BD33FA1FP3 [ROHM]

BD33FA1FP3是可提供0.1A输出电流的稳压器。输出电压为3.3V、输出精度为±1%。封装组件采用散热性优良的SOT89-3K。作为防止IC破坏的保护功能，内置了防止因输出短路等发生IC破坏的过电流保护电路、以及防止因过负荷状态等使IC发生热破坏的温度保护电路。本产品可用于数字家电等广泛用途。采用了陶瓷电容器，有助于整机的小型化和长寿化。;


型号：	BD33FA1FP3
厂家：	ROHM
描述：	BD33FA1FP3是可提供0.1A输出电流的稳压器。输出电压为3.3V、输出精度为±1%。封装组件采用散热性优良的SOT89-3K。作为防止IC破坏的保护功能，内置了防止因输出短路等发生IC破坏的过电流保护电路、以及防止因过负荷状态等使IC发生热破坏的温度保护电路。本产品可用于数字家电等广泛用途。采用了陶瓷电容器，有助于整机的小型化和长寿化。过电流保护电容器陶瓷电容器稳压器
文件：	总17页 (文件大小：782K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Single-Output LDO Regulators

30V Voltage Resistance

0.1A LDO Regulators

BDxxFA1FP3 series

●General Description

BDxxFA1FP3 series are LDO regulators with output current capability of 0.1A. The output voltages are 3.3V, 5.0V, 5.4V,

and 12.0V with ±1% accuracy. The SOT89-3K package is most suitable for heat dissipation. As protective function to

prevent IC from destruction, this chip has built-in over current protection circuit to protect the device when output is shorted,

and built-in thermal shutdown circuit to protect the IC during thermal over load conditions. This product can be used in

wide variety of digital appliances. These regulators can use ceramic capacitor, which have smaller size and longer life than

other capacitors.

●Package

SOT89-3K

W(Typ) D(Typ)

4.50mm x 4.095mm x 1.60mm

H(Max)

●Features

 High accuracy output voltage ±1.0%

 Built-in Over current protection circuit (OCP)

 Built-in Temperature protection circuit (TSD)

 Soft start function

●Key Features

 Input power supply voltage range: Vo+3.0V to 25.0V

 Output voltage:

 Output current:

3.3V, 5.0V, 5.4V, 12.0V

0.1A (Max)

 Operating temperature range:

Ta= -25°C to +85°C

●Typical Application Circuit

V_CC

V_O

C_OUT

C_IN

GND

FIN

C_IN,C_OUT: Ceramic Capacitor

●Ordering Information

T L

Part

Number

Output voltage Input

Output

Package

Manufacturing Packaging and forming

Voltage Current

Code

specification

33: 3.3V

50: 5.0V

54: 5.4V

J2: 12V

FP3:SOT89-3K

F:30V A1:0.1A

TL : Emboss tape reel

○ Product structure : Silicon monolithic integrated circuit ○This product is not designed to have protection against radioactive rays.

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Datasheet

BDxxFA1FP3

●Block Diagram

V_CC

OCP

SOFT

START

V_O

TSD

GND

Figure. 1 Block Diagram

●Pin Configuration

SOT89-3K

(TOP VIEW)

FIN

reverse

GND VCC

●Pin Description

Pin No.

Pin name

Pin Function

Output pin

GND pin

Input pin

GND

Vcc

reverse

FIN

GND (Connected to 2pin)

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Datasheet

BDxxFA1FP3

●Absolute Maximum Ratings (Ta=25°C)

Parameter

Power supply voltage

Output voltage

Symbol

V_CC

Limits

-0.3 to +30.0 *¹

-0.3 to +18

1.67 *²

Unit

Pd*²

Power dissipation

SOT89-3K

Operating temperature range

Storage temperature range

-25 to +85

-55 to +150

+150

°C

Tstg

Tjmax

Maximum junction temperature

*1 Not to exceed Pd.

*2 In case Ta≧25°C (114.3mm×76.2mm×1.6mm when mounted on a 4-layer PCB based on JEDEC) is reduced by 13.4mW/°C

●Recommended Operating Conditions (Ta=25°C)

Parameter

Input power supply voltage

Output current

Symbol

V_CC

Min.

Vo+3.0

0.0

Max.

25.0

0.1

Unit

I_O

●Recommended Operating Condition

Parameter

Symbol

C_OUT

Min

0.3 *³

Typ

1.0

Max

Unit

Conditions

Output Capacitor

μF Ceramic capacitor recommended

*3 The minimum value of capacitor must met this specification over full operating conditions. (Ex: Temperature, DC bias)

●Electrical Characteristics (Unless otherwise specified, Vcc= Vo+5V, Ta=25°C)

Limits

Parameter

Symbol

I_CC

Unit

Conditions

Min.

Typ.

300

400

0.5

Max.

450

μA I_O=0A, Vo=3.3V

μA I_O=0A, Vo=5.0V

μA I_O=0A, Vo=5.4V

μA I_O=0A, Vo=12.0V

450

Bias current

450

600

Line Regulation

Load Regulation

Reg.I

Reg I_O

V_CO

-1

-1.5

V_CC=( Vo+3V )→25.0V

I_O=0→0.1A

I_O=0.1A

0.5

1.5

Minimum dropout voltage

Output voltage

1.0

3.0

V_O

Vo×0.99

Vo×1.01

I_O=0A

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Datasheet

BDxxFA1FP3

●Performance Curve (Reference Data)

■ BD54FA1FP3

(Unless otherwise specified, Ta=25°C, Vcc=Vo+5V, C_IN=C_OUT=1μF)

Vcc

5V/div

2V/div

100u01s/div

0 100200300400500600700800₁9₀0_0μs/0_d0_iv0

8 10 12 14 16 18 20 22 24 26

Supply Voltage: Vcc [V]

Figure 3. Input sequence

Figure 2. Vcc - Vo

(C_OUT= 1μF)

0mA/

div

0mA/

div

0mA

5.4V

0mA

5.4V

50mV

div

1us/div

100us/div

10 20 30 40 50 60 70 80_1μ_μ9_s_s0_/_/_d_di_i1_v_v00

10 20 30 40 50 60 70 80 90 100

100μs/div

Figure 4. Transient Response

(Io = 0A→0.1A)

Figure 5. Transient Response

(Io = 0.1A→0A)

(C_OUT= 1μF)

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Datasheet

BDxxFA1FP3

●Performance Curve (Reference Data)

■ BD54FA1FP3

(Unless otherwise specified, Ta=25°C, Vcc=Vo+5V, C_IN=C_OUT=1μF)

5.45

5.43

5.41

5.39

5.37

450

400

350

300

250

200

150

100

5.35

-30 -20 -10 0 10 20 30 40 50 60 70 80 90

-30 -20 -10

10 20 30 40 50 60 70 80 90

Temperature: Ta [℃]

Figure 6. Ta - Vo

(Io = 0mA)

Figure 7. Ta - Icc

600

500

400

300

200

100

10 20 30 40 50 60 70 80 90 100

100

Output Current: Io [mA]

Figure 8. Io - Icc

Figure 9. Io - Vo

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BDxxFA1FP3

●Performance Curve (Reference Data)

■ BD54FA1FP3

(Unless otherwise specified, Ta=25°C, Vcc=Vo+5V, C_IN=C_OUT=1μF)

1.2

0.8

0.6

0.4

0.2

10 20 30 40 50 60 70 80 90 100

150

155

160

165

170

175

180

Output Current: Io [mA]

Ambient Temperature: Ta [℃]

Figure 10. Minimum dropout Voltage

Figure 11. TSD

(Io = 0mA)

Figure 12. OCP

Figure 13. PSRR

(Io = 50mA)

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BDxxFA1FP3

●Performance Curve (Reference Data)

■ BD54FA1FP3

(Unless otherwise specified, Ta=25°C, Vcc=10.4V, C_IN=C_OUT=1μF)

Stable Area

0.1

0.01

100

Output Current: Io [mA]

Figure 14. ESR Stable Region

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Datasheet

BDxxFA1FP3

●Power Dissipation

◎SOT89-3K

1.5

θj-a = 74.8℃/W

θj-a = 74.8°C/W

0.5

75 100 125 150

Ambient Temparature: Ta [℃]

Measurement condition: mounted on 4-layer JEDEC standard board

Board size: 114.3mm × 76.2mm × 1.6mm

When considering thermal design, operation should be maintained within the following conditions.

(The temperature mentioned below is a guaranteed temperature, therefore, margins must be considered.)

1. Ambient temperature Ta is 85°C and below.

2. Junction temperature Tj is 150°C and below.

The junction temperature Tj can be determined as follows:

Calculation based on ambient temperature Ta

Tj=Ta+θj-a×W

・θj-a: SOT89-3K 74.8°C/W

JEDEC standard 4 layers PCB

Board size: 114.3mm × 76.2mm × 1.6mm

Most of the heat loss that occurs in BDxxFA1FP3 is generated from the output Pch FET. Power loss is determined by the

product of voltage drop across Vcc-Vo and the output current. Check the conditions of output voltage and output current to be

used between Vcc-Vo and compare with the power dissipation characteristics.

In addition, power dissipation may change significantly due to board conditions because BDxxFA1FP3 uses power package. It is

important to consider the board size to be used before proceeding with the design.

Power consumption [W] = { Input voltage (Vcc) – Output voltage (Vo) } × Output current (Io: Ave)

Example) Vcc = 10.4V, Vo = 5.4V, Io(Average) = 0.1A

Power consumption [W] = ( 10.4V – 5.4V ) × 0.1A

= 0.5W

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Datasheet

BDxxFA1FP3

●Input/Output Capacitor

It is recommended that a capacitor is placed close to pin between input pin and GND as well as output pin and GND. The

input capacitor becomes more necessary when the power supply impedance is high or when the PCB trace has significant

length. Moreover, the higher the capacitance of the output capacitor the more stable the output will be, even with load and

line voltage variations. However, please check the actual functionality by mounting on a board for the actual application.

Also, ceramic capacitors usually have different thermal and equivalent series resistance characteristics and may degrade

gradually over continued use.

For additional details, please check with the manufacturer and select the best ceramic capacitor for your application.

Rated Voltage: 10V

B1 characteristics

GRM188B11A105KA61D

Rated Voltage: 10V

B characteristics

-10

Rated Voltage: 6.3V

B characteristics

-20

-30

-40

Rated Voltage: 10V

-50

F characteristics

Rated Voltage: 4V

-60

X6S characteristics

-70

-80

-90

-100

DC Bias Voltage [V]

Ceramic Capacitor Capacitance Value - DC Bias Characteristics

(Characteristics Example)

●Output Capacitor Equivalent Series Resistance

To prevent oscillation, please attach a capacitor between V_Oand

GND. Generally, capacitor has ESR (Equivalent Series

Resistance). Operation will be stable in ESR-Io range^*1shown in

the right.

The 1.0µF ceramic capacitor and resistor at output in this

characteristic data are connected in series and measured.

Generally, ESR of ceramic capacitor, tantalum capacitor and

electrolytic capacitor is different. Check the ESR of capacitor to

be used and use it within the range of stable region.

Stable Area

0.1

0.01

安定領域

However, please take note that for the same value of

capacitance of different electrolytic capacitor, ESR are not

always the same. In addition, ESR characteristics may also

change due to wiring impedance of board, input power

impedance and load impedance; therefore check the behavior in

actual application.

100

Output Current: Io [mA]

*1 Ta=25°C, Vcc=6.3V to 25V, Io=0A to 0.1A

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Datasheet

BDxxFA1FP3

●Input/Output Equivalent Circuit

3pin (V_CC) / 1pin (V_O)

3pin (V_CC

)

1pin (V_O)

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Datasheet

BDxxFA1FP3

●Operational Notes

(1) Absolute Maximum Value Rate

Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to predict all

destructive situations such as short-circuit modes, open circuit modes, etc. Therefore, it is important to consider circuit

protection measures, like adding a fuse, in case the IC is operated in a special mode exceeding the absolute maximum

ratings.

(2) Reverse connection of power supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

terminals.

(3) Power supply line

Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines

of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the

analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature

and aging on the capacitance value when using electrolytic capacitors.

(4) Ground voltage

The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no

pins are at a voltage below the ground pin at any time, even during transient condition.

(5) Thermal consideration

Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in

actual operating conditions.

(6) Short between pins and mounting errors

Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong

orientation or if pins are shorted together. Short circuit may be caused be conductive particles caught between the pins.

(7) Operation under strong electromagnetic field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

(8) Thermal shutdown circuit

The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal temperature

of the IC reaches a specified value. It is not designed to protect the IC from damage or guarantee its operation. Do not

continue to operate the IC after this function is activated. Do not use the IC in conditions where this function will always

be activated.

TSD ON Temperature [°C] (Typ)

173

Hysteresis Temperature [°C] (Typ)

BDxxFA1FP3

(9) Testing on application boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from electro static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

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Datasheet

BDxxFA1FP3

(10) Regarding input pins of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

(11) Ground wiring pattern

When using both small-signal and large-current GND traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on

the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance.

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Datasheet

BDxxFA1FP3

●External Measurement Drawing and Packing Forming Specification

Package Name

SOT89-3K

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Datasheet

BDxxFA1FP3

●Marking Diagram

Output

Voltage [V]

Part Number

Marking(xx)

SOT89-3K

(TOP VIEW)

3.3

5.0

Part Number Marking

LOT Number

5.4

x x F 1

12.0

1PIN

●Revision History

Date

Revision

Revision contents

2014.02.04

2014.10.31

001

002

New release

Added 5.0V and 12V to output voltage line-up.

The document control number: TSZ02201-0R6R0A600600-1-2 →TSZ02201-0GAG0A600600-1-2.

Modified the package name to SOT89-3K.

Modified external measurement drawing.

2015.06.08

2016.04.11

003

004

P.1 Ordering Information changed

P.3 Electrical characteristics added

P.6 Figure 13. PSRR modified from (Io=0mA) to (Io=50mA)

The document control number: TSZ02201-0R6R0A600600-1-2 →TSZ02201-0G2G0A600060-1-2

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

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A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

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When disposing Products please dispose them properly using an authorized industry waste company.

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ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.003

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

BD33FA1FP3 [ROHM]

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