BD35613HFV [ROHM]
Fixed Positive LDO Regulator, PDSO6, ROHS COMPLIANT, HVSOF-6;![BD35613HFV](http://pdffile.icpdf.com/pdf2/p00292/img/icpdf/BD35618HFN_1769576_icpdf.jpg)
型号: | BD35613HFV |
厂家: | ![]() |
描述: | Fixed Positive LDO Regulator, PDSO6, ROHS COMPLIANT, HVSOF-6 光电二极管 输出元件 调节器 |
文件: | 总12页 (文件大小:773K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
![](http://public.icpdf.com/style/img/ads.jpg)
TECHNICAL NOTE
High-performance Regulator IC Series for PCs
300mA Linear Regulators
for Desktop PC
BD35613HFV/EFJ/HFN, BD35615HFV/EFJ/HFN, BD35618HFV/EFJ/HFN
●Description
BD3561□ series is a LDO regulator with output current 300mA. The output accuracy is±1% of output voltage. BD3561
□ series has some kinds of output voltage line-up and package line-up. Thus, it is used for the wide applications of
digital appliances. Over current protection (for protecting the IC destruction by output short circuit), shutdown ON/OFF
switch (for setting the circuit current 0μA at shutdown mode), and thermal shutdown circuit (for protecting ICs from heat
destruction by over load condition) are all built in.
●Features
1) Output current 300mA
2) Output voltage accuracy : ±1%
3) Built-in Over Current Protection circuit (OCP)
4) Built-in Thermal Shut Down circuit (TSD)
5) With shut down switch
6) Rich package line-up : HSON8, HTSOP-J8, HVSOF6
●Line-up
Product name
BD3561□HFN
BD3561□EFJ
BD3561□HFV
8.0V
○
5.0V
○
3.3V
○
Package
HSON8
○
○
○
HTSOP-J8
HVSOF6
○
○
○
Product name : BD3561□ □□□
b
a
Symbol
Output Voltage (V)
a
b
1□
18
15
13
□□□
HFN
EFJ
Package
HSON8
8.0V typ.
5.0V typ.
3.3V typ.
HTSOP-J8
HVSOF6
HFV
Oct. 2008
●Absolute maximum ratings (Ta=25℃)
Parameter
Symbol
Vcc
Limits
15.0 *1
Unit
V
Power Supply Voltage
EN Voltage
VEN
15.0
V
HSON8
1350 *2
2110 *3
850.0 *4
-10~+100
-55~+150
+150
Power Dissipation
HTSOP-J8
HVSOF6
Pd
mW
Operating Temperature Range
Storage Temperature Range
Topr
Tstg
℃
℃
℃
Junction Temperature
Tjmax
*1 Not to exceed Pd
*2 Reduced by 10.8mW for each increase in Ta of 1℃ over 25℃.
(when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB. (copper foil area:100mm2))
*3 Reduced by 16.9mW for each increase in Ta of 1℃ over 25℃.
(when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB, 2 layer)
*4 Reduced by 6.8mW for each increase in Ta of 1℃ over 25℃.
(when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB. (copper foil area:100mm2))
●Operating Conditions (Ta=25℃)
Parameter
Input Power Supply Voltage
EN Voltage
Symbol
VCC
VEN
Io
Min.
Max.
14.0
14.0
300
Unit
V
Vo+1.8
-
-
V
Output Current
mA
★This product should not be used in a radioactive environment.
●ELECTRICAL CHARACTERISTICS
BD3561□HFN/EFJ/HFV (Unless otherwise noted, Ta=25℃, EN=3V, Vcc=12V)
Parameter
Symbol
Min.
Vo(T)×
0.99
Vo(T)×
0.985
-
Typ.
Max.
Vo(T)×
1.01
Vo(T)×
1.015
5
Unit
V
Conditions
Io=0mA
Output Voltage 1
Vo1
Vo(T)
Tj=0 to 100℃
Output Voltage 2
Vo2
Vo(T)
V
Io=0mA→300mA
EN=0V, @OFF mode
Circuit Current at shutdown mode
Bias Current
Isd
Icc
Io
0
200
-
μA
μA
mA
-
300
Output Current Ability
300
-
Vcc=(Vo+1.8V)→14.0V,
Line Regulation
Reg.I
-
25
50
MV
Io=300mA
EN Low Voltage
EN High Voltage
EN Bias Current
VEN (Low)
VEN (High)
IEN
0
-
-
0.8
14.0
5.0
V
V
2.4
0.5
1.0
μA
2/12
●Reference Data
BD35618HFV (Unless otherwise specified, Ta=25℃, EN=3V, Vcc=12V)
Vo
Vo
100mV/div
100mV/div
EN
5V/div
Io
Io
Vo
200mA/di
200mA/di
5V/div
(20m sec/div)
(10μsec/div)
(0.2msec/div)
Fig.3 Waveform at output start
Co=1μF
Fig.2 Transient Response
Fig.1 Transient Response
(0→50mA)
Co=1μF
(50→0mA)
Co=1μF
EN
EN
5V/div
5V/div
EN
5V/div
VCC
VCC
5V/div
5V/div
VCC
5V/div
Vo
Vo
Vo
5V/div
5V/div
5V/div
(1msec/div)
Fig.6 Input sequence 2
Co=1μF
(1sec/div)
(1msec/div)
Fig.5 Input sequence 1
Fig.4 Waveform at output OFF
Co=1μF
Co=1μF
1.0
0.8
0.6
0.4
0.2
0.0
8.5
8.3
8.1
7.9
7.7
7.5
230
220
210
200
190
180
-10
15
40
65
90
100
-10
10
30
50
70
90
100
90
-10
10
30
50
70
Ta [ ]
℃
Ta [℃]
Ta [ ]
℃
Fig.7 Ta-Vo (Io=0mA)
Fig.8 Ta-Icc
(VEN=12V)
Fig.9 Ta-Icc
(Vcc=12V, VEN=0V)
2.0
1.6
1.2
0.8
0.4
0.0
10
8
8.20
8.10
8.00
7.90
7.80
7.70
6
4
2
0
100
-10
10
30
50
70
90
0
100
200
300
0
5
10
15
20
25
Ta [℃]
Io [mA]
Vcc [V]
Fig.12 Vcc-ISTB
(Vcc=12V, VEN=3V)
Fig.11 Io-Vo
Fig.10 Ta-IEN
(Vcc=12V, VEN=3V)
3/12
●Reference Data
BD35618HFV (Unless otherwise specified, Ta=25℃, EN=3V, Vcc=12V)
10
8
6
4
2
0
0
5
10
15
20
25
Vcc [V]
Fig.13 Vcc-Vo
●Heat Dissipation Characteristics
◎HSON8
◎HTSOP-J8
[W]
[W]
2.0
4.0
④3.76W
PCB size:70mm×70mm×1.6mmt
③1.75W
②1.35W
Board①:1 layer (copper foil area: less than 0.2%)
Board②:1 layer (copper foil area:7%)
Board③:1 layer (copper foil area:65%)
Board①:θja=153.2℃/W
Board②:θja=113.6℃/W
Board③:θja=59.2℃/W
Board④:θja=33.3℃/W
1.5
3.0
①:θja=198.4℃/W
②:θja=92.4℃/W
③:θja=71.4℃/W
③2.11W
1.0
0.5
2.0
1.0
①0.63W
②1.10W
①0.82W
0
25
50
75
100
125
150
[℃]
0
25
50
75
100
125
150
[℃]
Ambient Temperature [Ta]
Ambient Temperature [Ta]
◎HVSOF6
[W]
3.0
2.5
2.0
PCB size:70mm×70mm×1.6mm
Board①:1 layer (copper foil area:100mm2).
Board②:1 layer (copper foil area:900 mm2)
Board③:1 layer (copper foil area: 2500mm2)
③1.70W
②1.40W
1.5
1.0
①:θja=147.1℃/W
②:θja=89.3℃/W
③:θja=73.5℃/W
①0.85W
0.5
0
0
25
50
75
100
125
150
[℃]
Ambient Temperature [Ta]
4/12
●Block Diagram
(HSON8, HTSOP-J8)
(Vo+1.8)~14V
GND
Vcc
1
5
6
OCP
GND_S
SOFT
Vo
3
Vo
Ceramic
Capacitor
≧ 1uF
VFB
EN
TSD
8
(HVSOF6)
(Vo+1.8)~14V
Vcc
GND
6
2
3
OCP
GND_S
SOFT
Vo
1
Vo
Ceramic
Capacitor
≧ 1uF
VFB
EN
TSD
4
5/12
●Pin Function Table (HSON8, HTSOP-J8)
(HVSOF6)
Pin No.
Pin name
Vcc
Pin Function
Input Voltage Pin
Open
Pin No.
Pin name
Vo
Pin Function
Output Voltage Pin
GND Pin
1
2
3
4
5
6
7
8
1
2
3
4
5
6
N.C.
GND
GND_S
EN
Vo
Output Voltage Pin
Open
GND Sense Pin
Enable Pin
N.C.
GND
GND_S
N.C.
GND Pin
N.C
Open
GND Sense Pin
Open
Vcc
Input Voltage Pin
EN
Enable Pin
●Pin Layout (HSON8, HTSOP-J8)
(HVSOF6)
Vcc
N.C
Vo
EN
Vo
GND
Vcc
N.C
EN
1
2
3
4
8
7
6
5
1
2
3
6
5
4
N.C
GND_S
GND_S
N.C
GND
6/12
●Evaluation Board Circuit (Vo=8.0V)
C1
C2
SW1
8
7
1
2
Vcc
N.C
EN
EN
N.C
C3
Vcc
C7
C6
3
4
6
5
GND_S
GND
GND_S
GND
Vo
N.C
C5
U2
R1
C4
U2
R2
C8
R4
R3
Vo
Gate
●Evaluation Board Parts List
Designation
R1
Value
Part No.
Company
-
-
-
-
-
-
-
-
-
-
-
R2
-
R3
-
R4
-
C1
-
C2
1uF
CM105B105K10A
KYOCERA
C3
-
-
-
C4
-
-
-
C5
-
-
-
C6
1uF
CM105B105K16A
KYOCERA
C7
-
-
-
-
-
-
C8
-
-
U1
BD3561XHFV
-
ROHM
-
U2
7/12
●Reference landing pattern
◎HSON8
MIE
E3
(Unit : mm)
L2
Lead pitch
landing pitch
landing length
≧l2
landing pitc
e
MIE
b2
0.65
2.50
central pad pitch
E3
0.40
0.35
central pad length
D3
2.90
1.90
*It is recommended to design suitable for the actual application.
◎HVSOF6
MIE
E3
L2
(Unit:mm)
Lead pitch
landing pitch
MIE
landing length
landing pitch
e
l2
b2
0.50
3.00
0.55
0.25
central pad length
central pad pitch
D3
E3
1.60
2.60
*It is recommended to design suitable for the actual application.
8/12
●Operation Notes
1. Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any
over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as
fuses.
2. Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply
lines. An external direction diode can be added.
3. Power supply lines
Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line,
separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals to
ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the
circuit, not that capacitance characteristic values are reduced at low temperatures.
4. GND voltage
The potential of GND pin must be minimum potential in all operating conditions.
5. Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
6. Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
7. Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
8. ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
9. Thermal shutdown circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed
only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not
continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is
assumed.
TSD on temperature [°C] (typ.)
175
Hysteresis temperature [°C] (typ.)
15
BD3561XHFN/EFJ/HFV
10. Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or
removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic
measure. Use similar precaution when transporting or storing the IC.
9/12
11. Regarding input pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or
transistor. For example, the relation between each potential is as follows:
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes
operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be
used.
Resistor
Transistor (NPN)
B
Pin A
Pin B
Pin B
C
E
Pin A
B
C
E
N
N
N
P+
P+
P+
P+
N
P
P
Parasitic
element
N
N
Parasitic
element
P substrate
P substrate
GND
GND
GND
GND
Parasitic element
Parasitic element
Other adjacent elements
12. Ground Wiring Pattern.
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing
a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations
caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND
wiring pattern of any external components, either.
10/12
●Type Designations (Ordering Information)
―
B
D
3
5
6
1
X
H
F
N
E
2
Package Type
Product Name
・BD35618
・BD35615
E2 Emboss tape reel opposite draw-out side: 1 pin
TR Emboss tape reel opposite draw-out side: 1 pin
・HFN : HSON8
・EFJ : HTSOP-J8
・HFV : HVSOF6
・BD35613
HSON8
<Dimension>
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
3000pcs
2.90 0.2
0.475
(2.2) (0.05)
Direction
of feed
TR
(The direction is the 1pin of product is at the upper light when you hold
reel on the left hand and you pull out the tape on the right hand)
8
7
6
5
5
6
7
8
+0.1
0.13
−0.05
1
2
3
4
4
3
2
1
0.32 0.10
X X
X
X X
X
X X
X
X X
X
X X
X
0.65
X
X
X
X
X
X X
X
X X
X
X X
X
X X
X
X X
X
Direction of feed
1Pin
Reel
(Unit:mm)
※When you order , please order in times the amount of package quantity.
HVSOF6
<Dimension>
<Tape and Reel information>
Tape
Embossed carrier tape
(MAX 1.8 include BURR)
1.6 0.1
Quantity
3000pcs
6
5
4
TR
Direction
of feed
(The direction is the 1pin of product is at the upper light when you hold
reel on the left hand and you pull out the tape on the right hand)
(1.2)
(1.4)
1
2
3
0.145 0.05
S
0.1 S
0.22 0.05
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0.5
Direction of feed
1Pin
Reel
(Unit:mm)
※When you order , please order in times the amount of package quantity.
HTSOP-J8
<Tape and Reel information>
4.9 0.1
<Dimension>
Max5.25(include.BURR)
+6
-4
(3.2)
4
Tape
Embossed carrier tape
2500pcs
8
7
6
5
Quantity
Direction
of feed
E2
(The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand)
1
2
3
4
+0.05
-0.03
0.17
M
0.545
S
+0.05
0.42
-0.04
0.08
1.27
0.08 S
Direction of feed
1Pin
Reel
※When you order , please order in times the amount of package quantity.
(Unit:mm)
11/12
Catalog No.08T419A '08.10 ROHM ©
相关型号:
©2020 ICPDF网 联系我们和版权申明