BD42530UEFJ-C [ROHM]
BD42530UEFJ-C是45V耐压、失调电压±10mV、输出电流250mA、静态电流40µA的低静态电流电压跟随器。本IC非常适合用来降低电池直连系统中的消耗电流。输出的相位补偿电容器可使用陶瓷电容器。另外，本IC还内置过电流保护电路，可防止输出短路等导致的IC损坏；内置过热保护电路，可防止IC因过负载状态等导致的热损坏。本系列产品中的BD42530EFJ-C是为提高生产效率而变更生产线后的型号。在新项目选型时，建议选择该型号。另外，在技术规格书中的保证特性并没有差异。除非另有说明，否则我们还会披露文档和设计模型的 BD42530EFJ-CE2 数据。;
| 型号： | BD42530UEFJ-C |
| 厂家： | 
ROHM |
| 描述： | BD42530UEFJ-C是45V耐压、失调电压±10mV、输出电流250mA、静态电流40µA的低静态电流电压跟随器。本IC非常适合用来降低电池直连系统中的消耗电流。输出的相位补偿电容器可使用陶瓷电容器。另外，本IC还内置过电流保护电路，可防止输出短路等导致的IC损坏；内置过热保护电路，可防止IC因过负载状态等导致的热损坏。本系列产品中的BD42530EFJ-C是为提高生产效率而变更生产线后的型号。在新项目选型时，建议选择该型号。另外，在技术规格书中的保证特性并没有差异。除非另有说明，否则我们还会披露文档和设计模型的 BD42530EFJ-CE2 数据。 电池 生产线 过电流保护 电容器 陶瓷电容器 |
| 文件： | 总30页 (文件大小：1491K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Voltage Tracker
250 mA Output Voltage Tracker
BD42530xxx-C Series
General Description
Features
■ AEC-Q100 Qualified (Note 1)
The BD42530xxx-C Series are voltage trackers featuring
45 V absolute maximum voltage, output voltage tracking
accuracy of ±10 mV, 250 mA output current and 40 µA
(Typ) low current consumption.
These trackers are therefore ideal for applications
requiring a direct connection to the battery and a low
current consumption.
Ceramic capacitors can be used for phase compensation
capacitor of the output. Furthermore, these ICs also
feature overcurrent protection to protect the device from
damage caused by short-circuiting and an integrated
thermal shutdown to protect the device from overheating
at overload conditions.
■ Qualified for Automotive Applications
■ Wide Temperature Range (Tj):
■ Wide Operating Input Range:
■ Low Quiescent Current:
■ Output Voltage Tracking Accuracy:
■ Over Current Protection (OCP)
■ Thermal Shutdown Protection (TSD)
(Note 1: Grade 1)
-40 °C to +150 °C
3 V to 42 V
40 µA (Typ)
±10 mV
Packages
■ EFJ：HTSOP-J8
W (Typ) x D (Typ) x H (Max)
4.90 mm x 6.00 mm x 1.00 mm
■ FPJ：TO252-J5
6.60 mm x 10.10 mm x 2.38 mm
■ FP2：TO263-5
10.16 mm x 15.10 mm x 4.70 mm
Applications
■ Automotive
(Engine-ECU, Body, Air-Conditioner etc.)
Typical Application Circuits
■ Components externally connected: 1 µF ≤ CIN (Min), 4.7 µF ≤ CO (Min)
Ceramic capacitors with less change in ESR due to temperature characteristics are recommended.
VCC
N.C.
GND
ADJ
/ EN
CIN
BD42530EFJ-C
VO
N.C.
N.C.
N.C.
CO
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
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BD42530xxx-C Series
Ordering Information
B
D
4
2
5
3
0
U
x
x
x
-
C
E
2
Part Number
None: Production Line A
U: Production Line B
Package
C: for Automotive
Packaging and Foming Specification
E2: Embossed Tape and Real
ꢀEFJ: HTSOP-J8
ꢀFPJ: TO252-J5
ꢀFP2: TO263-5
Lineup
Output Current
Package
Orderable Part Number
HTSOP-J8
(Production Line A) (Note1)
HTSOP-J8
Reel of 2500
Reel of 2500
BD42530EFJ-CE2
BD42530UEFJ-CE2
(Production Line B) (Note1)
250 mA
TO252-J5
Reel of 2000
Reel of 500
BD42530FPJ-CE2
BD42530FP2-CE2
TO263-5
(Note1) For the purpose of improving production efficiency, Production Line A and B have a multi-line configuration.
Electrical characteristics noted in Datasheet does not differ between Production Line A and B. Production Line B is recommended for new product.
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BD42530xxx-C Series
Pin Configurations
TO263-5
(Top View)
HTSOP-J8
(Top View)
7 6
TO252-J5
(Top View)
8
5
FIN
FIN
1
2
3
4
1 2 3 4 5
1 2 3 4 5
Pin Descriptions
HTSOP-J8 (Note 1), (Note 2), (Note 3)
、
TO252-J5(Note 1) (Note 2) / TO263-5 (Note 1)
、
(Note 2)
Pin No.
Pin Name
VO
Function
Output
Pin No.
Pin Name
VCC
Function
Input
1
2
3
4
5
6
7
8
1
2
N.C.
Not connected
Not connected
Not connected
N.C.
Not connected
Ground
N.C.
3
GND
N.C.
4
ADJ / EN
VO
Output Control Voltage
Output
ADJ / EN
GND
Output Control Voltage
Ground
5
FIN
GND
Ground
N.C.
Not connected
Input
VCC
Note 1: N.C. Pin is recommended to short with GND.
Note 2: N.C. Pin can be open because it isn’t connect it inside of IC.
Note 3: Exposed die pad is connected to GND in the inside of IC.
Exposed die pad is need to be connected to GND of the board.
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BD42530xxx-C Series
Block Diagrams
HTSOP-J8
VCC (8Pin)
N.C. (7Pin)
GND (6Pin)
ADJ / EN (5Pin)
Power Tr.
PREREG
OCP
TSD
AMP
VO (1Pin)
N.C. (2Pin)
N.C. (3Pin)
N.C. (4Pin)
TO252-J5 / TO263-5
GND (FIN)
Power Tr.
PREREG
OCP
TSD
AMP
VCC (1Pin)
N.C. (2Pin)
GND (3Pin)
ADJ / EN (4Pin)
VO (5Pin)
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BD42530xxx-C Series
Description of Blocks
Block Name
Function
Description of Blocks
PREREG
Internal Power Supply
Power Supply for Internal Circuit
The TSD protect the device from overheating.
If the chip temperature (Tj) reaches ca. 175 °C (Typ),
the output is turned off.
TSD
OCP
Thermal Shutdown Protection
Over Current Protection
The OCP protect the device from damage caused by over
current. (Typ:650mA at 25°C)
The amplifier drives output power transistor with ADJ/EN
voltage as reference voltage.
AMP
Amplifier for the Power Transistor Drive
Output Power Transistor
Power Tr.
PDMOS type output power transistor.
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BD42530xxx-C Series
Absolute Maximum Ratings
Parameter
Symbol
VCC
Ratings
-0.3 to +45
-0.3 to +28
-0.3 to +28
-40 to +150
-55 to +150
+150
Unit
V
(Note 1)
Supply Voltage
Output Control Voltage
Output Voltage
VADJ / EN
VO
V
V
Junction Temperature Range
Storage Temperature Range
Maximum Junction Temperature
Tj
°C
°C
°C
V
Tstg
Tjmax
VESD, HBM
VESD, CDM
(Note 2)
(Note 3)
HBM
CDM
±2000
ESD withstand Voltage
±1000
V
(Note 1)
(Note 2)
(Note 3)
(Caution)
Do not exceed Junction Temperature.
Human Body Model.
Charged Device Model.
Exceeding the absolute maximum rating for supply voltage, operating temperature or other parameters can result in damages to or destruction
of the chip. In this event it also becomes impossible to determine the cause of the damage (e.g. short circuit, open circuit, etc.). Therefore, if any
special mode is being considered with values expected to exceed the absolute maximum ratings, implementing physical safety measures, such
as adding fuses, should be considered.
Operating Range (-40 °C ≤ Tj ≤ +150 °C)
Parameter
Supply Voltage
Symbol
VCC
Min
5.6
2
Max
42
Unit
V
(Note 1)
(Note 2)
(Note 3)
Tracking Voltage
VADJ / EN
VCC
V
16
Start-Up Voltage
3
-
V
Output Current
IO
mA
°C
0
250
125
Ambient Temperature Range
Ta
-40
(Note 1)
(Note 2)
(Note 3)
VADJ/EN = 5V, IO = 200mA
VADJ/EN ≤ Vcc – 0.5V
IO = 0 mA.
Operating Conditions
Ratings
Parameter
Symbol
Unit
Condition
Min
Typ
-
Max
-
Input Capacitor
CIN
CO
1(Note 4)
μF
μF
Ceramic capacitor
Output Capacitor
4.7(Note 4)
-
-
Ceramic capacitor(Note 5)
(Note 4)
(Note 5)
The minimum value of capacitor must be met this specifications over full operating conditions.
(ex. Temperature, DC bias)
Electrolytic capacitor and tantalum capacitor can be used satisfying ESR of the stable operation range of the "output capacitor ESR vs.
output current" of Figure 17.
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BD42530xxx-C Series
Thermal Resistance(Note 1)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 3)
2s2p(Note 4)
HTSOP-J8
Junction to Ambient
Junction to Top Characterization Parameter(Note 2)
θJA
130
15
34
7
°C/W
°C/W
ΨJT
TO252-J5
Junction to Ambient
Junction to Top Characterization Parameter(Note 2)
θJA
136
17
23
3
°C/W
°C/W
ΨJT
TO263-5
Junction to Ambient
Junction to Top Characterization Parameter(Note 2)
θJA
81
8
21
2
°C/W
°C/W
ΨJT
(Note 1)Based on JESD51-2A(Still-Air)
(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3)Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
70μm
Footprints and Traces
(Note 4)Using a PCB board based on JESD51-7.
Layer Number of
Material
Thermal Via(Note 5)
Board Size
114.3mm x 76.2mm x 1.6mmt
2 Internal Layers
Measurement Board
Pitch
Diameter
4 Layers
FR-4
1.20mm
Φ0.30mm
Top
Bottom
Copper Pattern
Thickness
70μm
Copper Pattern
Thickness
35μm
Copper Pattern
Thickness
70μm
Footprints and Traces
74.2mm x 74.2mm
74.2mm x 74.2mm
(Note 5) This thermal via connects with the copper pattern of all layers.
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BD42530xxx-C Series
Electrical Characteristics
(Unless otherwise specified, -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, VADJ / EN = 5 V, IO = 0 mA.
The Typical value is defined at Tj = 25 °C.)
Limit
Parameter
Circuit Current
Symbol
ICC
Unit
μA
Conditions
Io ≤ 250 mA
Min
-
Typ
Max
80
40
3.5V ≤ Vcc ≤ 32V
0.1 mA ≤ IO ≤ 100 mA
VADJ / EN = 2V
mV
mV
-10
-10
-
-
10
10
3.8V ≤ Vcc ≤ 32V
0.1 mA ≤ IO ≤ 250 mA
VADJ / EN = 2V
Output Voltage Tracking Accuracy
ΔVO
6V ≤ Vcc ≤ 32V
mV
V
-10
-
-
10
0.1 mA ≤ IO ≤ 250 mA
VADJ / EN = 5V
VCC = VO × 0.95 (= 4.75 V: Typ)
IO = 200 mA
Dropout Voltage
ΔVd
0.28
0.60
f = 120 Hz, ein = 1 Vrms
IO = 100 mA
Ripple Rejection
R.R.
TSD
dB
°C
-
-
80
-
-
Thermal Shut Down
175
Tj at TSD ON
Electrical Characteristics (Output Control Function)
(Unless otherwise specified, -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, Io = 0 mA. The Typical value is defined at Tj = 25 °C.)
Limit
Parameter
Symbol
Unit
Conditions
Min
Typ
Max
VADJ / EN ≤ 0.4 V
Shutdown Current
Ishut
-
1
5
μA
V
Tj ≤ 125 °C
Active Mode
ADJ / EN ON Mode Voltage
ADJ / EN OFF Mode Voltage
ADJ / EN Bias Current
2
0
-
-
-
16
0.4
3
VthH
VthL
V
Off Mode
1
µA
IADJ / EN
VADJ / EN=5 V
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BD42530xxx-C Series
Typical Performance Curves
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, VADJ/EN = 5 V, Io = 0 mA.
5
4
5
4
Tj=150℃
Tj=25℃
Tj=-40℃
Tj=150℃
Tj=25℃
Tj=-40℃
3
3
2
2
1
1
0
0
-1
-2
-3
-4
-5
-1
-2
-3
-4
-5
0
50
100
150
200
250
0
5
10 15 20 25 30 35 40 45
Power Supply Voltage : Vcc[V]
Output Current : Io[mA]
Figure 1. Tracking Accuracy vs. Power Supply Voltage
Figure 2. Tracking Accuracy vs. Output Current
80
70
60
50
40
30
20
10
0
80
70
60
50
40
30
20
10
0
Tj=150℃
Tj=25℃
Tj=-40℃
Tj=150℃
Tj=25℃
Tj=-40℃
0
50
100
150
200
250
0
5
10 15 20 25 30 35 40 45
Power Supply Voltage : Vcc[V]
Output Current : Io[mA]
Figure 3. Circuit Current vs. Power Supply Voltage
Figure 4. Circuit Current vs. Output Current
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BD42530xxx-C Series
Typical Performance Curves – continued
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, VADJ/EN = 5 V, Io = 0 mA.
6
5
4
3
2
1
0
6
5
4
3
2
1
0
Tj=150℃
Tj=25℃
Tj=-40℃
Tj=150℃
Tj=25℃
Tj=-40℃
0
5
10 15 20 25 30 35 40 45
Power Supply Voltage : Vcc[V]
0
1
2
3
4
5
Power Supply Voltage : Vcc[V]
Figure 5. Output Voltage vs. Power Supply Voltage
Figure 6. Output Voltage vs. Power Supply Voltage
at Low Supply Voltage
600
500
400
300
200
100
0
120
100
80
60
40
20
0
Tj=150℃
Tj=25℃
Tj=-40℃
Tj=150℃
Tj=25℃
Tj=-40℃
0
50
100
150
200
250
100
1000
10000
100000
Output Current : Io[mA]
Frequency : f[Hz]
Figure 7. Dropout Voltage vs. Output Current
(Vcc = 4.75V)
Figure 8. Ripple Rejection vs. Frequency
(ein = 1Vrms, Io = 100mA)
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BD42530xxx-C Series
Typical Performance Curves – continued
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, VADJ/EN = 5 V, Io = 0 mA.
5
4
80
70
60
50
40
30
20
10
0
3
2
1
0
-1
-2
-3
-4
-5
-40
10
60
110
160
-40
0
40
Junction Temperarure : Tj[℃]
Figure 10. Circuit Current vs. Junction Temperature
80
120
160
Junction Temperarure : Tj[℃]
Figure 9. Tracking Accuracy vs. Junction Temperature
(Io = 50mA)
6
6
5
4
3
2
1
0
5
4
3
2
1
0
Tj=150℃
Tj=25℃
Tj=-40℃
100
120
140
160
180
200
0
200
400
600
800
1000
Output Current : Io[mA]
Junction Temperarure : Tj[℃]
Figure 11. Output Voltage vs. Output Current
(Over Current Protection)
Figure 12. Output Voltage vs. Junction Temperature
(Thermal Shut Down)
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BD42530xxx-C Series
Typical Performance Curves – continued
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, VADJ/EN = 5 V, Io = 0 mA.
5
4.5
4
5
4.5
4
Tj=150℃
Tj=25℃
Tj=-40℃
3.5
3
3.5
3
2.5
2
2.5
2
1.5
1
1.5
1
0.5
0
0.5
0
-40
10
60
110
160
0
5
10 15 20 25 30 35 40 45
Power Supply Voltage : Vcc[V]
Junction Temperarure : Tj[℃]
Figure 14. Shut Down Current vs. Junction Temperature
Figure 13. Shut Down Current vs. Power Supply Voltage
5
6
5
4
3
Tj=150℃
4.5
Tj=25℃
4
Tj=-40℃
3.5
3
2.5
2
2
1.5
1
Tj=150℃
Tj=25℃
Tj=-40℃
1
0
0.5
0
0
1
2
3
4
5
0
1
2
3
4
5
ADJ/EN Supply Voltage : VADJ/EN[V]
ADJ/EN Supply Voltage : VADJ/EN[V]
Figure 15. ADJ/EN Bias Current vs. ADJ/EN Supply Voltage
Figure 16. Output Voltage vs. ADJ/EN Supply Voltage
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BD42530xxx-C Series
Measurement Circuit
5:ADJ /
EN
5:ADJ /
EN
A
5:ADJ /
EN
8:VCC
7:N.C.
6:GND
8:VCC
7:N.C.
6:GND
8:VCC
7:N.C.
6:GND
1µF
1µF
1µF
BD42530EFJ-C
BD42530EFJ-C
BD42530EFJ-C
1:VO
2:N.C.
3:N.C.
4:N.C.
1:VO
2:N.C.
3:N.C.
4:N.C.
1:VO
2:N.C.
3:N.C.
4:N.C.
A
V
V
Io
10µF
10µF
Io
10µF
Measurement Setup for
Figure 1, 3, 10
Measurement Setup for
Figure 2, 9
Measurement Setup for
Figure 4
5:ADJ /
EN
8:VCC
7:N.C.
6:GND
8:VCC
7:N.C.
6:GND
5:ADJ /
EN
5:ADJ /
EN
8:VCC
7:N.C.
6:GND
1Vrms
V
1µF
1µF
1µF
BD42530EFJ-C
BD42530EFJ-C
BD42530EFJ-C
1:VO
2:N.C.
3:N.C.
4:N.C.
1:VO
2:N.C.
3:N.C.
4:N.C.
1:VO
2:N.C.
3:N.C.
4:N.C.
A
10µF
V
10µF
10µF
Io
Io
Measurement Setup for
Figure 5, 6, 12
Measurement Setup for
Figure 7
Measurement Setup for
Figure 8
A
5:ADJ /
EN
8:VCC
7:N.C.
6:GND
5:ADJ /
EN
8:VCC
7:N.C.
6:GND
8:VCC
7:N.C.
6:GND
5:ADJ /
EN
A
1µF
1µF
1µF
BD42530EFJ-C
BD42530EFJ-C
BD42530EFJ-C
1:VO
2:N.C.
3:N.C.
4:N.C.
1:VO
2:N.C.
3:N.C.
4:N.C.
1:VO
2:N.C.
3:N.C.
4:N.C.
A
10µF
10µF
V
V
10µF
Io
Measurement Setup for
Figure 11
Measurement Setup for
Figure 13, 14
Measurement Setup for
Figure 15, 16
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BD42530xxx-C Series
Selection of Components Externally Connected
・VCC Pin
Insert Capacitors with a capacitance of 1 μF (Min) or higher between the VCC and GND. Choose the capacitance
according to the line between the power smoothing circuit and the VCC. Selection of the capacitance also depends on
the application. Verify the application and allow sufficient margins in the design. We recommend to mount the
capacitor as close as possible to the pin. When selecting the capacitor, ensure that the capacitance of 1 μF or higher
is maintained at the intended applied voltage and temperature range.
・Output Pin Capacitor
In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND. We recommend using
a capacitor with a capacitance of 4.7 μF (Min) or higher. Ceramic, Electrolytic and tantalum capacitors can be used.
When selecting the capacitor, ensure that the capacitance of 4.7 μF or higher is maintained at the intended applied
voltage and temperature range. Capacitance fluctuation due to changes in temperature can possibly result in
oscillation. For selection of the capacitor refer to the data of Figure 18.
The stable operation range given in the data of Figure 17 is based on the standalone IC and resistive load. For actual
applications the stable operating range is influenced by the PCB impedance, input supply impedance and load
impedance. Therefore verification of the final operating environment is needed.
When selecting a ceramic type capacitor, we recommend using X5R, X7R or better with excellent temperature and
DC-biasing characteristics and high voltage tolerance.
When the above-mentioned Output Pin Capacitor and the bypass capacitor for the rear stage may be connected in
parallel, oscillation may occur due to the deterioration of phase characteristic depending on the ESR value of the
Output Pin Capacitor. In such case, select ceramic capacitor of 4.7μF or more as the bypass capacitor. Or insert
additional ceramic capacitor of 4.7μF or more.
Also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying
that the actual application meets with the required specification. Mount the capacitor as close as possible to the
connected pin.
100
1000
○Condition
○Condition
5.6V ≤ Vcc ≤ 42V
2V ≤ VADJ/EN ≤ 16V
VADJ/EN < Vcc
CIN = 1µF
-40°C ≤ Tj ≤ +150°C
5.6V ≤ Vcc ≤ 42V
2V ≤ VADJ/EN ≤ 16V
VADJ/EN < Vcc
CIN = 1 µF
4.7 µF ≤ CO ≤ 100 µF
-40°C ≤ Tj ≤ +150°C
Unstable Operation Range
Stable Operation Range
10
1
100
10
1
Stable Operation Range
0.1
0.01
0.001
Unstable Operation Range
0
50
100
150
200
250
0
50
100
150
200
250
Output Current: Io [mA]
Output Current: Io [mA]
Figure 17. Output Pin Capacitor ESR vs Output Current
Figure 18. Output Pin Capacitor vs Output Current
5:ADJ
/ EN
8:VCC
7:N.C.
6:GND
CIN
BD42530EFJ-C
1:VO
2:N.C.
3:N.C.
4:N.C.
ESR
CO
IO
Figure 19. Measurement Setups for ESR Reference Data
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BD42530xxx-C Series
Power Dissipation
■HTSOP-J8
5.0
IC mounted on ROHM standard board based on JEDEC.
①
: 1 - layer PCB
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
Board material: FR4
4.0
②3.67 W
Board size: 114.3 mm x 76.2 mm x 1.57 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
3.0
2.0
②
: 4 - layer PCB
(2 inner layers and Copper foil area on the reverse side of PCB:
74.2 mm x 74.2 mm)
Board material: FR4
①0.96 W
1.0
Board size: 114.3 mm x 76.2 mm x 1.60 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
2 inner layers copper foil area of PCB
: 74.2 mm x 74.2 mm, 1 oz. copper.
Copper foil area on the reverse side of PCB
: 74.2 mm x 74.2 mm, 2 oz. copper.
0.0
0
25
50
75
100
125
150
Ambient Temperature: Ta [°C]
Figure 20. HTSOP-J8 Package Data
Condition①: θJA = 130 °C / W, ΨJT (top center) = 15 °C / W
Condition②: θJA = 34 °C / W, ΨJT (top center) = 7 °C / W
■TO252-J5
10.0
IC mounted on ROHM standard board based on JEDEC.
①
: 1 - layer PCB
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.57 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
8.0
6.0
②5.43 W
②
: 4 - layer PCB
4.0
2.0
0.0
(2 inner layers and Copper foil area on the reverse side of PCB:
74.2 mm x 74.2 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.60 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
2 inner layers copper foil area of PCB
: 74.2 mm x 74.2 mm, 1 oz. copper.
Copper foil area on the reverse side of PCB
: 74.2 mm x 74.2 mm, 2 oz. copper.
①0.92 W
0
25
50
75
100
125
150
Ambient Temperature: Ta [°C]
Figure 21. TO252-J5 Package Data
Condition①: θJA = 136 °C / W, ΨJT (top center) = 17 °C / W
Condition②: θJA = 23 °C / W, ΨJT (top center) = 3 °C / W
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Power Dissipation – continued
■TO263-5
10.0
8.0
IC mounted on ROHM standard board based on JEDEC.
①
: 1 - layer PCB
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.57 mm
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
②5.95 W
6.0
②
: 4 - layer PCB
4.0
(2 inner layers and Copper foil area on the reverse side of PCB:
74.2 mm x 74.2 mm)
Board material: FR4
①1.54 W
2.0
Board size: 114.3 mm x 76.2 mm x 1.60 mm
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
2 inner layers copper foil area of PCB
: 74.2 mm x 74.2 mm, 1 oz. copper.
Copper foil area on the reverse side of PCB
: 74.2 mm x 74.2 mm, 2 oz. copper.
0.0
0
25
50
75
100
125
150
Ambient Temperature: Ta [°C]
Figure 22. TO263-5 Package Data
Condition①: θJA = 81 °C / W, ΨJT (top center) = 8 °C / W
Condition②: θJA = 21 °C / W, ΨJT (top center) = 2 °C / W
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BD42530xxx-C Series
Thermal Design
Within this product, the power consumption is decided by the dropout voltage condition, the load current and the circuit
current. Refer to Package Data illustrated in Figure 20, 21, 22 when using the IC in an environment of Ta ≥ 25 °C. Even if the
ambient temperature Ta is at 25 °C, depending on the input voltage and the load current, chip junction temperature can be
very high. Consider the design to be Tj ≤ Tjmax = 150 °C in all possible operating temperature range. On the reverse side of
the package (HTSOP-J8, TO252-J5, TO263-5) there is exposed heat pad for improving the heat dissipation.
Should by any condition the maximum junction temperature Tjmax = 150 °C rating be exceeded by the temperature increase
of the chip, it may result in deterioration of the properties of the chip. The thermal impedance in this specification is based on
recommended PCB and measurement condition by JEDEC standard. Verify the application and allow sufficient margins in
the thermal design by the following method is used to calculate the junction temperature Tj.
Tj can be calculated by either of the two following methods.
1. The following method is used to calculate the junction temperature Tj.
Tj = Ta + PC × θJA
Where:
Tj
: Junction Temperature
: Ambient Temperature
: Power Consumption
: Thermal Impedance
(Junction to Ambient)
Ta
PC
θJA
2. The following method is also used to calculate the junction temperature Tj.
Tj = TT + PC × ΨJT
Where:
Tj
: Junction Temperature
TT
PC
ΨJT
: Top Center of Case’s (mold) Temperature
: Power consumption
: Thermal Impedance
(Junction to Top Center of Case)
The following method is used to calculate the power consumption Pc (W).
Pc = (VCC - VO) × IO + VCC × ICC
Where:
PC
VCC
VO
IO
: Power Consumption
: Input Voltage
: Output Voltage
: Load Current
ICC
: Circuit Current
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BD42530xxx-C Series
・Calculation Example (HTSOP-J8)
If VCC = 13.5 V, VO = 5.0 V, IO = 50 mA, ICC = 40 μA, the power consumption Pc can be calculated as follows:
PC = (VCC - VO) × IO + VCC × ICC
= (13.5 V – 5.0 V) × 50 mA + 13.5 V × 40 μA
= 0.43 W
At the ambient temperature Tamax = 125°C, the thermal Impedance (Junction to Ambient) θJA = 34 °C / W ( 4-layer PCB ),
Tj = Tamax + PC × θJA
= 125 °C + 0.43 W × 34 °C / W
= 139.6°C
When operating the IC, the top center of case’s (mold) temperature TT = 100 °C, ΨJT = 15 °C / W (1-layer PCB),
Tj = TT + PC × ΨJT
= 100 °C + 0.43 W × 15 °C / W
= 106.5 °C
For optimum thermal performance, it is recommended to expand the copper foil area of the board, increasing the layer and
thermal via between thermal land pad.
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BD42530xxx-C Series
Application Examples
・Applying positive surge to the VCC
If the possibility exists that surges higher than 45 V will be applied to the VCC, a Zener Diode should be placed between
the VCC and GND as shown in the figure below.
VCC
VO
GND
・Applying negative surge to the VCC
If the possibility exists that negative surges lower than the GND are applied to the VCC, a Shottky Diode should be place
between the VCC and GND as shown in the figure below.
VCC
VO
GND
・Implementing a Protection Diode
If the possibility exists that a large inductive load is connected to the output pin resulting in back-EMF at time of startup
and shutdown, a protection diode should be placed as shown in the figure below.
VCC
VO
GND
・Reverse Polarity Protection Diode
In some applications, the VCC and pin potential might be reversed, possibly resulting in damage to internal circuit or
damage to the element. In instance, when VCC shorts to GND while external capacitor at VO is charged.
Reverse current in case of point A described in below diagram can be prevented by inserting Reverse polarity protection
diode in series to the VCC.
When a short of the point B and the GND is concerned after having reverse polarity protection diode inserted, we
recommend inserting a bypass diode between the VCC and the VO.
If the reverse polarity protection diode and bypass diode cannot be inserted due to any reasons, use a capacitor with a
capacitance with less than 1000μF at VADJ / EN = 5V and 100μF at VADJ / EN = 16V to avoid damage to the internal circuits or
the elements.
Bypass Diode
Reverse Polarity Protection Diode
A
B
VCC
VO
GND
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BD42530xxx-C Series
I/O equivalence circuits
1 VCC
2 ADJ/EN
3 VO
10 kΩ
(Typ)
VCC
ADJ/EN
VCC
10 kΩ
(Typ)
VO
IC
10 kΩ
(Typ)
1 kΩ
(Typ)
1900 kΩ
(Typ)
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BD42530xxx-C Series
Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may
result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the
board size and copper area to prevent exceeding the maximum junction temperature rating.
6.
7.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
8.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Terminals
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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BD42530xxx-C Series
Operational Notes – continued
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
12. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls
below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
14. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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BD42530xxx-C Series
Physical Dimension, Tape and Reel Information (HTSOP-J8)
Package Name
HTSOP-J8
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BD42530xxx-C Series
Physical Dimension, Tape and Reel Information(TO252-J5)
Package Name
TO252-J5
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BD42530xxx-C Series
Physical Dimension, Tape and Reel Information (TO263-5)
Package Name
TO263-5
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BD42530xxx-C Series
Marking Diagrams (Top View)
HTSOP-J8
TO252-J5
Part Number Marking
Lot Number
Part Number Marking
Lot Number
1PIN MARK
TO263-5
1PIN
Part Number Marking
Lot Number
1PIN
Part Number
Package
Part Number Marking
BD42530EFJ-C
BD42530UEFJ-C
BD42530FPJ-C
BD42530FP2-C
HTSOP-J8
HTSOP-J8
TO252-J5
TO263-5
42530
42530U
BD42530
BD42530
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BD42530xxx-C Series
Revision History
Date
Revision
Changes
20.Apr.2016
001
002
New Release
Page 1, 6 and 14, change value of minimum output capacitor and maximum ESR
Page 1, 6 and 14, add comment of [ recommended ceramic capacitor for output pin]
Page 7, change format for Thermal Resistance
1.Dec.2016
29.Dec.2016
8.Nov.2021
003
004
Add TO252-J5 Package
Add BD42530UEFJ-C
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
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