BD433S2WEFJ-C (新产品) [ROHM]
The BD4xxS2-C series are low quiescent regulators featuring 45V absolute maximum voltage, and output voltage accuracy of ±2% (3.3V or 5.0V: Typ), 200mA output current and 40µA (Typ) current consumption. These regulators are therefore ideal for applications requiring a direct connection to the battery and a low current consumption. A logical “HIGH” at the CTL pin enables the device and “LOW” at the CTL pin not enables the device. (Only W: Includes switch) Ceramic capacitors can be used for compensation of the output capacitor phase. Furthermore, these ICs also feature overcurrent protection to protect the device from damage caused by short-circuiting and an integrated thermal shutdown to protect the device from overheating at overload conditions.;
| 型号： | BD433S2WEFJ-C (新产品) |
| 厂家： | 
ROHM |
| 描述： | The BD4xxS2-C series are low quiescent regulators featuring 45V absolute maximum voltage, and output voltage accuracy of ±2% (3.3V or 5.0V: Typ), 200mA output current and 40µA (Typ) current consumption. These regulators are therefore ideal for applications requiring a direct connection to the battery and a low current consumption. A logical “HIGH” at the CTL pin enables the device and “LOW” at the CTL pin not enables the device. (Only W: Includes switch) Ceramic capacitors can be used for compensation of the output capacitor phase. Furthermore, these ICs also feature overcurrent protection to protect the device from damage caused by short-circuiting and an integrated thermal shutdown to protect the device from overheating at overload conditions. |
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| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
For Automotive 45 V Input
200 mA Fixed Output LDO Regulators
BD4xxS2-C Series
General Description
Features
◼ Qualified for Automotive Applications
The BD4xxS2-C series are low quiescent regulators
featuring 45 V absolute maximum voltage, and output
voltage accuracy of ±2 % (3.3 V or 5.0 V: Typ), 200 mA
output current and 40 μA (Typ) current consumption.
These regulators are therefore ideal for applications
requiring a direct connection to the battery and a low
current consumption.
◼ Wide Temperature Range (Tj):
◼ Wide Operating Input Range:
◼ Low Quiescent Current:
◼ Output Current:
-40 °C to +150 °C
3.0 V to 42 V
40 μA (Typ)
200 mA
◼ High Output Voltage Accuracy:
◼ Output Voltage:
±2 %
3.3 V or 5.0 V (Typ)
A logical “HIGH” at the CTL pin enables the device and
“LOW” at the CTL pin not enables the device.
(Only W: Includes switch)
Ceramic capacitors can be used for compensation of the
output capacitor phase. Furthermore, these ICs also
feature overcurrent protection to protect the device from
damage caused by short-circuiting and an integrated
thermal shutdown to protect the device from overheating
at overload conditions.
◼ Enable Input (Only W: Includes Enable Input)
◼ Over Current Protection (OCP)
◼ Thermal Shutdown Protection (TSD)
◼ AEC-Q100 Qualified(Note 1)
◼ Functional Safety Supportive Automotive Products
(Note 1): Grade 1
Applications
■
■
■
Body
Audio System
Navigation System, etc.
Packages
W (Typ) x D (Typ) x H (Max)
EFJ: HTSOP-J8 4.9 mm x 6.0 mm x 1.0 mm
■
■
FP3: SOT223-4 6.53 mm x 7.0 mm x 1.8 mm
Figure 1. Package Outlook
Typical Application Circuits
■Components Externally Connected: 0.1 µF ≤ CIN, 10 µF ≤ COUT (Typ)
*Electrolytic, tantalum and ceramic capacitors can be used.
Input
Voltage
Output
Voltage
VCC
CTL
VOUT
Input
Voltage
Output
Voltage
ꢀ
ꢀ
VCC
VOUT
ꢀ
ꢀ
CIN
COUT
CIN
COUT
GND
GND
Enable
Voltage
For product without Enable Input
For product with Enable Input
Figure 2. Typical Application Circuits
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
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BD4xxS2-C Series
Ordering Information
B D 4
x
x
S 2 W x
x
x
-
C E 2
Part
Output Voltage
Output
Enable Input
Package
Product Rank
Number
33: 3.3 V
50: 5.0 V
Current
2: 200 mA
W: Includes Enable
Input
None:
EFJ: HTSOP-J8
FP3: SOT223-4
C: for Automotive
Packaging and Forming
Specification
Without Enable
Input
E2: Embossed Tape and Reel
Lineup
Output Current
Ability
Output Voltage
(Typ)
Enable
Input(Note 1)
Package Type
Orderable Part Number
SOT223-4
HTSOP-J8
SOT223-4
HTSOP-J8
SOT223-4
HTSOP-J8
SOT223-4
HTSOP-J8
BD433S2WFP3-CE2
BD433S2WEFJ-CE2
BD433S2FP3-CE2
BD433S2EFJ-CE2
BD450S2WFP3-CE2
BD450S2WEFJ-CE2
BD450S2FP3-CE2
BD450S2EFJ-CE2
○
－
○
－
3.3 V
200 mA
5.0 V
(Note 1) ○: Includes Enable Input.
－: Not includes Enable Input.
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BD4xxS2-C Series
Pin Configurations
HTSOP-J8
(Top View)
SOT223-4
(Top View)
4 (FIN)
FIN
1
2
3
Figure 3. Pin Configurations
■BD433S2WFP3-C / BD450S2WFP3-C (SOT223-4)
Pin Descriptions
■BD433S2WEFJ-C / BD450S2WEFJ-C (HTSOP-J8)
Pin No.
Pin Name
VOUT
N.C.
Pin Function
Output pin
Pin No.
Pin Name
VCC
Pin Function
Supply voltage input pin
Output control pin
Output pin
1
2
3
4
5
6
7
8
-
1
Not connected
Not connected
Not connected
Ground pin
2
3
CTL
N.C.
VOUT
GND
N.C.
4 (FIN)
Ground pin
GND
N.C.
Not connected
Output control pin
Supply voltage input pin
Heat dissipation
CTL
VCC
EXP-PAD
■BD433S2EFJ-C / BD450S2EFJ-C (HTSOP-J8)
■BD433S2FP3-C / BD450S2FP3-C (SOT223-4)
Pin No.
Pin Name
VOUT
N.C.
Pin Function
Output pin
Pin No.
Pin Name
VCC
Pin Function
Supply voltage input pin
Ground pin
1
2
3
4
5
6
7
8
-
1
Not connected
Not connected
Not connected
Ground pin
2
3
GND
N.C.
VOUT
GND
Output pin
N.C.
4 (FIN)
Ground pin
GND
N.C.
Not connected
Not connected
Supply voltage input pin
Heat dissipation
N.C.
VCC
EXP-PAD
* N.C. Pin is recommended to short with GND.
* N.C. Pin can be open because it isn’t connected it inside of IC.
* EXP-PAD on the back side is connected to the IC substrate, so it should connect to external ground node.
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BD4xxS2-C Series
Block Diagrams
■BD433S2WEFJ-C / BD450S2WEFJ-C
VCC (Pin 8)
CTL (Pin 7)
N.C. (Pin 6)
GND (Pin 5)
CTL
PREREG
VREF
－
＋
DRIVER
OCP
TSD
VOUT (Pin 1)
N.C. (Pin 2)
N.C. (Pin 3)
N.C. (Pin 6)
DRIVER
N.C. (Pin 4)
■BD433S2EFJ-C / BD450S2EFJ-C
VCC (Pin 8)
N.C. (Pin 7)
GND (Pin 5)
PREREG
VREF
－
＋
OCP
TSD
VOUT (Pin 1)
N.C. (Pin 2)
N.C. (Pin 3)
N.C. (Pin 4)
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BD4xxS2-C Series
Block Diagrams – continued
■BD433S2WFP3-C / BD450S2WFP3-C
GND (FIN)
CTL
PREREG
VREF
－
＋
DRIVER
OCP
TSD
CTL (Pin 2)
VCC (Pin 1)
VOUT (Pin 3)
■BD433S2FP3-C / BD450S2FP3-C
GND (FIN)
PREREG
VREF
－
＋
DRIVER
OCP
TSD
GND (Pin 2)
VCC (Pin 1)
VOUT (Pin 3)
Figure 4. Block Diagrams
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BD4xxS2-C Series
Description of Blocks
Block Name
Function
Description of Blocks
A logical “HIGH” (≥ 2.8 V) at the CTL pin enables the device
and “LOW” (≤ 0.8 V) at the CTL pin not enable the device.
CTL(Note 1)
PREREG
TSD
Control Output Voltage ON/OFF
Internal Power Supply
Thermal Shutdown Protection
Reference Voltage
Power Supply for Internal Circuit
To protect the device from overheating.
If the chip temperature (Tj) reaches ca. 175 °C (Typ),
the output is turned off.
VREF
Generate the Reference Voltage
Drive the Output MOS FET
DRIVER
OCP
Output MOS FET Driver
Over Current Protection
To protect the device from damage caused by over current.
If the output current reaches ca. 550 mA (Typ),
the output current is limited.
(Note 1) Applicable for product with Enable Input.
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BD4xxS2-C Series
Absolute Maximum Ratings
Parameter
Symbol
VCC
Ratings
-0.3 to +45.0
-0.3 to +45.0
-0.3 to +8.0
-40 to +150
-55 to +150
+150
Unit
V
Supply Voltage(Note 1)
Output Control Voltage(Note 2)
Output Voltage
CTL
V
VOUT
Tj
V
Junction Temperature Range
Storage Temperature Range
Maximum Junction Temperature
ESD withstand Voltage (HBM)(Note 3)
°C
°C
°C
V
Tstg
Tjmax
VESD, HBM
±2000
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance and power dissipation taken into
consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) Do not exceed Pd.
(Note 2) Applicable for product with Enable Input.
The start-up orders of power supply (VCC) and the CTL pin do not influence if the voltage is within the operation power supply voltage range.
(Note 3) ESD susceptibility Human Body Model “HBM”.
Operating Conditions (-40 °C ≤ Tj ≤ +150 °C)
Parameter
Supply Voltage (IOUT ≤ 200 mA)(Note 1)
Supply Voltage (IOUT ≤ 100 mA)(Note 1)
Supply Voltage (IOUT ≤ 200 mA)(Note 2)
Supply Voltage (IOUT ≤ 100 mA)(Note 2)
Output Control Voltage(Note 3)
Symbol
VCC
VCC
VCC
VCC
CTL
Min
4.3
3.9
5.8
5.5
0
Max
42.0
42.0
42.0
42.0
42.0
–
Unit
V
V
V
V
V
Start-Up Voltage(Note 4)
VCC
IOUT
Tj
V
3.0
0
Output Current
mA
°C
200
+150
Junction Temperature Range
-40
(Note 1) For BD433S2WEFJ-C / BD433S2WFP3-C / BD433S2EFJ-C / BD433S2FP3-C
(Note 2) For BD450S2WEFJ-C / BD450S2WFP3-C / BD450S2EFJ-C / BD450S2FP3-C
(Note 3) Applicable for product with Enable Input.
(Note 4) When IOUT = 0 mA.
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BD4xxS2-C Series
Thermal Resistance
Parameter
Symbol
Min
Max
Unit
HTSOP-J8 Package
Junction to Ambient(Note 1)
θja
θjc
43.1
10
－
－
°C/W
°C/W
Junction to Case (bottom)(Note 1)
SOT223-4 Package
Junction to Ambient(Note 2)
Junction to Case (bottom)(Note 2)
θja
θjc
83.3
17
－
－
°C/W
°C/W
(Note 1)
(Note 2)
HTSOP-J8 mounted on 114.3 mm x 76.2 mm x 1.6 mmt Glass-Epoxy PCB based on JEDEC.
(4-layer PCB: Copper foil on the reverse side of PCB:74.2 mm x 74.2 mm)
SOT223-4 mounted on 114.3 mm x 76.2 mm x 1.6 mmt Glass-Epoxy PCB based on JEDEC.
(4-layer PCB: Copper foil on the reverse side of PCB:74.2 mm x 74.2 mm)
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BD4xxS2-C Series
Electrical Characteristics
(Unless otherwise specified, -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5 V(Note 1), IOUT = 0 mA.
The typical value is defined at Tj = 25 °C.)
Limit
Parameter
Symbol
Unit
μA
μA
μA
V
Conditions
Min
Typ
Max
5.0
CTL = 0 V,
Tj ≤ 125 °C
Shutdown Current
Ishut(Note 1)
－
2.0
IOUT = 0 mA,
－
－
40
40
90
Tj ≤ 125 °C
Circuit Current
Output Voltage
Icc
IOUT ≤ 200 mA,
150
5.10
3.37
0.35
0.45
－
Tj ≤ 150 °C
6 V ≤ VCC ≤ 42 V,
VOUT(Note 2)
VOUT(Note 3)
ΔVd(Note 2)
ΔVd(Note 3)
R.R.
4.90
3.23
－
5.00
3.30
0.16
0.20
65
0 mA ≤ IOUT ≤ 200 mA
6 V ≤ VCC ≤ 42 V,
V
0 mA ≤ IOUT ≤ 200 mA
VCC = VOUT x 0.95 (= 4.75 V: Typ),
IOUT = 100 mA
V
Dropout Voltage
Ripple Rejection
VCC = VOUT x 0.95 (= 3.135 V: Typ),
IOUT = 100 mA
－
V
f = 120 Hz, ein = 1 Vrms,
IOUT = 100 mA
55
dB
Line Regulation
Load Regulation
Thermal Shutdown
Reg.I
Reg.L
TSD
－
－
－
10
10
30
30
－
mV
mV
°C
8 V ≤ VCC ≤ 16 V
10 mA ≤ IOUT ≤ 100 mA
Tj at TSD ON
175
(Note 1) Applicable for product with Enable Input.
(Note 2) For BD450S2WEFJ-C / BD450S2WFP3-C / BD450S2EFJ-C / BD450S2FP3-C
(Note 3) For BD433S2WEFJ-C / BD433S2WFP3-C / BD433S2EFJ-C / BD433S2FP3-C
Electrical Characteristics (Enable function * Applicable for product with Enable Input.)
(Unless otherwise specified, -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, IOUT = 0 mA. The typical value is defined at Tj = 25 °C.)
Limit
Parameter
Symbol
Unit
Conditions
ACTIVE MODE
Min
2.8
Typ
Max
－
－
V
V
CTL ON Mode Voltage
CTL OFF Mode Voltage
CTL Bias Current
VthH
VthL
ICTL
－
－
－
0.8
30
OFF MODE
CTL = 5 V
15
µA
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BD4xxS2-C Series
Typical Performance Curves (Reference Data)
■Applicable Models: BD433S2WEFJ-C / BD433S2EFJ-C / BD433S2WFP3-C / BD433S2FP3-C
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5 V(Note 1), IOUT = 0 mA.
(Note 1) Applicable for product with Enable Input.
100
90
80
70
60
50
40
30
20
10
0
6
5
4
3
2
1
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
5
10 15 20 25 30 35 40 45
Supply Voltage: VCC [V]
0
5
10 15 20 25 30 35 40 45
Supply Voltage: VCC [V]
Figure 5. Circuit Current vs Power Supply Voltage
Figure 6. Output Voltage vs Power Supply Voltage
(IOUT = 0 mA)
6
5
4
3
2
1
0
100
90
80
70
60
50
40
30
20
10
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
Supply Voltage: VCC [V]
Supply Voltage: VCC [V]
Figure 8. Output Voltage vs Power Supply Voltage
(IOUT = 0 mA)
Figure 7. Circuit Current vs Power Supply Voltage
-Magnified Figure 5. at Low Supply Voltage
-Magnified Figure 6. at Low Supply Voltage
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BD4xxS2-C Series
Typical Performance Curves (Reference Data) – continued
■Applicable Models: BD433S2WEFJ-C / BD433S2EFJ-C / BD433S2WFP3-C / BD433S2FP3-C
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5 V(Note 1), IOUT = 0 mA.
(Note 1) Applicable for product with Enable Input.
6
5
4
3
2
1
0
6
5
4
3
2
1
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
5
10 15 20 25 30 35 40 45
SupplyVoltage: VCC [V]
0
100
200
300
400
500
600
700
Output Current: IOUT [mA]
Figure 9. Output Voltage vs Power Supply Voltage
(IOUT = 10 mA)
Figure10. Output Voltage vs Output Current
(Over Current Protection)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
90
80
70
60
50
40
30
20
10
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
20 40 60 80 100 120 140 160 180 200
Output Current: IOUT [mA]
0.01
0.1
1
10
100
Frequency: f [kHz]
Figure 11. Dropout Voltage
(VCC = 3.135 V)
Figure 12. Ripple Rejection
(ein = 1 Vrms, IOUT = 100 mA)
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BD4xxS2-C Series
Typical Performance Curves (Reference Data) – continued
■Applicable Models: BD433S2WEFJ-C / BD433S2EFJ-C / BD433S2WFP3-C / BD433S2FP3-C
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5 V(Note 1), IOUT = 0 mA.
(Note 1) Applicable for product with Enable Input.
90
80
70
60
50
40
30
20
10
0
6
5
4
3
2
1
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
100
120
140
160
180
200
0
40
80
120
160
200
Junction Temperature:Tj [°C]
Output Current: IOUT [mA]
Figure 14. Output Voltage vs Temperature
(Thermal Shutdown)
Figure 13. Circuit Current vs Output Current
3.370
3.350
3.330
3.310
3.290
3.270
3.250
3.230
100
90
80
70
60
50
40
30
20
10
0
-40
0
40
80
120
160
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature:Tj [°C]
Junction Temperature:Tj [°C]
Figure 15. Output Voltage vs Temperature
Figure 16. Circuit Current vs Temperature
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BD4xxS2-C Series
Typical Performance Curves (Reference Data) – continued
■Applicable Models: BD433S2WEFJ-C / BD433S2WFP3-C
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, IOUT = 0 mA
10
9
8
7
6
5
4
3
2
1
0
6
5
4
3
2
1
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
4 5
0
5
10 15 20 25 30 35 40 45
Supply Voltage: VCC [V]
0
1
2
3
CTL SupplyVoltage: CTL [V]
Figure 17. Shutdown Current vs Power Supply Voltage
(CTL = 0 V)
Figure 18. CTL ON / OFF Mode Voltage
(Tj = -40 °C)
6
5
4
3
2
6
5
4
3
2
1
0
1
Tj = 25 °C
Tj = 125 °C
0
0
1
2
3
4
5
0
1
2
3
4
5
CTL SupplyVoltage: CTL [V]
CTL SupplyVoltage: CTL [V]
Figure 20. CTL ON / OFF Mode Voltage
(Tj = 125 °C)
Figure 19. CTL ON / OFF Mode
Voltage
(Tj = 25 °C)
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BD4xxS2-C Series
Typical Performance Curves (Reference Data) – continued
■Applicable Models: BD433S2WEFJ-C / BD433S2WFP3-C
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, IOUT = 0 mA
5
4
3
2
1
0
30
25
20
15
10
5
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
0
1
2
3
4
5
-40
0
40
80
120
160
Junction Temperature:Tj [°C]
CTL Supply Voltage: CTL [V]
Figure 21. Shutdown Current vs Temperature
(CTL = 0 V)
Figure 22. CTL Bias Current vs CTL Supply Voltage
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BD4xxS2-C Series
Typical Performance Curves (Reference Data) – continued
■Applicable Models: BD450S2WEFJ-C / BD450S2EFJ-C / BD450S2WFP3-C / BD450S2FP3-C
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5 V(Note 1), IOUT = 0 mA.
(Note 1) Applicable for product with Enable Input.
6
5
4
3
2
1
0
100
90
80
70
60
50
40
30
20
10
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
5
10 15 20 25 30 35 40 45
SupplyVoltage: VCC [V]
0
5
10 15 20 25 30 35 40 45
SupplyVoltage: VCC [V]
Figure 23. Circuit Current vs Power Supply Voltage
Figure 24. Output Voltage vs Power Supply Voltage
(IOUT = 0 mA)
100
6
5
4
3
2
1
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
90
80
70
60
50
40
30
20
10
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
Supply Voltage: VCC [V]
SupplyVoltage: VCC [V]
Figure 26. Output Voltage vs Power Supply Voltage
(IOUT = 0 mA)
Figure 25. Circuit Current vs Power Supply Voltage
-Magnified Figure 23. at Low Supply Voltage
-Magnified Figure 24. at Low Supply Voltage
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BD4xxS2-C Series
Typical Performance Curves (Reference Data) – continued
■Applicable Models: BD450S2WEFJ-C / BD450S2EFJ-C / BD450S2WFP3-C / BD450S2FP3-C
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5 V(Note 1), IOUT = 0 mA.
(Note 1) Applicable for product with Enable Input.
6
5
4
3
2
1
0
6
5
4
3
2
1
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
100
200
300
400
500
600
700
0
5
10 15 20 25 30 35 40 45
SupplyVoltage: VCC [V]
Output Current: IOUT [mA]
Figure 28. Output Voltage vs Output Current
(Over Current Protection)
Figure 27. Output Voltage vs Power Supply Voltage
(IOUT = 10 mA)
90
80
70
60
50
40
30
20
10
0
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0.01
0.1
1
10
100
0
20 40 60 80 100 120 140 160 180 200
Output Current: IOUT [mA]
Frequency: f [kHz]
Figure 30. Ripple Rejection
(ein = 1 Vrms, IOUT = 100 mA)
Figure 29. Dropout Voltage
(VCC = 4.75 V)
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BD4xxS2-C Series
Typical Performance Curves (Reference Data) – continued
■Applicable Models: BD450S2WEFJ-C / BD450S2EFJ-C / BD450S2WFP3-C / BD450S2FP3-C
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5 V(Note 1), IOUT = 0 mA.
(Note 1) Applicable for product with Enable Input.
90
80
70
60
50
40
30
20
10
0
6
5
4
3
2
1
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
100
120
140
160
180
200
0
40
80
120
160
200
Junction Temperature:Tj [°C]
Output Current: IOUT [mA]
Figure 31. Circuit Current vs Output Current
Figure 32. Output Voltage vs Temperature
(Thermal Shutdown)
100
90
80
70
60
50
40
30
20
10
0
5.100
5.080
5.060
5.040
5.020
5.000
4.980
4.960
4.940
4.920
4.900
-40 -20
0
20 40 60 80 100 120 140 160
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature:Tj [℃]
Junction Temperature:Tj [°C]
Figure 34. Circuit Current vs Temperature
Figure 33. Output Voltage vs Temperature
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BD4xxS2-C Series
Typical Performance Curves (Reference Data) – continued
■Applicable Models: BD450S2WEFJ-C / BD450S2WFP3-C
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, IOUT = 0 mA
10
6
Tj = -40 °C
9
5
4
3
2
1
0
Tj = 25 °C
8
7
6
5
4
3
2
1
0
Tj = 125 °C
Tj = -40 °C
4 5
0
5
10 15 20 25 30 35 40 45
Supply Voltage: VCC [V]
0
1
2
3
CTL Supply Voltage: CTL [V]
Figure 35. Shutdown Current vs Power Supply Voltage
(CTL = 0 V)
Figure 36. CTL ON / OFF Mode Voltage
(Tj = -40 °C)
6
5
4
3
2
6
5
4
3
2
1
0
1
Tj = 25 °C
Tj = 125 °C
0
0
1
2
3
4
5
0
1
2
3
4
5
CTL Supply Voltage: CTL [V]
CTL SupplyVoltage: CTL [V]
Figure 38. CTL ON / OFF Mode Voltage
(Tj = 125 °C)
Figure 37. CTL ON / OFF Mode Voltage
(Tj = 25 °C)
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BD4xxS2-C Series
Typical Performance Curves (Reference Data) – continued
■Applicable Models: BD450S2WEFJ-C / BD450S2WFP3-C
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, IOUT = 0 mA
5
4
3
2
1
0
30
25
20
15
10
5
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
-40
0
40
80
120
160
0
1
2
3
4
5
Junction Temperature:Tj[°C]
CTL SupplyVoltage: CTL [V]
Figure 39. Shutdown Current vs Temperature
(CTL = 0 V)
Figure 40. CTL Bias Current vs CTL Supply
Voltage
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BD4xxS2-C Series
Measurement Circuit for Typical Performance Curves (BD433S2WEFJ-C / BD450S2WEFJ-C)
8: VCC
7: CTL
6: N.C.
5: GND
8: VCC
7: CTL
6: N.C.
5: GND
8: VCC
7: CTL
6: N.C.
5: GND
4.7 µF
4.7 µF
4.7 µF
BD4xxS2WEFJ-C
BD4xxS2WEFJ-C
BD4xxS2WEFJ-C
1: VOUT 2: N.C.
3: N.C.
4: N.C.
1: VOUT 2: N.C.
3: N.C.
4: N.C.
1: VOUT 2: N.C.
3: N.C.
4: N.C.
10 µF
10 µF
IOUT
10 µF
Measurement Setup for
Figure 5, 7, 16, 17, 21,
Figure 23, 25, 34, 35, 39
Measurement Setup for
Figure 6, 8, 14, 15,
Figure 24, 26, 32, 33
Measurement Setup for
Figure 9, 27
8: VCC
7: CTL
6: N.C.
5: GND
8: VCC
7: CTL
6: N.C.
5: GND
8: VCC
7: CTL
6: N.C.
5: GND
1 Vrms
4.7 µF
4.7 µF
4.7 µF
BD4xxS2WEFJ-C
BD4xxS2WEFJ-C
BD4xxS2WEFJ-C
1: VOUT 2: N.C.
3: N.C.
4: N.C.
1: VOUT 2: N.C.
3: N.C.
4: N.C.
1: VOUT 2: N.C.
3: N.C.
4: N.C.
10 µF
IOUT
10 µF
10 µF
IOUT
Measurement Setup for
Figure 11, 29
Measurement Setup for
Figure 12, 30
Measurement Setup for
Figure 10, 28
8: VCC
7: CTL
6: N.C.
5: GND
8: VCC
7: CTL
6: N.C.
5: GND
8: VCC
7: CTL
6: N.C.
5: GND
4.7 µF
4.7 µF
4.7 µF
BD4xxS2WEFJ-C
BD4xxS2WEFJ-C
BD4xxS2WEFJ-C
1: VOUT 2: N.C.
3: N.C.
4: N.C.
1: VOUT 2: N.C.
3: N.C.
4: N.C.
1: VOUT 2: N.C.
3: N.C.
4: N.C.
10 µF
10 µF
IOUT
10 µF
Measurement Setup for
Figure 22, 40
Measurement Setup for
Figure 18, 19, 20,
Figure 36, 37, 38
Measurement Setup for
Figure 13, 31
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BD4xxS2-C Series
Measurement Circuit for Typical Performance Curves (BD433S2EFJ-C / BD450S2EFJ-C) – continued
8: VCC
7: N.C.
6: N.C.
8: VCC
7: N.C.
6: N.C.
5: GND
5: GND
8: VCC
7: N.C.
6: N.C.
5: GND
4.7 µF
4.7 µF
4.7 µF
BD4xxS2EFJ-C
BD4xxS2EFJ-C
BD4xxS2EFJ-C
1: VOUT 2: N.C.
3: N.C.
4: N.C.
1: VOUT 2: N.C.
3: N.C.
4: N.C.
1: VOUT 2: N.C.
3: N.C.
4: N.C.
IOUT
10 µF
10 µF
10 µF
Measurement Setup for
Figure 6, 8, 14, 15,
Figure 24, 26, 32, 33
Measurement Setup for
Figure 5, 7, 16,
Measurement Setup for
Figure 9, 27
Figure 23, 25, 34
8: VCC
7: N.C.
6: N.C.
8: VCC
7: N.C.
6: N.C.
8: VCC
7: N.C.
6: N.C.
5: GND
5: GND
5: GND
1 Vrms
4.7 µF
4.7 µF
4.7 µF
BD4xxS2EFJ-C
BD4xxS2EFJ-C
BD4xxS2EFJ-C
1: VOUT 2: N.C.
3: N.C.
4: N.C.
1: VOUT 2: N.C.
3: N.C.
4: N.C.
1: VOUT 2: N.C.
3: N.C.
4: N.C.
10 µF
10 µF
IOUT
10 µF
IOUT
Measurement Setup for
Figure 12, 30
Measurement Setup for
Figure 11, 29
Measurement Setup for
Figure 10, 28
8: VCC
7: N.C.
6: N.C.
5: GND
4.7 µF
BD4xxS2EFJ-C
1: VOUT 2: N.C.
3: N.C.
4: N.C.
IOUT
10 µF
Measurement Setup for
Figure 13, 31
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BD4xxS2-C Series
Measurement Circuit for Typical Performance Curves (BD433S2WFP3-C / BD450S2WFP3-C) – continued
FIN
FIN
FIN
4: GND
4: GND
4: GND
BD4xxS2WFP3-C
BD4xxS2WFP3-C
BD4xxS2WFP3-C
1: VCC
2: CTL
3: VOUT
1: VCC
2: CTL
3: VOUT
1: VCC
2: CTL
3: VOUT
IOUT
4.7 µF
10 µF
4.7 µF
10 µF
4.7 µF
10 µF
Measurement Setup for
Figure 5, 7, 16, 17, 21,
Figure 23, 25, 34, 35, 39
Measurement Setup for
Figure 6, 8, 14, 15,
Figure 24, 26, 32, 33
Measurement Setup for
Figure 9, 27
FIN
FIN
FIN
4: GND
4: GND
4: GND
BD4xxS2WFP3-C
BD4xxS2WFP3-C
BD4xxS2WFP3-C
1: VCC
2: CTL
3: VOUT
1: VCC
2: CTL
3: VOUT
1: VCC
2: CTL
3: VOUT
1 Vrms
IOUT
4.7 µF
10 µF
4.7 µF
10 µF
4.7 µF
10 µF
IOUT
Measurement Setup for
Figure 12, 30
Measurement Setup for
Figure 10, 28
Measurement Setup for
Figure 11, 29
FIN
FIN
FIN
4: GND
4: GND
4: GND
BD4xxS2WFP3-C
BD4xxS2WFP3-C
BD4xxS2WFP3-C
1: VCC
2: CTL
3: VOUT
1: VCC
2: CTL
3: VOUT
1: VCC
2: CTL
3: VOUT
4.7 µF
10 µF
4.7 µF
10 µF
4.7 µF
10 µF IOUT
Measurement Setup for
Figure 18, 19, 20,
Figure 36, 37, 38
Measurement Setup for
Figure 13, 31
Measurement Setup for
Figure 22, 40
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BD4xxS2-C Series
Measurement Circuit for Typical Performance Curves (BD433S2FP3-C / BD450S2FP3-C) – continued
FIN
FIN
FIN
4: GND
4: GND
4: GND
BD4xxS2FP3-C
BD4xxS2FP3-C
BD4xxS2FP3-C
1: VCC
2: GND
3: VOUT
1: VCC
2: GND
3: VOUT
1: VCC
2: GND
3: VOUT
IOUT
4.7 µF
10 µF
4.7 µF
10 µF
4.7 µF
10 µF
Measurement Setup for
Figure 9, 27
Measurement Setup for
Figure 5, 7, 16,
Measurement Setup for
Figure 6, 8, 14, 15,
Figure 23, 25, 34
Figure 24, 26, 32, 33
FIN
FIN
FIN
4: GND
4: GND
4: GND
BD4xxS2FP3-C
BD4xxS2FP3-C
BD4xxS2FP3-C
1: VCC
2: GND
3: VOUT
1: VCC
2: GND
3: VOUT
1: VCC
2: GND
3: VOUT
1 Vrms
IOUT
4.7 µF
10 µF
4.7 µF
10 µF
4.7 µF
10 µF
IOUT
Measurement Setup for
Figure 11, 29
Measurement Setup for
Figure 12, 30
Measurement Setup for
Figure 10, 28
FIN
4: GND
BD4xxS2FP3-C
1: VCC
2: GND
3: VOUT
4.7 µF
10 µF IOUT
Measurement Setup for
Figure 13, 31
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BD4xxS2-C Series
Selection of Components Externally Connected
VCC Pin
Insert Capacitors with a capacitance of 0.1 µF or higher between the VCC and GND pin. Choose the capacitance
according to the line between the power smoothing circuit and the VCC pin. Selection of the capacitance also depends
on the application. Verify the application and allow sufficient margins in the design. We recommend using a capacitor
with excellent voltage and temperature characteristics.
Output Pin Capacitor
In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND pin. We recommend
using a capacitor with a capacitance of 10 μF (Typ) or higher. Electrolytic, tantalum and ceramic capacitors can be
used. When selecting the capacitor ensure that the capacitance of 6 μF or higher is maintained at the intended applied
voltage and temperature range. Due to changes in temperature the capacitor’s capacitance can fluctuate possibly
resulting in oscillation. For selection of the capacitor refer to the data of Figure 41.
The stable operation range given in the data of Figure 41 is based on the standalone IC and resistive load. For actual
applications the stable operating range is influenced by the PCB impedance, input supply impedance and load
impedance. Therefore verification of the final operating environment is needed.
When selecting a ceramic type capacitor, we recommend using X5R, X7R or better with excellent temperature and
DC-biasing characteristics and high voltage tolerance.
Also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying
that the actual application meets with the required specification.
○Condition
○Condition
VCC = 13.5 V
(CTL = 5 V)
CIN = 0.1 µF
-40 °C ≤ Tj ≤ +150 °C
VCC = 13.5 V
(CTL = 5 V)
CIN = 0.1 µF
10 µF ≤ COUT (Typ)
-40 °C ≤ Tj ≤ +150 °C
unstable operation range
stable operation range
stable operation range
unstable operation range
Figure 41. ESR vs IOUT
Figure 42. COUT vs IOUT
■Measurement Setup
FIN
FIN
8: VCC
7: N.C.
6: N.C.
4: GND
5: GND
4: GND
8: VCC
7: CTL
6: N.C.
5: GND
CIN
BD4xxS2FP3-C
CIN
BD4xxS2WFP3-C
BD4xxS2EFJ-C
BD4xxS2WEFJ-C
1: VCC
2: GND
3: VOUT
1: VCC
2: CTL
3: VOUT
1: VOUT 2: N.C.
3: N.C.
4: N.C.
1: VOUT 2: N.C.
3: N.C.
4: N.C.
ESR
ESR
ESR
ESR
CIN
IOUT
IOUT
CIN
IOUT
IOUT
COUT
COUT
COUT
COUT
Figure 43. Measurement Setups for ESR Reference Data
(about Output Pin Capacitor)
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BD4xxS2-C Series
Selection of Components Externally Connected – continued
Surge Voltage Protection for Linear Regulators
The following shows some helpful tips to protect ICs from possible inputting surge voltage which exceeds absolute
maximum ratings.
Positive Surge to the Input
If there is any potential risk that positive surges higher than absolute maximum ratings, it is applied to the input, a
Zener Diode should be inserted between the VCC pin and the GND to protect the device as shown in Figure 44.
VCC
VOUT
GND
VCC
VOUT
COUT
D1
CIN
Figure 44. Surges Higher than absolute maximum ratings are Applied to the Input
Negative Surge to the Input
If there is any potential risk that negative surges below the absolute maximum ratings, (e.g.) -0.3 V, is applied to the
input, a Schottky Diode should be inserted between the VCC and the GND to protect the device as shown in Figure
45.
VCC
VOUT
GND
VCC
VOUT
COUT
D1
CIN
Figure 45. Surges Lower than -0.3 V is Applied to the Input
Reverse Voltage Protection for Linear Regulators
A linear regulator which is one of the integrated circuits (IC) operates normally in the condition that the input voltage is
higher than the output voltage. However, it is possible to happen the abnormal situation in specific conditions which is
the output voltage becomes higher than the input voltage. A reverse polarity connection between the input and the output
might be occurred or a certain inductor component can also cause a polarity reverse conditions. If the countermeasure
is not implemented, it may cause damage to the IC. In this case, use a capacitor with a capacitance with less than 1000
μF, to reduce damage to internal circuits or elements. The following shows some helpful tips to protect ICs from the
reverse voltage occasion.
Protection against Reverse Input/Output Voltage
In the case that MOSFET is used for the pass transistor, a parasitic body diode between the drain-source generally
exists. If the output voltage becomes higher than the input voltage and if its voltage difference exceeds VF of the body
diode, a reverse current flows from the output to the input through the body diode as shown in Figure 46. The current
flows in the parasitic body diode is not limited in the protection circuit because it is the parasitic element, therefore
too much reverse current may cause damage to degrade or destroy the semiconductor elements of the regulator.
IR
VOUT
VCC
Error
AMP.
VREF
Figure 46. Reverse Current Path in a MOS Linear Regulator
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BD4xxS2-C Series
Protection against Reverse Input/Output Voltage – continued
An effective solution for this problem is to implement an external bypass diode in order to prevent the reverse current
flow inside the IC as shown in Figure 47. Especially in applications where the output voltage setting is high and a
large output capacitor is connected, be sure to consider countermeasures for large reverse current values. Note that
the bypass diode must be turned on prior to the internal body diode of the IC. This external bypass diode should be
chosen as being lower forward voltage VF than the internal body diode. It should to be selected a diode which has a
rated reverse voltage greater than the IC’s input maximum rating voltage and also which has a rated forward current
greater than the anticipated reverse current in the actual application.
D1
VCC
VOUT
GND
VCC
VOUT
COUT
CIN
Figure 47. Bypass Diode for Reverse Current Diversion
A Schottky barrier diode which has a characteristic of low forward voltage (VF) can meet to the requirement for the
external diode to protect the IC from the reverse current. However, it also has a characteristic that the leakage (IR)
caused by the reverse voltage is bigger than other diodes. Therefore, it should be taken into the consideration to
choose it because if IR is large, it may cause increase of the current consumption, or raise of the output voltage in the
light-load current condition. IR characteristic of Schottky diode has positive temperature characteristic, which the
details shall be checked with the datasheet of the products, and the careful confirmation of behavior in the actual
application is mandatory.
Even in the condition when the input/output voltage is inverted, if the VCC pin is open as shown in Figure 48, or if the
VIN pin becomes high-impedance condition as designed in the system, it cannot damage or degrade the parasitic
element. It's because a reverse current via the pass transistor becomes extremely low. In this case, therefore, the
protection external diode is not necessary.
ON→OFF
IBIAS
VCC
VOUT
GND
VCC
VOUT
COUT
CIN
Figure 48. Open VIN
Protection against Input Reverse Voltage
When the input of the IC is connected to the power supply, accidentally if plus and minus are routed in reverse, or if
there is a possibility that the input may become lower than the GND pin, it may cause to destroy the IC because a
large current passes via the internal electrostatic breakdown prevention diode between the input pin and the GND
pin inside the IC as shown in Figure 49.
The simplest solution to avoid this problem is to connect a Schottky barrier diode or a rectifier diode in series to the
power supply line as shown in Figure 50. However, it causes the voltage drop by a forward voltage VF at the supply
voltage while normal operation.
Generally, since the Schottky barrier diode has lower VF, so it contributes to rather smaller power loss than rectifier
diodes. If IC has load currents, the required input current to the IC is also bigger. In this case, this external diode
generates heat more, therefore select a diode with enough margin in power dissipation. On the other hand, a reverse
current passes this diode in the reverse connection condition, however, it is negligible because its small amount.
VCC
VOUT
COUT
GND
VCC
VOUT
D1
-
VCC
VOUT
GND
VOUT
COUT
VCC
CIN
GND
CIN
+
GND
Figure 50. Protection against Reverse Polarity 1
Figure 49. Current Path in Reverse Input Connection
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BD4xxS2-C Series
Protection against Input Reverse Voltage – continued
Figure 51 shows a circuit in which a P-channel MOSFET is connected in series to the power. The body diode (parasitic
element) is located in the drain-source junction area of the MOSFET. The drop voltage in a forward connection is
calculated from the on state resistance of the MOSFET and the output current IO. It is smaller than the drop voltage
by the diode as shown in Figure 50 and results in less of a power loss. No current flows in a reverse connection where
the MOSFET remains off in Figure 51.
If the gate-source voltage exceeds maximum rating of MOSFET gate-source junction with derating curve in
consideration, reduce the gate-source junction voltage by connecting resistor voltage divider as shown in Figure 52.
Q1
VCC
Q1
VOUT
VCC
VOUT
GND
VCC
VCC
VOUT
GND
VOUT
COUT
R1
CIN
R2
CIN
COUT
Figure 51. Protection against Reverse Polarity 2
Figure 52. Protection against Reverse Polarity 3
Protection against Reverse Output Voltage when Output Connect to an Inductor
If the output load is inductive, electrical energy accumulated in the inductive load is released to the ground at the
moment that the output voltage is turned off. IC integrates ESD protection diodes between the IC output and ground
pins. A large current may flow in such condition finally resulting on destruction of the IC. To prevent this situation,
connect a Schottky barrier diode in parallel to the integrated diodes as shown in Figure 53.
Further, if a long wire is in use for the connection between the output pin of the IC and the load, confirm that the
negative voltage is not generated at the VOUT pin when the output voltage is turned off by observation of the
waveform on an oscilloscope, since it is possible that the load becomes inductive. An additional diode is required for
a motor load that is affected by its counter electromotive force, as it produces an electrical current in a similar way.
VCC
VOUT
VCC
VOUT
GND
D1
CIN
XLL
COUT
GND
GND
Figure 53. Current Path in Inductive Load (Output: Off)
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BD4xxS2-C Series
Power Dissipation
■HTSOP-J8
5
IC mounted on ROHM standard board based on JEDEC.
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.6 mmt
(with thermal via on the board)
Mount condition: PCB and exposed pad are soldered.
Top copper foil: The footprint ROHM recommend.
+ wiring to measure.
4
(2) 2.9 W
3
Board (1): 1-layer PCB
2
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
Board (2): 4-layer PCB
(1) 0.75 W
1
(2 inner layers and Copper foil area on the reverse side of PCB:
74.2mm x 74.2 mm)
Condition (1): θja = 166.7 °C/W, θjc (top) = 45 °C/W
0
Condition (2): θja = 43.1 °C/W, θjc (top) = 16 °C/W, θjc (bottom) = 10 °C/W
0
25
50
75
100
125
150
AmbientTemperature:Ta [˚С]
Figure 54. Package Data
(HTSOP-J8)
■SOT223-4
5
4
3
IC mounted on ROHM standard board based on JEDEC.
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.6 mmt
(with thermal via on the board)
Mount condition: PCB and exposed pad are soldered.
Top copper foil: The footprint ROHM recommend.
+ wiring to measure.
(2) 1.9 W
Board (1): 1-layer PCB
2
1
0
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
Board (2): 4-layer PCB
(2 inner layers and Copper foil area on the reverse side of PCB:
74.2mm x 74.2 mm)
(1) 0.6 W
Condition (1): θja = 208.3 °C/W, θjc (top) = 52 °C/W
Condition (2): θja = 83.3 °C/W, θjc (top) = 36 °C/W, θjc (bottom) = 17 °C/W
0
25
50
75
100
125
150
Ambient Temperature: Ta [°C]
Figure 55. Package Data
(SOT223-4)
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BD4xxS2-C Series
Power Dissipation – continued
Refer to the heat mitigation characteristics illustrated in Figure 54, 55 when using the IC in an environment of Ta ≥ 25 °C.
The characteristics of the IC are greatly influenced by the operating temperature, and it is necessary to operate
under the maximum junction temperature Tjmax.
Even if the ambient temperature Ta is at 25 °C it is possible that the junction temperature Tj reaches high temperatures.
Therefore, the IC should be operated within the power dissipation range.
The following method is used to calculate the power consumption Pc (W)
(
)
푃퐶 = 푉ꢀꢀ − 푉푂푈푇 × 퐼푂푈푇 + 푉ꢀꢀ × 퐼퐶퐶 [W]
VCC : Input Voltage
VOUT : Output Voltage
IOUT : Load Current
Power dissipation 푃푑 ≥ 푃퐶
The load current IOUT is obtained by operating the IC within the power dissipation range.
Icc
: Circuit Current
Pc : Power Consumption
ꢁ
ꢃ ꢄ퐶퐶 × ꢅ
ꢆꢆ [A]
ꢂ
퐼푂푈푇 ≤
ꢄ퐶퐶 ꢃ ꢄꢇꢈꢉ
(Refer to Figure 13, 31 for the Icc.)
Thus, the maximum load current IOUTmax for the applied voltage VCC can be calculated during the thermal design process.
The following method is also used to calculate the junction temperature Tj.
푇 = 푃퐶 × 휃 + 푇퐶 [°C]
Ta : Ambient Temperature
Tc : Case Temperature
Tj : Junction Temperature
θjc : Thermal Resistance
(Junction to Case)
푗
푗푐
●HTSOP-J8
■Calculation Example 1) with Ta = 105 °C VCC = 13.5 V, VOUT = 5.0 V
1.06 푊 ꢃ 13.5 ꢄ × 45 휇퐴
퐼푂푈푇 ≤
8.5 ꢄ
IC stand alone θja = 43.1 °C/W → -23 mW/°C
25 °C = 2.9 W → 105 °C = 1.06 W
≤ ꢊ2ꢋ 푚ꢌ
(Icc = 45 µA)
At Ta = 105 °C with Figure 54 (2) condition, the calculation shows that 125 mA of output current is possible at 8.5 V potential
difference across input and output.
The thermal calculation shown above should be taken into consideration during the thermal design in order to keep the whole
operating temperature range within the power dissipation range.
In the event of shorting (i.e. VOUT and GND pins are shorted) the power consumption Pc of the IC can be calculated as
follows:
(
)
푃퐶 = 푉ꢀꢀ × 퐼퐶퐶 + 퐼푠ℎ표푟푡 [W]
(Refer to Figure 10, 28 for the Ishort.)
Ishort : Short Current
■Calculation Example 2) with Tc (bottom) = 80 °C, VCC = 13.5 V, VOUT = 5.0 V, IOUT = 80 mA
At Tc (bottom) = 80 °C with Figure 54 (2) condition, the power consumption Pc of the IC can be calculated as follows:
(
)
푃퐶 = 푉ꢀꢀ − 푉푂푈푇 × 퐼푂푈푇 + 푉ꢀꢀ × 퐼퐶퐶
(
)
= ꢊꢍ.ꢋ 푉 − ꢋ.ꢎ 푉 × ꢏꢎ 푚ꢌ + ꢊꢍ.ꢋ 푉 × ꢐꢋ ꢑꢌ
= ꢎ.ꢒꢏꢊ ꢓ
(Icc = 45 µA)
At the power consumption Pc is 0.681 W, the junction temperature Tj can be calculated as follows:
푇 = 푃퐶 × 휃 + 푇퐶
푗
푗푐
= ꢎ.ꢒꢏꢊ ꢓ × ꢊꢎ ℃/ꢓ + ꢏꢎ ℃
= ꢏꢒ.ꢏ ℃
(θjc (bottom) = 10 °C/W)
The junction temperature is 86.8 °C, at above condition.
The thermal calculation shown above should be taken into consideration during the thermal design in order to keep the whole
operating temperature range within Tj ≤ 150 °C.
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BD4xxS2-C Series
Power Dissipation – continued
●SOT223-4
■Calculation Example 1) with Ta = 105 °C VCC = 13.5 V, VOUT = 5.0 V
0.54 푊 ꢃ 13.5 ꢄ × 45 휇퐴
퐼푂푈푇 ≤
IC stand alone θja = 83.3 °C/W → -12 mW/°C
25 °C = 1.50 W → 105 °C = 0.54 W
8.5 ꢄ
≤ ꢒꢍ 푚ꢌ
(Icc = 45 µA)
At Ta = 105°C with Figure 55 (2) condition, the calculation shows that 63 mA of output current is possible at 8.5 V potential
difference across input and output.
The thermal calculation shown above should be taken into consideration during the thermal design in order to keep the whole
operating temperature range within the power dissipation range.
In the event of shorting (i.e. VOUT and GND pins are shorted) the power consumption Pc of the IC can be calculated as
follows:
(
)
푃퐶 = 푉ꢀꢀ × 퐼퐶퐶 + 퐼푠ℎ표푟푡 [W]
(Refer to Figure 10, 28 for the Ishort)
■Calculation Example 2) with Tc (bottom) = 92 °C, VCC = 13.5 V, VOUT = 5.0 V, IOUT = 80 mA
At Tc (bottom) = 92 °C with Figure 55 (2) condition, the power consumption Pc of the IC can be calculated as follows:
(
)
푃퐶 = 푉ꢀꢀ − 푉푂푈푇 × 퐼푂푈푇 + 푉ꢀꢀ × 퐼퐶퐶
(
)
= ꢊꢍ.ꢋ 푉 − ꢋ.ꢎ 푉 × ꢏꢎ 푚ꢌ + ꢊꢍ.ꢋ 푉 × ꢐꢋ ꢑꢌ
= ꢎ.ꢒꢏꢊ ꢓ
(Icc = 45 µA)
At the power consumption Pc is 0.681 W, the junction temperature Tj can be calculated as follows:
푇 = 푃퐶 × 휃 + 푇퐶
푗
푗푐
= ꢎ.ꢒꢏꢊ ꢓ × ꢊ7 ℃/ꢓ + 92 ℃
= ꢊꢎꢍ.ꢒ ℃
(θjc (bottom) = 17 °C/W)
The junction temperature is 103.6 °C, at above condition.
The thermal calculation shown above should be taken into consideration during the thermal design in order to keep the whole
operating temperature range within Tj ≤ 150 °C.
I/O Equivalence Circuit
VCC
(Applicable for product with Enable Input)
4 MΩ (Typ)
CTL
360 kΩ (Typ)
VOUT
1545 kΩ (Typ / 5.0 V Output)
185 kΩ (Typ)
840 kΩ (Typ / 3.3 V Output)
70 kΩ (Typ)
530 kΩ (Typ)
Figure 56. Input / Output Equivalence Circuit
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BD4xxS2-C Series
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the operating conditions. The
characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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BD4xxS2-C Series
Operational Notes – continued
9. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 57. Example of Monolithic IC Structure
10. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
11. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
12. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
13. Thermal Consideration
The power dissipation under actual operating conditions should be taken into consideration and a sufficient margin
should be allowed in the thermal design. On the reverse side of the package this product has an exposed heat pad for
improving the heat dissipation. The amount of heat generation depends on the voltage difference between the input
and output, load current, and bias current. Therefore, when actually using the chip, ensure that the generated heat
does not exceed the Pd rating. If Junction temperature is over Tjmax (= 150 °C), IC characteristics may be worse due
to rising chip temperature. Heat resistance in specification is measurement under PCB condition and environment
recommended in JEDEC. Ensure that heat resistance in specification is different from actual environment.
14. CTL Pin
The CTL pin is for controlling ON/OFF the output voltage. Do not make voltage level of chip enable keep floating level,
or between VthH and VthL. Otherwise, the output voltage would be unstable or indefinite.
15. Functional Safety
“ISO 26262 Process Compliant to Support ASIL-*”
A product that has been developed based on an ISO 26262 design process compliant to the ASIL level described in
the datasheet.
“Safety Mechanism is Implemented to Support Functional Safety (ASIL-*)”
A product that has implemented safety mechanism to meet ASIL level requirements described in the datasheet.
“Functional Safety Supportive Automotive Products”
A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the
functional safety.
Note: “ASIL-*” is stands for the ratings of “ASIL-A”, “-B”, “-C” or “-D” specified by each product's datasheet.
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BD4xxS2-C Series
Physical Dimension and Packing Information (HTSOP-J8)
Package Name
HTSOP-J8
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BD4xxS2-C Series
Physical Dimension and Packing Information (SOT223-4)
Package Name
SOT223-4
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BD4xxS2-C Series
Marking Diagrams (Top View)
HTSOP-J8 (Top View)
Part Number Marking
LOT Number
1PIN Mark
Enable
Part Number
Marking
Output
Voltage [V]
Orderable Part Number
Input(Note 1)
BD433S2WEFJ-CE2
BD450S2WEFJ-CE2
BD433S2EFJ-CE2
BD450S2EFJ-CE2
433S2W
450S2W
433S2
3.3
5.0
3.3
5.0
○
○
－
－
450S2
SOT223-4 (Top View)
Part Number Marking
LOT Number
1PIN
Part Number
Marking
Output
Voltage [V]
Enable
Orderable Part Number
Input(Note 1)
BD433S2WFP3-CE2
BD450S2WFP3-CE2
BD433S2FP3-CE2
BD450S2FP3-CE2
433S2W
450S2W
433S2
3.3
5.0
3.3
5.0
○
○
－
－
450S2
(Note 1) ○: Includes Enable Input
－: Not includes Enable Input
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BD4xxS2-C Series
Revision History
Date
Revision
001
Changes
09.Sep.2022
New Release
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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