BD433S5WEFJ-C (新产品) [ROHM]
BD433S5WEFJ-C is low quiescent regulators featuring 45V absolute maximum voltage, and output voltage accuracy of ±2% (3.3V or 5V: Typ), 500mA output current and 38µA (Typ) current consumption. This regulator is therefore ideal for applications requiring a direct connection to the battery and a low current consumption. A logical “HIGH” at the CTL enables the device and “LOW” at the CTL disables the device. Ceramic capacitors can be used for compensation of the output capacitor phase. Furthermore, this IC also feature overcurrent protection to protect the device from damage caused by short-circuiting and an integrated thermal shutdown to protect the device from overheating at overload conditions.;
| 型号： | BD433S5WEFJ-C (新产品) |
| 厂家： | 
ROHM |
| 描述： | BD433S5WEFJ-C is low quiescent regulators featuring 45V absolute maximum voltage, and output voltage accuracy of ±2% (3.3V or 5V: Typ), 500mA output current and 38µA (Typ) current consumption. This regulator is therefore ideal for applications requiring a direct connection to the battery and a low current consumption. A logical “HIGH” at the CTL enables the device and “LOW” at the CTL disables the device. Ceramic capacitors can be used for compensation of the output capacitor phase. Furthermore, this IC also feature overcurrent protection to protect the device from damage caused by short-circuiting and an integrated thermal shutdown to protect the device from overheating at overload conditions. |
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| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
For Automotive 45 V Input
500 mA Fixed Output LDO Regulators
BD4xxS5-C Series
General Description
Features
◼ Qualified for Automotive Applications
The BD4xxS5-C series are low quiescent regulators
featuring 45 V absolute maximum voltage, and output
voltage accuracy of ±2 % (3.3 V or 5 V: Typ), 500 mA
output current and 38 μA (Typ) current consumption.
These regulators are therefore ideal for applications
requiring a direct connection to the battery and a low
current consumption.
◼ Wide Temperature Range (Tj):
◼ Wide Operating Input Range:
◼ Low Quiescent Current:
◼ Output Current:
-40 °C to +150 °C
3.0 V to 42 V
38 μA (Typ)
500 mA
◼ High Output Voltage Accuracy:
◼ Output Voltage:
±2 %
3.3 V or 5.0 V (Typ)
A logical “HIGH” at the CTL enables the device and “LOW”
at the CTL disables the device.
(Only W: Includes Enable Input).
Ceramic capacitors can be used for compensation of the
output capacitor phase. Furthermore, these ICs also
feature overcurrent protection to protect the device from
damage caused by short-circuiting and an integrated
thermal shutdown to protect the device from overheating
at overload conditions.
◼ Enable Input (Only W: Includes Enable Input)
◼ Overload Current Protection (OCP)
◼ Thermal Shutdown Protection (TSD)
◼ AEC-Q100 Qualified(Note 1)
◼ Functional Safety Supportive Automotive Products
(Note 1): Grade 1
Packages
■ FP2: TO263-3
W (Typ) x D (Typ) x H (Max)
10.16 mm × 15.10 mm × 4.70 mm
■ FP2: TO263-5
10.16 mm × 15.10 mm × 4.70 mm
■ EFJ: HTSOP-J8
4.9 mm × 6.0 mm × 1.0 mm
Figure 1. Package Outlook
Applications
◼ Body
◼ Audio System
◼ Navigation System, etc.
Typical Application Circuits
■Components Externally Connected: 0.1 µF ≤ CIN, 10 µF ≤ COUT (Typ)
* Electrolytic, tantalum and ceramic capacitors can be used.
Input
Voltage
Output
Voltage
Input
Voltage
VOUT
Output
Voltage
VCC
CTL
VCC
VOUT
COUT
COUT
CIN
CIN
GND
GND
Enable
Voltage
For product without Enable input
For product with Enable input
Figure 2. Typical Application Circuits
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
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BD4xxS5-C Series
Ordering Information
B D 4 x x S 5 W x
x
x
-
C E 2
Part
Number
Output Voltage
33: 3.3 V
50: 5.0 V
Output
Current
5: 500 mA
Enable Input
W: Includes
Enable
Package
Product Rank
C: for Automotive
Packaging and Forming
Specification
EFJ: HTSOP-J8
FP2:TO263-3
TO263-5
Input
None:
E2: Embossed Tape and Reel
Without Enable
Input
Lineup
Output Current
Ability
Output Voltage
(Typ)
Enable
Input(Note 1)
Package Type
TO263-5
Orderable Part Number
BD433S5WFP2-CE2
BD433S5WEFJ-CE2
BD433S5FP2-CE2
BD433S5EFJ-CE2
BD450S5WFP2-CE2
BD450S5WEFJ-CE2
BD450S5FP2-CE2
BD450S5EFJ-CE2
○
HTSOP-J8
TO263-3
3.3 V
－
○
－
HTSOP-J8
TO263-5
500 mA
HTSOP-J8
TO263-3
5.0 V
HTSOP-J8
(Note 1) ○: Includes Enable Input
–: Not includes Enable Input
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BD4xxS5-C Series
Pin Configurations
TO263-3
(Top View)
HTSOP-J8
(Top View)
TO263-5
(Top View)
4 (FIN)
FIN
6 (FIN)
FIN
1
2
3
1 2 3 4 5
Figure 3. Pin Configurations
Pin Descriptions
■BD433S5FP2-C / BD450S5FP2-C
■BD433S5WFP2-C / BD450S5WFP2-C
Pin No.
Pin Name
VCC
Pin Function
Pin No.
Pin Name
VCC
Pin Function
Supply voltage input pin
Output control pin
Ground pin
1
Supply voltage input pin
Ground pin
1
2
3
GND
2
CTL
VOUT
GND
Output pin
3
GND
4 (FIN)
Ground pin
4
5
N.C.
Not connected
Ground pin
VOUT
GND
6 (FIN)
Ground pin
■BD433S5EFJ-C / BD450S5EFJ-C
■BD433S5WEFJ-C / BD450S5WEFJ-C
Pin No.
Pin Name
VOUT
N.C.
Pin Function
Output pin
Pin No.
Pin Name
VOUT
N.C.
Pin Function
Output pin
1
2
3
4
5
6
7
8
-
1
2
3
4
5
6
7
8
-
Not connected
Not connected
Not connected
Ground pin
Not connected
Not connected
Not connected
Ground pin
N.C.
N.C.
N.C.
N.C.
GND
GND
N.C.
Not connected
Not connected
Supply voltage input pin
Heat dissipation
N.C.
Not connected
Output control pin
Supply voltage input pin
Heat dissipation
N.C.
CTL
VCC
VCC
EXP-PAD
EXP-PAD
* N.C. Pin is recommended to short with GND.
* N.C. Pin can be open because it isn’t connected it inside of IC.
* EXP-PAD on the back side is connected to the IC substrate, so it should connect to external ground node.
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BD4xxS5-C Series
Block Diagrams
■ BD4xxS5FP2-C
GND (FIN)
VREF
PREREG
DRIVER
OCP
TSD
VCC (Pin 1)
GND (Pin 2)
VOUT (Pin 3)
■ BD4xxS5WFP2-C
GND (FIN)
CTL
VREF
PREREG
DRIVER
OCP
TSD
VCC (Pin 1)
CTL (Pin 2)
GND (Pin 3)
N.C. (Pin 4)
VOUT (Pin 5)
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BD4xxS5-C Series
Block Diagrams – continued
■ BD4xxS5EFJ-C
VCC (Pin 8)
N.C. (Pin 7)
N.C. (Pin 6)
GND (Pin 5)
VREF
PREREG
DRIVER
OCP
TSD
VOUT (Pin 1)
N.C. (Pin 2)
N.C. (Pin 3)
N.C. (Pin 4)
■ BD4xxS5WEFJ-C
VCC (Pin 8)
CTL (Pin 7)
N.C. (Pin 6)
GND (Pin 5)
CTL
VREF
PREREG
DRIVER
OCP
TSD
VOUT (Pin 1)
N.C. (Pin 2)
N.C. (Pin 3)
N.C. (Pin 4)
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BD4xxS5-C Series
Description of Blocks
Block Name
Function
Description of Blocks
A logical “HIGH” ( ≥ 2.8 V ) at the CTL enables the device
and “LOW” ( ≤ 0.8 V ) at the CTL disable the device.
CTL(Note 1)
PREREG
TSD
Control Output Voltage ON/OFF
Internal Power Supply
Thermal Shutdown Protection
Reference Voltage
Power Supply for Internal Circuit
To protect the device from overheating.
If the chip temperature ( Tj ) reaches ca. 175 °C ( Typ ),
the output is turned off.
VREF
Generate the Reference Voltage
Drive the Output MOS FET
DRIVER
OCP
Output MOS FET Driver
Over Current Protection
To protect the device from damage caused by over current.
If the output current reaches ca. 900 mA ( Typ ),
the output is turned off.
(Note 1) Applicable for product with Enable Input.
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BD4xxS5-C Series
Absolute Maximum Ratings
Parameter
Symbol
VCC
Ratings
-0.3 to +45.0
-0.3 to +45.0
-0.3 to +8.0
-40 to +150
-55 to +150
+150
Unit
V
Supply Voltage(Note 1)
Output Control Voltage(Note 2)
Output Voltage
CTL
V
VOUT
Tj
V
Junction Temperature Range
Storage Temperature Range
Maximum Junction Temperature
ESD withstand Voltage (HBM)(Note 3)
°C
°C
°C
V
Tstg
Tjmax
VESD, HBM
±2000
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance and power dissipation taken into
consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) Do not exceed Pd.
(Note 2) Applicable for product with Enable Input.
The start-up orders of power supply (VCC) and the CTL pin do not influence if the voltage is within the operation power supply voltage range.
(Note 3)
ESD susceptibility Human Body Model “HBM”.
Operating Conditions (-40 °C ≤ Tj ≤ +150 °C)
Parameter
Supply Voltage ( IOUT ≤ 500 mA ) (Note 1)
Supply Voltage ( IOUT ≤ 250 mA ) (Note 1)
Supply Voltage ( IOUT ≤ 500 mA ) (Note 2)
Supply Voltage ( IOUT ≤ 250 mA ) (Note 2)
Output Control Voltage(Note 3)
Symbol
VCC
VCC
VCC
VCC
CTL
Min
5.9
5.5
4.6
4.0
0
Max
42.0
42.0
42.0
42.0
42.0
–
Unit
V
V
V
V
V
Start-Up Voltage(Note 4)
VCC
IOUT
Tj
3.0
0
V
Output Current
500
+150
mA
°C
Junction Temperature Range
-40
(Note 1)
For 5.0 V Output products (BD450S5FP2-C, BD450S5WFP2-C, BD450S5EFJ-C, BD450S5WEFJ-C)
(Note 2)
For 3.3 V Output products (BD433S5FP2-C, BD433S5WFP2-C, BD433S5EFJ-C, BD433S5WEFJ-C)
(Note 3) Applicable for product with Enable Input.
(Note 4) When IOUT = 0 mA
Notice: Please consider that the output voltage would be dropped (Dropout voltage) according to the output current.
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BD4xxS5-C Series
Thermal Impedance (Note 1)
Parameter
Symbol
Typ
Unit
Conditions
TO263-5 / TO263-3
Junction to Ambient
(Note 2)
81
21
8
°C/W
°C/W
°C/W
°C/W
1s
θJA
(Note 3)
2s2p
(Note 2)
1s
Junction to Top Center of Case(Note 4)
HTSOP-J8
ΨJT
(Note 3)
2
2s2p
(Note 2)
126
27
9
°C/W
°C/W
°C/W
°C/W
1s
Junction to Ambient
θJA
(Note 3)
2s2p
(Note 2)
1s
Junction to Top Center of Case(Note 4)
ΨJT
(Note 3)
2
2s2p
(Note 1)
(Note 2)
The thermal impedance is based on JESD51 - 2A (Still-Air) standard.
JESD51 - 3 standard FR4 114.3 mm × 76.2 mm × 1.57 mm 1-layer (1s)
(Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper.)
(Note 3)
(Note 4)
JESD51 -5 / -7 standard FR4 114.3 mm × 76.2 mm × 1.60 mm 4-layer（2s2p）
(Top copper foil: ROHM recommended footprint + wiring to measure / 2 inner layers copper foil area of PCB: 74.2 mm × 74.2 mm,
copper (top & reverse side / inner layers) 2oz. / 1oz.)
TT : Top center of case’s (mold) temperature
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BD4xxS5-C Series
Electrical Characteristics
Unless otherwise specified, -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5 V (Note 1, IOUT = 0 mA
The typical value is defined at Tj = 25 °C.
Limit
Parameter
Symbol
Unit
Conditions
Min
–
Typ
Max
5.0
CTL = 0 V
Shutdown Current
Ishut(Note 1)
2.0
μA
μA
μA
V
Tj ≤ 125 °C
IOUT = 0 mA
Tj ≤ 125 °C
–
38
38
95
Circuit Current
Output Voltage
Dropout Voltage
Icc
IOUT ≤ 500 mA
Tj ≤ 150 °C
–
175
5.10
5.10
6 V ≤ VCC ≤ 42 V,
0 mA ≤ IOUT ≤ 400 mA
4.90
4.80
5.00
5.00
VOUT(Note 2)
6 V ≤ VCC ≤ 42V
0 mA ≤ IOUT ≤ 500 mA
V
6 V ≤ VCC ≤ 42 V
3.23
3.20
–
3.30
3.30
0.20
0.25
60
3.37
3.37
0.50
0.75
–
V
V
0 mA ≤ IOUT ≤ 400 mA
VOUT(Note 3)
6 V ≤ VCC ≤ 42 V
0 mA ≤ IOUT ≤ 500 mA
VCC = VOUT × 0.95 (Typ 4.75 V)
IOUT = 300 mA
ΔVd(Note 2)
ΔVd(Note 3)
R.R.
V
VCC = VOUT × 0.95 (Typ 3.135 V)
IOUT = 300 mA
–
V
f = 120 Hz, ein = 1 Vrms
IOUT = 100 mA
Ripple Rejection
Line Regulation
Load Regulation
Thermal Shutdown
55
–
dB
mV
mV
°C
Reg.I
10
30
8 V ≤ VCC ≤ 16 V
10 mA ≤ IOUT ≤ 400 mA
Tj at TSD ON
Reg.L
–
10
30
TSD
–
175
–
(Note 1) Applicable for product with Enable Input.
(Note 2)
(Note 3)
For 5.0 V Output products (BD450S5FP2-C, BD450S5WFP2-C, BD450S5EFJ-C, BD450S5WEFJ-C)
For 3.3 V Output products (BD433S5FP2-C, BD433S5WFP2-C, BD433S5EFJ-C, BD433S5WEFJ-C)
Electrical Characteristics ( Enable function * Applicable for product with Enable Input. )
Unless otherwise specified, -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, IOUT = 0 mA. The typical value is defined at Tj = 25 °C.
Limit
Parameter
Symbol
Unit
Conditions
Min
2.8
Typ
–
Max
–
CTL ON Mode Voltage
CTL OFF Mode Voltage
CTL Bias Current
VthH
VthL
ICTL
V
V
Active Mode
Off Mode
–
–
–
0.8
30
15
µA
CTL = 5 V
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BD4xxS5-C Series
Typical Performance Curves (Reference Data)
■For 3.3 V Output products
■Applicable Models:BD433S5FP2-C, BD433S5WFP2-C, BD433S5EFJ-C, BD433S5WEFJ-C
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5 V(Note 1), IOUT = 0 mA.
(Note 1) Applicable for product with Enable Input.
100
90
80
70
60
50
40
30
20
10
0
6
5
4
3
2
1
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
5
10 15 20 25 30 35 40 45
Supply Voltage:VCC [V]
0
5
10 15 20 25 30 35 40 45
Supply Voltage:VCC [V]
Figure 5. Output Voltage vs Power Supply Voltage
(IOUT = 0 mA)
Figure 4. Circuit Current vs Power Supply Voltage
100
90
80
70
60
50
40
30
20
10
0
6
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
5
4
3
2
1
0
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
Supply Voltage:VCC [V]
Supply Voltage:VCC [V]
Figure 7. Output Voltage vs Power Supply Voltage
(IOUT = 0 mA) - Magnified Figure 5.
Figure 6. Circuit Current vs Power Supply Voltage
- Magnified Figure 4.
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BD4xxS5-C Series
Typical Performance Curves (Reference Data) – continued
■For 3.3 V Output products
■Applicable Models:BD433S5FP2-C, BD433S5WFP2-C, BD433S5EFJ-C, BD433S5WEFJ-C
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5 V(Note 1), IOUT = 0 mA.
(Note 1) Applicable for product with Enable Input.
6
5
4
3
2
1
0
6
5
4
3
2
1
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
5
10 15 20 25 30 35 40 45
Supply Voltage:VCC [V]
0
100 200 300 400 500 600 700 800 900 1000
Output Current: IOUT [mA]
Figure 8. Output Voltage vs Power Supply Voltage
(IOUT = 10 mA)
Figure 9. Output Voltage vs Output Current
(Over Current Protection)
90
80
70
60
50
40
30
20
10
0
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0.01
0.1
1
10
100
0
50 100 150 200 250 300 350 400 450 500
Output Current: IOUT [mA]
Frequency:f [kHz]
Figure 10. Dropout Voltage
(VCC = 3.135 V)
Figure 11. Ripple Rejection
(ein = 1 Vrms, IOUT = 100 mA)
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BD4xxS5-C Series
Typical Performance Curves (Reference Data) – continued
■For 3.3 V Output products
■Applicable Models:BD433S5FP2-C, BD433S5WFP2-C, BD433S5EFJ-C, BD433S5WEFJ-C
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5 V(Note 1), IOUT = 0 mA.
(Note 1) Applicable for product with Enable Input.
6
5
4
3
2
1
0
90
80
70
60
50
40
30
20
10
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
100
120
140
160
180
200
0
100
200
300
400
500
Junction Temperature:Tj [°C]
Output Current: IOUT [mA]
Figure 12. Circuit Current vs Output Current
Figure 13. Output Voltage vs Temperature
(Thermal Shutdown)
3.370
3.350
3.330
3.310
3.290
3.270
3.250
3.230
100
90
80
70
60
50
40
30
20
10
0
-40 -20
0
20 40 60 80 100 120 140 160
-40
0
40
80
120
160
Junction Temperature:Tj [°C]
Junction Temperature:Tj [°C]
Figure 14. Output Voltage vs Temperature
Figure 15. Circuit Current vs Temperature
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BD4xxS5-C Series
Typical Performance Curves (Reference Data) – continued
■For 3.3 V Output with Enable input products
■Applicable Model:BD433S5WFP2-C, BD433S5WEFJ-C
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, IOUT = 0 mA
10
9
8
7
6
5
4
3
2
1
0
6
5
4
3
2
1
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
4
0
1
2
3
5
0
5
10 15 20 25 30 35 40 45
Supply Voltage: VCC [V]
CTL Supply Voltage:CTL [V]
Figure 16. Shutdown Current vs Power Supply Voltage
(CTL = 0 V)
Figure 17. CTL ON / OFF Mode Voltage
(Tj = -40 °C)
6
5
4
3
2
1
6
5
4
3
2
1
0
Tj = 25 °C
Tj = 125 °C
0
0
1
2
3
4
5
0
1
2
3
4
5
CTL Supply Voltage:CTL [V]
CTL Supply Voltage:CTL [V]
Figure 18. CTL ON / OFF Mode Voltage
(Tj = 25 °C)
Figure 19. CTL ON / OFF Mode Voltage
(Tj = 125 °C)
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BD4xxS5-C Series
Typical Performance Curves (Reference Data) – continued
■For 3.3 V Output with Enable input products
■Applicable Model:BD433S5WFP2-C, BD433S5WEFJ-C
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, IOUT = 0 mA
5
4
3
2
1
0
20
15
10
5
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
-40
0
40
80
120
160
0
1
2
3
4
5
Junction Temperature:Tj [°C]
CTL SupplyVoltage:CTL [V]
Figure 20. Shutdown Current
(CTL = 0 V)
Figure 21. CTL Bias Current vs CTL Supply Voltage
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BD4xxS5-C Series
Typical Performance Curves (Reference Data) – continued
■For 5.0 V Output products
■Applicable Models:BD450S5FP2-C, BD450S5WFP2-C, BD450S5EFJ-C, BD450S5WEFJ-C
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5 V(Note 1), IOUT = 0 mA.
(Note 1) Applicable for product with Enable Input
100
90
80
70
60
50
40
30
20
10
0
6
5
4
3
2
1
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
5
10 15 20 25 30 35 40 45
Supply Voltage:VCC [V]
0
5
10 15 20 25 30 35 40 45
Supply Voltage:VCC [V]
Figure 22. Circuit Current vs Power Supply Voltage
Figure 23. Output Voltage vs Power Supply Voltage
(IOUT = 0 mA)
100
90
80
70
60
50
40
30
20
10
0
6
5
4
3
2
1
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
Supply Voltage:VCC [V]
Supply Voltage:VCC [V]
Figure 24. Circuit Current vs Power Supply Voltage
- Magnified Figure 22.
Figure 25. Output Voltage vs Power Supply Voltage
(IOUT = 0 mA) - Magnified Figure 23.
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BD4xxS5-C Series
Typical Performance Curves (Reference Data) – continued
■For 5.0 V Output products
■Applicable Models:BD450S5FP2-C, BD450S5WFP2-C, BD450S5EFJ-C, BD450S5WEFJ-C
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5 V(Note 1), IOUT = 0 mA.
(Note 1) Applicable for product with Enable Input
6
5
4
3
2
1
0
6
5
4
3
2
1
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
100 200 300 400 500 600 700 800 900 1000
Output Current: IOUT [mA]
0
5
10 15 20 25 30 35 40 45
Supply Voltage:VCC [V]
Figure 27. Output Voltage vs Output Current
(Over Current Protection)
Figure 26. Output Voltage vs Power Supply Voltage
(IOUT = 10 mA)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
90
80
70
60
50
40
30
20
10
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
50 100 150 200 250 300 350 400 450 500
Output Current: IOUT [mA]
0.01
0.1
1
10
100
Frequency:f [kHz]
Figure 28. Dropout Voltage
(VCC = 4.75 V)
Figure 29. Ripple Rejection
(ein = 1 Vrms, IOUT = 100 mA)
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BD4xxS5-C Series
Typical Performance Curves (Reference Data) – continued
■For 5.0 V Output products
■Applicable Models:BD450S5FP2-C, BD450S5WFP2-C, BD450S5EFJ-C, BD450S5WEFJ-C
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5 V(Note 1), IOUT = 0 mA.
(Note 1) Applicable for product with Enable Input
90
80
70
60
50
40
30
20
10
0
6
5
4
3
2
1
0
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
100
200
300
400
500
100
120
140
160
180
200
Output Current: IOUT [mA]
Junction Temperature:Tj [°C]
Figure 31. Output Voltage vs Temperature
(Thermal Shutdown)
Figure 30. Circuit Current vs Output Current
5.100
5.080
5.060
5.040
5.020
5.000
4.980
4.960
4.940
4.920
4.900
100
90
80
70
60
50
40
30
20
10
0
-40 -20
0
20 40 60 80 100 120 140 160
-40
0
40
80
120
160
Junction Temperature:Tj [°C]
Junction Temperature:Tj [°C]
Figure 32. Output Voltage vs Temperature
Figure 33. Circuit Current vs Temperature
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BD4xxS5-C Series
Typical Performance Curves (Reference Data) – continued
■For 5.0 V Output with Enable input products
■Applicable Model:BD450S5WFP2-C, BD450S5WEFJ-C
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, IOUT = 0 mA
10
6
Tj = -40 °C
9
Tj = 25 °C
5
8
7
Tj = 125 °C
4
6
5
4
3
2
1
0
3
2
1
0
Tj = -40 °C
4
0
5
10 15 20 25 30 35 40 45
Supply Voltage: VCC [V]
0
1
2
3
5
CTL Supply Voltage:CTL [V]
Figure 34. Shutdown Current vs Power Supply Voltage
(CTL = 0 V)
Figure 35. CTL ON / OFF Mode Voltage
(Tj = -40 °C)
6
5
4
3
2
1
0
6
5
4
3
2
1
0
Tj = 25 °C
Tj = 125 °C
0
1
2
3
4
5
0
1
2
3
4
5
CTL Supply Voltage:CTL [V]
CTL Supply Voltage:CTL [V]
Figure 36. CTL ON / OFF Mode Voltage
(Tj = 25 °C)
Figure 37. CTL ON / OFF Mode Voltage
(Tj = 125 °C)
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BD4xxS5-C Series
Typical Performance Curves (Reference Data) – continued
■For 5.0 V Output with Enable input products
■Applicable Model:BD450S5WFP2-C, BD450S5WEFJ-C
Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, IOUT = 0 mA
5
4
3
2
1
0
20
15
10
5
Tj = -40 °C
Tj = 25 °C
Tj = 125 °C
0
-40
0
40
80
120
160
0
1
2
3
4
5
Junction Temperature:Tj [°C]
CTL SupplyVoltage:CTL [V]
Figure 38. Shutdown Current vs Temperature
(CTL = 0 V)
Figure 39. CTL Bias Current vs CTL Supply Voltage
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BD4xxS5-C Series
Measurement Circuit for Typical Performance Curves (BD4xxS5FP2-C)
FIN
FIN
FIN
BD4xxS5FP2-C
BD4xxS5FP2-C
BD4xxS5FP2-C
1: VCC 2: GND 3: VOUT
1: VCC 2: GND 3: VOUT
1: VCC 2: GND 3: VOUT
4.7 µF
10 µF
4.7 µF
10 µF
IOUT
10 µF
4.7 µF
Measurement Setup for
Figure 5, 7, 13, 14,
Measurement Setup for
Figure 4, 6, 15,
Measurement Setup for
Figure 8, 26
Figure 23, 25, 31, 32
Figure 22, 24, 33
FIN
FIN
FIN
BD4xxS5FP2-C
BD4xxS5FP2-C
BD4xxS5FP2-C
1: VCC 2: GND 3: VOUT
1: VCC 2: GND 3: VOUT
1: VCC 2: GND 3: VOUT
1 Vrms
4.7 µF
10 µF
IOUT
4.7 µF
10 µF
10 µF
4.7 µF
IOUT
Measurement Setup for
Figure 10, 28
Measurement Setup for
Figure 9, 27
Measurement Setup for
Figure 11, 29
FIN
BD4xxS5FP2-C
1: VCC 2: GND 3: VOUT
4.7 µF
IOUT
10 µF
Measurement Setup for
Figure 12, 30
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BD4xxS5-C Series
Measurement Circuit for Typical Performance Curves (BD4xxS5WFP2-C) – continued
FIN
FIN
FIN
BD4xxS5WFP2-C
BD4xxS5WFP2-C
BD4xxS5WFP2-C
2: CTL
4: N.C.
2: CTL
4: N.C.
2: CTL
4: N.C.
1: VCC 3: GND 5: VOUT
1: VCC 3: GND 5: VOUT
1: VCC 3: GND 5: VOUT
4.7 µF
IOUT
4.7 µF
4.7 µF
10 µF
10 µF
10 µF
Measurement Setup for
Figure 5, 7, 13, 14,
Figure 23, 25, 31, 32
Measurement Setup for
Figure 4, 6, 15, 16, 20,
Figure 22, 24, 33, 34, 38
Measurement Setup for
Figure 8, 26
FIN
FIN
FIN
BD4xxS5WFP2-C
BD4xxS5WFP2-C
BD4xxS5WFP2-C
2: CTL
4: N.C.
2: CTL
4: N.C.
2: CTL
4: N.C.
1: VCC 3: GND 5: VOUT
1: VCC 3: GND 5: VOUT
1: VCC 3: GND 5: VOUT
1 Vrms
4.7 µF
10 µF
IOUT
4.7 µF
OUT
10 µF
4.7 µF
10 µF
Measurement Setup for
Figure 10, 28
Measurement Setup for
Figure 9, 27
Measurement Setup for
Figure 11, 29
FIN
FIN
FIN
BD4xxS5WFP2-C
BD4xxS5WFP2-C
BD4xxS5WFP2-C
2: CTL
4: N.C.
2: CTL
4: N.C.
2: CTL
4: N.C.
1: VCC 3: GND 5: VOUT
1: VCC 3: GND 5: VOUT
1: VCC 3: GND 5: VOUT
4.7 µF
10 µF
10 µF
4.7 µF
4.7 µF
10 µF
Measurement Setup for
Figure 12, 30
Measurement Setup for
Figure 21, 39
Measurement Setup for
Figure 17, 18, 19,
Figure 35, 36, 37
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BD4xxS5-C Series
Measurement Circuit for Typical Performance Curves (BD4xxS5EFJ-C) – continued
8: VCC 7: N.C. 6: N.C. 5: GND
BD4xxS5EFJ-C
8: VCC 7: N.C. 6: N.C. 5: GND
BD4xxS5EFJ-C
8: VCC 7: N.C. 6: N.C. 5: GND
BD4xxS5EFJ-C
4.7 µF
4.7 µF
4.7 µF
1: VOUT2: N.C. 3: N.C. 4: N.C.
1: VOUT2: N.C. 3: N.C. 4: N.C.
1: VOUT2: N.C. 3: N.C. 4: N.C.
10 µF
IOUT
10 µF
10 µF
Measurement Setup for
Figure 5, 7, 13, 14,
Measurement Setup for
Figure 4, 6, 15,
Measurement Setup for
Figure 8, 26
Figure 23, 25, 31, 32
Figure 22, 24, 33
1 Vrms
8: VCC 7: N.C. 6: N.C.5: GND
8: VCC 7: N.C. 6: N.C. 5: GND
BD4xxS5EFJ-C
8: VCC 7: N.C. 6: N.C. 5: GND
BD4xxS5EFJ-C
4.7 µF
BD4xxS5EFJ-C
4.7 µF
4.7 µF
1: VOUT2: N.C. 3: N.C. 4: N.C.
1: VOUT 2: N.C. 3: N.C. 4: N.C.
1: VOUT2: N.C. 3: N.C. 4: N.C.
10 µF
10 µF
IOUT
10 µF
IOUT
Measurement Setup for
Figure 10, 28
Measurement Setup for
Figure 9, 27
Measurement Setup for
Figure 11, 29
8: VCC 7: N.C. 6: N.C.5: GND
4.7 µF
BD4xxS5EFJ-C
1: VOUT 2: N.C. 3: N.C. 4: N.C.
10 µF
IOUT
Measurement Setup for
Figure 12, 30
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BD4xxS5-C Series
Measurement Circuit for Typical Performance Curves (BD4xxS5WEFJ-C) – continued
8: VCC 7: CTL 6: N.C.5: GND
BD4xxS5WEFJ-C
8: VCC 7: CTL 6: N.C.5: GND
BD4xxS5WEFJ-C
8: VCC 7: CTL 6: N.C.5: GND
BD4xxS5WEFJ-C
4.7 µF
4.7 µF
4.7 µF
1: VOUT2: N.C. 3: N.C. 4: N.C.
1: VOUT2: N.C. 3: N.C. 4: N.C.
1: VOUT2: N.C. 3: N.C. 4: N.C.
IOUT
10 µF
10 µF
10 µF
Measurement Setup for
Figure 5, 7, 13, 14,
Figure 23, 25, 31, 32
Measurement Setup for
Figure 4, 6, 15, 16, 20,
Figure 22, 24, 33, 34, 38
Measurement Setup for
Figure 8, 26
8: VCC 7: CTL 6: N.C.5: GND
BD4xxS5WEFJ-C
8: VCC 7: CTL 6: N.C.5: GND
BD4xxS5WEFJ-C
8: VCC 7: CTL 6: N.C.5: GND
BD4xxS5WEFJ-C
1 Vrms
4.7 µF
4.7 µF
4.7 µF
1: VOUT2: N.C. 3: N.C. 4: N.C.
1: VOUT2: N.C. 3: N.C. 4: N.C.
1: VOUT2: N.C. 3: N.C. 4: N.C.
10 µF
10 µF
IOUT
10 µF
IOUT
Measurement Setup for
Figure 10, 28
Measurement Setup for
Figure 9, 27
Measurement Setup for
Figure 11, 29
8: VCC 7: CTL 6: N.C.5: GND
BD4xxS5WEFJ-C
8: VCC 7: CTL 6: N.C.5: GND
BD4xxS5WEFJ-C
8: VCC 7: CTL 6: N.C.5: GND
4.7 µF
4.7 µF
BD4xxS5WEFJ-C
4.7 µF
1: VOUT2: N.C. 3: N.C. 4: N.C.
1: VOUT2: N.C. 3: N.C. 4: N.C.
1: VOUT2: N.C. 3: N.C. 4: N.C.
10 µF
10 µF
10 µF
IOUT
Measurement Setup for
Figure 12, 30
Measurement Setup for
Figure 21, 39
Measurement Setup for
Figure 17, 18, 19,
Figure 35, 36, 37
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BD4xxS5-C Series
Selection of Components Externally Connected
VCC
Insert capacitors with a capacitance of 0.1 μF or higher between the VCC and the GND. Choose the capacitance
according to the line between the power smoothing circuit and the VCC. Selection of the capacitance also depends
on the application. Verify the application and allow sufficient margins in the design. We recommend using a capacitor
with excellent voltage and temperature characteristics.
Output Pin Capacitor
In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND. We recommend using
a capacitor with a capacitance of 10 μF (Typ) or higher. Electrolytic, tantalum and ceramic capacitors can be used.
When selecting the capacitor ensure that the capacitance of 6 μF or higher is maintained at the intended applied
voltage and temperature range. Due to changes in temperature the capacitor’s capacitance can fluctuate possibly
resulting in oscillation. For selection of the capacitor refer to the data of Figure 40.
The stable operation range given in the data of Figure 40 and Figure 41 is based on the standalone IC and resistive
load. For actual applications the stable operating range is influenced by the PCB impedance, input supply impedance
and load impedance. Therefore verification of the final operating environment is needed.
When selecting a ceramic type capacitor, we recommend using X5R, X7R or better with excellent temperature and
DC-biasing characteristics and high voltage tolerance.
Also, in case of rapidly fluctuation of input voltage and load current, select the capacitance in accordance with verifying
that the actual application meets with the required specification. Mount the capacitor as much as possible near
connected pin.
100
1000
○Condition:
○Condition:
Unstable OperationRange
VCC = 13.5 V
(CTL = 5 V)
VCC = 13.5 V
(CTL = 5 V)
10
1
Stable Operation Range
CIN = 0.1 μF
10 µF ≤ COUT (Typ)
-40 °C ≤ Tj ≤ +150°C
CIN = 0.1 µF
-40 °C ≤ Tj ≤ +150 °C
100
10
1
0.1
Stable Operation Range
0.01
0.001
Unstable OperationRange
0
100
200 300
IOUT [mA]
400
500
0
100
200 300
IOUT [mA]
400
500
Figure 40. ESR vs IOUT
Figure 41. COUT vs IOUT
FIN
FIN
8: VCC
7: N.C. 6: N.C. 5: GND
8: VCC
7: CTL
6: N.C. 5: GND
BD4xxS5FP2-C
BD4xxS5WFP2-C
CIN
CIN
BD4xxS5EFJ-C
BD4xxS5WEFJ-C
2: CTL
4: N.C.
1: VCC 2: GND 3: VOUT
1: VCC 3: GND 5: VOUT
1: VOUT 2: N.C. 3: N.C. 4: N.C.
1: VOUT 2: N.C.
3: N.C. 4: N.C.
ESR
CIN
ESR
COUT
ESR
ESR
IOUT
IOUT
COUT
CIN
COUT
COUT
Figure 42. Measurement Setups for ESR Reference Data
(about Output Pin Capacitor)
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BD4xxS5-C Series
Selection of Components Externally Connected – continued
Surge Voltage Protection for Linear Regulators
The following shows some helpful tips to protect ICs from possible inputting surge voltage which exceeds absolute
maximum ratings.
Positive Surge to the Input
If there is any potential risk that positive surges higher than absolute maximum ratings, it is applied to the input, a
Zener Diode should be inserted between the VCC pin and the GND to protect the device as shown in Figure 43.
VCC
VOUT
GND
VCC
VOUT
COUT
D1
CIN
Figure 43. Surges Higher than absolute maximum ratings are Applied to the Input
Negative Surge to the Input
If there is any potential risk that negative surges below the absolute maximum ratings, (e.g.) -0.3 V, is applied to the
input, a Schottky Diode should be inserted between the VCC and the GND to protect the device as shown in Figure
44.
VCC
VOUT
GND
VCC
VOUT
COUT
D1
CIN
Figure 44. Surges Lower than -0.3 V is Applied to the Input
Reverse Voltage Protection for Linear Regulators
A linear regulator which is one of the integrated circuit (IC) operates normally in the condition that the input voltage is
higher than the output voltage. However, it is possible to happen the abnormal situation in specific conditions which is
the output voltage becomes higher than the input voltage. A reverse polarity connection between the input and the output
might be occurred or a certain inductor component can also cause a polarity reverse conditions. If the countermeasure
is not implemented, it may cause damage to the IC. In this case, use a capacitor with a capacitance with less than 1000
μF, to reduce damage to internal circuits or elements. The following shows some helpful tips to protect ICs from the
reverse voltage occasion.
Protection against Reverse Input/Output Voltage
In the case that MOSFET is used for the pass transistor, a parasitic body diode between the drain-source generally exists.
If the output voltage becomes higher than the input voltage and if its voltage difference exceeds VF of the body diode, a
reverse current flows from the output to the input through the body diode as shown in Figure 45. The current flows in the
parasitic body diode is not limited in the protection circuit because it is the parasitic element, therefore too much reverse
current may cause damage to degrade or destroy the semiconductor elements of the regulator.
IR
VOUT
VCC
Error
AMP.
VREF
Figure 45. Reverse Current Path in a MOS Linear Regulator
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BD4xxS5-C Series
Protection against Reverse Input/Output Voltage – continued
An effective solution for this problem is to implement an external bypass diode in order to prevent the reverse current
flow inside the IC as shown in Figure 46. Especially in applications where the output voltage setting is high and a large
output capacitor is connected, be sure to consider countermeasures for large reverse current values. Note that the bypass
diode must be turned on prior to the internal body diode of the IC. This external bypass diode should be chosen as being
lower forward voltage VF than the internal body diode. It should to be selected a diode which has a rated reverse voltage
greater than the IC’s input maximum rating voltage and also which has a rated forward current greater than the anticipated
reverse current in the actual application.
D1
VCC
VOUT
GND
VCC
VOUT
COUT
CIN
Figure 46. Bypass Diode for Reverse Current Diversion
A Schottky barrier diode which has a characteristic of low forward voltage (VF) can meet to the requirement for the
external diode to protect the IC from the reverse current. However, it also has a characteristic that the leakage (IR) caused
by the reverse voltage is bigger than other diodes. Therefore, it should be taken into the consideration to choose it
because if IR is large, it may cause increase of the current consumption, or raise of the output voltage in the light-load
current condition. IR characteristic of Schottky diode has positive temperature characteristic, which the details shall be
checked with the datasheet of the products, and the careful confirmation of behavior in the actual application is mandatory.
Even in the condition when the input/output voltage is inverted, if the VCC pin is open as shown in Figure 47, or if the
VIN pin becomes high-impedance condition as designed in the system, it cannot damage or degrade the parasitic
element. It's because a reverse current via the pass transistor becomes extremely low. In this case, therefore, the
protection external diode is not necessary.
ON→OFF
IBIAS
VCC
VOUT
GND
VCC
VOUT
COUT
CIN
Figure 47. Open VIN
Protection against Input Reverse Voltage
When the input of the IC is connected to the power supply, accidentally if plus and minus are routed in reverse, or if there
is a possibility that the input may become lower than the GND pin, it may cause to destroy the IC because a large current
passes via the internal electrostatic breakdown prevention diode between the input pin and the GND pin inside the IC as
shown in Figure 48.
The simplest solution to avoid this problem is to connect a Schottky barrier diode or a rectifier diode in series to the power
supply line as shown in Figure 49. However, it causes the voltage drop by a forward voltage VF at the supply voltage
while normal operation.
Generally, since the Schottky barrier diode has lower VF, so it contributes to rather smaller power loss than rectifier diodes.
If IC has load currents, the required input current to the IC is also bigger. In this case, this external diode generates heat
more, therefore select a diode with enough margin in power dissipation. On the other hand, a reverse current passes this
diode in the reverse connection condition, however, it is negligible because its small amount.
VCC
VOUT
COUT
GND
VCC
VOUT
D1
-
VCC
VOUT
GND
VOUT
COUT
VCC
CIN
GND
CIN
+
GND
Figure 49. Protection against Reverse Polarity 1
Figure 48. Current Path in Reverse Input Connection
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BD4xxS5-C Series
Protection against Input Reverse Voltage – continued
Figure 50 shows a circuit in which a P-channel MOSFET is connected in series to the power. The body diode (parasitic
element) is located in the drain-source junction area of the MOSFET. The drop voltage in a forward connection is
calculated from the on state resistance of the MOSFET and the output current IO. It is smaller than the drop voltage by
the diode as shown in Figure 49 and results in less of a power loss. No current flows in a reverse connection where the
MOSFET remains off in Figure 50.
If the gate-source voltage exceeds maximum rating of MOSFET gate-source junction with derating curve in consideration,
reduce the gate-source junction voltage by connecting resistor voltage divider as shown in Figure 51.
Q1
VCC
Q1
VOUT
VCC
VOUT
GND
VCC
VCC
VOUT
GND
VOUT
COUT
R1
CIN
R2
CIN
COUT
Figure 50. Protection against Reverse Polarity 2
Figure 51. Protection against Reverse Polarity 3
Protection against Reverse Output Voltage when Output Connect to an Inductor
If the output load is inductive, electrical energy accumulated in the inductive load is released to the ground at the moment
that the output voltage is turned off. IC integrates ESD protection diodes between the IC output and ground pins. A large
current may flow in such condition finally resulting on destruction of the IC. To prevent this situation, connect a Schottky
barrier diode in parallel to the integrated diodes as shown in Figure 52.
Further, if a long wire is in use for the connection between the output pin of the IC and the load, confirm that the negative
voltage is not generated at the VOUT pin when the output voltage is turned off by observation of the waveform on an
oscilloscope, since it is possible that the load becomes inductive. An additional diode is required for a motor load that is
affected by its counter electromotive force, as it produces an electrical current in a similar way.
VCC
VOUT
VCC
VOUT
GND
D1
CIN
XLL
COUT
GND
GND
Figure 52. Current Path in Inductive Load (Output: Off)
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BD4xxS5-C Series
Power Dissipations
■TO263-5 / TO263-3
IC mounted on ROHM standard board based on JEDEC.
①: 1-layer PCB (Copper foil area on the reverse side of PCB: 0 mm × 0 mm)
10
8
Board material: FR4
Board size: 114.3 mm × 76.2 mm × 1.57 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper.
②5.9 W
6
:
②: 4-layer PCB (Copper foil area on the reverse side of PCB: 74.2 mm × 74.2 mm)
Board material: FR4
Board size: 114.3 mm × 76.2 mm × 1.60 mmt
4
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper.
2 inner layers copper foil area of PCB: 74.2 mm × 74.2 mm, 1 oz. copper.
Copper foil area on the reverse side of PCB: 74.2 mm × 74.2 mm, 2 oz. copper.
①1.5 W
2
Condition①: θJA = 81 °C/W, ΨJT (top center) = 8 °C/W
Condition②: θJA = 21 °C/W, ΨJT (top center) = 2 °C/W
0
0
25
50
75
100
125
150
Ambient Temperature: Ta [°C]
Figure 53. Package Data
(TO263-5 / TO263-3)
■HTSOP-J8
IC mounted on ROHM standard board based on JEDEC.
①1-layer PCB (Copper foil area on the reverse side of PCB: 0 mm × 0 mm)
10
8
Board material: FR4
Board size: 114.3 mm × 76.2 mm × 1.57 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper.
6
②4-layer PCB (Copper foil area on the reverse side of PCB: 74.2 mm × 74.2 mm)
②4.6 W
①1.0 W
25
Board material: FR4
Board size: 114.3 mm × 76.2 mm × 1.60 mmt
4
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper.
2 inner layers copper foil area of PCB: 74.2 mm × 74.2 mm, 1 oz. copper.
2
Copper foil area on the reverse side of PCB: 74.2 mm × 74.2 mm, 2 oz. copper.
Condition①: θJA = 126 °C/W, ΨJT (top center) = 9 °C/W
0
0
50
75
100
125
150
Condition②: θJA = 27 °C/W, ΨJT (top center) = 2 °C/W
Ambient Temperature: Ta [°C]
Figure 54. Package Data
(HTSOP-J8)
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BD4xxS5-C Series
Thermal Design
This product exposes a frame on the back side of the package for thermal efficiency improvement.
Within this IC, the power consumption is decided by the dropout voltage condition, the load current and the circuit current.
Refer to power dissipation curves illustrated in Figure 53, 54 when using the IC in an environment of Ta ≥ 25 °C. Even if the
ambient temperature Ta is at 25 °C, depending on the input voltage and the load current, chip junction temperature can be
very high. Consider the design to be Tj ≤ Tjmax = 150 °C in all possible operating temperature range.
Should by any condition the maximum junction temperature Tjmax = 150 °C rating be exceeded by the temperature increase
of the chip, it may result in deterioration of the properties of the chip. The thermal impedance in this specification is based on
recommended PCB and measurement condition by JEDEC standard. Verify the application and allow sufficient margins in
the thermal design by the following method is used to calculate the junction temperature Tj.
Tj can be calculated by either of the two following methods.
1. The following method is used to calculate the junction temperature Tj.
푇푗 = 푇푎 + 푃퐶 × 휃퐽퐴 [°C]
Tj
: Junction Temperature
: Ambient Temperature
: Power Consumption
: Thermal Impedance
(Junction to Ambient)
Ta
PC
θJA
2. The following method is also used to calculate the junction temperature Tj.
푇푗 = 푇ꢀ + 푃퐶 × 훹 [°C]
퐽ꢀ
Tj
: Junction Temperature
TT
PC
ΨJT
: Top Center of Case’s (mold) Temperature
: Power consumption
: Thermal Impedance
(Junction to Top Center of Case)
The following method is used to calculate the power consumption Pc (W).
푃푐 = (푉ꢁꢁ − 푉푂푈푇) × 퐼푂푈푇 + 푉ꢁꢁ × 퐼퐶퐶 [W]
PC
: Power Consumption
: Input Voltage
: Output Voltage
: Load Current
VCC
VOUT
IOUT
Icc
: Circuit Current
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BD4xxS5-C Series
Calculation Example (TO263-3 / TO263-5)
If VCC = 13.5 V, VOUT = 5.0 V, IOUT = 200 mA, Icc = 38 μA, the power consumption Pc can be calculated as follows:
푃푐 = (푉ꢁꢁ − 푉푂푈푇) × 퐼푂푈푇 + 푉ꢁꢁ × 퐼퐶퐶
(
)
= 13.5 푉 – 5.0 푉 × 200 푚ꢂ + 13.5 푉 × 38 휇ꢂ
= 1.7 푊
At the ambient temperature Ta = 85 °C, the thermal impedance ( Junction to Ambient ) θJA = 21 °C/W( 4-layer PCB ),
푇푗 = 푇푎 + 푃퐶 × 휃퐽퐴
= 85 °ꢁ + 1.7 푊 × 21 °ꢁ/푊
= 120.7 °ꢁ
When operating the IC, the top center of case’s (mold) temperature TT = 100 °C, ΨJT = 8 °C/W( 1-layer PCB ),
푇푗 = 푇ꢀ + 푃퐶 × 훹
퐽ꢀ
= 100 °ꢁ + 1.7 푊 × 8 °ꢁ/푊
= 113.6 °ꢁ
For optimum thermal performance, it is recommended to expand the copper foil area of the board, increasing the layer and
thermal via between thermal land pad.
Calculation Example (HTSOP-J8)
If VCC = 13.5 V, VOUT = 5.0 V, IOUT = 200 mA, Icc = 38 μA, the power consumption Pc can be calculated as follows:
푃푐 = (푉ꢁꢁ − 푉푂푈푇) × 퐼푂푈푇 + 푉ꢁꢁ × 퐼퐶퐶
(
)
= 13.5 푉 – 5.0 푉 × 200 푚ꢂ + 13.5 푉 × 38 휇ꢂ
= 1.7 푊
At the ambient temperature Ta = 85 °C, the thermal impedance ( Junction to Ambient ) θJA = 27 °C/W( 4-layer PCB ),
푇푗 = 푇푎 + 푃퐶 × 휃퐽퐴
= 85 °ꢁ + 1.7 푊 × 27 °ꢁ/푊
= 130.9 °ꢁ
When operating the IC, the top center of case’s (mold) temperature TT = 100 °C, ΨJT = 9 °C/W( 1-layer PCB ),
푇푗 = 푇ꢀ + 푃퐶 × 훹
퐽ꢀ
= 100 °ꢁ + 1.7 푊 × 9 °ꢁ/푊
= 115.3 °ꢁ
For optimum thermal performance, it is recommended to expand the copper foil area of the board, increasing the layer and
thermal via between thermal land pad.
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BD4xxS5-C Series
I/O Equivalence Circuit
VCC
4 MΩ (Typ)
( Applicable for product with Enable Input )
CTL
360 k (Typ)
Ω
VOUT
1545 kΩ (Typ/ 5.0 V Output)
840 kΩ (Typ/ 3.3 V Output)
185 kΩ (Typ)
530 kΩ (Typ)
70 kΩ (Typ)
Figure 55. Input / Output Equivalence Circuit
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BD4xxS5-C Series
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the operating conditions. The
characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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BD4xxS5-C Series
Operational Notes – continued
9. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 56. Example of Monolithic IC Structure
10. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
11. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
12. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
13. Thermal Consideration
The power dissipation under actual operating conditions should be taken into consideration and a sufficient margin
should be allowed in the thermal design. On the reverse side of the package this product has an exposed heat pad for
improving the heat dissipation. The amount of heat generation depends on the voltage difference between the input
and output, load current, and bias current. Therefore, when actually using the chip, ensure that the generated heat
does not exceed the Pd rating. If Junction temperature is over Tjmax (= 150 °C), IC characteristics may be worse due
to rising chip temperature. Heat resistance in specification is measurement under PCB condition and environment
recommended in JEDEC. Ensure that heat resistance in specification is different from actual environment.
14. CTL Pin
The CTL pin is for controlling ON/OFF the output voltage. Do not make voltage level of chip enable keep floating
level, or between VthH and VthL. Otherwise, the output voltage would be unstable or indefinite.
15. Functional Safety
“ISO 26262 process compliant to support ASIL-*”
A product that has been developed based on an ISO 26262 design process compliant to the ASIL level described in
the datasheet.
“Safety mechanism is implemented to support functional safety (ASIL-*)”
A product that has implemented safety mechanism to meet ASIL level requirements described in the datasheet.
“Functional safety supportive automotive products”
A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the
functional safety.
Note: “ASIL-*” is stands for the ratings of “ASIL-A”, “-B”, “-C” or “-D” specified by each product's datasheet.
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BD4xxS5-C Series
Physical Dimension and Packing Information
Package Name
TO263-3
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BD4xxS5-C Series
Physical Dimension and Packing Information – continued
Package Name
TO263-5
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BD4xxS5-C Series
Physical Dimension and Packing Information – continued
Package Name
HTSOP-J8
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BD4xxS5-C Series
Marking Diagrams (Top View)
TO263-5 (Top View)
TO263-3 (Top View)
Part Number Marking
LOT Number
Part Number Marking
LOT Number
Pin 1
Pin 1
Output
Voltage [V]
Enable
Part Number Marking
Orderable Part Number
Input(Note 1)
BD433S5WFP2-CE2
BD450S5WFP2-CE2
BD433S5FP2-CE2
BD450S5FP2-CE2
433S5W
450S5W
433S5
3.3
5.0
3.3
5.0
○
○
－
－
450S5
(Note 1)
○: Includes Enable Input
– : Not includes Enable Input
HTSOP-J8 (Top View)
Part Number Marking
LOT Number
Pin 1
Output
Voltage [V]
Enable
Part Number Marking
Orderable Part Number
Input(Note 1)
BD433S5WEFJ-CE2
BD450S5WEFJ-CE2
BD433S5EFJ-CE2
BD450S5EFJ-CE2
433S5W
450S5W
433S5
3.3
5.0
3.3
5.0
○
○
－
－
450S5
(Note 1)
○: Includes Enable Input
– : Not includes Enable Input
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BD4xxS5-C Series
Revision History
Date
Revision
Changes
24.Jun.2022
26.Oct.2022
001
002
New Release
Add lineup
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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