BD45E312G-M [ROHM]

罗姆的BD45Exxxx-M、BD46Exxxx-M系列，是采用了CMOS工艺的高精度、低消耗电流的RESET IC系列。通过内置计数器定时器延迟电路，无需外接延迟时间设定用电容器。为保证客户可根据应用进行选择，备有Nch漏极开路输出BD45Exxxx-M和CMOS输出BD46Exxxx-M两个系列的产品。备有检测电压范围在2.3V～4.8V之间，可按0.1V阶跃进行选择的26种产品，按固定延迟时间不同共有156种类型。;


型号：	BD45E312G-M
厂家：	ROHM
描述：	罗姆的BD45Exxxx-M、BD46Exxxx-M系列，是采用了CMOS工艺的高精度、低消耗电流的RESET IC系列。通过内置计数器定时器延迟电路，无需外接延迟时间设定用电容器。为保证客户可根据应用进行选择，备有Nch漏极开路输出BD45Exxxx-M和CMOS输出BD46Exxxx-M两个系列的产品。备有检测电压范围在2.3V～4.8V之间，可按0.1V阶跃进行选择的26种产品，按固定延迟时间不同共有156种类型。电容器计数器
文件：	总17页 (文件大小：1411K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Datasheet

Voltage Detector IC Series for Automotive

Counter Timer Built-in

CMOS Voltage Detector IC

BD45Exxxx-M series BD46Exxxx-M series

●Key Specifications

 Detection voltage:

●General Description

2.3V to 4.8V (Typ.)

0.1V steps

±1.0%

ROHM’s BD45Exxxx-M and BD46Exxxx-M series are

highly accurate, low current consumption Voltage

Detector IC series. Because the counter timer delay

circuit is built into those series, an external capacitor for

the delay time setting is unnecessary. The lineup was

established with two output types (Nch open drain and

CMOS output) and detection voltages range from 2.3V

to 4.8V in increments of 0.1V, so that the series may be

selected according to application.

 High accuracy detection voltage:

 Ultra-low current consumption:

 Operating temperature range:

 Three internal, fixed delay time:

0.85µA (Typ.)

-40°C to +105°C

50ms

100ms

200ms

●Package

SSOP5

2.90mm x 2.80mm x 1.25mm

●Features

 Counter Timer Built-in

 No delay time setting capacitor required

 Ultra-low current consumption

●Applications

Circuits using microcontrollers or logic circuits that

require reset for automotive applications (car

navigation, car audio, meter panel, exterior lamp etc.)

 Two output types (Nch open drain and CMOS output)

 Package SSOP5 is similar to SOT-23-5 (JEDEC)

 AEC-Q100 Qualified

●Typical Application Circuit

VDD1

VDD2

Micro

controller

BD46Exxxx-M

RST

Micro

controller

BD45Exxxx-M

RST

（Noise-filtering

Capacitor）

（Noise-filtering

Capacitor）

GND

（CMOS Output Type）

（Open Drain Output Type）

BD46Exxxx-M series

BD45Exxxx-M series

●Connection Diagram

●Pin Descriptions

SSOP5

VDD

VOUT

PIN No.

Symbol

Function

Manual Reset

Substrate *

SUB

GND

VOUT

VDD

GND

TOP VIEW

Reset Output

Power Supply Voltage

Lot. No

Marking

ER SUB GND

*Connect the substrate to GND.

○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays

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●Ordering Information

Part

Number

Output Type

45 : Open Drain

46 : CMOS

Reset Voltage Value Counter Timer

23 : 2.3V

Package

Delay Time Settings G : SSOP5

0.1V step 5 : 50ms

Product Category Packaging and

M : Automotive Category forming specification

TR : Embossed tape

and reel

48 : 4.8V

1 : 100ms

2 : 200ms

●Lineup

Table 1. Open Drain Output Type

Counter Timer Delay Time Settings

50ms

100ms

Part

200ms

Detection

Voltage

Part

Marking

Number

4.8V

4.7V

4.6V

4.5V

4.4V

4.3V

4.2V

4.1V

4.0V

3.9V

3.8V

3.7V

3.6V

3.5V

3.4V

3.3V

3.2V

3.1V

3.0V

2.9V

2.8V

2.7V

2.6V

2.5V

2.4V

2.3V

BD45E485

BD45E475

BD45E465

BD45E455

BD45E445

BD45E435

BD45E425

BD45E415

BD45E405

BD45E395

BD45E385

BD45E375

BD45E365

BD45E355

BD45E345

BD45E335

BD45E325

BD45E315

BD45E305

BD45E295

BD45E285

BD45E275

BD45E265

BD45E255

BD45E245

BD45E235

BD45E481

BD45E471

BD45E461

BD45E451

BD45E441

BD45E431

BD45E421

BD45E411

BD45E401

BD45E391

BD45E381

BD45E371

BD45E361

BD45E351

BD45E341

BD45E331

BD45E321

BD45E311

BD45E301

BD45E291

BD45E281

BD45E271

BD45E261

BD45E251

BD45E241

BD45E231

BD45E482

BD45E472

BD45E462

BD45E452

BD45E442

BD45E432

BD45E422

BD45E412

BD45E402

BD45E392

BD45E382

BD45E372

BD45E362

BD45E352

BD45E342

BD45E332

BD45E322

BD45E312

BD45E302

BD45E292

BD45E282

BD45E272

BD45E262

BD45E252

BD45E242

BD45E232

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●Lineup - continued

Table 2. CMOS Output Type

Counter Timer Delay Time Settings

100ms

50ms

200ms

Detection

Voltage

Part

Number

Part

Number

Part

Number

Marking

4.8V

4.7V

4.6V

4.5V

4.4V

4.3V

4.2V

4.1V

4.0V

3.9V

3.8V

3.7V

3.6V

3.5V

3.4V

3.3V

3.2V

3.1V

3.0V

2.9V

2.8V

2.7V

2.6V

2.5V

2.4V

2.3V

BD46E485

BD46E475

BD46E465

BD46E455

BD46E445

BD46E435

BD46E425

BD46E415

BD46E405

BD46E395

BD46E385

BD46E375

BD46E365

BD46E355

BD46E345

BD46E335

BD46E325

BD46E315

BD46E305

BD46E295

BD46E285

BD46E275

BD46E265

BD46E255

BD46E245

BD46E235

BD46E481

BD46E471

BD46E461

BD46E451

BD46E441

BD46E431

BD46E421

BD46E411

BD46E401

BD46E391

BD46E381

BD46E371

BD46E361

BD46E351

BD46E341

BD46E331

BD46E321

BD46E311

BD46E301

BD46E291

BD46E281

BD46E271

BD46E261

BD46E251

BD46E241

BD46E231

BD46E482

BD46E472

BD46E462

BD46E452

BD46E442

BD46E432

BD46E422

BD46E412

BD46E402

BD46E392

BD46E382

BD46E372

BD46E362

BD46E352

BD46E342

BD46E332

BD46E322

BD46E312

BD46E302

BD46E292

BD46E282

BD46E272

BD46E262

BD46E252

BD46E242

BD46E232

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 Absolute maximum ratings

Parameter

Symbol

Limits

-0.3 to +10

Unit

Power Supply Voltage

V_DD-GND

Nch Open Drain Output

CMOS Output

GND-0.3 to +10

GND-0.3 to V_DD+0.3

Output Voltage

VOUT

Output Current

ER pin Voltage

Power Dissipation

VCT

GND-0.3 to V_DD+0.3

540

*1,*2

°C

Operating Temperature

Topr

Tstg

-40 to +105

-55 to +125

Ambient Storage Temperature

°C

*1 Reduced by 5.4mW/°C when used over 25°C.

*2 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board).

●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C)

Limit

Typ.

Parameter

Symbol

Condition

Unit

Min.

VDET(T)

×0.99

2.475

2.418

2.404

2.970

2.901

2.885

3.267

3.191

3.173

4.158

4.061

4.039

4.752

4.641

4.616

Max.

VDET(T)

×1.01

2.525

2.584

2.597

3.030

3.100

3.117

3.333

3.410

3.428

4.242

4.341

4.364

4.848

4.961

4.987

VDET(T)

VDD=HL, RL=470kΩ

2.5

Ta=+25°C

VDET=2.5V

VDET=3.0V

VDET=3.3V

VDET=4.2V

Ta=-40°C to 85°C

Ta=85°C to 105°C

Ta=+25°C

3.0

Ta=-40°C to 85°C

Ta=85°C to 105°C

Ta=+25°C

3.3

Detection Voltage

VDET

Ta=-40°C to 85°C

Ta=85°C to 105°C

Ta=+25°C

4.2

Ta=-40°C to 85°C

Ta=85°C to 105°C

Ta=+25°C

4.8

VDET=4.8V

Ta=-40°C to 85°C

Ta=85°C to 105°C

Detection Voltage

Temperature coefficient

VDET/

∆T

±100

±360 ppm/°C

-40°C to +105°C

VDET(T) VDET(T) VDET(T)

VDD＝LHL, RL=470kΩ

Hysteresis Voltage

∆VDET

×0.03

×0.05

×0.08

BD45EXX5, BD46EXX5

CL=100pF,

‘High’ Output

Delay time

tPLH

100

110

RL=100kΩ

BD45EXX1, BD46EXX1

BD45EXX2, BD46EXX2

*1,*2,*3

180

200

220

0.70

0.75

0.80

0.75

0.80

0.85

2.10

2.85

2.25

3.00

2.40

3.15

2.25

4.28

2.40

4.50

2.55

4.73

VDD=VDET-0.2V, VER=0V VDET=2.3V to 3.1V

VDD=VDET-0.2V, VER=0V VDET=3.2V to 4.2V

VDD=VDET-0.2V, VER=0V VDET=4.3V to 4.8V

Circuit Current

when ON

IDD1

IDD2

µA

VDD=VDET+0.2V, VER=0V VDET=2.3V to 3.1V *1

VDD=VDET+0.2V, VER=0V VDET=2.3V to 3.1V

VDD=VDET+0.2V, VER=0V VDET=3.2V to 4.2V *1

VDD=VDET+0.2V, VER=0V VDET=3.2V to 4.2V

VDD=VDET+0.2V, VER=0V VDET=4.3V to 4.8V *1

VDD=VDET+0.2V, VER=0V VDET=4.3V to 4.8V

Circuit Current

when OFF

VDET(T):Standard Detection Voltage (2.3V to 4.8V, 0.1V step)

RL :Pull-up resistor to be connected between VOUT and power supply.

CL :Capacitor to be connected between VOUT and GND.

*1 Guarantee is Ta=25°C.

*2 tPLH:VDD=(VDET(T)-0.5V)(VDET(T)+0.5V)

*3 tPLH:VDD=Please set up the rise up time between VDD=0VDET more than 100µs.

Attention: Please connect ‘ER’ to the GND when not in use.

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●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C) – continued

Limit

Typ.

Condition

Parameter

Symbol

Unit

Min.

0.95

1.20

Max.

VOL≤0.4V, RL=470kΩ, Ta=25 to 105°C

VOL≤0.4V, RL=470kΩ, Ta=-40 to 25°C

VDD=4.8V, ISOURCE= 1.0 mA, VDET(2.3V to 4.2V)

VDD=6.0V, ISOURCE= 1.2 mA, VDET(4.3V to 4.8V)

VDD=1.2V, ISINK = 0.45 mA

Operating Voltage Range

‘High’ Output Voltage (Pch)

VOPL

VDD-0.5

VOH

VOL

VDD-0.5

0.3

0.1

0.8

‘Low’Output Voltage (Nch)

VDD=2.4V, ISINK = 1.3 mA, VDET(2.7V to 4.8V)

VDD=VDS=10V

Leak Current when OFF

ER Pin ‘H’ Voltage

ER Pin ‘L’ Voltage

I_leak

VEH

VEL

IEL

µA

2.0

ER Pin Input Current

µA

VDET(T):Standard Detection Voltage (2.3V to 4.8V, 0.1V step)

RL :Pull-up resistor to be connected between VOUT and power supply.

CL :Capacitor to be connected between VOUT and GND.

*1 Guarantee is Ta=25°C.

Attention: Please connect ‘ER’ to the GND when not in use.

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BD45Exxxx-M series BD46Exxxx-M series

●Block Diagrams

VDD

VOUT

Oscillation

Circuit Counter

Timer

Vref

GND

Fig.1 BD45Exxxx-M Series

VDD

Oscillation

Circuit Counter

Timer

VOUT

Vref

GND

Fig.2 BD46Exxxx-M Series

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BD45Exxxx-M series BD46Exxxx-M series

●Typical Performance Curves

2.0

【BD4

【

】

G】

【BD45E281-M】

BD45281G

【

】

【BD46E281-M】

1.5

1.0

0.5

0.0

VDD=2.4V

VDD=1.2V

0.0

0.5

1.0

1.5

2.0

2.5

9 10

DRAIN-SOURCE VOLTAGE ： VDS[V]

VDD SUPPLY VOLTAGE ：VDD[V]

Fig.4 “Low” Output Current

Fig.3 Circuit Current

【BD45E281-M】

BD46281G

【

】

BD45421G

【BD46E281-M】

【

】

【BD46E281-M】

VDD=6.0V

VDD=4.8V

Ta=25

℃

Ta=25

℃

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5

DRAIN-SOURCE VOLTAGE ： VDS[V]

VDD SUPPLY VOLTAGE ：VDD[V]

Fig.5 “High” Output Current

Fig.6 I/O Characteristics

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●Typical Performance Curves – continued

BD45421G

【

】

【BD45E281-M】

BD46281G

【BD45E421-M】

【

】

【BD46E281-M】

【BD46E421-M】

9 10

ER VOLTAGE ： VER[V]

Fig.8 ER Terminal Input Current

ER VOLTAGE ： VER[V]

Fig.7 ER Terminal Threshold Voltage

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

5.8

5.4

5.0

4.6

4.2

3.8

3.4

3.0

BD45421G

【

】

【BD45E421-M】【 BD46E421-M】

BD45421G

【】

【BD45E421-M】

【BD46E421-M】

Lowto high(VDET+ΔVDET)

High to low(VDET)

～

-40 -20

20 40 60 80 100

-40

TEMPERATURE ： Ta[℃]

Fig.10 Circuit Current when ON

(VDET-0.2V)

Fig.9 Detection Voltage

Release Voltage

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●Typical Performance Curves – continued

1.5

1.0

0.5

0.0

3.0

2.8

【BD45E421-M】

BD45421G

【

】

【BD45E421-M】

【BD46E421-M】

2.6

2.4

2.2

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

【BD46E421-M】

-40 -20

20 40 60 80 100

-40 -20

20 40 60 80 100

TEMPERATURE ： Ta[℃]

Fig.11 Circuit Current when OFF

Fig.12 Operating Limit Voltage

250

200

150

100

BD4528

【

□ 】

【BD45E282-M】【 BD46E282-M】

BD45281G tPHL

【

】

【BD45E281-M】

BD45282G

【BD46E281-M】

【BD45E281-M】【 BD46E281-M】

BD45281G

_{【BD45E285-M】【 BD4}B_6ED₂4₈₅5_-2_M8_】5G

-60 -40 -20

20 40 60 80 100 120

-60 -40 -20

20 40 60 80 100 120

TEMPERATURE ： Ta[℃]

Fig.13 Output Delay Time

Fig.14 Output Delay Time

“Low””High”

“High””Low”

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●Application Information

Explanation of Operation

For both the open drain type (Fig.15) and the CMOS output type (Fig.16), the detection and release voltages are used as

threshold voltages. When the voltage applied to the V_DDpins reaches the applicable threshold voltage, the V_OUTterminal

voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BD45Exxxx-M series uses an open drain

output type, it is necessary to connect a pull-up resistor to V_DDor another power supply if needed [The output “High”

voltage (V_OUT) in this case becomes V_DDor the voltage of the other power supply].

VDD

Vref

Reset

VOUT

Oscillation

Circuit Counter

Timer

Oscillation

Circuit Counter

Timer

Reset

VOUT

GND

Fig.15 (BD45Exxxx-M Type Internal Block Diagram)

Fig.16 (BD46Exxxx-M Type Internal Block Diagram)

Reference Data

Examples of Leading (t_PLH) and Falling (t_PHL) Output

Part Number

BD45E275G-M

BD46E275G-M

t_PLH[ms]

t_PHL[µs]

VDD=2.2V3.2V

VDD=3.2V2.2V

*This data is for reference only.

The figures will vary with the application, so please confirm actual operating conditions before use.

Timing Waveform

Example: The following shows the relationship between the input voltages V_DD, the output voltage V_OUTand ER terminal when

the input power supply voltage V_DDis made to sweep up and sweep down (the circuits are those in Fig. 15 and 16).

When the power supply is turned on, the output is unstable

VDD

VDET+ΔVDET

from after over the operating limit voltage (V_OPL) until t_PHL

Therefore it is possible that the reset signal is not outputted when

VDET

VDD

VOUT

⑦

the rise time of V_DDis faster than t_PHL

VOPL

When V_DDis greater than V_OPLbut less than the reset release

voltage (V_DET+ ∆V_DET), the output voltages will switch to Low.

VOH

If V_DDexceeds the reset release voltage (V_DET+ ∆V_DET), the

tPLH

counter timer start and V_OUTswitches from L to H.

tPHL

VOL

VEH

When more than the high level voltage is supplied ER terminal,

tPHL

V_OUTcomes to “L” after t_PLHdelay time. Therefore, a time when ER

terminal is “H” is necessary for 100µsec or more.

tPHL

When the ER terminal switches to Low, the counter timer starts

to operate, a delay of t_PLHoccurs, and V_OUTswitches from “L” to

“H”.

①

②

③

④ ⑤

⑥

If V_DDdrops below the detection voltage (V_DET) when the power

supply is powered down or when there is a power supply

fluctuation, V_OUTswitches to L (with a delay of t_PHL).

Fig.17 Timing Waveform

The potential difference between the detection voltage and the

release voltage is known as the hysteresis width (∆V_DET). The

system is designed such that the output does not toggle with

power supply fluctuations within this hysteresis width, thus,

preventing malfunctions due to noise.

Timing may change depending on application and use. Please verify and confirm using practical applications.

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BD45Exxxx-M series BD46Exxxx-M series

●Circuit Applications

1) Examples of a common power supply detection reset circuit.

Application examples of BD45Exxxx-M series (Open

Drain output type) and BD46Exxxx-M series (CMOS

output type) are shown below.

VDD1

VDD2

Micro

controller

BD45Exxxx-M

RST

CASE1: Power supply of microcontroller (VDD2) differs

from the power supply of the reset detection (V_DD).

Use an open drain output Type (BD45xx series) device

with a load resistance R_Las shown Fig.18.

（Noise-filtering

Capacitor）

GND

CASE2: Power supply of the microcontroller (V_DD1) is

same as the power supply of the reset detection (V_DD1).

Use a CMOS output type (BD46Exxxx-M) device or an

open drain output type (BD45Exxxx-M) with a pull up

Fig.18 Open Drain Output Type

VDD1

resistor between the output and V_DD1

Micro

controller

BD46Exxxx-M

RST

When a capacitance C_Lfor noise filtering is connected to

the V_OUTpin (the reset signal input terminal of the

microcontroller), please take into account the waveform

of the rise and fall of the output voltage (V_OUT).

（Noise-filtering

Capacitor）

GND

Fig.19 CMOS Output Type

2) The following is an example of a circuit application in which an OR connection between two types of detection voltage

resets the microcontroller.

VDD1

VDD2

VDD3

Micro

controller

BD45Exxxx-M

RST

GND

Fig. 20

To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain

output type (BD45Exxxx-M series) to the microcontroller’s input with pull-up resistor to the supply voltage of the

microcontroller (V_DD3) as shown in Fig. 20. By pulling-up to V_DD3, output “High” voltage of micro-controller power supply is

possible.

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3) Examples of the power supply with resistor dividers.

In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow

into the circuit when the output level switches from “High” to “Low” or vice versa. In-rush current is a sudden surge of current

that flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow may cause

malfunction in the systems operation such as output oscillations, etc.

VDD

BD45Exxxx-M

BD46Exxxx-M

VOUT

CIN

GND

Fig. 21

When an in-rush current (I1) flows into the circuit (Refer to Fig. 21) at the time when output switches from “Low” to “High”,

a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the VDD

voltage drops below the detection voltage, the output will switch from “High” to “Low”. While the output voltage is at “Low”

condition, in-rush current will stop flowing and the voltage drop will be reduced. As a result, the output voltage will switches

again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will result to

oscillation.

IDD

In-rush Current

VDD

VDET

Fig. 22 Current Consumption vs. Power Supply Voltage

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●Operational Notes

1) Absolute maximum ratings

Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit

between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such

as adding a fuse, in case the IC is operated over the absolute maximum ratings.

2) Ground Voltage

The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no

pins are at a voltage below the ground pin at any time, even during transient condition.

3) Recommended operating conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

4) Bypass Capacitor for Noise Rejection

To help reject noise, put a 1uF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND.

Be careful when using extremely big capacitor as transient response will be affected.

5) Short between pins and mounting errors

Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong

orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.

6) Operation under strong electromagnetic field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

7) The V_DDline impedance might cause oscillation because of the detection current.

8) A V_DDto GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.

9) Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD)

condition.

10) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might

cause unexpected operations. Application values in these conditions should be selected carefully. If the leakage of

about 1MΩ is assumed between the ER terminal and the GND terminal, 100kΩ connection between the ER terminal

and the V_DDterminal would be recommended. If the leakage is assumed between the V_OUTterminal and the GND

terminal, the pull-up resistor should be less than 1/10 of the assumed leak resistance.

11) External parameters

The recommended parameter range for RLis 50kΩ to 1MΩ. There are many factors (board layout, etc) that can affect

characteristics. Please verify and confirm using practical applications.

12) Power on reset operation

Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual

operation.

13) Testing on application boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

14) Rush current

When the power supply, is turned on because of in certain cases, momentary Rash-current flow into the IC at the logic

unsettled, the couple capacitance, GND pattern of width and leading line must be considered.

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●Revision History

Date

Revision

001

Changes

20.Nov.2012

New Release

Change the value of “Counter Timer Delay” from 5ms to 50ms in Table1 and Table2.

Change unit of Operating Limit Voltage graph from uA to V in Typical Performance

Curve.

18.Dec.2012

002

23.May.2013

27.Aug.2013

003

004

Change limits for VDET at VDET=2.5V,3.0V,3.3V,4.2V,4.8V

Update the applications and features on page 1 and ordering information on page 2

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Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice - SS

Rev.002

Daattaasshheeeett

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice - SS

Rev.002

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

BD45E312G-M [ROHM]

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