BD48E28G_技术文档

Datasheet

Voltage Detector IC Series

Standard CMOS

Voltage Detector IC

BD48xxx series BD49xxx series

●General Description

●Key Specifications

¢ Detection voltage:

ROHM’s BD48xxx and BD49xxx series are highly

accurate, low-current Voltage Detector IC series. The

family includes BD48xxx devices with N-channel open

drain output and BD49xxx devices with CMOS output.

The devices are available for specific detection voltages

ranging from 2.3V to 6.0V in increments of 0.1V.

2.3V to 6.0V (Typ.),

0.1V steps

¢ High accuracy detection voltage:

¢ Ultra-low current consumption:

±1.0%

0.9µA (Typ.)

¢ Operating temperature range:

-40°C to +105°C

●Package

SSOP5:

SSOP3:

2.90mm x 2.80mm x 1.25mm

2.92mm x 2.80mm x 1.25mm

1.60 mm x 1.60mm x 0.60mm

●Features

¢

High accuracy detection

Ultra-low current consumption

Two output types (Nch open drain and CMOS output)

Wide Operating temperature range

VSOF5:

Very small and low height package

●Applications

Package SSOP5 is similar to SOT-23-5 (JEDEC)

Package SSOP3 is similar to SOT-23-3 (JEDEC)

Circuits using microcontrollers or logic circuits that

require a reset.

●Typical Application Circuit

DD1

V

VDD1

VDD2

RL

Micro

controller

RST

BD49xxx

Micro

controller

BD48xxx

RST

CL

Capacitor for

(

Capacitor for

(

noise filtering

）

noise filtering

）

GND

(Open Drain Output type）

(CMOS Output type）

BD49xxx series

BD48xxx series

○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays

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Datasheet

BD48xxx series BD49xxx series

●Connection Diagram

N.C.

SSOP5

VSOF5

VDD

5

GND

4

Lot. No

Marking

Lot. No

1 2 3

VOUT SUB N.C

Marking

VOUT VDD GND

TOP VIEW

●Pin Descriptions

SSOP5

VSOF5

PIN No.

Symbol

VOUT

VDD

Function

PIN No.

Symbol

Function

1

2

3

4

5

Reset Output

Power Supply Voltage

GND

1

2

3

4

5

VOUT

SUB

N.C.

GND

VDD

Reset Output

Substrate*

GND

N.C.

Unconnected Terminal

GND

Unconnected Terminal

Power Supply Voltage

N.C.

*Connect the substrate to GND.

SSOP3(1pin GND)

SSOP3(3pin GND)

VDD

GND

3

Marking

Lot. No

2

1

GND

2

VDD

1

VOUT

TOP VIEW

●Pin Descriptions

SSOP3-1

SSOP3-2

Symbol

PIN No.

Symbol

GND

VOUT

VDD

Function

GND

PIN No.

Function

Reset Output

Power Supply Voltage

GND

1

2

3

1

2

3

VOUT

VDD

Reset Output

Power Supply Voltage

GND

ò Ordering Information

B

D

x

-

T

R

Part

Number

Output Type

48 : Open Drain

49 : CMOS

Package1 Reset Voltage Value

23 : 2.3V

Package2

Packaging and

forming specification

Embossed tape and reel

TR :The pin number 1is

0.1V step

60 : 6.0V

the upper right

:SSOP5

:VSOF5

TL :The pin number 1is

Package1

E

K

Package2 Package name

SSOP5

the upper left

G

:SSOP3-1

:SSOP3-2

G

FVE

G

SSOP3(1pin GND)

SSOP3(3pin GND)

VSOF5

L

Blank

SSOP5

Note: When ordering new SSOP5, select “E” for Package 1 and “G” for Package 2.

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Datasheet

BD48xxx series BD49xxx series

SSOP5

°

+

2.9±0.2

6

°

4

Tape

Embossed carrier tape

3000pcs

−4

5

4

Quantity

TR

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1

2

3

1pin

+0.05

−0.03

0.13

+0.05

−0.04

0.42

0.1

0.95

Direction of feed

Reel

(Unit : mm)

Order quantity needs to be multiple of the minimum quantity.

VSOF5

1.6±0.05

1.0±0.05

5

4

1

2

3

0.13±0.05

0.22±0.05

0.5

(Unit : mm)

SSOP3

2.92±0.1

4°±4°

3

L

1

2

0.15±0.05

0.95

1.9±0.1

0.4±0.1

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Datasheet

BD48xxx series BD49xxx series

●Lineup

Table 1. Lineup for VSOF5 and SSOP5 Package

Package Type

Output Type

VSOF5 or SSOP5

Open Drain

SSOP5

CMOS

Part Number

Open Drain

CMOS

Detection

Voltage

Part Number

Marking

6.0V

5.9V

5.8V

5.7V

5.6V

5.5V

5.4V

5.3V

5.2V

5.1V

5.0V

4.9V

4.8V

4.7V

4.6V

4.5V

4.4V

4.3V

4.2V

4.1V

4.0V

3.9V

3.8V

3.7V

3.6V

3.5V

3.4V

3.3V

3.2V

3.1V

3.0V

2.9V

2.8V

2.7V

2.6V

2.5V

2.4V

2.3V

EW

EV

EU

ET

ES

ER

EQ

EP

EN

EM

EL

BD4860

BD4859

BD4858

BD4857

BD4856

BD4855

BD4854

BD4853

BD4852

BD4851

BD4850

BD4849

BD4848

BD4847

BD4846

BD4845

BD4844

BD4843

BD4842

BD4841

BD4840

BD4839

BD4838

BD4837

BD4836

BD4835

BD4834

BD4833

BD4832

BD4831

BD4830

BD4829

BD4828

BD4827

BD4826

BD4825

BD4824

BD4823

GW

GV

GU

GT

GS

GR

GQ

GP

GN

GM

GL

GK

GJ

GH

GG

GF

GE

GD

GC

GB

GA

FV

FU

FT

FS

FR

FQ

FP

FN

FM

FL

FK

FJ

FH

FG

FF

BD4960

BD4959

BD4958

BD4957

BD4956

BD4955

BD4954

BD4953

BD4952

BD4951

BD4950

BD4949

BD4948

BD4947

BD4946

BD4945

BD4944

BD4943

BD4942

BD4941

BD4940

BD4939

BD4938

BD4937

BD4936

BD4935

BD4934

BD4933

BD4932

BD4931

BD4930

BD4929

BD4928

BD4927

BD4926

BD4925

BD4924

BD4923

Cm

Ck

Ch

Cg

Cf

Ce

Cd

Cc

Cb

Ca

By

Br

Bp

Bn

Bm

Bk

Bh

Bg

Bf

Be

Bd

Bc

Bb

Ba

Ay

Ar

Ap

An

Am

Ak

Ah

Ag

Af

Ae

Ad

Ac

Ab

Aa

BD48E60

BD48E59

BD48E58

BD48E57

BD48E56

BD48E55

BD48E54

BD48E53

BD48E52

BD48E51

BD48E50

BD48E49

BD48E48

BD48E47

BD48E46

BD48E45

BD48E44

BD48E43

BD48E42

BD48E41

BD48E40

BD48E39

BD48E38

BD48E37

BD48E36

BD48E35

BD48E34

BD48E33

BD48E32

BD48E31

BD48E30

BD48E29

BD48E28

BD48E27

BD48E26

BD48E25

BD48E24

BD48E23

Ff

Fe

Fd

Fc

Fb

Fa

Ey

Er

Ep

En

Em

Ek

Eh

Eg

Ef

Ee

Ed

Ec

Eb

Ea

Dy

Dr

Dp

Dn

Dm

Dk

Dh

Dg

Df

BD49E60

BD49E59

BD49E58

BD49E57

BD49E56

BD49E55

BD49E54

BD49E53

BD49E52

BD49E51

BD49E50

BD49E49

BD49E48

BD49E47

BD49E46

BD49E45

BD49E44

BD49E43

BD49E42

BD49E41

BD49E40

BD49E39

BD49E38

BD49E37

BD49E36

BD49E35

BD49E34

BD49E33

BD49E32

BD49E31

BD49E30

BD49E29

BD49E28

BD49E27

BD49E26

BD49E25

BD49E24

BD49E23

EK

EJ

EH

EG

EF

EE

ED

EC

EB

EA

DV

DU

DT

DS

DR

DQ

DP

DN

DM

DL

DK

DJ

De

Dd

Dc

Db

Da

Cy

Cr

DH

DG

DF

DE

DD

FE

FD

Cp

Cn

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Datasheet

BD48xxx series BD49xxx series

●Lineup - continued

Table 2. Lineup for SSOF3(1pin GND) and SSOP3(3pin GND) Package

Package Type

Output Type

SSOP3(1pin GND)

Open Drain

SSOP3(3pin GND)

Open Drain

CMOS

Part Number

CMOS

Detection

Voltage

Part Number

Marking

Cm

Ck

Ch

Cg

Cf

Ce

Cd

Cc

Cb

Ca

By

Br

Bp

Bn

Bm

Bk

Bh

Bg

Bf

Be

Bd

Bc

Bb

Ba

Ay

Ar

Ap

An

Am

Ak

Ah

Ag

Af

Ae

Ad

Ac

Ab

Aa

6.0V

5.9V

5.8V

5.7V

5.6V

5.5V

5.4V

5.3V

5.2V

5.1V

5.0V

4.9V

4.8V

4.7V

4.6V

4.5V

4.4V

4.3V

4.2V

4.1V

4.0V

3.9V

3.8V

3.7V

3.6V

3.5V

3.4V

3.3V

3.2V

3.1V

3.0V

2.9V

2.8V

2.7V

2.6V

2.5V

2.4V

2.3V

Ff

Fe

Fd

Fc

Fb

Fa

Ey

Er

Ep

En

Em

Ek

Eh

Eg

Ef

Ee

Ed

Ec

Eb

Ea

Dy

Dr

Dp

Dn

Dm

Dk

Dh

Dg

Df

Kb

Ka

Hy

Hr

Hp

Hn

Hm

Hk

Hh

Hg

Hf

He

Hd

Hc

Hb

Ha

Gy

Gr

Gp

Gn

Gm

Gk

Gh

Gg

Gf

Np

Nn

Nm

Nk

Nh

Ng

Nf

Ne

Nd

Nc

Nb

Na

My

Mr

Mp

Mn

Mm

Mk

Mh

Mg

Mf

Me

Md

Mc

Mb

Ma

Ky

Kr

BD48K60

BD48K59

BD48K58

BD48K57

BD48K56

BD48K55

BD48K54

BD48K53

BD48K52

BD48K51

BD48K50

BD48K49

BD48K48

BD48K47

BD48K46

BD48K45

BD48K44

BD48K43

BD48K42

BD48K41

BD48K40

BD48K39

BD48K38

BD48K37

BD48K36

BD48K35

BD48K34

BD48K33

BD48K32

BD48K31

BD48K30

BD48K29

BD48K28

BD48K27

BD48K26

BD48K25

BD48K24

BD48K23

BD49K60

BD49K59

BD49K58

BD49K57

BD49K56

BD49K55

BD49K54

BD49K53

BD49K52

BD49K51

BD49K50

BD49K49

BD49K48

BD49K47

BD49K46

BD49K45

BD49K44

BD49K43

BD49K42

BD49K41

BD49K40

BD49K39

BD49K38

BD49K37

BD49K36

BD49K35

BD49K34

BD49K33

BD49K32

BD49K31

BD49K30

BD49K29

BD49K28

BD49K27

BD49K26

BD49K25

BD49K24

BD49K23

BD48L60

BD48L59

BD48L58

BD48L57

BD48L56

BD48L55

BD48L54

BD48L53

BD48L52

BD48L51

BD48L50

BD48L49

BD48L48

BD48L47

BD48L46

BD48L45

BD48L44

BD48L43

BD48L42

BD48L41

BD48L40

BD48L39

BD48L38

BD48L37

BD48L36

BD48L35

BD48L34

BD48L33

BD48L32

BD48L31

BD48L30

BD48L29

BD48L28

BD48L27

BD48L26

BD48L25

BD48L24

BD48L23

BD49L60

BD49L59

BD49L58

BD49L57

BD49L56

BD49L55

BD49L54

BD49L53

BD49L52

BD49L51

BD49L50

BD49L49

BD49L48

BD49L47

BD49L46

BD49L45

BD49L44

BD49L43

BD49L42

BD49L41

BD49L40

BD49L39

BD49L38

BD49L37

BD49L36

BD49L35

BD49L34

BD49L33

BD49L32

BD49L31

BD49L30

BD49L29

BD49L28

BD49L27

BD49L26

BD49L25

BD49L24

BD49L23

Ge

Gd

Gc

Gb

Ga

Fy

Kp

Kn

Km

Kk

Kh

Kg

Kf

Ke

Kd

Kc

De

Dd

Dc

Db

Da

Cy

Cr

Fr

Fp

Fn

Fm

Fk

Fh

Fg

Cp

Cn

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Datasheet

BD48xxx series BD49xxx series

●Absolute Maximum Ratings

Parameter

Symbol

Limits

-0.3 to +10

GND-0.3 to +10

GND-0.3 to V_DD+0.3

70

Unit

Power Supply Voltage

V_DD-GND

V

Nch Open Drain Output

Output Voltage

Output Current

V_OUT

Io

V

CMOS Output

mA

*1*4

*2*4

*3*4

SSOP5

SSOP3

VSOF5

540

Power

Pd

700

mW

Dissipation

210

Operating Temperature

Topr

Tstg

-40 to +105

-55 to +125

°C

Ambient Storage Temperature

*1 Reduced by 5.4mW/°C when used over 25°C.

*2 Reduced by 7.0mW/°C when used over 25°C.

*3 Reduced by 2.1mW/°C when used over 25°C.

*4 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board).

●Electrical Characteristics (Unless Otherwise Specified, Ta=-40 to 105°C)

Limit

Typ.

Parameter

Symbol

Condition

Unit

Min.

V_DET(T)

×0.99

2.475

2.418

2.404

2.970

2.901

2.885

3.267

3.191

3.173

4.158

4.061

4.039

4.752

4.641

4.616

Max.

V_DET(T)

×1.01

2.525

2.584

2.597

3.030

3.100

3.117

3.333

3.410

3.428

4.242

4.341

4.364

4.848

4.961

4.987

*1

RL=470kΩ, VDD=H‰L

V_DET(T)

Ta=+25°C

2.5

Ta=-40°C to 85°C

Ta=85°C to 105°C

Ta=+25°C

-

VDET=2.5V

-

3.0

Ta=-40°C to 85°C

Ta=85°C to 105°C

Ta=+25°C

-

VDET=3.0V

VDET=3.3V

VDET=4.2V

VDET=4.8V

-

3.3

Detection Voltage

V_DET

V

Ta=-40°C to 85°C

Ta=85°C to 105°C

Ta=+25°C

-

4.2

Ta=-40°C to 85°C

Ta=85°C to 105°C

Ta=+25°C

-

4.8

-

Ta=-40°C to 85°C

Ta=85°C to 105°C

-

*2

CL=100pF RＬ=100kΩ

Vout=GND‰50%

Output Delay Time “L‰H”

tPLH

ICC1

-

100

µs

V_DET=2.3-3.1V

V_DET=3.2-4.2V

V_DET=4.3-5.2V

V_DET=5.3-6.0V

V_DET=2.3-3.1V

V_DET=3.2-4.2V

V_DET=4.3-5.2V

V_DET=5.3-6.0V

-

0.51

0.56

0.60

0.66

0.75

0.80

0.85

0.90

-

1.53

1.68

1.80

1.98

2.25

2.40

2.55

2.70

-

*1

Circuit Current when ON

VDD=V_DET-0.2V

µA

-

*1

Circuit Current when OFF

Operating Voltage Range

ICC2

VDD=V_DET+2.0V

µA

V

-

VOL≤0.4V, Ta=25 to 105°C, RL=470kΩ

0.95

1.20

VOPL

VOL≤0.4V, Ta=-40 to 25°C, RL=470kΩ

-

V_DET(T) : Standard Detection Voltage(2.3V to 6.0V, 0.1V step)

R_L: Pull-up resistor to be connected between VOUT and power supply.

C_L: Capacitor to be connected between VOUT and GND.

Design Guarantee. (Outgoing inspection is not done on all products.)

*1 Guaranteed at Ta=25°C.

*2 tPLH:VDD=(V_DETtyp.-0.5V)‰(V_DETtyp.+0.5V)

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Datasheet

BD48xxx series BD49xxx series

●Electrical Characteristics (Unless Otherwise Specified, Ta=-40 to 105°C) - continued

Limit

Parameter

Symbol

VOL

Condition

Unit

Min.

Typ.

Max.

VDD=1.5V, ISINK = 0.4 mA, VDET=2.3-6.0V

VDD=2.4V, ISINK = 2.0 mA, VDET=2.7-6.0V

-

0.5

‘Low’Output Voltage (Nch)

V

0.5

VDD=4.8V, ISOURCE=0.7 mA, VDET(2.3V to 4.2V) VDD-0.5

VDD=6.0V, ISOURCE=0.9 mA,VDET(4.3V to 5.2V) VDD-0.5

VDD=8.0V, ISOURCE=1.1 mA,VDET(5.3V to 6.0V) VDD-0.5

-

‘High’Output Voltage (Pch)

(BD49Exxx Series)

VOH

Leak Current when OFF

(BD48xxx Series)

*1

I_leak

VDD=VDS=10V

-

0.1

µA

Detection Voltage

Ta=-40°C to 105°C

V_DET/∆T

±100

±360

ppm/°C

V

Temperature coefficient

(Designed Guarantee)

Hysteresis Voltage

∆V_DETVDD=L‰H‰L, RL=470kΩ

V_DET×0.03 V_DET×0.05 V_DET×0.08

V_DET(T) : Standard Detection Voltage(2.3V to 6.0V, 0.1V step)

R_L: Pull-up resistor to be connected between VOUT and power supply.

C_L: Capacitor to be connected between VOUT and GND.

Design Guarantee. (Outgoing inspection is not done on all products.)

*1 Guaranteed at Ta=25°C.

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Datasheet

BD48xxx series BD49xxx series

●Block Diagrams

VDD

VOUT

Vref

GND

Fig.1 BD48xxx series

VDD

VOUT

Vref

GND

Fig.2 BD49xxx series

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Datasheet

BD48xxx series BD49xxx series

●Typical Performance Curves

20

15

10

5

2.0

【BD48x42】

【BD4842G/FVE】

BD4842G/FVE

【BD48x42】

【

】

【BD49x42】

1.5

1.0

0.5

0.0

V_DD=2.4V

V_DD=1.2V

0

0.0

0.5

1.0

1.5

2.0

2.5

0

1

2

3

4

5

6

7

8

9

10

DRAIN-SOURCE VOLTAGE V_DS[V]

V_DDSUPPLY VOLTAGE V_DD[V]

：

Fig.3 Circuit Current

Fig.4 “Low” Output Current

45

9

8

7

6

5

4

3

2

1

0

BD4942G/FVE

BD4842G/FVE

【BD48x42】

40

35

30

25

20

15

10

5

【

】

【BD49x42】

【

】

【BD49x42】

V^DD=8.0V

Ta=25

℃

V

DD=6.0V

^DD=4.8V

V

Ta=25

℃

0

1

2

3

4

5

6

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5

DRAIN-SOURCE VOLTAGE ： VDS[V]

V_DDSUPPLY VOLTAGE V_DD[V]

：

Fig.5 “High” Output Current

Fig.6 I/O Characteristics

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Datasheet

BD48xxx series BD49xxx series

●Typical Performance Curves – continued

1.0

5.4

5.0

4.6

4.2

3.8

3.4

BD4842G/FVE

【BD48x42】

x

【

】

【BD48x42】

BD48x42x

BD4842G/FVE

【

】

【

【BD49x42】

0.8

0.6

0.4

0.2

0.0

【BD49x42】

Low to High(V_DET+∆V_DET

）

High to Low(V_DET

）

～

3.0

0

0.5

1

1.5

2

2.5

-40

0

40

80

SUPPLY VOLTAGE : [V]

TEMPERATURE_:

Ta[℃]

Fig.7 Operating Limit Voltage

Fig.8 Detection Voltage

Release Voltage

1.5

1.0

0.5

0.0

1.5

1.0

0.5

0.0

BD48x42x

BD4842G/FVE

BD48x42x

【

】

【【

】】

【

【BD48x42】

【BD49x42】

-40 -20

TEMPERATURE Ta[ ]

℃

0

20 40 60 80 100

-40 -20

0

20 40 60 80 100

TEMPERATURE Ta[

]

℃

：

Fig.10 Circuit Current when OFF

Fig.9 Circuit Current when ON

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Datasheet

BD48xxx series BD49xxx series

●Typical Performance Curves – continued

1.5

BDB4D84482xG4/2FxVE

【

】

【

【BD48x42】

【BD49x42】

1.0

0.5

0.0

-40 -20

0

20 40 60 80 100

TEMPERATURE Ta[

]

℃

：

Fig.11 Operating Limit Voltage

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BD48xxx series BD49xxx series

●Application Information

Explanation of Operation

For both the open drain type (Fig.12) and the CMOS output type (Fig.13), the detection and release voltages are used as

threshold voltages. When the voltage applied to the V_DDpins reaches the appropriate threshold voltage, the V_OUTterminal

voltage switches from either “High” to “Low” or from “Low” to “High”. Please refer to the Timing Waveform and Electrical

Characteristics for information on hysteresis.

Because the BD48xxx series uses an open drain output type, it is necessary to connect a pull-up resistor to V_DDor another

power supply if needed [The output “High” voltage (V_OUT) in this case becomes V_DDor the voltage of the other power

supply].

V

DD

V

DD

R1

R

L

Vref

Q2

Q1

V

OUT

V

OUT

R2

R3

R2

R3

Q1

GND

Fig.12 (BD48xxx series Internal Block Diagram)

Fig.13 (BD49xxx series Internal Block Diagram)

Reference Data

Examples of Leading (t_PLH) and Falling (t_PHL) Output

Part Number

BD48x45

t_PLH(µs)

39.5

t_PHL(µs)

87.8

BD49x45

32.4

52.4

V_DD=4.3V‰5.1V

V_DD=5.1V‰4.3V

*These data are for reference only.

The figures will vary with the application, so please check actual operating conditions before use.

Timing Waveform

Example: the following shows the relationship between the input voltages V_DDand the output voltage V_OUTwhen the

input power supply voltage V_DDswept up and down (the circuits are those in Fig.12 and 13).

1

When the power supply is turned on, the output is unstable

VDD

from after over the operating limit voltage (VOPL) until tPHL.

Therefore it is possible that the reset signal is not outputted when

the rise time of V_DDis faster than tPHL.

VDET+ΔVDET

⑤

VDET

2

When V_DDis greater than V_OPLbut less than the reset release

VOPL

0V

voltage (V_DET+ ∆V_DET), the output voltages will switch to Low.

3

If V_DDexceeds the reset release voltage (V_DET+ ∆V_DET), then

VOUT

V_OUTswitches from L to H.

VOH

VOL

4

If V_DDdrops below the detection voltage (V_DET) when the power

tPLH

tPHL

tPLH

tPHL

supply is powered down or when there is a power supply

fluctuation, V_OUTswitches to L (with a delay of t_PHL).

5

The potential difference between the detection voltage and the

①

②

③

④

release voltage is known as the hysteresis width (∆V_DET). The

system is designed such that the output does not toggle with

power supply fluctuations within this hysteresis width, preventing

malfunctions due to noise.

Fig.14 Timing Waveform

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Datasheet

BD48xxx series BD49xxx series

●Circuit Applications

1) Examples of a common power supply detection reset circuit.

Application examples of BD48xxx series (Open Drain

output type) and BD49xxx series (CMOS output type)

are shown on the left.

DD1

V

DD2

V

L

R

Micro

controller

CASE1: Power supply of the microcontroller (V_DD2

)

BD48xxx

ST

R

differs from the power supply of the reset detection IC

(V_DD1).

C_L

Use an open drain output type (BD48xxx) device with a

load resistance R_Lattached as shown in figure 15.

capacitor is for

noise filtering

(

）

GND

CASE2: Power supply of the microcontroller (V_DD1) is

same as the power supply of the reset detection IC

(V_DD1).

Fig.15 Open Drain Output Type

Use a CMOS output type (BD49xxx) device or an open

drain device with a pull up resistor between output and

VDD1.

DD1

V

Micro

controller

When a capacitance C_Lfor noise filtering is connected to

the V_OUTpin (the reset signal input terminal of the

microcontroller), please take into account the rise and

fall waveform of the output voltage (V_OUT).

BD49xxx

R

ST

C_L

capacitor is for

(

filtering

）

The Electrical characteristics were measured using

GND

R_L= 470kΩ and C_L= 100pF.

Fig.16 CMOS Output Type

2) The following is an example of a circuit application in which an OR connection between two types of detection voltage

resets the microcontroller.

VDD1

VDD2

VDD3

RL

Microcontroller

RST

BD48xxx

GND

Fig.17

To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain

output type (BD48xxx series) to the microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller

(V_DD3) as shown in Fig. 17. By pulling-up to V_DD3, output “High” voltage of micro-controller power supply is possible.

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BD48xxx series BD49xxx series

3) Examples of the power supply with resistor dividers

In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow

into the circuit when the output level switches from “High” to “Low” or vice versa. In-rush current is a sudden surge of

current that flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow

may cause malfunction in the systems operation such as output oscillations, etc.

V1

R2

I1

VDD

BD48xxx

BD49xxx

R1

VOUT

CIN

CL

GND

Fig.18

When an in-rush current (I1) flows into the circuit (Refer to Fig. 18) at the time when output switches from “Low” to “High”,

a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the

VDD voltage drops below the detection voltage, the output will switch from “High” to “Low”. While the output voltage is at

“Low” condition, in-rush current will stop flowing and the voltage drop will be reduced. As a result, the output voltage will

switches again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will

result to oscillation.

IDD

Through Current

VDD

0

VDET

Fig.19 Current Consumption vs. Power Supply Voltage

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BD48xxx series BD49xxx series

●Operational Notes

1) Absolute maximum ratings

Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit

between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such

as adding a fuse, in case the IC is operated over the absolute maximum ratings.

2) Ground Voltage

The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no

pins are at a voltage below the ground pin at any time, even during transient condition.

3) Recommended operating conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

4) Bypass Capacitor for Noise Rejection

To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND.

Be careful when using extremely big capacitor as transient response will be affected.

5) Short between pins and mounting errors

Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong

orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.

6) Operation under strong electromagnetic field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

7) The V_DDline impedance might cause oscillation because of the detection current.

8) A V_DDto GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.

9) Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD)

condition.

10) External parameters

The recommended parameter range for R_Lis 10kΩ to 1MΩ. There are many factors (board layout, etc) that can affect

characteristics. Please verify and confirm using practical applications.

11) Power on reset operation

Please note that the power on reset output varies with the V_DDrise time. Please verify the behavior in the actual

operation.

12) Testing on application boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

13) Rush current

When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to

the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special

consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.

14) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might

cause unexpected operations. Application values in these conditions should be selected carefully. If 10MΩ leakage is

assumed between the C_Tterminal and the GND terminal, 1MΩ connection between the CT terminal and the V_DD

terminal would be recommended. Also, if the leakage is assumed between the Vout terminal and the GND terminal, the

pull up resistor should be less than 1/10 of the assumed leak resistance.

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Notice

●General Precaution

1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

ROHM’s Products against warning, caution or note contained in this document.

2) All information contained in this document is current as of the issuing date and subject to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales

representative.

●Precaution on using ROHM Products

1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

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a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3) Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4) The Products are not subject to radiation-proof design.

5) Please verify and confirm characteristics of the final or mounted products in using the Products.

6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8) Confirm that operation temperature is within the specified range described in the product specification.

9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Notice - Rev.004

Daattaasshheeeett

●Precaution for Mounting / Circuit board design

1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

●Precautions Regarding Application Examples and External Circuits

1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2) You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

●Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

●Precaution for Storage / Transportation

1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

●Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

●Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

●Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

●Precaution Regarding Intellectual Property Rights

1) All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Notice - Rev.004

Daattaasshheeeett

●Other Precaution

1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

5) The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice - Rev.004


型号：	BD48E28G
厂家：	ROHM
描述：	Standard CMOS Voltage Detector IC
文件：	总18页 (文件大小：433K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD48E28G [ROHM]

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