BD48W00G-C [ROHM]

ROHM的窗口电压检测IC是采用CMOS工艺实现了高精度和低消耗电流的CMOS RESET IC系列。输出形式为Nch开漏，Dual输出。另外，还可通过外置电阻自由调整检测电压。;


型号：	BD48W00G-C
厂家：	ROHM
描述：	ROHM的窗口电压检测IC是采用CMOS工艺实现了高精度和低消耗电流的CMOS RESET IC系列。输出形式为Nch开漏，Dual输出。另外，还可通过外置电阻自由调整检测电压。
文件：	总22页 (文件大小：1440K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Datasheet

Voltage Detector (Reset) IC Series for Automotive Application

Dual Output ADJ Type

Window Voltage Detector (Reset) IC

BD48W00G-C

General Description

Key Specifications

ROHM's window voltage detector ICs are highly

accurate, with low current consumption feature that

uses CMOS process. It has dual N-channel open drain

output. Detection voltage can be control by external

resistors.

◼ Over Voltage Detection:

◼ Under Voltage Detection:

◼ Ultra-Low Current Consumption:

1.20 V (Typ)

3 μA (Typ)

Special Characteristics

Features

◼ AEC-Q100 Qualified^{(Note 1)}

◼ Detection Voltage Accuracy:

±2.5 % (-40 °C to +125 °C)

◼ Functional Safety Supportive Automotive Products

◼ Under and Over Voltage Monitor

◼ Free Detection Voltage Setting by External Resistors

◼ Nch Open Drain Output

Package

W (Typ) x D (Typ) x H (Max)

2.9 mm x 2.8 mm x 1.25 mm

SSOP6:

◼ Very Small, Lightweight and Thin Package

◼ SSOP6 Package is Similar to SOT-23-6 (JEDEC)

(Note 1) Grade 1

Application

All Automotive Devices that Requires Voltage Detection

Typical Application Circuit

V_DD1

VDD2

V_SENSE

R_L

R₁

VDD

UVIN

UVB

OVB

R_ST

Microcontroller

R₂

C_I

OVIN

GND

C_I

R₃

GND

〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.

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Pin Configuration

SSOP6

TOP VIEW

OVIN

GND OVB

UVIN VDD

UVB

Pin Description

Pin No.

Pin Name

Function

UVIN

VDD

UVB

OVB

GND

OVIN

Under voltage input

Power supply voltage

Under voltage detection output pin

Over voltage detection output pin

GND

Over voltage input

Block Diagram

VDD

(Note)

UVB

OVB

UVIN

(Note)

Vref

(Note)

OVIN

(Note)

GND

(Note) Parasitic Diode

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Absolute Maximum Ratings (Ta = 25 °C)

Parameter

Symbol

V_DD

Limit

-0.3 to +7

(GND - 0.3) to +7

Unit

Power Supply Voltage

UVIN Pin Voltage

V_UVIN

V_OVIN

V_UVB

OVIN Pin Voltage

UVB Pin Voltage

V_OVB

I_OUVB

I_OOVB

Tjmax

Tstg

OVB Pin Voltage

UVB Pin Output Current

OVB Pin Output Current

Maximum Junction Temperature

Storage Temperature Range

+150

°C

-55 to +150

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing

board size and copper area so as not to exceed the maximum junction temperature rating.

Thermal Resistance^{(Note 1)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 3)}

2s2p^{(Note 4)}

SSOP6

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

376.5

185.4

°C/W

Ψ_JT

(Note 1) Based on JESD51-2A (Still-Air).

(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface

of the component package.

(Note 3) Using a PCB board based on JESD51-3.

(Note 4) Using a PCB board based on JESD51-7.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3 mm x 76.2 mm x 1.57 mmt

Top

Copper Pattern

Thickness

70 μm

Footprints and Traces

Layer Number of

Measurement Board

Material

FR-4

Board Size

114.3 mm x 76.2 mm x 1.6 mmt

2 Internal Layers

4 Layers

Top

Copper Pattern

Bottom

Copper Pattern

74.2 mm x 74.2 mm

Thickness

70 μm

Copper Pattern

Thickness

35 μm

Thickness

70 μm

Footprints and Traces

74.2 mm x 74.2 mm

Recommended Operating Conditions

Parameter

Symbol

V_DD

Min

1.6

Typ

Max

6.0

Unit

Operating Supply Voltage

UVIN Pin Voltage

V_UVIN

V_OVIN

Topr

6.0

OVIN Pin Voltage

6.0

Operating Temperature

-40

+25

+125

°C

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Electrical Characteristics (Unless otherwise specified Ta = -40 °C to +125 °C, V_DD= 1.6 V to 6.0 V)

Limit

Parameter

Symbol

V_IT-

Condition

Unit

Min

Typ

Max

1.23

Under Voltage

1.17

1.20

V_UVIN= H→L

V_OVIN= L→H

Detection Voltage

Over Voltage

1.17

1.20

1.23

V_IT+

Detection Voltage

Hysteresis Voltage

Circuit Current

0.5

1.0

1.5

V_HYS

I_DD

μA

UVB Operating

Voltage Range^{(Note 1)}

V_OPLUVBV_OLUVB≤ 0.4 V, RL = 100 kΩ

V_OPLOVBV_OLOVB≤ 0.4 V, RL = 100 kΩ

1.6

OVB Operating

Voltage Range^{(Note 1)}

V_UVIN< V_IT-, V_DD= 1.6 V, I_SINK= 1.0 mA

0.4

UVB “Low” Output Voltage

OVB “Low” Output Voltage

V_OLUVB

V_OLOVB

t_PLHUVB

t_PLHOVB

t_PHLUVB

t_PHLOVB

V_UVIN< V_IT-, V_DD= 2.4 V, I_SINK= 2.0 mA

V_OVIN> V_IT+, V_DD= 1.6 V, I_SINK= 1.0 mA

V_OVIN> V_IT+, V_DD= 2.4 V, I_SINK= 2.0 mA

UVB L→H Propagation

Delay Time

V_UVB= GND→0.9 x V_DD, V_DD= 3.0 V

V_OVB= GND→0.9 x V_DD, V_DD= 3.0 V

V_UVB= V_DD→0.1 x V_DD, V_DD= 3.0 V

V_OVB= V_DD→0.1 x V_DD, V_DD= 3.0 V

300

250

μs

OVB L→H Propagation

Delay Time

UVB H→L Propagation

Delay Time

OVB H→L Propagation

Delay Time

R_L: Pull-up resistor connected between UVB, OVB and power supply.

(Note 1) When V_DDis less than V_OPLUVB, V_OPLOVB, outputs are unstable.

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Typical Performance Curves

Figure 2. Circuit Current vs Temperature

(VDD = UVIN = OVIN)

Figure 1. Circuit Current vs Operating Supply

Voltage (VDD = UVIN = OVIN)

Figure 4. Detection Voltage vs Temperature

(V_DD= 3 V)

Figure 3. Detection Voltage vs Operating Supply

Voltage (Ta = 25 °C)

(Note) The above data is measurement value of typical sample, it is not guaranteed.

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Typical Performance Curves – continued

Figure 5. Hysteresis Voltage vs Operating

Supply Voltage (Ta = 25 °C)

Figure 6. Hysteresis Voltage vs Temperature

(V_DD= 3 V)

Figure 7. Operating Voltage vs Temperature

Figure 8. “Low” Output Current vs Drain-Source

Voltage (Ta = 25 °C)

(Note) The above data is measurement value of typical sample, it is not guaranteed.

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Typical Performance Curves – continued

Figure 9. “Low” Output Current vs Temperature

(V_DS= 0.4 V)

Figure 10. L→H Propagation Delay Time vs

Operating Supply Voltage

(Ta = 25 °C)

Figure 11. L→H Propagation Delay Time vs

Figure 12. H→L Propagation Delay Time vs

Operating Supply Voltage

(Ta = 25 °C)

Temperature

(V_DD= 3 V)

(Note) The above data is measurement value of typical sample, it is not guaranteed.

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Typical Performance Curves – continued

Figure 13. H→L Propagation Delay Time vs

Temperature (V_DD= 3 V)

(Note) The above data is measurement value of typical sample, it is not guaranteed.

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Timing Chart

The following shows the change of the output voltages when operating supply voltage (V_DD) and SENSE pin Voltage (V_SENSE

)

sweep.

V_DD

V_SENSE

VDD

R_L

R₁

C_VDD

UVB

R_L

UVIN

C_I

R₂

R₃

Vref

OVB

OVIN

C_I

C_L

GND

C_L

Figure 14. Set-up diagram

V_DD

V_OPL: <1.6 V

V_SENSE

V_MON(OV)

V_MON(OVREL)

V_MON(UV)

V_MON(UVREL)

V_UVB

t_PLH

t_PHL

V_OVB

t_PLH

t_PHL

Figure 15. Timing Chart

Operating Conditions Explanation

1. The Output Voltage (V_OVBand V_UVB) becomes unstable until V_DDexceeds the Operating Voltage Range (V_OPL).

2. When V_DDexceeds the Operating Voltage Range (V_OPL) but V_SENSEis the Under Voltage Detection Voltage (V_MON(UV)

)

or less, V_UVBchanges to “L” and V_OVBchanges to “H”. However, this change depends on the V_UVBand V_OVBrise time

when the power supply starts up, so thorough confirmation is required.

3. When V_SENSErises and exceeds the Under Voltage Release Voltage (V_MON(UVREL)), delay time (t_PLH) happens and V_UVB

switches from “L” to “H”.

4. Both Under Voltage and Over Voltage are undetected so V_UVBand V_OVBremains “H”.

5. When V_SENSErises further and exceeds the Over Voltage Detection Voltage (V_MON(OV)), delay time (t_PHL) happens and

V_OVBchanges from “H” to “L” and state becomes Over Voltage Detection.

6. V_SENSEis V_MON(OV)or more so V_UVBremains “H” and V_OVBremains “L”.

7. When V_SENSEdrops and falls below the Over Voltage Release Voltage (V_MON(OVREL)), delay time (t_PLH) happens and V_OVB

switches from “L” to “H”.

8. When V_SENSEdecreases further and falls below the Under Voltage Detection Voltage (V_MON(UV)), delay time (t_PHL

)

happens and V_UVBchanges from “H” to “L” and state becomes Under Voltage Detection.

(Note) The potential difference between the detection voltage and the release voltage is known as the Hysteresis Voltage width. The system is designed such

that the output will not toggle with power supply fluctuations within this hysteresis width, preventing malfunctions due to noise.

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Application Information

Operation Description

The detection and release voltage are used as threshold voltages. When the voltage applied to the UVIN and OVIN pins reaches

the applicable threshold voltage, the V_OVBand V_UVBlevels switch from either “H” to “L” or “L” to “H”. Because the BD48W00G-

C uses an open drain output type, it is necessary to connect a pull-up resistor to V_DDor another power supply. (In this case, the

output “H” voltage becomes V_DDor the voltage of another power supply).

Setting of External Resistors

Detection voltage of BD48W00G-C can be control by external resistors. The resistance value of R₁, R₂and R₃can be determined

by the following formula. However, determine external resistance value so that the current flowing through external resistors is

10 μA or more. In addition, when using, ensure that confirmation of the real function was carried out.

푅_푇= 푅₁+ 푅₂+ 푅₃

푅_푇

푅₃=

× 푉

퐼푇ꢁ

푉_{푀푂푁(푂ꢀ)}

푅_푇

푅₂=

× 푉

ꢂ 푅₃

퐼푇−

푉_{푀푂푁(푈ꢀ)}

where:

R_Tis the total value of external resistors.

V_MON(OV)is the target value of over voltage detection voltage.

V_MON(UV)is the target value of under voltage detection voltage.

Example No. 1:

V_MON(UV)= 2.5 V, V_MON(OV)= 3.5 V (R_T= 250 kΩ)

ꢃ50 × ꢄ0³

푅₃=

푅₂=

× ꢄ.ꢃ = 85.7 kΩ

ꢅ.5

ꢃ50 × ꢄ0³

ꢃ.5

× ꢄ.ꢃ ꢂ 85.7 × ꢄ0³= ꢅ4.ꢅ kΩ

푅₁= ꢃ50 × ꢄ0³ꢂ 85.7 × ꢄ0³ꢂ ꢅ4.ꢅ × ꢄ0³= ꢄꢅ0.0 kΩ

Bypass Capacitor for Noise Rejection

For the stable operation of the IC, put capacitor 0.1 μF or more between the VDD and GND pins and 100 pF or more between

UVIN, OVIN and GND and connect it closer to the pin as possible. When using extremely big capacitors, the transient response

speed becomes slow so check thoroughly.

External Parameters

The recommended value of pull-up resistance value is 50 kΩ to 1 MΩ. Since the changes are brought by many factors (circuit

configuration, board layout, etc.) when using, ensure that confirmation of the real function was carried out. In addition, this IC

has high impedance design. So depending on the condition of use, this may be affected by unexpected leak route due to the

uncleanness of PCB surface. For example, if a 10 MΩ leakage is assumed between the output and GND pins, it is recommended

to set the value of pull-up resistor to 1/10 or less of the impedance of assumed leakage route.

Behavior at less than the Operating Voltage Range

When V_DDfalls less than the operating voltage range, output will be undefined. When output is connected to pull-up voltage,

output will be equivalent to pull-up voltage.

Precautions when Steep Power Supply Rise

In case of a steep power supply rise, the output may be unstable even if V_DDexceeds the operating voltage range. This is due

to the undefined output when the supply is less than the operating voltage range of the IC. When this waveform affects the

application, make the rise time slower by attaching capacitor to VDD (C_VDD). Make the V_DDRise Time 1 ms or more.

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Application Examples

(1) Monitoring the power supply input pin of the IC

The following shows example of applications when monitoring the power supply input pin (V_DD) of the IC. The external

resistors are connected between VDD and GND.

V_DD

R_L

R₁

VDD

UVIN

UVB

OVB

To a reset of the system

R₂

R₃

C_I

OVIN

GND

C_I

C_L

GND

(2) Monitoring the Voltage Other Than the power supply input pin of the IC

The following shows example of applications when monitoring the voltage other than V_DD. The external resistors are

connected between V_SENSEand GND. The voltage exceeding maximum rating of V_DDcan be detected by external resistors

setting. Set UVIN and OVIN so that it does not exceed absolute maximum rating voltage.

V_DD

V_SENSE

R_L

R₁

VDD

UVIN

UVB

OVB

To a reset of the system

R₂

R₃

C_I

OVIN

GND

C_I

C_L

GND

When connecting a capacitor C_Lfor noise elimination and setting the output delay time to the output pin, the waveform is dull

during rising and falling of the output so use after confirmation that there is no problem.

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Application Examples - continued

(3) Examples of the Power Supply with Resistor Dividers

The following shows example of applications of a resistor divider circuit in applications which the resistor connected to the

power supply voltage (V_DD) of an IC. In these applications, when the output logic changes its state, an Inrush current will flow

suddenly into the circuit. This current flow may cause malfunction in the systems operation such as output oscillations, etc.

The recommended value of R_Ais 4.7 kΩ or less, and C_VDDis 0.1 μF or more. (Inrush current will flow suddenly from the power

supply (VDD) to GND when the output level switches to “H” or “L”.)

V_IN

(Note 1)

R_A

I_DD

(R_A≤ 4.7 kΩ)

I₁

V_DD

R_B1

R_B2

R_L

V_UVIN

Inrush current

V_UVB

(Note 1)

C_VDD

C_I

(C_VDD≥ 0.1 µF)

V_OVB

C_I

V_OVIN

C_L

GND

R_B3

V_DD

V_IT

Figure 16. Resistor Divider Connection Application

Figure 17. Current Consumption vs V_DDVoltage

(Note 1) The circuit example mentioned above does not guarantee successful operation.

Perform thorough evaluation using the actual application and set countermeasures.

For example, during low voltage detection release, a voltage drop [Inrush current (I₁)] x [input resistor (R_A)] is caused by the

Inrush current when output changes from “L” to “H”, and causes the input voltage to drop. When the input voltage drops and

falls below the detection voltage, the output will switch from “H” to “L”. At this time, the Inrush current stops flowing through

output “L”, and the voltage drop disappears. As a result, the output switches from “L” to “H”, which again causes the Inrush

current to flow and the voltage to drop. This operation repeats and leads to oscillation. In addition, note that the same

phenomenon occurs during over voltage detection. Depending on the application set-up, there are times that V_UVINvoltage

is always below the Release Voltage because of the effect of Inrush current as shown follows.

Voltage

V_IN

ΔV_DROP: proportional to Inrush Current x R_A

V_UVIN

V_IT-+ V_HYS

V_IT-

Hysteresis Voltage (V_HYS

)

Figure 18. V_UVINDrop Caused by Inrush Current

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Application Examples - continued

Considerations on Input and Output Capacitor

It is suggested to use capacitors between the input pin and GND, and the output pin and GND, which is positioned as near

as possible to the pins. The capacitor between the input pin and GND is effective when the power supply impedance

increases or when the wiring is long. A large capacitor between the output pin and GND improves stability and output load

characteristics. Check the state of mounting. In addition, the ceramic capacitor deviates and has temperature characteristics

and AC bias characteristics in general. Furthermore, depending on the usage, the capacitance value decreases over time.

It is recommended that ceramic capacitor to use is decided after gathering detailed data information by consulting brand

manufacturers.

10 V withstand voltage

B1 characteristics

-10

10 V withstand voltage

B characteristics

-20

-30

6.3 V withstand voltage

B characteristics

10 V withstand voltage

-40

F characteristics

-50

-60

4 V withstand voltage

X6S characteristics

-70

-80

-90

-100

DC Bias Voltage [V]

Figure 19. Ceramic Capacitance Change vs DC Bias voltage

(Characteristic example)

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I/O Equivalence Circuits

Pin No.

Pin Name

Pin Description

Equivalence Circuit

3, 4

Under voltage detection output

UVB

OVB

Over voltage detection output

1, 6

UVIN

OVIN

Under voltage input

Over voltage input

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

6. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing

of connections.

7. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

8. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

9. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power

supply or ground line.

10. Regarding the Input Pin of the IC

In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation

of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.

Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower

than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply

voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages

within the values specified in the electrical characteristics of this IC.

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Operational Notes – continued

11. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

12. Functional Safety

“ISO 26262 Process Compliant to Support ASIL-*”

A product that has been developed based on an ISO 26262 design process compliant to the ASIL level described in

the datasheet.

“Safety Mechanism is Implemented to Support Functional Safety (ASIL-*)”

A product that has implemented safety mechanism to meet ASIL level requirements described in the datasheet.

“Functional Safety Supportive Automotive Products”

A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the

functional safety.

Note: “ASIL-*” is stands for the ratings of “ASIL-A”, “-B”, “-C” or “-D” specified by each product's datasheet.

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Ordering Information

Package

G: SSOP6

Product Rank

C: for Automotive

Packaging and forming

specification

TR: Embossed tape and reel

Marking Diagram

SSOP6 (TOP VIEW)

Part Number Marking

LOT Number

Pin 1 Mark

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TSZ22111 • 15 • 001

TSZ02201-0GAG2G600100-1-2

03.Feb.2023 Rev.003

17/19

BD48W00G-C

Physical Dimension and Packing Information

Package Name

SSOP6

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0GAG2G600100-1-2

03.Feb.2023 Rev.003

18/19

BD48W00G-C

Revision History

Date

Revision

Changes

10.Mar.2021

09.Apr.2021

03.Feb.2023

001

002

003

New Release

Clerical corrections

Page 4 Change symbols of detection voltage

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TSZ22111 • 15 • 001

TSZ02201-0GAG2G600100-1-2

03.Feb.2023 Rev.003

19/19

Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.004

Daattaasshheeeett

General Precaution

1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this document is current as of the issuing date and subject to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales

representative.

3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

BD48W00G-C [ROHM]

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