BD49E37G-M [ROHM]

罗姆的标准型CMOS复位IC系列是高精度、低消耗电流的RESET IC系列。为保证客户可根据应用进行选择，备有输出形式为Nch漏极开路和CMOS输出的2种产品，检测电压为2.3V～6.0V的0.1V阶跃;


型号：	BD49E37G-M
厂家：	ROHM
描述：	罗姆的标准型CMOS复位IC系列是高精度、低消耗电流的RESET IC系列。为保证客户可根据应用进行选择，备有输出形式为Nch漏极开路和CMOS输出的2种产品，检测电压为2.3V～6.0V的0.1V阶跃
文件：	总20页 (文件大小：918K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Datasheet

Voltage Detector IC Series for Automotive

Standard CMOS

Voltage Detector IC

BD48Exxx-M series BD49Exxx-M series

●General Description

●Key Specifications

 Detection voltage:

ROHM’s BD48Exxx-M and BD49Exxx-M series are

highly accurate, low current consumption Voltage

Detector IC series. The line up includes BD48xxx

devices with N-channel open drain output and BD49xxx

devices with CMOS output. The devices are available for

specific detection voltages ranging from 2.3V to 6.0V in

increments of 0.1V.

2.3V to 6.0V (Typ.),

0.1V steps

 High accuracy detection voltage:

 Ultra-low current consumption:

±1.0%

0.9μA (Typ.)

 Operating temperature range:

-40°C to +105°C

●Package

SSOP5:

2.90mm x 2.80mm x 1.25mm

●Features

●Applications



High accuracy detection

Circuits using microcontrollers or logic circuits that

require reset for automotive applications (car

navigation, car audio, meter panel, exterior lamp etc.)

Ultra-low current consumption

Two output types (N-ch open drain and CMOS

output)



Wide Operating temperature range

Very small and low height package

Package SSOP5 is similar to SOT-23-5(JEDEC)

AEC-Q100 Qualified

●Typical Application Circuit

VDD1

VDD2

DD1

Micro

Controller

BD49Exxx-M

Micro

Controller

RST

BD48Exxx-M

Capacitor

for

(

Capacitor for

(

noise filtering

）

noise filtering

）

GND

(CMOS Output type）

BD49Exxx-M series

(Open Drain Output type）

BD48Exxx-M series

○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays

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●Connection Diagram

N.C.

SSOP5

Marking

Lot. No

VOUT VDD GND

TOP VIEW

●Pin Descriptions

SSOP5

PIN No.

Symbol

VOUT

VDD

Function

Reset Output

Power Supply Voltage

GND

N.C.

Unconnected Terminal

N.C.

 Ordering Information

Part

Number

Output Type

48 : Open Drain

49 : CMOS

Reset Voltage Value Package

G : SSOP5

0.1V step

Product Category

Packaging and

23 : 2.3V

M : Automotive Category forming specification

TR : Embossed tape

and reel

60 : 6.0V

SSOP5

−4

2.9 0.2

Tape

Embossed carrier tape

Quantity

3000pcs

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1pin

+0.05

0.13

−0.03

+0.05

−0.04

0.42

0.1

0.95

Direction of feed

Reel

(Unit : mm)

Order quantity needs to be multiple of the minimum quantity.

∗

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●Lineup

Output Type

Open Drain

CMOS

Part Number

Detection Voltage

Part Number

Marking

6.0V

5.9V

5.8V

5.7V

5.6V

5.5V

5.4V

5.3V

5.2V

5.1V

5.0V

4.9V

4.8V

4.7V

4.6V

4.5V

4.4V

4.3V

4.2V

4.1V

4.0V

3.9V

3.8V

3.7V

3.6V

3.5V

3.4V

3.3V

3.2V

3.1V

3.0V

2.9V

2.8V

2.7V

2.6V

2.5V

2.4V

2.3V

BD48E60

BD48E59

BD48E58

BD48E57

BD48E56

BD48E55

BD48E54

BD48E53

BD48E52

BD48E51

BD48E50

BD48E49

BD48E48

BD48E47

BD48E46

BD48E45

BD48E44

BD48E43

BD48E42

BD48E41

BD48E40

BD48E39

BD48E38

BD48E37

BD48E36

BD48E35

BD48E34

BD48E33

BD48E32

BD48E31

BD48E30

BD48E29

BD48E28

BD48E27

BD48E26

BD48E25

BD48E24

BD48E23

BD49E60

BD49E59

BD49E58

BD49E57

BD49E56

BD49E55

BD49E54

BD49E53

BD49E52

BD49E51

BD49E50

BD49E49

BD49E48

BD49E47

BD49E46

BD49E45

BD49E44

BD49E43

BD49E42

BD49E41

BD49E40

BD49E39

BD49E38

BD49E37

BD49E36

BD49E35

BD49E34

BD49E33

BD49E32

BD49E31

BD49E30

BD49E29

BD49E28

BD49E27

BD49E26

BD49E25

BD49E24

BD49E23

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●Absolute Maximum Ratings

Parameter

Symbol

Limits

-0.3 to +10

GND-0.3 to +10

GND-0.3 to V_DD+0.3

Unit

Power Supply Voltage

V_DD-GND

Nch Open Drain Output

Output Voltage

V_OUT

CMOS Output

Output Current

°C

*1*2

Power Dissipation SSOP5

540

Operating Temperature

Topr

Tstg

-40 to +105

-55 to +125

Ambient Storage Temperature

°C

*1 Reduced by 5.4mW/°C when used over 25°C.

*2 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board).

●Electrical Characteristics (Unless Otherwise Specified Ta=-40°C to 105°C)

Limit

Typ.

Parameter

Symbol

Condition

RL=470kΩ, VDD=HL

Unit

Min.

Max.

_DET(T)

×1.01

2.525

2.584

2.597

3.030

3.100

3.117

3.333

3.410

3.428

4.242

4.341

4.364

4.848

4.961

4.987

V_DET(T)

×0.99

2.475

2.418

2.404

2.970

2.901

2.885

3.267

3.191

3.173

4.158

4.061

4.039

4.752

4.641

4.616

Ta=+25°C

2.5

VDET=2.5V

VDET=3.0V

VDET=3.3V

VDET=4.2V

VDET=4.8V

Ta=-40°C to 85°C

Ta=85°C to 105°C

Ta=+25°C

3.0

Ta=-40°C to 85°C

Ta=85°C to 105°C

Ta=+25°C

Detection Voltage

V_DET

3.3

Ta=-40°C to 85°C

Ta=85°C to 105°C

Ta=+25°C

4.2

Ta=-40°C to 85°C

Ta=85°C to 105°C

Ta=+25°C

4.8

Ta=-40°C to 85°C

Ta=85°C to 105°C

CL=100pF RＬ=100kΩ

Vout=GND50%

Output Delay Time “LH”

tPLH

ICC1

100

µs

V_DET=2.3-3.1V

0.51

0.56

0.60

0.66

0.75

0.80

0.85

0.90

1.53

1.68

1.80

1.98

2.25

2.40

2.55

2.70

V_DET=3.2-4.2V

V_DET=4.3-5.2V

V_DET=5.3-6.0V

V_DET=2.3-3.1V

V_DET=3.2-4.2V

V_DET=4.3-5.2V

V_DET=5.3-6.0V

Circuit Current when ON

VDD=V_DET-0.2V

µA

Circuit Current when OFF

Operating Voltage Range

ICC2

VDD=V_DET+2.0V

µA

VOL≤0.4V, Ta=25 to 105°C, RL=470kΩ

VOL≤0.4V, Ta=-40 to 25°C, RL=470kΩ

0.95

1.20

VOPL

V_DET(T) : Standard Detection Voltage(2.3V to 6.0V, 0.1V step)

R_L: Pull-up resistor to be connected between VOUT and power supply.

C_L: Capacitor to be connected between VOUT and GND.

Design Guarantee. (Outgoing inspection is not done on all products.)

*1 Guarantee is Ta=25°C.

*2 tPLH:VDD=(V_DETtyp.-0.5V)(V_DETtyp.+0.5V)

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●Electrical Characteristics (Unless Otherwise Specified Ta=-40°C to 105°C) - continued

Limit

Unit

Parameter

Symbol

VOL

Condition

Min.

Typ.

Max.

V^DD=1.5V, ISINK = 0.4 mA, VDET=2.3-6.0V

VDD=2.4V, ISINK = 2.0 mA, VDET=2.7-6.0V

0.5

‘Low’Output Voltage (Nch)

0.5

VDD=4.8V, ISOURCE=0.7 mA, VDET(2.3V to 4.2V) VDD-0.5

VDD=6.0V, ISOURCE=0.9 mA,VDET(4.3V to 5.2V) VDD-0.5

VDD=8.0V, ISOURCE=1.1 mA,VDET(5.3V to 6.0V) VDD-0.5

‘High’Output Voltage (Pch)

(BD49Exxx-M Series)

VOH

Leak Current when OFF

(BD48Exxx-M Series)

Detection Voltage

I_leak

VDD=VDS=10V

0.1

µA

Ta=-40°C to 105°C

V_DET/∆T

±100

±360

ppm/°C

Temperature coefficient

(Designed Guarantee)

Hysteresis Voltage

∆V_DETVDD=LHL, RL=470kΩ

V_DET×0.03 V_DET×0.05 V_DET×0.08

V_DET(T) : Standard Detection Voltage(2.3V to 6.0V, 0.1V step)

R_l: Pull-up resistor to be connected between Vout and power supply.

C_l: Capacitor to be connected between Vout and GND.

Design Guarantee. (Outgoing inspection is not done on all products.)

*1 Guarantee is Ta=25°C.

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●Block Diagrams

VOUT

Vref

GND

Fig.1 BD48Exxx-M series

VDD

VOUT

Vref

GND

Fig.2 BD49Exxx-M series

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BD48Exxx-M series BD49Exxx-M series

●Typical Performance Curves

2.0

【BD48E42G-M】

BD4842G/FVE

【

】

BD4842G/FVE

【BD48E42G-M】

【

】

【BD49E42G-M】

1.5

1.0

0.5

0.0

V_DD=2.4V

V_DD=1.2V

0.0

0.5

1.0

1.5

2.0

2.5

DRAIN-SOURCE VOLTAGE V_DS[V]

V^DDSUPPLY VOLTAGE V^DD[V]

：

Fig.3 Circuit Current

Fig.4 “Low” Output Current

BD4942G/FVE

BD4842G/FVE

【BD48E42G-M】

【】

【

】

【BD49E42G-M】

V^DD=8.0V

V^DD=6.0V

Ta=25

℃

V^DD=4.8V

Ta=25

℃

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5

DRAIN-SOURCE VOLTAGE V^DS[V]

：

V_DDSUPPLY VOLTAGE V_DD[V]

：

Fig.5 “High” Output Current

Fig.6 I/O Characteristics

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●Typical Performance Curves – continued

1.0

5.4

5.0

4.6

4.2

3.8

3.4

42G/FVE

【BD48E42G-M】

BD48x42x

【

】

【BD48E42G-M】

BD48x42x

BD4842G/FVE

【

】

【

【BD49E42G-M】

0.8

0.6

0.4

0.2

0.0

【BD49E42G-M】

Low to High(V_DET+ΔV_DET

）

High to Low(V_DET

）

～

3.0

0.5

1.5

2.5

-40

SUPPLY VOLTAGE: [V]

TEMPERATURE_:

Ta[℃]

Fig.8 Detection Voltage

Release Voltage

Fig.7 Operating Limit Voltage

1.5

1.0

0.5

0.0

1.5

1.0

0.5

0.0

BD48x42x

BD4842G/FVE

】

BD4842G/FVE

BD48x42x

【

】

【

【BD48E42G-M】

【BD49E42G-M】

-40 -20

20 40 60 80 100

-40 -20

20 40 60 80 100

TEMPERATURE Ta[

]

℃

TEMPERATURE Ta[

]

℃

：

Fig.10 Circuit Current when OFF

Fig.9 Circuit Current when ON

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●Typical Performance Curves – continued

1.5

BDB4D84482xG4/2FxVE

【

】

【

【BD48E42G-M】

【BD49E42G-M】

1.0

0.5

0.0

-40 -20

20 40 60 80 100

TEMPERATURE Ta[

]

℃

：

Fig.11 Operating Limit Voltage

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●Application Information

Explanation of Operation

For both the open drain type (Fig.12) and the CMOS output type (Fig.13), the detection and release voltages are used as

threshold voltages. When the voltage applied to the V_DDpins reaches the applicable threshold voltage, the V_OUTterminal

voltage switches from either “High” to “Low” or from “Low” to “High”. Please refer to the Timing Waveform and Electrical

Characteristics for information on hysteresis. Because the BD48Exxx-M series uses an open drain output type, it is

necessary to connect a pull-up resistor to V_DDor another power supply if needed [The output “High” voltage (V_OUT) in this

case becomes V_DDor the voltage of the other power supply].

Vref

OUT

GND

Fig.12 (BD48Exxx-M series Internal Block Diagram)

Fig.13 (BD49Exxx-M series Internal Block Diagram)

Reference Data

Examples of Leading (t_PLH) and Falling (t_PHL) Output

Part Number

BD48E45G-M

BD49E45G-M

t_PLH(μs)

39.5

t_PHL(μs)

87.8

32.4

52.4

V_DD=4.3V5.1V

V_DD=5.1V4.3V

*This data is for reference only.

The figures will vary with the application, so please confirm actual operating conditions before use.

Timing Waveform

Example: the following shows the relationship between the input voltages V_DDand the output voltage V_OUTwhen the

input power supply voltage V_DDis made to sweep up and sweep down (the circuits are those in Fig.12 and 13).

When the power supply is turned on, the output is unstable

VDD

from after over the operating limit voltage (V_OPL) until t_PHL

Therefore it is possible that the reset signal is not valid when the

VDET+ΔVDET

⑤

VDET

rise time of V_DDis faster than t_PHL

When V_DDis greater than V_OPL, but less than the reset release

voltage (V_DET+ ∆V_DET), the output voltages will switch to Low.

VOPL

If V_DDexceeds the reset release voltage (V_DET+ ∆V_DET), then,

VOUT

V_OUTswitches from L to H.

VOH

VOL

If V_DDdrops below the detection voltage (V_DET) when the power

tPLH

tPHL

tPLH

tPHL

supply is powered down or when there is a power supply

fluctuation, V_OUTswitches to L (with a delay of t_PHL).

The potential difference between the detection voltage and the

①

②

③

④

release voltage is known as the hysteresis width (∆V_DET).

The system is designed such that the output does not toggle with

power supply fluctuations within this hysteresis width, preventing

the

Fig.14 Timing Waveform

malfunctions due to noise.

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BD48Exxx-M series BD49Exxx-M series

●Circuit Applications

1) Examples of a common power supply detection reset circuit.

Application examples of BD48Exxx-M series (Open

Drain output type) and BD49Exxx-M series (CMOS

output type) are shown on the left.

DD1

DD2

Micro

Controller

CASE1: Power supply of the microcontroller (V_DD2

)

BD48Exxx-M

differs from the power supply of the reset detection

(V_DD1).

C_L

Use an open drain output type (BD48xxx-M) device with

a load resistance R_Lattached as shown in figure 15.

Capacitor is for

noise filtering

(

）

GND

CASE2: Power supply of the microcontroller (V_DD1) is

same as the power supply of the reset detection (V_DD1).

Use a CMOS output type (BD49xxx-M) device or an

open drain device with a pull up resistor between output

and VDD1.

Fig.15 Open Drain Output Type

DD1

Micro

Controller

When a capacitance C_Lfor noise filtering is connected to

the V_OUTpin (the reset signal input terminal of the

microcontroller), please take into account the waveform

of the rise and fall of the output voltage (V_OUT).

BD49Exxx-M

C_L

Capacitor is for

(

The Electrical characteristics were measured using

R_L= 470kΩ and C_L= 100pF.

filtering

）

GND

Fig.16 CMOS Output Type

2) The following is an example of a circuit application in which an OR connection between two types of detection voltage

resets the microcontroller.

VDD1

VDD2

VDD3

Microcontroller

RST

BD48Exxx-M

GND

Fig.17

To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain

output type (BD48Exxx-M series) to the microcontroller’s input with pull-up resistor to the supply voltage of the

microcontroller (V_DD3) as shown in Fig. 17. By pulling-up to V_DD3, output “High” voltage of micro-controller power supply is

possible.

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3) Examples of the power supply with resistor dividers

In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow into

the circuit when the output level switches from “High” to “Low” or vice versa. In-rush current is a sudden surge of current that

flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow may cause

malfunction in the systems operation such as output oscillations, etc.

VDD

BD48Exxx-M

BD49Exxx-M

VOUT

CIN

GND

Fig.18

When an in-rush current (I1) flows into the circuit (Refer to Fig. 18) at the time when output switches from “Low” to “High”,

a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the VDD

voltage drops below the detection voltage, the output will switch from “High” to “Low”. While the output voltage is at “Low”

condition, in-rush current will stop flowing and the voltage drop will be reduced. As a result, the output voltage will switches

again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will result to

oscillation.

IDD

Through Current

VDD

VDET

Fig.19 Current Consumption vs. Power Supply Voltage

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●Operational Notes

1) Absolute maximum ratings

Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit

between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such

as adding a fuse, in case the IC is operated over the absolute maximum ratings.

2) Ground Voltage

The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no

pins are at a voltage below the ground pin at any time, even during transient condition.

3) Recommended operating conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

4) Bypass Capacitor for Noise Rejection

To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND.

Be careful when using extremely big capacitor as transient response will be affected.

5) Short between pins and mounting errors

Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong

orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.

6) Operation under strong electromagnetic field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

7) The V_DDline impedance might cause oscillation because of the detection current.

8) A V_DDto GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.

9) Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD)

condition.

10) External parameters

The recommended parameter range for R_Lis 10kΩ to 1MΩ. There are many factors (board layout, etc) that can affect

characteristics. Please verify and confirm using practical applications.

11) Power on reset operation

Please note that the power on reset output varies with the V_DDrise time. Please verify the behavior in the actual

operation.

12) Testing on application boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

13) Rush current

When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to

the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special

consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.

14) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might

cause unexpected operations. Application values in these conditions should be selected carefully. If 10MΩ leakage is

assumed between the C_Tterminal and the GND terminal, 1MΩ connection between the CT terminal and the V_DD

terminal would be recommended. Also, if the leakage is assumed between the Vout terminal and the GND terminal, the

pull up resistor should be less than 1/10 of the assumed leak resistance.

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BD48Exxx-M series BD49Exxx-M series

●Revision History

Date

Revision

001

Changes

30.Mar.2012

New Release

Updated General Description, Features, Applications, Absolute maximum ratings, Explanation

of Operation, Timing Waveform, Circuit Applications, and Operational Notes.

Changed Lineup table format.

Add Io in Absolute Maximum Rating table

14.Dec.2012

002

Add limits for VDET specifically at VDET=2.5V,3.0V,3.3V,4.2V,4.8V

Change parameter in electrical characteristics from IOL to VOL and IOH to VOH

Add circuits application numbers 2 and 3

Added Revision History.

22.May.2013

27.Aug.2013

25.Nov.2020

003

004

005

Change limits for VDET at VDET=2.5V,3.0V,3.3V,4.2V,4.8V

Update the applications and features on page 1 and ordering information on page 2

P.14-2, 14-3, 14-4 Updated packages and part numbers.

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BD48Exxx-M series BD49Exxx-M series

Ordering Information

B D

Output Type

48 : Open Drain

49 : CMOS

Reset Voltage

Value

23:2.3 V

↓ 0.1 Vstep

60:6.0 V

Package

G: SSOP5A

Packaging and forming

specification

TR: Embossed tape and

reel

Product Rank

M : for Automotive

Production site

Z : Added

Marking Diagram

SSOP5A (TOP VIEW)

Part Number Marking

LOT Number

CMOS

Output Type

Open Drain

Detection Voltage

Part Number

Marking

6.0V

5.9V

5.8V

5.7V

5.6V

5.5V

5.4V

5.3V

5.2V

5.1V

5.0V

4.9V

4.8V

4.7V

4.6V

4.5V

4.4V

4.3V

4.2V

4.1V

4.0V

BD48E60

BD48E59

BD48E58

BD48E57

BD48E56

BD48E55

BD48E54

BD48E53

BD48E52

BD48E51

BD48E50

BD48E49

BD48E48

BD48E47

BD48E46

BD48E45

BD48E44

BD48E43

BD48E42

BD48E41

BD48E40

BD49E60

BD49E59

BD49E58

BD49E57

BD49E56

BD49E55

BD49E54

BD49E53

BD49E52

BD49E51

BD49E50

BD49E49

BD49E48

BD49E47

BD49E46

BD49E45

BD49E44

BD49E43

BD49E42

BD49E41

BD49E40

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BD48Exxx-M series BD49Exxx-M series

Marking Diagram - continued

Output Type

Open Drain

CMOS

Part Number

Detection Voltage

Part Number

Marking

3.9V

3.8V

3.7V

3.6V

3.5V

3.4V

3.3V

3.2V

3.1V

3.0V

2.9V

2.8V

2.7V

2.6V

2.5V

2.4V

2.3V

BD48E39

BD48E38

BD48E37

BD48E36

BD48E35

BD48E34

BD48E33

BD48E32

BD48E31

BD48E30

BD48E29

BD48E28

BD48E27

BD48E26

BD48E25

BD48E24

BD48E23

BD49E39

BD49E38

BD49E37

BD49E36

BD49E35

BD49E34

BD49E33

BD49E32

BD49E31

BD49E30

BD49E29

BD49E28

BD49E27

BD49E26

BD49E25

BD49E24

BD49E23

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BD48Exxx-M series BD49Exxx-M series

Physical Dimension and Packing Information

Package Name

SSOP5A

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TSZ22111・15・001

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Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.004

Daattaasshheeeett

General Precaution

1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this document is current as of the issuing date and subject to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales

representative.

3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

BD49E37G-M [ROHM]

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