BD50FD0WHFP_技术文档

Datasheet

Single-Output LDO Regulators

35V Voltage Resistance

2A LDO Regulators

BDxxFD0 series

Description

The BDxxFD0 series are low-saturation regulators. The

Packages

W(Typ) x D(Typ) x H(Max)

9.395mm x 10.540mm x 2.005mm

series’ output voltages are Variable, and fixed type.

These series have a built-in over-current protection

circuit that prevents the destruction of the IC due to

output short circuits and a thermal shutdown circuit that

protects the IC from thermal damage due to overloading.

HRP5

Features

Output current capability: 2A



TO263-5

10.16mm×15.10mm×4.70mm



Output voltage: Variable, Fixed

(1.5V / 1.8V / 2.5V / 3.0V / 3.3V / 5.0V / 8.0V

/ 9.0V / 12V / 15V / 16V)



±1% (±1.5%:BD15/18/25FD0W)

High output voltage accuracy (Ta=25°C)

Low saturation with PDMOS output

Built-in over-current protection circuit that prevents

the destruction of the IC due to output short circuits

Built-in thermal Shutdown circuit for protecting the

IC from thermal damage due to overloading

Low ESR Capacitor



Key Specifications



Supply Voltage(Vo ≥ 3.0V):

Vo+1.0V to 32.0V

4.0V to 32.0V

1.5V to 16.0V

2A



Supply Voltage(Vo < 3.0V):

Output Voltage(BD00FD0W):

Output Current:

HRP5/TO263-5 package

Output Voltage Precision^{(Note 1)}

:

±1%(Ta=25°C)

Operating Temperature Range: -40°C to +105°C

(Note 1) BD15/18/25FD0W are ±1.5% (Ta=25°C)

Applications

General Purpose

Ordering Part Number

B

D

x

F

D

0

W

x

-

x

Output voltage

00: Variable

15:1.5V

Input Voltage,

Current capacity

FD0: 35V, 2A

Enable

W: With CTL(Enable)

Package

HFP: HRP5

FP2: TO263-5

Packaging and forming

specification

TR: Embossed tape and

reel(HRP5)

18:1.8V

25:2.5V

30:3.0V

E2: Embossed tape and

reel(TO263-5)

33:3.3V

50:5.0V

80:8.0V

90:9.0V

J2:12.0V

J5:15.0V

J6:16.0V

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.

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Contents

Description............................................................................................................................................................................1

Features ................................................................................................................................................................................1

Packages...............................................................................................................................................................................1

Key Specifications................................................................................................................................................................1

Applications..........................................................................................................................................................................1

Ordering Part Number...........................................................................................................................................................1

Contents................................................................................................................................................................................2

Lineup ...................................................................................................................................................................................3

Typical Application Circuits..................................................................................................................................................3

Pin Configurations/Pin Descriptions....................................................................................................................................4

Block diagrams.....................................................................................................................................................................5

Description of Blocks ...........................................................................................................................................................6

Absolute Maximum Ratings..................................................................................................................................................7

Recommended Operating Conditions ..................................................................................................................................7

Electrical Characteristics......................................................................................................................................................8

Thermal Resistance ..............................................................................................................................................................9

Reference Data....................................................................................................................................................................10

Measurement setup for reference data..............................................................................................................................14

Linear Regulators Surge Voltage Protection......................................................................................................................15

1. Applying positive surge to the input........................................................................................................................15

2. Applying negative surge to the input.......................................................................................................................15

Linear Regulators Reverse Voltage Protection...................................................................................................................15

1. about Input /Output Voltage Reversal ......................................................................................................................15

2. Protection against Input Reverse Voltage................................................................................................................16

3. Protection against Output Reverse Voltage when Output Connect to an Inductor.................................................17

Thermal design ...................................................................................................................................................................18

I/O equivalence circuit ........................................................................................................................................................20

Output Voltage Configuration Method (BD00FD0WHFP/FP2) ............................................................................................20

Operational Notes...............................................................................................................................................................21

1. Reverse Connection of Power Supply.........................................................................................................................21

2. Power Supply Lines.....................................................................................................................................................21

3. Ground Voltage............................................................................................................................................................21

4. Ground Wiring Pattern.................................................................................................................................................21

5. Thermal Consideration................................................................................................................................................21

6. Inrush Current..............................................................................................................................................................21

7. Testing on Application Boards....................................................................................................................................21

8. Inter-pin Short and Mounting Errors ...........................................................................................................................21

9. Unused Input Pins .......................................................................................................................................................21

10. Regarding the Input Pin of the IC ..............................................................................................................................22

11. Ceramic Capacitor .....................................................................................................................................................22

12. Thermal Shutdown Circuit (TSD)...............................................................................................................................22

13. Over Current Protection Circuit (OCP) ......................................................................................................................22

14. Vcc Pin.......................................................................................................................................................................22

15. Output Pin..................................................................................................................................................................23

16. CTL Pin.......................................................................................................................................................................24

17. Rapid variation in Vcc Voltage and load Current CTL Pin.........................................................................................24

18. Minute variation in output voltage.............................................................................................................................24

19. Regarding the Input Pin and Vcc voltage..................................................................................................................24

Physical Dimension, Tape and Reel Information................................................................................................................25

Marking Diagrams...............................................................................................................................................................27

Revision History..................................................................................................................................................................28

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Lineup

Output

Voltage

Output

Voltage

Ordering Part Number

Package

Ordering Part Number

Package

BD00FD0WHFP-TR

BD15FD0WHFP-TR

BD18FD0WHFP-TR

BD25FD0WHFP-TR

BD30FD0WHFP-TR

BD33FD0WHFP-TR

BD50FD0WHFP-TR

BD80FD0WHFP-TR

BD90FD0WHFP-TR

BDJ2FD0WHFP-TR

BDJ5FD0WHFP-TR

BDJ6FD0WHFP-TR

Variable

1.5V

1.8V

2.5V

3.0V

3.3V

5.0V

8.0V

9.0V

12V

BD00FD0WFP2-E2

BD15FD0WFP2-E2

BD18FD0WFP2-E2

BD25FD0WFP2-E2

BD30FD0WFP2-E2

BD33FD0WFP2-E2

BD50FD0WFP2-E2

BD80FD0WFP2-E2

BD90FD0WFP2-E2

BDJ2FD0WFP2-E2

BDJ5FD0WFP2-E2

BDJ6FD0WFP2-E2

Variable

1.5V

1.8V

2.5V

3.0V

3.3V

5.0V

8.0V

9.0V

12V

HRP5

2000pcs/Reel

TO263-5

500pcs/Reel

15V

16V

Typical Application Circuits

Vcc

Vo

R₂

Vcc

Cin

Cout

CTL

ADJ

GND

R₁

Figure 1. Typical Application Circuit

Output Voltage Variable Type

Vcc

CTL

Vo

Vcc

Cin

Cout

N.C.

GND

Figure 2. Typical Application Circuit

Output Voltage Fixation Type

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Pin Configurations/Pin Descriptions

HRP5

TO263-5

(TOP VIEW)

FIN

1

2

3

4 5

1 2 3 4 5

Figure 3. Pin Configurations

Variable output voltage type

Terminal

Pin No

Function

Name

Control terminal

1

CTL

By setting this pin to High, you can turn the device on. By setting this pin to Low, you can

turn the device off.

Input Power source terminal

2

3

Vcc

GND

Vo

Connect a ceramic capacitor between Vcc and GND. Place the capacitor close to the

terminal.

Ground

It is connected to the FIN terminal at the ground of the circuit.

Output terminal

Connect a capacitor between Vo and GND. Place the capacitor close to the terminal. Refer

to Operational Notes 15 for capacitance and ESR value.

Output voltage setting terminal

Connect a resistor between Vo and ADJ,ADJ and GND.

Heat dissipating FIN

4

5

ADJ

FIN

It is recommended that FIN is soldered to a copper foil part with a large area.

It is electrically connected to GND inside the package.

Fixed output voltage type

Terminal

Pin No

Function

Name

Control terminal

1

CTL

By setting this pin to High, you can turn the device on. By setting this pin to Low, you can

turn the device off.

Input Power source terminal

2

3

Vcc

GND

Vo

Connect a ceramic capacitor between Vcc and GND. Place the capacitor close to the

terminal.

Ground

It is connected to the FIN terminal at the ground of the circuit.

Output terminal

Connect a capacitor between Vo and GND. Place the capacitor close to the terminal. Refer

to Operational Notes 15 for capacitance and ESR value.

Unused terminal

4

5

N.C.

FIN

Connect to open or GND.

Heat dissipating FIN

It is recommended that FIN is soldered to a copper foil part with a large area.

FIN

It is electrically connected to GND inside the package.

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Block diagrams

< BD00FD0WHFP/FP2 (Output Voltage Variable Type) >

■HRP5/TO263-5

FIN

VREF : 基準電圧回路

OCP : 過電流保護回路

TSD : 温度保護回路

Driver:出力ドライブ回路

PREREG

VREF

Driver

AMP

OCP

TSD

4

5

1

3

2

CTL

Vcc

GND

Vo

ADJ

Figure 4. Block diagram

BD00FD0WHFP/FP2 (Output Voltage Variable Type)

< BDxxFD0WHFP/FP2 (Output Voltage Fixation Type) >

■HRP5/TO263-5

FIN

VREF : 基準電圧回路

OCP : 過電流保護回路

TSD : 温度保護回路

Driver:出力ドライブ回路

PREREG

VREF

AMP

Driver

OCP

TSD

1

2

4

5

3

CTL

Vcc

Vo

N.C.

GND

Figure 5. Block diagram

BDxxFD0WHFP/FP2(Output Voltage Fixation Type)

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Description of Blocks

Block Name

Function

Description of Blocks

A logical “High” ( V_thH≥ 2.0 V ) at the CTL enables

Power Supply for Internal Circuit

PREREG

TSD

Internal Power Supply

To protect the device from overheating.

If the chip temperature ( Tj ) reaches ca. 175 °C ( Typ ),

the output is turned off.

Thermal Shutdown Protection

Reference Voltage

VREF

AMP

Generate the Reference Voltage

The Error Amplifier amplifies the difference between the feed

back voltage of the output voltage and the reference v.

Error Amplifier

Driver

OCP

Output MOS FET Driver

Over Current Protection

Drive the Output MOS FET

To protect the device from damage caused by over current.

If the output current reaches current ability ( Typ : 2500mA ),

the output is turned off.

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Absolute Maximum Ratings

Parameter

Symbol

Vcc

V_CTL

Ta

Tstg

Ratings

-0.3 to +35.0

-40 to +105

-55 to +150

150

Unit

V

°C

Supply Voltage^{(Note 1)}

Output Control Voltage ^{(Note 2)}

Operating Temperature Range

Storage Temperature Range

Maximum Junction Temperature

(Note 1) Do not exceed Tjmax.

Tjmax

(Note 2) The order of starting up power supply (Vcc) and CTL pin doesn't have either in the problem within

the range of the operation power-supply voltage ahead.

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage

can either be a short circuit between pins or an open circuit between pins and the internal circuitry.

Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case

the IC is operated over the absolute maximum ratings.

Recommended Operating Conditions (-40°C ≤ Ta ≤ +105°C)

Parameter

Supply Voltage (Vo ≥ 3.3V)

Supply Voltage (Vo ≤ 3.0V)

Startup Voltage (Io=0mA)

Output Control Voltage

Symbol

Vcc

V_CTL

Io

Min

Vo+1

4.0

-

0

Max.

32.0

3.8

32.0

2.0

Unit

V

Output Current

Output Voltage (BD00FD0W) ^{(Note 3)}

A

V

Vo

1.5

18.0

(Note 3) Refer to Notes15 for use when you use BD00FD0W by output voltage 1.5V ≤ Vo < 3.0V.

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Electrical Characteristics

Unless otherwise specified, Ta=25°C, Vcc= 13.5V^{(Note 1)}, Io=0mA, VCTL=5.0V

The resistor of between ADJ and Vo =56.7kΩ, ADJ and GND =10kΩ (BD00FD0W)

Limits

Parameter

Shutdown Current

Symbol

Unit

Conditions

Min

-

Typ

0

Max

10

Isd

Ib

μA V_CTL=0V, Vcc<10V

Circuit Current

-

0.5

1.0

mA

ADJ Terminal Voltage

(BD00FD0W)

VADJ

0.742

0.750

0.758

V

Io=500mA, Vcc=13.5V

Vo

×

0.985

Vo

×

1.015

Output Voltage

(BD15/18/25FD0W)

Io=500mA

Vo ≤ 2.5V

Vo

×

0.99

Vo

×

1.01

Io=500mA

Vo ≥ 3.0V

Output Voltage

Vo

0.40

55

V

(BD30 to J6FD0W) ^{(Note 2)}

Vcc=Vo×0.95, Io=1A,

Vo ≥ 5.0V

f=120Hz,

Dropout Voltage

ΔVd

R.R.

-

0.55

-

Ripple Rejection

45

dB Input Voltage Ripple =1Vrms,

Io=500mA

(BD00 to 50FD0W) ^{(Note 3)}

f=120Hz,

dB Input Voltage Ripple =1Vrms,

Io=500mA

Ripple Rejection

R.R.

Reg.I

Reg.L

40

-

50

20

-

(BD80 to J6FD0W) ^{(Note 4)}

Vo+1.0V ≤ Vcc ≤ 26.5V

Vo ≥ 3.3V

Line Regulation ^{(Note 5)}

Line Regulation ^{(Note 6)}

Load Regulation ^{(Note 5)}

80

mV

4.0V ≤ Vcc ≤ 26.5V

Vo ≤ 3.0V

-

mV

Vo

×

0.007

Vo

×

0.014

5mA ≤ Io ≤ 1A

Vo ≥ 3.3V

-

V

Vo

×

0.020

Vo

×

0.040

5mA ≤ Io ≤ 1A

Vo ≤ 3.0V

Load Regulation ^{(Note 6)}

Reg.L

-

V

CTL ON Mode Voltage

CTL OFF Mode Voltage

CTL Bias Current

V_thH

V_thL

I_CTL

2.0

-

V

ACTIVE MODE

OFF MODE

-

0.8

50

25

μA

(Note 1) In case of Vo>10V, Vcc=Vo+5V

(Note 2) BD30/33/50/80/90/J2/J5/J6FD0W

(Note 3) BD00/15/18/25/30/33/50FD0W

(Note 4) BD80/90/J2/J5/J6FD0W

(Note 5) BD00/33/50/80/90/J2/J5/J6FD0W

(Note 6) BD15/18/25/30FD0W

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Thermal Resistance ^{(Note 1)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s ^{(Note 3)}

2s2p ^{(Note 4)}

HRP5

Junction to Ambient

Junction to Top Characterization Parameter ^{(Note 2)}

θ_JA

119.3

8

22.0

3

°C/W

Ψ_JT

TO263-5

Junction to Ambient

Junction to Top Characterization Parameter ^{(Note 2)}

θ_JA

80.7

8

20.3

2

°C/W

Ψ_JT

(Note 1) Based on JESD51-2A(Still-Air)

(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 3) Using a PCB board based on JESD51-3.

(Note 4) Using a PCB board based on JESD51-5, 7.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3mm x 76.2mm x 1.57mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70μm

Thermal Via^{(Note 5)}

Layer Number of

Measurement Board

Material

FR-4

Board Size

114.3mm x 76.2mm x 1.6mmt

2 Internal Layers

Pitch

Diameter

4 Layers

1.20mm

Φ0.30mm

Top

Copper Pattern

Bottom

Thickness

Copper Pattern

Thickness

Copper Pattern

Thickness

70μm

Footprints and Traces

70μm

74.2mm x 74.2mm

35μm

74.2mm x 74.2mm

(Note 5) This thermal via connects with the copper pattern of all layers. The placement and dimensions obey a land pattern.

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Reference Data

BD00FD0WHFP/FP2 (Vo=5.0V)

Unless otherwise specified, Ta=25°C, Vcc=13.5V, V_CTL=5.0V, Io=0mA, Vo=5.0V

(The resistor of between ADJ and Vo =56.7kΩ, ADJ and GND =10.0kΩ)

Figure 6. Circuit Current

(IFEEDBACK_R ≈ 75µA)

Figure 7. Shutdown Current

(V_CTL=0V)

Figure 9. Line Regulation

(Io=1.0A)

Figure 8. Line Regulation

(Io=0mA)

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Reference Data - Continue

Figure 10. Start up voltage characteristic

Figure 11. Load regulation

(Io=0 to 2A)

(Io=1.0A, Vcc=0 to 6V)

Figure 12. Over Current Protection Characteristic

Figure 13. Dropout Voltage

(Vcc=4.75V)

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Reference Data - Continue

Figure 15. Output Voltage

Temperature Characteristic

Figure 14. Ripple Rejection

(Io=500mA)

Figure 17. CTL voltage vs CTL current

Figure 16. Output Current vs Circuit Current

(0mA ≤ Io ≤ 1000mA, IFEEDBACK_R ≈ 75µA)

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Reference Data - Continue

Figure 18. CTL voltage vs. Output Voltage

Figure 19. CTL voltage vs. Output Voltage

(V_CTL=0 to 2V)

Figure 20. Thermal Shutdown Protection Characteristic

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Measurement setup for reference data

BD00FD0WHFP/FP2 (Vo=5.0V)

Vcc

Vo

Vcc

Vo

Vcc

Vo

56.7kΩ

10kΩ

2.2µF

56.7kΩ

2.2µF

56.7kΩ

CTL

ADJ

CTL

ADJ

CTL

ADJ

2.2µF

GND

5V

10kΩ

FEEDBACK _R

Measurement setup for

Figure 6.

Measurement setup for

Figure 7.

Measurement setup for

Figure 8.

Vcc

Vo

Vcc

Vo

Vcc

Vo

56.7kΩ

10kΩ

56.7kΩ

10kΩ

2.2µF

CTL

ADJ

CTL

ADJ

CTL

ADJ

13.5V

2.2µF

4.75V

2.2µF

GND

1.0A

GND

10kΩ

GND

5V

Measurement setup for

Figure 9,10.

Measurement setup for

Figure 11,12.

Measurement setup for

Figure 13.

Vcc

Vo

Vcc

Vo

Vcc

Vo

56.7kΩ

10kΩ

56.7kΩ

10kΩ

56.7kΩ

10kΩ

1Vrms

13.5V

2.2µF

CTL

ADJ

13.5V

2.2µF

V

GND

CTL

ADJ

CTL

ADJ

2.2µF

13.5V

2.2µF

500mA

GND

5V

FEEDBACK _R

5V

Measurement setup for

Figure 14.

Measurement setup for

Figure 15.

Measurement setup for

Figure 16.

Vcc

Vo

Vcc

Vo

Vcc

Vo

56.7kΩ

10kΩ

56.7kΩ

10kΩ

56.7kΩ

10kΩ

2.2µF

CTL

ADJ

CTL

ADJ

CTL

ADJ

13.5V

2.2µF

13.5V

2.2µF

GND

5V

Measurement setup for

Figure 17.

Measurement setup for

Figure 20.

Measurement setup for

Figure 18,19.

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Linear Regulators Surge Voltage Protection

The following provides instructions on surge voltage overs absolute maximum ratings polarity protection for ICs.

1. Applying positive surge to the input

If the possibility exists that surges higher than absolute maximum ratings 35 V will be applied to the input, a Zener Diode

should be placed to protect the device in between the V_INand the GND as shown in the figure 21.

IN

OUT

V_IN

V_OUT

C_OUT

GND

D₁

C_IN

Figure 21. Surges Higher than 35 V will be Applied to the Input

2. Applying negative surge to the input

If the possibility exists that surges lower than absolute maximum ratings -0.3 V will be applied to the input, a Schottky

Diode should be place to protect the device in between the V_INand the GND as shown in the figure 22.

IN

OUT

V_IN

V_OUT

C_OUT

GND

D₁

C_IN

Figure 22. Surges Lower than -0.3 V will be Applied to the Input

Linear Regulators Reverse Voltage Protection

A linear regulator integrated circuit (IC) requires that the input voltage is always higher than the regulated voltage. Output

voltage, however, may become higher than the input voltage under specific situations or circuit configurations, and that

reverse voltage and current may cause damage to the IC. A reverse polarity connection or certain inductor components can

also cause a polarity reversal between the input and output pins. The following provides instructions on reversed voltage

polarity protection for ICs.

1. about Input /Output Voltage Reversal

In an MOS linear regulator, a parasitic element exists as a body diode in the drain-source junction portion of its power

MOSFET. Reverse input/output voltage triggers the current flow from the output to the input through the body diode. The

inverted current may damage or destroy the semiconductor elements of the regulator since the effect of the parasitic

body diode is usually disregarded for the regulator behavior (Figure 23).

I_R

V_OUT

V_IN

Error

AMP.

V_REF

Figure 23. Reverse Current Path in an MOS Linear Regulator

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An effective solution to this is an external bypass diode connected in-between the input and output to prevent the

reverse current flow inside the IC (see Figure 24.). Note that the bypass diode must be turned on before the internal

circuit of the IC. Bypass diodes in the internal circuits of MOS linear regulators must have low forward voltage V_F. Some

ICs are configured with current-limit thresholds to shut down high reverse current even when the output is off, allowing

large leakage current from the diode to flow from the input to the output; therefore, it is necessary to choose one that

has a small reverse current. Specifically, select a diode with a rated peak inverse voltage greater than the input to output

voltage differential and rated forward current greater than the reverse current during use.

D₁

IN

OUT

V_IN

V_OUT

C_OUT

GND

C_IN

Figure 24. Bypass Diode for Reverse Current Diversion

The lower forward voltage (V_F) of Schottky barrier diodes cater to requirements of MOS linear regulators, however the

main drawback is found in the level of their reverse current (I_R), which is relatively high. So, one with a low reverse

current is recommended when choosing a Schottky diode. The V_R-I_Rcharacteristics versus temperatures show

increases at higher temperatures.

If V_INis open in a circuit as shown in the following Figure 25. with its input/output voltage being reversed, the only current

that flows in the reverse current path is the bias current of the IC. Because the amperage is too low to damage or

destroy the parasitic element, a reverse current bypass diode is not required for this type of circuit.

ON→OFF

IBIAS

IN

OUT

V_OUT

C_OUT

V_IN

GND

CIN

Figure 25. Open V_IN

2. Protection against Input Reverse Voltage

Accidental reverse polarity at the input connection flows a large current to the diode for electrostatic breakdown

protection between the input pin of the IC and the GND pin, which may destroy the IC (see Figure 26.).

A Schottky barrier diode or rectifier diode connected in series with the power supply as shown in Figure 27. is the

simplest solution to prevent this from happening. The solution, however, is unsuitable for a circuit powered by batteries

because there is a power loss calculated as V_F× I_OUT,as the forward voltage V_Fof the diode drops in a correct

connection. The lower V_Fof a Schottky barrier diode than that of a rectifier diode gives a slightly smaller power loss.

Because diodes generate heat, care must be taken to select a diode that has enough allowance in power dissipation. A

reverse connection allows a negligible reverse current to flow in the diode.

VIN

V_OUT

C_OUT

GND

IN

OUT

D1

-

IN

OUT

V_OUT

C_OUT

VIN

GND

CIN

GND

CIN

+

GND

Figure 26. Current Path in Reverse Input Connection

Figure 27. Protection against Reverse Polarity 1

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Figure 28. shows a circuit in which a P-channel MOSFET is connected in series with the power. The diode located in the

drain-source junction portion of the MOSFET is a body diode (parasitic element). The voltage drop in a correct

connection is calculated by multiplying the resistance of the MOSFET being turned on by the output current I_OUT

therefore it is smaller than the voltage drop by the diode (see Figure 27.) and results in less of a power loss. No current

flows in a reverse connection where the MOSFET remains off.

,

If the voltage taking account of derating is greater than the voltage rating of MOSFET gate-source junction, lower the

gate-source junction voltage by connecting voltage dividing resistors as shown in Figure 29.

Q1

VIN

Q1

V_OUT

IN

OUT

VIN

V_OUT

C_OUT

IN

OUT

R1

GND

CIN

R2

CIN

C_OUT

Figure 29. Protection against Reverse Polarity 3

Figure 28. Protection against Reverse Polarity 2

3. Protection against Output Reverse Voltage when Output Connect to an Inductor

If the output load is inductive, electrical energy accumulated in the inductive load is released to the ground upon the

output voltage turning off. In-between the IC output and ground pins is a diode for preventing electrostatic breakdown, in

which a large current flows that could destroy the IC. To prevent this from happening, connect a Schottky barrier diode in

parallel with the diode (see Figure 30.).

Further, if a long wire is in use for the connection between the output pin of the IC and the load, observe the waveform

on an oscilloscope, since it is possible that the load becomes inductive. An additional diode is needed for a motor load

that is affected by its counter electromotive force, as it produces an electrical current in a similar way.

VOUT

VIN

OUT

IN

GND

D1

CIN

XLL

COUT

GND

Figure 30. Current Path in Inductive Load (Output: Off)

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Thermal design

HRP5

IC mounted on ROHM standard board based on JEDEC.

8

7

① : 1 - layer PCB

(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)

Board material: FR4

②5.68 W

6

Board size: 114.3 mm x 76.2 mm x 1.57 mmt

Mount condition: PCB and exposed pad are soldered.

Top copper foil: ROHM recommended

footprint + wiring to measure, 2 oz. copper.

5

4

3

② : 4 - layer PCB

(2 inner layers and Copper foil area on the reverse side of

PCB:

2

①1.04W

74.2 mm x 74.2 mm)

1

Board material: FR4

0

Board size: 114.3 mm x 76.2 mm x 1.60 mmt

Mount condition: PCB and exposed pad are soldered.

Top copper foil: ROHM recommended

footprint + wiring to measure, 2 oz. copper.

2 inner layers copper foil area of PCB

: 74.2 mm x 74.2 mm, 1 oz. copper.

Copper foil area on the reverse side of PCB

: 74.2 mm x 74.2 mm, 2 oz. copper.

0

25

50

75

100

125

150

Ambient Temperature: Ta[ꢀC]

Figure 31. Power Dissipation (HRP5)

Condition①: θ_JA= 119.3 °C/W、Ψ_JT(top) = 8 °C/W

Condition②: θ_JA= 22.0 °C/W、Ψ_JT(top) = 3 °C/W

IC mounted on ROHM standard board based on JEDEC.

TO263-5

8

7

6

5

4

3

2

1

0

① : 1 - layer PCB

(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)

Board material: FR4

②6.15 W

Board size: 114.3 mm x 76.2 mm x 1.57 mmt

Mount condition: PCB and exposed pad are soldered.

Top copper foil: ROHM recommended

footprint + wiring to measure, 2 oz. copper.

② : 4 - layer PCB

(2 inner layers and Copper foil area on the reverse side of

PCB:

①1.54W

74.2 mm x 74.2 mm)

Board material: FR4

Board size: 114.3 mm x 76.2 mm x 1.60 mmt

Mount condition: PCB and exposed pad are soldered.

Top copper foil: ROHM recommended

footprint + wiring to measure, 2 oz. copper.

2 inner layers copper foil area of PCB

: 74.2 mm x 74.2 mm, 1 oz. copper.

Copper foil area on the reverse side of PCB

: 74.2 mm x 74.2 mm, 2 oz. copper.

0

25

50

75

100

125

150

Ambient Temperature: Ta[ꢀC]

Figure 32. Power Dissipation (TO263-5)

Condition①: θ_JA= 80.7 °C/W、Ψ_JT(top) = 8 °C/W

Condition②: θ_JA= 20.3 °C/W、Ψ_JT(top) = 2 °C/W

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When operating at temperature more than Ta=25°C, please refer to the power dissipation characteristic curve shown in

Figure 31.

The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC at

temperatures less than the maximum junction temperature Tjmax.

Figure 31. show the acceptable power dissipation characteristic curves of the HRP5 package. Even when the ambient

temperature (Ta) is at normal temperature (25°C), the chip junction temperature (Tj) may be quite high so please operate the

IC at temperatures less than the acceptable power dissipation.

The calculation method for power consumption Pc(W) is as follows

Pc= (Vcc－Vo)×Io+Vcc×Ib

Acceptable loss Pd ≥ Pc

Vcc : Input voltage

Solving this for load current Io in order to operate within the acceptable loss

Vo

Io

Ib

: Output voltage

: Load current

: Circuit current

Pd－Vcc×Ib

Vcc－Vo

Io≤

It is then possible to find the maximum load current Iomax with respect to the applied voltage Vcc at the time of thermal

design.

Calculation Example) When HRP5, Ta=85°C, Vcc=13.5V, Vo=5.0V

2.953－13.5×Ib

Io≤

Figure 31 ②θja=22°C /W →-45.5mW/°C

25°C =5.68W → 85°C =2.953W

8.5

Io≤346.5.2 mA (Ib: 0.58mA)

Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating

temperature ranges.

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I/O equivalence circuit

Vcc Terminal

CTL Terminal

200kΩ

(Typ)

1kΩ

(Typ)

Vcc

CTL

200kΩ

(Typ)

IC

Vo Terminal BD15/18/25/30/33/50/80/90/J2/J5/J6FD0W

R₁(kΩ)

(Typ)

R₂(kΩ)

(Typ)

10.2

14.2

23.6

29.5

33.5

56.1

47.9

54.5

74.5

75.4

80.6

R₃(kΩ)

(Typ)

Vcc

BD15FD0

BD18FD0

BD25FD0

BD30FD0

BD33FD0

BD50FD0

BD80FD0

BD90FD0

BDJ2FD0

BDJ5FD0

BDJ6FD0

15.0

R₃

10.0

Vo

R₂

20.0

5.0

4.0

R₁

BD00FD0W

Vo Terminal

ADJ Terminal

Vcc

Vo

1kΩ

(Typ)

15kΩ

(Typ)

ADJ

Vo

1kΩ

(Typ)

28kΩ

(Typ)

Figure 33. I/O equivalence circuit

Output Voltage Configuration Method (BD00FD0WHFP/FP2)

Please connect resistors R₁and R₂(which determines the output voltage) as shown in Figure 34.

Please be aware that the offset due to the current that flows from the ADJ terminal becomes large when resistor values are

large. Due to this, resistance ranging from 5kΩ to 10kΩ is highly recommended for R₁.

Vo

IC

ADJ

R₂

R₁

ADJ≈0.75V

(Typ)

Vo ≈ ADJ×(R₁+R₂)/R₁

Figure 34. Output Voltage Configuration

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging

on the capacitance value when using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on

the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the

IC is mounted on a 114.3mm x 76.2mm x 1.57mmt(1S) / 114.3mm x 76.2mm x 1.60mmt(2S2P) glass epoxy board. In

case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd

rating.

6. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing

of connections.

7. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

8. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

9. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power

supply or ground line.

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Operational Notes – continued

10. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 35. Example of monolithic IC structure

11. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

12. Thermal Shutdown Circuit (TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be

within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the

TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat

damage.

13. Over Current Protection Circuit (OCP)

This IC incorporates an integrated over current protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not

be used in applications characterized by continuous operation or transitioning of the protection circuit.

14. Vcc Pin

Insert a capacitor (Vo ≥ 5.0V : capacitor ≥ 1µF, 1.5V < Vo ≤ 5.0V : capacitor ≥ 2.2µF) between the Vcc and GND pins.

Choose the capacitance according to the line between the power smoothing circuit and the Vcc pin. Selection of the

capacitance also depends on the application. Verify the application and allow for sufficient margins in the design. We

recommend using a capacitor with excellent voltage and temperature characteristics.

Electric capacitor

IC

Ceramic capacitor, Low ESR capacitor

Figure 36. Input Capacitor

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Operational Notes – continued

15. Output Pin

In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND pin. We recommend a

capacitor with a capacitance of more than 2.2μF(Min) (3.0V ≤ Vo ≤ 16.0V). Electrolytic, tantalum and ceramic capacitors

can be used. We recommend a capacitor with a capacitance of more than 4.7μF(Min) (1.5V ≤ Vo < 3.0V). Ceramic

capacitors can be used. When selecting the capacitor ensure that the capacitance of more than 2.2μF(Min)(3.0V ≤ Vo ≤

16.0V) or more than 4.7μF(Min)(1.5V ≤ Vo < 3.0V) is maintained at the intended applied voltage and temperature range.

Due to changes in temperature, the capacitance can fluctuate possibly resulting in oscillation. For selection of the

capacitor refer to the Cout ESR vs Io data. The stable operation range given in the reference data is based on the

standalone IC and resistive load. For actual applications the stable operating range is influenced by the PCB

impedance, input supply impedance and load impedance. Therefore verification of the final operating environment is

needed.

When selecting a ceramic type capacitor, we recommend using X5R, X7R or better with excellent temperature and

DC-biasing characteristics and high voltage tolerance.

Also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying that

the actual application meets with the required specification.

4.0V ≤ Vcc ≤ 26.5V

1.5V ≤ Vo < 3.0V

3.0V ≤ Vo ≤ 16.0V

-40ꢀC ≤ Ta ≤ +105°C

5kΩ ≤ R₁≤ 10kΩ (BD00FD0W)

2.2µF ≤ Cin ≤ 100µF

4.7µF ≤ Cout ≤ 100µF

-40ꢀC ≤ Ta ≤ +105°C

5kΩ ≤ R₁≤ 10kΩ (BD00FD0W)

1.0µF ≤ Cin ≤ 100µF

2.2µF ≤ Cout ≤ 100µF

100

Unstable operating region

Stable operating region

Unstable operating region

10

1

10

1

Stable operating region

0.1

0.01

0.001

0

400

800

1200

Io(mA)

1600

2000

0

400

800

1200

Io(mA)

1600

2000

Cout ESR vs Io

3.0V ≤ Vo ≤ 16.0V

1.5V ≤ Vo < 3.0V

Vcc

Vo

Cin

Cout

ESR

R₂

V_CC

(4.0V to 26.5V)

Io

(Rout)

CTL

ADJ

GND

V_CTL

(5.0V)

R₁

(5k to 10kΩ)

Measurement circuit (BD00FD0W)

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Operational Notes – continued

16. CTL Pin

Do not set the voltage level on the IC's enable pin in between VthH and VthL. Do not leave it floating or unconnected,

otherwise, the output voltage would be unstable.

17. Rapid variation in Vcc Voltage and load Current CTL Pin

In case of a rapidly changing input voltage, transients in the output voltage might occur due to the use of a MOSFET as

output transistor. Although the actual application might be the cause of the transients, the IC input voltage, output

current and temperature are also possible causes. In case problems arise within the actual operating range, use

countermeasures such as adjusting the output capacitance.

18. Minute variation in output voltage

In case of using an application susceptible to minute changes to the output voltage due to noise, changes in input and

load current, etc., use countermeasures such as implementing filters.

19. Regarding the Input Pin and Vcc voltage

In some applications, the Vcc and pin potential might be reversed, possibly resulting in circuit internal damage or

damage to the elements. For example, while the external capacitor is charged, the Vcc shorts to the GND. Use a

capacitor with a capacitance with less than 1000μF. We also recommend using reverse polarity diodes in series or a

bypass between all pins and the Vcc pin.

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Physical Dimension, Tape and Reel Information

Package Name

HRP5

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Package Name

TO263-5

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Marking Diagrams

Output

Voltage[V]

Part Number

Marking

HRP5

Variable

1.5

D00FD0WHFP

D15FD0WHFP

D18FD0WHFP

D25FD0WHFP

D30FD0WHFP

D33FD0WHFP

D50FD0WHFP

D80FD0WHFP

D90FD0WHFP

DJ2FD0WHFP

DJ5FD0WHFP

DJ6FD0WHFP

HRP5 (TOP VIEW)

1.8

Part Number Marking

LOT Number

2.5

3.0

3.3

5.0

8.0

9.0

12.0

15.0

16.0

1PIN MARK

TO263-5

Output

Voltage[V]

Part Number

Marking

TO263-5 (TOP VIEW)

Variable

1.5

00FD0WFP2

15FD0WFP2

18FD0WFP2

25FD0WFP2

30FD0WFP2

33FD0WFP2

50FD0WFP2

80FD0WFP2

90FD0WFP2

J2FD0WFP2

J5FD0WFP2

J6FD0WFP2

Part Number Marking

LOT Number

1.8

2.5

3.0

3.3

5.0

8.0

9.0

12.0

15.0

16.0

1PIN

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Revision History

Date

Revision

Changes

21.Mar.2017

15.Mar.2018

09.Sep.2019

001

002

003

New Release

TO263-5 package added

Figure 12 changed

Notation variation fixed

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.004


型号：	BD50FD0WHFP
厂家：	ROHM
描述：	BDxxFD0系列是可提供最大2A电流的低饱和型稳压器。输出电压有可通过外部电阻设定的可变型和固定型。本系列内置防止因输出短路等发生IC破坏的过流保护电路、以及防止因过负荷状态等使IC发生热破坏的过热保护电路。稳压器
文件：	总31页 (文件大小：1846K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD50FD0WHFP [ROHM]

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