BD52013GUL-E2 [ROHM]
Unipolar Detection Hall ICs; 单极检测霍尔IC型号: | BD52013GUL-E2 |
厂家: | ROHM |
描述: | Unipolar Detection Hall ICs |
文件: | 总14页 (文件大小:378K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Hall IC Series
Unipolar Detection
Hall ICs
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV
No.10045EBT03
●Description
The unipolar Detection Hall IC detects only either the N pole or S pole. The output turns ON (active Low) upon detection.
It is most suitable for strictly unipole detection and when lower power consumption is desired.
●Features
1) unipolar detection
2) Micropower operation (small current using intermittent operation method)
3) Ultra-compact CSP4 package (BU52002GUL,BU52003GUL)
4) Small outline package (BU52012HFV,BU52013HFV)
5) Line up of supply voltage
For 1.8V Power supply voltage(BU52012HFV,BU52013HFV)
For 3.0V Power supply voltage (BU52002GUL,BU52003GUL)
6) High ESD resistance 8kV(HBM)
●Applications
Mobile phones, notebook computers, digital video camera, digital still camera, etc.
●Product Lineup
Supply voltage Operate point Hysteresis
Period
(ms)
50
50
50
Supply current
(AVG.)(μA)
Product name
Output type
Package
(V)
(mT)
3.7※
-3.7※
3.0※
-3.0※
(mT)
0.8
0.8
0.9
0.9
BU52002GUL
BU52003GUL
BU52012HFV
BU52013HFV
2.40~3.30
2.40~3.30
1.65~3.30
1.65~3.30
6.5
6.5
3.5
3.5
CMOS
CMOS
CMOS
CMOS
VCSP50L1
VCSP50L1
HVSOF5
50
HVSOF5
※Plus is expressed on the S-pole; minus on the N-pole
●Absolute Maximum Ratings
BU52002GUL,BU52003GUL (Ta=25℃)
Parameters
Symbol
Limit
Unit
1
Power Supply Voltage
Output Current
VDD
IOUT
Pd
-0.1~+4.5※
V
mA
mW
℃
±1
420※
2
Power Dissipation
Operating Temperature Range
Topr
Tstg
-40~+85
Storage Temperature Range
-40~+125
℃
※1. Not to exceed Pd
※2. Reduced by 4.20mW for each increase in Ta of 1℃over 25℃(mounted on 50mm×58mm Glass-epoxy PCB)
BU52012HFV,BU52013HFV (Ta=25℃)
Parameters
Symbol
Limit
Unit
3
Power Supply Voltage
VDD
IOUT
Pd
-0.1~+4.5※
V
mA
mW
℃
Output Current
±0.5
4
Power Dissipation
536※
Operating Temperature Range
Topr
Tstg
-40~+85
Storage Temperature Range
-40~+125
℃
※3. Not to exceed Pd
※4. Reduced by 5.36mW for each increase in Ta of 1℃over 25℃(mounted on 70mm×70mm×1.6mm Glass-epoxy PCB)
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.01 - Rev.B
1/13
Technical Note
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV
●Magnetic, Electrical Characteristics
BU52002GUL (Unless otherwise specified, VDD=3.0V, Ta=25℃)
Limit
Typ
Parameters
Power Supply Voltage
Symbol
VDD
Unit
V
Conditions
Min
2.4
Max
3.3
3.0
Operate Point
BopS
-
3.7
2.9
0.8
50
-
5.5
mT
mT
mT
ms
V
Release Point
BrpS
0.8
-
Hysteresis
BhysS
TP
-
-
100
-
Period
-
※
Output High Voltage
Output Low Voltage
Supply Current
VOH
VDD-0.4
B<BrpS 5 , IOUT=-1.0mA
BopS<B※5 , IOUT =+1.0mA
Average
VOL
-
-
-
-
-
0.4
9
V
IDD(AVG)
IDD(EN)
IDD(DIS)
6.5
4.7
3.8
μA
mA
μA
Supply Current During Startup Time
Supply Current During Standby Time
-
During Startup Time Value
During Standby Time Value
-
※5. B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed.
BU52003GUL (Unless otherwise specified, V =3.0V, Ta=25℃)
DD
Limit
Typ
Parameters
Power Supply Voltage
Symbol
VDD
Unit
V
Conditions
Min
2.4
Max
3.3
3.0
-3.7
-2.9
0.8
50
Operate Point
BopN
-5.5
-
mT
mT
mT
ms
V
Release Point
BrpN
-
-0.8
Hysteresis
BhysN
TP
-
-
100
-
Period
-
Output High Voltage
Output Low Voltage
Supply Current
VOH
VDD-0.4
-
BrpN<B※6 , IOUT=-1.0mA
B<BopN※6 , IOUT =+1.0mA
Average
VOL
-
-
-
-
-
0.4
9
V
IDD(AVG)
IDD(EN)
IDD(DIS)
6.5
4.7
3.8
μA
mA
μA
Supply Current During Startup Time
-
During Startup Time Value
During Standby Time Value
Supply Current During Standby Time
-
※6. B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed.
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.01 - Rev.B
2/13
Technical Note
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV
BU52012HFV (Unless otherwise specified, V =1.80V, Ta=25℃)
DD
Limit
Typ
Parameters
Power Supply Voltage
Symbol
Unit
Conditions
Min
Max
3.30
VDD
BopS
1.65
1.80
3.0
2.1
0.9
50
V
Operate Point
-
5.0
mT
mT
mT
ms
V
Release Point
BrpS
0.6
-
Hysteresis
BhysS
-
-
Period
TP
-
100
Output High Voltage
Output Low Voltage
VOH
VDD-0.2
-
-
0.2
5.5
-
B<BrpS※6 , IOUT =-0.5mA
BopS<B※6 , IOUT =+0.5mA
VDD=1.8V, Average
VOL
-
-
-
-
-
-
-
-
V
Supply Current 1
IDD1(AVG)
IDD1(EN)
IDD1(DIS)
IDD2(AVG)
IDD2(EN)
IDD2(DIS)
3.5
2.8
1.8
6.5
4.5
4.0
μA
mA
μA
μA
mA
μA
VDD=1.8V,
During Startup Time Value
VDD=1.8V,
During Standby Time Value
Supply Current During Startup Time 1
Supply CurrentDuring Standby Time 1
Supply Current 2
-
9
VDD=2.7V, Average
VDD=2.7V,
During Startup Time Value
VDD=2.7V,
During Standby Time Value
-
Supply Current During Startup Time 2
-
Supply CurrentDuring Standby Time 2
※6. B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed.
BU52013HFV (Unless otherwise specified, VDD=1.80V, Ta=25℃)
Limit
Typ
Parameters
Power Supply Voltage
Symbol
VDD
Unit
V
Conditions
Min
Max
3.30
1.65
1.80
BopN
-5.0
-3.0
-2.1
0.9
50
-
mT
mT
mT
ms
V
Operate Point
BrpN
-
-0.6
Release Point
BhysN
-
-
Hysteresis
TP
-
100
Period
VOH
VDD-0.2
-
-
0.2
5.5
-
BrpN<B※7 , IOUT =-0.5mA
Output High Voltage
VOL
-
-
-
-
-
-
-
-
V
B<BopN 7 , IOUT =+0.5mA
※
Output Low Voltage
IDD1(AVG)
IDD1(EN)
IDD1(DIS)
IDD2(AVG)
IDD2(EN)
IDD2(DIS)
3.5
2.8
1.8
6.5
4.5
4.0
μA
mA
μA
μA
mA
μA
VDD=1.8V, Average
Supply Current 1
VDD=1.8V,
During Startup Time Value
Supply Current During Startup Time 1
Supply CurrentDuring Standby Time 1
Supply Current 2
VDD=1.8V,
During Standby Time Value
-
9
VDD=2.7V,Average
VDD=2.7V,
During Startup Time Value
-
Supply Current During Startup Time 2
Supply CurrentDuring Standby Time 2
VDD=2.7V,
During Standby Time Value
-
※7 B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed.
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.01 - Rev.B
3/13
Technical Note
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV
●Figure of mesurement circuit
Tp
Bop/Brp
200Ω
VDD
VDD
GND
VDD
OUT
VDD
100μF
OUT
Oscilloscope
GND
V
Bop and Brp are measured with applying the magnetic field
from the outside.
The period is monitored by Oscilloscope.
Fig.2 Tp mesurement circuit
Fig.1 Bop,Brp mesurement circuit
VOH
Product Name
IOUT
BU52002GUL, BU52003GUL
BU52012HFV, BU52013HFV
1.0mA
0.5mA
VDD
OUT
VDD
100μF
GND
IOUT
V
Fig.3 VOH mesurement circuit
VOL
Product Name
IOUT
BU52002GUL, BU52003GUL
BU52012HFV, BU52013HFV
1.0mA
0.5mA
VDD
VDD
100μF
OUT
GND
V
IOUT
Fig.4 VOL mesurement circuit
IDD
A
VDD
2200μF
VDD
OUT
GND
Fig.5 IDD mesurement circuit
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2010.01 - Rev.B
4/13
© 2010 ROHM Co., Ltd. All rights reserved.
Technical Note
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV
●Technical (Reference) Data
BU52002GUL (VDD=2.4~3.3V type)
100
90
80
70
60
50
40
30
20
10
0
8.0
6.0
8.0
6.0
VDD=3.0V
Ta = 25°C
V
DD=3.0V
Bop S
Brp S
Bop S
Brp S
4.0
4.0
2.0
2.0
0.0
0.0
-2.0
-4.0
-6.0
-8.0
-2.0
-4.0
-6.0
-8.0
-60 -40 -20
0
20 40 60 80 100
-60 -40 -20
0
20 40 60 80 100
2.0
2.4
2.8
3.2
3.6
AMBIENT TEMPERATURE [
]
℃
SUPPLY VOLTAGE
V
[ ]
AMBIENT TEMPERATURE [
]
℃
Fig.8 TP –Ambient temperature
Fig.6 Bop,Brp – Ambient temperature
Fig.7 Bop,Brp – Supply voltage
100
90
20.0
18.0
20.0
18.0
VDD=3.0V
16.0
Ta = 25°C
80
16.0
Ta = 25°C
14.0
12.0
10.0
8.0
70
60
50
40
30
20
10
0
14.0
12.0
10.0
8.0
6.0
6.0
4.0
4.0
2.0
2.0
0.0
0.0
-60 -40 -20
0
20 40 60 80 100
2.0
2.4
2.8
3.2
3.6
2.0
2.4
2.8
3.2
3.6
SUPPLY VOLTAGE [V]
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
Fig.11
I
DD – Supply voltage
Fig.9 TP – Supply voltage
Fig.10 IDD – Ambient temperature
BU52003GUL (VDD=2.4~3.3V type)
8.0
6.0
8.0
100
90
80
70
60
50
40
30
20
10
0
6.0
Ta = 25°C
VDD=3.0V
VDD=3.0V
4.0
4.0
2.0
0.0
2.0
0.0
Brp N
Bop N
Brp N
-2.0
-2.0
-4.0
-6.0
-8.0
-4.0
Bop N
-6.0
-8.0
-60 -40 -20
0
20 40 60 80 100
-60 -40 -20
0
20 40 60 80 100
2.0
2.4
2.8
3.2
3.6
AMBIENT TEMPERATURE [
]
℃
SUPPLY VOLTAGE
V
]
[
AMBIENT TEMPERATURE [
]
℃
Fig.14 TP – Ambient temperature
Fig.13 Bop,Brp – Supply voltage
Fig.12 Bop,Brp – Ambient temperature
100
20.0
18.0
20.0
18.0
90
Ta = 25°C
80
VDD=3.0V
Ta = 25°C
16.0
16.0
14.0
12.0
10.0
8.0
70
60
50
40
30
20
10
0
14.0
12.0
10.0
8.0
6.0
6.0
4.0
4.0
2.0
2.0
0.0
0.0
-60 -40 -20
0
20 40 60 80 100
2.0
2.4
2.8
3.2
3.6
2.0
2.4
2.8
3.2
3.6
SUPPLY VOLTAGE [V]
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
Fig.17
I
DD – Supply voltage
Fig.16
IDD – Ambient temperature
Fig.15 TP –Supply voltage
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.01 - Rev.B
5/13
Technical Note
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV
BU52012HFV (VDD=1.65V~3.3V type)
100
90
80
70
60
50
40
30
20
10
0
8.0
6.0
8.0
6.0
Ta = 25°C
VDD=1.8V
Bop S
Brp S
VDD=1.8V
Bop S
Brp S
4.0
4.0
2.0
2.0
0.0
0.0
-2.0
-4.0
-6.0
-8.0
-2.0
-4.0
-6.0
-8.0
-60 -40 -20
0
20 40 60 80 100
-60 -40 -20
0
20 40 60 80 100
1.4 1.8 2.2 2.6 3.0 3.4 3.8
SUPPLY VOLTAGE
AMBIENT TEMPERATURE [
]
℃
V
[
]
AMBIENT TEMPERATURE [
]
℃
Fig.19 Bop,Brp – Supply voltage
Fig.18 Bop,Brp – Ambient temperature
Fig.20 TP – Ambient temperature
20.0
18.0
100
90
20.0
18.0
VDD=1.8V
Ta = 25°C
80
16.0
Ta = 25°C
16.0
14.0
12.0
10.0
8.0
14.0
12.0
10.0
8.0
70
60
50
40
30
20
10
0
6.0
6.0
4.0
4.0
2.0
2.0
0.0
0.0
-60 -40 -20
0
20 40 60 80 100
1.4 1.8 2.2 2.6 3.0 3.4 3.8
SUPPLY VOLTAGE [V]
1.4
1.8 2.2
2.6 3.0
3.4 3.8
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
Fig.23 IDD – Supply voltage
Fig.21 TP – Supply voltage
Fig.22 IDD – Ambient temperature
BU52013HFV (VDD=1.65V~3.3V type)
8.0
8.0
100
90
6.0
4.0
6.0
Ta = 25°C
VDD=1.8V
VDD=1.8V
80
4.0
2.0
70
60
50
40
30
20
10
0
2.0
0.0
0.0
Brp N
Brp N
Bop N
-2.0
-4.0
-6.0
-8.0
-2.0
-4.0
Bop N
-6.0
-8.0
-60 -40 -20
0
20 40 60 80 100
-60 -40 -20
0
20 40 60 80 100
1.4 1.8 2.2 2.6 3.0 3.4 3.8
SUPPLY VOLTAGE
AMBIENT TEMPERATURE [
]
℃
V
[
]
AMBIENT TEMPERATURE [
]
℃
Fig.26 TP – Ambient temperature
Fig.24 Bop,Brp – Ambient temperature
Fig.25 Bop,Brp – Supply voltage
20.0
18.0
100
90
20.0
18.0
VDD=1.8V
Ta = 25°C
Ta = 25°C
16.0
16.0
14.0
12.0
10.0
8.0
80
70
60
50
40
30
20
10
14.0
12.0
10.0
8.0
6.0
6.0
4.0
4.0
2.0
2.0
0
0.0
0.0
1.4 1.8 2.2 2.6 3.0 3.4 3.8
-60 -40 -20
0
20 40 60 80 100
1.4 1.8 2.2 2.6 3.0 3.4 3.8
SUPPLY VOLTAGE [V]
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
Fig.29 IDD – Supply voltage
Fig.27 TP – Supply voltage
Fig.28 IDD – Ambient temperature
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2010.01 - Rev.B
6/13
© 2010 ROHM Co., Ltd. All rights reserved.
Technical Note
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV
●Block Diagram
BU52002GUL, BU52003GUL
0.1μF
VDD
A1
Adjust the bypass capacitor
value as necessary, according
to voltage noise conditions, etc.
TIMING LOGIC
HALL
ELEMENT
The CMOS output terminals enable
direct connection to the PC, with no
external pull-up resistor required.
B1
A2
×
OUT
GND
Fig.30
PIN No. PIN Name
Function
POWER SUPPLY
GROUND
Comment
A2
B2
A1
B1
A1
B1
A2
A1
A2
B1
B2
VDD
GND
OUT
N.C.
OUTPUT
B2
OPEN or Short to GND.
Surface
Reverse
BU52012HFV, BU52013HFV
0.1µF
VDD
4
Adjust the bypass capacitor
value as necessary, according
to voltage noise conditions, etc.
TIMING LOGIC
The CMOS output terminals enable direct
connection to the PC, with no external pull-up
resistor required
HALL
ELEMENT
5
2
×
OUT
GND
Fig.31
4
4
3
5
1
5
PIN No.
PIN NAME
N.C.
FUNCTION
COMMENT
1
2
3
4
5
OPEN or Short to GND.
GND
GROUND
N.C.
OPEN or Short to GND.
2
3
2
1
VDD
POWER SUPPLY
OUTPUT
Surface
Reverse
OUT
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2010.01 - Rev.B
7/13
© 2010 ROHM Co., Ltd. All rights reserved.
Technical Note
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV
●Description of Operations
(Micropower Operation)
The unipolar detection Hall IC adopts an intermittent
operation method to save energy. At startup, the Hall
IDD
elements, amp, comparator and other detection circuits
power ON and magnetic detection begins. During standby,
the detection circuits power OFF, thereby reducing current
consumption. The detection results are held while standby
is active, and then output.
Period
Startup time
Standby
Reference period: 50ms (MAX100ms)
Reference startup time: 24μs
t
Fig.32
(Offset Cancelation)
VDD
The Hall elements form an equivalent Wheatstone (resistor)
bridge circuit. Offset voltage may be generated by a
differential in this bridge resistance, or can arise from changes
in resistance due to package or bonding stress. A dynamic
offset cancellation circuit is employed to cancel this offset
voltage.
When Hall elements are connected as shown in Fig. 33 and a
magnetic field is applied perpendicular to the Hall elements,
voltage is generated at the mid-point terminal of the bridge.
This is known as Hall voltage.
I
+
B
×
Hall Voltage
Dynamic cancellation switches the wiring (shown in the figure)
to redirect the current flow to a 90˚ angle from its original path,
and thereby cancels the Hall voltage.
-
The magnetic signal (only) is maintained in the sample/hold
circuit during the offset cancellation process and then
released.
GND
Fig.33
(Magnetic Field Detection Mechanism)
S
N
S
S
N
S
N
Flux
Flux
Fig.34
The Hall IC cannot detect magnetic fields that run horizontal to the package top layer.
Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer.
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.01 - Rev.B
8/13
Technical Note
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV
BU52002GUL,BU52012HFV
S-Pole
N
S
N
S
S
N
OUT [V]
Flux
Flux
High
High
High
Low
B
Brp S
Bop S
0
Magnetic flux density [mT]
Fig.35 S-Pole Detection
N-Pole
S-Pole
BU52002GUL,BU52012HFV detects and outputs for the S-pole only. Since it is unipolar, it does not recognize the N-pole.
BU52003GUL,BU52013HFV
N-Pole
N
S
N
S
S
N
OUT [V]
Flux
Flux
High
High
B
High
Low
Bop N Brp N
0
N-Pole
S-Pole
Magnetic flux density [mT]
Fig.36 N-Pole Detection
BU52003GUL,BU52013HFV detects and outputs for the N-pole only. Since it is unipolar, it does not recognize the S-pole.
The unipolar detection Hall IC detects magnetic fields running perpendicular to the top surface of the package. There is an
inverse relationship between magnetic flux density and the distance separating the magnet and the Hall IC: when distance
increases magnetic density falls. When it drops below the operate point (Bop), output goes HIGH. When the magnet gets
closer to the IC and magnetic density rises, to the operate point, the output switches LOW. In LOW output mode, the
distance from the magnet to the IC increases again until the magnetic density falls to a point just below Bop, and output
returns HIGH. (This point, where magnetic flux density restores HIGH output, is known as the release point, Brp.) This
detection and adjustment mechanism is designed to prevent noise, oscillation and other erratic system operation.
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.01 - Rev.B
9/13
Technical Note
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV
●Intermittent Operation at Power ON
Power ON
VDD
Startup time
Indefinite
Standby time
High
Startup time
Standby time
Supply current
(Intermittentaction)
OUT
(No magnetic
field present)
Indefinite
OUT
(Magnetic
field present)
Low
Fig.37
The unipolar detection Hall IC adopts an intermittent operation method in detecting the magnetic field during startup, as
shown in Fig. 37. It outputs to the appropriate terminal based on the detection result and maintains the output condition
during the standby period. The time from power ON until the end of the initial startup period is an indefinite interval, but it
cannot exceed the maximum period, 100ms. To accommodate the system design, the Hall IC output read should be
programmed within 100ms of power ON, but after the time allowed for the period ambient temperature and supply voltage.
●Magnet Selection
Of the two representative varieties of permanent magnet, neodymium generally offers greater magnetic power per volume
than ferrite, thereby enabling the highest degree of miniaturization, Thus, neodymium is best suited for small equipment
applications. Fig. 38 shows the relation between the size (volume) of a neodymium magnet and magnetic flux density. The
graph plots the correlation between the distance (L) from three versions of a 4mm X 4mm cross-section neodymium magnet
(1mm, 2mm, and 3mm thick) and magnetic flux density. Fig. 39 shows Hall IC detection distance – a good guide for
determining the proper size and detection distance of the magnet. Based on the BU52012HFV,BU52013HFV operating point
max 5.0 mT, the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 7.6mm, 9.22mm, and 10.4mm,
respectively. To increase the magnet’s detection distance, either increase its thickness or sectional area.
10
9
t=3mm
8
7
6
5
4
3
2
1
0
t=1mm
t=2mm
7.6mm 9.2mm
10.4mm
0
2
4
6
8
10
12
14
16
18
20
Distance between magnet and Hall IC [mm]
Fig.38
X
Magnet material: NEOMAX-44H (material)
Maker: NEOMAX CO.,LTD.
Magnet
t
t
Y
X=Y=4mm
t=1mm,2mm,3mm
L: Variable
…Flux density measuring point
Magnet size
Fig.39 Magnet Dimensions and Flux Density Measuring Point
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.01 - Rev.B
10/13
Technical Note
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV
●Position of the Hall Effect IC(Reference)
HVSOF5
VCSP50L1
0.55
0.6
0.55
0.35
0.8
0.2
(UNIT:mm)
●Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition)
HVSOF5
VCSP50L1
(UNIT:mm)
Strings
Size(Typ.)
0.50
e
b3
SD
SE
0.25
0.25
0.25
●Terminal Equivalent Circuit Diagram
Because they are configured for CMOS (inverter) output, the output pins require no external resistance and allow direct
connection to the PC. This, in turn, enables reduction of the current that would otherwise flow to the external resistor during
magnetic field detection, and supports overall low current (micropower) operation.
OUT
VDD
GND
Fig.40
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.01 - Rev.B
11/13
Technical Note
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV
●Notes for use
1)Absolute maximum ratings
Exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or
destruction of the IC. Because the source (short mode or open mode) cannot be identified if the device is damaged in this
way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in
excess of absolute rating limits.
2)GND voltage
Make sure that the GND terminal potential is maintained at the minimum in any operating state, and is always kept lower
than the potential of all other pins.
3)Thermal design
Use a thermal design that allows for sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
4)Pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. Mounting errors, such as improper positioning
or orientation, may damage or destroy the device. The IC may also be damaged or destroyed if output pins are shorted
together, or if shorts occur between the output pin and supply pin or GND.
5)Positioning components in proximity to the Hall IC and magnet
Positioning magnetic components in close proximity to the Hall IC or magnet may alter the magnetic field, and therefore
the magnetic detection operation. Thus, placing magnetic components near the Hall IC and magnet should be avoided in
the design if possible. However, where there is no alternative to employing such a design, be sure to thoroughly test and
evaluate performance with the magnetic component(s) in place to verify normal operation before implementing the design.
6)Operation in strong electromagnetic fields
Exercise extreme caution about using the device in the presence of a strong electromagnetic field, as such use may cause
the IC to malfunction.
7)Common impedance
Make sure that the power supply and GND wiring limits common impedance to the extent possible by, for example,
employing short, thick supply and ground lines. Also, take measures to minimize ripple such as using an inductor or
capacitor.
8)GND wiring pattern
When both a small-signal GND and high-current GND are provided, single-point grounding at the reference point of the set
PCB is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes
due to the wiring resistance and high current do not cause any voltage fluctuation in the small-signal GND. In the same
way, care must also be taken to avoid wiring pattern fluctuations in the GND wiring pattern of external components.
9)Exposure to strong light
Exposure to halogen lamps, UV and other strong light sources may cause the IC to malfunction. If the IC is subject to such
exposure, provide a shield or take other measures to protect it from the light. In testing, exposure to white LED and
fluorescent light sources was shown to have no significant effect on the IC.
10)Power source design
Since the IC performs intermittent operation, it has peak current when it’s ON. Please taking that into account and under
examine adequate evaluations when designing the power source.
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2010.01 - Rev.B
12/13
© 2010 ROHM Co., Ltd. All rights reserved.
Technical Note
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV
●Ordering part number
B
U
5
2
0
0
2
G U
L
-
E
2
Part No
Part No
52002,52003,
52012,52013
Package
GUL : VSCP50L1
HFV : HVSOF5
Packaging and forming specification
E2: Embossed tape and reel
(VSCP50L1)
TR: Embossed tape and reel
(HVSOF5)
VCSP50L1 (BU52002GUL,BU52003GUL)
<Tape and Reel information>
Tape
Embossed carrier tape
3000pcs
Quantity
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
Direction of feed
1pin
(Unit:mm)
Reel
Order quantity needs to be multiple of the minimum quantity.
∗
HVSOF5
<Tape and Reel information>
1.6 0.05
1.0 0.05
(0.8)
(0.3)
Tape
Embossed carrier tape
Quantity
3000pcs
TR
Direction
of feed
5
1
4
3
4
5
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
3
2 1
2
1pin
0.13 0.05
S
0.1
0.22 0.05
S
0.5
M
Direction of feed
Order quantity needs to be multiple of the minimum quantity.
0.08
Reel
(Unit : mm)
∗
www.rohm.com
2010.01 - Rev.B
13/13
© 2010 ROHM Co., Ltd. All rights reserved.
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Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
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implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
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The Products specified in this document are intended to be used with general-use electronic
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While ROHM always makes efforts to enhance the quality and reliability of its Products, a
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Please be sure to implement in your equipment using the Products safety measures to guard
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The Products are not designed or manufactured to be used with any equipment, device or
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R1010
A
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