BD52014HFV-E2 [ROHM]
Omnipolar Detection Hall ICs (Polarity detection for both S and N features dual outputs); 全极霍尔检测器IC（极性检测为S和N采用了双输出）
| 型号： | BD52014HFV-E2 |
| 厂家： | 
ROHM |
| 描述： | Omnipolar Detection Hall ICs (Polarity detection for both S and N features dual outputs) |
| 文件： | 总12页 (文件大小：359K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Hall IC Series
Omnipolar Detection Hall ICs
(Polarity detection for
both S and N features dual outputs)
BU52004GUL, BU52014HFV
No.10045EDT01
●Description
The BU52004GUL and BU52014HFV are bipolar Hall ICs incorporating a polarity determination circuit that enables
operation (output) on both the S- and N-poles, with the polarity judgment based on the output processing configuration.
These Hall IC products can be in with movie, mobile phone and other applications involving crystal panels to detect the
(front-back) location or determine the rotational direction of the panel.
●Features
1) Omnipolar detection (polarity detection for both S and N features dual outputs)
2) Micropower operation (small current using intermittent operation method)
3) Ultra-compact CSP4 package(BU52004GUL)
4) Small outline package (BU52014HFV)
5) Line up of supply voltage
For 1.8V Power supply voltage (BU52014HFV)
For 3.0V Power supply voltage (BU52004GUL)
6) Polarity judgment and output on both poles (OUT1: S-pole output; OUT2: N-pole output)
7) High ESD resistance 8kV(HBM)
●Applications
Mobile phones, notebook computers, digital video camera, digital still camera, etc.
●Product Lineup
Supply
voltage
(V)
Supply current
(AVG. )
Operate point Hysteresis
Period
(ms)
Product name
Output type
Package
(mT)
(mT)
(μA)
※
※
BU52004GUL
BU52014HFV
2.40～3.30
+/-3.7
+/-3.0
0.8
0.9
50
50
8.0
5.0
CMOS
CMOS
VCSP50L1
HVSOF5
1.65～3.30
※Plus is expressed on the S-pole; minus on the N-pole
●Absolute Maximum Ratings
BU52004GUL (Ta=25℃)
PARAMETERS
SYMBOL
LIMIT
UNIT
V
1
Power Supply Voltage
Output Current
VDD
IOUT
Pd
-0.1 ~ +4.5※
±1
420※
mA
mW
℃
2
Power Dissipation
Operating Temperature Range
Topr
Tstg
-40 ~ +85
Storage Temperature Range
-40 ~ +125
℃
※1. Not to exceed Pd
※2. Reduced by 4.20mW for each increase in Ta of 1℃ over 25℃
(mounted on 50mm×58mm Glass-epoxy PCB)
BU52014 HFV (Ta=25℃)
PARAMETERS
SYMBOL
VDD
LIMIT
-0.1 ~ +4.5※
±0.5
UNIT
V
3
Power Supply Voltage
Output Current
IOUT
Pd
mA
mW
℃
4
Power Dissipation
536※
Operating Temperature Range
Storage Temperature Range
Topr
Tstg
-40 ~ +85
-40 ~ +125
℃
※3. Not to exceed Pd
※4. Reduced by 5.36mW for each increase in Ta of 1℃ over 25℃
(mounted on 70mm×70mm×1.6mm Glass-epoxy PCB)
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.01 - Rev.D
1/11
Technical Note
BU52004GUL, BU52014HFV
●Magnetic, Electrical Characteristics
BU52004GUL (Unless otherwise specified, VDD＝3.0V, Ta＝25℃)
LIMIT
TYP MAX
3.0
PARAMETERS
Power Supply Voltage
SYMBOL
VDD
UNIT
V
CONDITIONS
MIN
2.4
3.3
OUTPUT：OUT1
(respond the south pole)
OUTPUT：OUT2
(respond the north pole)
OUTPUT：OUT1
(respond the south pole)
OUTPUT：OUT2
BopS
-
-5.5
0.8
-
3.7
5.5
Operate Point
mT
BopN
BrpS
BrpN
-3.7
2.9
-
-
Release Point
Hysteresis
mT
mT
-2.9
-0.8
(respond the north pole)
BhysS
BhysN
Tp
-
-
0.8
0.8
50
-
-
Period
-
100
ms
V
5
※
VDD
-0.4
BrpN<B<BrpS
OUT =-1.0mA
Output High Voltage
VOH
VOL
-
-
-
I
5
※
B<BopN, BopS<B
IOUT =+1.0mA
Average
Output Low Voltage
-
0.4
V
Supply Current
IDD(AVG)
IDD(EN)
IDD(DIS)
-
-
-
8
12
-
μA
mA
μA
Supply Current During Startup Time
Supply Current During Standby Time
4.7
3.8
During Startup Time Value
During Standby Time Value
-
※5. B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to
the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
BU52014HFV (Unless otherwise specified, VDD＝1.80V, Ta＝25℃)
LIMIT
TYP MAX
PARAMETERS
Power Supply Voltage
SYMBOL
VDD
UNIT
V
CONDITIONS
MIN
1.65
1.80
3.30
OUTPUT：OUT1
(respond the south pole)
OUTPUT：OUT2
(respond the north pole)
OUTPUT：OUT1
(respond the south pole)
OUTPUT：OUT2
BopS
-
-5.0
0.6
-
3.0
5.0
Operate Point
mT
BopN
BrpS
BrpN
-3.0
2.1
-
-
Release Point
Hysteresis
mT
mT
-2.1
-0.6
(respond the north pole)
BhysS
BhysN
Tp
-
-
0.9
0.9
50
-
-
Period
-
100
ms
V
6
※
VDD
-0.2
BrpN<B<BrpS
Output High Voltage
VOH
-
-
I
OUT =-0.5mA
6
※
B<BopN, BopS<B
IOUT =+0.5mA
Output Low Voltage
VOL
-
-
-
-
5
0.2
8
V
Supply Current 1
IDD1(AVG)
IDD1(EN)
μA
mA
VDD=1.8V, Average
VDD=1.8V,
During Startup Time Value
Supply Current During Startup Time 1
2.8
-
V
DD=1.8V,
Supply Current During Standby Time 1
Supply Current 2
IDD1(DIS)
IDD2(AVG)
IDD2(EN)
-
-
-
1.8
8
-
12
-
μA
μA
During Standby Time Value
VDD=2.7V, Average
VDD=2.7V,
During Startup Time Value
VDD=2.7V,
Supply Current During Startup Time 2
4.5
mA
Supply Current During Standby Time 2
IDD2(DIS)
-
4.0
-
μA
During Standby Time Value
※6. B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to
the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.01 - Rev.D
2/11
Technical Note
BU52004GUL, BU52014HFV
●Figure of measurement circuit
Tp
Bop/Brp
200Ω
VDD
VDD
VDD
OUT
VDD
OUT
100μF
Oscilloscope
GND
GND
V
Bop and Brp are measured with applying the magnetic field
from the outside.
The period is monitored by Oscilloscope.
Fig.2 Tp measurement circuit
Fig.1 Bop,Brp measurement circuit
VOH
Product Name
BU52004GUL
IOUT
1.0mA
0.5mA
VDD
OUT
BU52014HFV
VDD
100μF
GND
IOUT
V
Fig.3 VOH measurement circuit
VOL
Product Name
BU52004GUL
IOUT
1.0mA
0.5mA
BU52014HFV
VDD
VDD
OUT
100μF
GND
V
IOUT
Fig.4 VOL measurement circuit
IDD
A
VDD
2200μF
VDD
OUT
GND
Fig.5 IDD measurement circuit
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2010.01 - Rev.D
3/11
© 2010 ROHM Co., Ltd. All rights reserved.
Technical Note
BU52004GUL, BU52014HFV
●Technical (Reference) Data
BU52004GUL (VDD=2.4V～3.3V type)
8.0
8.0
6.0
100
95
90
85
80
75
70
65
60
55
50
45
40
6.0
VDD=3.0V
V
DD=3.0V
Bop S
Brp S
Ta = 25°C
Bop S
Brp S
4.0
2.0
4.0
2.0
0.0
0.0
-2.0
-4.0
-6.0
-8.0
Brp N
Bop N
-2.0
-4.0
-6.0
-8.0
Brp N
Bop N
-60 -40 -20
0
20 40 60 80 100
2.0
2.4
2.8
3.2
3.6
-60 -40 -20
0
20 40 60 80 100
SUPPLY VOLTAGE
V
［ ］
AMBIENT TEMPERATURE [
]
℃
AMBIENT TEMPERATURE [
]
℃
Fig.6 Bop,Brp –
Ambient temperature
Fig.7 Bop,Brp –
Supply voltage
Fig.8 TP– Ambient
temperature
100
20.0
18.0
16.0
14.0
12.0
10.0
8.0
20.0
18.0
16.0
14.0
12.0
10.0
8.0
90
80
70
60
50
40
30
20
10
0
Ta = 25°C
VDD=3.0V
Ta = 25°C
6.0
6.0
4.0
4.0
2.0
2.0
0.0
0.0
-60 -40 -20
0
20 40 60 80 100
2.0
2.4
2.8
3.2
3.6
2.0
2.4
2.8
3.2
3.6
SUPPLY VOLTAGE [V]
SUPPLLY VOLTAGE[V]
AMBIENT TEMPERATURE [
]
℃
Fig.11 IDD – Supply voltage
Fig.10 IDD – Ambient
temperature
Fig.9 TP – Supply voltage
BU52014HFV (VDD=1.65V～3.3V type)
8.0
6.0
8.0
100
90
80
70
60
50
40
30
20
10
0
6.0
4.0
Ta = 25°C
Bop S
VDD=1.8V
VDD=1.8V
Bop S
4.0
2.0
2.0
Brp S
Brp N
Brp S
Brp N
0.0
0.0
-2.0
-4.0
-6.0
-8.0
-2.0
-4.0
-6.0
-8.0
Bop N
Bop N
-60 -40 -20
0
20 40 60 80 100
-60 -40 -20
0
20 40 60 80 100
1.4
1.8
2.2
2.6
3.0
3.4
AMBIENT TEMPERATURE [
]
℃
SUPPLY VOLTAGE
V
［ ］
AMBIENT TEMPERATURE [
]
℃
Fig.12 Bop,Brp –
Ambient temperature
Fig.14 TP– Ambient
temperature
Fig.13 Bop,Brp – Supply voltage
100
90
80
70
60
50
40
30
20
10
0
20.0
18.0
16.0
14.0
12.0
10.0
8.0
20.0
18.0
Ta = 25°C
VDD=1.8V
Ta = 25°C
16.0
14.0
12.0
10.0
8.0
6.0
6.0
4.0
4.0
2.0
2.0
0.0
0.0
1.4 1.8 2.2 2.6 3.0 3.4 3.8
SUPPLY VOLTAGE [V]
-60 -40 -20
0
20 40 60 80 100
1.4
1.8
2.2
2.6
3.0
3.4
AMBIENT TEMPERATURE [
]
℃
SUPPLY VOLTAGE[V]
Fig.17 IDD – Supply voltage
Fig.16 IDD – Ambient
temperature
Fig.15 TP– Supply voltage
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.01 - Rev.D
4/11
Technical Note
BU52004GUL, BU52014HFV
●Block Diagram
BU52004GUL
VDD
A1
0.1µF
Adjust the bypass capacitor value
as necessary, according to
voltage noise conditions, etc.
TIMING LOGIC
OUT1
B1
HALL
The CMOS output terminals enable direct
connection to the PC, with no external pull-up
resistor required.
ELEMENT
GND
VDD
×
OUT2
B2
A2
GND
Fig.18
A2
B2
A1
B1
A1
B1
A2
PIN No.
A1
PIN NAME
VDD
FUNCTION
COMMENT
POWER SUPPLY
GROUND
A2
B1
B2
GND
OUT1
OUT2
OUTPUT( respond the south pole)
OUTPUT( respond the north pole)
B2
Surface
Reverse
BU52014HFV
VDD
4
0.1μF
TIMING LOGIC
Adjust the bypass capacitor
value as necessary, according to
voltage noise conditions, etc.
OUT1
5
HALL
ELEMENT
GND
VDD
The CMOS output terminals enable
direct connection to the PC, with no
external pull-up resistor required.
×
OUT2
1
2
GND
Fig.19
PIN No.
1
PIN NAME
FUNCTION
COMMENT
4
3
4
3
5
1
5
1
OUTPUT
OUT2
( respond the north pole)
2
3
4
GND
N.C.
VDD
GROUND
OPEN or Short to GND.
2
2
POWER SUPPLY
Surface
Reverse
OUTPUT
5
OUT1
( respond the south pole)
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2010.01 - Rev.D
5/11
© 2010 ROHM Co., Ltd. All rights reserved.
Technical Note
BU52004GUL, BU52014HFV
● Description of Operations
Micropower Operation (Small current using intermittent action)
The dual output bipolar detection Hall IC adopts an
intermittent operation method to save energy. At startup, the
IDD
Hall elements, amp, comparator and other detection circuits
power ON and magnetic detection begins. During standby,
the detection circuits power OFF, thereby reducing current
consumption. The detection results are held while standby
is active, and then output.
Period 50ms
Startup time
Standby
t
Reference period: 50ms (MAX100ms)
Reference startup time: 48μs
Fig.20
(Offset Cancelation)
VDD
The Hall elements form an equivalent Wheatstone (resistor)
bridge circuit. Offset voltage may be generated by a
differential in this bridge resistance, or can arise from
changes in resistance due to package or bonding stress. A
dynamic offset cancellation circuit is employed to cancel this
offset voltage.
I
＋
B
×
When Hall elements are connected as shown in Fig. 21 and a
magnetic field is applied perpendicular to the Hall elements,
voltage is generated at the mid-point terminal of the bridge.
This is known as Hall voltage.
Hall Voltage
－
Dynamic cancellation switches the wiring (shown in the
figure) to redirect the current flow to a 90˚ angle from its
original path, and thereby cancels the Hall voltage.
The magnetic signal (only) is maintained in the sample/hold
circuit during the offset cancellation process and then
released.
GND
Fig.21
(Magnetic Field Detection Mechanism)
S
N
S
S
N
S
N
Flux direction
Flux direction
Fig.22
The Hall IC cannot detect magnetic fields that run horizontal to the package top layer.
Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer.
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2010.01 - Rev.D
6/11
© 2010 ROHM Co., Ltd. All rights reserved.
Technical Note
BU52004GUL, BU52014HFV
OUT1
N
S
N
S
S
N
OUT 1[V]
Flux
Flux
High
High
High
Low
B
Brp S
Bop S
0
N-Pole
S-Pole
Magnetic flux density [mT]
Fig.23 S-Pole Detection
The OUT1 pin detects and outputs for the S-pole only. Since it is unipolar, it does not recognize the N-pole.
OUT2
N
S
N
S
S
N
OUT 2[V]
Flux
Flux
High
High
B
High
Low
Bop N Brp N
0
N-Pole
S-Pole
Magnetic density [mT]
Fig.24 N-Pole Detection
The OUT2 pin detects and outputs for the N-pole only. Since it is unipolar, it does not recognize the S-pole.
The dual output Omnipolar detection Hall IC detects magnetic fields running perpendicular to the top surface of the package.
There is an inverse relationship between magnetic flux density and the distance separating the magnet and the Hall IC:
when distance increases magnetic density falls. When it drops below the operate point (Bop), output goes HIGH. When the
magnet gets closer to the IC and magnetic density rises, to the operate point, the output switches LOW. In LOW output
mode, the distance from the magnet to the IC increases again until the magnetic density falls to a point just below Bop, and
output returns HIGH. (This point, where magnetic flux density restores HIGH output, is known as the release point, Brp.)
This detection and adjustment mechanism is designed to prevent noise, oscillation and other erratic system operation.
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.01 - Rev.D
7/11
Technical Note
BU52004GUL, BU52014HFV
●Intermittent Operation at Power ON
Power ON
VDD
Startup time
Standby time
High
Standby time
Startup time
Supply current
(Intermittent action)
Indefinite
OUT
(No magnetic
field present)
Indefinite
OUT
(Magnetic
field present)
Low
Fig.25
The dual output Omnipolar detection Hall IC adopts an intermittent operation method in detecting the magnetic field during
startup, as shown in Fig. 25. It outputs to the appropriate terminal based on the detection result and maintains the output
condition during the standby period. The time from power ON until the end of the initial startup period is an indefinite interval,
but it cannot exceed the maximum period, 100ms. To accommodate the system design, the Hall IC output read should be
programmed within 100ms of power ON, but after the time allowed for the period ambient temperature and supply voltage.
●Magnet Selection
Of the two representative varieties of permanent magnet, neodymium generally offers greater magnetic power per volume
than ferrite, thereby enabling the highest degree of miniaturization, Thus, neodymium is best suited for small equipment
applications. Fig. 26 shows the relation between the size (volume) of a neodymium magnet and magnetic flux density. The
graph plots the correlation between the distance (L) from three versions of a 4mm X 4mm cross-section neodymium magnet
(1mm, 2mm, and 3mm thick) and magnetic flux density. Fig. 27 shows Hall IC detection distance – a good guide for
determining the proper size and detection distance of the magnet. Based on the BU52014HFV operating point max 5.0 mT,
the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 7.6mm, 9.22mm, and 10.4mm, respectively.
To increase the magnet’s detection distance, either increase its thickness or sectional area.
10
9
t=3mm
8
7
t=1mm
t=2mm
6
5
4
3
2
1
7.6mm 9.2mm
10.4mm
0
0
2
4
6
8
10
12
14
16
18
20
Distance between magnet and Hall IC [mm]
Fig.26
X
Magnet material: NEOMAX-44H (material)
Maker: NEOMAX CO.,LTD.
Magnet
t
t
Y
X=Y=4mm
t=1mm,2mm,3mm
L: Variable
…Flux density measuring point
Magnet size
Fig.27 Magnet Dimensions and
Flux Density Measuring Point
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.01 - Rev.D
8/11
Technical Note
BU52004GUL, BU52014HFV
●Position of the Hall Effect IC(Reference)
HVSOF5
0.6
VCSP50L1
0.55
0.55
0.8
0.35
0.2
(UNIT：mm)
●Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition)
VCSP50L1
HVSOF5
(UNIT：mm)
Strings
e
Size(Typ)
0.50
b3
0.25
SD
SE
0.25
0.25
●Terminal Equivalent Circuit Diagram
Because they are configured for CMOS (inverter) output, the
output pins require no external resistance and allow direct
connection to the PC. This, in turn, enables reduction of the
current that would otherwise flow to the external resistor
during magnetic field detection, and supports overall low
current (micropower) operation.
OUT1, OUT2
VDD
GND
Fig.28
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.01 - Rev.D
9/11
Technical Note
BU52004GUL, BU52014HFV
●Operation Notes
1) Absolute maximum ratings
Exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or
destruction of the IC. Because the source (short mode or open mode) cannot be identified if the device is damaged in this
way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in
excess of absolute rating limits.
2) GND voltage
Make sure that the GND terminal potential is maintained at the minimum in any operating state, and is always kept lower
than the potential of all other pins.
3) Thermal design
Use a thermal design that allows for sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
4) Pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. Mounting errors, such as improper positioning or
orientation, may damage or destroy the device. The IC may also be damaged or destroyed if output pins are shorted
together, or if shorts occur between the output pin and supply pin or GND.
5) Positioning components in proximity to the Hall IC and magnet
Positioning magnetic components in close proximity to the Hall IC or magnet may alter the magnetic field, and therefore the
magnetic detection operation. Thus, placing magnetic components near the Hall IC and magnet should be avoided in the
design if possible. However, where there is no alternative to employing such a design, be sure to thoroughly test and
evaluate performance with the magnetic component(s) in place to verify normal operation before implementing the design.
6) Slide-by position sensing
Fig.29 depicts the slide-by configuration employed for position sensing. Note that when the gap (d) between the magnet and
the Hall IC is narrowed, the reverse magnetic field generated by the magnet can cause the IC to malfunction. As seen in
Fig.30, the magnetic field runs in opposite directions at Point A and Point B. Since the dual output Omnipolar detection Hall
IC can detect the S-pole at Point A and the N-pole at Point B, it can wind up switching output ON as the magnet slides by in
the process of position detection. Fig. 31 plots magnetic flux density during the magnet slide-by. Although a reverse
magnetic field was generated in the process, the magnetic flux density decreased compared with the center of the magnet.
This demonstrates that slightly widening the gap (d) between the magnet and Hall IC reduces the reverse magnetic field
and prevents malfunctions.
Flux
Magnet
10
Slide
8
6
Reverse
d
4
2
A
B
0
Hall IC
-2
-4
-6
-8
-10
S
Flux
L
N
Fig.30
Fig.29
0
1
2
3
4
5
6
7
8
9
10
Horizontal distance from the magnet [mm]
Fig.31
7) Operation in strong electromagnetic fields
Exercise extreme caution about using the device in the presence of a strong electromagnetic field, as such use may cause
the IC to malfunction.
8) Common impedance
Make sure that the power supply and GND wiring limits common impedance to the extent possible by, for example,
employing short, thick supply and ground lines. Also, take measures to minimize ripple such as using an inductor or
capacitor.
9) GND wiring pattern
When both a small-signal GND and high-current GND are provided, single-point grounding at the reference point of the set
PCB is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes
due to the wiring resistance and high current do not cause any voltage fluctuation in the small-signal GND. In the same way,
care must also be taken to avoid wiring pattern fluctuations in the GND wiring pattern of external components.
10) Exposure to strong light
Exposure to halogen lamps, UV and other strong light sources may cause the IC to malfunction. If the IC is subject to such
exposure, provide a shield or take other measures to protect it from the light. In testing, exposure to white LED and
fluorescent light sources was shown to have no significant effect on the IC.
11) Power source design
Since the IC performs intermittent operation, it has peak current when it’s ON. Please taking that into account and under
examine adequate evaluations when designing the power source.
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2010.01 - Rev.D
10/11
© 2010 ROHM Co., Ltd. All rights reserved.
Technical Note
BU52004GUL, BU52014HFV
●Ordering part number
B
U
5
2
0
0
4
G U
L
-
E
2
Part No.
Part No.
52004
52014
Package
GUL: VCSP50L1
HFV: HVSOF5
Packaging and forming specification
E2: Embossed tape and reel
(VSCP50L1)
TR: Embossed tape and reel
(HVSOF5)
VCSP50L1(BU52004GUL)
<Tape and Reel information>
1PIN MARK
Tape
Embossed carrier tape
3000pcs
Quantity
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
1.10±0.1
(
)
S
0.08
S
φ
4- 0.25±0.05
0.05
A B
A
B
B
A
1
2
Direction of feed
1pin
0.30±0.1
0.50
Reel
Order quantity needs to be multiple of the minimum quantity.
(Unit : mm)
∗
HVSOF5
<Tape and Reel information>
1.6 0.05
1.0 0.05
(0.8)
(0.3)
Tape
Embossed carrier tape
3000pcs
Quantity
TR
Direction
of feed
5
1
4
3
4
5
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
3
2 1
2
1pin
0.13 0.05
S
0.1
0.22 0.05
S
0.5
M
Direction of feed
Order quantity needs to be multiple of the minimum quantity.
0.08
Reel
(Unit : mm)
∗
www.rohm.com
2010.01 - Rev.D
11/11
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R1010
A
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