BD5230NVX-2C [ROHM]
罗姆的延迟时间自由设置型CMOS电压检测器IC系列是内置了采用CMOS工艺的高精度、低功耗电流延迟电路的CMOS RESET IC系列。可通过外接电容器设定延迟时间。备有Nch漏极开路输出的BD5230NVX-2C。备有检测电压为2.6V～3.1V的0.1V阶跃的产品阵容。在-40°C到125°C的整个工作温度范围内，将延迟时间精度控制在±50%内。日本碍子株式会社的芯片型陶瓷二次电池“EnerCera®”与ROHM电源IC的超低静态电流技术“Nano Energy™”相结合，助力实现免维护物联网设备，构建超高效蓄电单元。EnerCera® × Nano Energy™ Collaboration Page;
| 型号： | BD5230NVX-2C |
| 厂家： | 
ROHM |
| 描述： | 罗姆的延迟时间自由设置型CMOS电压检测器IC系列是内置了采用CMOS工艺的高精度、低功耗电流延迟电路的CMOS RESET IC系列。可通过外接电容器设定延迟时间。备有Nch漏极开路输出的BD5230NVX-2C。备有检测电压为2.6V～3.1V的0.1V阶跃的产品阵容。在-40°C到125°C的整个工作温度范围内，将延迟时间精度控制在±50%内。日本碍子株式会社的芯片型陶瓷二次电池“EnerCera®”与ROHM电源IC的超低静态电流技术“Nano Energy™”相结合，助力实现免维护物联网设备，构建超高效蓄电单元。EnerCera® × Nano Energy™ Collaboration Page 电池 电容器 |
| 文件： | 总21页 (文件大小：1391K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Voltage Detector (Reset) IC Series for Automotive Application
Free Time Delay Setting
CMOS Voltage Detector (Reset) IC
BD52xxNVX-2C Series BD5320NVX-2C
General Description
Key Specifications
ROHM's Free Time Delay Setting CMOS Voltage
Detector ICs are highly accurate, with ultra-low current
consumption feature that uses CMOS process. Delay
time setting can be control by an external capacitor. The
lineup includes N-channel open drain output (BD52xx
NVX-2C) and CMOS output (BD5320NVX-2C). The
devices are available for specific detection voltage is 1.4
V, 1.6 V, 2.0 V, 2.6 V to 3.1 V (0.1 V step).
◼ Detection Voltage: 1.4 V, 1.6 V, 2.0 V, 2.6 V, 2.7 V
2.8 V, 2.9 V, 3.0 V, 3.1 V(Typ)
◼ Ultra-Low Current Consumption:
270 nA (Typ)
◼ Time Delay Accuracy:
±50 % (-40 °C to +125 °C,
CT pin capacitor ≥ 1 nF)
Special Characteristics
The time delay has ±50 % accuracy in the overall
operating temperature range of -40 °C to 125 °C.
◼ Detection Voltage Accuracy:
±3.0 %±12 mV (VDET=1.4 V, 1.6 V)
±2.5 %(VDET=2.0 V, 2.6 V to 3.1 V)
Features
◼ AEC-Q100 Qualified (Note 1)
◼ Nano Energy™
Package
SSON004R1010:
W(Typ) x D(Typ) x H(Max)
1.00 mm x 1.00 mm x 0.60 mm
◼ Delay Time Setting Controlled by External Capacitor
◼ Two output types (Nch open drain and CMOS
output)
◼ Miniature Surface-mount Package
(Note 1) Grade 1
Application
All automotive devices that requires voltage detection
Typical Application Circuit
VDD1
VDD2
VDD1
RL
Microcontroller
RST
Microcontroller
CVDD
CVDD
BD52xxNVX-2C
BD5320NVX-2C
RST
CCT
(Noise-reduction
Capacitor)
CCT
(Noise-reduction
Capacitor)
CL
CL
GND
GND
Figure 1. Open Drain Output Type
Figure 2. CMOS Output Type
BD52xxNVX-2C Series
BD5320NVX-2C
Pin Configuration
Pin Description
SSON004R1010
SSON004R1010
PIN No. PIN NAME
VOUT
CT
4
VOUT
3
CT
4
Function
GND
3
1
2
3
GND
VDD
VOUT
Pin 1 Mark
Power supply voltage
Output pin
EXP-PAD
Capacitor connection pin for
output delay time setting
Same potential with substrate
voltage (VDD), it is
recommended to connect to
VDD or can be left open
4
CT
2
VDD
1
GND
2
VDD
1
GND
-
EXP-PAD
BOTTOM VIEW
TOP VIEW
Nano Energy™ is a trademark or a registered trademark of ROHM Co., Ltd.
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 14 • 001
TSZ02201-0GIG2G600050-1-2
09.Sep.2021 Rev.003
1/18
BD52xxNVX-2C Series BD5320NVX-2C
Block Diagram
VDD
VOUT
Delay
Vref
Circuit
(Note)
(Note)
(Note)
GND
(Note) Parasitic Diode
CT
Figure 3. BD52xxNVX-2C Series
VDD
(Note)
Delay
Vref
Circuit
VOUT
(Note)
(Note)
(Note)
GND
CT
(Note) Parasitic Diode
Figure 4. BD5320NVX-2C
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GIG2G600050-1-2
2/18
09.Sep.2021 Rev.003
BD52xxNVX-2C Series BD5320NVX-2C
Ordering Information
B
D
x
x
x
x
N V X
-
2
C
T L
Output Type
52 : Open Drain
53 : CMOS
Packing and Forming
Specification
TL : Embossed tape and reel
Detection Voltage Package
Product Rank
14 : 1.4 V
16 : 1.6 V
20 : 2.0 V
26 : 2.6 V
NVX : SSON004R1010 C : for Automotive
↓
0.1 V step
31 : 3.1 V
Lineup
Output Type
Open Drain
CMOS
Detection Voltage Marking
Part Number
Marking
Part Number
3.1 V
3.0 V
2.9 V
2.8 V
2.7 V
2.6 V
2.0 V
1.6 V
1.4 V
6l
5l
4l
3l
2l
1l
-
BD5231NVX
BD5230NVX
BD5229NVX
BD5228NVX
BD5227NVX
BD5226NVX
-
-
-
-
-
-
-
nl
-
-
-
-
-
-
-
BD5320NVX
g
e
BD5216NVX
BD5214NVX
-
-
-
Marking Diagram
SSON004R1010 (TOP VIEW)
LOT Number
Part Number Marking
Pin 1 Mark
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GIG2G600050-1-2
3/18
09.Sep.2021 Rev.003
BD52xxNVX-2C Series BD5320NVX-2C
Absolute Maximum Ratings (Ta=25 °C)
Parameter
Symbol
Limit
-0.3 to +7
Unit
V
Power Supply Voltage
VDD - GND
Nch Open Drain Output
Output Voltage
GND-0.3 to +7
GND-0.3 to VDD+0.3
70
VOUT
V
CMOS Output
Output Current
Maximum Junction Temperature
IO
Tjmax
mA
°C
+150
Storage Temperature Range
Tstg
-55 to +150
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 1)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 3)
2s2p(Note 4)
SSON004R1010
Junction to Ambient
Junction to Top Characterization Parameter(Note 2)
θJA
450.2
99
97.1
22
°C/W
°C/W
ΨJT
(Note 1) Based on JESD51-2A(Still-Air).
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70 μm
Footprints and Traces
Layer Number of
Measurement Board
Thermal Via(Note 5)
Material
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
Pitch
Diameter
4 Layers
FR-4
1.20 mm
Φ0.30 mm
Top
Copper Pattern
Bottom
Thickness
70 μm
Copper Pattern
Thickness
Copper Pattern
Thickness
70 μm
Footprints and Traces
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
(Note 5) This thermal via connects with the copper pattern of layers 1,2, and 4. The placement and dimensions obey a land pattern.
Function Explanation
1. Nano Energy™
Nano Energy™ is a combination of technologies which realizes ultra low quiescent current operation.
Recommended Operating Conditions
Parameter
Symbol
Topr
Min
Typ
+25
Max
Unit
°C
Operating Temperature
-40
+125
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GIG2G600050-1-2
4/18
09.Sep.2021 Rev.003
BD52xxNVX-2C Series BD5320NVX-2C
Electrical Characteristics (Unless otherwise specified Ta=-40 °C to +125 °C, VDD=0.8 V to 6.0 V)
Limit
Typ
Parameter
Detection Voltage
Hysteresis Voltage
Symbol
VDET
Condition
Unit
V
Min
Max
VDET(T)
×1.03
VDET(T)
×0.97
-0.012
VDET=1.4 V, 1.6 V, VDD=H→L,
VDET(T)
(Note 1)
RL=100 kΩ (Note 2)
+0.012
VDET=2.0 V~3.1 V, VDD=H→L,
VDET(T) VDET(T) VDET(T)
(Note 1)
RL=100 kΩ (Note 2)
×0.975
×1.025
VDET
×0.035
VDET
×0.05
0.23
0.27
-
VDET
×0.065
1.50
1.60
-
∆ VDET VDD=L→H→L, RL=100 kΩ
V
Circuit Current when ON
Circuit Current when OFF
Minimum Operating Voltage
IDD1
IDD2
VOPL
VDD=VDET-0.2 V
VDD=VDET+0.5 V
-
-
µA
µA
V
VOL≤0.4 V, RL=100 kΩ (Note 2)
VDD=0.8 V, ISINK=0.17 mA,
VDET=1.4 V, 1.6 V
VDD=1.2 V, ISINK=1.0 mA,
VDET=2.0 V to 3.1 V
VDD=2.4 V, ISINK=2.0 mA,
VDET=2.6 V to 3.1 V
VDD=4.8 V, ISOURCE=2.0 mA,
VDET=2.0 V
0.80
-
-
-
-
-
0.4
0.4
0.4
-
“Low” Output Voltage(Nch)
“High” Output Voltage(Pch)
VOL
-
V
-
VDD-0.4
V
VOH
VDD=6.0 V, ISOURCE=2.5 mA,
VDET=2.0 V
VDD-0.4
-
-
-
Output Leak Current
Ileak
tPLH
VDD=VDS=6 V
-
1.0
83.2
µA
ms
V
OUT＝GND→50 %, CCT=0.01 μF
Delay Time(L→H)
27.7
55.5
(Note 3) (Note 4)
(Note 1) VDET(T): Standard Detection Voltage (1.4 V, 1.6 V, 2.0 V, 2.6 V, 2.7 V, 2.8 V, 2.9 V, 3.0 V, 3.1 V)
(Note 2) RL: Pull-up resistor connected between VOUT and power supply
(Note 3) tPLH: VDD=(VDET(T)–0.5 V) → (VDET(T)+0.5 V) for VDET=1.4 V, 1.6 V, 2.0 V, 2.6 V, 2.7 V, 2.8 V, 2.9 V, 3.0 V, 3.1 V
(Note 4) CT delay capacitor range: open to 4.7 µF
www.rohm.com
TSZ02201-0GIG2G600050-1-2
© 2018 ROHM Co., Ltd. All rights reserved.
5/18
TSZ22111 • 15 • 001
09.Sep.2021 Rev.003
BD52xxNVX-2C Series BD5320NVX-2C
Typical Performance Curves
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.0
BD5229NVX-2C
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
BD5229NVX-2C
Ta=+125 °C
VDD=VDET+0.5 V
Ta=+105 °C
Ta=+25 °C
VDD=VDET-0.2 V
Ta=-40 °C
-40 -25 -10
5
20 35 50 65 80 95 110 125
0
1
2
3
4
5
6
Temperature : Ta[°C]
Power Supply Voltage : VDD[V]
Figure 6. Circuit Current vs Temperature
Figure 5. Circuit Current vs Power Supply Voltage
6.0
5.0
4.0
3.0
2.0
1.0
0.0
3.10
3.05
3.00
2.95
2.90
2.85
2.80
2.75
2.70
BD5229NVX-2C
BD5229NVX-2C
2.4
2.6
2.8
3.0
3.2
3.4
-40 -25 -10
5
20 35 50 65 80 95 110 125
Power Supply Voltage : VDD[V]
Temperature : Ta[°C]
Figure 7. Detection Voltage vs Power Supply Voltage
Figure 8. Detection Voltage vs Temperature
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GIG2G600050-1-2
6/18
09.Sep.2021 Rev.003
BD52xxNVX-2C Series BD5320NVX-2C
Typical Performance Curves - continued
6.0
5.0
4.0
3.0
2.0
1.0
0.0
6.0
BD5229NVX-2C
BD5229NVX-2C
5.0
Ta=+125 °C
4.0
Ta=+105 °C
Ta=+25 °C
3.0
Ta=-40 °C
Ta=+125 °C
Ta=+105 °C
2.0
Ta=+25 °C
1.0
Ta=-40 °C
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
Power Supply Voltage : VDD[V]
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
Power Supply Voltage : VDD[V]
Figure 9. I/O Characteristics
Figure 10. I/O Characteristics
(VOUT Pull-up to 5 V, RL=100 kΩ)
(VOUT Pull-up to VDD, RL=100 kΩ)
1.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
BD5229NVX-2C
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
BD5229NVX-2C
-40 -25 -10
5
20 35 50 65 80 95 110 125
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature : Ta[°C]
Temperature : Ta[°C]
Figure 12. Minimum Operating Voltage vs Temperature
Figure 11. Minimum Operating Voltage vs Temperature
(VOUT Pull-up to VDD, RL=100 kΩ)
(VOUT Pull-up to 5 V, RL=100 kΩ)
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GIG2G600050-1-2
7/18
09.Sep.2021 Rev.003
BD52xxNVX-2C Series BD5320NVX-2C
Typical Performance Curves - continued
100
100
90
80
70
60
50
40
30
20
10
0
BD5229NVX-2C
BD5229NVX-2C
90
80
70
60
50
40
30
20
10
0
-40 -25 -10
5
20 35 50 65 80 95 110 125
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature : Ta[°C]
Temperature : Ta [°C]
Figure 13. Output Delay Time (L→H) vs Temperature
(CCT=10 nF)
Figure 14. Output Delay Time (H→L) vs Temperature
100
100,000
BD5229NVX-2C
BD5229NVX-2C
90
80
70
60
50
40
30
20
10
0
Ta=-40 °C
Ta=+25 °C
10,000
1,000
100
10
Ta=-40 °C
Ta=+25 °C
Ta=+105 °C
Ta=+125 °C
Ta=+105 °C
Ta=+125 °C
1
0.001
0.01
0.1
1
10
0.001
0.01
0.1
1
10
CT Pin Capacitance : CCT[µF]
CT Pin Capacitance : CCT[µF]
Figure 15. Output Delay Time (L→H) vs CT Pin Capacitance
Figure 16. Output Delay Time (H→L) vs CT Pin Capacitance
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GIG2G600050-1-2
8/18
09.Sep.2021 Rev.003
BD52xxNVX-2C Series BD5320NVX-2C
Typical Performance Curves - continued
70
70
60
50
40
30
20
10
0
60
VDD=2.0 V
VDD=4.0 V
50
VDD=1.8 V
40
VDD=3.0 V
30
VDD=1.2 V
20
10
VDD=0.8 V
BD5229NVX-2C
BD5320NVX-2C
0
0.0
0.5
1.0
1.5
2.0
2.5
0.0
1.0
2.0
3.0
4.0
5.0
Drain-Source Voltage : VDS[V]
Drain-Source Voltage : VDS [V]
Figure 17. “Low” Output Current vs Drain-Source Voltage
Figure 18. “High” Output Current vs Drain-Source Voltage
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GIG2G600050-1-2
9/18
09.Sep.2021 Rev.003
BD52xxNVX-2C Series BD5320NVX-2C
Application Information
Operation Description
The detection and release voltage are used as threshold voltages. When the voltage applied to the VDD reaches the
applicable threshold voltage, the VOUT level switches from either “H”→“L” or from “L”→“H”. BD52xxNVX-2C series and
BD5320NVX-2C have delay time function, which set tPLH (output “L”→”H”) using an external capacitor connected in CT pin
(CCT).
Because the BD52xxNVX-2C series uses an open drain output type, it is necessary to connect a pull up resistor to VDD or
another power supply. [In this case, the output (VOUT) “H” voltage becomes VDD or the voltage of the other power supply].
VDD
VDD
VOUT
Delay
Vref
Delay
Circuit
Vref
VOUT
Circuit
GND
GND
CT
CT
Figure 19. (BD52xxNVX-2C type internal block diagram)
Figure 20. (BD5320NVX-2C type internal block diagram)
Setting of Detector Delay Time
Delay time L→H (tPLH) is the time when VOUT rises to 1/2 of VDD after VDD rises up and beyond the release voltage
(VDET+∆VDET).
Delay time L→H (tPLH) is determined by CT capacitor and can be calculated from the following formula. When CT capacitor
≥ 1nF, tCTO has less effect and tPLH computation is shown on Example No.2. The result has ±50 % tolerance within the
operating temperature range of -40 °C to +125 °C.
Formula: (Ta=25 °C)
푡푃퐿퐻 = 퐶ꢀ푇 × 퐷푒푙푎푦 퐶표푒푓푓푖푐푖푒푛푡 + 푡ꢀ푇푂
[s]
where:
C
CT is the CT pin external capacitor
Delay Coefficient is equal to 5.55 x 106
t
CTO is the delay time when CT=open (Note 1)
Delay Time (tCTO
)
Temperature
Min
Typ
Max
150 µs
Ta = -40 °C to +125 °C
15 µs
50 µs
(Note 1) tCTO is design guarantee only
Example No.1:
CT capacitor = 100 pF
−ꢃ2
× 5.55 × 106 × 0.5 + 15 × 10−6 = ꢄ9ꢄ µ푠
)
(
푡푃퐿퐻_푚ꢁꢂ = 100 × 10
−ꢃ2
× 5.55 × 106 × 1.0 + 50 × 10−6 = ꢇ05 µ푠
)
(
푡푃퐿퐻_ꢅꢆ푝 = 100 × 10
−ꢃ2
× 5.55 × 106 × 1.5 + 150 × 10−6 = 983 µ푠
)
(
푡푃퐿퐻_푚ꢈ푥 = 100 × 10
Example No.2:
CT capacitor = 1 nF
푡푃퐿퐻_ꢅꢆ푝 = 1 × 10−ꢉ × 5.55 × 106 = 5.55 ꢊ푠
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GIG2G600050-1-2
10/18
09.Sep.2021 Rev.003
BD52xxNVX-2C Series BD5320NVX-2C
Application Information - continued
Timing Waveform
The following shows the relationship between the input voltage VDD and the output voltage VOUT when the power supply
voltage VDD is sweep up and sweep down.
VDD
RL
VDD
Delay
Circuit
Vref
VOUT
GND
CT
CCT
Figure 21. BD52xxNVX-2C Set-up
VDD
VDET+ΔVDET
Hysteresis Voltage
(ΔVDET
)
VDET
VOPL: <0.8 V
t
1
2
3
4
5
2
3
4
5
2
1
VOUT
t
undefined
tPLH
tPLH
undefined
tPHL
tPHL
Figure 22. Timing Diagram
Operating Conditions Explanation
1
2
3
When the power supply turns on, the Output Voltage (VOUT) becomes unstable until VDD exceeds the Minimum
Operating Voltage (VOPL).
VOUT changes to “L”. However, this change depends on the VOUT rise time when the power supply starts up, so
thorough confirmation is required.
When VDD exceeds the release voltage (VDET+∆VDET ), delay time (tPLH) set by the capacitor at CT pin (CCT) happens,
then VOUT switches from “L” to “H”.
4
VOUT remains “H”.
5
When VDD drops below Detection Voltage (VDET), delay time (tPHL) happens, then VOUT switches from “H” to “L”.
The potential difference between the detection voltage and the release voltage is known as the Hysteresis Voltage width
(∆VDET). The system is designed such that the output will not toggle with power supply fluctuations within this hysteresis
width, preventing malfunctions due to noise.
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GIG2G600050-1-2
11/18
09.Sep.2021 Rev.003
BD52xxNVX-2C Series BD5320NVX-2C
Application Information – continued
Bypass Capacitor for Noise Rejection
To help reject noise, put more than 0.1 μF capacitor between VDD and GND pin and connect it closer to the pin as possible.
Be careful when using extremely big capacitor as transient response will be affected.
External Parameters
The recommended value of CT capacitor is from open to 4.7 μF and pull-up resistance value is 50 kΩ to 1 MΩ. There are
many factors (board layout, etc.) that can affect characteristics. Operating beyond the recommended values does not
guarantee correct operation. Please verify and confirm using practical applications.
In addition, this IC has extremely high impedance pins. Small leak current due to the uncleanness of PCB surface might
cause unexpected operations. Application values in these conditions should be selected carefully. For example, if a 10 MΩ
leakage is assumed between VOUT and GND pin, consider to set the value of pull up resistor lower than 1/10 of the
impedance of assumed leakage route.
Behavior when below the Operating Voltage Limit
When VDD falls below the minimum operating voltage, output will be open. When output is connected to pull-up voltage,
output will be equivalent to pull-up voltage.
CT Pin Discharge
Due to the capabilities of the CT pin discharge transistor, the CT pin may not completely discharge when a short input
pulse is applied, and in this case the delay time may not be controlled. Please verify the actual operation.
Application Circuits
(1) Examples of common application circuits
Application examples of BD52xxNVX-2C series (Open
VDD1
VDD2
drain output type) and BD5320NVX-2C (CMOS output
type) are shown below.
RL
CVDD
If the power supply of the microcontroller (VDD2) differs
from the power supply of the detection (VDD1), use the
load resistance RL connected to VDD2 in the output of
open drain output type (BD52xxNVX-2C series) as
shown in Figure 23.
Microcontroller
RST
BD52xxNVX-2C
CCT
Power supply of the microcontroller (VDD1) is the same
as the power supply of the reset detection (VDD1):
Use a CMOS output type (BD5320NVC-2C) device as
shown in Figure 24, or an open-drain output type
(BD52xxNVX-2C series) device with a pull-up resistor
CL
GND
Figure 23. Open Drain Output Type
between the output and VDD1
.
When connecting a capacitor CL for noise elimination
and for output time delay setting to VOUT pin (reset
signal input pin of micro-controller), the waveform is dull
during rising and falling of the output so use after
confirmation that there is no problem.
VDD1
CVDD
Microcontroller
RST
BD5320NVX-2C
CCT
CL
GND
Figure 24. CMOS Output Type
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GIG2G600050-1-2
12/18
09.Sep.2021 Rev.003
BD52xxNVX-2C Series BD5320NVX-2C
Application Circuits – continued
(2) The following is an example of an OR connection between two types of detection voltage resets the microcontroller.
VDD1
VDD2
VDD3
RL
Microcontroller
RST
BD52xxNVX-2C
NO.1
BD52xxNVX-2C
NO.2
CCT
CCT
GND
Figure 25. OR Circuit Connection Application
There are multiple power supply in the system, and in case monitoring for each independent power supply VDD1 and VDD2
and reset of micro-controller is required, an application where output “H” voltage is aligned to the microcontroller power
supply VDD3 is possible by connecting OR application and pull-up at random voltage (VDD3) such as shown in Figure 25.
(3) Examples of the power supply with resistor dividers
In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an inrush current will flow
into the circuit when the output level switches from “Low” to “High” or vice versa. Inrush current is a sudden surge of current
that flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow may cause
malfunction in the systems operation such as output oscillations, etc.
V1
IDD
(Note 1)
RA
(RA≤100 kΩ)
IDD
VDD
Inrush Current
(Note 1)
CVDD
(CVDD≥0.1 μF)
BD52xxNVX-2C
BD5320NVX-2C
RB
VOUT
GND
0
VDD
VDET
Figure 26. Resistor Divider Connection Application
Figure 27. Current Consumption vs VDD Voltage
A voltage drop [Inrush current (I1)] x [input resistor (RA)] is caused by the inrush current, and causes the input voltage to
drop when the output switches from “L”→”H”. When the input voltage drops and falls below the detection voltage, the output
will switch from “H”→”L”. At this time, the inrush current stops flowing through output “L”, and the voltage drop disappears.
As a result, the output switches from “L”→”H”, which again causes the inrush current to flow and the voltage to drop. This
operation repeats and leads to oscillation.
In case resistor divider is not use and only use RA, same response will happen.
(Note 1) The circuit connection mentioned above does not guarantee successful operation.
Perform thorough evaluation using the actual application and set countermeasures.
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GIG2G600050-1-2
13/18
09.Sep.2021 Rev.003
BD52xxNVX-2C Series BD5320NVX-2C
Application Circuits - continued
100
90
80
70
60
50
40
30
20
10
0
100
BD5229NVX-2C
BD5229NVX-2C
90
80
70
60
50
40
30
20
10
0
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature : Ta[°C]
3.5
4.0
4.5
5.0
5.5
6.0
Power Supply Voltage : VDD[V]
Figure 29. IDD Inrush Current vs Temperature
(VDD=6 V)
Figure 28. IDD Inrush Current vs Power Supply Voltage
(Ta=25 °C)
Depending on the application set-up, there are times that VDD voltage is always below the Release Voltage (VDET+ΔVDET
)
because of the effect of inrush current as shown in Figure 30.
Voltage
V1
ΔVDROP = Inrush Current x RA
VDD
VDET+ΔVDET
Hysteresis Voltage (ΔVDET
)
VDET
t
Figure 30. VDD Drop Caused by Inrush Current
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GIG2G600050-1-2
14/18
09.Sep.2021 Rev.003
BD52xxNVX-2C Series BD5320NVX-2C
Considerations on Input and Output Capacitor
It is suggested to use input and output capacitors which is positioned as near as possible to the pins. The capacitor between
the input pin and GND is effective when the power supply impedance increases or when the wiring is long. A large capacitor
at the output improves stability and output load characteristics. Before implementation, check the state of mounting. In
addition, the ceramic capacitor deviates in general and has temperature characteristics and AC bias characteristics.
Furthermore, depending on the usage, the capacitance value decreases over time. It is recommended that ceramic
capacitor to use is decided after gathering detailed data information by consulting brand manufacturers.
10 V withstand voltage
B1characteristics
GRM188B11A105KA61D
10
0
10 V withstand voltage
B characteristics
-10
6.3 V withstand voltage
B characteristics
-20
-30
10 V withstand voltage
-40
-50
F characteristics
-60
4 V withstand voltage
X6S characteristics
-70
-80
-90
-100
0
1
2
3
4
DC Bias Voltage [V]
Figure 31. Ceramic Capacitance Change - DC Bias Properties
(Characteristic example)
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GIG2G600050-1-2
15/18
09.Sep.2021 Rev.003
BD52xxNVX-2C Series BD5320NVX-2C
Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
10. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin
lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power
supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have
voltages within the values specified in the electrical characteristics of this IC.
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GIG2G600050-1-2
16/18
09.Sep.2021 Rev.003
BD52xxNVX-2C Series BD5320NVX-2C
Physical Dimension and Packing Information
Package Name
SSON004R1010
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GIG2G600050-1-2
17/18
09.Sep.2021 Rev.003
BD52xxNVX-2C Series BD5320NVX-2C
Revision History
Date
Revision
001
Changes
23.Jan.2018
31.Jul.2018
09.Sep.2021
New Release
Format Change
Add Notation of “Nano Energy”
002
003
Add lineup (BD5214NVX-2C, BD5216NVX-2C, BD5320NVX-2C)
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GIG2G600050-1-2
09.Sep.2021 Rev.003
18/18
Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
相关型号：
SI9130DB
5- and 3.3-V Step-Down Synchronous ConvertersWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1-E3
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135_11
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9136_11
Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130CG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130LG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130_11
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137DB
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137LG
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9122E
500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
©2020 ICPDF网 联系我们和版权申明