BD5247FVE-TR [ROHM]

Power Supply Support Circuit, Fixed, 1 Channel, +4.7VV, CMOS, PDSO5, VSOF-5;


型号：	BD5247FVE-TR
厂家：	ROHM
描述：	Power Supply Support Circuit, Fixed, 1 Channel, +4.7VV, CMOS, PDSO5, VSOF-5
文件：	总10页 (文件大小：270K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Voltage Detector IC Series

Free Delay Time Setting

CMOS Voltage Detector IC Series

BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series

No.09006EBT03

 Description

ROHM’s BD52□□G/FVE and BD53□□G/FVE series are highly accurate, low current consumption reset IC series with a

built-in delay circuit. The lineup was established with tow output types (Nch open drain and CMOS output) and detection

voltages range from 2.3V to 6.0V in increments of 0.1V, so that the series may be selected according the application at

hand.

 Features

1) Detection voltage: 2.3V to 6.0V (Typ.), 0.1V steps

2) High accuracy detection voltage: ±1.0%

3) Ultra-low current consumption: 0.8µA (Typ.)

4) Nch open drain output (BD52□□G/FVE), CMOS output (BD53□□G/FVE)

5) Compact packages VSOF5: BD52□□FVE, BD53□□FVE

SSOP5: BD52□□G, BD53□□G

 Applications

All electronic devices that use micro controllers and logic circuits

 Selection Guide

No.

Specifications

Description

Output Circuit Format

Detection Voltage

Package

2:Open Drain Output, 3:CMOS Output

Example: Displays VS over a 2.3V to 6.0V range in

0.1V increments.

Part Number : BD5

G:SSOP5 / FVE:VSOF5

 Lineup

Detection

Voltage

6.0V

5.9V

5.8V

5.7V

5.6V

5.5V

5.4V

5.3V

5.2V

5.1V

5.0V

4.9V

4.8V

4.7V

4.6V

4.5V

4.4V

4.3V

4.2V

Part

Detection

Part

Detection

Part

Detection

Voltage

4.1V

4.0V

3.9V

3.8V

3.7V

3.6V

3.5V

3.4V

3.3V

3.2V

3.1V

3.0V

2.9V

2.8V

2.7V

2.6V

2.5V

2.4V

2.3V

Part

Marking

Number

BD5260

BD5259

BD5258

BD5257

BD5256

BD5255

BD5254

BD5253

BD5252

BD5251

BD5250

BD5249

BD5248

BD5247

BD5246

BD5245

BD5244

BD5243

BD5242

Voltage

4.1V

4.0V

3.9V

3.8V

3.7V

3.6V

3.5V

3.4V

3.3V

3.2V

3.1V

3.0V

2.9V

2.8V

2.7V

2.6V

2.5V

2.4V

2.3V

Number

BD5241

BD5240

BD5239

BD5238

BD5237

BD5236

BD5235

BD5234

BD5233

BD5232

BD5231

BD5230

BD5229

BD5228

BD5227

BD5226

BD5225

BD5224

BD5223

Voltage

6.0V

5.9V

5.8V

5.7V

5.6V

5.5V

5.4V

5.3V

5.2V

5.1V

5.0V

4.9V

4.8V

4.7V

4.6V

4.5V

4.4V

4.3V

4.2V

Number

BD5360

BD5359

BD5358

BD5357

BD5356

BD5355

BD5354

BD5353

BD5352

BD5351

BD5350

BD5349

BD5348

BD5347

BD5346

BD5345

BD5344

BD5343

BD5342

Number

BD5341

BD5340

BD5339

BD5338

BD5337

BD5336

BD5335

BD5334

BD5333

BD5332

BD5331

BD5330

BD5329

BD5328

BD5327

BD5326

BD5325

BD5324

BD5323

www.rohm.com

2009.06 - Rev.B

1/9

Technical Note

BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series

 Absolute maximum ratings (Ta=25°C)

Parameter

Power Supply Voltage

Symbol

Limits

-0.3 ~ +10

GND-0.3 ~ +10

GND-0.3 ~ VDD+0.3

540

Unit

VDD-GND

Nch Open Drain Output

CMOS Output

Output Voltage

VOUT

*1*3

Power

SSOP5

VSOF5

*2*3

Dissipation

210

Operating Temperature

Topr

Tstg

-40 ~ +105

-55 ~ +125

°C

Ambient Storage Temperature

*1 Use above Ta=25°C results in a 5.4mW loss per degree.

*2 Use above Ta=25°C results in a 2.1mW loss per degree.

*3 When a ROHM standard circuit board (70mm×70mm×1.6mm glass epoxy board) is mounted.

 Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C)

Limit

Parameter

Detection Voltage

Symbol

V_DET

Condition

VDD=HL, RL=470kΩ

Unit

Min.

VDET(T)

×0.99

Typ.

Max.

VDET(T)

×1.01

VDET(T)

_DET=2.3-3.1V

0.80

0.85

0.90

0.95

0.75

0.80

0.85

0.90

2.40

V_DET=3.2-4.2V

V_DET=4.3-5.2V

V_DET=5.3-6.0V

2.55

µA

Circuit Current when ON

Circuit Current when OFF

IDD1

IDD2

VDD=VDET-0.2V

VDD=VDET+2.0V

2.70

2.85

2.25

_DET=2.3-3.1V

V_DET=3.2-4.2V

V_DET=4.3-5.2V

V_DET=5.3-6.0V

2.40

µA

2.55

2.70

VOL≤0.4V, Ta=25~105°C, RL=470kΩ

VOL≤0.4V, Ta=-40~25°C, RL=470kΩ

VDS=0.5V VDD=1.2V

0.95

1.20

0.4

Operating Voltage Range

‘Low’ Output Current (Nch)

VOPL

IOL

1.2

VDS=0.5V VDD=2.4V

VDS=0.5V VDD=4.8V VDET=2.3-4.2V

2.0

0.7

5.0

1.4

VDS=0.5V VDD=6.0V VDET=4.3-5.2V

VDS=0.5V VDD=8.0V VDET=5.3-6.0V

0.9

1.1

1.8

2.2

‘High’ Output Current (Pch)

Leak Current when OFF

IOH

Ileak VDD=VDS=10V

VDD=VDET×1.1, VDET=2.3-2.6V, RL=470kΩ

0.1

VDD

×0.60

µA

VDD

×0.30

VDD

×0.40

VDD

×0.30

VDD

×0.35

VDD

×0.40

5.5

VDD

×0.45

VDD

×0.50

VDD

×0.50

VDD

×0.60

VDD

×0.60

VDD

×0.60

12.5

VDD=VDET×1.1, VDET=2.7-4.2V, RL=470kΩ

VDD=VDET×1.1, VDET=4.3-5.2V, RL=470kΩ

VDD=VDET×1.1, VDET=5.3-6.0V, RL=470kΩ

CT pin Threshold Voltage

VCTH

Output Delay Resistance

CT pin Output Current

RCT

ICT

VDD=VDET×1.1 VCT=0.5V

VCT=0.1V VDD=0.95V

VCT=0.5V VDD=1.5V

MΩ

µA

150

240

Detection Voltage

VDET/∆T Ta=-40°C to 105°C

±100

±360 ppm/°C

Temperature coefficient

VDET

Hysteresis Voltage

∆VS VDD=LHL, RL=470kΩ

×0.03

×0.05

×0.08

V_S(T) : Standard Detection Voltage (2.3V to 6.0V, 0.1V step)

R_L: Pull-up resistor to be connected between VOUT and power supply.

Designed Guarantee. (Outgoing inspection is not done on all products.)

*1 Guarantee is Ta=25°C.

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2009.06 - Rev.B

2/9

Technical Note

BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series

 Block Diagrams

BD52□□G/FVE

BD53□□G/FVE

VDD

VOUT

Vref

GND

Fig.1

Fig.2

TOP VIEW

SSOP5

VSOF5

PIN No.

Symbol

VOUT

VDD

Function

Reset Output

PIN No.

Symbol

VOUT

SUB

Function

Reset Output

Substrate*

Power Supply Voltage

GND

Capacitor connection terminal for

output delay time

N.C.

Unconnected Terminal

Capacitor connection terminal for

output delay time

GND

VDD

GND

Power Supply Voltage

*Connect the substrate to GND.

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2009.06 - Rev.B

3/9

Technical Note

BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series

 Reference Data (Unless specified otherwise, Ta=25°C)

2.0

1.5

1.0

0.5

0.0

BD5242G/FVE

】

BD5342G/FVE

【

】

【

】

V_DD=2.4V

V_DD=8.0V

V_DD=6.0V

V_DD=4.8V

V_DD=1.2V

2.0

0.0

0.5

1.0

1.5

2.5

V_DDSUPPLY VOLTAGE V_DD[V]

DRAIN-SOURCE VOLTAGE V_DS[V]

：

DRAIN-SOURCE VOLTAGE V_DS[V]

：

Fig.3 Circuit Current

Fig.4 “Low” Output Current

Fig.5 “High” Output Current

1.0

450

400

350

300

250

200

150

100

BD5242G/FVE

【

】

BD5242G/FVE

【】

BD5242G/FVE

【

】

0.8

0.6

0.4

0.2

0.0

Ta=25

℃

Ta=25

℃

0.0

0.5

1.0

1.5

2.0

2.5

0.5

1.5

2.5

3.5

4.5

5.5

V_DDSUPPLY VOLTAGE V_DD[V]

：

_DDSUPPLY VOLTAGE V_DD[V]

：

V_DDSUPPLY VOLTAGE V_DD[V]

：

Fig.7 Operating Limit Voltage

Fig.8 CT Terminal Current

Fig.6 I/O Characteristics

5.4

5.0

4.6

4.2

3.8

3.4

1.5

1.0

0.5

0.0

BD5242G/FVE

【

】

BD5242G/FVE

【】

【

】

Low to high(V_DET+ΔV_DET

)

1.0

0.5

0.0

High to low(V_DET

)

～

3.0

-40

-40 -20

20 40 60 80 100

-40 -20

TEMPERATURE Ta[ ]

℃

20 40 60 80 100

TEMPERATURE Ta[

]

℃

TEMPERATURE Ta[

]

℃

：

Fig.9 Detection Voltage

Release Voltage

Fig.10 Circuit Current when ON

Fig.11 Circuit Current when OFF

1.5

1.0

0.5

0.0

10000

BD5242G/FVE

【

】

【

】

【

】

1000

100

0.1

0.01

0.001

-40 -20

20 40 60 80 100

-40 -20

20 40 60 80 100

0.0001

0.001

0.01

0.1

TEMPERATURE Ta[

]

℃

TEMPERATURE Ta[

]

℃

：

CAPACITANCE OF CT C_CT[μF]

：

Fig.12 Operating Limit Voltage

Fig.14 Delay Time (TPLH) and

Fig.13 Ct Terminal Circuit Resistance

CT Terminal External Capacitance

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2009.06 - Rev.B

4/9

Technical Note

BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series

 Setting of Detector Delay Time

This detector IC can be set delay time at the rise of VDD by the capacitor connected to CT terminal.

Delay time at the rise of V_DD

voltage(V_DET+∆V_DET

T_PLH：Time until when Vout rise to 1/2 of V_DDafter V_DDrise up and beyond the release

)

_DD-V_CTH

T_PLH= -C_CT×R_CT×ln

V_DD

C _CT

CT pin Externally Attached Capacitance

R_CT: CT pin Internal Impedance （P.2 R_CTrefer.）

V_CTH

CT pin Threshold Voltage（P.2 VCTH refer.）

Ln : Natural Logarithm

 Reference Data of Falling Time (T_PHL) Output

Examples of Falling Time (T_PHL) Output

Part Number

BD5227G

tPHL[µs] -40°C

tPHL[µs] ,+25°C

tPHL[µs],+105°C

30.8

26.8

28.8

24.8

BD5327G

*This data is for reference only.

The figures will vary with the application, so please confirm actual operating conditions before use.

 Explanation of Operation

For both the open drain type (Fig.15) and the CMOS output type (Fig.16), the detection and release voltages are used as

threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal

voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BD52□□G/FVE series uses an open drain

output type, it is possible to connect a pull-up resistor to VDD or another power supply [The output “High” voltage (VOUT) in

this case becomes VDD or the voltage of the other power supply].

VDD

RESET

Vref

RESET

VOUT

GND

Fig.15 (BD52□□Type Internal Block Diagram)

Fig.16 (BD53□□Type Internal Block Diagram)

 Timing Waveforms

Example: the following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output

voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in

Fig.15 and 16).

When the power supply is turned on, the output is unsettled from

after over the operating limit voltage (VOPL) until TPHL. There fore it is

possible that the reset signal is not outputted when the rise time of

VDD is faster than TPHL.

When VDD is greater than VOPL but less than the reset release

voltage (VDET+∆VDET), the CT terminal (VCT) and output (VOUT)

V^DET+ΔV^DET

⑤

V^DET

V^OPL

voltages will switch to L.

1/2 V^DD

If VDD exceeds the reset release voltage (VDET+∆VDET), then

VOUT switches from L to H (with a delay to the CT terminal).

If VDD drops below the detection voltage (VDET) when the power

supply is powered down or when there is a power supply fluctuation,

VOUT switches to L (with a delay of TPHL).

OUT

T^PLH

T^PHL

T^PLH

T^PHL

The potential difference between the detection voltage and the

release voltage is known as the hysteresis width (∆VDET). The

system is designed such that the output does not flip-flop with power

supply fluctuations within this hysteresis width, preventing

malfunctions due to noise.

①

②

③

④

Fig.17

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2009.06 - Rev.B

5/9

Technical Note

BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series

 Circuit Applications

1) Examples of a common power supply detection reset circuit

VDD1

VDD2

Application examples of BD52□□G/FVE series (Open

Drain output type) and BD53□□G/FVE series (CMOS

output type) are shown below.

Microcontroller

BD52□□□

CASE1: the power supply of the microcontroller (VDD2)

differs from the power supply of the reset detection

(VDD1).

（Noise-filtering

Capacitor）

）

Use the open drain output type (BD52□□G/FVE) attached

a load resistance (RL) between the output and VDD2. (As

shown Fig.15)

GND

Fig.18 Open Collector Output Type

CASE2: the power supply of the microcontroller (VDD1) is

same as the power supply of the reset detection (VDD1).

Use CMOS output type (BD53□□G/FVE) or open drain

output type (BD52□□G/FVE) attached a load resistance

(RL) between the output and Vdd1. (As shown Fig.16)

VDD1

Microcontroller

BD53□□□

When a capacitance CL for noise filtering is connected to

the VOUT pin (the reset signal input terminal of the

microcontroller), please take into account the waveform of

the rise and fall of the output voltage (VOUT).

（Noise-filtering

Capacitor）

GND

Fig.19 CMOS Output Type

2) The following is an example of a circuit application in which an OR connection between two types of detection voltages

resets the microcontroller.

VDD1

VDD2

VDD3

BD52□□□

RST

microcontroller

NO.1

NO.2

GND

Fig.20

When there are many power supplies of the system, power supplies VDD1 and VDD2 are being monitored separately, and it is

necessary to reset the microcomputer, it is possible to use an OR connection on the open drain output type BD52□□G/FVE

series to pull-up to the desired voltage (VDD3) as shown in Fig.17 and make the output “High” voltage matches the power

supply voltage VDD3 of the microcontroller.

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2009.06 - Rev.B

6/9

Technical Note

BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series

3) Examples of the power supply with resistor dividers

In applications where the power supply input terminal (VDD) of an IC with resistor dividers, it is possible that a through

current will momentarily flow into the circuit when the output logic switches, resulting in malfunctions (such as output

oscillatory state).

(Through-current is a current that momentarily flows from the power supply (VDD) to ground (GND) when the output level

switches from “High” to “Low” or vice versa.)

IDD

Through

Current

BD52□□

BD53□□

OUT

CIN

GND

VDD

VDET

Fig.21

A voltage drop of [the through-current (I1)] × [input resistor (R2)] is caused by the through current, and the input voltage to

descends, when the output switches from “Low” to “High”. When the input voltage decreases and falls below the detection

voltage, the output voltage switches from “High” to “Low”. At this time, the through-current stops flowing through output

“Low”, and the voltage drop is eliminated. As a result, the output switches from “Low” to “High”, which again causes the

through current to flow and the voltage drop. This process is repeated, resulting in oscillation.

Temp - IDD(BD52xx)

VDD - IDD Peak Current Ta=25°C

BU43xx

BU42xx

BD52xx

BD53xx

VDD3V

VDD5V

VDD7V

VDD10V

0.4

0.3

0.2

0.1

0.01

0.001

-50 -30 -10

110 130

VDD[V]

Temp[°C]

Fig.22 Current Consumption vs. Power Supply Voltage

*This data is for reference only.

The figures will vary with the application, so please confirm actual operating conditions before use.

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2009.06 - Rev.B

7/9

Technical Note

BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series

 Operation Notes

1 . Absolute maximum range

Absolute Maximum Ratings are those values beyond which the life of a device may be destroyed. We cannot be defined the

failure mode, such as short mode or open mode. Therefore a physical security countermeasure, like fuse, is to be given

when a specific mode to be beyond absolute maximum ratings is considered.

2 . GND potential

GND terminal should be a lowest voltage potential every state.

Please make sure all pins, which are over ground even if, include transient feature.

3 . Electrical Characteristics

Be sure to check the electrical characteristics that are one the tentative specification will be changed by temperature,

supply voltage, and external circuit.

4 . Bypass Capacitor for Noise Rejection

Please put into the capacitor of 1µF or more between VDD pin and GND, and the capacitor of about 1000pF between VOUT

pin and GND, to reject noise. If extremely big capacitor is used, transient response might be late. Please confirm sufficiently

for the point.

5 . Short Circuit between Terminal and Soldering

Don’t short-circuit between Output pin and VDD pin, Output pin and GND pin, or VDD pin and GND pin. When soldering the

IC on circuit board, please be unusually cautious about the orientation and the position of the IC. When the orientation is

mistaken the IC may be destroyed.

6 . Electromagnetic Field

Mal-function may happen when the device is used in the strong electromagnetic field.

7 . The VDD line inpedance might cause oscillation because of the detection current.

8 . A VDD -GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.

9 . Lower than the mininum input voltage makes the VOUT high impedance, and it must be VDD in pull up (VDD) condition.

10. This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause

unexpected operations. Application values in these conditions should be selected carefully. If the leakage is assumed

between the VOUT terminal and the GND terminal, the pull-up resistor should be less than 1/10 of the assumed leak

resistance. If 10Mꢀ leakage is assumed between the CT terminal and the GND terminal, 1Mꢀ connection between the CT

terminal and the VDD terminal would be recommended. The value of RCT depends on the external resistor that is

connected to CT terminal, so please consider the delay time that is decided by τ×RCT×CCT changes.

11. External parameters

The recommended parameter range for CT is 100pF~0.1µF and RL is 50kꢀ~1Mꢀ. There are many factors (board layout,

etc) that can affect characteristics. Please verify and confirm using practical applications.

12. Power on reset operation

Please note that the power on reset output varies with the VDD rise up time. Please verify the actual operation.

13. Precautions for board inspection

Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be

certain to use proper discharge procedure before each process of the test operation.

To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any

equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handing, transfer

and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is

OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup.

14. When the power supply, is turned on because of in certain cases, momentary Rash-current flow into the IC at the logic

unsettled, the couple capacitance, GND pattern of width and leading line must be considered.

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2009.06 - Rev.B

8/9

Technical Note

BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series

 Part Number Selection

－

BD52: Adjustable Delay Time

CMOS Reset IC

Reset Voltage Value

23: 2.3V to (0.1V step)

60: 6.0V

Package

Taping Specifications

Embossed Taping

G: SSOP5

Open Drain Type

FVE: VSOF5

BD53: Adjustable Delay Time

CMOS Reset IC

CMOS Output Type

SSOP5

−4

2.9 0.2

Tape

Embossed carrier tape

3000pcs

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1pin

+0.05

0.13

−0.03

+0.05

−0.04

0.42

0.1

0.95

Direction of feed

Order quantity needs to be multiple of the minimum quantity.

Reel

(Unit : mm)

∗

VSOF5

1.6 0.05

1.0 0.05

Tape

Embossed carrier tape

3000pcs

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1pin

0.13 0.05

Direction of feed

Order quantity needs to be multiple of the minimum quantity.

0.22 0.05

0.5

Reel

(Unit : mm)

∗

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2009.06 - Rev.B

9/9

Notice

N o t e s

No copying or reproduction of this document, in part or in whole, is permitted without the

consent of ROHM Co.,Ltd.

The content speciﬁed herein is subject to change for improvement without notice.

The content speciﬁed herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the speciﬁcations,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information speciﬁed in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information speciﬁed herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

use of such technical information.

The Products speciﬁed in this document are intended to be used with general-use electronic

equipment or devices (such as audio visual equipment, ofﬁce-automation equipment, commu-

nication devices, electronic appliances and amusement devices).

The Products speciﬁed in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

against the possibility of physical injury, ﬁre or any other damage caused in the event of the

failure of any Product, such as derating, redundancy, ﬁre control and fail-safe designs. ROHM

shall bear no responsibility whatsoever for your use of any Product outside of the prescribed

scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or

system which requires an extremely high level of reliability the failure or malfunction of which

may result in a direct threat to human life or create a risk of human injury (such as a medical

instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,

fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of

any of the Products for the above special purposes. If a Product is intended to be used for any

such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology speciﬁed herein that may

be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to

obtain a license or permit under the Law.

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

http://www.rohm.com/contact/

www.rohm.com

R0039

BD5247FVE-TR [ROHM]

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