BD52E34G-M [ROHM]

罗姆的延迟时间自由设置型CMOS复位IC系列，是内置了采用CMOS工艺的高精度、低消耗电流的延迟电路的CMOS RESET IC系列。可通过外接电容器设定延迟时间。为保证客户可根据应用进行选择，备有Nch漏极开路输出(BD52Exxx-M)系列和CMOS输出(BD53Exxx-M)系列产品。备有检测电压为2.3V～6.0V的0.1V阶跃的产品阵容。;


型号：	BD52E34G-M
厂家：	ROHM
描述：	罗姆的延迟时间自由设置型CMOS复位IC系列，是内置了采用CMOS工艺的高精度、低消耗电流的延迟电路的CMOS RESET IC系列。可通过外接电容器设定延迟时间。为保证客户可根据应用进行选择，备有Nch漏极开路输出(BD52Exxx-M)系列和CMOS输出(BD53Exxx-M)系列产品。备有检测电压为2.3V～6.0V的0.1V阶跃的产品阵容。电容器
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中文：	中文翻译
下载：	下载PDF数据表文档文件

Datasheet

Voltage Detector IC Series for Automotive

Free Delay Time Setting

CMOS Voltage Detector IC Series

BD52Exxx-M series BD53Exxx-M series

●General Description

●Key Specifications

 Detection voltage:

Rohm's BD52Exxx and BD53Exxx series are highly

accurate, low current consumption Voltage Detector

ICs with a capacitor controlled time delay. The line up

includes BD52Exxx devices with N-channel open drain

output and BD53Exxx devices with CMOS output. The

devices are available for specific detection voltages

ranging from 2.3V to 6.0V in increments of 0.1V.

●Features

2.3V to 6.0V (Typ.)

0.1V steps

 High accuracy detection voltage:

 Ultra-low current consumption:

●Package

±1.0%

0.95µA (Typ.)

SSOP5:

2.90mm x 2.80mm x 1.25mm

●Applications

Circuits using microcontrollers or logic circuits that

require reset for automotive applications (car

navigation, car audio, meter panel, exterior lamp etc.)

 Delay Time Controlled by external Capacitor

 Two output types(N-channel open drain and CMOS

output)

 Ultra-low current consumption

 Very small, lightweight and thin package

 Package SSOP5 is similar to SOT-23-5(JEDEC)

 AEC-Q100 Qualified

●Typical Application Circuit

VDD1

VDD2

Micro

controller

RST

BD53Exxx-M

Micro

controller

RST

BD52Exxx-M

(Capacitor for

noise filtering)

(Capacitor for

noise filtering)

GND

Open Drain Output type

BD52Exxx-M Series

CMOS Output type

BD53Exxx-M Series

●Connection Diagram

SSOP5

N.C.

TOP VIEW

Lot. No

Marking

VOUT VDD GND

●Pin Descriptions

SSOP5

PIN No. Symbol

Function

VOUT

VDD

Reset Output

Power Supply Voltage

GND

N.C.

Unconnected Terminal

Capacitor connection terminal for

output delay time

C_T

○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays

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●Ordering Information

Part

Number

Output Type

52 : Open Drain

53 : CMOS

Reset Voltage Value Package

G : SSOP5

0.1V step

Product Category Packaging and

M : Automotive Category forming specification

23 : 2.3V

TR : Embossed tape

and reel

60 : 6.0V

●Lineup

Output Type

Detection Voltage

Open Drain

CMOS

Part Number

Marking

6.0V

5.9V

5.8V

5.7V

5.6V

5.5V

5.4V

5.3V

5.2V

5.1V

5.0V

4.9V

4.8V

4.7V

4.6V

4.5V

4.4V

4.3V

4.2V

4.1V

4.0V

3.9V

3.8V

3.7V

3.6V

3.5V

3.4V

3.3V

3.2V

3.1V

3.0V

2.9V

2.8V

2.7V

2.6V

2.5V

2.4V

2.3V

BD52E60

BD52E59

BD52E58

BD52E57

BD52E56

BD52E55

BD52E54

BD52E53

BD52E52

BD52E51

BD52E50

BD52E49

BD52E48

BD52E47

BD52E46

BD52E45

BD52E44

BD52E43

BD52E42

BD52E41

BD52E40

BD52E39

BD52E38

BD52E37

BD52E36

BD52E35

BD52E34

BD52E33

BD52E32

BD52E31

BD52E30

BD52E29

BD52E28

BD52E27

BD52E26

BD52E25

BD52E24

BD52E23

BD53E60

BD53E59

BD53E58

BD53E57

BD53E56

BD53E55

BD53E54

BD53E53

BD53E52

BD53E51

BD53E50

BD53E49

BD53E48

BD53E47

BD53E46

BD53E45

BD53E44

BD53E43

BD53E42

BD53E41

BD53E40

BD53E39

BD53E38

BD53E37

BD53E36

BD53E35

BD53E34

BD53E33

BD53E32

BD53E31

BD53E30

BD53E29

BD53E28

BD53E27

BD53E26

BD53E25

BD53E24

BD53E23

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●Absolute maximum ratings

Parameter

Symbol

Limits

-0.3 to +10

Unit

Power Supply Voltage

V_DD-GND

Nch Open Drain Output

Output Voltage

GND-0.3 to +10

GND-0.3 to V_DD+0.3

V_OUT

CMOS Output

Output Current

Power

*1*2

SSOP5

540

Dissipation

Operating Temperature

Topr

Tstg

-40 to +105

-55 to +125

°C

Ambient Storage Temperature

*1 Reduced by 5.4mW/°C when used over 25°C.

*2 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board).

●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C)

Limit

Typ.

Parameter

Symbol

Condition

Unit

Min.

VDET(T)

×0.99

Max.

VDET(T)

×1.01

VDET(T)

VDD=HL, RL=470kΩ

Ta=+25°C

2.475

2.418

2.404

2.970

2.901

2.885

3.267

3.191

3.173

4.158

4.061

4.039

4.752

4.641

4.616

2.5

2.525

2.584

2.597

3.030

3.100

3.117

3.333

3.410

3.428

4.242

4.341

4.364

4.848

4.961

4.987

2.40

2.55

2.70

2.85

2.25

2.40

2.55

2.70

Ta=-40°C to 85°C

Ta=85°C to 105°C

Ta=+25°C

VDET=2.5V

3.0

Ta=-40°C to 85°C

Ta=85°C to 105°C

Ta=+25°C

VDET=3.0V

VDET=3.3V

VDET=4.2V

VDET=4.8V

3.3

Detection Voltage

V_DET

Ta=-40°C to 85°C

Ta=85°C to 105°C

Ta=+25°C

4.2

Ta=-40°C to 85°C

Ta=85°C to 105°C

Ta=+25°C

4.8

Ta=-40°C to 85°C

Ta=85°C to 105°C

V_DET=2.3-3.1V

V_DET=3.2-4.2V

V_DET=4.3-5.2V

V_DET=5.3-6.0V

V_DET=2.3-3.1V

V_DET=3.2-4.2V

V_DET=4.3-5.2V

V_DET=5.3-6.0V

0.80

0.85

Circuit Current when ON

Circuit Current when OFF

IDD1

IDD2

VDD=VDET-0.2V

VDD=VDET+2.0V

µA

0.90

0.95

0.75

0.80

0.85

0.90

VOL≤0.4V, Ta=25 to 105°C, RL=470kΩ

VOL≤0.4V, Ta=-40 to 25°C, RL=470kΩ

VDD=1.5V, ISINK = 0.4 mA, VDET=2.3-6.0V

VDD=2.4V, ISINK = 2.0 mA, VDET=2.7-6.0V

0.95

1.20

Operating Voltage Range

VOPL

VOL

0.5

‘Low’ Output Voltage (Nch)

0.5

VDD=4.8V, ISOURCE=0.7 mA, VDET(2.3V to 4.2V) VDD-0.5

VDD=6.0V, ISOURCE=0.9 mA, VDET(4.3V to 5.2V) VDD-0.5

VDD=8.0V, ISOURCE=1.1 mA, VDET(5.3V to 6.0V) VDD-0.5

‘High’ Output Voltage (Pch)

VOH

VDET (T) : Standard Detection Voltage (2.3V to 6.0V, 0.1V step)

R_L: Pull-up resistor to be connected between VOUT and power supply.

Design Guarantee. (Outgoing inspection is not done on all products.)

*1 Guarantee is at Ta=25°C.

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●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C) - continued

Limit

Typ.

Parameter

Symbol

I_leak

Condition

Unit

µA

Min.

Max.

Leak Current when OFF

VDD=VDS=10V

0.1

VDD

×0.60

VDD

×0.30

VDD

×0.40

VDD=VDET×1.1, VDET=2.3-2.6V, RL=470kΩ

VDD

×0.30

VDD

×0.35

VDD

×0.40

5.5

VDD

×0.45

VDD

×0.50

VDD

×0.50

VDD

×0.60

VDD

×0.60

VDD

×0.60

12.5

VDD=VDET×1.1, VDET=2.7-4.2V, RL=470kΩ

C_Tpin Threshold Voltage

VCTH

VDD=VDET×1.1, VDET=4.3-5.2V, RL=470kΩ

VDD=VDET×1.1, VDET=5.3-6.0V, RL=470kΩ

Output Delay Resistance

C_Tpin Output Current

RCT

ICT

VDD=VDET×1.1 VCT=0.5V

VCT=0.1V VDD=0.95V

VCT=0.5V VDD=1.5V

MΩ

µA

150

240

Detection Voltage

VDET/∆T Ta=-40°C to 105°C

±100

±360 ppm/°C

Temperature coefficient

VDET

Hysteresis Voltage

∆ VDET VDD=LHL, RL=470kΩ

×0.03

×0.05

×0.08

VDET (T) : Standard Detection Voltage (2.3V to 6.0V, 0.1V step)

R_L: Pull-up resistor to be connected between VOUT and power supply.

Design Guarantee. (Outgoing inspection is not done on all products.)

*1 Guarantee is at Ta=25°C.

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●Block Diagrams

VDD

VOUT

Vref

GND

Figure.1 BD52Exxx-M Series

VDD

VOUT

Vref

GND

Figure.2 BD53Exxx-M Series

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●Typical Performance Curves

2.0

BD5242G/FVE

【

】

BD5242G/FVE

【】

【BD52E42G-M】

【BD53E42G-M】

1.5

1.0

0.5

0.0

VDD=2.4V

VDD=1.2V

2.0

0.0

0.5

1.0

1.5

2.5

9 10

DRAIN-SOURCE VOLTAGE ： VDS[V]

VDD SUPPLY VOLTAGE ：VDD[V]

Figure.4 “Low” Output Current

Figure.3 Circuit Current

BD5242G/FVE

【

】

BD5342G/FVE

【BD52E42G-M】

【

【BD53E42G-M】

】

【BD53E42G-M】

VDD=8.0V

VDD=6.0V

Ta=25℃

VDD=4.8V

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5

DRAIN-SOURCE VOLTAGE ： VDS[V]

VDD SUPPLY VOLTAGE ：VDD[V]

Figure.5 “High” Output Current

Figure.6 I/O Characteristics

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●Typical Performance Curves – continued

450

400

350

300

250

200

150

100

1.0

BD5242G/FVE

【

】

BD5242G/FVE

【BD52E42G-M】

【

【BD52E42G-M】

】

0.8

0.6

0.4

0.2

0.0

【BD53E42G-M】

0.0

0.5

1.0

1.5

2.0

2.5

VDD SUPPLY VOLTAGE ： VDD[V]

Figure.8 CT Terminal Current

Figure.7 Operating Limit Voltage

5.6

5.2

4.8

4.4

4.0

3.6

3.2

1.5

1.0

0.5

0.0

【BD52E42G-M】

BD5242G/FVE

【

】

【BD52E42G-M】

BD5242G/FVE

【

】

【BD53E42G-M】

Lowto high(VDET+ΔVDET)

High to low(VDET)

～

-40 -20

20 40 60 80 100

-40

TEMPERATURE ： Ta[℃]

Figure.10 Circuit Current when ON

Figure.9 Detection Voltage

Release Voltage

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●Typical Performance Curves – continued

1.5

1.0

0.5

0.0

1.5

【BD52E42G-M】

BD5242G/FVE

【

BD5242G/FVE

】

【

】

【BD53E42G-M】

1.0

0.5

0.0

-40 -20

20 40 60 80 100

-40 -20

20 40 60 80 100

TEMPERATURE ： Ta[℃]

Figure.11 Circuit Current when OFF

Figure.12 Operating Limit Voltage

10000

【BD52E42G-M】

BD5242G/FVE

【

】

BD5242G/FVE

【

】

【BD52E42G-M】

【BD53E42G-M】

1000

100

【BD53E42G-M】

0.1

0.0001

0.001

0.01

0.1

-40 -20

20 40 60 80 100

CAPACITANCE OF C_T： CCT[μF]

TEMPERATURE ： Ta[

]

℃

Figure.14 Delay Time (t_PLH) and

C_TTerminal External Capacitance

Figure.13 C_TTerminal Circuit Resistance

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●Application Information

Explanation of Operation

For both the open drain type (Figure.15) and the CMOS output type (Figure.16), the detection and release voltages are

used as threshold voltages. When the voltage applied to the V_DDpins reaches the applicable threshold voltage, the V_OUT

terminal voltage switches from either “High” to “Low” or from “Low” to “High”. Please refer to the Timing Waveform and

Electrical Characteristics for information on hysteresis. Because the BD52Exxx-M series uses an open drain output type, it

is necessary to connect a pull-up resistor to V_DDor another power supply if needed [The output “High” voltage (V_OUT) in this

case becomes V_DDor the voltage of the other power supply].

VDD

RESET

Vref

RESET

VOUT

GND

Figure.15 (BD52Exxx-MType Internal Block Diagram)

Setting of Detector Delay Time

It is possible to set the delay time at the rise of VDD using a capacitor connected to the Ct terminal.

Figure.16 (BD53Exxx-MType Internal Block Diagram)

Delay time at the rise of V_DD

voltage(V_DET+∆V_DET

_PLH：Time until when Vout rise to 1/2 of V_DDafter V_DDrise up and beyond the release

)

V_DD-V_CTH

t_PLH= -C_CT×R_CT×ln

V_DD

C_CT

R_CT

V_CTH

C_Tpin Externally Attached Capacitance

C_Tpin Internal Impedance（Please refer to Electrical Characteristics.）

C_Tpin Threshold Voltage（Please refer to Electrical Characteristics.）

ln : Natural Logarithm

Reference Data of Falling Time (t_PHL) Output

Examples of Falling Time (t_PHL) Output

Part Number

BD52E27G-M

t_PHL[µs] -40°C

t_PHL[µs] ,+25°C

t_PHL[µs],+105°C

28.8

30.8

26.8

BD53E27G-M

24.8

*This data is for reference only.

The figures will vary with the application, so confirm actual operating conditions before use.

Timing Waveforms

Example: the following shows the relationship between the input voltage VDD, the C_TTerminal Voltage VCT and the output

voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in

Figure.15 and 16).

When the power supply is turned on, the output is unstable

VDD

from after over the operating limit voltage (VOPL) until tPHL.

Therefore it is possible that the reset signal is not outputted when

the rise time of V_DDis faster than tPHL.

VDET+ΔVDET

⑤

VDET

When VDD is greater than VOPL but less than the reset release

VOPL

voltage (VDET+∆VDET), the C_Tterminal (VCT) and output (VOUT)

voltages will switch to L.

VCT

1/2 VDD

If VDD exceeds the reset release voltage (VDET+∆VDET), then

VOUT switches from L to H (with a delay due to the C_Tterminal).

If VDD drops below the detection voltage (VDET) when the

power supply is powered down or when there is a power supply

fluctuation, VOUT switches to L (with a delay of tPHL).

VOUT

tPLH

tPHL

tPLH

tPHL

The potential difference between the detection voltage and the

release voltage is known as the hysteresis width (∆VDET). The

system is designed such that the output does not toggle with

power supply fluctuations within this hysteresis width, preventing

malfunctions due to noise.

①

②

③

④

Figure.17 Timing Waveform

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●Circuit Applications

1) Examples of a common power supply detection reset circuit

VDD1

VDD2

Application examples of BD52Exxx series (Open Drain

output type) and BD53Exxx series (CMOS output type)

are shown below.

Micro

controller

RST

BD52Exxx-M

CASE1: Power supply of the microcontroller (V_DD2

)

differs from the power supply of the reset detection

(V_DD1).

（Noise-filtering

Capacitor）

Use an open drain output type (BD52Exxx) with a load

resistance R_Lattached as shown Figure.18.

GND

Figure.18 Open Drain Output Type

CASE2: Power supply of the microcontroller (V_DD1) is the

same as the power supply of the reset detection (V_DD1).

Use a CMOS output type (BD53Exxx) device or open

drain output type (BD52Exxx) device with a pull up

VDD1

resistor attached between the output and V_DD1

Micro

controller

RST

BD53Exxx-M

When a capacitance C_Lfor noise filtering is connected to

the V_OUTpin (the reset signal input terminal of the

microcontroller), please take into account the waveform

of the rise and fall of the output voltage (V_OUT).

（Noise-filtering

Capacitor）

Please refer to Operational Notes for recommendations

on resistor and capacitor values.

GND

Figure.19 CMOS Output Type

2) The following is an example of a circuit application in which an OR connection between two types of detection voltage

resets the microcontroller.

VDD1

VDD2

VDD3

BD52Exxx-M

NO.1

BD52Exxx-M

NO.2

RST

microcontroller

GND

Fig.20

To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain

output type (BD52Exxx-M series) to the microcontroller’s input with pull-up resistor to the supply voltage of the

microcontroller (V_DD3) as shown in Fig. 20. By pulling-up to V_DD3, output “High” voltage of micro-controller power supply is

possible.

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3) Examples of the power supply with resistor dividers

In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow

into the circuit when the output level switches from “High” to “Low” or vice versa. In-rush current is a sudden surge of

current that flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow

may cause malfunction in the systems operation such as output oscillations, etc.

Figure.21

IDD

Through

Current

VDD

BD52Exxx-M

BD53Exxx-M

VOUT

CIN

GND

VDD

VDET

When an in-rush current (I1) flows into the circuit (Refer to Fig. 21) at the time when output switches from “Low” to “High”,

a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the VDD

voltage drops below the detection voltage, the output will switch from “High” to “Low”. While the output voltage is at “Low”

condition, in-rush current will stop flowing and the voltage drop will be reduced. As a result, the output voltage will switches

again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will result to

oscillation.

VDD - IDD PeakCurrent Ta=25℃

BD52Exxx-M

BD53Exxx-M

0.1

0.01

0.001

VDD[V]

Figure.22 IDD Peak Current vs. Power Supply Voltage

* This data is for reference only.

The figures will vary with the application, so please confirm actual operating conditions before use.

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●Operational Notes

1) Absolute maximum ratings

Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit

between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such

as adding a fuse, in case the IC is operated over the absolute maximum ratings.

2) Ground Voltage

The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no

pins are at a voltage below the ground pin at any time, even during transient condition.

3) Recommended operating conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

4) Bypass Capacitor for Noise Rejection

To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND.

Be careful when using extremely big capacitor as transient response will be affected.

5) Short between pins and mounting errors

Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong

orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.

6) Operation under strong electromagnetic field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

7) The V_DDline impedance might cause oscillation because of the detection current.

8) A V_DDto GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.

9) Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD)

condition.

10) External parameters

The recommended value of R_LResistor is 50kΩ to 1MΩ. The recommended value of C_TCapacitor is over 100pF to

0.1µF. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using

practical applications.

11) Power on reset operation

Please note that the power on reset output varies with the V_DDrise time. Please verify the behavior in the actual

operation.

12) Testing on application boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

13) Rush current

When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to

the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special

consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.

14) C_Tpin discharge

Due to the capabilities of the C_Tpin discharge transistor, the C_Tpin may not completely discharge when a short input

pulse is applied, and in this case the delay time may not be controlled. Please verify the actual operation.

www.rohm.com

TSZ02201-0R7R0G300090-1-2

17.Jun.2020 Rev.006

12/12

TSZ22111・15・001

Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.004

Daattaasshheeeett

General Precaution

1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this document is current as of the issuing date and subject to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales

representative.

3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

BD52E34G-M [ROHM]

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