BD5340G-2M [ROHM]

罗姆的延迟时间自由设置型CMOS电压检测器IC系列是内置了采用CMOS工艺的高精度、低消耗电流延迟电路的CMOS RESET IC系列。可通过外接电容器设定延迟时间。为保证客户可根据应用进行选择，备有Nch漏极开路输出(BD52xx-2M)系列和CMOS输出(BD53xx-2M)系列产品。备有检测电压为0.9V～5.0V的0.1V阶跃的产品阵容。在-40°C到105°C的整个工作温度范围内，将延迟时间精度控制在±30%内。;


型号：	BD5340G-2M
厂家：	ROHM
描述：	罗姆的延迟时间自由设置型CMOS电压检测器IC系列是内置了采用CMOS工艺的高精度、低消耗电流延迟电路的CMOS RESET IC系列。可通过外接电容器设定延迟时间。为保证客户可根据应用进行选择，备有Nch漏极开路输出(BD52xx-2M)系列和CMOS输出(BD53xx-2M)系列产品。备有检测电压为0.9V～5.0V的0.1V阶跃的产品阵容。在-40°C到105°C的整个工作温度范围内，将延迟时间精度控制在±30%内。电容器
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中文：	中文翻译
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Datasheet

Voltage Detector (Reset) IC Series for Automotive Application

Free Time Delay Setting

CMOS Voltage Detector (Reset) IC

BD52xx-2M Series and BD53xx-2M Series

General Description

Key Specifications

ROHM's BD52xx-2M and BD53xx-2M series are highly

accurate, low current consumption Voltage Detector

ICs with a capacitor controlled time delay. The lineup

includes N-channel open drain output (BD52xx-2M)

and CMOS output (BD53xx-2M) so that the users can

select depending on the application. The devices are

available for specific detection voltage ranging from

0.9V to 5.0V with 0.1V increment.

 Detection Voltage:

0.9V to 5.0V (Typ.)

0.1V step

 Ultra-Low Current Consumption:

270nA (Typ.)

 Time Delay Accuracy:

±30% (-40°C to +105°C, )

(CT pin capacitor ≥ 1nF)

Special Characteristics

 Detection Voltage Accuracy:

The time delay has ±30% accuracy in the overall

operating temperature range of -40°C to 105°C.

±2.0%±12mV (V_DET=0.9V to 1.6V)

±2.5% (V_DET=1.7V to 5.0V)

Special Features

 AEC-Q100 Qualified ^(Note1)

Package

 Nano Energy

SSOP5:

W(typ) x D(typ) x H(max)

 Delay Time Setting controlled by external capacitor

 Two output types (Nch open drain and CMOS output)

 Very small, lightweight and thin package

 Package SSOP5 is similar to SOT-23-5 (JEDEC)

(Note1: Grade 1)

2.90mm x 2.80mm x 1.25mm

Application

 Automotive (audio system, navigation system, etc.)

Application Circuit

V_DD1

V_DD2

V_DD1

R_L

Microcontroller

RST

Microcontroller

BD52xx-2M

BD53xx-2M

RST

C_CT

GND

Figure 1. Open Drain Output Type

BD52xx-2M Series

Figure 2. CMOS Output Type

BD53xx-2M Series

Pin Configuration

SSOP5

Pin Description

N.C.

SSOP5

Function

TOP VIEW

PIN No.

Symbol

VOUT Output pin

VDD

GND

N.C.

Power supply voltage

GND

Lot No.

Marking

No connection pin

Capacitor connection pin

for output delay time setting

VOUT VDD GND

N.C. pin is electrically open and can

be connected to either VDD or GND.

Nano Energy is a combination of technologies which realizes ultra low quiescent current operation.

○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays

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Ordering Information

Part

Number

Output Type

52 : Open Drain

53 : CMOS

Detection Voltage

09 : 0.9V

Package

G : SSOP5

Product Rank

M : for Automotive specification

TR : Embossed tape and reel

Packaging and forming

0.1V step

50 : 5.0V

Lineup

Output Type

Open Drain

CMOS

Part Number

Detection Voltage

Part Number

Marking

5.0V

4.9V

4.8V

4.7V

4.6V

4.5V

4.4V

4.3V

4.2V

4.1V

4.0V

3.9V

3.8V

3.7V

3.6V

3.5V

3.4V

3.3V

3.2V

3.1V

3.0V

2.9V

2.8V

2.7V

2.6V

2.5V

2.4V

2.3V

2.2V

2.1V

2.0V

1.9V

1.8V

1.7V

1.6V

1.5V

1.4V

1.3V

1.2V

1.1V

1.0V

0.9V

BD5250

BD5249

BD5248

BD5247

BD5246

BD5245

BD5244

BD5243

BD5242

BD5241

BD5240

BD5239

BD5238

BD5237

BD5236

BD5235

BD5234

BD5233

BD5232

BD5231

BD5230

BD5229

BD5228

BD5227

BD5226

BD5225

BD5224

BD5223

BD5222

BD5221

BD5220

BD5219

BD5218

BD5217

BD5216

BD5215

BD5214

BD5213

BD5212

BD5211

BD5210

BD5209

BD5350

BD5349

BD5348

BD5347

BD5346

BD5345

BD5344

BD5343

BD5342

BD5341

BD5340

BD5339

BD5338

BD5337

BD5336

BD5335

BD5334

BD5333

BD5332

BD5331

BD5330

BD5329

BD5328

BD5327

BD5326

BD5325

BD5324

BD5323

BD5322

BD5321

BD5320

BD5319

BD5318

BD5317

BD5316

BD5315

BD5314

BD5313

BD5312

BD5311

BD5310

BD5309

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Absolute Maximum Ratings (Ta=+25°C)

Parameter

Symbol

Limit

-0.3 to +7

Unit

V_DD-GND

Power Supply Voltage

Nch Open Drain Output

CMOS Output

GND-0.3 to +7

GND-0.3 to V_DD+0.3

Output Voltage

Output Current

V_OUT

°C

Operating Temperature Range

Maximum Junction Temperature

Storage Temperature Range

Topr

-40 to +105

+150

Tjmax

Tstg

-55 to +150

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the

maximum junction temperature rating.

Thermal Resistance^{(Note 1)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 3)}

2s2p^{(Note 4)}

SSOP5

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

376.5

185.4

°C/W

Ψ_JT

(Note 1)Based on JESD51-2A(Still-Air).

(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 3)Using a PCB board based on JESD51-3.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3mm x 76.2mm x 1.57mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70μm

(Note 4)Using a PCB board based on JESD51-7.

Layer Number of

Material

Board Size

114.3mm x 76.2mm x 1.6mmt

2 Internal Layers

Measurement Board

4 Layers

FR-4

Top

Bottom

Copper Pattern

74.2mm x 74.2mm

Copper Pattern

Thickness

Copper Pattern

Thickness

Footprints and Traces

70μm

74.2mm x 74.2mm

35μm

70μm

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Electrical Characteristics (Unless otherwise specified Ta=-40°C to +105°C, VDD=0.8V to 6V)

Limit

Parameter

Symbol

Condition

Unit

Min

V_DET(T)

×0.98

-0.012

V_DET(T)

×0.975

Typ

Max

V_DET(T)

×1.02

+0.012

V_DET(T)

×1.025

V_DET(T)

V_DET=0.9V to 1.6V, VDD=HL, RL=100kΩ

V_DET=1.7V to 5.0V, VDD=HL, RL=100kΩ

DetectionVoltage

V_DET

V_DET(T)

V_DET

×0.07

1.00

1.10

HysteresisVoltage

∆V_DETV_DD=LHL, RL=100kΩ

×0.03

×0.05

0.23

Circuit Current when ON

Circuit Current when OFF

Operating Voltage Range

I_DD1V_DD= V_DET-0.2V

µA

0.27

I_DD2V_DD= V_DET+0.5V

V_OPLV_OL≤0.4V, Ta=-40°C to 105°C, RL=100kΩ

V_DD=0.8V, ISINK = 0.17mA, V_DET=0.9V to 1.6V

0.80

0.4

“Low” Output Voltage (Nch)

V_OL

V_DD=1.2V, ISINK = 1.0mA, V_DET=1.7V to 5.0V

V_DD=2.4V, ISINK = 2.0mA, V_DET=2.7V to 5.0V

V_DD=4.8V, ISOURCE=2.0mA,

V_DET(0.9V to 4.2V)

0.4

V_DD-0.4

V_OH

“High” Output Voltage (Pch)

V_DD=6.0V, ISOURCE=2.5mA,

V_DET(0.9V to 5.0V)

V_DD-0.4

Output Leak Current (BD52xx) I_LEAKV_DD= V_DS=6V

1.0

72.1

µA

_OUT＝GND→50%, CT=0.01μF

Delay Time (L → H)

t_PLH

38.9

55.5

Note 1 Note 2

V_DET(T) : Standard Detection Voltage(0.9V to 5.0V, 0.1V step)

R_L: Pull-up resistor to be connected between V_OUTand power supply.

Note 1 t_PLH: V_DD=(V_DET(T)–0.1V) → (V_DET(T)+0.5V) for V_DET=0.9V to 1.2V

t_PLH: V_DD=(V_DET(T)–0.5V) → (V_DET(T)+0.5V) for V_DET=1.3V to 5.0V

Note 2 CT delay capacitor range: open to 4.7µF.

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Block Diagram

VDD

VOUT

Delay

Vref

Circuit

GND

*1: Parasitic Diode

Figure 3. BD52xx-2M Series

VDD

Delay

Circuit

Vref

Delay

VOUT

GND

*1: Parasitic Diode

Figure 4. BD53xx-2M Series

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Typical Performance Curves

1.0

0.6

0.5

0.4

0.3

0.2

0.1

0.0

BD5209G-2M

0.9

0.8

0.7

Ta=105°C

0.6

V_DD=V_DET+0.5V

Ta=25°C

0.5

0.4

0.3

0.2

V_DD=V_DET-0.2V

Ta=-40°C

0.1

0.0

-40

-20

100

Supply Voltage : V_DD[V]

Temperature : Ta [°C]

Figure 5. Circuit Current vs. V_DD

Figure 6. Circuit Current vs. Temp

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

0.6

0.5

0.4

0.3

0.2

0.1

0.0

BD5230G-2M

V_DD=V_DET+0.5V

Ta=105°C

Ta=25°C

V_DD=V_DET-0.2V

Ta=-40°C

-40

-20

Temperature : Ta [°C]

Figure 8. Circuit Current vs. Temp

100

Supply Voltage : V_DD[V]

Figure 7. Circuit Current vs. V_DD

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Typical Performance Curves - continued

1.0

0.6

0.5

0.4

0.3

0.2

0.1

0.0

BD5250G-2M

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

BD5250G-2M

V_DD=V_DET+0.5V

Ta=105°C

Ta=25°C

V_DD=V_DET-0.2V

Ta=-40°C

-40

-20

100

Temperature : Ta [°C]

Supply Voltage : V_DD[V]

Figure 10. Circuit Current vs. Temp

Figure 9. Circuit Current vs. V_DD

6.0

5.0

4.0

3.0

2.0

1.0

0.0

1.3

1.2

1.1

1.0

0.9

0.8

0.7

0.6

BD5209G-2M

V_DET+ ΔV_DET

V_DET

0.7

0.8

0.9

1.0

1.1

1.2

-40

-20

100

Supply Voltage : V_DD[V]

Temperature : Ta [°C]

Figure 11. Detection Voltage

Figure 12. Detection Voltage and Release Voltage

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Typical Performance Curves - continued

6.0

3.6

3.5

3.4

3.3

3.2

3.1

3.0

2.9

2.8

2.7

2.6

BD5230G-2M

5.0

V_DET+ ΔV_DET

4.0

3.0

2.0

1.0

0.0

V_DET

2.7 2.8 2.9

3.1 3.2 3.3 3.4 3.5

-40

-20

100

Supply Voltage : V_DD[V]

Temperature : Ta [°C]

Figure 13. Detection Voltage

Figure 14. Detection Voltage and Release Voltage

5.6

5.5

5.4

5.3

5.2

5.1

5.0

4.9

4.8

4.7

4.6

6.0

5.0

4.0

3.0

2.0

1.0

0.0

BD5250G-2M

V_DET+ ΔV_DET

V_DET

4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5 5.6

-40

-20

100

Supply Voltage : V_DD[V]

Temperature : Ta [°C]

Figure 16. Detection Voltage and Release Voltage

Figure 15. Detection Voltage

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Typical Performance Curves - continued

Pull-up to 5V

Pull-up resistance: 100kΩ

Pull-up to VDD

Pull-up resistance: 100kΩ

6.0

5.0

4.0

3.0

2.0

1.0

0.0

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

BD5230G-2M

Ta=105°C

Ta=25°C

Ta=-40°C

Ta=105°C

Ta=25°C

Ta=-40°C

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

Supply Voltage : V_DD[V]

Figure 17. I/O Characteristics

Figure 18. I/O Characteristics

Pull-up to 5V

Pull-up to VDD

Pull-up resistance: 100kΩ

1.0

0.8

0.6

0.4

0.2

0.0

1.0

0.8

0.6

0.4

0.2

0.0

-40

-20

Temperature : Ta [°C]

Figure 19. Operating Limit Voltage

100

-40

-20

Temperature : Ta [°C]

Figure 20. Operating Limit Voltage

100

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Typical Performance Curves - continued

BD5309G-2M

BD5250G-2M

V_DD= 2V

V_DD= 4V

V_DD= 3V

V_DD= 1.2V

V_DD= 2V

V_DD= 0.85V

V_DD= 1.2V

0.0

1.0

2.0

3.0

4.0

5.0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

Drain-Source Voltage : V_DS[V]

Figure 21. “High” Output Current

Figure 22. “Low” Output Current

BD5220G-2M

BD5309G-2M

Ta=-40°C

Ta=25°C

Ta=105°C

0.0

1.0

2.0

3.0

4.0

5.0

6.0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

Supply Voltage : V_DD[V]

Figure 23. “High” Output Current (V_DS=0.5V)

Figure 24. “Low” Output Current (V_DS=0.5V)

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Typical Performance Curves - continued

C_CT=10nF

C_CT=4.7nF

-40

-20

Temperature : Ta [°C]

Figure 26. Output Delay Time (H to L)

100

-40

-20

100

Temperature : Ta [°C]

Figure 25. Output Delay Time (L to H)

100000

10000

1000

100

Ta=-40°C

Ta=25°C

Ta=105°C

0.1

0.0001

0.001

0.01

0.1

0.0001

0.001

0.01

0.1

CT Pin Capacitance : C_CT[µF]

Figure 27. Output Delay Time (L to H)

Figure 28. Output Delay Time (H to L)

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Application Information

1. Explanation of Operation

For both the open drain type (Figure 29) and the CMOS output type (Figure 30), the detection and release voltages

are used as threshold voltages. When the voltage applied to the VDD pin reaches the applicable threshold voltage,

the VOUT pin voltage switches from either “High” to “Low” or from “Low” to “High”. BD52xx-2M series and

BD53xx-2M series have delay time function which set t_PLH(output “Low” to ”High”) using an external capacitor

connected in CT pin (C_CT). Because the BD52xx-2M series uses an open drain output type, it is necessary to connect

a pull up resistor to V_DDor another power supply if needed [The output “High” voltage (V_OUT) in this case becomes

V_DDor the voltage of the other power supply].

VDD

VOUT

Delay

Vref

VOUT

Circuit

GND

Figure 30. (BD53xx-2M type internal block diagram)

Figure 29. (BD52xx-2M type internal block diagram)

2. Setting of Detector Delay Time

Delay time L to H (t_PLH) is the time when V_OUTrises to 1/2 of V_DDafter V_DDrises up and beyond the release

voltage (V_DET+∆V_DET). The delay time (t_PLH) at the rise of V_DDis determined by delay coefficient, CT capacitor and

delay time when CT pin is open (t_CTO) and calculated from the following formula. When CT capacitor ≥ 1nF, t_CTOhas

less effect and t_PLHcomputation is shown on Example No.2. The result has ±30% tolerance within the operating

temperature range of -40°C to +105°C

Formula: (Ta=25°C)

푡_푃퐿퐻= 퐶_ꢀ푇× 퐷푒푙푎푦 퐶표푒푓푓푖푐푖푒푛푡 + 푡_ꢀ푇푂

[s]

where:

C_CTis the CT pin external capacitor

Delay Coefficient is equal to 5.55 x 10⁶

t_CTOis the delay time when CT=open ^Note1

Delay Time (t_CTO

)

Temperature

Min

Typ

Max

Ta = -40°C to +105°C

15µs

50µs

150µs

Note1: t_CTOis design guarantee only; outgoing inspection is not done on all products.

Example No.1:

CT capacitor = 100pF

−ꢃ2

× 5.55 × 10⁶× 0.7 + 15 × 10⁻⁶= 403µ푠

)

(

푡_{푃퐿퐻_푚ꢁꢂ}= 100 × 10

−ꢃ2

× 5.55 × 10⁶× 1.0 + 50 × 10⁻⁶= ꢆ05µ푠

)

(

푡_{푃퐿퐻_ꢄꢅ푝}= 100 × 10

−ꢃ2

× 5.55 × 10⁶× 1.3 + 150 × 10⁻⁶= 87ꢈµ푠

)

(

푡_{푃퐿퐻_푚ꢇ푥}= 100 × 10

Example No.2:

CT capacitor = 1nF

푡_{푃퐿퐻_ꢄꢅ푝}= 1 × 10⁻⁹× 5.55 × 10⁶= 5.55ꢉ푠

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3. Timing Waveform

The following shows the relationship between the input voltage V_DDand the output voltage V_OUTwhen the power supply

voltage V_DDis sweep up and sweep down.

V_DD

R_L

VDD

Delay

Circuit

Vref

VOUT

GND

C_CT

Figure 31. BD52xx-2M Set-up

V_DD

V_DET+ΔV_DET

Hysteresis Voltage (ΔV_DET

)

V_DET

V_OPL: <0.8V

V_OUT

undefined

t_PLH

t_PHL

Figure 32. Timing Diagram

1. When the power supply turns on, the Output Voltage (V_OUT) is undefined until V_DDovercomes the Operating

Voltage Limit (V_OPL).

2. V_OUTwill turn to “Low” as V_DDincreases above V_OPLbut less than the Release Voltage (V_DET+ΔV_DET),

3. When V_DDexceeds the Release Voltage (V_DET+ΔV_DET), delay time (t_PLH) set by capacitor at CT pin (C_CT)

will happen then V_OUTwill switch from “Low” to “High”.

4. V_OUTwill remain “High” until V_DDdo not fall below the Detection Voltage (V_DET).

5. When V_DDdrops below V_DET, V_OUTwill switch from “High” to “Low” with a delay of t_PHL

*The potential difference between the detection voltage and the release voltage is known as the Hysteresis

Voltage width (∆V_DET). The system is designed such that the output will not toggle with power supply fluctuations

within this hysteresis width, preventing malfunctions due to noise.

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4. Circuit Applications

(1) Examples of common application circuits

V_DD1

V_DD2

Application examples of BD52xx-2M series

(Open-drain output type) and BD53xx-2M series

(CMOS output type) are shown below.

R_L

Microcontroller

CASE1: Power supply of the microcontroller (V_DD2

differs from the power supply of the reset detection

(V_DD1).

)

RST

BD52xx-2M

C_CT

Use an open drain output type (BD52xx-2M) device

with a load resistance R_Lattached as shown

in Figure33.

GND

Figure 33. Open Drain Output Type

CASE2: Power supply of the microcontroller (V_DD1) is

the same as the power supply of the reset detection

(V_DD1).

V_DD1

Use a CMOS output type (BD53xx-2M) device or an

open-drain output type (BD52xx-2M) device with a

pull-up resistor between the output and V_DD1

Microcontroller

RST

BD53xx-2M

C_CT

GND

Figure 34. CMOS Output type

(2) The following is an example of circuit application in which an OR connection between two types of detection voltage

resets the microcontroller.

V_DD1

V_DD2

V_DD3

R_L

Microcontroller

RST

BD52xx-2M

NO.1

BD52xx-2M

NO.2

C_CT

GND

Figure 35. OR Circuit Connection Application

To reset the microcontroller when many independent power supplies are used in the system, OR connect an open

drain output type (BD52xx-2M series) to the microcontroller’s input with pull-up resistor to the supply voltage of the

microcontroller (V_DD3) as shown in Figure 35. By pulling-up to V_DD3, output “High” voltage of micro-controller power

supply is possible.

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Circuit Applications (continued)

(3) Examples of the power supply with resistor dividers

In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an inrush current will

flow into the circuit when the output level switches from “Low” to “High” or vice versa. Inrush current is a sudden

surge of current that flows from the power supply (V_DD) to ground (GND) as the output logic changes its state. This

current flow may cause malfunction in the systems operation such as output oscillations, etc.

V₁

(Note1)

I_DD

R_A

(R_A≤100kohm)

I₁

V_DD

Inrush Current

(Note1)

C_VDD

(C_VDD≥0.1μF)

BD52xx-2M

BD53xx-2M

R_B

V_OUT

GND

V_DD

V_DET

Figure 36. Resistor Divider Connection Application

Figure 37. V_DDVoltage vs. Current Consumption

A voltage drop [Inrush current (I₁)] × [input resistor (R_A)] is caused by the inrush current, and causes the input

voltage to drop when the output switches from “Low” to “High”. When the input voltage decreases and falls below

the detection voltage, the output voltage switches from “High” to “Low”. At this time, the inrush current stops flowing

through output “Low”, and the voltage drop is reduced. As a result, the output switches from “Low” to “High”, which

again causes the inrush current to flow and the voltage to drop. This operation repeats and will result to oscillation.

In case resistor divider will not use and only R_Awill use, same response will happen.

Note1: The circuit connection mentioned above does not guarantee successful operation.

Please perform thorough evaluation using the actual application and set countermeasures

100

100.0

10.0

1.0

BD5309G-2M

0.1

1.0

2.0

3.0

4.0

5.0

6.0

-40

-20

Temperature : Ta (°C)

Figure 39. I_DDInrush Current V_DD=6V

100

Supply Voltage : V_DD(V)

Figure 38. I_DDInrush Current Ta=25°C

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Circuit Applications (continued)

Depending on the application set-up, there are times that V_DDvoltage is always below the Release Voltage (V_DET+ΔV_DET

)

because of the effect of inrush current as shown in Figure 40.

Voltage

V₁

ΔV_DROP= Inrush Current x R_A

V_DD

V_DET+ΔV_DET

Hysteresis Voltage (ΔV_DET

)

V_DET

Figure 40. V_DDDrop Caused by Inrush Current

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

pins.

2. Power Supply Line

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all

power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on

the ground voltage. The power supply and ground lines must be as short and thick as possible to reduce line

impedance.

5. Thermal Consideration

Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may

result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the

board size and copper area to prevent exceeding the maximum junction temperature rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

7. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of

connections.

8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power

supply or ground line

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Operational Notes – continued

12. Regarding Input Pins of the IC

In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation

of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.

Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower

than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply

voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages

within the values specified in the electrical characteristics of this IC

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others

14. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within

the Area of Safe Operation (ASO).

15. Bypass Capacitor for Noise Rejection

To help reject noise, put more than 0.1µF capacitor between VDD pin and GND. Be careful when using extremely big

capacitor as transient response will be affected.

16. The V_DDline impedance might cause oscillation because of the detection current.

17. A V_DDto GND capacitor (as close connection as possible) should be used in high V_DDline impedance condition.

18. External Parameters

The recommended value of C_TCapacitor is from open to 4.7µF and pull-up resistance value is 50kΩ to 1MΩ. There are

many factors (board layout, etc) that can affect characteristics. Operating beyond the recommended values does not

guarantee correct operation. Please verify and confirm using practical applications.

19. When V_DDfalls below the minimum operating voltage, output will be open. When output is connected to pull-up voltage,

output will be equivalent to pull-up voltage.

20. Power-on Reset Operation

Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual

operation.

21. CT Pin Discharge

Due to the capabilities of the CT pin discharge transistor, the CT pin may not completely discharge when a short input

pulse is applied, and in this case the delay time may not be controlled. Please verify the actual operation.

22. This IC has extremely high impedance pins. Small leak current due to the uncleanness of PCB surface might cause

unexpected operations. Application values in these conditions should be selected carefully. If 10MΩ leakage is assumed

between the CT and GND pin, it is recommended to insert 1MΩ resistor between CT and VDD pin. However, delay time

will change when resistor is connected externally to CT pin so verify the delay time requirements when using this set-up.

Also, when similar leakage is assumed between VOUT and GND pin, consider to set the value of pull up resistor lower

than 1/10 of the impedance of assumed leakage route.

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External Dimension Diagram, Packaging and Forming Specification

Package Name

SSOP5

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Revision History

Date

Revision

Changes

2017/05/12

2018/07/05

001

002

New

Add notation of “Nano Energy”

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Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.003

Daattaasshheeeett

General Precaution

1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this document is current as of the issuing date and subject to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales

representative.

3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

BD5340G-2M [ROHM]

相关型号：

SI9130DB

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SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

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SI9137LG

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