BD5431EFS_11 [ROHM]
Silicon monolithic integrated circuits; 硅单片集成电路
| 型号： | BD5431EFS_11 |
| 厂家： | 
ROHM |
| 描述： | Silicon monolithic integrated circuits |
| 文件： | 总5页 (文件大小：153K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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STRUCTURE:
PRODUCT:
Silicon monolithic integrated circuits
Stereo Class-D Power Amplifier For Speaker
TYPE:
BD5431EFS
HTSSOP-A44
PACKAGE:
FEATURES:
1) Differential Analog / PWM inputs
2) High efficiency and low heat generation eliminates external heat-sinks
3) Eliminates pop noise generated when the power supply goes on/off, or when the power supply is
suddenly shut off
4) High quality muting performance is realized by using the soft-switching technology
5) Incorporates a master/slave function that enables synchronous operation when several
units are used simultaneously
6) Allows the internal PWM sampling clock frequency to be adjusted
○Absolute maximum ratings (Ta=25℃)
Item Symbol
Limit
+20
Unit
V
Conditions
Pin7、8、15、16、29、30、37、38、40
※1 ※2
Supply voltage
Vcc
Pd
2.0
4.5
W
W
V
※3
Power dissipation
※4
Input voltage for signal pin
Input voltage for control pin
Input voltage for clock pin
Operating temperature range
Storage temperature range
Maximum junction temperature
VIN
-0.2 ～ +7.2
-0.2 ～ Vcc+0.2
-0.2 ～ +7.2
-40 ～ +85
-55 ～ +150
+150
Pin1、2、3、4 ※1
Pin20、24 ※1
Pin23 ※1
VCONT
VOSC
V
V
Topr
Tstg
Tjmax
℃
℃
℃
※1 The voltage that can be applied, based on GND(Pin11, 12, 33, 34, 43)
※2 Do not, however exceed Pd and Tjmax=150℃.
※3 70mm×70mm×1.6mm, FR4, 1-layer glass epoxy board (Copper on bottom layer 0%)
Derating in done at 16mW/℃ for operating above Ta＝25℃. There are thermal vias on the board.
※4 70mm×70mm×1.6mm, FR4, 2-layer glass epoxy board (Copper on bottom layer 100%)
Derating in done at 36mW/℃ for operating above Ta＝25℃. There are thermal vias on the board.
○Operating conditions (Ta＝25℃)
Item
Symbol
Vcc
Limit
Unit
V
Conditions
Pin7、8、15、16、29、30、37、38、40
※1
Supply voltage
+10 ～ +16.5
4 ～ 16
RL
Load impedance
Ω
※5
※5 Do not, however exceed Pd.
※
No radiation-proof design
REV. B
2/4
○Electrical characteristics
（Unless otherwise specified Ta=25℃, Vcc=12V, f=1kHz differential analog input、 Rg=0Ω, RL=8Ω, MUTEX=H, MS=L）
Limit
Item
Symbol
Unit
Conditions
Min
Typ
Max
Whole circuit
Circuit current 1 (Sampling mode)
Circuit current 2 (Mute mode)
Control circuit
ICC1
ICC2
-
-
25
10
50
20
mA
mA
MUTEX=L
VIH
VIL
2.3
0
-
-
12
V
V
MUTEX, MS
MUTEX, MS
H level input voltage
0.8
L level input voltage
Audio circuit
Voltage gain
Gv
PO1
22
-
23.5
10
25
-
dB
W
Po=1W, 20log(Vout/Vin)
Maximum output power 1
Maximum output power 2
Total harmonic distortion
Crosstalk
RL=8Ω, THD+n=10% ※1
RL=4Ω, THD+n=10% ※1
PO=1W, BW=20Hz～20kHz ※1
PO=1W, Rg=0Ω, BW=IHF-A
PO2
-
17
-
W
THD
CT
-
0.1
75
-
%
60
-
-
dB
Output noise voltage (Sampling mode)
Residual noise voltage (Mute mode)
Internal sampling clock frequency
VNO
VNOM
FOSC
60
160
10
320
μVrms Rg=0Ω, BW=IHF-A
μVrms MUTEX=L, Rg=0Ω, BW=IHF-A
kHz
-
1
180
250
※1 These items show the typical performance of device and depend on board layout, parts, power supply.
The standard value is in mounting device and parts on surface of ROHM’s board directly.
○Package outline
Type
BD5431EFS
Lot No.
(UNIT: mm)
PKG: HTSSOP-A44
Drawing No.: EX195-5002
REV. B
3/4
○Block diagram
○Pin No. / Pin name
Pin No.
1
Pin name
Pin No.
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
Pin name
N.C.
N.C.
1
2
3
4
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
IN2N
IN2P
2
GNDA
FILA
GNDA
FILA
3
IN1N
IN1P
4
FILP
5
N.C.
VCCA
BSP2P
FILP
VCCA
6
BSP1P
5
N.C.
PWM1
PWM2
7
VCCP1P
OUT1P
GNDP1
OUT1N
VCCP1N
VCCP2P
OUT2P
GNDP2
OUT2N
VCCP2N
6
8
9
7
10
11
12
13
14
15
16
17
18
19
20
21
22
8
9
DRIVER
1P
DRIVER
2P
10
11
12
13
14
15
16
17
18
19
20
21
22
BSP1N
WARNING
ERROR
MUTEX
N.C.
BSP2N
VHOLD
TM
DRIVER
1N
DRIVER
2N
ROSC
MS
N.C.
OSC
Protection & Logic
N.C. ： Non Connection.
Power-off
Detector
WARNING
ERROR
Under Voltage Protection
High Temperature Protection
SOFT MUTE
Output Short Protection
MUTE
CONTROL
Ramp
Generator
N.C.
N.C.
Clock
Control
REV. B
4/4
○Operation Notes
（1） Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may
result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when
such damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a
special mode where the absolute maximum ratings may be exceeded is anticipated.
（2） Power supply lines
As return of current regenerated by back EMF of output coil happens, take steps such as putting capacitor between
power supply and GND as a electric pathway for the regenerated current. Be sure that there is no problem with each
property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. If
the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the
voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the
absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a
voltage clamp diode between the power supply and GND pins.
（3） GND potential
Ensure a minimum GND pin potential in all operating conditions.
（4） Setting of heat
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating
conditions. This IC exposes its frame of the backside of package. Note that this part is assumed to use after
providing heat dissipation treatment to improve heat dissipation efficiency. Try to occupy as wide as possible with
heat dissipation pattern not only on the board surface but also the backside.
Class-D power amplifier is High efficiency and low heat generation by comparison with conventional Analog power
amplifier. However, In case it is operated continuously by maximum output power, Power dissipation(Pdiss) may
exceed package dissipation. Please consider about heat design that Power dissipation(Pdiss) does not exceed
Package dissipation(Pd) in average power(Poav). （Tjmax ：Maximum junction temperature=150℃、Ta ：Peripheral
temperature[℃]、θja ：Thermal resistance of package[℃/W]、Poav：Average power[W]、η：Efficiency）
Package dissipation: Pd （W） = （Tjmax - Ta）／θja
Power dissipation:
（5） Actions in strong magnetic field
Pdiss（W） = Poav * （1／η- 1）
Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to
malfunction.
（6） Thermal shutdown circuit
This product is provided with a built-in thermal shutdown circuit. When the thermal shoutdown circuit operates, the
output transistors are placed under open status. The thermal shutdown circuit is primarily intended to shut down the
IC avoiding thermal runaway under abnormal conditions with a chip temperature exceeding Tjmax = 150℃, and is not
intended to protect and secure an electrical appliance.
（7） Shorts between pins and misinstallation
When mounting the LSI on a board, pay adequate attention to orientation and placement discrepancies of the LSI. If
it is misinstalled and the power is turned on, the LSI may be damaged. It also may be damaged if it is shorted by a
foreign substance coming between pins of the LSI or between a pin and a power supply or a pin and a GND.
（8） Power supply on/off
In case power supply is started up, MUTEX（Pin20）always should be set LOW, And in case power supply is shut down,
it should be set LOW likewise. Then it is possible to eliminate pop noise when power supply is turned on/off. And
also, all power supply terminals should start up and shut down together.
（9） WARNING terminal(Pin18), ERROR terminal(Pin19)
A WARNING flag is outputted when Under Voltage Protection and High Temperature Protection are operated. A
Error flag is outputted when Output Short Protection and Output DC Voltage Protection are operated. These flags
are the function which the condition of this product is shown in. The use which aimed at the protection except for
this product is prohibition.
（10） N.C. terminal(Pin5, 21, 22, 44)
N.C. terminal(Non Connection Pin) does not connect to the inside circuit. Therefore, please open or connect to GND.
REV. B
Notice
N o t e s
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which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
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The technical information specified herein is intended only to show the typical functions of and
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The Products specified in this document are intended to be used with general-use electronic
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