BD5650AFVM [ROHM]

Power Management ICs for Battery Chargers; 电池充电器的电源管理IC


型号：	BD5650AFVM
厂家：	ROHM
描述：	Power Management ICs for Battery Chargers 电池充电器的电源管理IC 电池
文件：	总12页 (文件大小：349K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Power Management ICs for Mobile Phones

Power Management ICs

for Battery Chargers

BD5650AFVM

No.10032EBT02

●Description

BD5650AFVM is small controller built in high accuracy reference voltage, constant voltage controlled amplifier and over

current detection. BD5650AFVM functions as constant voltage control to realize stable power supply and abnormal

(open-collector ON) output in case a controller continues to detect over current overtime. A time until driving is flexible

depend on external capacitance.

●Features

1) Constant voltage control

2) Supply voltage range: 2.5V～18V

3) High accuracy reference voltage: 1.21V±1%

4) Current detected voltage: 73mV±5%(0～85℃)

5) Built-in over current detection with delay time

6) Small package: MSOP8

●Applications

It is suitable for secondary side controller in AC/DC adaptor to protect from over current.

●Absolute Maximum Ratings (Ta=25℃)

Parameter

Maximum supply Voltage

CP pin maximum voltage

Power Dissipation

Symbol

VMAX

VCPMAX

Ratings

-0.3 ～ 20

-0.3～7

Unit

587 *1

℃

Operating Temperature Range

Maximum Junction Temperature

Storage Temperature Range

Topr

-30 ～ +85

150

Tjmax

Tstg

℃

-55 ～ +150

℃

*1 Pd derate at 4.7mW/℃for temperature above Ta = 25℃(When mounted on a PCB 70.0mm×70.0mm×1.6mm)

●Operating condition (Ta=0～+85℃)

Parameter

Supply voltage

CP pin operating voltage

Symbol

VCC

Ratings

2.5～18

0～5.5

Unit

VCP

www.rohm.com

2011.11 - Rev.B

1/11

Technical Note

BD5650AFVM

●Electric Characteristics (Ta=25℃, Vcc=+5V)

Parameter

Limits

TYP.

Symbol

ICC

Unit

Conditions

MIN.

MAX.

1.2

【WHOLE DEVICE】

Total Supply Current - not taking the

output sinking current into account

0.6

【Voltage Control Loop】

Transconduction Gain(VCT).

Sink Current Only

GMV

1.0

4.5

mA/mV

1.198

1.186

1.21

1.222

1.234

Ta=25℃

Voltage Control Loop Reference

at 1.5mA sinking current

VREF

0 < Ta < 85℃

【Current Detection】

Current Detection Reference

VSE

Ibi

69.4

76.6

0 < Ta < 85℃

Current out of pin ICT

μA

ICT=-0.1V

【Output Stage】

Output Short Circuit Current,

Output to VCC, Sink Current Only

OUT=VCC, ICT=-0.2V

VSE=0V

IOS

Ichg

【Delay Time Setting】

Set 4 second,

when CP=2.2uF

CP Charge Current

612

665

718

This product is not designed to be radiation-resistant.

●Measurement circuit diagram

1uF

VCC

VREF

VOLTAGE

REFERENCE

Error amplifier

Ichg

73mV detection

Comparator

with latch

VREF

Fig.1

www.rohm.com

2011.11 - Rev.B

2/11

Technical Note

BD5650AFVM

●Reference data

1.2

1.24

1.23

1.22

1.21

1.2

0.8

2.5V

18V

5.0V

18V

0.6

0.4

2.5V

18V

0.2

1.19

1.18

Ambient Temperature: Ta[

]

℃

Ambient Temperature: Ta[

]

℃

]

Ambient Temperature: Ta[

Fig.2 Circuit current vs temp.

Fig.3 Voltage controlled

reference voltage vs temp.

Fig.4 Over-current detected

voltage vs temp.

CP=2.2uF

2.5V

18V

5.0V

2.5V

18V

5.0V

2.5V

18V

-20

-40

-60

Ambient Temperature: Ta[ ]

℃

Ambient Temperature: Ta[

]

℃

Ambient Temperature: Ta[

]

℃

Fig.5 Voltage controlled

amplifier:GM vs temp.

Fig.7 Delay time vs temp.

Fig.6 VCT pin input bias current

vs temp.

400

300

200

100

18V

2.5V

5.0V

18V

5.0V

18V

2.5V

Ambient Temperature: Ta[

]

Ambient Temperature: Ta[

]

Ambient Temperature: Ta[

]

℃

Fig.8 ICT pin output current

vs temp.

Fig.9 10mA sinking output voltage

vs temp.

Fig.10 Output short-circuit current

vs temp.

Ta=25℃

1.2

1.0

0.8

0.6

0.4

0.2

0.0

1.6

2.5

2.0

1.5

1.0

0.5

0.0

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

Power Supply : VCC[V]

IOUT [mA]

Fig.12 Voltage controlled

reference voltage vs VCC

Fig.11 Circuit current vs VCC

www.rohm.com

Fig.13 Sinking output voltage

vs IOUT

2011.11 - Rev.B

3/11

Technical Note

BD5650AFVM

●Block Diagram

VREF

VOLTAGE

REFERENCE

73mV detection

Comparator

Ichg

Comparator

with latch

VREF

Fig.14

●Pin Description

PIN No.

PIN NAME

VCT

FUNCTION

Input Pin of the Voltage Control Loop

Ground Line. 0V Reference For All Voltages

Output Pin. Sinking Current Only

GND

OUT

OCP

VCC

VSE

Output Pin for Over Current Detection. After delay time, sinking current.

Positive Power Supply Line

Input Pin of the Current Detection(+). Normally short to GND.

Input Pin of the Current Detection(-). Detected at -73mV.

Set delay time by capacitor.

ICT

●Package Dimensions

2.9±0.1

バリ含むMAX寸法ꢀꢀ3.25

+6°

-4°

4°

MAX 3.25 Incle BURR

Lot No.

0.475

1PIN MARK

+0.05

-0.03

0.145

+0.05

-0.04

0.22

0.65

0.08

MSOP8 (UNIT:mm)

Fig.15

4/11

www.rohm.com

2011.11 - Rev.B

Technical Note

BD5650AFVM

●Typical application

1000pF

Vout

Set divided resistance

at output voltage your

request.

Recommended use

grade.

P.6

C21

VREF

VOLTAGE

0.1uF

REFERENCE

R21

Error amplifier

73mV detection

Comparator

Ichg

470uF

/10V

Comparator

with latch

VREF

R22

ΔVS

Phase compensation parts

for voltage controlled

Set at limit current

Set delay time from

over-current detection to

amplifier.

P.6

your request.

P.7

protection latch.

P.7

Fig.16

VOUT = VREF × (R1+R2) / R2 [V]

CURRENT LIMIT : IL = VSE / RS [A]

Recommended part list

Symbol

Products

Recommended value

UD Series (Nichikon)

MCH182CN104 (Rohm)

220 ～ 1000μF

100 ～ 680μF

C21

0.1μF

(Tolerence B)

MCR03 (Rohm)

MCR25 (Rohm)

SB240

160k (Tolerence F)

51k (Tolerence F)

470

R21

R22

470

0.3 (Tolerence F)

PC17K1DD (KODENSHI)

Caution in use

We are convinced that an example above application circuit is no problem, but you should sufficiently evaluate the

characteristics for your application. You need to decide external values sufficiently considering static characteristics,

transient characteristics and IC’s unevenness to keep working application margin when you use in change external circuit

value. You need to evaluate when you decide external value, since the frequency response in overall system is affected in

particular from not IC only but characteristics of optocoupler and primary side control IC.

www.rohm.com

2011.11 - Rev.B

5/11

Technical Note

BD5650AFVM

●Explanation for circuit working

1. Constant voltage control

(1-1) Output voltage

Voltage feedback system is composited from error amplifier, resistance R1 / R2 and optocoupler connected to OUT

terminal.

Output voltage “VOUT” is defined by expression (1).

VOUT = VREF × (R1+R2)/R2

(1)

VOUT is free setting from R1 / R2, but a potential of OUT terminal is not over VCC.

In addition, it is recommended that resistance R1 / R2 has high impedance not to have heavy load at output. But an input

bias current is 50nA(typ.) in VCT terminal, you need to select a resistance value that flow over 10uA not to influence the

ratio of resistance in (1).

We show a reference value below.

When R1=160kΩ, R2=51kΩ, Vout=5.00V

(1-2) Frequency response of error amplifier

In BD5650AFVM, shunt regulation executes constant voltage control. Monitoring an alteration of output voltage in VCT

terminal, through error amplifier, finally respond as sink current in OUT terminal. A frequency response of

transconductance, a change at output current against an change at input voltage, is shown in Fig.17. In case that frequency

is higher over 200kHz, a response of GAIN is lower, error amplifier is losing its function little by little.

Fig.17

VCC

BD5650FVM

CH1

160ｋ

51ｋ

OSC

Error Amplifier

～

OUT

VCT

1.21V

GND

CH1[A]

OSC[V]

Fig.18

It is needed that your application circuit connects external capacitance and resistance between OUT terminal and VCT

terminal for phase compensation regarding constant voltage control. But you need to decide external values sufficiently

considering static characteristics, transient characteristics and IC’s unevenness to keep working application margin.

www.rohm.com

2011.11 - Rev.B

6/11

Technical Note

BD5650AFVM

2. Over current detection

BD5650AFVM has a function regarding over current detection. When over current your set limit freely flow during a

continuous time you also set capacitance in CP terminal, open collector in OCP terminal is driving (ON). Once turned to ON,

its state keep(latch) in internal. When you want to release latch state, you need that CP terminal fall to GND, or, VCC

voltage apply lower under about 1V.

An application circuit in Fig.16 has a function that adaptor output stop due to stop feedback to primary side.

(2-1) Limit current

Overcurrent detection is composited from detection comparator, sensing resistance RS.

Limit current “IL” is defined by expression (2).

IL = VSE / RS

(2)

IL means Limit current, VSE means current detected voltage(73mV: a potential difference from ICT toVSE).

We show a reference value below.

When IL=1A, RS=73mΩ

You need to decide RS value sufficiently considering maximum load current IL,max in application.

Pl=VSE×IL,max

(3)

For example, when IL,max set to 2A, the maximum power loss “Pl.max” is 200mW in RS resistance. Since BD5650AFVM

itself can’t limit IL,max, considering a characteristics on module, you need to select resistance includes enough margin for

power loss. But for mostly small power adaptor, selecting 1/4 watt or 1/2 watt resistance is sufficiently suitable.

(2-2) CP charge

A delay time from a occur of over current to turn ON in OCP terminal is below expression (4).

Toth=CP×VREF/Ichg

(4)

Timing chart when over current detection is shown in Fig.19.

IOUT

IL,max

(73mV/RS)

ΔVS

73ｍV

Toth

VREF

Iocp

Fig.19

www.rohm.com

2011.11 - Rev.B

7/11

Technical Note

BD5650AFVM

In case that over current reduces and ΔVS become under 73mV during CP charging, an electric charge in CP capacitance

discharge and CP voltage returns to 0V. When over current detect for the second time, start to charge.

Its discharging velocity is shown in expression (8).

Vcp(t)  Vcp0・exp（-

）

(8)

CP･Rdis

Vcp0 means CP terminal voltage at discharge start, and Rdis is internal discharge resistance:900Ω(typ.).

If you don’t set up a delay time, you need that CP terminal is open or connects 10pF order of magnitude. In this case, when

IC detects surge current in an instant, normal working stops by protection. Consequently, you need to use this mode

considering a characteristics of module.

In addition, when you don’t use a function that IC detects over current, you need to short ICT terminal to VSE terminal and

pull down to GND by about 10kΩ in CP terminal.

Regarding board layout around CP capacitance, you pay attention that CP capacitance will not be in parallel with noisy

parts and lines wherever possible, and place to short pattern line as possible.

●Internal equivalent circuit diagram

VCT(1PIN)

OCP(4PIN)

VSE(6PIN)

OCP

VSE

Pow

ICT(7PIN)

CP(8PIN)

OUT(3PIN)

Vref

OUT

ICT

Pow

www.rohm.com

2011.11 - Rev.B

8/11

Technical Note

BD5650AFVM

●Operation Notes

1) Absolute maximum ratings

Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may

result in IC deterioration or damage. Assumptions should not be made regarding the state of the IC (short mode or

open mode) when such damage is suffered. A physical safety measure such as a fuse should be implemented when

use of the IC in a special mode w here the absolute maximum ratings may be exceeded is anticipated.

2) GND potential

Ensure a minimum GND pin potential in all operating conditions. In addition, ensure that no pins other than the GND

pin carry a voltage lower than or equal to the GND pin, including during actual transient phenomena. As an exception,

the circuit design allows voltages up to -0.3 V to be applied to the ICT pin.

3) Setting of heat

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating

conditions.

4) Pin short and mistake fitting

Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result

in damage to the IC. Shorts between output pins or between output pins and the power supply and GND pin caused by

the presence of a foreign object may result in damage to the IC.

5) Actions in strong magnetic field

Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to

malfunction.

6) Mutual impedance

Power supply and ground wiring should reflect consideration of the need to lower mutual impedance and minimize

ripple as much as possible (by making wiring as short and thick as possible or rejecting ripple by incorporating

inductance and capacitance).

7) Regarding input pin of the IC

This IC is a monolithic IC which (as shown is Fig-1)has P⁺substrate and between the various pins. A P-N junction is

formed from this P layer of each pin. For example, the relation between each potential is as follows,

○ (When GND > PinB and GND > PinA, the P-N junction operates as a parasitic diode.)

○ (When PinB > GND > PinA, the P-N junction operates as a parasitic transistor.)

Parasitic diodes can occur inevitably in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits as well as operation faults and physical damage. Accordingly you must not use methods by

which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input

pin.

Although the circuit design allows voltages up to -0.3 V to be applied to the ICT pin, voltages lower than this may cause

the behavior described above. Use caution when designing the circuit.

Transistor (NPN)

Resistance

(PinA)

(PinB)

GND

P^＋

Ｎ

P substrate

GND

Parasitic diode

P substrate

GND

Parasitic diode

(PinB)

(PinA)

Parasitic diode

GND

Other adjacent components

Parasitic diode

Fig.20 Simplified structure of a Bipolar IC

www.rohm.com

2011.11 - Rev.B

9/11

Technical Note

BD5650AFVM

●Power Dissipation Reduction

MSOP8

When mounted on a PCB

0.6

(70 mm  70 mm  1.6 mm, glass epoxy)

587mW

0.4

0.2

100

125 150

Ta[℃]

www.rohm.com

2011.11 - Rev.B

10/11

Technical Note

BD5650AFVM

●Ordering Part Number

B D

V M - T R

Part No.

Package

FVM: MSOP8

Packaging and forming specification

TR: Embossed tape and reel

MSOP8

2.9 0.1

(MAX 3.25 include BURR)

Tape

Embossed carrier tape

3000pcs

6°

4°

Quantity

−4°

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1PIN MARK

+0.05

1pin

+0.05

−0.03

0.145

0.475

0.22

−0.04

0.08

Direction of feed

Order quantity needs to be multiple of the minimum quantity.

0.65

Reel

(Unit : mm)

∗

www.rohm.com

2011.11 - Rev.B

11/11

Notice

N o t e s

No copying or reproduction of this document, in part or in whole, is permitted without the

consent of ROHM Co.,Ltd.

The content speciﬁed herein is subject to change for improvement without notice.

The content speciﬁed herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the speciﬁcations,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information speciﬁed in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information speciﬁed herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

use of such technical information.

The Products speciﬁed in this document are intended to be used with general-use electronic

equipment or devices (such as audio visual equipment, ofﬁce-automation equipment, commu-

nication devices, electronic appliances and amusement devices).

The Products speciﬁed in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

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The Products are not designed or manufactured to be used with any equipment, device or

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R1120

BD5650AFVM [ROHM]

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