BD6044GUL [ROHM]

Silicon Monolithic Integrated Circuit; 硅单片集成电路


型号：	BD6044GUL
厂家：	ROHM
描述：	Silicon Monolithic Integrated Circuit 硅单片集成电路外围驱动器驱动程序和接口接口集成电路
文件：	总5页 (文件大小：158K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

1/4

STRUCTURE

Silicon Monolithic Integrated Circuit

PRODUCT NAME

Over Voltage Protection Controller with Internal FET

MODEL NAME

BD6044GUL

BLOCK DIAGRAM

See Figure 1

PACKAGE DIMENSIONS See Figure 2

FEATURES ●Overvoltage Protection up to 36V

●Internal Low Ron (125m) FET

●Over voltage Lockout (OVLO)

●Under voltage Lockout(UVLO)

●Internal 2msec Startup Delay

●Over Current Protect

●Thermal Shut Down

●Small package: VCSP50L1(1.6mm x 1.6mm, height=0.55mm)

※This product is not especially designed to be protected from radioactivity.

●Absolute maximum ratings (Ta=25℃)

Contents

Input supply voltage 1

Input supply voltage 2

Power dissipation

Operating temperature range

Storage temperature range

Symbol

Rating

-0.3～36

-0.3～7

725

-35～+85

-55～+150

Unit

Conditions

IN1, IN2, IN3, IN4

other

Vmax1

Vmax2

Topr

Tstr

℃

※1 When using more than at Ta=25℃, it is reduced 5.8 mW per 1℃.

ROHM specification board 50mm× 58mm mounting.

●Recommended operating range (Ta=-35～+85℃)

Parameter

Input voltage range

Symbol

V_in

Range

Unit

Usage

2.2～34

※ This product is not especially designed to be protected from radioactivity.

REV. A

2/4

●

Electrical Characteristics

(Unless otherwise noted, Ta = 25C, IN=5V)

Rating

Typ.

Parameter

Symbol

Unit

Conditions

Min.

Max.

● ELECTRICAL

Input Voltage Range

VIN

ICC1

ICC2

UVLO

UVLOh

OVLO

OVLOh

ILM

2.65

100

6.4

100

125

A

m

A

Supply Quiescent Current 1

Supply Quiescent Current 2

Under Voltage Lockout

Under Voltage Lockout Hysteresis

Over Voltage Lockout

Over Voltage Lockout Hysteresis

Current limit

IN=5V, EN=L

120

2.77

150

6.6

150

400

IN=5V, EN=H

IN=decreasing

IN=increasing

IN=decreasing

2.53

6.2

1.2

Vin vs. Vout Res.

RON

FLGB Output Low Voltage

FLGB Leakage Current

EN input voltage (H)

EN input voltage (L)

EN input current

FLGBVO

FLGBleak

ENH

ENL

ENC

SINK=1mA

EN=1.5V

1.45

0.5

A

● TIMINGS (FLGB pull up resistance 100kΩ)

Start Up Delay

Output Turn Off Time

Alert Delay

Ton

Toff

Tovp

1.5

msec

sec

* This product is not especially designed to be protected from radioactivity.

REV. A

3/4

● Block Diagram

● PIN number/PIN name

Pin name

number

IN1

IN2

IN3

IN4

OUT1

OUT2

GND

FLGB

Figure1. Block Diagram

●

PIN DESCRIPTIONS

A2, A3

B2, B3

A1, B1

NAME

IN1, 2,

3, 4

OUT1, 2

FLGB

GND

FUNCTION

Input voltage Pin. A 1F low ESR capacitor,

or larger must be connected between this pin and GND

Output Voltage Pin

Active-low open drain output to signal if the adapter voltage is correct

Ground Pin

Enable input Drive EN high to turn off OUT (Hi-z output)

● Package Dimensions (VCSP50L1)

6044

LOT No.

Figure2. Package

●Use-related Cautions

REV. A

4/4

(1) Absolute maximum ratings

If applied voltage (VDD, VIN), operating temperature range (Topr), or other absolute maximum ratings are exceeded, there is a risk of damage.

Since it is not possible to identify short, open, or other damage modes, if special modes in which absolute maximum ratings are exceeded are

assumed, consider applying fuses or other physical safety measures.

(2) Recommended operating range

This is the range within which it is possible to obtain roughly the expected characteristics. For electrical characteristics, it is those that are

guaranteed under the conditions for each parameter. Even when these are within the recommended operating range, voltage and temperature

characteristics are indicated.

(3) Reverse connection of power supply connector

There is a risk of damaging the LSI by reverse connection of the power supply connector. For protection from reverse connection, take measures

such as externally placing a diode between the power supply and the power supply pin of the LSI.

(4) Power supply lines

In the design of the board pattern, make power supply and GND line wiring low impedance.

When doing so, although the digital power supply and analog power supply are the same potential, separate the digital power supply pattern and

analog power supply pattern to deter digital noise from entering the analog power supply due to the common impedance of the wiring patterns.

Similarly take pattern design into account for GND lines as well.

Furthermore, for all power supply pins of the LSI, in conjunction with inserting capacitors between power supply and GND pins, when using

electrolytic capacitors, determine constants upon adequately confirming that capacitance loss occurring at low temperatures is not a problem for various

characteristics of the capacitors used.

(5) GND voltage

Make the potential of a GND pin such that it will be the lowest potential even if operating below that. In addition, confirm that there are no pins for

which the potential becomes less than a GND by actually including transition phenomena.

(6) Shorts between pins and misinstallation

When installing in the set board, pay adequate attention to orientation and placement discrepancies of the LSI. If it is installed erroneously, there is a

risk of LSI damage. There also is a risk of damage if it is shorted by a foreign substance getting between pins or between a pin and a power supply or

GND.

(7) Operation in strong magnetic fields

Be careful when using the LSI in a strong magnetic field, since it may malfunction.

(8) Inspection in set board

When inspecting the LSI in the set board, since there is a risk of stress to the LSI when capacitors are connected to low impedance LSI pins, be sure to

discharge for each process. Moreover, when getting it on and off of a jig in the inspection process, always connect it after turning off the power supply,

perform the inspection, and remove it after turning off the power supply. Furthermore, as countermeasures against static electricity, use grounding in the

assembly process and take appropriate care in transport and storage.

(9) Input pins

Parasitic elements inevitably are formed on an LSI structure due to potential relationships. Because parasitic elements operate, they give rise to

interference with circuit operation and may be the cause of malfunctions as well as damage. Accordingly, take care not to apply a lower voltage than

GND to an input pin or use the LSI in other ways such that parasitic elements operate. Moreover, do not apply a voltage to an input pin when the power

supply voltage is not being applied to the LSI. Furthermore, when the power supply voltage is being applied, make each input pin a voltage less than the

power supply voltage as well as within the guaranteed values of electrical characteristics.

(10) Ground wiring pattern

When there is a small signal GND and a large current GND, it is recommended that you separate the large current GND pattern and small signal GND

pattern and provide single point grounding at the reference point of the set so that voltage variation due to resistance components of the pattern wiring and

large currents do not cause the small signal GND voltage to change. Take care that the GND wiring pattern of externally attached components also does

not change.

(11) Externally attached capacitors

When using ceramic capacitors for externally attached capacitors, determine constants upon taking into account a lowering of the rated capacitance

due to DC bias and capacitance change due to factors such as temperature.

(12) Thermal shutdown circuit (TSD)

When the junction temperature reaches the defined value, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown

circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore,

do not continuously use the LSI with this circuit operating or use the LSI assuming its operation.

(13) Thermal design

Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use.

REV. A

Notice

N o t e s

No copying or reproduction of this document, in part or in whole, is permitted without the

consent of ROHM Co.,Ltd.

The content speciﬁed herein is subject to change for improvement without notice.

The content speciﬁed herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the speciﬁcations,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information speciﬁed in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information speciﬁed herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

use of such technical information.

The Products speciﬁed in this document are intended to be used with general-use electronic

equipment or devices (such as audio visual equipment, ofﬁce-automation equipment, commu-

nication devices, electronic appliances and amusement devices).

The Products speciﬁed in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

against the possibility of physical injury, ﬁre or any other damage caused in the event of the

failure of any Product, such as derating, redundancy, ﬁre control and fail-safe designs. ROHM

shall bear no responsibility whatsoever for your use of any Product outside of the prescribed

scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or

system which requires an extremely high level of reliability the failure or malfunction of which

may result in a direct threat to human life or create a risk of human injury (such as a medical

instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,

fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of

any of the Products for the above special purposes. If a Product is intended to be used for any

such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology speciﬁed herein that may

be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to

obtain a license or permit under the Law.

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

http://www.rohm.com/contact/

www.rohm.com

R0039

BD6044GUL [ROHM]

相关型号：

BD6044GUL-E2

BD6046GUL

BD6046GUL-E2

BD6047AGUL

BD6061GUT

BD6062GU

BD6062GU_11

BD6063HFN

BD6066EKN

BD6066EKN-E2

BD6066GU

BD6066GU-E2