BD61247NUX [ROHM]
BD61247NUX是通过功率DMOSFET构成H桥的单芯片驱动器。通过PWM软开关实现了电机静音。;
| 型号： | BD61247NUX |
| 厂家： | 
ROHM |
| 描述： | BD61247NUX是通过功率DMOSFET构成H桥的单芯片驱动器。通过PWM软开关实现了电机静音。 开关 电机 驱动 驱动器 |
| 文件： | 总23页 (文件大小：1608K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
DC Brushless Fan Motor Drivers
Multifunction Single-phase Full-wave
Fan Motor Driver
BD61247NUX
General Description
Key Specifications
BD61247NUX is a 1chip driver that is composed of
H-bridge power DMOS FET.
It realizes the quietness of the motor by PWM soft
switching.
Supply Voltage Range:
4.5 V to 16 V
Operating Temperature Range: -40 °C to +105 °C
Output Voltage
(High Side and Low Side Voltage Total):
0.2 V(Typ) at ±0.2 A
Features
Package
VSON010X3030
W(Typ) x D(Typ) x H(Max)
3.00 mm x 3.00 mm x 0.60 mm
Driver Including Power DMOS FET
Speed Controllable by PWM Input
PWM Soft Switching
Quick Start
Start Assist
Lock Protection and Automatic Restart
High Speed Detection Protection
Rotation Speed Pulse Signal Output (1/2FG)
Applications
Fan Motors for General Consumer Equipment of
Refrigerator etc.
VSON010X3030
Typical Application Circuit
HM
PWM
1
2
3
4
5
10
PWM
SIG
REF
HP
SSW
FG
9
8
7
6
H
VCC
OUT2
OUT1
GND
＋
M
―
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
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BD61247NUX
Pin Configuration
Block Diagram
(TOP VIEW)
5.0 V
200 kΩ
HM
REF
HP
1
2
3
4
5
10
PWM
PWM
1
2
TSD
OSC
10
FILTER
SSW
FG
9
8
7
6
3.3 V
200 kΩ
REFE-
RENCE
SSW
SSW
SELECT
9
CONTROL
LOGIC
VCC
OUT2
OUT1
GND
SIGNAL
OUTPUT
FG
3
4
8
7
PRE-
DRIVER
VCC
OUT1
GND
5
6
Pin Description
Pin No. Pin Name
Function
1
2
HM
REF
HP
Hall input - pin
Reference voltage output pin
Hall input + pin
3
4
VCC
Power supply pin
5
OUT2 Motor output 2 pin
GND Ground pin
OUT1 Motor output 1 pin
6
7
8
FG
Rotation speed pulse signal output pin
Soft switching setting select pin
9
SSW
10
PWM PWM duty input pin
Exposed pad
Reverse EXP-PAD
(Only GND can be connected.)
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BD61247NUX
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Supply Voltage
VCC
Tstg
VO
18
V
°C
V
Storage Temperature Range
Output Voltage
-55 to +150
18
1.2
18
Output Current
IO
A
Rotation Speed Pulse Signal (FG) Output Voltage
Rotation Speed Pulse Signal (FG) Output Current
Reference Voltage (REF) Output Current
Input Voltage1 (PWM)
VFG
IFG
V
10
mA
mA
V
IREF
VIN1
VIN2
Tj
10
6.5
3.6
150
Input Voltage2 (HP, HM, SSW)
V
Junction Temperature
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 1)
Thermal Resistance (Typ)
Symbol
Unit
Parameter
1s(Note 3)
2s2p(Note 4)
VSON010X3030
Junction to Ambient
Junction to Top Characterization Parameter(Note 2)
θJA
245.7
10
41.6
5
°C/W
°C/W
ΨJT
(Note 1) Based on JESD51-2A(Still-Air).
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70μm
Footprints and Traces
Thermal Via(Note 5)
Layer Number of
Measurement Board
Material
Board Size
Pitch
1.20 mm
Diameter
4 Layers
Top
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
Φ0.30 mm
Bottom
Copper Pattern
Thickness
70 μm
Copper Pattern
Thickness
35 μm
Copper Pattern
Thickness
70 μm
Footprints and Traces
74.2 mm x 74.2 mm
74.2 mm x 74.2 mm
(Note 5) This thermal via connects with the copper pattern of all layers.
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BD61247NUX
Recommended Operating Conditions
Parameter
Supply Voltage
Symbol
Min
Typ
Max
Unit
VCC
VH
fIN
4.5
0
12
16
2
V
V
Hall Input Voltage
-
-
15
PWM Input Frequency
Operating Temperature
50
kHz
°C
Topr
-40
+25
+105
Electrical Characteristics (Unless otherwise specified Ta=25 °C, VCC=12 V)
Limit
Typical
Performance
Curves
Unit
mA
Conditions
Parameter
Circuit Current
Symbol
ICC
Min
0.8
Typ
1.6
Max
3.0
Figure 1
IO=±0.2 A,
Figure 2 to
Figure 5
Output Voltage
VO
-
0.2
0.35
V
High side and Low side
voltage total
Hall Input Hysteresis Voltage
PWM Input High Level
PWM Input Low Level
VHYS
VPWMH
VPWML
IPWMH
IPWML
fPWM
±7
2.5
-0.3
-10
-50
30
±12
-
±17
5.3
mV
V
Figure 6
-
-
+1.0
+10
-12
70
V
-
0
µA
µA
kHz
VPWM=5 V
VPWM=0 V
Figure 7 to
Figure 8
-
PWM Input Current
PWM Drive Frequency
Reference Voltage
-25
50
Figure 9 to
Figure 10
Figure 11 to
Figure 12
Figure 13
VREF
VFGL
3.0
3.3
3.6
0.3
V
V
IREF=-1 mA
FG Output Low Voltage
-
-
IFG=5 mA
VFG=18 V
FG Output Leak Current
Lock Protection ON Time
Lock Protection OFF Time
SSW Input High Level
SSW Input Low Level
IFGL
tON
-
-
0.5
5.0
-
10
0.7
7.0
3.6
+0.8
+10
-8
µA
s
0.3
3.0
2.0
-0.3
-10
-34
Figure 14
Figure 15
-
tOFF
s
VSSWH
VSSWL
ISSWH
ISSWL
V
-
V
-
0
µA
µA
VSSW=3.3 V
VSSW=0 V
Figure 16 to
Figure 17
SSW Input Current
-17
For parameters involving current, positive notation means inflow of current to the IC while negative notation means outflow of current from the IC.
I/O Truth Table
Hall Input
Driver Output
OUT1 OUT2
HP
HM
L
H
L
H
L
H
H
L
H; High, L; Low
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Typical Performance Curves
(Reference Data)
0.0
-0.3
-0.6
-0.9
-1.2
2.5
2.0
1.5
1.0
Ta=-40 °C
Ta=+25 °C
Ta=+105 °C
Ta=+25 °C
Ta=-40 °C
Ta=+105 °C
Operating Voltage Range
0.5
0
5
10
15
20
0.0
0.4
0.8
1.2
SupplyVoltage: VCC[V]
Output Source Current: IO[A]
Figure 1. Circuit Current vs Supply Voltage
Figure 2. Output High Voltage vs Output Source
Current(VCC=12 V)
0.0
-0.3
-0.6
-0.9
-1.2
1.2
0.9
0.6
0.3
0.0
Ta=+105 °C
VCC=16 V
VCC=12 V
VCC=4.5 V
Ta=+25 °C
Ta=-40 °C
0.0
0.4
0.8
1.2
0.0
0.4
0.8
1.2
Output Sink Current: IO[A]
Output Source Current: IO[A]
Figure 3. Output High Voltage vs Output Source Current
Figure 4. Output Low Voltage vs Output Sink Current
(VCC=12 V)
(Ta=25 °C)
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Typical Performance Curves – continued
(Reference Data)
40
20
0
1.2
0.9
Ta=+105 °C
Ta=+25 °C
Ta=-40 °C
VCC=4.5 V
Ta=-40 °C
Ta=+25 °C
Ta=+105 °C
0.6
0.3
0.0
VCC=16 V
VCC=12 V
-20
-40
Operating Voltage Range
0
5
10
15
20
0.0
0.4
0.8
1.2
SupplyVoltage: VCC[V]
Output Sink Current: IO[A]
Figure 5. Output Low Voltage vs Output Sink Current
Figure 6. Hall Input Hysteresis Voltage vs Supply Voltage
(Ta=25 °C)
12
0
Operating Voltage Range
Ta=+105 °C
Ta=+25 °C
Ta=-40 °C
-10
Ta=-40 °C
Ta=+25 °C
Ta=+105 °C
9
-20
-30
-40
-50
6
3
0
Operating Voltage Range
0
5
10
15
20
0
5
10
15
20
SupplyVoltage: VCC[V]
SupplyVoltage: VCC[V]
Figure 7. PWM Input High Current vs Supply Voltage
(VPWM=5 V)
Figure 8. PWM Input Low Current vs Supply Voltage
(VPWM=0 V)
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BD61247NUX
Typical Performance Curves – continued
(Reference Data)
4.0
4.0
3.5
3.0
2.5
2.0
Ta=+25 °C
Ta=-40 °C
Ta=+105 °C
VCC=16 V
VCC=12 V
3.5
3.0
VCC=4.5 V
2.5
Operating Voltage Range
2.0
0.0
2.5
5.0
7.5
10.0
0
5
10
15
20
SupplyVoltage: VCC[V]
REF Source Current: IREF[mA]
Figure 9. Reference Voltage vs Supply Voltage
(VCC=12 V)
Figure 10. Reference Voltage vs REF Source Current
(Ta=25 °C)
0.4
0.3
0.2
0.1
0.0
0.4
0.3
0.2
0.1
0.0
Ta=+105 °C
Ta=+25 °C
Ta=-40 °C
VCC=4.5 V
VCC=12 V
VCC=16 V
0
2
4
6
8
10
0
2
4
6
8
10
FG Sink Current: IFG[mA]
FG Sink Current: IFG[mA]
Figure 11. FG Output Low Voltage vs FG Sink Current
(VCC=12 V)
Figure 12. FG Output Low Voltage vs FG Sink Current
(Ta=25 °C)
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Typical Performance Curves – continued
(Reference Data)
0.7
0.6
0.5
0.4
0.3
8
6
4
Ta=-40 °C
Ta=+25 °C
Ta=+105 °C
2
Ta=+105 °C
Ta=+25 °C
Ta=-40 °C
0
Operating Voltage Range
-2
0
5
10
15
20
0
5
10
15
20
SupplyVoltage: VCC[V]
FG Voltage: VFG[V]
Figure 13. FG Output Leak Current vs FG Voltage
(VCC=12 V)
Figure 14. Lock Protection ON Time vs Supply Voltage
8
6
7.0
Operating Voltage Range
6.0
5.0
4.0
3.0
Ta=-40 °C
Ta=+25 °C
Ta=+105 °C
4
2
Ta=+105 °C
Ta=+25 °C
Ta=-40 °C
0
Operating Voltage Range
-2
0
5
10
15
20
0
5
10
15
20
SupplyVoltage: VCC[V]
SupplyVoltage: VCC[V]
Figure 15. Lock Protection OFF Time vs Supply Voltage
Figure 16. SSW Input High Current vs Supply Voltage
(VSSW=3.3 V)
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Typical Performance Curves – continued
(Reference Data)
0
Ta=-40 °C
Ta=+25 °C
Ta=+105 °C
-10
-20
-30
-40
Operating Voltage Range
-50
0
5
10
15
20
SupplyVoltage: VCC[V]
Figure 17. SSW Input Low Current vs Supply Voltage
(VSSW=0 V)
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Application Circuit Example (Constant Values are for Reference)
PWM Duty Input Application
This is the application example to control rotation speed by inputting a direct pulse into the PWM pin.
Noise measures of substrate
Protection of PWM pin
5.0 V
200 kΩ
HM
PWM
1
2
TSD
OSC
10
FILTER
PWM
The Hall bias resistance
sets depending on Hall
amplitude and a Hall input
voltage range.
PWM Soft switching setting
select
3.3 V
200 kΩ
500 Ω
to 2 kΩ
REFE-
RENCE
SSW
SSW
SELECT
9
H
CONTROL
LOGIC
Reverse connection
measures of the fan
connector.
SIGNAL
OUTPUT
HP
FG
3
4
8
7
SIG
PRE-
DRIVER
Protection of FG open-drain
VCC
OUT1
＋
Rise in VCC voltage measures
by the back electromotive force.
1 μF to
10 μF
GND
5
6
Connect bypass capacitor near the
VCC pin as much as possible.
M
―
Figure 18. Application Example
The SSW pin is pulled up by resistance in the IC. This pin opening sets the High logic.
A resistance pull-down or the GND pin short sets the Low logic.
Please refer to “2. Soft Switching Period and Re-circulate Period“ (P.11) for this function.
Application Design Note
(1) Please connect the bypass capacitor with reference to the value mentioned above. Because there is a possibility of
the motor start-up failure etc. due to the IC malfunction.
Substrate Design Note
(1) The IC power(VCC), and motor outputs(OUT1, 2) lines are made as wide as possible.
(2) The IC ground (GND) line is common with the application ground (e.g. Hall element ground), and arranged near to
(-) land.
(3) The bypass capacitor and the Zener diode are placed near to the VCC pin.
(4) The HP and the HM lines are arranged side by side and made from the hall element to IC as short as possible,
because it is easy for the noise to influence the hall lines.
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Functional Descriptions
1. Speed Control
Output PWM duty is changed depending on input PWM duty from the PWM pin, and a motor rotational speed is also
controlled. Please refer to “Recommended Operating Conditions and Electrical Characteristics” (P.4) for the signal input
condition from the PWM pin. In the case of the PWM pin is open, internal supply voltage 5 V(Typ) is applied to the PWM
pin, and output duty is driven in 100 %.
The resolution of input and output duty is 7 bits (127 steps).
The PWM drive frequency of the motor output is 50 kHz(Typ). The PWM drive frequency does not synchronize with input
PWM frequency.
In case input PWM duty is less than 5 %, the motor output is turned OFF.
Insert the protective resistance if necessary.
HM
HP
High
Low
High
Motor Unit
IC
5 V(Typ)
PWM
OUT1
Low
High
Low
200 kΩ(Typ)
PWM
(
)
FILTER
Motor Output ON
: High Impedance
High
OUT2
Low
Full
Motor
Torque
Zero
The drive frequency of fixed value 50 kHz(Typ) does not synchronize
with input PWM frequency.
Figure 19. PWM Signal Input Application
Figure 20. PWM Input Operation Timing Chart
2. Soft Switching Period and Re-circulate Period
The soft switching period and the re-circulate period can be chosen with the SSW pin.
These are defined at an angle of one period of hall signal 360° and are selected like a table depending on the SSW
setting logic.
SSW pin
SSW Setting Logic
Soft Switching Angle
Re-Circulate Angle
OPEN
H
L
78.75°
67.50°
5.63°
8.44°
GND short
HP
HM
One Period of Hall Signal 360°
High
OUT1
OUT2
Low
High
Low
0 A
Motor
Current
Soft Switching Period
Re-Circulate Period
Figure 21. Setting of a Soft Switching Period and Re-Circulate Period
The soft switching period means the section where output PWM duty changes from 0% just after the phase change to
setting duty or a section changing from setting duty to 0%. To smooth off the current waveform, the coefficient table that
duty gradually changes with 16 steps is set the inside IC.
The re-circulate period means the section where the coil current re-circulate before the timing of output phase change. It
is effective to suppress leaping up of voltage by back electromotive force, and reduce invalid electricity consumption.
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Functional Descriptions – continued
3. Quick Start
After having stopped a motor in the PWM signal to input from the outside, a lock protection is turned off when input of the
PWM Low logic continues a given period of time or more. The motor can be restarted without being influenced at lock
protection time.
Motor Idling
HM
HP
High
Low
High
PWM
Low
Enable
Lock
Protection
Disable
100 %
(Internal Signal)
5 ms or less
Quick Start Standby Mode
Motor
Output
ON Duty
0 %
Torque OFF
Motor Stop
Torque ON
Figure 22. Quick Start Timing Chart
4. Start Assist Function
It is function that enables the motor to start even if input PWM duty is low. When input PWM duty is less than 50 % in a
condition at the time of the following motor starting, output PWM duty is set in 50 % till three times of hall signal change
are detected.
Motor starting condition
a) Power ON
b) Quick Start
c) Lock Protection Release
HP
High
Hall Signal
Low
HM
High
Input PWM Duty
10 % Input
Low
50 %
0 %
Output PWM Duty
50 % Output
10 % Output
Power ON
Start Detect
Figure 23. Start Assist Operation at Input Duty 10 %
5. Lock Protection and Automatic Restart
The motor rotation is detected by the hall signal period. The IC detects motor rotation is locked when the period becomes
longer than the time set up at the internal counter, and the IC turns off outputs. The lock protection ON time (tON) and the
lock protection OFF time (tOFF) are set by the digital counter based on internal oscillator. Therefore, the ratio of ON/OFF
time is always constant.
Motor Idling
: High
HM
: Low
: High
HP
tOFF (Typ 5.0 s)
(Typ 0.5 s)
tOFF
tOFF
tON
tON
tON
OUT1
OUT2
: Low
: High
: Low
Motor Lock
Lock Detect
Lock Release
Figure 24. Lock Protection Timing Chart
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Functional Descriptions – continued
6. Hall Input Setting
Please input the hall signal level within the recommended operating condition “Hall Input Voltage” (P.4) including
amplitude of the signal. The hall amplitude of the “Hall Input Hysteresis Voltage” or more is necessary to detect rotation of
a motor.
The amplitude of the hall signal recommends 100 mVpp or more, but please input 34 mVpp or more at least.
2 V
GND
Figure 25. Hall Input Voltage Range
○Reducing the Noise of Hall Signal
The hall element may be affected by VCC noise depending on the wiring pattern of board. In this case, place a capacitor
like C1 in Figure 26. In addition, when wiring from the hall element output to the IC hall input is long, noise may be loaded
on wiring. In this case, place a capacitor like C2 in Figure 26.
HM
HP
REF
C2
R1
C1
RH
Hall Element
Figure 26. Application Near of Hall Signal
7. High Speed Detection Protection
The high speed detection protection begins the lock protection action when it detects that the hall input signal is in an
abnormal state (2.5 kHz(Typ) or more).
8. Rotation Speed Pulse Signal Output (1/2FG)
A pulse signal depending on the rotation speed of the motor is output from the FG pin. Hall edge signal in the IC is
generated from changing hall signal. The FG signal changes with two pulses of the hall edge signal shown as Figure 27.
FG signal may shift for one hall edge depending on the initial hall signal input logic at the time of the motor start.
ON
VCC
OFF
HP
High
Hall Signal
Low
HM
Hall Edge Signal
（Internal Signal）
High
Low
High
FG
Low
Power ON
High Impedance
Figure 27. Rotation Speed Pulse Output Timing Chart of Power ON
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BD61247NUX
I/O Equivalence Circuit (Resistance Values are Typical)
1. Power supply pin
2. PWM duty input pin
3. Hall input pin
5 V(Typ)
200 kΩ
5 V(Typ)
VCC
HP
HM
PWM
GND
4. Soft switching setting
select pin
5. Reference voltage
output pin
6. Motor output pin
3.3 V(Typ) 3.3 V(Typ)
200 kΩ
OUT1
OUT2
REF
SSW
7. Rotation speed pulse signal
output pin
FG
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Safety Measures
1. Reverse Connection Protection Diode
The reverse connection of the power results in the IC destruction as shown in Figure 28. When the reverse connection is
possible, the reverse connection protection diode must be added between the power supply and the VCC pin.
After reverse connection
In normal energization
Reverse power connection
VCC
Destruction prevention
VCC
VCC
Circuit
Block
Circuit
Block
Circuit
Block
GND
GND
GND
Internal circuit impedance is high
Large current flows
No destruction
Amperage is small
Thermal destruction
Figure 28. Flow of Current When the Power is Connected Reversely
2. Protection against VCC Voltage Rise by Back Electromotive Force
The back electromotive force (Back EMF) generates
regenerative current to the power supply. However,
when the reverse connection protection diode is
connected to the power supply line as shown in
Figure 29, the VCC voltage rises because the diode
prevents current flow to the power supply.
ON
Phase
Switching
ON
When the absolute maximum rated voltage may be
exceeded due to the voltage rise by the back
electromotive force, place a (A) capacitor or (B) Zener
diode between the VCC pin and the GND pin for
regenerative current path as shown in Figure 30. If
further measures are necessary, use measures of (A)
and (B) together like as (C). The capacitor and the
resistor can be used to have better voltage surge
protection like as (D).
ON
ON
Figure 29. VCC Voltage Rise by Back Electromotive
(A) Capacitor
(B) Zener Diode
(C) Capacitor & Zener Diode
(D) Capacitor & Resistor
ON
ON
ON
ON
ON
ON
ON
ON
Figure 30. Measure Against VCC and Motor Driving Outputs Voltage
3. PWM Switching of GND Line
Do not perform the PWM switching of the GND line because the GND pin potential cannot be kept to a minimum.
4. Protection of Input Pin and Output Pin
Misconnecting of the external connector from the motor PCB or plugging and unplugging the hot connector may cause
damage to the IC by the rush current or the over voltage surge.
About the input pin and the output pin except the VCC pin and the GND pin, please take measures such as using the
protection resistor so that the IC is not affected by the over voltage or the over current as shown in Figure 32.
Motor PCB
＋
IC
Protection
Resistor
Protection
Resistor
PWM
FG
Motor
Driver
Controller
PWM
M
GND
PWM Input
Prohibition
－
FG
Figure 31. Prohibition of the GND Line PWM Switching
Figure 32. Protection of the PWM Pin and the FG Pin
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BD61247NUX
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground
due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below
ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions
such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
8. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
9. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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BD61247NUX
Operational Notes – continued
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 33. Example of Monolithic IC Structure
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within
the Area of Safe Operation (ASO).
14. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
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31.May.2018 Rev.001
BD61247NUX
Ordering Information
B D 6 1 2 4 7 N U X -
E 2
Part Number
Package
NUX: VSON010X3030
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
VSON010X3030 (TOP VIEW)
Part Number Marking
D 6 1
2 4 7
LOT Number
Pin 1 Mark
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TSZ22111 • 15 • 001
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31.May.2018 Rev.001
18/20
BD61247NUX
Physical Dimension and Packing Information
Package Name
VSON010X3030
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TSZ02201-0H1H0C102240-1-2
19/20
31.May.2018 Rev.001
BD61247NUX
Revision History
Date
Revision
001
Changes
31.May.2018
New Release
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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