BD6216FP_技术文档

For brush motors

H-bridge drivers

(7V max.)

BD6210, BD6211, BD6212, BD6215, BD6216, BD6217

No.09007ECT01

 Overview

These H-bridge drivers are full bridge drivers for brush motor applications. Each IC can operate at a wide range of power

supply voltages (from 3V to 36V), supporting output currents of up to 2A. MOS transistors in the output stage allow for

PWM signal control, while the integrated VREF voltage control function of previous models offers direct replacement of

deprecated motor driver ICs. These highly efficient H-bridge driver ICs facilitate low-power consumption design.

 Features

1) Built-in, selectable one channel or two channels configuration

2) Low standby current

3) Supports PWM control signal input (20kHz to 100kHz)

4) VREF voltage setting pin enables PWM duty control

5) Cross-conduction prevention circuit

6) Four protection circuits provided: OCP, OVP, TSD and UVLO

 Applications

VCR; CD/DVD players; audio-visual equipment; optical disc drives; PC peripherals;

car audios; car navigation systems; OA equipments

 Line up matrix

Maximum output current

1.0A

Rating voltage

Channels

0.5A

2.0A

BD6210

HFP / F

BD6211

HFP / F

BD6212

HFP / FP

1ch

2ch

7V

BD6215

FP

BD6216

FP / FM

BD6217

FM

BD6220

HFP / F

BD6221

HFP / F

BD6222

HFP / FP

1ch

2ch

1ch

2ch

18V

36V

BD6225

FP

BD6226

FP / FM

BD6227

FM

BD6230

HFP / F

BD6231

HFP / F

BD6232

HFP / FP

BD6235

FP

BD6236

FP / FM

BD6237

FM

*Packages; F:SOP8, HFP:HRP7, FP:HSOP25, FM:HSOP-M28

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2009.08 - Rev.C

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Technical Note

BD6210, BD6211, BD6212, BD6215, BD6216, BD6217

 Absolute maximum ratings (Ta=25°C, All voltages are with respect to ground)

Parameter

Supply voltage

Symbol

VCC

I_OMAX

V_IN

Ratings

Unit

V

7

0.5 *¹/ 1.0 *²/ 2.0 *³

-0.3 ~ VCC

Output current

A

All other input pins

Operating temperature

Storage temperature

Power dissipation

Junction temperature

V

T_OPR

T_STG

Pd

-40 ~ +85

°C

W

°C

-55 ~ +150

0.687 *⁴/ 1.4 *⁵/ 1.45 *⁶/ 2.2 *⁷

T_jmax

150

*1 BD6210 / BD6215. Do not, exceed Pd or ASO.

*2 BD6211 / BD6216. Do not, exceed Pd or ASO.

*3 BD6212 / BD6217. Do not, exceed Pd or ASO.

*4 SOP8 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 5.5mW/°C above 25°C.

*5 HRP7 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 11.2mW/°C above 25°C.

*6 HSOP25 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 11.6mW/°C above 25°C.

*7 HSOP-M28 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 17.6mW/°C above 25°C.

 Operating conditions (Ta=25°C)

Parameter

Supply voltage

VREF voltage

Symbol

VCC

Ratings

3.0 ~ 5.5

1.5 ~ 5.5

Unit

V

VREF

V

 Electrical characteristics (Unless otherwise specified, Ta=25°C and VCC=VREF=5V)

Limits

Parameter

Symbol

Limits

Conditions

Min.

0.4

0.6

-

Min.

0.7

0.9

0

Min.

1.5

1.7

10

Supply current (1ch)

Supply current (2ch)

Stand-by current

I_CC

I_STBY

V_IH

mA

µA

V

Forward / Reverse / Brake

Stand-by

Input high voltage

2.0

-

Input low voltage

V_IL

-

0.8

100

1.5

1.0

10

V

Input bias current

I_IH

30

0.5

0.2

-10

20

50

1.0

0.5

0

µA

Ω

VIN=5.0V

Output ON resistance *¹

Output ON resistance *²

Output ON resistance *³

VREF bias current

Carrier frequency

R_ON

I_VREF

F_PWM

F_MAX

IO=0.25A, vertically total

IO=0.5A, vertically total

IO=1.0A, vertically total

VREF=VCC

Ω

µA

kHz

25

-

35

VREF=3.75V

Input frequency range

100

FIN / RIN

*1 BD6210 / BD6215

*2 BD6211 / BD6216

*3 BD6212 / BD6217

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2009.08 - Rev.C

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Technical Note

BD6210, BD6211, BD6212, BD6215, BD6216, BD6217

 Electrical characteristic curves (Reference data)

1.0

0.8

0.6

0.4

0.2

0.0

1.0

0.8

0.6

0.4

0.2

0.0

1.5

1.0

85°C

25°C

-40°C

25°C

85°C

25°C

85°C

0.5

-40°C

25°C

85°C

0.0

-0.5

3

4

5

6

3

4

5

6

1

1.2

1.4

1.6

1.8

2

Supply Voltage: Vcc [V]

Input Voltage: VIN [V]

Fig.1 Supply current (1ch)

Fig.2 Supply current (2ch)

Fig.3 Input threshold voltage

100

80

60

40

20

0

10

5

1.0

0.8

0.6

0.4

0.2

0.0

-40°C

25°C

85°C

25°C

-40°C

0

-40°C

25°C

85°C

-5

-10

0

1

2

3

4

5

0

1

2

3

4

5

0

0.2

0.4

0.6

0.8

1

Input Voltage: VIN [V]

Input Voltage: VREF [V]

Input Voltage: VREF / VCC [V]

Fig.4 Input bias current

Fig.5 VREF input bias current

Fig.6 VREF - DUTY

(VCC=5V)

35

30

25

20

6.0

4.0

2.0

0.0

9.0

6.0

3.0

0.0

85°C

-40°C

25°C

85°C

25°C

-40°C

3

4

5

1.5

2

2.5

3

3.5

6

6.5

7

7.5

8

Supply Voltage: VCC [V]

Fig.7 VCC - Carrier frequency

Fig.8 Under voltage lock out

Fig.9 Over voltage protection

1.5

1.0

1.5

1.0

1.5

1.0

85°C

25°C

-40°C

85°C

25°C

-40°C

0.5

0.0

-0.5

125

150

175

200

1.5

2

2.5

3

1

1.5

2

2.5

Junction Temperature: Tj [°C]

Load Current / Iomax: Normalized

Fig.10 Thermal shutdown

Fig.11 Over current protection (H side) Fig.12 Over current protection (L side)

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2009.08 - Rev.C

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Technical Note

BD6210, BD6211, BD6212, BD6215, BD6216, BD6217

 Electrical characteristic curves (Reference data) - Continued

0.4

0.3

0.2

0.1

0

0.8

0.6

0.4

0.2

0

0.8

0.6

0.4

0.2

0

85°C

25°C

85°C

25°C

85°C

25°C

-40°C

0

0.1

0.2

0.3

0.4

0.5

0

0.2

0.4

0.6

0.8

1

0

0.4

0.8

1.2

1.6

2

Output Current: IOUT [A]

Fig.13 Output high voltage (0.5A class) Fig.14 Output high voltage (1A class)

Fig.15 Output high voltage (2A class)

2

1.5

1

2

1.5

1

2

-40°C

25°C

85°C

-40°C

25°C

85°C

-40°C

25°C

85°C

1.5

1

0.5

0

0.5

0

0.5

0

0.1

0.2

0.3

0.4

0.5

0

0.2

0.4

0.6

0.8

1

0

0.4

0.8

1.2

1.6

2

Output Current: IOUT [A]

Fig.16 High side body diode (0.5A class) Fig.17 High side body diode (1A class) Fig.18 High side body diode (2A class)

0.4

0.3

0.2

0.1

0

0.8

0.6

0.4

0.2

0

0.8

0.6

0.4

0.2

0

85°C

25°C

85°C

25°C

85°C

25°C

-40°C

0

0.1

0.2

0.3

0.4

0.5

0

0.2

0.4

0.6

0.8

1

0

0.4

0.8

1.2

1.6

2

Output Current: IOUT [A]

Fig.19 Output low voltage (0.5A class)

Fig.20 Output low voltage (1A class)

Fig.21 Output low voltage (2A class)

2

-40°C

25°C

85°C

1.5

1

0.5

0

1

0.5

0

1

0.5

0

0.1

0.2

0.3

0.4

0.5

0

0.2

0.4

0.6

0.8

1

0

0.4

0.8

1.2

1.6

2

Output Current: IOUT [A]

Fig.22 Low side body diode (0.5A class) Fig.23 Low side body diode (1A class) Fig.24 Low side body diode (2A class)

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2009.08 - Rev.C

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Technical Note

BD6210, BD6211, BD6212, BD6215, BD6216, BD6217

 Block diagram and pin configuration

BD6210F / BD6211F

Table 1 BD6210F/BD6211F

VREF

6

DUTY

PROTECT

1

Name

OUT1

VCC

FIN

Function

3

2

VCC

Driver output

Power supply

FIN

RIN

4

5

2

CTRL

3

8

GND

4

Control input (forward)

Control input (reverse)

Duty setting pin

Driver output

1

7

OUT1

OUT2

5

RIN

6

VREF

OUT2

GND

Fig.25 BD6210F / BD6211F

7

8

Ground

OUT1

VCC

FIN

GND

OUT2

VREF

RIN

Note: Use all VCC pin by the same voltage.

Fig.26 SOP8

BD6210HFP / BD6211HFP / BD6212HFP

Table 2 BD6210HFP/BD6211HFP/BD6212HFP

VREF

DUTY

PROTECT

1

Name

VREF

OUT1

FIN

Function

Duty setting pin

Driver output

VCC

GND

7

4

FIN

RIN

3

5

2

CTRL

3

Control input (forward)

Ground

4

GND

RIN

FIN

2

6

5

Control input (reverse)

Driver output

GND

OUT1

OUT2

6

OUT2

VCC

GND

7

Power supply

Ground

Fig.27 BD6210HFP / BD6211HFP / BD6212HFP

FIN

Fig.28 HRP7

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2009.08 - Rev.C

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Technical Note

BD6210, BD6211, BD6212, BD6215, BD6216, BD6217

 Block diagram and pin configuration - Continued

BD6212FP

Table 3 BD6212FP

Name Function

Driver output

VREF

DUTY

PROTECT

17

1,2

6

VCC

21

22

23

OUT1

GND

RNF

OUT2

VREF

RIN

FIN

RIN

20

19

Small signal ground

Power stage ground

Driver output

CTRL

7,8

12,13

17

7

8

RNF

6

FIN

1

2

12 13

OUT2

Duty setting pin

Control input (reverse)

Control input (forward)

Power supply

GND

OUT1

19

Fig.29 BD6212FP

20

FIN

OUT1

NC

21

VCC

GND

OUT1

NC

VCC

FIN

22,23

FIN

Power supply

NC

GND

Ground

GND

Note: All pins not described above are NC pins.

Note: Use all VCC pin by the same voltage.

RNF

NC

RIN

NC

VREF

NC

OUT2

NC

Fig.30 HSOP25

BD6215FP / BD6216FP

Table 4 BD6215FP / BD6216FP

VREFA

9

DUTY

PROTECT

1

Name

OUT1A

RNFA

OUT2A

GND

Function

Driver output

VCC

24

25 VCC

FINA

RINA

11

10

3

Power stage ground

Driver output

OUT1A

1

6

CTRL

6

OUT2A

8

Small signal ground

Duty setting pin

Control input (reverse)

Control input (forward)

Power supply

GND 20

3

RNFA

9

VREFA

RINA

VREFB

DUTY

PROTECT

21

10

11

12

13

14

16

19

20

21

22

23

24

25

FIN

VCC

12

13 VCC

FINA

FINB

RINB

23

22

VCC

14 OUT1B

CTRL

VCC

Power supply

OUT2B

19

OUT1B

RNFB

OUT2B

GND

Driver output

GND

RNFB

8

16

Power stage ground

Driver output

FIN

GND

Small signal ground

Duty setting pin

Control input (reverse)

Control input (forward)

Power supply

Fig.31 BD6215FP / BD6216FP

VREFB

RINB

OUT1A

NC

RNFA

NC

OUT2A

VCC

FINB

RINB

VREFB

GND

FINB

VCC

GND

VCC

Power supply

GND

NC

GND

VREFA

RINA

FINA

VCC

OUT2B

NC

GND

Ground

NC

Note: All pins not described above are NC pins.

Note: Use all VCC pin by the same voltage.

RNFB

NC

OUT1B

Fig.32 HSOP25

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2009.08 - Rev.C

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Technical Note

BD6210, BD6211, BD6212, BD6215, BD6216, BD6217

 Block diagram and pin configuration - Continued

BD6216FM

Table 5 BD6216FM

VREFA

9

DUTY

PROTECT

1

Name

OUT1A

RNFA

OUT2A

GND

Function

Driver output

VCC

28 VCC

26

FINA

RINA

11

10

3

Power stage ground

Driver output

OUT1A

1

6

CTRL

OUT2A

6

8

Small signal ground

Duty setting pin

Control input (reverse)

Control input (forward)

Power supply

GND 22

3

RNFA

9

VREFA

RINA

VREFB

DUTY

PROTECT

23

10

11

12

14

15

17

20

22

23

24

25

26

28

FIN

VCC

12

14 VCC

FINA

FINB

RINB

25

24

VCC

15 OUT1B

CTRL

OUT2B

20

VCC

Power supply

OUT1B

RNFB

OUT2B

GND

Driver output

GND

RNFB

8

17

Power stage ground

Driver output

FIN

GND

Small signal ground

Duty setting pin

Control input (reverse)

Control input (forward)

Power supply

Fig.33 BD6216FM

VREFB

RINB

FINB

VCC

OUT1A

VCC

NC

VCC

FINB

RINB

VREFB

GND

VCC

Power supply

NC

RNFA

NC

GND

Ground

NC

OUT2A

NC

Note: All pins not described above are NC pins.

Note: Use all VCC pin by the same voltage.

GND

VREFA

RINA

FINA

VCC

NC

OUT2B

NC

RNFB

NC

VCC

OUT1B

Fig.34 HSOP-M28

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2009.08 - Rev.C

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Technical Note

BD6210, BD6211, BD6212, BD6215, BD6216, BD6217

 Block diagram and pin configuration - Continued

BD6217FM

Table 6 BD6217FM

VREFA

DUTY

PROTECT

VCC

9

26

1,2

3,4

6,7

8

Name

OUT1A

RNF A

OUT2A

GND

Function

Driver output

27

28

1

2

FINA

RINA

11

10

OUT1A

OUT2A

Power stage ground

Driver output

CTRL

6

7

Small signal ground

Duty setting pin

Control input (reverse)

Control input (forward)

Power supply

GND

22

23

3

4

RNFA

VCC

9

VREFA

RINA

VREFB

DUTY

PROTECT

12

10

13

14

11

FINA

12

VCC

15

16

FINB

RINB

25

24

OUT1B

OUT2B

CTRL

13,14

15,16

17,18

20,21

22

VCC

Power supply

20

21

OUT1B

RNFB

OUT2B

GND

Driver output

GND

8

17

18

Power stage ground

Driver output

RNFB

FIN

GND

Small signal ground

Duty setting pin

Control input (reverse)

Control input (forward)

Power supply

23

VREFB

RINB

Fig.35 BD6217FM

24

25

FINB

26

VCC

OUT1A

RNFA

NC

VCC

27,28

FIN

VCC

Power supply

FINB

RINB

VREFB

GND

Ground

OUT2A

Note: All pins not described above are NC pins.

Note: Use all VCC pin by the same voltage.

GND

VREFA

RINA

FINA

OUT2B

NC

RNFB

OUT1B

VCC

Fig.36 HSOP-M28

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2009.08 - Rev.C

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c

Technical Note

BD6210, BD6211, BD6212, BD6215, BD6216, BD6217

 Functional descriptions

1) Operation modes

Table 7 Logic table

FIN

RIN

VREF

X

OUT1

OUT2

Hi-Z*

L

Operation

a

b

c

d

e

f

L

Hi-Z*

Stand-by (idling)

H

L

H

VCC

X

H

L

Forward (OUT1 > OUT2)

Reverse (OUT1 < OUT2)

Brake (stop)

L

H

L

__________

PWM

L

VCC

Option

H

Forward (PWM control mode A)

Reverse (PWM control mode A)

Forward (PWM control mode B)

Reverse (PWM control mode B)

Forward (VREF control)

PWM

__________

PWM

__________

PWM

H

L

__________

PWM

__________

PWM

g

h

i

H

PWM

H

L

H

__________

j

L

H

Reverse (VREF control)

PWM

* Hi-Z is the off state of all output transistors. Please note that this is the state of the connected diodes, which differs from that of the mechanical relay.

X : Don’t care

a) Stand-by mode

Stand-by operates independently of the VREF pin voltage. In stand-by mode, all internal circuits are turned off,

including the output power transistors. Motor output goes to high impedance. If the motor is running at the switch to

stand-by mode, the system enters an idling state because of the body diodes. However, when the system switches

to stand-by from any other mode (except the brake mode), the control logic remains in the high state for at least

50µs before shutting down all circuits.

b) Forward mode

This operating mode is defined as the forward rotation of the motor when the OUT1 pin is high and OUT2 pin is low.

When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT1 to OUT2. For

operation in this mode, connect the VREF pin with VCC pin.

c) Reverse mode

This operating mode is defined as the reverse rotation of the motor when the OUT1 pin is low and OUT2 pin is high.

When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT2 to OUT1. For

operation in this mode, connect the VREF pin with VCC pin.

d) Brake mode

This operating mode is used to quickly stop the motor (short circuit brake). It differs from the stand-by mode

because the internal control circuit is operating in the brake mode. Please switch to the stand-by mode (rather than

the brake mode) to save power and reduce consumption.

OFF

OFF ON

OFF OFF

ON OFF

OFF ON

OFF

ON

M

ON

a) Stand-by mode

b) Forward mode

c) Reverse mode

d) Brake mode

Fig.37 Four basic operations (output stage)

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2009.08 - Rev.C

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Technical Note

BD6210, BD6211, BD6212, BD6215, BD6216, BD6217

e) f) PWM control mode A

The rotational speed of the motor can be controlled by the switching duty when the PWM signal is input to the FIN

pin or the RIN pin. In this mode, the high side output is fixed and the low side output does the switching,

corresponding to the input signal. The switching operates by the output state toggling between "L" and "Hi-Z".

The PWM frequency can be input in the range between 20kHz and 100kHz. Note that control may not be attained

by switching on duty at frequencies lower than 20kHz, since the operation functions via the stand-by mode. Also,

circuit operation may not respond correctly when the input signal is higher than 100kHz. To operate in this mode,

connect the VREF pin with VCC pin. In addition, establish a current path for the recovery current from the motor, by

connecting a bypass capacitor (10µF or more is recommended) between VCC and ground.

ON

OFF

ON

OFF

M

OFF

Control input : H

Control input : L

Fig.38 PWM control mode A operation (output stage)

FIN

RIN

OUT1

OUT2

Fig.39 PWM control mode A operation (timing chart)

g) h) PWM control mode B

The rotational speed of the motor can be controlled by the switching duty when the PWM signal is input to the FIN

pin or the RIN pin. In this mode, the low side output is fixed and the high side output does the switching,

corresponding to the input signal. The switching operates by the output state toggling between "L" and "H".

The PWM frequency can be input in the range between 20kHz and 100kHz. Also, circuit operation may not respond

correctly when the input signal is higher than 100kHz. To operate in this mode, connect the VREF pin with VCC pin.

In addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10µF

or more is recommended) between VCC and ground.

OFF

ON

OFF

ON

OFF

ON

M

OFF

Control input : H

Control input : L

Fig.40 PWM control mode B operation (output stage)

FIN

RIN

OUT1

OUT2

Fig.41 PWM control mode B operation (timing chart)

10/16

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2009.08 - Rev.C

c

Technical Note

BD6210, BD6211, BD6212, BD6215, BD6216, BD6217

i) j) VREF control mode

The built-in VREF-switching on duty conversion circuit provides switching duty corresponding to the voltage of the

VREF pin and the VCC voltage. The function offers the same level of control as the high voltage output setting

function in previous models. The on duty is shown by the following equation.

DUTY ≈ VREF [V] / VCC [V]

For example, if VCC voltage is 5V and VREF pin voltage is 3.75V, the switching on duty is about 75 percent.

However, please note that the switching on duty might be limited by the range of VREF pin voltage (Refer to the

operating conditions, shown on page 2). The PWM carrier frequency in this mode is 25kHz (nominal), and the

switching operation is the same as it is the PWM control modes. When operating in this mode, do not input the

PWM signal to the FIN and RIN pins. In addition, establish a current path for the recovery current from the motor, by

connecting a bypass capacitor (10µF or more is recommended) between VCC and ground.

VCC

VREF

0

FIN

RIN

OUT1

OUT2

Fig.42 VREF control operation (timing chart)

2) Cross-conduction protection circuit

In the full bridge output stage, when the upper and lower transistors are turned on at the same time, and this condition

exists during the period of transition from high to low, or low to high, a rush current flows from the power supply to

ground, resulting in a loss. This circuit protects against the rush current by providing a dead time (about 400ns,

nominal) at the transition.

3) Output protection circuits

a) Under voltage lock out (UVLO) circuit

To secure the lowest power supply voltage necessary to operate the controller, and to prevent under voltage

malfunctions, a UVLO circuit has been built into this driver. When the power supply voltage falls to 2.3V (nominal) or

below, the controller forces all driver outputs to high impedance. When the voltage rises to 2.5V (nominal) or above,

the UVLO circuit ends the lockout operation and returns the chip to normal operation.

b) Over voltage protection (OVP) circuit

When the power supply voltage exceeds 7.3V (nominal), the controller forces all driver outputs to high impedance.

The OVP circuit is released and its operation ends when the voltage drops back to 6.8V (nominal) or below. This

protection circuit does not work in the stand-by mode. Also, note that this circuit is supplementary, and thus if it is

asserted, the absolute maximum rating will have been exceeded. Therefore, do not continue to use the IC after this

circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed.

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2009.08 - Rev.C

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c

Technical Note

BD6210, BD6211, BD6212, BD6215, BD6216, BD6217

c) Thermal shutdown (TSD) circuit

The TSD circuit operates when the junction temperature of the driver exceeds the preset temperature (175°C

nominal). At this time, the controller forces all driver outputs to high impedance. Since thermal hysteresis is provided

in the TSD circuit, the chip returns to normal operation when the junction temperature falls below the preset

temperature (150°C nominal). Thus, it is a self-returning type circuit.

The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or

guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is

activated, and do not operate the IC in an environment where activation of the circuit is assumed.

d) Over current protection (OCP) circuit

To protect this driver IC from ground faults, power supply line faults and load short circuits, the OCP circuit monitors

the output current for the circuit’s monitoring time (10µs, nominal). When the protection circuit detects an over

current, the controller forces all driver outputs to high impedance during the off time (290µs, nominal). The IC

returns to normal operation after the off time period has elapsed (self-returning type). At the two channels type, this

circuit works independently for each channel.

Threshold

Iout

0

CTRL Input

Internal status

Monitor / Timer

ON

mon.

OFF

ON

off timer

Fig.43 Over current protection (timing chart)

 Interfaces

VCC

VREF

100k

10k

FIN

RIN

OUT1

OUT2

OUT1

OUT2

GND

RNF

GND

Fig.44 FIN / RIN

Fig.45 VREF

Fig.46 OUT1 / OUT2

Fig.47 OUT1 / OUT2

(HSOP25/HSOPM28)

(SOP8/HRP7)

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2009.08 - Rev.C

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Technical Note

BD6210, BD6211, BD6212, BD6215, BD6216, BD6217

 Notes for use

1) Absolute maximum ratings

Devices may be destroyed when supply voltage or operating temperature exceeds the absolute maximum rating.

Because the cause of this damage cannot be identified as, for example, a short circuit or an open circuit, it is important

to consider circuit protection measures – such as adding fuses – if any value in excess of absolute maximum ratings is

to be implemented.

2) Connecting the power supply connector backward

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply lines, such as adding an external direction diode.

3) Power supply lines

Return current generated by the motor’s Back-EMF requires countermeasures, such as providing a return current path

by inserting capacitors across the power supply and GND (10µF, ceramic capacitor is recommended). In this case, it is

important to conclusively confirm that none of the negative effects sometimes seen with electrolytic capacitors –

including a capacitance drop at low temperatures - occurs. Also, the connected power supply must have sufficient

current absorbing capability. Otherwise, the regenerated current will increase voltage on the power supply line, which

may in turn cause problems with the product, including peripheral circuits exceeding the absolute maximum rating. To

help protect against damage or degradation, physical safety measures should be taken, such as providing a voltage

clamping diode across the power supply and GND.

4) Electrical potential at GND

Keep the GND terminal potential to the minimum potential under any operating condition. In addition, check to

determine whether there is any terminal that provides voltage below GND, including the voltage during transient

phenomena. When both a small signal GND and high current GND are present, single-point grounding (at the set’s

reference point) is recommended, in order to separate the small signal and high current GND, and to ensure that

voltage changes due to the wiring resistance and high current do not affect the voltage at the small signal GND. In the

same way, care must be taken to avoid changes in the GND wire pattern in any external connected component.

5) Thermal design

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) under actual operating

conditions.

6) Inter-pin shorts and mounting errors

Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any

connection error, or if pins are shorted together.

7) Operation in strong electromagnetic fields

Using this product in strong electromagnetic fields may cause IC malfunctions. Use extreme caution with

electromagnetic fields.

8) ASO - Area of Safety Operation

When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.

9) Built-in thermal shutdown (TSD) circuit

The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or

guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated,

and do not operate the IC in an environment where activation of the circuit is assumed.

10) Capacitor between output and GND

In the event a large capacitor is connected between the output and GND, if VCC and VIN are short-circuited with 0V or

GND for any reason, the current charged in the capacitor flows into the output and may destroy the IC. Use a capacitor

smaller than 1μF between output and GND.

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c

Technical Note

BD6210, BD6211, BD6212, BD6215, BD6216, BD6217

11) Testing on application boards

When testing the IC on an application board, connecting a capacitor to a low impedance pin subjects the IC to stress.

Therefore, always discharge capacitors after each process or step. Always turn the IC's power supply off before

connecting it to or removing it from the test setup during the inspection process. Ground the IC during assembly steps

as an antistatic measure. Use similar precaution when transporting or storing the IC.

12) Switching noise

When the operation mode is in PWM control or VREF control, PWM switching noise may effects to the control input

pins and cause IC malfunctions. In this case, insert a pulled down resistor (10kΩ is recommended) between each

control input pin and ground.

13) Regarding the input pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements, in order to keep them

isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example, the relation between each potential is as follows:

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, as well as operating malfunctions and physical damage. Therefore, do not use methods by

which parasitic diodes operate, such as applying a voltage lower than the GND (P substrate) voltage to an input pin.

Resistor

Pin A

Transistor (NPN)

B

Pin A

Pin B

C

E

B

C

E

N

P⁺

Parasitic

element

P⁺

N

P

N

Parasitic

element

P substrate

GND

Parasitic element

Other adjacent elements

Appendix: Example of monolithic IC structure

 Ordering part number

B D

6

2

1

0

F

-

E

2

ROHM part

number

Type

Package

Packaging spec.

E2: Embossed taping

(SOP8/HSOP25/HSOP-M28)

1X: 7V max.

2X: 18V max.

3X: 36V max.

F: SOP8

FP: HSOP25

FM: HSOP-M28

HFP: HRP7

TR: Embossed taping

(HRP7)

X0: 1ch/0.5A X5:

2ch/0.5A

X1: 1ch/1A X6: 2ch/1A

X2 1 h/2A

X7 2 h/2A

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2009.08 - Rev.C

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c

Technical Note

BD6210, BD6211, BD6212, BD6215, BD6216, BD6217

SOP8

Tape

Embossed carrier tape

Quantity

2500pcs

E2

Direction

of feed

(Holding the reel with the left hand and pulling the tape out with the right,

pin 1 will be on the upper left-hand side.)

Direction of feed

1Pin

Reel

(Unit:mm)

*Orders should be placed in multiples of package quantity.

HSOP25

Tape

Embossed carrier tape

2000pcs

Quantity

13.6 0.2

2.75 0.1

Direction

of feed

E2

25

1

14

13

(Holding the reel with the left hand and pulling the tape out with the right,

pin 1 will be on the upper left-hand side.)

0.25 0.1

1.95 0.1

0.8

0.1

0.36 0.1

Direction of feed

1Pin

Reel

(Unit:mm)

*Orders should be placed in multiples of package quantity.

HSOP-M28

Tape

Embossed carrier tape

1500pcs

Quantity

18.5 0.2

28

15

14

Direction

of feed

E2

(Holding the reel with the left hand and pulling the tape out with the right,

pin 1 will be on the upper left-hand side.)

1

0.25 0.1

5.15 0.1

0.8

0.35 0.1

0.1 S

M

0.08

16.0 0.2

Direction of feed

1Pin

Reel

(Unit:mm)

*Orders should be placed in multiples of package quantity.

HRP7

9.395 0.125

(MAX 9.745 include BURR)

8.82 – 0.1

Tape

Embossed carrier tape

2000pcs

1.905 0.1

(5.59)

Quantity

Direction

of feed

TR

(Holding the reel with the left hand and pulling the tape out with the right,

pin 1 will be on the upper right-hand side.)

1

2

3

4

5

6

7

0.8875

+

5.5

4.5

0.27

-

4.5

+

-

0.1

0.05

x

x x

x

x x

x

x x

x

x x

x

x x

x x x x

S

1.27

0.73 0.1

S

Direction of feed

1Pin

0.08

Reel

(Unit:mm)

*Orders should be placed in multiples of package quantity.

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2009.08 - Rev.C

15/16

c

Technical Note

BD6210, BD6211, BD6212, BD6215, BD6216, BD6217

www.rohm.com

2009.08 - Rev.C

16/16

c

Notice

N o t e s

No copying or reproduction of this document, in part or in whole, is permitted without the

consent of ROHM Co.,Ltd.

The content speciﬁed herein is subject to change for improvement without notice.

The content speciﬁed herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the speciﬁcations,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information speciﬁed in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information speciﬁed herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

use of such technical information.

The Products speciﬁed in this document are intended to be used with general-use electronic

equipment or devices (such as audio visual equipment, ofﬁce-automation equipment, commu-

nication devices, electronic appliances and amusement devices).

The Products speciﬁed in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

against the possibility of physical injury, ﬁre or any other damage caused in the event of the

failure of any Product, such as derating, redundancy, ﬁre control and fail-safe designs. ROHM

shall bear no responsibility whatsoever for your use of any Product outside of the prescribed

scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or

system which requires an extremely high level of reliability the failure or malfunction of which

may result in a direct threat to human life or create a risk of human injury (such as a medical

instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,

fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of

any of the Products for the above special purposes. If a Product is intended to be used for any

such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology speciﬁed herein that may

be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to

obtain a license or permit under the Law.

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

http://www.rohm.com/contact/

www.rohm.com

R0039

A


型号：	BD6216FP
厂家：	ROHM
描述：	Brush DC Motor Controller, 1A, PDSO25, ROHS COMPLIANT, HSOP-25 电动机控制光电二极管
文件：	总17页 (文件大小：389K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD6216FP [ROHM]

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