BD63282EFV-E2 [ROHM]
Brushless DC Motor Controller,;
| 型号： | BD63282EFV-E2 |
| 厂家： | 
ROHM |
| 描述： | Brushless DC Motor Controller, 电动机控制 光电二极管 |
| 文件： | 总30页 (文件大小：2283K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
DC Brushless Fan Motor Driver Series
Three-phase Full-wave
Fan Motor Driver
BD63282EFV
General Description
Key Specifications
BD63282EFV is a 1chip driver composed of a Power
DMOS FET motor driver. This IC implements a stable
start-up by rotor position detection with 3 hall element.
Furthermore, it introduces silent operation and low
vibration by making output current a sine-wave that
achieves.
Operating Supply Voltage Range: 5.0 V to 16.0 V
Operating Temperature Range: -40 °C to +100 °C
Output Voltage
(High Side and Low Side Voltage Total):
0.3 V(Typ) at ±0.3 A
Package
HTSSOP-B20
W(Typ) x D(Typ) x H(Max)
6.50 mm x 6.40 mm x 1.00 mm
Features
Small Package
Driver Including Power DMOS FET
3 Hall Sine Drive
Speed Controllable by DC/PWM Input
Lead Angle Control (Auto/Fixed)
Soft-Start Function
Rotation Direction Select
Rotation Speed Pulse Signal Output (FG)
Protection Function
(Under Voltage Protection Function, Lock Protection
Function (Automatic Recovery Function), High
Speed Rotation Protection Function, Low Speed
Rotation Protection Function)
HTSSOP-B20
Application
Fan Motors for General Consumer Equipment of
Refrigerator etc.
Typical Application Circuit
REF
PWM
REF
H1+
PWM
GND
H3
H2
H1
-
SIG
H1-
FG
H2+
OSC
REF
REF
H2-
HPST
BD63282EFV
H3+
LKT
FR
H3-
SS
+
VCC
W
RNF
V
U
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays
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BD63282EFV
Contents
General Description........................................................................................................................................................................1
Features..........................................................................................................................................................................................1
Application ......................................................................................................................................................................................1
Key Specifications ..........................................................................................................................................................................1
Package..........................................................................................................................................................................................1
Typical Application Circuit...............................................................................................................................................................1
Contents .........................................................................................................................................................................................2
Pin Configuration ............................................................................................................................................................................3
Pin Descriptions..............................................................................................................................................................................3
Block Diagram ................................................................................................................................................................................4
Absolute Maximum Ratings ............................................................................................................................................................5
Thermal Resistance........................................................................................................................................................................5
Recommended Operating Conditions.............................................................................................................................................5
Electrical Characteristics.................................................................................................................................................................6
Typical Performance Curves...........................................................................................................................................................8
Application Examples ...................................................................................................................................................................13
Description of Function Operations...............................................................................................................................................14
Thermal Resistance Model ...........................................................................................................................................................21
I/O Equivalence Circuits................................................................................................................................................................22
Note for Content ...........................................................................................................................................................................22
Operational Notes.........................................................................................................................................................................23
Ordering Information.....................................................................................................................................................................25
Marking Diagram ..........................................................................................................................................................................25
Physical Dimension and Packing Information...............................................................................................................................26
Revision History............................................................................................................................................................................27
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BD63282EFV
Pin Configuration
(TOP VIEW)
REF
H1+
H1-
1
PWM
GND
FG
20
19
18
2
3
4
5
6
H2+
H2-
17 OSC
16
HPST
H3+
15 LKT
FR
14
H3-
SS
7
8
13
12
11
VCC
W
RNF
U
9
EXP-PAD
10
V
Pin Descriptions
Pin No.
Pin Name
Function
1
REF
H1+
H1-
Reference voltage output pin
Hall input 1 + pin
Hall input 1 - pin
2
3
4
H2+
H2-
Hall input 2 + pin
Hall input 2 - pin
5
6
H3+
H3-
Hall input 3 + pin
Hall input 3 – pin
7
8
SS
Oscillating capacitor connection pin for Soft-Start time setting
Output current detection resistor connection pin
Output U pin
9
RNF
U
10
11
12
13
14
15
16
17
18
19
20
Reverse
V
Output V pin
W
Output W pin
VCC
FR
Power supply pin
Motor rotation direction setting pin
Lock off time setting pin
LKT
HPST
OSC
FG
Lead angle control setting pin
Oscillating capacitor connection pin for OSC frequency setting
Rotating speed pulse signal output pin
Ground pin
GND
PWM
EXP-PAD
Output duty control pin
Substrate (Connect to Ground)
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BD63282EFV
Block Diagram
VREF
LOCK
PROTECT
REF
H1+
H1-
H2+
H2-
H3+
H3-
SS
1
2
20 PWM
19 GND
18 FG
REF
TSD
UVLO
HALL
COMP
SIGNAL
OUTPUT
3
4
17 OSC
16 HPST
15 LKT
14 FR
OSC
HALL
COMP
VREF
5
CONTROL
LOGIC
VREF
6
HALL
COMP
VREF
7
VCLV
1/15
8
13 VCC
12 W
Current
PRE DRIVER
Limit
COMP
RNF
U
9
10
11 V
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BD63282EFV
Absolute Maximum Ratings (Ta=25 °C)
Parameter
Symbol
Rating
Unit
Supply Voltage (VCC)
VCC
Tstg
VO
20
-55 to +150
20
V
°C
V
Storage Temperature Range
Output Voltage (U, V, W)
Output Current (U, V, W)
FG Output Voltage
IO
1.0(Note 1)
A
VFG
IFG
20
V
FG Output Current
10
mA
mA
Reference Voltage (REF) Output Current
IREF
10
Input Voltage 1
(PWM, HPST, LKT, OSC,SS, FR, H2+, H2-, H3+, H3-)
VIN1
7
V
Input Voltage 2 (H1+, H1-)
Input Voltage 3 (RNF)
VIN2
VIN3
7
V
V
4.5
Maximum Junction Temperature
Tjmax
150
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) Do not exceed Tjmax
Thermal Resistance(Note 2)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 4)
2s2p(Note 5)
HTSSOP-B20
Junction to Ambient
Junction to Top Characterization Parameter(Note 3)
θJA
143.0
8
26.8
4
°C/W
°C/W
ΨJT
(Note 2) Based on JESD51-2A(Still-Air).
(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the surface of the
outside component package.
(Note 4) Using a PCB board based on JESD51-3.
(Note 5) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70 μm
Footprints and Traces
Thermal Via(Note 6)
Layer Number of
Measurement Board
Material
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
Pitch
Diameter
4 Layers
FR-4
1.20 mm
Φ0.30 mm
Top
Copper Pattern
Bottom
Thickness
70 μm
Copper Pattern
Thickness
35 μm
Copper Pattern
Thickness
70 μm
Footprints and Traces
74.2 mm x 74.2 mm
74.2 mm x 74.2 mm
(Note 6) This thermal via connects with the copper pattern of all layers.
Recommended Operating Conditions
Parameter
Symbol
VCC
Min
5
Typ
12
-
Max
16
Unit
V
Supply Voltage (VCC)
Input Voltage 1
VIN1
0
VREF
V
(PWM, HPST, LKT, OSC, SS, FR, H2+, H2-, H3+, H3-)
Input Voltage 2 (H1+, H1-)
Input Frequency (PWM)
Operating Temperature
VIN2
fPWM
Topr
0
-
-
-
2.5
50
V
20
-40
kHz
°C
+100
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BD63282EFV
Electrical Characteristics (Unless otherwise specified VCC=12 V Ta=25 °C)
Parameter
Circuit Current
Symbol
ICC
Min
4.2
Typ
7.0
Max
9.8
Unit
mA
Conditions
<REF>
Reference Voltage
<OSC>
VREF
4.65
5.00
5.35
V
IREF=-2 mA
OSC High Voltage
OSC Low Voltage
OSC Charge Current
OSC Discharge Current
<FG>
VOSCH
VOSCL
ICOSC
IDOSC
2.3
0.8
-55
+25
2.5
1.0
-40
+40
2.7
1.2
-25
+55
V
V
µA
µA
VOSC=1.8 V
VOSC=1.8 V
FG Output Low Voltage
FG Output Leak Current
<PWM>
VFGL
IFGL
-
-
0.3
0.4
10
V
IFG=+5 mA
VFG=20 V
-
µA
Speed Control with PWM Input
VOSC=0 V
Speed Control with PWM Input
VOSC=0 V
Speed Control with PWM Input
VOSC=0 V, VPWM=0 V
Speed Control with DC Voltage
VPWM=0 V
PWM Input High Voltage
PWM Input Low Voltage
PWM Input Bias Current 1
PWM Input Bias Current 2
VPWMH
VPWML
IPWM1
IPWM2
2.5
0.0
-75
-1
-
-
VREF
0.8
-25
-
V
V
-50
-
µA
µA
<Soft-Start>
SS Charge Current
<Current Limit>
Current Limit Setting Voltage
<Output>
ISS
-2.4
-1.8
-1.2
µA
VCLV
120
150
180
mV
IO=±300 mA,
Output Voltage
VO
-
0.3
0.4
V
High and low side output
voltage total
Output High Voltage
VOH
VOL
-0.20
-0.15
-
V
V
IO=-300 mA, for VCC Voltage
Output Low Voltage
-
0.15
0.20
IO=+300 mA
<Lead Angle Control Setting>
HPST Input Current
IHPST
-35
-25
-15
µA
V
VHPST=0 V
Auto Lead Angle Control Mode
Fixed Lead Angle Control 25° Mode
Fixed Lead Angle Control 10° Mode
Fixed Lead Angle Control 0° Mode
<FR>
VHPST1
VHPST2
VHPST3
VHPST4
3.85
2.60
1.35
0.00
-
-
-
-
VREF
3.65
2.40
1.15
V
V
V
FR Input Current
IFR
-35
3.8
0.0
-25
-15
VREF
0.8
µA
V
VFR=0 V
Forward Rotation Mode
Reverse Rotation Mode
VFRH
VFRL
-
-
V
For parameters involving current, positive notation means inflow of current to the IC while negative notation means outflow of current from the IC
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BD63282EFV
Electrical Characteristics – Continued (Unless Otherwise Specified VCC=12 V Ta=25 °C)
Parameter
<Lock Detection>
Symbol
Min
Typ
Max
Unit
Conditions
Lock Detection ON Time
Lock Detection OFF Time 1
Lock Detection OFF Time 2
Lock Detection OFF Time 3
<LKT>
tON
0.6
2.5
1.0
5.0
1.0
5.0
1.6
7.5
s
s
s
s
Sine start-up section
VLKT=Open
tOFF1
tOFF2
tOFF3
2.0
3.0
VLKT=0 V
10.0
15.0
VLKT=1.5 V
LKT Input Bias Current
tOFF1 Mode
ILKT
-70
2.2
1.2
0.0
-50
-35
VREF
1.8
µA
V
VLKT=0 V
VLKT1
VLKT2
VLKT3
-
-
-
tOFF2 Mode
V
tOFF3 Mode
0.8
V
<Hall Input>
Hall Input Hysteresis Voltage +
Hall Input Hysteresis Voltage –
VHYS+
VHYS-
+5
+10
+15
mV
mV
-15
-10
-5
For parameters involving current, positive notation means inflow of current to the IC while negative notation means outflow of current from the IC
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BD63282EFV
Typical Performance Curves
(Reference Data)
6
5
4
3
2
10
Operating Voltage Range
Operating Voltage Range
8
6
4
2
0
Ta=+100 °C
Ta=+25 °C
Ta=-40 °C
Ta=+100 °C
Ta=+25 °C
Ta=-40 °C
0
5
10
15
20
0
5
10
15
20
Supply Voltage: VCC[V]
Supply Voltage: VCC[V]
Figure 1. Circuit Current vs Supply Voltage
Figure 2. Reference Voltage vs Supply Voltage
6
5
4
3
2
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Operating Voltage Range
Ta=+100 °C
Ta=+25 °C
Ta=-40 °C
Ta=-40 °C
Ta=+25 °C
Ta=+100 °C
OSC High Voltage
Ta=+100 °C
Ta=+25 °C
Ta=-40 °C
OSC Low Voltage
0
2
4
6
8
10
0
5
10
15
20
Reference Voltage Output Current: IREF[mA]
Supply Voltage: VCC[V]
Figure 3. Reference Voltage vs
Reference Voltage Output Current
(VCC=12 V)
Figure 4. OSC High/Low Voltage vs Supply Voltage
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BD63282EFV
Typical Performance Curves - continued
(Reference Data)
0.8
0.6
0.4
0.2
0.0
80
Operating Voltage Range
40
Discharge Current
Ta=+100 °C
Ta=+25 °C
Ta=-40 °C
0
-40
-80
Ta=+100 °C
Ta=+25 °C
Ta=-40 °C
Ta=-40 °C
Ta=+25 °C
Ta=+100 °C
Charge Current
0
2
4
6
8
10
0
5
10
15
20
FG Output Current: IFG[mA]
Supply Voltage: VCC[V]
Figure 5. OSC Charge/Discharge Current vs Supply Voltage
Figure 6. FG Output Low Voltage vs FG Output Current
(VCC=12 V)
10
0.8
0.6
0.4
0.2
Operating Voltage Range
8
6
4
2
VCC=5 V
Ta=-40 °C
Ta=+25 °C
Ta=+100 °C
VCC=12 V
VCC=16 V
0
0.0
0
2
4
6
8
10
0
5
10
15
20
FG Output Current: IFG[mA]
Supply Voltage: VCC[V]
Figure 7. FG Output Low Voltage vs FG Output Current
Figure 8. FG Output Leak Current vs Supply Voltage
(Ta=25 °C)
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BD63282EFV
Typical Performance Curves - continued
(Reference Data)
0
-1
-2
-3
-4
0
Operating Voltage Range
Operating Voltage Range
-20
-40
-60
Ta=-40 °C
Ta=+25 °C
Ta=+100 °C
Ta=-40 °C
Ta=+25 °C
Ta=+100 °C
-80
-100
0
5
10
15
20
0
5
10
15
20
Supply Voltage: VCC[V]
SupplyVoltage: VCC[V]
Figure 9. PWM Input Bias Current 1 vs Supply Voltage
Figure 10. SS Charge Current vs Supply Voltage
300
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
Operating Voltage Range
250
200
150
100
Ta=+100 °C
Ta=+25 °C
Ta=-40 °C
50
Ta=+100 °C
Ta=+25 °C
Ta=-40 °C
0
0
5
10
15
20
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
Supply Voltage: VCC[V]
Output Current: IO[mA]
Figure 11. Current Limit Setting Voltage vs Supply Voltage
Figure 12. Output High Voltage vs Output Current
(VCC=12 V)
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BD63282EFV
Typical Performance Curves - continued
(Reference Data)
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
VCC=5 V
VCC=12 V
VCC=16 V
Ta=+100 °C
Ta=+25 °C
Ta=-40 °C
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
0.0
0.2
0.4
0.6
0.8
1.0
Output Current: IO[mA]
Output Current: IO[mA]
Figure 13. Output High Voltage vs Output Current
Figure 14. Output Low Voltage vs Output Current
(VCC=12 V)
(Ta=25 °C)
0.6
0.5
0.4
0.3
0
Operating Voltage Range
-10
-20
-30
-40
-50
-60
VCC=5 V
VCC=12 V
VCC=16 V
Ta=-40 °C
Ta=+25 °C
Ta=+100 °C
0.2
0.1
0.0
0.0
0.2
0.4
0.6
0.8
1.0
0
5
10
15
20
Output Current: IO[mA]
Supply Voltage: VCC[V]
Figure 15. Output Low Voltage vs Output Current
Figure 16. HPST Input Current vs Supply Voltage
(Ta=25 °C)
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BD63282EFV
Typical Performance Curves - continued
(Reference Data)
0
0
-20
Operating Voltage Range
Operating Voltage Range
-10
-20
-30
-40
-60
Ta=+100 °C
Ta=+100 °C
-40
Ta=+25 °C
Ta=-40 °C
Ta=+25 °C
Ta=-40 °C
-80
-50
-60
-100
0
5
10
15
20
0
5
10
15
20
Supply Voltage: VCC[V]
Supply Voltage: VCC[V]
Figure 17. FR Input Current vs Supply Voltage
(VFR=0 V)
Figure 18. LKT Input Bias Current vs Supply Voltage
(VLKT=0 V)
20
15
10
5
0
Operating Voltage Range
Operating Voltage Range
-5
-10
-15
Ta=-40 °C
Ta=+25 °C
Ta=+100 °C
Ta=+100 °C
Ta=+25 °C
Ta=-40 °C
0
-20
0
5
10
15
20
0
5
10
15
20
Supply Voltage: VCC[V]
Supply Voltage: VCC[V]
Figure 19. Hall Input Hysteresis Voltage + vs Supply Voltage
Figure 20. Hall Input Hysteresis Voltage - vs Supply Voltage
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BD63282EFV
Application Examples
1. Variable Speed Control Application Using PWM Duty Converted to DC Voltage.
This is the application example to control rotation speed by the external PWM signal converted to DC voltage.
Stabilization of REF voltage
Noise measure
PWM/DC convert circuit
VREF
REF
H1+
PWM
GND
PWM
LOCK
PROTECT
1
2
20
19
18
17
REF
TSD
PWM
To DC
Protection of
FG Open-drain
UVLO
HALL
-
H3
H2
H1
Hall bias voltage is set
by amplitude of hall
element output voltage
and hall input voltage
range.
Lead angle setting
COMP
FG
H1-
SIGNAL
OUTPUT
SIG
3
4
OSC
HPST
H2+
Lock detection
OFF time setting.
OSC
REF
VREF
CONTROL
LOGIC
H2-
16
REF
5
VREF
LKT
FR
H3+
Hall bias voltage is set
by amplitude of hall
element output voltage
and hall input voltage
range.
15
VREF
6
H3-
SS
14
13
12
11
Rotation direction setting.
7
VCLV
VCC
Protection against
reverse connection of
fan connector.
+
1/15
8
Soft-Start time setting
Current
Limit
COMP
VCC
RNF
U
W
V
VCC
VCC
The motor current detecting
resister.
Be mindful to wattage.
9
Rise in VCC voltage
measures by the BEMF.
10
Connect bypass capacitor near
the VCC pin as much as
possible.
Rated output voltage 20 V
Rated output current 1.0 A
Figure 21. PWM Duty Convert DC Voltage Application
2. Variable Speed Control Application by Input PWM Duty
This is the application example to control rotation speed by the direct input external PWM signal.
Protection of
PWM pin
VREF
REF
H1+
PWM
GND
LOCK
PROTECT
1
2
20
19
18
17
REF
TSD
PWM
UVLO
HALL
PWM duty input
-
H3
H2
H1
COMP
FG
H1-
SIGNAL
OUTPUT
SIG
3
4
Connected to the GND
OSC
HPST
H2+
OSC
REF
VREF
CONTROL
LOGIC
H2-
16
REF
5
VREF
LKT
FR
H3+
15
VREF
6
H3-
SS
14
13
12
11
7
VCLV
VCC
+
1/15
8
Current
Limit
COMP
VCC
RNF
U
W
V
VCC
VCC
9
10
Figure 22. Input PWM Duty Signal Application
Board Design Note
1. IC power (VCC), motor outputs (U, V, W), and motor ground (RNF) lines are made as wide as possible.
2. The IC ground (GND) is common with the application ground except motor ground, and arranged as close as
possible to (-) land.
3. The bypass capacitor and the Zener diode are placed as near as possible to the VCC pin.
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Description of Function Operations
1. 3 Hall Sine Drive
BD63282EFV detects rotor position by hall element. It is a motor driver IC for sine drive. Using hall signal, it makes the coil
current of a three-phase brushless DC motor a sine waveform.
At start-up, it confirms the rotation of the rotor in the normal rotation judgement section for 100 ms(Typ). If normal rotation
is not detected, it is judged rotor is stop and it moves to the sine start-up section. In the sine start-up section, it gradually
accelerates the rotation speed until the stable rotation speed (The difference between previous FG cycle and current FG
cycle is 3.125 %(Typ) or lower.) which depends on input PWM duty. After the rotation speed is stable, it moves to the sine
driving section. If detects normal rotation in the normal rotation judgement section, the state moves to the sine driving
section. If detects reverse rotation in the normal rotation judgement section, it sets low the output logic of U, V, W and
stops the rotation of the rotor. When VLKT is open, after 5 s(Typ), it moves to the normal rotation judgement section again.
VCC
Output U
Output V
Output W
FG Signal
Normal Rotation
Judgment Section
Sine Start-up Section
Rotation Speed
is Stable
Sine Driving Section
High impedance
Figure 23. Timing Chart of Forward Rotation Mode Output Signals (U, V, W) and FG Signal (FR = H)
Table 1. Driving Section Description
Driving Section
Normal Rotation
Function
Detect the rotation of the rotor. (100 ms(Typ))
Judgement Section
Gradually accelerate the rotor speed with rotor position detection signal from 3 hall
elements until the stable rotor speed (The difference between previous FG cycle and
current FG cycle is 3.125%(Typ) or lower)
Sine Start-up Section
Sine Driving Section
Motor driving with rotor position detection signal from 1 hall element.
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Description of Function Operations – continued
2. Current Limit
BD63282EFV has the current limit function that limits the current flowing through the motor coil. When the current flowing
through the motor coil is detects a set current value or more, adjusts output PWM duty.
When not using the current limit function, short the RNF pin with GND.
VCC
Current Limit Setting
Current Limit Setting Voltage (VCLV
)
Soft Start Setting Voltage
(Note 9)
ICL2
(Note 8)
ICL1
(Note 7)
ICL
Motor rpm
(Note 10)
tSS
(Note 7) Current limit setting value.
(Note 8) Current limit setting determined by 1/15 of the SS pin voltage (VSS).
(Note 9) Current limit setting determined by the current limit setting voltage inside the IC(VCLV).
(Note 10) Soft start time.
Figure 24. Timing Chart in Motor Start-up
2.1. Current Limit in Soft Start Setting Voltage Section
In the soft start setting voltage section, current limit setting value is determined by 1/15 (Typ) of the SS pin voltage and
the RNF pin voltage. After start-up, the SS pin voltage is gradually increase in time according to the capacity of
capacitor connected to the SS pin (Soft start time, tSS) from 0 V (Soft start function). If the SS pin voltage become
current limit setting voltage inside the IC (VCLV, 150 mV(Typ)) or more, the state moves to current limit setting voltage
section. As shown in Figure 25, if the current detection resistance (R1) is 0.20 Ω, the SS pin voltage is 0.75 V, the
current limit setting value and the power consumption value of the current detection resistance can be obtained from
the following formula.
1
0.75
15
VCC
푉퐶퐿1 = 푉 ×
=
= ꢀꢁ [mV]
푆푆
15
ꢂ
50 푚
ꢃꢄꢅ
U
V
퐼퐶퐿1
=
=
= ꢁ.ꢆꢀ [A]
푅
ꢅ
0.2
푃푅푀퐴푋 = 푉퐶퐿1 × 퐼퐶퐿1
W
= ꢀꢁ ꢇ × ꢁ.ꢆꢀ = ꢁ.ꢁꢈꢆꢀ [W]
R1
RNF
－
푉
is the SS pin voltage [V]
is the 1/15 (Typ) of the SS pin voltage [V]
is the current detection resistance [Ω]
푆푆
Motor Large
Current GND Line
푉
VCLV
ICL1
퐶퐿1
ISS
ꢉ1
1/15
Amp
sel
퐼퐶퐿1 is the current limit setting value [A]
푅푀퐴푋 is the maximum power consumption value
of the current detection resistance [W]
C1
SS
푃
CURRENT
LIMIT
COMP
VCL1
GND
IC Small Signal GND Line
As shown in Figure 25, the IC small signal GND
line should be separated to the motor large
current GND line connected to R1.
Figure 25. Current Limit Setting
(Soft Start Setting Voltage Section)
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2.1. Current Limit in Soft Start Setting Voltage Section – continued
If the charge current of the SS pin (ISS) is 1.8 µA (Typ), current limit setting voltage inside IC (VCLV) is 150 mV (Typ)
and the capacitance of the capacitor (C1) which connected to the SS pin is 1 µF, the soft start time (tSS) can be
obtained from the following formula.
퐶
ꢅ
× ꢂ
× 15
1.0 휇 × 150 푚 × 15
= ꢈ.ꢆꢀ [s]
1.8 휇
ꢃꢄꢊ
푡푆푆 =
=
ꢋ
ꢌꢌ
ꢍ1 is The capacitance of the capacitor (C1) which connected to the SS pin [F]
is The current limit setting voltage inside IC [V]
푉
퐶퐿ꢂ
퐼푆푆 is The charge current of the SS pin [A]
When not using the Soft start function, open the SS pin.
2.2. Current limit in Current Limit Setting Voltage Section
In the current limit setting voltage section, current limit setting value is determined by current limit setting voltage
inside IC (VCLV) and the RNF pin voltage. As shown in Figure 26, if the current detection resistance (R1) is 0.20 Ω,
current limit setting voltage inside the IC is 150 mV (Typ), the current limit setting value and the maximum power
consumption value of the current detection resistance can be obtained from the following formula.
ꢂ
150 푚
= ꢁ.ꢎꢀ [A]
0.2
VCC
ꢃꢄꢊ
퐼퐶퐿2
=
=
푅
ꢅ
U
V
푃푅푀퐴푋 = 푉퐶퐿ꢂ × 퐼퐶퐿2
= ꢈꢀꢁ ꢇ × ꢁ.ꢎꢀ = ꢁ.ꢈꢈ3 [W]
W
푉
ꢉ1
is the current limit setting voltage [V]
is the current detection resistance [Ω]
퐶퐿ꢂ
R1
RNF
SS
－
퐼퐶퐿2 is the current limit setting value [A]
푅푀퐴푋 is the maximum power consumption value
Motor Large
Current GND Line
ICL2
VCLV
푃
1/15
Amp
of the current detection resistance [W]
sel
C1
UNUSED
CURRENT
LIMIT
GND
COMP
As shown in Figure 26, the IC small signal GND
line should be separated to the motor large
current GND line connected to R1.
IC Small Signal GND Line
Figure 26. Current Limit Setting
(Current Limit Setting Voltage Section)
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Description of Function Operations – continued
3. Output signals (U, V, W) and FG Signal Logic in Driving
The timing chart of the output signals (U, V, W), the FG signal and Hall signals in driving is shown in Figure 27. The FG
signal is generated from the Hall signal. The relation of the placement of Hall elements and motor coil of each phase is
shown in Figure 28.
High impedance
Output U
Output V
Output W
FG Signal
Electrical Cycle = 360˚
H+
H-
H1
H2
H3
Figure 27. Timing Chart of Forward Rotation Mode Output Signals
(U, V, W), FG Signal and Hall Signal (FR = H)
Figure 28. Placement of Hall elements
(Reference)
4. Motor Rotation Direction Setting (FR Pin)
The FR pin input voltage sets the rotation direction of the motor. The input voltage range and function is shown as Table 2.
When the FR pin is open, it sets the forward rotation mode.
Table 2. FR Mode and Motor Rotation Direction (VCC=12 V)
FR Mode
FR Pin Voltage [V]
Motor Rotation Direction
Forward Rotation Mode
Reverse Rotation Mode
3.8 to VREF
0.0 to 0.8
Forward Rotation (U→V→W)
Reverse Rotation (U→W→V)
High impedance
Output U
Output V
Output W
FG Signal
Electrical Cycle = 360˚
H+
H-
H1
H2
H3
Figure 29. Timing Chart of Reverse Rotation Mode Output Signals
(U, V, W), FG Signal and Hall Signal (FR = L)
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Description of Function Operations – continued
5. Speed Control
5.1. Speed Control with DC Voltage
The DC voltage input to PWM pin controls the motor rotation speed. As shown in Figure 31, the command PWM duty
is generated by comparing the DC voltage input to the PWM pin with the triangular wave generated by the OSC circuit.
The command PWM duty is determined by the PWM voltage.
5.0V
2.5V
REF
PWM
OSC
VREF
OSC
GND
1.0V
0.0V
Disable
PWM
High
Low
PWM
To DC
Command
PWM Duty
Command
PWM Duty
Figure 30. DC Voltage Input Application
Figure 31. Timing Chart of PWM Duty Generation in DC Voltage Input
The OSC High voltage (2.5 V(Typ)) and the Low voltage (1.0 V(Typ)) are made by resistance division of the reference
voltage (REF) and are designed to be resistant to voltage ratio fluctuations. Therefore, by setting the PWM pin input
voltage to the REF voltage reference, it is possible to make it an application that is not easily affected even if there is
voltage fluctuation of the triangular wave. In this case as well, in applications requiring strict accuracy, decide the
value with sufficient margin after consideration.
5.2. OSC Frequency Setting
The capacitor value (COSC) connected to the OSC pin sets the OSC frequency.
Equation
|
|
ꢋ
×ꢋ
퐷ꢏꢌꢃ ꢃꢏꢌꢃ
푓
=
[Hz]
푂푆퐶
(|
× ꢋ
| |
+ ꢋ
|) (
× ꢂ
)
−ꢂ
ꢏꢌꢃꢄ
퐶
ꢏꢌꢃ
퐷ꢏꢌꢃ
ꢃꢏꢌꢃ
ꢏꢌꢃ퐻
푓
푂푆퐶
is the OSC frequency [Hz]
ꢍ푂푆퐶 is the OSC capacitor value [F]
퐼ꢐ푂푆퐶 is the OSC discharge current [A] (Typ +40 μA)
퐼퐶푂푆퐶 is the OSC charge current [A] (Typ -40 μA)
푉푂푆퐶ꢑ is the OSC high voltage [V] (Typ 2.5 V)
푉푂푆퐶퐿 is the OSC low voltage [V] (Typ 1.0 V)
(Example) If the OSC capacitor value is 330 pF, the OSC frequency is around 40.4 kHz
|
(
)|
(+40 휇)× −40 휇
푓
푂푆퐶
=
≒ ꢓꢁ.ꢓ [kHz]
(| )
ꢒꢒ0 푝× +40 휇 + −40 휇 × 2.5−1.0
| | |) (
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5. Speed Control – continued
5.3. Speed Control with PWM Input
The PWM signal input to the PWM pin controls the motor rotation speed. As shown in Figure 33, the command PWM
duty is determined by the PWM signal of the PWM pin. The OSC pin is connected to the GND.
REF
5.0V
2.5V
PWM
OSC
VREF
Disable
0.8V
0.0V
GNDOSC
PWM
High
PWM
Command
PWM Duty
Command
PWM Duty
Low
Figure 32. PWM Input Application
5.4. PWM Input Characteristics
Figure 33. Timing Chart of PWM Duty Generation in PWM Input
When the command PWM duty reaches 5 %(Typ) or more, the IC starts driving and outputs the PWM signal form
output pins (U, V, W). Also, when the PWM command duty becomes 1 % (Typ) or less, the IC stops driving and output
pins become low. In other areas, the output PWM duty is proportional to the command PWM duty.
100
5
1
0 1 5
100
Command PWM duty [%]
Figure 34. Output PWM Duty vs Command PWM Duty
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Description of Function Operating - continued
6. Under Voltage Lock Out Protection Function (UVLO)
The under voltage lock out protection function is a protection function to prevent unexpected operation such as large
current flow by turning output pins to OFF state in an extremely low supply voltage range deviating from normal operation.
When the supply voltage is 3.9 V (Typ) or less, the under voltage lock out circuit operates (UVLO ON) and output pins are
turned OFF. It returns to normal operation (UVLO OFF) when the supply voltage is 4.2 V (Typ) or more.
7. Lock Protection Function (Automatic Recovery)
When a motor is locked, the lock protection function (automatic recovery) is becoming output pins to low state for a certain
time (Lock detection OFF time, tOFF) so as not to keep flowing current through the coil, and then automatically recovers.
The position detection signals of each hall elements are toggling during the motor rotation. However, when the motor
locked, the position detection signal of each hall are not toggling. This is used to judge the motor lock state. In the
BD63282EFV, there are different lock judgement condition in sine start-up section and sine driving section. The lock
detection OFF time in motor lock state can selected by the LKT input voltage.
7.1. Lock Judgement Condition in Sine Start-up Section
After start-up normal rotation judgement section, when the switching of position detection signal from hall element is
not detected until 1.0 s(Typ), judged motor is locked and the lock protection function is started.
7.2. Lock Judgement Condition in Sine Driving Section
At the sine driving section, when the switching of the position detection signal of Hall element (H1) is not detected in
400ms(Typ), judged motor is locked and the lock protection function is started.
7.3. Setting of the Lock Detection OFF Time (tOFF) (LKT pin)
The LKT pin input voltage sets the lock detection OFF time (tOFF). The input voltage range and function is shown as
table 3.
Table 3. Lock Detection OFF Time (tOFF) and LKT Input Voltage (VCC=12 V)
Lock Detection Mode
LKT Pin Input Voltage [V] Lock Detection OFF Time
tOFF1 Mode
tOFF2 Mode
tOFF3 Mode
2.2 to VREF
1.2 to 1.8
0.0 to 0.8
5 s (Typ)
10 s (Typ)
2 s (Typ)
8. High Speed Rotation Protection Function and Low Speed Rotation Protection Function
The high speed rotation protection function and the low speed rotation protection function set output pins to low state for a
certain time (tOFF) so that the motor speed does not become uncontrollable by becoming faster or slower than expected,
and then automatically recovers. The speed protection function and the FG signal frequency condition is shown as Table
4.
Table 4. Speed Protection Function and FG Signal Frequency Condition
Speed Protection
Function
FG Signal Frequency
Condition
High Speed
Rotation Protection
Low Speed
Rotation Protection
1666.7 Hz (Typ) or more
2.5 Hz (Typ) or less
9. Lead Angle Control Setting (HPST pin)
The HPST pin input voltage sets the lead angle control setting. The input voltage range and lead angle mode is shown as
Table 5. The auto lead angle control function has been enabled when the auto lead angle mode is set. The fixed lead
angle control function has been enabled when the fixed lead angle mode is set. In the Fixed lead angle control mode, the
phase of the output voltage is controlled, to advance the phase of the current flowing through the motor coil by the setting
angle from the phase of input hall signal.
Table 5. Lead angle mode and HPST input voltage
Lead Angle Mode
HPST Pin Voltage [V]
3.85 to VREF
Auto Lead Angle
Control Mode
Fixed Lead Angle
Control Mode (25°)
Fixed Lead Angle
Control Mode (10°)
Fixed Lead Angle
Control Mode (0°)
2.60 to 3.65
1.35 to 2.40
0.00 to 1.15
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Thermal Resistance Model
Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which
indicates this heat dissipation capability (hardness of heat release) is called thermal resistance. Thermal resistance from the
chip junction to the ambient temperature is represented in θJA [°C/W], and thermal characterization parameter from junction to
the top center of the outside surface of the component package is represented in ΨJT [°C/W]. Thermal resistance is divide into
the package part and the substrate part. Thermal resistance in the package part depends on the composition materials such as
the mold resins and the lead frames. On the other hand, thermal resistance in the substrate part depends on the substrate heat
dissipation capability of the material, the size, and the copper foil area etc. Therefore, thermal resistance can be decreased by
the heat radiation measures like installing a heat sink etc. in the mounting substrate.
The thermal resistance model is shown in Figure 35 and equation is shown below.
Equation
푇푗−푇푎
Ambient temperature: Ta[°C]
휃퐽퐴 =
휓퐽푇 =
[°C/W]
[°C/W]
ꢔ
Package outside surface (top center)
temperature: Tt[°C]
푇푗−푇ꢕ
θJA[°C/W]
ꢔ
Where:
Junction temperature: Tj[°C]
ΨJT[°C/W]
휃퐽퐴 is the thermal resistance from junction to ambient
temperature [°C/W]
휓퐽푇 is the thermal characterization parameter from junction
to the top center of the outside surface of the component
package [°C/W]
Mounting Substrate
ꢖꢗ is the junction temperature [°C]
ꢖꢘ is the ambient temperature [°C]
ꢖ푡 is the package outside surface (top center)
temperature [°C]
Figure 35. Thermal Resistance Model of Surface Mount
푃
is the power consumption [W]
Even if it uses the same package, θJA and ΨJT are changed depending on the chip size, power consumption and the
measurement environments of the ambient temperature, the mounting condition and the wind velocity, etc.
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I/O Equivalence Circuits (Resistance Values are Typical)
1.VCC, GND pins
2. PWM pin
3. HPST pin
4. H1+, H2+, H3+,
H1-, H2-, H3- pins
VREF
VREF
VREF
H1+
VCC
H2+
H3+
H1-
H2-
H3-
200 kΩ
1 kΩ
1 kΩ
1 kΩ
HPST
100 kΩ
1 kΩ
PWM
GND
5. REF pin
6. OSC pin
7.SS pin
8. FG pin
VCC
VCC
1 kΩ
40 kΩ
30 Ω
FG
REF
SS
OSC
1 kΩ
1 kΩ
9. LKT pin
10. U,V,W,RNF pins
11. FR pin
VREF
VREF
VCC
VCC
VCC
VREF
90 kΩ
V
U
W
24 kΩ
200 kΩ
LKT
500 Ω
30 kΩ
FR
30 kΩ
30 kΩ
RNF
313 kΩ
Note for Content
Timing charts might be omitted or simplified to explain functional operation.
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Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all
power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to
back EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not
cause the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor
characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground
caused by large currents. Also ensure that the ground traces of external components do not cause variations on the
ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions.
The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of
connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always
be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent
damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 36. Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature
and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
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Ordering Information
B D 6
3
2
8
2 E
F
V -
E 2
Package
EFV:HTSSOP-B20
Part Number
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
HTSSOP-B20 (TOP VIEW)
Part Number Marking
LOT Number
6 3 2 8 2
Pin 1 Mark
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© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0H2H0C101900-1-2
08.Feb.2019 Rev.001
25/27
BD63282EFV
Physical Dimension and Packing Information
Package Name
HTSSOP-B20
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0H2H0C101900-1-2
26/27
08.Feb.2019 Rev.001
BD63282EFV
Revision History
Date
Revision
001
Changes
08.Feb.2019
New Release
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0H2H0C101900-1-2
27/27
08.Feb.2019 Rev.001
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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