BD63525AEFV_技术文档

Datasheet

Stepping Motor Driver series

Micro step 36V

Stepping Motor Drivers

BD63525AEFV

●General Description

● Major Characteristics

BD63525AEFV series are stepping motor drivers of

1/16 micro step(Sixteenth step) drive. As for its basic

function, it is a low power consumption bipolar PWM

constant current-drive driver with power supply rated

voltage of 36V and rated output current (DC) of 2.5A.

The input interface is CLK-IN type.

■

Range of power supply voltage

Rated output current

Rated output current (peak)

Range of operating temperature

Output ON resistance (total of upper

and lower resistors)

8～28 [V]

2.5 [A]

3.0 [A]

-25～+85 [℃]

0.35 [Ω] (Typ)

There are step modes of Full step & Half step, Quarter

step, Sixteenth step mode by internal DAC (D-A

converter), and for current decay mode, the ratio of

FAST DECAY & SLOW DECAY can be freely set, so the

optimum control conditions for every motor can be

realized. In addition, being able to drive with one system

of power supply makes contribution to the set design’s

getting easy.

● Package

HTSSOP-B28

W(Typ) x D(Typ)x H(Max)

9.70mm x 6.40mm x 1.00mm

● Features

1) Single power supply input (rated voltage of 36V)

2) Rated output current:(DC) 2.5A

3) Low ON resistance DMOS output

4) CLK-IN drive mode

5) PWM constant current control (other oscillation)

6) Built-in spike noise cancel function (external noise

filter is unnecessary)

● Basic application circuit

7) Full step, Half step, Quarter step, Sixteenth step

drive

GND

9

8) Timing free for changing step modes

9) Current decay mode switching function (linearly

variable FAST/SLOW DECAY ratio)

10) Normal rotation & reverse rotation switching

function

15

CLK

14

PS

CW_CCW

16

18

MODE0

MODE1 19

11) Power save function

20

ENABLE

12) Built-in logic input pull-down resistor

13) Power-on reset function

14) Thermal shutdown circuit (TSD)

15) Over current protection circuit (OCP)

16) Under voltage lock out circuit (UVLO)

17) Over voltage lock out ci

VCC1

7

VREF 13

OUT1A

5

2

OUT1B

RNF1

3

4

rcuit (OVLO)

18) Ghost Supply Prevention (protects against

malfunction when power supply is disconnected)

19) Adjacent pins short protection

20) Inverted mounting protection

21) Microminiature, ultra-thin and high heat-radiation

(exposed metal type) HTSSOP-B28 package

RNF1S

VCC2

22

OUT2A

CR

10

24

27

OUT2B

RNF2

26

25

MTH 12

● Application

RNF2S

GND

TEST

17

■

PPC, multi-function printer, laser beam printer, and

1

ink-jet printer

■

Monitoring camera and WEB camera

Sewing machine

Photo printer, FAX, scanner and mini printer

Toy and robot

Figure 1. BD63525AEFV application circuit diagram

○Product structure：silicon monolithic integrated circuit ○It is not the radiation-proof design for this product.

www.rohm.com

TSZ02201-0P2P0B701520-1-2

12.Jul.2017 Rev.002

1/23

TSZ22111・14・001

BD63525AEFV

● Terminals Configuration Diagram

28

27 OUT2B

26

25 RNF2S

1

2

3

4

5

NC

GND

TSD

OCP

15

CLK

CW_CCW

MODE0

GND

PS

16

18

19

20

9

OVLO

UVLO

OUT1B

RNF1

Translator

RESET

MODE1

14

RNF2

ENABLE

RNF1S

OUT1A

＋

－

VREF 13

4bit DAC

24

23

OUT2A

NC

VCC1

7

NC

6

7

8

OUT1A

＋

－

5

2

RNF1S

RNF2S

OUT1B

RNF1

VCC1

22 VCC2

21

3

＋

－

4 RNF1S

NC

GND

CR

Blank time

PWM control

VCC2

22

20 ENABLE

19 MODE1

9

10

11

12

13

14

OUT2A

CR

10

24

27

OSC

OUT2B

RNF2

26

25

Mix decay

control

MTH 12

NC

18

17

MODE0

TEST

RNF2S

GND

TEST

17

Regulator

1

MTH

VREF

PS

CW_CCW

CLK

16

15

Figure 3. BD63525AEFV Block Diagram

Figure 2. Terminals Configuration Diagram

● Descriptions on Terminals

Pin No.

Pin name

Function

Pin No.

15

Pin name

CLK

Function

Clock input terminal for advancing the

electrical angle.

Ground terminal

1

GND

H bridge output terminal

CW_CCW Motor rotating direction setting terminal

2

3

OUT1B

RNF1

RNF1S

OUT1A

NC

16

17

18

19

20

21

22

23

24

25

26

27

28

Connection terminal of resistor for

output current detection

Terminal for testing

TEST1

(Used by connecting with GND)

Input

terminal

of

current

limit

Motor excitation mode setting terminal

Output enable terminal

4

MODE0

MODE1

ENABLE

NC

comparator

H bridge output terminal

Non connection

5

6

Power supply terminal

Non connection

7

VCC1

NC

Power supply terminal

8

VCC2

NC

Ground terminal

Non connection

9

GND

CR

Connection terminal of CR for setting

chopping frequency

H bridge output terminal

10

11

12

13

14

OUT2A

RNF2S

RNF2

OUT2B

NC

Input terminal of current limit comparator

NC

Non connection

Connection terminal of resistor for output

current detection

Current decay mode setting terminal

Output current value setting terminal

Power save terminal

MTH

VREF

PS

H bridge output terminal

Non connection

www.rohm.com

TSZ02201-0P2P0B701520-1-2

12.Jul.2017 Rev.002

2/23

TSZ22111・15・001

BD63525AEFV

● Absolute Maximum Rated Values (Ta=25℃)

Item

Symbol

V_CC1,2

Rated Value

Unit

Supply voltage

-0.3～+36.0

V

1

1.45^※

W

Power dissipation

Pd

2

4.70^※

W

Input voltage for control pin

RNF maximum voltage

V_IN

V_RNF

I_OUT

-0.3～+7.0

V

0.7

3

Maximum output current (DC)

Maximum output current (peak)

Operating temperature range

Storage temperature range

Junction temperature

2.5^※

A/Phase

℃

4

※

3

I_OUTPEAK

T_opr

3.0^※

-25～+85

-55～+150

+150

T_stg

℃

T_jmax

°C

1

2

3

4

※

70mm×70mm×1.6mm glass epoxy board. Derating in done at 11.6mW/°C for operating above Ta=25°C.

4-layer recommended board. Derating in done at 37.6mW/°C for operating above Ta=25°C.

Do not, however exceed Pd, ASO and Tjmax=150°C.

pulth width tw≦1ms,duty20%

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over

the absolute maximum ratings.

●Recommended operating range (Ta= -25～+85℃)

Item

Supply voltage

Symbol

V_CC1,2

V_IN

Rated Value

8～28

Unit

V

Input voltage for control pin

0～+5.5

5

Maximum Output current (DC)

I_OUT

2.0^※

A/ Phase

5

※

Not exceeding Pd，ASO or Tj=150℃

www.rohm.com

TSZ22111・15・001

TSZ02201-0P2P0B701520-1-2

12.Jul.2017 Rev.002

3/23

BD63525AEFV

●Electrical Characteristics (Unless otherwise specified Ta=25℃, VCC1,2=24V)

Specification

Item

Symbol

Unit

Condition

Minimum Standard Maximum

[Whole]

Circuit current at standby

Circuit current

I_CCST

I_CC

-

10

uA

PS=L

2.0

4.5

mA

PS=H, VREF=3V

[Control input] (CW_CCW, MODE0, MODE1, ENABLE, PS)

H-level input voltage

L-level input voltage

H-level input current

L-level input current

[Control input] (CLK)

H-level input voltage

L-level input voltage

H-level input current

L-level input current

V_IN1H

V_IN1L

I_IN1H

I_IN1L

2.0

-

V

0.8

100

-

35

-10

50

0

µA

V_IN1=5V

V_IN1=0V

V_IN2H

V_IN2L

I_IN2H

I_IN2L

2.4

-

V

0.6

100

-

35

-10

50

0

µA

V_IN2=5V

V_IN2=0V

[Output (OUT1A, OUT1B, OUT2A, OUT2B)]

I_OUT=±2.0A

Output ON resistance

R_ON

-

0.35

-

0.50

10

Ω

(Sum of upper and lower)

Output leak current

[Current control]

I_LEAK

µA

RNFXS input current

IRNFS

I_RNF

-2.0

-80

-2.0

0

-0.1

-40

-0.1

-

µA

V

RNFXS=0V

RNFx=0V

VREF=0V

RNFx input current

VREF input current

I_VREF

V_VREF

I_MTH

-

VREF input voltage range

MTH input current

3.0

-

-2.0

0

-0.1

-

µA

V

MTH=0V

MTH input voltage range

V_MTH

3.5

Minimum ON time

(Blank time)

t_ONMIN

V_CTH1

V_CTH2

V_CTH3

0.3

0.8

1.5

µs

V

C=1000pF, R=39kΩ

VREF=3V, 100%

Comparator threshold 1

Comparator threshold 2

Comparator threshold 3

0.570

0.403

0.196

0.600

0.424

0.230

0.630

0.445

0.264

V

VREF=3V, 70.71%

VREF=3V, 38.27%

V

www.rohm.com

TSZ02201-0P2P0B701520-1-2

12.Jul.2017 Rev.002

4/23

TSZ22111・15・001

BD63525AEFV

●Function explanation

○CLK／Clock input terminal for advancing the electrical angle

CLK is reflected at rising edge. The Electrical angle advances by one for each CLK input.

Motor’s misstep will occur if noise is picked up at the CLK terminal, so please design the pattern in such a way that there is

no noise plunging.

○MODE0,MODE1/Motor excitation mode setting terminal

Set the step mode.

MODE0

MODE1

Step mode

Full step

L

H

L

Half step

H

Quarter step

1/16 step

H

Unrelated to CLK, change in setting is forcibly reflected (refer to P.14).

○CW_CCW Terminal／Motor rotating direction setting

Set the motor’s rotating direction. Change in setting is reflected at the CLK rising edge immediately after the change in

setting (refer to P.13)

CW_CCW

Rotating direction

L

Clockwise (CH2’s current is outputted with a phase lag of 90°in regard to CH1’s current)

Counter Clockwise(CH2’s current is outputted with a phase lead of 90°in regard to CH1’s current)

H

○ENABLE Terminal／Output enable terminal

Turn off forcibly all the output transistors (motor output is open).

When ENABLE=L, input to CLK is blocked, and phase advance operation of internal translator circuit is stopped.

However, during excitation modes (MODE0,MODE1) switch within the interval of ENABLE=L, as ENABLE=L→H is reset,

the new mode upon switch will be applied for excitation (See P.14).

ENABLE

Motor Output

OPEN (electrical angle maintained)

ACTIVE

L

H

○PS／Power save terminal

PS can make circuit standby state and make motor output OPEN. In standby state, translator circuit is reset (initialized) and

electrical angle is initialized.

Please be careful because there is a delay of 40μs(max.) before it is returned from standby state to normal state and the

motor output becomes ACTIVE (refer to P.11).

PS

Status

Standby state(RESET)

ACTIVE

L

H

The electrical angle (initial electrical angle) of each excitation mode immediately after RESET is as follows

(refer to P.12).

Step mode

Initial electrical angle

Full step

45°

Half step

Quarter step

1/16 step

○TEST/ Terminal for testing

This is the terminal used at the time of shipping test. Please connect to GND. Please be careful because there is a

possibility of malfunction if GND unconnected.

www.rohm.com

TSZ02201-0P2P0B701520-1-2

12.Jul.2017 Rev.002

5/23

TSZ22111・15・001

BD63525AEFV

○VCC1,VCC2／Power supply terminal

Motor’s drive current is flowing in it, so please wire in such a way that the wire is thick & short and has low impedance.

Voltage VCC may have great fluctuation, so please arrange the bypass capacitor of about 100μ～470μF as close to the

terminal as possible and adjust in such a way that the voltage VCC is stable. Please increase the capacity if needed

especially when a large current is used or those motors that have great back electromotive force are used.

In addition, for the purpose of reducing of power supply’s impedance in wide frequency bandwidth, parallel connection of

multi-layered ceramic capacitor of 0.01μ～0.1μF etc is recommended. Extreme care must be used to make sure that the

voltage VCC does not exceed the rating even for a moment.

VCC1 & VCC2 are shorted inside IC, so please be sure to short externally VCC1 & VCC2 when using. If used without

shorting, malfunction or destruction may occur because of concentration of current routes etc., so please make sure that

they are shorted when in use. Still more, in the power supply terminal, there is built-in clamp component for preventing of

electrostatic destruction. If steep pulse or voltage of surge more that maximum absolute rating is applied, this clamp

component operates, as a result there is the danger of destruction, so please be sure that the maximum absolute rating

must not be exceeded. It is effective to mount a Zener diode of about the maximum absolute rating. Moreover, the diode for

preventing of electrostatic destruction is inserted between VCC terminal and GND terminal, as a result there is the danger

of IC destruction if reverse voltage is applied between VCC terminal and GND terminal, so please be careful.

○GND／Ground terminal

In order to reduce the noise caused by switching current and to stabilize the internal reference voltage of IC, please wire in

such a way that the wiring impedance from this terminal is made as low as possible to achieve the lowest electrical potential

no matter what operating state it may be. Moreover, please design patterns not to have any common impedance with other

GND patterns.

○OUT1A,OUT1B,OUT2A,OUT2B／H Bridge output terminal

Motor’s drive current is flowing in it, so please wire in such a way that the wire is thick & short and has low impedance. It is

also effective to add a Schottky diode if output has positive or negative great fluctuation when large current is used etc, for

example, if counter electromotive voltage etc. is great. Moreover, in the output terminal, there is built-in clamp component

for preventing of electrostatic destruction. If steep pulse or voltage of surge more than maximum absolute rating is applied,

this clamp component operates, as a result there is the danger of even destruction, so please be sure that the maximum

absolute rating must not be exceeded.

○RNF1,RNF2／Connection terminal of resistor for detecting of output current

Please connect the resistor of 0.1Ω～0.3Ω for current detection between this terminal and GND In view of the power

consumption of the current-detecting resistor, please determine the resistor in such a way that W=I^OUT2･R[W] does not

exceed the power dissipation of the resistor. In addition, please wire in such a way that it has a low impedance and does

not have a impedance in common with other GND patterns because motor’s drive current flows in the pattern through RNF

terminal～current-detecting resistor～GND. Please do not exceed the rating because there is the possibility of circuits’

malfunction etc. if RNF voltage has exceeded the maximum rating (0.7V). Moreover, please be careful because if RNF

terminal is shorted to GND, large current flows without normal PWM constant current control, then there is the danger that

OCP or TSD will operate. If RNF terminal is open, then there is the possibility of such malfunction as output current does

not flow either, so please do not let it open.

○RNF1S,RNF2S/ Input terminal of current limit comparator

In this series, RNFS terminal, which is the input terminal of current limit comparator, is independently arranged in order to

decrease the lowering of current-detecting accuracy caused by the wire impedance inside the IC of RNF terminal.

Therefore, please be sure to connect RNF terminal and RNFS terminal together when using in the case of PWM constant

current control. In addition, because the wires from RNFS terminal is connected near the current-detecting resistor in the

case of interconnection, the lowering of current-detecting accuracy, which is caused by the impedance of board pattern

between RNF terminal and the current-detecting resistor, can be decreased. Moreover, please design the pattern in such a

way that there is no noise plunging. In addition, please be careful because if terminals of RNF1S & RNF2S are shorted to

GND, large current flows without normal PWM constant current control and, then there is the danger that OCP or TSD will

operate.

○VREF／Output current value setting terminal

This is the terminal to set the output current value. The output current value can be set by VREF voltage and

current-detecting resistor (RNF resistor).

Output current I_OUT[A] = {VREF[V] / 5} / RNF[Ω]・・・（Half step, Quarter step, 1/16step）

Output current I_OUT[A] = {VREF[V] / 5}＊0.7071 / RNF[Ω]・・・（Full step）

Please avoid using it with VREF terminal open because if VREF terminal is open, the input is unsettled, and the VREF

voltage increases, and then there is the possibility of such malfunctions as the setting current increases and a large

current flows etc. Please keep to the input voltage range because if the voltage of over 3V is applied on VREF terminal,

then there is also the danger that a large current flows in the output and so OCP or TSD will operate. Besides, please

take into consideration the outflow current (max.2µA) if inputted by resistance division when selecting the resistance

value. The minimum current, which can be controlled by VREF voltage, is determined by motor coil’s L & R values and

minimum ON time because there is a minimum ON time in PWM drive.

www.rohm.com

TSZ02201-0P2P0B701520-1-2

12.Jul.2017 Rev.002

6/23

TSZ22111・15・001

BD63525AEFV

○CR／Connection terminal of CR for setting chopping frequency

This is the terminal to set the chopping frequency of output. Please connect the external C(470p～1500pF) and R(10k～

200kΩ) between this terminal and GND. Please refer to P9. Please interconnect from external components to GND in such

a way that the interconnection does not have impedance in common with other GND patterns. In addition, please carry out

the pattern design in such ways as keeps such steep pulses as square wave etc. away and that there is no noise plunging.

Please mount the two components of C and R if being used by PWM constant current control because normal PWM

constant current control becomes impossible if CR terminal is open or it is biased externally.

○MTH/ Current decay mode-setting terminal

This is the terminal to set the current decay mode. Current decay mode can be optionally set according to input voltage.

MTH terminal input voltage [V]

Current decay mode

SLOW DECAY

MIX DECAY

0~0.3

0.4~1.0

1.5~3.5

FAST DECAY

Please connect to GND if using at SLOW DECAY mode.

Please avoid using with MTH terminal open because if MTH terminal is open, the input is unsettled, and then there is the

danger that PWM operation becomes unstable. Besides, please take into consideration the outflow current (max.2µA) if

inputted by resistance division when selecting the resistance value.

○NC terminal

This terminal is unconnected electrically with IC internal circuit.

○IC back metal

For HTSSOP-B28 package, the heat-radiating metal is mounted on IC’s back side, and on the metal the heat-radiating

treatment is performed when in use, which becomes the precondition to use, so please secure sufficiently the

heat-radiating area by surely connecting by solder with the GND plane on the board and getting as wide GND pattern as

possible. Please be careful because the allowable loss as shown in P.20 cannot be secured if not connected by solder.

Moreover, the back side metal is shorted with IC chip’s back side and becomes the GND potential, so there is the danger

of malfunction and destruction if shorted with potentials other than GND, therefore please absolutely do not design

patterns other than GND through the IC’s back side.

www.rohm.com

TSZ02201-0P2P0B701520-1-2

12.Jul.2017 Rev.002

7/23

TSZ22111・15・001

BD63525AEFV

○Thermal Shutdown (TSD)

This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises above

175℃(Typ), the motor output becomes OPEN. Also, when the temperature returns to under 150℃ (Typ), it

automatically returns to normal operation. However, even when TSD is in operation, if heat is continued to be added

externally, heat overdrive can lead to destruction.

○Over Current Protection (OCP)

This IC has a built in over current protection circuit as a provision against destruction when the motor outputs are

shorted each other or VCC-motor output or motor output-GND is shorted. This circuit latches the motor output to OPEN

condition when the regulated threshold current (Target:5A,25℃, typ) flows for 4μs (Typ). It returns with power

reactivation or a reset of the PS terminal. The over current protection circuit’s only aim is to prevent the destruction of

the IC from irregular situations such as motor output shorts, and is not meant to be used as protection or security for

the set. Therefore, sets should not be designed to take into account this circuit’s functions. After OCP operating, if

irregular situations continues and the return by power reactivation or a reset of the PS terminal is carried out repeatedly,

then OCP operates repeatedly and the IC may generate heat or otherwise deteriorate. When the L value of the wiring

is great due to the wiring being long, after the over current has flowed and the output terminal voltage jumps up and the

absolute maximum values may be exceeded and as a result, there is a possibility of destruction. Also, when current

which is over the output current rating and under the OCP detection current flows, the IC can heat up to over

T_jmax=150℃and can deteriorate, so current which exceeds the output rating should not be applied.

○Under Voltage Lock Out (UVLO)

This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power supply

under voltage. When the applied voltage to the VCC terminal goes under 5V (Typ), the motor output is set to OPEN.

This switching voltage has a 1V (Typ) hysteresis to prevent false operation by noise etc. Please be aware that this

circuit does not operate during power save mode. Also, the electrical angle is reset when the UVLO circuit operates

during CLK-IN drive mode.

○Over Voltage Lock Out (OVLO)

This IC has a built-in over voltage lock out function to protect the IC output and the motor during power supply over

voltage. When the applied voltage to the VCC terminal goes over 32V (Typ), the motor output is set to OPEN. This

switching voltage has a 1V (Typ) hysteresis and a 4μs (Typ) mask time to prevent false operation by noise etc.

Although this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum

value for power supply voltage is exceeded, therefore the absolute maximum value should not be exceeded. Please be

aware that this circuit does not operate during power save mode.

○Ghost Supply Prevention (protects against malfunction when power supply is disconnected)

If a signal (logic input, MTH, VREF) is input when there is no power supplied to this IC, there is a function which

prevents the false operation by voltage supplied via the electrostatic destruction prevention diode from these input

terminals to the VCC to this IC or to another IC’s power supply. Therefore, there is no malfunction of the circuit even

when voltage is supplied to these input terminals while there is no power supply.

www.rohm.com

TSZ02201-0P2P0B701520-1-2

12.Jul.2017 Rev.002

8/23

TSZ22111・15・001

BD63525AEFV

○PWM Constant current control

1) Current control operation

When the output transistor is turned on, the output current increases, raising the voltage over the current sense resistor.

When the voltage on the RNF pin reaches the voltage value set by the internal 2-bit DAC and the VREF input voltage, the

current limit comparator engages and enters current decay mode. The output is then held off for a period of time

determined by the RC time constant connected to the CR pin. The process repeats itself constantly for PWM operation.

2) Noise-masking function

In order to avoid misdetection of output current due to RNF spikes that may occur when the output turns ON, the IC

employs an automatic current detection-masking period (t^ONMIN), during which current detection is disabled immediately

after the output transistor is turned on. This allows for constant-current drive without the need for an external filter. This

noise-masking period defines the minimum ON-time for the motor output transistor.

3) CR Timer

The CR filter connected to the CR pin is repeatedly charged and discharged between the VCRH and VCRL levels. The

output of the internal comparator is masked while charging from VCRL to VCRH in order to cancel noise. (As mentioned

above, this period defines the minimum ON-time of the motor output transistor.) The CR terminal begins discharging once

the voltage reaches VCRH. When the output current reaches the current limit during this period (i.e. RNF voltage reaches

the decay trigger voltage), then the IC enters decay mode. The CR continues to discharge during this period until it reaches

VCRL, at which point the IC output is switched back ON. The current output and CR pin begin charging simultaneously.

The CR charge time (t^ONMIN) and discharge time (tdischarge) are set by external components, according to the following

formulas. The total of t^ONMINand tdischarge yield the chopping period, tchop.

t^ONMIN[s]≒C･R'･R / (R'+R)･ln[(VCR-0.4)/(VCR-1.0)]

0.30

VCR=V･R/(R'+R)

V: internal regulator voltage 5V(Typ)

0.25

R': CR terminal internal impedance 5kΩ(Typ)

0.20

t^discharge[s]≒C･R･ln[(1+α)/0.4]

0.15

α:See the right graph.

0.10

tCHOP[s]≒tONMIN + tdischarge

0.05

0.00

0

500

1000

Cꢀ[pF]

1500

2000

Spike noise

Current limit Value

0mA

Output current

RNF Voltage

Current limit Value

GND

VCRH(1.0V typ)

CR Voltage

VCRL(0.4V typ)

GND

Discharge time

t_discharge

Chopping Period

t_CHOP

Minimum ON Time

t_ONMIN

Figure 4 Timing chart of CR voltage, RNF voltage and output current

Attach a resistor of at least 10 kΩ to the CR terminal (10 kΩ~200 kΩ recommended) as lower values may keep the RC from

reaching the VCRH voltage level. A capacitor in the range of 470 pF – 1500 pF is also recommended. As the capacitance

value is increased, however, the noise-masking period (t^onmin) also increases, and there is a risk that the output current may

exceed the current limit threshold due to the internal L and R components of the output motor coil. Also, ensure that the

chopping period (t^chop) is not set longer than necessary, as doing so will increase the output ripple, thereby decreasing the

average output current and yielding lower output rotation efficiency. The optimal value should reduce the motor drive noise

while keeping distortion of the output current waveform to a minimum.

www.rohm.com

TSZ02201-0P2P0B701520-1-2

12.Jul.2017 Rev.002

9/23

TSZ22111・15・001

BD63525AEFV

○Current decay mode

The IC allows for a mixed decay mode in which the ratio of fast and slow decay can be optionally set.

The following diagrams show the operating state of each transistor and the regenerative current path during attenuation for

each decay mode:

FAST DECAY

SLOW DECAY

OFF→OFF

ON→ON

OFF

ON→OFF

OFF→ON

ON→OFF

OFF→ON

M

ON→OFF

Output current path

Current decay path

Figure 5. Route of Regenerated Current during Current Decay

The merits of each decay mode are as follows:

○SLOW DECAY

During current attenuation, the voltage between motor coils is small and the regeneration current decreases slowly,

decreasing the output current ripple. This is favorable for keeping motor torque high. However, due to fall-off of current

control characteristics in the low-current region, or due to reverse EMF of the output motors exhibited when using

high-pulse-rate half-step, Sixteenth-step or Sixteenth-step modes, the output current increases, distorting the output

current waveform and increasing motor vibration. Thus, this decay mode is most suited to full-step modes, or

low-pulse-rate half-step, Sixteenth-step or Sixteenth-step modes.

○FAST DECAY

Fast decay decreases the regeneration current much more quickly than slow decay, greatly reducing distortion of the

output current waveform. However, fast decay yields a much larger output current ripple, which decreases the overall

average current running through the motor. This causes two problems: first, the motor torque decreases (increasing the

current limit value can help eliminate this problem, but the rated output current must be taken into consideration); and

second, the power loss within the motor increases and thereby radiates more heat. If neither of these problems is of

concern, then fast decay can be used for high-pulse rate half-step, Sixteenth-step or Sixteenth-step drive.

Additionally, this IC allows for a mixed decay mode that can help improve upon problems that arise from using fast or slow

decay alone. In this mode, the IC switches automatically between slow and fast decay, improving the current control

characteristics without increasing the output current ripple. The ratio of fast to slow decay is set externally via the voltage

input to the MTH pin; therefore, the optimal mix of slow and fast decay can be achieved for each application. Mixed decay

mode operates by splitting the decay period into two sections, the first X%(t1-t2) of which operates the IC in slow decay

mode, and the remainder(t2-t3) of which operates in fast decay mode. However, if the output current (i.e., the voltage on the

RNF pin) does not reach the set current limit during the first X% (t1-t2) decay period, the IC operates in fast decay mode

only.

t1

t2

t3

1.0V

CR voltage

MTH voltage

0.4V

GND

chopping period t_chop

SLOW DECAY

Output current

Current limit value

MTH voltage [V]

Current decay mode

SLOW DECAY

MIX DECAY

0~0.3

0.4~1.0

1.5~3.5

FAST DECAY

0

FAST DECAY

Figure.6 Relation between CR terminal voltage, MTH voltage, and output current during mixed decay

www.rohm.com

TSZ02201-0P2P0B701520-1-2

12.Jul.2017 Rev.002

10/23

TSZ22111・15・001

BD63525AEFV

●Translator circuit

This series builds in translator circuit and can drive stepping motor in CLK-IN mode.

The operation of the translator circuit in CLK-IN drive mode is described as below.

○Reset operation

The translator circuit is initialized by power ON Reset function and PS terminal.

・Initializing operation when power supply is turned on

①If power supply is turned on at PS=L (Please use this sequence as a general rule)

When power supply is turned on, the power ON reset function operates in IC and initialized, but as long as it is PS=L,

the motor output is the OPEN state. After power supply is turned on, because of the changing of PS=L⇒H, the motor

output becomes the ACTIVE state, and the excitation is started at the initial electrical angle.

But at the time of PS=L⇒H, it returns from the standby state to the normal state and there is a delay of 40μs(max.)

until the motor output has become the ACTIVE state.

Reset is released

ACTIVE

①

②

Delay

PS

CLK

OUT1A

OUT1B

Motor output OPEN

②If power supply is turned on at PS=H

Motor output ON

When power supply is turned on, the power ON function in IC operates, and initialized before the motor output

becomes the ACTIVE state, and the excitation is started at the initial electrical angle.

・Initializing operation during motor operating

Please input the reset signal to PS terminal when the translator circuit is initialized during motor operating. (Refer to

P.14) But at the time of PS=L⇒H, it returns from the standby state to the normal state and there is a delay of 40μs

(max.) until the motor output has become the ACTIVE state, so please be careful.

○Control input timing

Please input as shown below because the translator circuit operates at the rising edge of CLK signal. If you disobey this

timing and input, then there is the possibility that the translator circuit does not operate as expected. In addition, at the time

of PS=L⇒H, it returns from the standby state to the normal state and there is a delay of 40μs (max.) until the motor output

has become the ACTIVE state, so within this delay interval there is no phase advance operation even if CLK is inputted.

A

PS

B

C

CLK

MODE0

MODE1

D

E

F

G

CW_CCW

ENABLE

A:PS minimum input pulse width･･････20μs

B:PS rising edge～CLK rising edge input possible maximum delay time･･････40μs

C:CLK minimum period･･････4μs

D:CLK minimum input H pulse width･･････2μs

E:CLK minimum input L pulse width･･････2μs

F:MODE0,MODE1,CW_CCW,ENABLE set-up time･･････1μs

G:MODE0,MODE1,CW_CCW,ENABLE hold time･･････1μs

www.rohm.com

TSZ02201-0P2P0B701520-1-2

12.Jul.2017 Rev.002

11/23

TSZ22111・15・001

BD63525AEFV

●Step sequence table(CW_CCW=L、Initial electrical angle=step angle 45°)

Full step

Half step

Quarter step

1/16 step

ch1 current[%] ch2 current[%] step angle[°]

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

9

100.00

99.52

98.08

95.69

92.39

88.19

83.15

77.30

70.71

63.44

55.56

47.14

38.27

29.03

19.51

9.80

0.00

9.80

0.0

5.6

11.3

16.9

22.5

28.1

33.8

39.4

45.0

50.6

56.3

61.9

67.5

73.1

78.8

84.4

90.0

19.51

29.03

38.27

47.14

55.56

63.44

70.71

77.30

83.15

88.19

92.39

95.69

98.08

99.52

100.00

99.52

98.08

95.69

92.39

88.19

83.15

77.30

70.71

63.44

55.56

47.14

38.27

29.03

19.51

9.80

2

3

1

2

3

4

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

4

5

0.00

-9.80

95.6

-19.51

-29.03

-38.27

-47.14

-55.56

-63.44

-70.71

-77.30

-83.15

-88.19

-92.39

-95.69

-98.08

-99.52

-100.00

-99.52

-98.08

-95.69

-92.39

-88.19

-83.15

-77.30

-70.71

-63.44

-55.56

-47.14

-38.27

-29.03

-19.51

-9.80

101.3

106.9

112.5

118.1

123.8

129.4

135.0

140.6

146.3

151.9

157.5

163.1

168.8

174.4

180.0

185.6

191.3

196.9

202.5

208.1

213.8

219.4

225.0

230.6

236.3

241.9

247.5

253.1

258.8

264.4

270.0

275.6

281.3

286.9

292.5

298.1

303.8

309.4

315.0

320.6

326.3

331.9

337.5

343.1

348.8

354.4

6

7

8

9

0.00

-9.80

-19.51

-29.03

-38.27

-47.14

-55.56

-63.44

-70.71

-77.30

-83.15

-88.19

-92.39

-95.69

-98.08

-99.52

-100.00

-99.52

-98.08

-95.69

-92.39

-88.19

-83.15

-77.30

-70.71

-63.44

-55.56

-47.14

-38.27

-29.03

-19.51

-9.80

10

11

12

13

14

15

16

0.00

9.80

19.51

29.03

38.27

47.14

55.56

63.44

70.71

77.30

83.15

88.19

92.39

95.69

98.08

99.52

www.rohm.com

TSZ02201-0P2P0B701520-1-2

12.Jul.2017 Rev.002

12/23

TSZ22111・15・001

BD63525AEFV

・Reset timing chart (FULL STEP, MODE0=L, MODE1=L, CW_CCW=L, ENABLE=H)

If the terminal PS is input to L, the reset operation is done with regardless of other input signals when reset the translator

circuit while motor is working. At this time, IC internal circuit enters the standby mode, and makes the motor output

OPEN.

RESET

①

②

③

①

②

PS

CLK

OUT1A

OUT1B

OUT2A

OUT2B

IOUT(CH1)

IOUT(CH2)

・CW_CCW Switch timing chart (FULL STEP, MODE0=L, MODE1=L, ENABLE=H)

The switch of CW_CCW is reflected by the rising edge of CLK that comes immediately after the changes of the

CW_CCW signal. However, depending on the state of operation of the motor at the switch the motor cannot follow even if

the control on driver IC side is correspondent and there are possibilities of step-out and mistake step in motor, so please

evaluate the sequence of the switch enough.

CW

CCW

①

②

③

②

①

PS

CW_CCW

CLK

OUT1A

OUT1B

OUT2A

OUT2B

IOUT(CH1)

IOUT(CH2)

・

www.rohm.com

TSZ02201-0P2P0B701520-1-2

12.Jul.2017 Rev.002

13/23

TSZ22111・15・001

BD63525AEFV

・ENABLE Switch timing chart (FULL STEP, MODE0=L, MODE1=L)

The switch of the ENABLE signal is reflected by the change in the ENABLE signal with regardless of other input signals.

In the section of ENABLE=L, the motor output becomes OPEN and the electrical angle doesn't advance. Because the

translator circuit stop and CLK input is canceled. Therefore, the progress of ENABLE=L→H is completed before the input of

ENABLE=L. Excitation mode (MODE0, MODE1) also switches within ENABLE=L interval. Where excitation mode switched

within ENABLE=L interval, restoring of ENABLE=L→H was done in the excitation mode after switch.

Output off & Translator stop

①

②

③

PS

ENABLE

CLK

OUT1A

OUT1B

OUT2A

OUT2B

100%

IOUT(CH1)

IOUT(CH2)

-100%

100%

-100%

Restoring in the state prior to input of ENABLE=L

・

About the switch of the motor excitation mode

The switch of the excitation mode can be done with regardless of the CLK signal at the same time as changing of the

signal MODE0 and MODE1. The following built-in function can prevent motor out-of-step caused by discrepancies of

torque vector of transitional excitations during switch between excitation modes. However, due to operation state of motor

during switch, motor may not act following control on IC side of controller, and thereby lead to out-of-step or miss step.

Therefore, switch sequence shall be evaluated sufficiently before any decision.

・Cautions of bidirectional switch of CW_CCW and excitation modes (MODE0, MODE1)

As shown in the figure below, the area between the end of reset discharge (PS=L→H) and beginning of the first CLK signal

input is defined as interval A, while the area post the end of the first CLK signal input is defined as interval B.

Interval A

=> For CW_CCW, no limitation is applied on switch of excitation mode.

Interval B

=> In CLK1 period, or within ENABLE=L interval, CW_CCW and excitation mode can’t be switched together.

Violation of this restriction may lead to false step (with one extra leading phase) or out-of-step.

Therefore, in case that CW_CCW and excitation modes are switched simultaneously, PS terminal must be input with

reset signal. Then start to operate in interval A before carrying out such bidirectional switch.

interval A

interval B

PS

CLK

www.rohm.com

TSZ02201-0P2P0B701520-1-2

12.Jul.2017 Rev.002

14/23

TSZ22111・15・001

BD63525AEFV

●Power dissipation

Please confirm that the IC’s chip temperature Tj is not over 150℃, while considering the IC’s power consumption (W),

package power (Pd) and ambient temperature (Ta). When Tj=150℃ is exceeded the functions as a semiconductor do not

operate and problems such as parasitism and leaks occur. Constant use under these circumstances leads to deterioration

and eventually destruction of the IC. Tjmax=150℃ must be strictly obeyed under all circumstances.

○Thermal Calculation

The IC’s consumed power can be estimated roughly with the power supply voltage (V^CC), circuit current (ICC), output ON

resistance (R^ONH､RONL) and motor output current value (IOUT).

The calculation method during FULL STEP drive, SLOW DECAY mode is shown here:

Consumed power of the Vcc [W] = V^CC[V]･ICC [A] ･･･････①

Consumed power of the output DMOS [W] = (R_ONH[Ω] + R_ONL[Ω])･I_OUT[A]²･2[ch]･on_duty

During output ON

+ (2･R_ONL[Ω])･I_OUT[A]²･2[ch]･(1 - on_duty) ･･･････②

During current decay

However, on duty: PWM on duty = t^on/ (tchop)

t^onvaries depending on the L and R values of the motor coil and the current set value. Please confirm by actual

measurement, or make an approximate calculation.

t^chopis the chopping period, which depends on the external CR. See P.9 for details.

Upper PchDMOS ON Resistance

Lower NchDMOS ON Resistance

IC number

R^ONH[Ω] (Typ)

RONL[Ω] (Typ)

BD63525AEFV

0.20

0.15

Consumed power of total IC W_total [W] = ① + ②

Junction temperature Tj = Ta[℃] + θ^ja[℃/W]･W_total [W]

However, the thermal resistance valueθja [℃/W] differs greatly depending on circuit board conditions. Refer to the derating

curve on P.20.Also, we are taking measurements of thermal resistance valueθ^jaof boards actually in use. Please feel free

to contact our salesman. The calculated values above are only theoretical. For actual thermal design, please perform

sufficient thermal evaluation for the application board used, and create the thermal design with enough margin to not

exceed Tjmax=150℃.Although unnecessary with normal use, if the IC is to be used under especially strict heat conditions,

please consider externally attaching a Schottky diode between the motor output terminal and GND to abate heat from the

IC.

○Temperature Monitoring

In respect of BD63525AEFV, there is a way to directly measure the approximate chip temperature by using the TEST terminal

with a protection diode for prevention from electrostatic discharge. However, temperature monitor using this TEST terminal is

only for evaluation and experimenting, and must not be used in actual usage conditions.

(1) Measure the terminal voltage when a current of Idiode=50μA flows from the TEST terminal to the GND, without

supplying VCC to the IC. This measurement is of the Vf voltage inside the diode.

(2) Measure the temperature characteristics of this terminal voltage. (Vf has a linear negative temperature factor against

the temperature.) With the results of these temperature characteristics, chip temperature may be calibrated from the

TEST terminal voltage.

(3) Supply VCC, confirm the TEST terminal voltage while running the motor, and the chip temperature can be

approximated from the results of (2).

VCC

-Vf[mV]

Internal circuit

TEST

Internal circuit

Idiode

V

25

150 Chip temperature T_j[℃]

Figure 7. Model diagram for measuring chip temperature

www.rohm.com

TSZ22111・15・001

TSZ02201-0P2P0B701520-1-2

12.Jul.2017 Rev.002

15/23

BD63525AEFV

●Example for applied circuit

Logic input terminal.

Refer to P.5 for detail.

Power save terminal

Refer to P.5 for detail.

OVLO

TSD

Regulator

OCP

15

16

18

19

CLK

GND

PS

CW_CCW

MODE0

MODE1

9

Translator

14

RESET

UVLO

ENABLE 20

＋

－

VREF 13

4bit DAC

Bypass capacitor.

Set the output currenet.

Input by resistor divison.

Refer to P.6 for detail.

Setting range is

100uF~470uF(electrolytic)

0.01uF~0.1uF(multilayer ceramic etc.)

Refer to P.6 for detail.

VCC1

7

OUT1A

＋

－

5

2

Be sure to short VCC1 & VCC2.

RNF1S

RNF2S

OUT1B

RNF1

Set the chopping frequency.

Setting range is

C:470pF~1500pF

R:10kΩ~200kΩ

Refer to P.9 for detail.

3

4

＋

－

0.2Ω

100µF

0.1µF

RNF1S

VCC2

Blank time

PWM control

22

OUT2A

CR

10

24

27

Resistor for current. detecting.

Setting range is

0.1Ω~0.3Ω.

OSC

39kΩ

1000pF

OUT2B

RNF2

26

25

Refer to P.6 for detail.

Mix decay

control

0.2Ω

MTH 12

RNF2S

GND

Set the current decay mode.

①SLOW DECAY

⇒Connect to GND.

TEST

17

1

②MIX DECAY

⇒Input by resistor divison.

Refer to P.10 for detail.

Resistor for current. detecting.

Setting range is

0.1Ω~0.3Ω.

Terminal for testing.

Connect to GND.

Refer to P.6 for detail.

Refer to P.5 for detail.

Figure.8 Block diagram & Application circuit diagram

www.rohm.com

TSZ22111・15・001

TSZ02201-0P2P0B701520-1-2

12.Jul.2017 Rev.002

16/23

BD63525AEFV

●Input output equivalent circuit diagram

CW_CCW

MODE0

MODE1

ENABLE

PS

VREF

MTH

10kΩ

5kΩ

CLK

215kΩ

100kΩ

10kΩ

100kΩ

VREG(internal regulator)

RNF1S

RNF2S

5kΩ

CR

5kΩ

VCC

OUT1A

OUT2A

OUT1B

OUT2B

RNF1, RNF2

Circuitry

Figure 9. Input output equivalent circuit diagram

www.rohm.com

TSZ02201-0P2P0B701520-1-2

12.Jul.2017 Rev.002

17/23

TSZ22111・15・001

BD63525AEFV

Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Thermal Consideration

Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may

result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the

board size and copper area to prevent exceeding the maximum junction temperature rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately

obtained. The electrical characteristics are guaranteed under the conditions of each parameter.

7. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush

current may flow instantaneously due to the internal powering sequence and delays, especially if the IC

has more than one power supply. Therefore, give special consideration to power coupling capacitance,

power wiring, width of ground wiring, and routing of connections.

8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)

and unintentional solder bridge deposited in between pins during assembly to name a few.

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

www.rohm.com

TSZ02201-0P2P0B701520-1-2

12.Jul.2017 Rev.002

18/23

TSZ22111・15・001

BD63525AEFV

Operational Notes – continued

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided.

Figure 10. Example of monolithic IC structure

13. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe

Operation (ASO).

14. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below

the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

15. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

16. Operation Under Strong Electromagnetic Field (BD63525AEFV)

The IC is not designed for using in the presence of strong electromagnetic field. Be sure to confirm that no

malfunction is found when using the IC in a strong electromagnetic field.

17. Metal on the backside (Define the side where product markings are printed as front) (BD63525AEFV)

The metal on the backside is shorted with the backside of IC chip therefore it should be connected to GND. Be aware

that here is a possibility of malfunction or destruction if it is shorted with any potential other than GND.

18. TEST Terminal (BD63525AEFV)

Be sure to connect TEST pin to GND.

www.rohm.com

TSZ02201-0P2P0B701520-1-2

12.Jul.2017 Rev.002

19/23

TSZ22111・15・001

BD63525AEFV

●Thermal derating curve

HTSSOP-B28 has exposed metal on the back, and it is possible to dissipate heat from a through hole in the back. Also, the

back of board as well as the surfaces has large areas of copper foil heat dissipation patterns, greatly increasing power

dissipation. The back metal is shorted with the back side of the IC chip, being a GND potential, therefore there is a

possibility for malfunction if it is shorted with any potential other than GND, which should be avoided. Also, it is

recommended that the back metal is soldered onto the GND to short. Please note that it has been assumed that this

product will be used in the condition of this back metal performed heat dissipation treatment for increasing heat dissipation

efficiency.

Measurement machine：TH156（Kuwano Electric）

Measurement condition：ROHM board

Board size：70mm*70mm*1.6mm

(With through holes on the board)

The exposed metal of the backside is connected to the board with solder.

5.0

4.70W

3.30W

4

3

Board①：1-layer board (Copper foil on the back 0mm)

Board②：2-layer board (Copper foil on the back 15mm*15mm)

Board③：2-layer board (Copper foil on the back 70mm*70mm)

Board④：4-layer board (Copper foil on the back 70mm*70mm)

4.0

3.0

2.0

1.0

Board①：θ_ja=86.2°C W

Board②：θ_ja=67.6°C W

Board③：θ_ja=37.9°C W

Board④：θ_ja=26.6°C W

1.85W

1.45W

2

1

0

25

50

75 85 100

125

150

Ambient temperature:Ta[C]

Figure.11 HTSSOP-B28 Thermal derating curve

www.rohm.com

TSZ02201-0P2P0B701520-1-2

12.Jul.2017 Rev.002

20/23

TSZ22111・15・001

BD63525AEFV

●Selecting a model name when ordering

E F

V

B D 6 3 5 2 5 A

-

E 2

Package type

Packing, Forming specification

ROHM Model

EFV

: HTSSOP-B28 E2: Reel-wound embossed taping

● Marking Diagram

HTSSOP-B28 (TOP VIEW)

Part Number Marking

LOT Number

B D 6 3 5 2 5 A E F

1PIN MARK

www.rohm.com

TSZ02201-0P2P0B701520-1-2

12.Jul.2017 Rev.002

21/23

TSZ22111・15・001

BD63525AEFV

Physical Dimension, Tape and Reel Information

Package Name

HTSSOP-B28

www.rohm.com

TSZ22111・15・001

TSZ02201-0P2P0B701520-1-2

12.Jul.2017 Rev.002

22/23

BD63525AEFV

Revision History

Date

Revision

Changes

24.Nov.2016

12.Jul.2017

001

002

New Release

Making Diagram change BD63525AEFV→BD63525AEF

www.rohm.com

TSZ02201-0P2P0B701520-1-2

12.Jul.2017 Rev.002

23/23

TSZ22111・15・001

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.003


型号：	BD63525AEFV
厂家：	ROHM
描述：	BD63525AEFV是适用于1/16µ-step的步进电机驱动器。作为基本功能，是低功耗双极PWM恒流驱动器，额定电源为36V、额定输出电流(DC)为2.5A，接口为CLK-IN驱动型。通过内置DAC，励磁模式适用于Full step (2相励磁)、Half step (1-2相励磁)、Quarter step (W1-2 相励磁)、Sixteenth step (4W1-2相励磁）模式，对于电流衰减方式，可自由设定FAST DECAY/SLOW DECAY的比率，可对所有电机实现很好的控制状态。另外，也可使用一个系统电源进行驱动，因此有助于提高整机设计的便利性。电机驱动驱动器
文件：	总26页 (文件大小：1788K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD63525AEFV [ROHM]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB

SI9137LG

SI9122E