BD63730EFV_技术文档

36ViHigh-performanceiand

High-reliability Withstand Voltage

Stepping Motor Driver

BD63730EFV

General Description

Key Specification

19 to 28 [V]

3.0 [A]

3.5 [A]

-25 to +85 [°C]

BD63730EFV is a low-power motor driver that drives

load by PWM current. Rated power supply voltage of

the device is 36V, and rated output current is 3.0A. The

input interface are interchangeable between CLK-IN

drive mode and the PARALLEL-IN drive mode, and

excitation mode is corresponding to FULL STEP, HALF

STEP (2 types), and QUARTER STEP modes via a

built-in DAC. In terms of current decay, the FAST

DECAY/SLOW DECAY ratio may be set without any

limitation, and all available modes may be controlled in

the most appropriate way. In addition, the power supply

may be driven by one single system, which simplifies

the design.

■

Range of Power Supply Voltage:

Rated Output Current (Continuous):

Rated Output Current (Peak Value):

Range of Operating Temperature:

Output ON-Resistance (Total of

Upper and Lower Resistors):

0.40 [Ω] (Typ)

Package

W(Typ) x D(Typ)x H(Max)

Features

■

Rated output current of 3.0A DC

Low ON-Resistance DMOS output

CLK-IN drive mode

PARALLEL-IN drive mode

PWM constant current control (other oscillation)

Built-in spike noise cancel function (external noise

filter is unnecessary)

HTSSOP-B54

18.50mm x 9.50mm x 1.00mm

■

Full-step, half-step (two types), and quarter-step

functionality

Typical Application Circuit

■

Dynamic excitation mode switch

Current decay mode switch (linearly variable

FAST/SLOW DECAY ratio)

■

Normal rotation & reverse rotation switching

function

Power save function

Built-in logic input pull-down resistor

Power-ON reset function

Thermal shutdown circuit (TSD)

Over-current protection circuit (OCP)

Under voltage lock out circuit (UVLO)

Over voltage lock out circuit (OVLO)

Ghost Supply Prevention (protects against

malfunction when power supply is disconnected)

Electrostatic discharge: 4kV (HBM specification)

Adjacent pins short protection

CLK/PHASE1

CW/I01

MODE0/PHASE2

MODE1/I02

ENABLE/I12

TEST/I11

PS

■

TEST1

SELECT

TEST2

VCC1

VREF

OUT1A

OUT1B

RNF1

■

Micro miniature, ultra-thin and high heat-radiation

(exposed metal type) package

RNF1S

VCC2

OUT2A

CR

Application

■

PPC, multi-function printer, laser beam printer, and

ink-jet printer

Monitoring camera and WEB camera

Sewing machine

Photo printer, FAX, scanner and mini printer

Toy and robot

OUT2B

RNF2

MTH

■

RNF2S

GND

Figure 1. BD63730EFV Application Circuit Diagram

○Product structure：silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays

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Pin Configuration

54

53

52 NC

OUT2A

NC

1

2

3

VCC2

VCC

2

RNF2

RNF2S

NC

51

50

49

4

5

6

7

CR

NC

MTH

48 VREF

NC

NC 11

47

8

9

10

CLK

MODE 0

MODE

ENABLE

TEST

CW_CCW

PS

SELECT

NC

TEST2

TEST1

46

45

44

43

42

41

40

39

38

37

1

OUT B 12

2

OUT B 13

GND 14

1

OUT B

15

16

17

18

19

20

1B

OUT

NC

36 NC

35 NC

34

33 NC

NC 21

22

NC

RNF1S

23

24

NC 25

32

31

30

RNF1

GND

NC

OUT1A 26

29 VCC1

28 VCC1

OUT1A

27

Figure 2. Terminals Configuration Diagram

Block Diagram

CLK/PHASE1

TSD

OCP

CW/I01

MODE0/PHASE2

MODE1/I02

OVLO

UVLO

Translator

ENABLE/I12

TEST/I11

SELECT

RESET

PS

TEST1

VREF

＋

－

2bit DAC

TEST2

VCC1

OUT1A

＋

－

RNF1S

RNF2S

OUT1B

＋

－

RNF1

RNF1S

Blank time

PWM control

VCC2

OUT2A

CR

OSC

OUT2B

RNF2

Mix decay

control

MTH

RNF2S

GND

Regulator

Figure 3. BD63730EFV Block Diagram

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Pin Descriptions

No.

Name

No.

Name

No.

Function

Pin Name

TEST1

Function

Terminal for enabling

TEST mode

H bridge output terminal

1

OUT2A

19

NC

No connection

37

(TEST1=GND)

Terminal for enabling

TEST mode

H bridge output terminal

No connection

2

3

4

5

OUT2A

NC

20

21

22

23

NC

No connection

38

39

40

41

TEST2

NC

(TEST2=GND)

No connection

Connection terminal of

resistor for output current

detection

Input terminal of current

limit comparator

Input mode select terminal

RNF2

RNF1S

RNF1

SELECT

PS

Connecting terminal of

resistor for output

current detection

Connection terminal of

resistor for output current

detection

Power save terminal

Motor rotating direction

CW_CCW setting terminal

Connecting terminal of

resistor for output

current detection

Input terminal of current

limit comparator

6

7

RNF2S

NC

24

25

RNF1

NC

42

43

/I01

/VREF division ratio

setting terminal

Terminal for enabling

TEST mode

TEST

/I11

No connection

(TEST=GND)

/VREF division ratio

setting terminal

Terminal for enabling

output

ENABLE

/I12

H bridge output terminal

8

9

NC

No connection

26

27

28

OUT1A

44

45

46

/VREF division ratio

setting terminal

Motor excitation mode

setting terminal

/VREF division ratio

setting terminal

Motor excitation mode

setting terminal

/Phase selection

terminal

Clock input terminal for

advancing the electrical

angle

/Phase selection

terminal

MODE1

/I02

MODE0

/PHASE2

10

VCC1 Power supply terminal

CLK

11

NC

No connection

29

47

/PHASE1

Output current value

setting terminal

H bridge output terminal

Ground terminal

12

13

14

OUT2B

GND

30

31

32

NC

No connection

Ground terminal

48

49

50

VREF

MTH

NC

Current decay mode

setting terminal

GND

No connection

Connecting terminal of

CR for setting chopping

frequency

H bridge output terminal

No connection

15

OUT1B

33

NC

No connection

51

CR

16

17

18

OUT1B

NC

34

35

36

NC

No connection

52

53

54

No connection

NC

Power supply terminal

VCC2

NC

No connection

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Absolute Maximum Ratings (Ta=25°C)

Parameter

Symbol

V_CC1,2

Rated Value

-0.2 to +36.0

2.0 ^{(Note 1)}

6.2 ^{(Note 2)}

-0.2 to +5.5

0.7

Unit

Supply Voltage

V

W

Power Dissipation

Pd

W

Input Voltage For Control Pin

RNF Maximum Voltage

V_IN

V_RNF

I_OUT

V

Maximum Output Current (Dc)

Maximum Output Current (Peak) ^{(Note 4)}

Operating Temperature Range

Storage Temperature Range

3.0 ^{(Note 3)}

3.5 ^{(Note 3)}

-25 to +85

-55 to +150

A/Phase

°C

I_OUTPEAK

Topr

Tstg

°C

(Note 1) 70mm×70mm×1.6mm glass epoxy board. Derate by 16.0mW/°C when operating above Ta=25°C.

(Note 2) 4-layer recommended board. Derate by 49.5mW/°C when operating above Ta=25°C.

(Note 3) Not exceeding Pd, ASO, or Tjmax=150°C.

(Note 4) 4 Pulse width tw≤1ms, duty 20%.

Caution: Operating the IC over its absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over

its absolute maximum ratings.

Recommended Operating Conditions (Ta= -25 to +85°C)

Parameter

Symbol

V_CC1,2

I_OUT

Rated Value

19 to 28

Unit

V

Supply Voltage

Maximum Output Current (DC)

2.7 ^{(Note 5)}

A/ Phase

(Note 5) Not exceeding Pd, ASO or Tj=150°C

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Electrical Characteristics (Unless otherwise specified Ta=25°C, V_CC1,2=24V)

Specification

Parameter

Symbol

Unit

Conditions

Minimum Standard Maximum

[Whole]

Circuit Current at Standby

Circuit Current

I_CCST

I_CC

-

0.8

2.0

5.0

mA

PS=L

PS=H, V_REF=3V

[Control input] (CLK, MODE0)

H-level Input Voltage

L-level Input Voltage

Input Hysteresis Voltage

H-level Input Current

L-level Input Current

V_IN1H

V_IN1L

V_IN1HYS

I_IN1H

2.8

-

0.6

-

V

-

0.85

50

0

V

35

-10

100

-

µA

V_IN1=5V

V_IN1=0V

I_IN1L

[Control input] (CW, MODE1, ENABLE, TEST, PS, SELECT)

H-level Input Voltage

L-level Input Voltage

H-level Input Current

L-level Input Current

V_IN2H

V_IN2L

I_IN2H

I_IN2L

2.0

-

V

0.8

100

-

35

-10

50

0

µA

V_IN2=5V

V_IN2=0V

[Output (OUT1A, OUT1B, OUT2A, OUT2B)]

I

_OUT=±2.5A

Output ON-Resistance

R_ON

-

0.40

-

0.52

10

Ω

(Sum of upper and lower)

Output Leak Current

[Current control]

I_LEAK

µA

RNFxS Input Current

RNFx Input Current

I_RNFS

I_RNF

-2.0

-40

-2.0

0

-0.1

-20

-0.1

-

µA

V

RNFxS=0V

RNFx=0V

V_REF=0V

VREF Input Current

VREF Input Voltage Range

MTH Input Current

I_VREF

V_VREF

I_MTH

-

3.0

-

-2.0

0

-0.1

-

µA

V

MTH=0V

MTH Input Voltage Range

V_MTH

3.5

Minimum ON Time

(Blank Time)

t_ONMIN

V_CTH

0.3

0.9

1.5

µs

V

C=1000pF, R=39kΩ

Comparator Threshold

0.57

0.60

0.63

V_REF=3V

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Application Information

Function Explanation

SELECT Terminal/Input Mode Switching Terminal

This is the terminal to set the input mode.

SELECT

Input mode

CLK-IN drive

Parallel IN drive

L

H

Input mode in the case of CLK-IN drive (SELECT=L)

CLK/Clock Input Terminal for Advancing Electrical Angle

The electrical angle advances by one for each CLK input and only reflected at CLK’s rising edge.

Motor misstep will occur if noise is picked up at the CLK terminal, so please design the pattern in such a way that

there is no noise being introduced.

MODE0,MODE1/Motor Excitation Mode Setting Terminal

Set the motor excitation mode

MODE0

MODE1

Excitation Mode

L

H

L

FULL STEP

HALF STEP A

HALF STEP B

QUARTER STEP

H

Please refer to the P.13, 14 for the timing chart & motor torque vector of various excitation modes.

Unrelated to CLK, change in setting is reflected instantly (refer to P.16).

CW_Terminal/Motor Rotating Direction Setting

Set the motor’s rotating direction. Change in setting is reflected at the CLK rising edge immediately after the

change in setting (refer to P.15)

CW

Rotating direction

L

Clockwise (CH2’s current is outputted with a phase lag of 90°in regard to CH1’s current)

Counter Clockwise(CH2’s current is outputted with a phase lead of 90°in regard to CH1’s

current)

H

ENABLE Terminal/Output Enable Terminal

Turns ON or OFF all output transistors (motor output is open).

When ENABLE=L, input to CLK is blocked, and phase advance operation of internal translator circuit is stopped.

However, during excitation mode (MODE0, MODE1) switch when ENABLE=L, setting ENABLE=L→H resets the

IC and the new excitation mode will be applied (See P.16).

ENABLE

Motor Output

OPEN (electrical angle retained)

ACTIVE

L

H

PS/Power Save Terminal

Setting PS=L will cause the circuit to enter standby state and make motor output OPEN. In standby state,

translator circuit, and electrical angle are initialized.

Please take note that there is a delay of 40µs (max) before returning from standby state to normal state then the

motor output becomes ACTIVE (refer to P.12).

PS

Status

Standby state(RESET)

ACTIVE

L

H

The initial electrical angle of each excitation mode after RESET is as follows (refer to P.13, 14).

Excitation Mode

Initial Electrical Angle

FULL STEP

45°

HALFSTEP A

HALFSTEP B

QUARTER

STEP

45°

TEST, TEST1, TEST2 Terminal/Terminal for Inspection

This terminal is used for delivery inspection on IC, and shall be grounded before use.

In addition, malfunctions may be caused by application without grounding.

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◆ Input mode in the case of Parallel-IN drive (SELECT=H)

PS/Power Save Terminal

Setting PS=L will cause the circuit to enter standby state and make motor output OPEN. In standby state,

translator circuit, and electrical angle are initialized.

Please take note that there is a delay of 40µs (max) before returning from standby state to normal state then the

motor output becomes ACTIVE (refer to P.12).

PS

Status

Standby state(RESET)

ACTIVE

L

H

PHASE1,PHASE2/Phase Selection Terminal

PHASE1

PHASE2

OUT1A

OUT1B

OUT2A

OUT2B

L

H

L

H

L

H

L

H

L

H

L

H

L

H

L

I01,I02,I11,I12/VREF Division Ratio Setting Terminal

I0x

L

I1x

L

Output current level (%)

100

67

33

0

H

L

H

(I0X, I1X)=(H, H): motor outputs are OPEN.

VCC1,VCC2/Power Supply Terminal

Since the motor’s drive current is passing through it, please wire the power supply in such a way that the wire is

thick and short, and has low impedance.

VCC voltage may suffer from great fluctuation, so it is necessary to connect a bypass capacitor of about 100µF to

470µF as close to the terminal as possible and adjust in such a way that the VCC voltage is stable. Please

increase the capacitance if needed especially when a large current is required or those motors that have great

back electromotive force are used.

In addition, for the purpose of reducing the power supply’s impedance in wide frequency bandwidth, parallel

connection of multi-layered ceramic capacitor of 0.01µF to 0.1µF is recommended. Extreme care must be

observed to make sure that the VCC voltage does not exceed the voltage rating even for a moment.

VCC1 & VCC2 are shorted internally, so please be sure to short VCC1 & VCC2 externally when operating. It might

cause malfunction or destruction if not shorted externally because of the concentration of current in a certain route.

Moreover, in the power supply terminal, there is built-in clamp component for preventing an electrostatic

destruction. If a steep pulse or surge voltage of more than that of maximum absolute rating is present, this clamp

component operates and as a result there is the danger of destruction, so please be sure that the maximum

absolute rating is not to be exceeded. It is effective to mount a Zener diode of about the maximum absolute rating.

In addition, the diode for preventing an electrostatic destruction is inserted between VCC terminal and GND

terminal, as a result there is the danger of IC destruction if a voltage of reverse polarity is applied between VCC

terminal and GND terminal, so please be careful.

GND/Ground Terminal

In order to reduce the noise caused by switching current, and to stabilize the internal reference voltage of IC,

please wire in such a way that the wiring impedance from this terminal is made as low as possible to achieve the

lowest electrical potential no matter what operating state it may be. Moreover, please design patterns not to have

any common impedance with other GND patterns.

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OUT1A,OUT1B,OUT2A,OUT2B/H Bridge Output Terminal

Since the motor’s drive current is passing through it, please wire in such a way that the wire is thick and short, and

has low impedance. It is also effective to add a Schottky diode if the output has a big positive or negative

fluctuation when large current is present (i.e. counter electromotive voltage is big). Moreover, in the output terminal,

there is a built-in clamp component for preventing an electrostatic destruction. If a steep pulse or surge voltage of

more than that of maximum absolute rating is present, this clamp component operates and as a result there is the

danger of destruction, so please be sure that the maximum absolute rating is not to be exceeded.

RNF1,RNF2/Connecting terminal of Resistor for Detecting of Output Current

Please connect a resistor of 0.1Ω to 0.3Ω for current detection between this terminal and GND. In view of the

power consumption of the current-detecting resistor, please determine the resistor in such a way that W=I_OUT²･R

[W] does not exceed the power dissipation of the resistor. In addition, please wire in such a way that it has low

impedance and does not have impedance common with other GND patterns because motor’s drive current passes

through RNF terminal to current-detecting resistor to GND. Do not exceed the rating because there is the

possibility of circuit malfunction (i.e. RNF voltage exceeded the maximum rating of 0.7V). Moreover, please be

careful because if RNF terminal is shorted to GND, large current flows without normal PWM constant current

control, then there is the possibility that OCP or TSD will operate. If RNF terminal is open, then there is the danger

of malfunction as output current does not flow either, so please do not leave open.

RNF1S,RNF2S/Input Terminal of Current Limit Comparator

In this series, RNFS terminal, which is the input terminal of current limit comparator, is independently arranged in

order to decrease the error of current-detecting accuracy caused by the internal wire impedance of RNF terminal.

Therefore, connect RNF terminal and RNFS terminal together when using PWM constant current control. In

addition, because the wires from RNFS terminal is connected near the current-detecting resistor in the case of

interconnection, the lowering of current-detecting accuracy that is caused by the impedance of board pattern

between RNF terminal and the current-detecting resistor can be decreased. Moreover, design the pattern in such

a way that there is no noise being introduced. In addition, please be careful when terminals of RNF1S & RNF2S

are shorted to GND, large current flows without normal PWM constant current control, then there is the possibility

that OCP or TSD will operate.

VREF/Output Current Value Setting Terminal

This is the terminal to set the output current value. The output current value can be set by VREF voltage and

current-detecting resistor (RNF resistor).

Output current I_OUT

[

A

]

=

{

V_REF

[

V

]

(

/5 division ratio inside IC)}/RNF

Ω

[ ]

Please avoid IC operation with VREF terminal open because if VREF terminal is open, the input is unsettled, and

the VREF voltage increases, and then there is the possibility of malfunctions such as the setting current increases,

then a large current flows. Please do not exceed 3V because if it exceeds 3V, then there is also the danger that a

large current flows in the output and so OCP or TSD will operate. Moreover, please take into consideration the

outflow current of 2µA (Max) if configuring by voltage division when selecting the resistance value. The minimum

current, which can be controlled by VREF voltage, is determined by motor coil’s L & R values and minimum ON

time since there is a minimum ON time in PWM drive.

CR/Connecting terminal of CR for Setting Chopping Frequency

This is the terminal to set the chopping frequency of output. Please connect the external C (470p to 1500pF) and

R (10k to 200kΩ) between this terminal and GND. Please refer to P11. Please interconnect from external

components to GND in such a way that the interconnection does not have impedance in common with other GND

patterns. In addition, please design the pattern in such a way that it keeps steep pulses such as square wave

away and that there is no noise being introduced. Please mount the two components C and R if operating by PWM

constant current control because normal PWM constant current control becomes impossible if CR terminal is open

or is biased externally.

MTH/Current Decay Mode-setting Terminal

This is the terminal to set the current decay mode. Current decay mode can be optionally set according to input

voltage.

MTH terminal input voltage[V] Current decay mode

0 to 0.3

0.4 to 1.0

1.5 to 3.5

SLOW DECAY

MIX DECAY

FAST DECAY

Please connect to GND if utilizing SLOW DECAY mode.

Please avoid IC operation with MTH terminal open because if MTH terminal is open, the input is unsettled, and

then there is the danger that PWM operation becomes unstable. Moreover, please take into consideration the

outflow current of 2µA (Max) if configuring by voltage division when selecting the resistance value.

NC Terminal

This terminal is unconnected electrically with IC internal circuit.

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Thermal Shutdown (TSD)

This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises above

175°C (Typ), the motor output becomes OPEN. Also, when the temperature decreases less than 150°C (Typ), it

automatically returns to normal operation. However, even when TSD is in operation and heat is continuously

added externally, heat overdrive can lead to destruction.

Over-Current Protection (OCP)

This IC has a built in over-current protection circuit as a provision against destruction when the motor outputs are

shorted to each other, or VCC-motor output or motor output-GND is shorted. This circuit latches the motor output

to OPEN condition when the regulated threshold current flows for 4µs (Typ). It resumes normal operation by

re-applying main power supply or a reset of the PS terminal. The over-current protection circuit only aims to

prevent the destruction of the IC from irregular situations such as motor output shorts, and is not meant to be used

as protection or security for the set. Therefore, sets should not be designed to take into account this circuit’s

function. After OCP operation, if irregular situations continue and the resume on normal operation by power

reactivation or a reset of the PS terminal is carried out repeatedly, then OCP operates repeatedly and the IC may

generate heat or otherwise deteriorate. When the L value of the wiring is great due to the wiring being long, after

the over-current has flowed and the output terminal voltage jumps up, the absolute maximum values may be

exceeded and as a result, there is a possibility of destruction. Also, when current is over the output current rating

and under the OCP detection current, the IC can heat up to over Tjmax=150°C and can deteriorate, so current

which exceeds the output rating should not be applied.

Under Voltage Lock Out (UVLO)

This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power

supply under voltage. When the applied voltage to the VCC terminal goes under 15V (Typ), the motor output is set

to OPEN. This protection circuit has a 1V (Typ) hysteresis to prevent false operation cause by noise. Please be

aware that this circuit does not operate during power save mode. Also, the electrical angle is reset when the UVLO

circuit operates during CLK-IN drive mode.

Over Voltage Lock Out (OVLO)

This IC has a built-in over voltage lock out function to protect the IC output and the motor during power supply

over voltage. When the applied voltage to the VCC terminal goes over 32V (Typ), the motor output is set to OPEN.

This protection circuit has a 1V (Typ) hysteresis and a 4µs (Typ) mask time to prevent false operation cause by

noise. Although this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute

maximum value for power supply voltage is exceeded. Please be aware that this circuit does not operate during

power save mode.

Ghost Supply Prevention (protects against malfunction when power supply is disconnected)

If a signal from logic input (e.g. MTH, VREF) is supplied when there is no power supplied to this IC, there is a

function which prevents the false operation via the electrostatic discharge protection diode from these input

terminals to VCC or to another IC’s power supply.

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PWM Constant Current Control

Current Control Operation

When the output transistor is turned ON, the output current increases, and as a result increases the voltage at the current

sense resistor. Once the voltage at the RNF pin reaches the voltage value set by the internal 2-bit DAC, and the VREF

input voltage, the current limit comparator engages and enters current decay mode. The output is then turned OFF for a

period of time determined by the RC time constant connected to the CR pin. The process repeats itself constantly for PWM

operation.

Noise-masking Function

In order to avoid misdetection of output current due to RNF spikes that may occur when the output turns ON, the IC

employs an automatic current detection-masking period (t^ONMIN), during which current detection is disabled immediately

after the output transistor is turned ON. This allows for constant-current drive without the need for an external filter. This

noise-masking period defines the minimum ON-time for the motor output transistor.

CR Timer

The CR filter connected to the CR pin is repeatedly charged and discharged between the VCR_Hand VCR_Llevels. The

output of the internal comparator is masked while charging from VCR_Lto VCR_Hin order to cancel noise. As mentioned

above, this operation defines the minimum ON-time of the motor output transistor. The CR terminal begins discharging

once the voltage reaches VCR_H. When the output current reaches the current limit during this period (i.e. RNF voltage

reaches the decay trigger voltage), then the IC enters decay mode. The CR continues to discharge during this period until it

reaches VCR_L; at this point the IC output is switched back ON. The current output, and CR pin begin charging

simultaneously.

The CR charge time (t^ONmin) and discharge time (tdischarge) are set by external components, according to the following

formulas. The sum of t^ONMINand tdischarge yields the chopping period, tchop.

t_ONMIN

[s

]

≈ C • R' R /

VCR = V • R /

Where:

V is the internal regulator voltage 5V(Typ)

R' is the CR terminal internal impedance 5kΩ(Typ)

(

R"+R

)

• In

[

(

VCR − 0.4

)

/

(

VCR −1.0

)]

(

R'+R

)

0.30

0.25

0.20

0.15

0.10

0.05

0.00

t_DISCHARGE

[

s

]

≈ C • R • In

[

(

1+α

)

/ 0.4

]

α:See the right graph.

t_CHOP

[

s ≈ t_ONMIN+ t_DISCHARGE

]

0

500

1000

Cꢀ[pF]

1500

2000

Spike noise

Current

Value

0mA

limit

Output current

RNF Voltage

Current

Value

limit

GND

VCRH(1.0V

Typ

)

CR Voltage

VCRL(0.4V

GND

Discharge

time

Chopping Period

t_CHOP

Minimum ON

Time

Figure 4. Timing Chart of CR Voltage, RNF Voltage, and Output Current

Attach a resistor of at least 10kΩ to the CR terminal (10kΩ to 200kΩ is recommended) as lower values may keep

the RC from reaching the VCRH voltage level. A capacitor in the range of 470pF to 1500pF is recommended. As

the capacitance is increased, the noise-masking period (t_ONMIN) also increases, and there is a risk that the output

current may exceed the current limit threshold due to the internal L and R components of the output motor coil.

Also, ensure that the chopping period (t_CHOP) is not set longer than necessary doing so will increase the output

ripple, in effect decreasing the average output current, and yielding lower output rotation efficiency. The optimal

value should reduce the motor drive noise while keeping distortion of the output current waveform to a minimum.

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BD63730EFV

Current Decay Mode

The IC allows for a mixed decay mode in which the ratio of fast and slow decay can be optionally set.

The following diagrams show the operating state of each transistor and the regenerative current path during

attenuation for each decay mode:

SLOW DECAY

FAST DECAY

OFF

OFF→ OFF

ON→ OFF

M

OFF→ ON

ON→ ON

ON→ OFF

Output ON Time

Current Decay Time

Figure 5. Route of Regenerated Current during Current Decay

The merits of each decay mode are as follows:

SLOW DECAY

During current attenuation, the voltage between motor coils is small and the regeneration current decreases

slowly decreasing the output current ripple. This is favorable for keeping motor torque high. However, due to

fall-off of current control characteristics in the low-current region, or reverse EMF of the output motors

exhibited when using high-pulse-rate half-step or quarter-step modes, the output current increases, distorting

the output current waveform, and increasing motor vibration. Thus, this decay mode is most suited to full-step

modes, or low-pulse-rate half-step or quarter-step modes.

FAST DECAY

Fast decay decreases the regeneration current more quickly than slow decay, greatly reducing distortion of

the output current waveform. However, fast decay yields a larger output current ripple, in effect decreases the

overall average current running through the motor. This creates two problems: first, the motor torque

decreases. Increasing the current limit value can help eliminate this problem, but the rated output current must

be taken into consideration; second, the power loss within the motor increases and thereby produces more

heat. If neither of these problems is of concern, then fast decay can be used for high-pulse rate half- or

quarter-step drive.

Additionally, this IC allows for a mixed decay mode that can help improve problems that arise from using fast

or slow decay mode. In this mode, the IC switches automatically between slow and fast decay, improving the

current control characteristics without increasing the output current ripple. Mixed decay mode operates by

splitting the decay period into two sections, the first X% (t₁-t₂) operates the IC in slow decay mode, and the

remainder (t₂-t₃) operates in fast decay mode. However, if the output current (i.e. the voltage on the RNF pin)

does not reach the set current limit during the first X% (t₁-t₂) decay period, the IC operates in fast decay mode

only.

MTH voltage [V]

Current decay mode

0 to 0.3

0.4 to 1.0

1.5 to 3.5

SLOW DECAY

MIX DECAY

FAST DECAY

t₁

t₂

t₃

1.0V

CR Voltage

MTH Voltage

0.4V

GND

Chopping Period

t_chop

Current limit value

Output Current

SLOW

FAST

DECAY

0A

Figure 6. Relation between CR Terminal Voltage, MTH Voltage, and Output Current during Mixed Decay

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BD63730EFV

Translator Circuit

This IC has a built-in translator circuit that can drive stepper motor in CLK-IN mode.

The operation of the translator circuit in CLK-IN mode is described below.

Reset Operation

The translator circuit is initialized by power ON, Reset function, or PS terminal.

Initializing Operation when Power Supply is Turned ON

① If power supply is turned ON at PS=L (Please use this sequence as a general rule)

When power supply is turned ON, the power ON reset function operates and initialized, but as long as it is

PS=L, the motor output is in OPEN state. After power supply is turned ON and changing of PS=L→H, the

motor output becomes ACTIVE, and the excitation is started at the initial electrical angle. At the time of

PS=L→H, there is a delay of 40µs (max) until the motor output becomes ACTIVE.

Reset is released

ACTIVE

①

②

Delay

PS

CLK

OUT1A

OUT1B

Motor output OPEN

② If power supply is turned ON at PS=H

Motor output ON

When power supply is turned ON, the power ON function in IC operates, and initialized before the motor

output becomes ACTIVE, and the excitation is started at the initial electrical angle.

Initializing Operation during Motor Operation

Please input the reset signal to PS terminal when the translator circuit is initialized during motor operation.

(Refer to P.15) But at the time of PS=L→H, there is a delay of 40µs (max) until the motor output becomes

ACTIVE, so please be careful.

Control Input Timing

Please input signals as shown below since the translator circuit operates at the rising edge of a CLK signal. If the

timing is not followed, then there is the possibility that the translator circuit will not operate as expected. In addition,

at the time of PS=L→H, there is a delay of 40µs (Max) until the motor output becomes ACTIVE, so within this

delay interval there is no phase advance operation even if CLK is inputted.

A

PS

B

C

CLK

D

E

MODE0

MODE1

CW

F

G

F

G

A:PS minimum input pulse width･･････20µs

B:PS rising edge to CLK rising edge input possible maximum delay time･･････40µs

C:CLK minimum period･･････4µs

D:CLK minimum input H pulse width･･････2µs

E:CLK minimum input L pulse width･･････2µs

F:MODE0,MODE1,CW set-up time･･････1µs

G:MODE0,MODE1,CW hold time･･････1µs

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BD63730EFV

FULL STEP (MODE0=L, MODE1=L, CW=L, ENABLE=H)

①

②

③

④

①

OUT1A

100%

67%

PS

CLK

1

2

4

3

33%

OUT1A

OUT1B

OUT2A

OUT2B

OUT2A

OUT2B

OUT1B

100%

67%

33%

4CLK = Electrical angle 360°

IOUT(CH1)

IOUT(CH2)

-33%

-67%

-100%

100%

67%

33%

-33%

-67%

-100%

HALF STEP A (MODE0=H, MODE1=L, CW=L, ENABLE=H)

①

②

③

④

⑤

⑥

⑦

⑧

①

②

OUT1A

8

100%

67%

PS

CLK

1

3

7

5

33%

OUT1A

OUT1B

OUT2A

OUT2B

OUT2A

6

2

4

OUT1B

100%

67%

33%

IOUT(CH1)

IOUT(CH2)

8CLK = Electrical angle 360°

-33%

-67%

-100%

100%

67%

33%

-33%

-67%

-100%

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BD63730EFV

HALF STEP B(MODE0=L, MODE1=H, CW=L, ENABLE=H)

①

②

③

④

⑤

⑥

⑦

⑧

①

②

OUT1A

8

PS

100%

67%

CLK

OUT1A

OUT1B

OUT2A

OUT2B

33%

1

3

7

5

OUT2B

OUT2A

2

6

4

100%

67%

33%

OUT1B

IOUT(CH1)

IOUT(CH2)

8CLK = Electrical angle 360°

-33%

-67%

-100%

100%

67%

33%

-33%

-67%

-100%

QUARTER STEP(MODE0=H, MODE1=H, CW=L, ENABLE=H)

① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪ ⑫ ⑬ ⑭ ⑮ ⑯ ① ② ③ ④

OUT1A

PS

100%

CLK

67%

33%

15

2

14

16

OUT1A

OUT1B

OUT2A

OUT2B

13

1

5

12

11

2

3

4

OUT2A

OUT2B

1

10

9

8

6

7

100%

67%

33%

OUT1B

IOUT(CH1)

IOUT(CH2)

16CLK = Electrical angle 360°

-33%

-67%

-100%

100%

67%

33%

-33%

-67%

-100%

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BD63730EFV

Reset Timing Chart (QUARTER STEP, MODE0=H, MODE1=H, CW=L , ENABLE=H)

If the terminal PS is set to L, the reset operation is done regardless of other input signals then resets the

translator circuit while motor is working. At this time, IC internal circuit enters standby mode, and makes the

motor output OPEN.

RESET

①

②

③

④

⑤

⑥

⑦

⑧

⑨

⑩

①

②

③

④

⑤

⑥

⑦

⑧

PS

CLK

OUT1A

OUT1B

OUT2A

OUT2B

100%

67%

33%

IOUT(CH1)

IOUT(CH2)

-33%

-67%

-100%

100%

67%

33%

-33%

-67%

-100%

CW Switch Timing Chart (FULL STEP, MODE0=L, MODE1=L, ENABLE=H)

The switching of CW is reflected at the rising edge of the CLK. However, depending on the state of the motor

output at the switch, the motor cannot follow even if the control on driver side corresponds and there are

possibilities of step-out or misstep in motor. So please consider the sequence of the switch sufficiently.

CW

CCW

①

②

③

②

①

PS

CW

CLK

OUT1A

OUT1B

OUT2A

OUT2B

100%

IOUT(CH1)

IOUT(CH2)

-100%

100%

-100%

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BD63730EFV

ENABLE Switch Timing Chart (FULL STEP, MODE0=L, MODE1=L, ENABLE=H)

The switching of ENABLE signal is reflected regardless of other input signals.

When ENABLE=L, the motor output becomes OPEN and the electrical angle won’t advance because the

translator circuit stops, and CLK input is cancelled. Therefore, the previous state will resume after

ENABLE=L→H. Excitation mode (MODE0, MODE1) can be switched within ENABLE=L interval. When

excitation mode is switched within ENABLE=L interval, restoring of the excitation mode is done after

ENABLE=L→H.

Output off & Translator stop

①

②

③

PS

ENABLE

CLK

OUT1A

OUT1B

OUT2A

OUT2B

100%

IOUT(CH1)

IOUT(CH2)

-100%

100%

-100%

Restoring in the state prior to input of ENABLE=L

Switching of Motor Excitation Mode

The switching of the excitation mode can be done regardless of the CLK signal at the same time as changing

of the signal MODE0 and MODE1. The following built-in function can prevent motor out-of-step caused by

discrepancies of torque vector of transitional excitations during switch between excitation modes. However,

due to operation state of motor during switch, motor may not act following control on IC side of controller, and

thereby lead to out-of-step or miss step. Therefore, switch sequence shall be evaluated sufficiently before any

decision.

Cautions of Bidirectional Switch of CW and Excitation Modes (MODE0,MODE1)

As shown in the Figure below, the area between the end of reset discharge (PS=L→H) and beginning of the

first CLK signal input is defined as interval A, while the area post the end of the first CLK signal input is

defined as interval B.

Interval A

=> For CW, no limitation is applied on switch of excitation mode.

Interval B

=> In CLK1 period, or within ENABLE=L interval, CW and excitation mode can’t be switched together.

Violation of this restriction may lead to false step (with one extra leading phase) or out-of-step.

Therefore, in case that CW and excitation modes are switched simultaneously, PS terminal must be input with

reset signal. Then start to operate in interval A before carrying out such bidirectional switch.

interval A

interval B

PS

CLK

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BD63730EFV

PARALLEL-IN Drive Mode

It is possible to drive stepping motor with FULL STEP, HALF STEP, and QUARTER STEP by inputting the following

motor control signals using PARALLEL-IN drive mode.

Examples of control sequence and torque vector

FULL STEP

Controlled by 2 logic signals of PHASE1 & PHASE2

①

②

③

④

OUT1A

100%

PHASE1

PHASE2

I01

67%

33%

4

3

1

2

I11

OUT2A

OUT2B

I02

I12

100%

67%

33%

IOUT(CH1)

IOUT(CH2)

OUT1B

-33%

-67%

-100%

100%

67%

33%

-33%

-67%

-100%

HALF STEP A

Controlled by 4 logic signals of PHASE1, PHASE2, I01 (I11), and I02 (I12)

OUT1A

1

①

②

③

④

⑤

⑥

⑦

⑧

100%

67%

PHASE1

PHASE2

I01

2

4

8

6

33%

I11

OUT2B

OUT2A

7

3

I02

I12

100%

67%

33%

5

IOUT(CH1)

IOUT(CH2)

OUT1B

-33%

-67%

-100%

100%

67%

33%

-33%

-67%

-100%

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TSZ22111・15・001

BD63730EFV

HALF STEP B

Controlled by 6 logic signals of PHASE1, PHASE2, I01, I11, I02, and I12

①

②

③

④

⑤

⑥

⑦

⑧

OUT1A

1

100%

67%

PHASE1

PHASE2

I01

2

4

33%

8

6

I11

OUT2B

OUT2A

7

3

I02

I12

100%

67%

33%

5

IOUT(CH1)

IOUT(CH2)

OUT1B

-33%

-67%

-100%

100%

67%

33%

-33%

-67%

-100%

QUARTER STEP

Controlled by 6 logic signals of PHASE1, PHASE2, I01, I11, I02, and I12

① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪ ⑫ ⑬ ⑭ ⑮ ⑯

OUT1A

100%

67%

33%

PHASE1

PHASE2

I01

1

2

16

2

15

3

7

14

4

I11

OUT2A

OUT2B

13

12

5

6

I02

I12

11

8

100%

67%

33%

10

9

IOUT(CH1)

-33%

OUT1B

-67%

-100%

100%

67%

33%

IOUT(CH2)

-33%

-67%

-100%

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BD63730EFV

Power Dissipation

Please ensure that the IC’s chip temperature Tj is not over 150°C, while considering the IC’s power consumption (W),

package power dissipation (Pd), and ambient temperature (Ta). When Tj=150°C is exceeded the functions of the

semiconductor do not operate as expected, and problems such as parasitism and leaks occur. Constant use under

these circumstances leads to deterioration and eventually destruction of the IC. Tjmax≤150°C must be strictly obeyed

under all circumstances.

Thermal Consideration

The IC’s power consumption can be estimated roughly with power supply voltage (V_CC), circuit current (I_CC), output

ON-Resistance (R_ONH, R_ONL), and motor output current value (I_OUT).

The calculation method during FULL STEP drive, SLOW DECAY mode is shown below:

･･･････①

Consumed power of the V_CC

[W

]

= V_CC

[V

]

• I_CC

[A]

(

R_ONH

[

Ω

]

+ R_ONL

[

Ω

]

)

• I_OUT

[

A ²

]

• 2

[ch

]

• on duty

Consumed power of the output DMOS

[

W =

]

During output ON

+

(

2•R_ONL

)

• I_OUT

During current decay

[

A ²

]

• 2

[

ch

]

•

(

1−on _ duty

)

･･･････②

PWM on duty = t_ON

/

(

t_CHOP

)

When ON duty:

t_ONvaries depending on the L and R values of the motor coil and the current set value. Please confirm by actual

measurement, or make an approximate calculation.

t_CHOPis the chopping period, which depends on the external CR. See P.10 for details.

Upper PchDMOS ON-Resistance

Lower NchDMOS ON-Resistance

IC number

BD63730EFV

R_ONH[Ω] (Typ)

R_ONL[Ω] (Typ)

0.27

0.13

Consumed power of total IC W_total [W] = ① + ②

Junction Temperature Tj = Ta °C + θja °C/ W • W _ total

[

]

[

]

[

W

]

However, the thermal resistance value θja [°C/W] differs greatly depending on circuit board conditions. Refer to

the derating curve on P.21. Also, we are taking measurements of thermal resistance value θja of actual boards in

use. Please feel free to contact our sales department. The calculated values above are only theoretical. For actual

thermal design, please perform sufficient thermal evaluation for the application board used, and create the thermal

design with enough margin to not exceed Tjmax=150°C. Although unnecessary with normal use, if the IC is to be

used under strict heat conditions, please consider inserting an external Schottky diode between the motor output

terminal and GND to abate heat from the IC.

Temperature Monitoring

In case of CLK-IN drive, there is a way to approximately measure the chip temperature by using the electrostatic

discharge protection diode of TEST pin. For PARALLEL-IN drive, the logic terminal (I0x or I1x) can be used when

at L state. Temperature monitoring using this method is only for evaluation and experimenting purposes, and must

not be used in actual usage conditions.

•

Measure the terminal voltage when a current of I_DIODE=50µA passes from the TEST or I0x or I1x terminal to

the GND without supplying VCC to the IC. This measurement is the V_fvoltage of the internal diode.

Measure the temperature characteristics of this terminal voltage. V_fhas a linear negative temperature factor

against temperature. With these results of temperature characteristics, chip temperature may be calibrated

from the TEST or I0x or I1x terminal voltage.

•

Supply VCC, monitor the TEST or I0x or I1x terminal voltage while running the motor, and the chip

temperature can be approximated from the results of (2).

VCC

-Vf[mV]

TEST or

Internal circuit

I0x or I1x

Internal circuit

I_DIODE

Vf

25

150 Chip temperature Tj [℃]

Figure 7.Model Diagram for Measuring Chip Temperature

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BD63730EFV

Example for Application Circuit

Logic input terminal

See P6, 7 for detail.

Power save terminal

Refer to P.6, 7 for detail.

CLK/PHASE1

TSD

OVLO

RESET

OCP

CW/I01

MODE0/PHASE2

MODE1/I02

ENABLE/I12

TEST/I11

UVLO

Translator

PS

SELECT

TEST1

Bypass capacitor.

Setting range is

VREF

＋

－

100µF to 470µF(electrolytic)

0.01µF to 0.1µF(multilayer ceramic

etc.)

2bit DAC

TEST2

Set the output current.

Input by voltage division.

Refer to P.8 for detail.

Refer to P.7 for detail.

Be sure to short VCC1 & VCC2.

VCC1

OUT1A

＋

－

RNF1S

RNF2S

Set the chopping

frequency.

Setting range is

C:470pF to 1500pF

R:10kΩ to 200kΩ

Refer to P.8, 10 for detail.

OUT1B

RNF1

＋

－

0.2Ω

100µF

0.1µF

RNF1S

VCC2

Blank time

PWM control

OUT2A

CR

Resistor for current detection

Setting range is

0.1Ω to 0.3Ω.

OSC

OUT2B

RNF2

39kΩ

1000pF

Refer to P.8 for detail.

Mix decay

control

0.2Ω

MTH

Set the current decay mode.

①SLOW DECAY

⇒Connect to GND.

RNF2S

GND

Regulator

②MIX DECAY

⇒Input by voltage division.

Refer to P.8, 11 for detail.

Resistor for current detection

Setting range is

0.1Ω to 0.3Ω.

Refer to P.8 for detail.

Figure 8. BD63730EFV Block Diagram and Application Circuit Diagram

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BD63730EFV

I/O Equivalent Circuit

VCC

CW

MODE1

ENABLE

PS,SELECT

circuitry

CLK

MODE0

circuitry

10kΩ

VREF

MTH

5kΩ

215kΩ

10kΩ

100kΩ

VREG (internal

regulator)

circuitry

5kΩ

RNF1S

RNF2S

5kΩ

CR

5kΩ

VCC

OUT1A

OUT2A

OUT1B

OUT2B

RNF1, RNF2

circuitry

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BD63730EFV

Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

terminals.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Thermal Consideration

Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when

the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,

increase the board size and copper area to prevent exceeding the Pd rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

7. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing

of connections.

8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned OFF completely before connecting or removing it from the test setup during the inspection process.

To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport

and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

11. Unused Input Terminals

Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance

and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to

the power supply or ground line.

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Operational Notes – continued

12. Regarding Input Pins of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Figure 10. Example of Monolithic IC Structure

13. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe

Operation (ASO).

14. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be

within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the

TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat

damage.

15. Over-Current Protection Circuit (OCP)

This IC has a built-in overcurrent protection circuit that activates when the output is accidentally shorted. However, it is

strongly advised not to subject the IC to prolonged shorting of the output.

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Power Dissipation

HTSSOP-B54 is designed with heat-remission metal on the backside of IC to perform heat dissipation treatment using

through hole from backside. It is possible to increase power dissipation considerably by ensuring sufficient heat-releasing

area on both top and back sides such as copper foil. Please note that the power dissipation described below may not be

assured without being shorted. The back metal is shorted with the backside of the IC chip that is a GND potential. There is

a possibility for malfunction if it is shorted with any potential other than GND, which should be avoided. The back metal

should be soldered onto the GND to short. Please be careful that this package is designed to be used after performing heat

dissipation treatment on the back metal, and to improve heat dissipation efficiency.

Measurement machine：TH156 (Kuwano Electric)

Measurement condition：ROHM board

Board size：70mm*70mm*1.6mm

(With through holes on the board)

The exposed metal of the backside is connected to the board with solder

7.0

4

3

6.2W

4.5W

Board①：1-layer board (Copper foil on the back 0mm*0mm)

6.0

5.0

4.0

3.0

2.0

1.0

0

Board②：2-layer board (Copper foil on the back 15mm*15mm)

Board③：2-layer board (Copper foil on the back 70mm*70mm)

Board④：4-layer board (Copper foil on the back 70mm*70mm)

Board①：θja=62.5°C /W

Board②：θja=50.0°C/W

Board③：θja=27.8°C/W

2

1

2.5W

2.0W

Board④：θja=20.2°C/W

25

50

75

100

125

150

Ambient Temperature : Ta [°C]

Ambient Temperature：Ta[℃]

Figure 9. HTSSOP-B54 Derating Curve

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Ordering Information

E F V

B D 6 3 7 3 0

-

E 2

Package type

EFV : HTSSOP-B54

Packing, Forming specification

E2: Reel-wound embossed taping

ROHM Model

Marking Diagram

HTSSOP-B54 (TOP VIEW)

Part Number Marking

LOT Number

BD63730EFV

1PIN MARK

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Physical Dimension, Tape and Reel Information

Package Name

HTSSOP-B54

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-GE

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-GE

Rev.003


型号：	BD63730EFV
厂家：	ROHM
描述：	BD63730EFV是额定电源36V､额定输出电流3.0A的低功耗双极PWM恒流驱动器。输入接口适用于CLK-IN驱动方式、PARALLEL-IN驱动方式中的任意一种，通过内置DAC，励磁模式可适用于FULL STEP､HALF STEP(2种)､QUATER STEP模式。电流衰减方式方面可任意设定FAST DECAY/SLOW DECAY的比率，可对所有电机实现很好的控制状态。另外，也可使用一个系统电源进行驱动，有助于提高整机设计的便利性。电机驱动驱动器
文件：	总29页 (文件大小：2884K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD63730EFV [ROHM]

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