BD63731EFV_技术文档

Datasheet

36 V High-performance,

High-reliability Withstand Voltage

Stepping Motor Driver

BD63731EFV

General Description

Key Specifications

BD63731EFV is a bipolar low-consumption driver that is

driven by PWM current. Rated power supply voltage of

the device is 36 V, and rated output current is 3.0 A.

CLK-IN driving mode is adopted for input interface, and

excitation mode is corresponding to FULL STEP mode (2

types), HALF STEP mode (2 types), QUARTER STEP

mode (2 types), 1/8 STEP mode and 1/16 STEP mode

via a built-in DAC. In terms of current decay, the SLOW

DECAY/FAST DECAY ratio may be set without any

limitation, and all available modes may be controlled in

the most appropriate way. In addition, the power supply

may be driven by one single system, which simplifies the

design.

■

Range of Power Supply Voltage

Rated Output Current (continuous)

Rated Output Current (peak value)

Range of Operating Temperature -25 °C to +85 °C

Output ON Resistance

8 V to 28 V

3.0 A

■

3.5 A

0.28 Ω (Typ)

(total of upper and lower resistors)

W (Typ) x D (Typ) x H (Max)

9.7 mm x 6.4 mm x 1.0 mm

Package

HTSSOP-B28

Features

■

Rated Output Current 3.0 A

Low ON Resistance DMOS Output

CLK-IN Drive Mode

PWM Constant Current (other oscillation)

Built-in Spike Noise Cancel Function

(external noise filter is unnecessary)

FULL STEP (2 types), HALF STEP (2 types),

QUARTER STEP (2 types), 1/8 STEP, 1/16 STEP

Functionality

■

Typical Application Circuit

■

Freely Timing Excitation Mode Switch

Current Decay Mode Switch

(linearly variable SLOW/FAST DECAY ratio)

Normal Rotation & Reverse Rotation Switching

Function

Power Save Function

Built-in Logic Input Pull-down Resistor

Power-on Reset Function

GND

PS

CLK

CW_CCW

■

MODE0

MODE1

MODE2

ENABLE

■

Thermal Shutdown Circuit (TSD)

VCC1

Over-current Protection Circuit (OCP)

Under Voltage Lock Out Circuit (UVLO)

Over Voltage Lock Out Circuit (OVLO)

Protects Against Malfunction when Power Supply is

Disconnected (Ghost Supply Prevention Function)

Adjacent Pins Short Protection

VREF

OUT1A

M

OUT1B

RNF1

■

Microminiature, Ultra-thin and High Heat-radiation

(exposed metal type) Package

RNF1S

VCC2

CR

Application

Sewing Machine, PPC, Multi-function Printer, Laser

OUT2A

M

■

Beam Printer, Ink-jet Printer, Monitoring Camera,

WEB Camera, Photo Printer, FAX, Scanner, Mini

Printer, Toy and Robot

OUT2B

RNF2

RNF2S

GND

MTH

TEST

〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays

www.rohm.com

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

1/28

TSZ22111 • 14 • 001

BD63731EFV

Pin Configuration

Block Diagram

[TOP VIEW]

TSD

OCP

CLK 15

9

GND

28 NC

GND

１

２

OVLO

RESET

UVLO

16

CW_CCW

MODE0 18

27 OUT2B

26 RNF2

14 PS

OUT1B

Translator

MODE1

MODE2

ENABLE

19

11

20

RNF1 3

RNF2S

25

4

５

６

７

８

９

RNF1S

OUT1A

NC

24 OUT2A

23 NC

VREF

13

4 bit DAC

7

5

2

VCC1

OUT1A

OUT1B

22

21

20

19

18

17

VCC2

NC

VCC1

NC

RNF1S

3

RNF1

RNF2S

ENABLE

MODE1

GND

4

RNF1S

Blank time

PWM control

CR 10

11

22 VCC2

24

MODE0

TEST

MODE2

OSC

CR 10

OUT2A

27 OUT2B

MTH

12

Mix decay

control

MTH 12

26

25

RNF2

RNF2S

GND

EXP-PAD

VREF 13

PS 14

16 CW_CCW

CLK

15

Regulator

TEST 17

1

Pin Description

Pin No.

Pin Name

Function

Pin No.

Pin Name

Function

CLK input pin for advancing the

electrical angle

Ground pin

1

2

3

4

5

6

7

8

9

GND

15

16

17

18

19

20

21

22

23

24

25

26

27

28

-

CLK

CW_CCW

TEST

MODE0

MODE1

ENABLE

NC

H bridge output pin

Motor rotating direction setting pin

OUT1B

RNF1

RNF1S

OUT1A

NC

Connection pin of resistor for output

current detection

Input pin of current detection

comparator

Pin for testing. (Used by connecting

with GND)

Motor excitation mode setting pin

Output enable pin

H bridge output pin

No connection

Power supply pin

No connection

Ground pin

No connection

VCC1

NC

Power supply pin

VCC2

NC

No connection

GND

Connection pin of CR for setting

chopping frequency

H bridge output pin

10

11

12

13

14

-

CR

MODE2

MTH

OUT2A

RNF2S

RNF2

OUT2B

NC

Input pin of current detection

comparator

Connection pin of resistor for output

current detection

Motor excitation mode setting pin

Current decay mode setting pin

Output current value setting pin

Power save pin

H bridge output pin

VREF

PS

No connection

-

The EXP-PAD of the product

connect to GND.

EXP-PAD

-

www.rohm.com

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

2/28

TSZ22111 • 15 • 001

BD63731EFV

Function Explanation

1

CLK/Clock input pin for advancing the electrical angle

Trigger is CLK’s rising edge. The Electrical angle advances by one for each CLK input.

Motor’s misstep will occur if noise is picked up at the CLK pin, so design the pattern in such a way that there is

no noise plunging in.

2

MODE0, MODE1, MODE2/Motor excitation mode setting pin

Sets the motor excitation mode.

MODE0

MODE1

MODE2

Excitation Mode

FULL STEP A

HALF STEP A

HALF STEP B

QUARTER STEP A

FULL STEP B

QUARTER STEP B

1/8 STEP

L

H

L

H

L

H

L

H

L

H

1/16 STEP

Refer to the P.15, 16, 17 for the timing chart and motor torque vector of various excitation modes.

The excitation mode setting changes regardless of CLK signal (Refer to P.19).

3

CW_CCW/Motor rotating direction setting pin

Sets the motor’s rotating direction. Change in setting is reflected at the CLK rising edge immediately after the change

in setting (refer to P.18).

CW_CCW

Rotating Direction

L

Clockwise (CH2’s current is outputted with a phase lag of 90° in regard to CH1’s current)

Counter Clockwise(CH2’s current is outputted with a phase lead of 90° in regard to CH1’s current)

H

4

ENABLE/Output enable pin

Turn off forcibly all the output transistors (motor output is open).

The translator circuit stop and the electrical angle doesn't advance in the section of ENABLE=L. Because CLK input is

blocked.

However, during excitation modes (MODE0, MODE1, MODE2) switch within the interval of ENABLE=L, as ENABLE=L

to H is reset, the new mode upon switch will be applied for excitation (Refer to P.19).

ENABLE

Motor Output

OPEN (electrical angle maintained)

ACTIVE

L

H

5

PS/Power save pin

The PS pin can make circuit in standby state and make motor output OPEN.

In standby state, translator circuit is RESET (initialized) and electrical angle is initialized.

When PS=L to H, be careful because there is a delay of 40 μs (Max) before it is returned from standby state to normal

state and the motor output becomes ACTIVE (Refer to P.14).

PS

L

Status

Standby state (RESET)

ACTIVE

H

The electrical angle (initial electrical angle) of each excitation mode immediately after RESET is as follows (Refer to

P.15, 16, 17).

Excitation Mode

FULL STEP A

HALF STEP A

HALF STEP B

QUARTER STEP A

FULL STEP B

QUARTER STEP B

1/8 STEP

Initial Electrical Angle

45°

1/16 STEP

www.rohm.com

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

3/28

TSZ22111 • 15 • 001

BD63731EFV

Function Explanation - continued

6

VCC_X^{(Note 1)}/Power supply pin

Motor’s drive current is flowing in this pin, design the wire in such a way that it is thick enough, as short as possible

and has low impedance. VCC voltage may have large fluctuations due to counter electromotive force of the motor,

PWM switching noise etc., so arrange the bypass capacitors to 100 μF to 470 μF, as close as possible to the pin and

adjust in such a way the VCC voltage is stable. Increase the capacitor if needed specially when a large current is used

or those motors that have large electromotive force are used. In addition, we recommend placing a multilayer ceramic

capacitor of 0.01 μF to 0.1 μF in parallel for the purpose of lowering the impedance of the power supply in a wide

frequency band. Extreme care should be observed to make sure that the VCC voltage does not exceed the rating even

for a short period of time only. VCC_Xis shorted inside the IC, so make sure to short VCC_Xexternally. If it is used

without shorting, malfunction or destruction may occur because of concentration of current routes, so make sure to

short it. In addition, the power supply in has a built-in clamp element for preventing electrostatic damage. If a steep

pulse signal or voltage, such as a surge exceeding the absolute maximum rating, is applied, the clamping element

may operate and be destroyed, so do not exceed the absolute maximum rating. It is also effective to attach a Zener

diode of the absolute maximum rating. In addition, the diode for preventing electrostatic damage is inserted between

the VCC_Xpin and the GND pin, as a result there is a danger that IC will destroyed if a reverse voltage is applied, so be

careful.

(Note 1) x=1 or 2

7

8

GND/Ground pin

In order to reduce the noise caused by switching current and stabilized the internal reference voltage of IC, wire in

such a way that the wiring impedance from this pin made as low as possible to achieve the lowest electrical potential in

any operating conditions. Design the pattern so that it does not have a common impedance with other GND patterns.

OUT1A, OUT1B, OUT2A, OUT2B/H bridge output pin

Motor’s drive current is flowing in this pin, design the wire in such a way that it is thick enough, as short as possible

and has low impedance. It is also effective to add a Schottky diode when the output has large positive and negative

fluctuations when large current is used, for example when the back electromotive voltage is large. In addition, the

output pin has a built-in clamp element for preventing electrostatic damage. If a steep pulse signal or voltage, such as

a surge exceeding the absolute maximum rating, is applied, the clamping element may operate and be destroyed, so

do not exceed the absolute maximum rating.

9

RNF_X^{(Note 2)}/Connection pin of resistor for detecting of output current

Insert current detecting resistor of 0.1 Ω to 0.2 Ω between RNF_Xand GND.

The power consumption of current detecting resistor (W) can be calculated by the motor output current value (I_OUT

and resistance for current detecting resistor (R).

)

푊 = 퐼_푂푈푇²× 푅

[W]

Where:

W

I_OUT

R

:

is the power consumption of current detecting resistor

is the motor output current value

is the current-detecting resistor

To avoid exceeding the rated power consumption of the resistor, consider its power consumption. In addition, design it

in such a way it that it has low impedance and does not have a common impedance with other GND patterns because

motor’s drive current flows through this pattern from the RNF_Xpin to current-detecting resistor to GND. Do not exceed

the rating because there is the possibility of circuits’ malfunction etc., if the RNF_Xvoltage has exceeded the maximum

rating (0.7 V). Moreover, be careful because if the RNF_Xpin is shorted to GND, large current flows without normal

PWM constant current control, then there is the danger that OCP or TSD will operate. If the RNF_Xpin is open, then

there is the possibility of such malfunction as output current does not flow either, so do not let it open.

(Note 2) x=1 or 2

10 RNF_XS^{(Note 3)}/Input pin of current detection comparator

In this IC, the RNFxS pin, which is the input pin of current detection comparator, is independently arranged in order to

decrease the lowing of the current-detecting accuracy caused by the wire impedance inside the IC of the RNF_Xpin.

Therefore, be sure to connect the RNF_Xpin and the RNF_XS pin together when using the device in the case of PWM

constant current control. In addition, impedance of board pattern between the RNF_Xpin and the current-detecting

resistor can decrease accuracy, so connect RNF_XS pattern in such a way it is connected near the current-detecting

resistor so accuracy can be increased. Moreover, design the pattern in such a way that there is no noise plunging in. In

addition, be careful because if the RNF_XS pin is shorted to GND, large current flows without normal PWM constant

current control and, then there is the danger that OCP or TSD will operate.

(Note 3) x=1 or 2

www.rohm.com

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

4/28

TSZ22111 • 15 • 001

BD63731EFV

Function Explanation - continued

11 VREF/Output current value setting pin

(Note 1)

This is the pin to set the output current value. It can be set by VREF voltage and current-detecting resistor (RNF_X

resistor).

(Note 1) x=1 or 2

푉ꢀ퐸퐹

5

1

퐼_푂푈푇

=

×

[A] … (All modes except FULL STEP B)

[A] … (FULL STEP B)

ꢀ푁퐹

푋

푉ꢀ퐸퐹

5

0.7071

ꢀ푁퐹

푋

Where:

I_OUT

VREF

RNF_X

:

is the output current.

is the voltage of output current value-setting pin.

is the current-detecting resistor.

Avoid using the VREF pin open because input becomes unsettled, and the VREF voltage increases, and then there is

the possibility of such malfunctions as the setting current increases and a large current flows etc. Keep to the input

voltage range because if the voltage of above 3 V is applied on the VREF pin, then there is also the danger that a large

current flows in the output and so OCP or TSD will operate. Besides, take into consideration the outflow current (Max 2

μA) if the input used is a resistor divider. The minimum current, which can be controlled by VREF voltage, is

determined by motor coil’s L, R values and minimum ON time because there is a minimum ON time in PWM drive.

12 CR/Connection pin of CR for setting chopping frequency

This is the pin to set the chopping frequency of output. Connect the external C (470 pF to 1500 pF) and R (10 kΩ to

200 kΩ) between this pin and GND. Refer to P.10.

Make the connection from external components to GND in such a way that there is no common impedance with other

GND patterns. In addition, keep the pattern away from steep pulses like square waves, etc. and there is no noise

plunging in. When it is open or it is biased from the outside, it is not possible to control normal PWM constant current,

so if it is used in PWM constant current control, always put both C and R parts.

13 MTH/Current decay mode setting pin

This is the pin to set the current decay mode. Current decay mode can be optionally set according to input voltage.

MTH Pin Input Voltage [V]

0 to 0.3

Current Decay Mode

SLOW DECAY

MIX DECAY

0.4 to 1.0

1.5 to 2.0

FAST DECAY

3.1 to 3.5

AUTO DECAY

Connect to GND if using at SLOW DECAY mode.

Avoid using with the MTH pin open because if the MTH pin is open, the input is unsettled, and then there is the

danger that PWM operation becomes unstable. Besides, take into consideration the outflow current (Max 2 μA) if the

input used is a resistor divider.

14 TEST/Pin for testing

It is a pin to use at the time of an IC shipment test. Use it in GND connection.

In addition, malfunctions may be caused by application without grounding.

15 NC/No connection

This pin is unconnected electrically with IC internal circuit.

16 IC Back Metal

The HTSSOP-B28 package has a metal for heat dissipation on the back of the IC. Since it is assumed to be used by

applying heat dissipation treatment to this metal, always GND on the substrate connect with the plane and solder, and

use the GND pattern widely to ensure sufficient heat dissipation area. In addition, the backside metal is short and the

back of the IC chip, so it has become a GND potential. Because there is a possibility of malfunction and destruction

when it is short and the potential other than GND, never pass the wiring pattern other than GND on the back of the IC.

www.rohm.com

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

5/28

TSZ22111 • 15 • 001

BD63731EFV

Protection Circuits

1

Thermal Shutdown (TSD)

This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises 175 °C

(Typ) or more, the motor output becomes OPEN. Also, when the temperature returns to 150 °C (Typ) or less, it

automatically returns to normal operation. However, even when TSD is in operation, if heat is continued to be added

externally, heat overdrive can lead to destruction.

2

Over Current Protection (OCP)

This IC has a built-in over current protection circuit as a provision against destruction when the motor outputs are

shorted each other or VCC-motor output or motor output-GND is shorted. This circuit latches the motor output to

OPEN condition when the regulated current flows for 4 μs (Typ). It returns with power reactivation or a reset by the PS

pin. The over current protection circuit’s only aim is to prevent the destruction of the IC from irregular situations such

as motor output shorts, and is not meant to be used as protection or security for the set. Therefore, sets should not be

designed to take into account this circuit’s functions. After OCP operating, if irregular situations continue and the return

by power reactivation or a reset by the PS pin, then OCP operates repeatedly and the IC may generate heat or

otherwise deteriorate. When the L value of the wiring is great due to the wiring being long, the motor outputs are

shorted each other or VCC-motor output or motor output-GND is shorted., if the output pin voltage jumps up and the

absolute maximum values can be exceeded after the over current has flowed, there is a possibility of destruction. Also,

when current which is the output current rating or more and the OCP detection current or less flows, the IC can heat up

to Tjmax=150 °C exceeds and can deteriorate, so current which or more the output rating should not be applied.

3

4

Under Voltage Lock Out (UVLO)

This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power supply

under voltage is low. When the applied voltage to the VCC_Xpin goes 5 V (Typ) or less, the motor output is set to OPEN.

This switching voltage has a 1 V (Typ) hysteresis to prevent false operation by noise etc. Be aware that this circuit

does not operate during power save mode. Also, the electrical angle is reset when he UVLO circuit operates.

Over Voltage Lock Out (OVLO)

This IC has a built-in over voltage lock out function to protect the IC output and the motor during power supply over

voltage. When the applied voltage to the VCC_Xpin goes 32 V (Typ) or more, the motor output is set to OPEN. This

switching voltage has a 1 V (Typ) hysteresis and a 4 μs (Typ) mask time to prevent false operation by noise etc.

Although this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum

value for power supply voltage is exceeded. Therefore, the absolute maximum value should not be exceeded. Be

aware that this circuit does not operate during power save mode.

5

6

Protects against malfunction when power supply is disconnected (Ghost Supply Prevention Function)

If a control signal^(Note1)is input when there is no power supplied to this IC, there is a function which prevents a

malfunction where voltage is supplied to power supply of this IC or other IC in the set via the electrostatic destruction

prevention diode from these input pins to the VCC_X. Therefore, there is no malfunction of the circuit even when voltage

is supplied to these input pins while there is no power supply.

(Note 1) control signal=CLK, CW_CCW, MODE0, MODE1, MODE2, ENABLE, PS, MTH, VREF

Operation Under Strong Electromagnetic Field

The IC is not designed for using in the presence of strong electromagnetic field. Be sure to confirm that no malfunction

is found when using the IC in a strong electromagnetic field.

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

6/28

BD63731EFV

Absolute Maximum Rating (Ta=25 °C)

Item

Symbol

V_CC1,V_CC2

V_IN

Rated Value

-0.2 to +36.0

-0.2 to +5.5

0.7

Unit

Supply Voltage

V

Input Voltage for Control Pin^{(Note 1)}

RNF_X^{(Note 2)}Maximum Voltage

Output Current

V

V_RNF

I_OUT

3.0^{(Note 3)}

3.5^{(Note 3)}

-55 to +150

+150

A/Phase

°C

Output Current (PEAK)

Storage Temperature Range

Maximum Junction Temperature

I_OUTPEAK

Tstg

Tjmax

°C

(Note 1) Input Voltage for Control Pin=CLK, CW_CCW, MODE0, MODE1, MODE2, ENABLE, PS, MTH, VREF

(Note 2) x=1 or 2

(Note 3) Do not exceed Tjmax=150 °C.

Caution 1:Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2:Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing

board size and copper area so as not to exceed the maximum junction temperature rating.

Recommended Operating Condition

Item

Symbol

V_CC1,V_CC2

Topr

Min

8

Typ

24

+25

-

Max

28

Unit

V

Supply Voltage

Operating Temperature

-25

-

+85

°C

Maximum Output Current (DC)

I_OUT

2.4^{(Note 4)}

A/Phase

(Note 4) Do not exceed Tjmax=150 °C.

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

7/28

BD63731EFV

Thermal Resistance ^{(Note 5)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 7)}

2s2p^{(Note 8)}

HTSSOP-B28

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 6)}

θ_JA

107.0

6

25.1

3

°C/W

Ψ_JT

(Note 5) Based on JESD51-2A (Still-Air).

(Note 6) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 7) Using a PCB board based on JESD51-3.

(Note 8) Using a PCB board based on JESD51-5, 7.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3 mm x 76.2 mm x 1.57 mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70 μm

Thermal Via^{(Note 9)}

Layer Number of

Measurement Board

Material

FR-4

Board Size

114.3 mm x 76.2 mm x 1.6 mmt

2 Internal Layers

Pitch

Diameter

4 Layers

1.20 mm

Φ0.30 mm

Top

Copper Pattern

Bottom

Thickness

Copper Pattern

Thickness

Copper Pattern

Thickness

Footprints and Traces

70 μm

74.2 mm x 74.2 mm

35 μm

74.2 mm x 74.2 mm

70 μm

(Note 9) This thermal via connects with the copper pattern of all layers.

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

8/28

BD63731EFV

Electrical Characteristics (Unless otherwise specified Ta=25 °C, V_CC1=V_CC2=24 V)

Specification

Item

Symbol

Unit

Condition

Min

Typ

Max

[Whole]

Circuit Current at Standby

Circuit Current

I_CCST

I_CC

-

0

10

μA

PS=L

2.0

5.0

mA

PS=H, VREF=3 V

[Control Logic Input^{(Note 1)}

H-level Input Voltage

L-level Input Voltage

H-level Input Current

L-level Input Current

]

V_INH

V_INL

I_INH

I_INL

2.0

-

V

0.8

100

-

35

-10

50

0

μA

V_IN=5 V

V_IN=0 V

[Output^{(Note 2)}

]

I_OUT=±2.5 A

Output ON Resistance

R_ON

-

0.280 0.392

Ω

(Sum of upper and lower)

Output Leak Current

I_LEAK

-

10

μA

[Current Control]

RNF_XS^{(Note 3)}Input Current

RNF_X^{(Note 3)}Input Current

VREF Input Current

I_RNFS

I_RNF

-2.0

-80

-2.0

0

-0.1

-40

-0.1

-

μA

V

RNF_XS=0 V

RNF_X=0 V

VREF=0 V

I_VREF

V_VREF

I_{MTH_H}

I_{MTH_L}

V_MTH

-

VREF Input Voltage Range

MTH H Input Current

MTH L Input Current

3.0

100

-

35

50

-0.1

-

μA

V

MTH=5 V

MTH=0 V

-2.0

0

MTH Input Voltage Range

3.5

Minimum ON Time

(Cancel time)

t_ONMIN

V_CTH

0.3

0.7

1.5

μs

C=1000 pF, R=39 kΩ

Comparator Threshold

0.579 0.600 0.621

V

VREF=3 V

(Note 1) Control Logic Input=CLK, CW_CCW, MODE0, MODE1, MODE2, ENABLE, PS

(Note 2) Output=OUT1A, OUT1B, OUT2A, OUT2B

(Note 3) x=1 or 2

www.rohm.com

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

9/28

TSZ22111 • 15 • 001

BD63731EFV

PWM Constant Current Control

1

Current control operation

When the output transistor is turned on, the output current increases. The output current is converted to voltage due to

the connected external resistance to the RNF_X^{(Note 1)}pin. When the voltage on the RNF_Xpin reaches the voltage value

set by the VREF input voltage, the current limit comparator operates and enters current decay mode. Output turns on

again after changing this pin to the high voltage from the low voltage. The process repeats itself with chopping period

(t_CHOP).

(Note 1) x=1 or 2

2

3

Noise-masking function

In order to avoid misdetection of current detection comparator due to RNF spike noise that may occur when the output

turns ON, the IC has the minimum ON time t_ONMIN(Blank time). The current detection is invalid from the output

transistor turned on to t_ONMIN. This allows for constant-current drive without the need for an external filter.

CR Timer

The external capacitor and resistor connected to the CR pin is repeatedly charged and discharged between the V_CRH

and V_CRLlevels. The CR pin voltage decides in IC and it is V_CRL=0.4 V, V_CRH=1.0 V respectively. The output of the

current detection comparator is masked while charging from V_CRLto V_CRH. As mentioned above, this period defines the

minimum ON-time. The CR pin begins discharging once the voltage reaches V_CRH. When the output current reaches

the current limit during this period, then the IC enters decay mode. The CR continues to discharge during this period

until it reaches V_CRL, at which point the IC output is switched back ON. The current output and the CR pin begin

charging simultaneously. The CR charge time (t_ONMIN) and discharge time (t_DISCHARGE) are set by external components,

according to the following formulas. The total of t_ONMINand t_DISCHARGEyield the chopping period, t_CHOP

.

′

−0.4

−1.0

푡_{푂푁푀ꢁ푁}≒ 퐶 × ^{ꢀ ×ꢀ}

_{ꢀ +ꢀ}× 푙푛 (^푉_푉

)

[s]

ꢂꢃ

′

ꢂꢃ

0.30

0.25

0.20

0.15

0.10

0.05

0.00

Where:

t_ONMIN

C

R

R’

:

is the minimum ON-time.

is the capacitance of the CR Pin.

is the resistance of the CR Pin.

is the CR Pin internal impedance 5 kΩ(Typ)

is the CR Pin voltage.

V_CR

ꢀ

′

0

500

1000

C[pF]

1500

2000

ꢄ_ꢅꢀ= ꢄ × _{ꢀ +ꢀ}

[V]

Figure 1. CR Coefficient for calculation of

discharge time

Where:

V

:

is the internal regulator voltage 5 V(Typ).

푡_{퐷ꢁ푆ꢅ퐻퐴ꢀ퐺퐸}≒ 퐶 × 푅 × 푙푛 (¹₀⁺_.4^훼

)

[s]

Where:

t_DISCHARGE

α

:

is the CR discharge time.

Refer to the right graph.

푡_ꢅ퐻푂푃= 푡_{푂푁푀ꢁ푁}ꢆ 푡_{퐷ꢁ푆ꢅ퐻퐴ꢀ퐺퐸}

[s]

Where:

t_CHOP

:

is the chopping period.

www.rohm.com

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

10/28

TSZ22111 • 15 • 001

BD63731EFV

3

CR Timer – continued

Spike noise

Current Detection Value

0 mA

Output current

RNFx^{(Note 1)}Voltage

CR Voltage

Current Detection Value

GND

V_CRH(1.0 V Typ)

V_CRL(0.4 V Typ)

GND

Discharge

time

t_DISCHARGE

Minimum ON Time Chopping Period

t_CHOP

t_ONMIN

(Note 1) x=1 or 2

Figure 2. Timing Chart of CR Voltage, RNFx Voltage and Output Current

Attach a resistor of at least 10 kΩ to the CR Pin (10 kΩ to 200 kΩ recommended) as lower values may keep the CR

from reaching the V_CRHvoltage level. A capacitor in the range of 470 pF to 1500 pF is also recommended. Using

capacitance value of several thousand pF or more, however, the noise-masking period (t_ONMIN) also increases, and

there is a risk that the output current may exceed the setting value due to the internal L and R components of the

output motor coil. Also, ensure that the chopping period (t_CHOP) is not set longer than necessary, as doing so will

increase the output ripple, thereby decreasing the average output current and yielding lower output rotation efficiency.

Select optimal value so that motor drive sound, and distortion of output current waveform can be minimized.

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

11/28

BD63731EFV

PWM Constant Current Control - continued

4

Current Decay Mode

PWM Constant Current Control can be optionally set the current decay mode in which the ratio of fast and slow decay.

The following diagrams show the state of each transistor and the regenerative current path during the current decay

for each decay mode.

FAST DECAY

SLOW DECAY

OFF→ON

ON→OFF

OFF→ON

OFF→OFF

ON→ON

ON→OFF

OFF→ON

M

Output ON Time

Current Decay Time

Figure 3. Route of Regenerated Current during Current Decay

The merits of each decay mode are as follows:

4.1 SLOW DECAY

The output current ripple is small and this is favorable for keeping motor torque high because the voltage

between the motor coils is small and the regenerative current decreases slowly. However, an increase in the

output current due to deterioration of the current control in the lower current operation in HALF STEP,

QUARTER STEP, 1/8 STEP, 1/16 STEP, due to the influence of the motor reverse electromotive voltage

during high pulse rate driving in the mode, the current waveform is not able to follow the change in the current

limit and the distortion and motor vibration increases. Thus, this decay mode is suited to FULL STEP mode or

low-pulse-rate driven HALF STEP, QUARTER STEP, 1/8 STEP or 1/16 STEP modes.

4.2 FAST DECAY

Fast decay decreases the regeneration current much more quickly than slow decay, reducing distortion of the

output current waveform. However, fast decay yields a much larger output current ripple, which decreases

the overall average current running through the motor. This causes two problems: first, the motor torque

decreases (increasing the current limit value can help eliminate this problem, but the rated output current

must be taken into consideration); and second, the power loss within the motor increases and thereby

radiates more heat. If neither of these problems is of concern, then fast decay can be used for high-pulse rate

HALF STEP, QUARTER STEP, 1/8 STEP or 1/16 STEP drive.

Additionally, this IC allows for MIX DECAY mode/AUTO DECAY mode that can help to improve upon problems that

arise from using fast or slow decay.

4.3 MIX DECAY

During current decay Switching between SLOW DECAY and FAST DECAY can improve current control

without increasing the current ripple. In addition, the time ratio of SLOW DECAY and FAST DECAY can be

changed by the voltage input to the MTH pin, and it is possible to achieve optimal control state for any motor.

During MIX DECAY mode about chopping cycle, the first (t₁to t₂) of which operates the IC in SLOW DECAY

mode, and the remainder (t₂to t₃) of which operates in FAST DECAY mode. However, if the output current

does not reach the set current limit during the first (t₁to t₂) decay period, the IC operates in fast decay mode

only.

4.4 AUTO DECAY

Current control capability can still be improved without making the current ripple big by using SLOW DECAY

and switches only to FAST DECAY when required. Decay mode becomes FAST DECAY only when output

current reaches the set value while at minimum ON time.

MTH Pin Input Voltage [V]

0 to 0.3

Current Decay Mode

SLOW DECAY

MIX DECAY

0.4 to 1.0

1.5 to 2.0

FAST DECAY

3.1 to 3.5

AUTO DECAY

www.rohm.com

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

12/28

TSZ22111 • 15 • 001

BD63731EFV

4

Current Decay Mode - continued

t1

t2 t3

1.0 V

CR Voltage

MTH Voltage

0.4 V

GND

Chopping Period

t_CHOP

Current Detection Value

Output Current

SLOWꢀ

ꢀFASTꢀ

DECAY

0 A

Figure 4. CR Pin Voltage and Output Current during MIX DECAY

1.0 V

CR Voltage

0.4 V

GND

Chopping Period

t_CHOP

Current Detection Value

Output Current

SLOWꢀ

ꢀFASTꢀ

DECAY

0 A

Minimun ON Time

t_ONMIN

Figure 5. CR Pin Voltage and Output Current during AUTO DECAY

www.rohm.com

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

13/28

TSZ22111 • 15 • 001

BD63731EFV

Translator Circuit

This series has a built in translator circuit and can drive stepping motor in CLK-IN mode.

The operation of the translator circuit in CLK-IN drive mode is described as below.

1

Reset operation

The translator circuit is initialized by power ON Reset function and the PS Pin.

1.1 Initializing operation when power supply is turned on

1.1.1 If power supply is turned on at PS=L (Use this sequence as a general rule)

When power supply is turned on, the power ON reset function is initialized and operates the IC,

but as long as it is PS=L, the motor output is the OPEN state. After power supply is turned on,

the motor output becomes ACTIVE state by changing PS=L to H, and the excitation is started at

the initial electrical angle.

But at the time of PS=L to H, it returns from the standby state to the normal state and there is a

delay of 40 μs (Max) until the motor output has become the ACTIVE state.

Reset is released

Delay

ACTIVE

PS

CLK

OUT1A

OUT1B

Motor output OPEN

Motor output ON

1.1.2 If power supply is turned on at PS=H

When power supply is turned on and the power ON reset function in IC operates, and be

initialized before the motor output becomes the ACTIVE state during EN=H, and the excitation is

started at the initial electrical angle.

1.2 Initializing operation during motor operating

Enter a reset signal to the PS pin to initialize the translator circuit during motor operation. (Refer to P.18) But

at the time of PS=L to H, it returns from the standby state to the normal state and there is a delay of 40 μs

(Max) until the motor output has become the ACTIVE state, so within this delay interval there is no phase

advance operation even if CLK is inputted.

2

Control Input Timing

Shown below is the operation of the translator circuit at the rising edge of CLK signal. If you disobey this timing and

input, then there is the possibility that the translator circuit does not operate as expected. In addition, at the time of

PS=L to H, it returns from the standby state to the normal state and there is a delay of 40 μs (Max) until the motor

output has become the ACTIVE state, so within this delay interval there is no phase advance operation even if CLK is

inputted.

A

PS

B

C

CLK

D

E

MODE0

MODE1

MODE2

F

G

F

G

CW_CCW

ENABLE

A: PS minimum input pulse width … 20 μs

B: PS rising edge to CLK rising edge input possible maximum delay time … 40 μs

C: CLK minimum period … 4 μs

D: CLK minimum input H pulse width … 2 μs

E: CLK minimum input L pulse width … 2 μs

F: MODE0, MODE1, MODE2, CW_CCW, ENABLE set-up time … 1 μs

G: MODE0, MODE1, MODE2, CW_CCW, ENABLE hold time … 1 μs

www.rohm.com

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

14/28

TSZ22111 • 15 • 001

BD63731EFV

Translator Circuit - continued

3

FULL STEP (MODE0=L, MODE1=L, MODE2=L, CW_CCW=L, ENABLE=H)

①

②

③

④

①

OUT1A

PS

100 %

67 %

CLK

1

2

4

3

33 %

OUT1A

OUT1B

OUT2A

OUT2B

OUT2A

OUT2B

OUT1B

100 %

67 %

33 %

4CLK = Electrical angle 360°

IOUT(CH1)

IOUT(CH2)

-33 %

-67 %

-100 %

100 %

67 %

33 %

-33 %

-67 %

-100 %

4

HALF STEP A (MODE0=H, MODE1=L, MODE2=L, CW_CCW=L, ENABLE=H)

①

②

③

④

⑤

⑥

⑦

⑧

①

②

OUT1A

8

100 %

67 %

PS

CLK

1

3

7

5

33 %

OUT1A

OUT1B

OUT2A

OUT2B

OUT2A

6

2

4

OUT1B

100 %

67 %

33 %

8CLK = Electrical angle 360°

IOUT(CH1)

IOUT(CH2)

-33 %

-67 %

-100 %

100 %

67 %

33 %

-33 %

-67 %

-100 %

www.rohm.com

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

15/28

TSZ22111 • 15 • 001

BD63731EFV

Translator Circuit - continued

5

HALF STEP B (MODE0=L, MODE1=H, MODE2=L, CW_CCW=L, ENABLE=H)

①

②

③

④

⑤

⑥

⑦

⑧

①

②

OUT1A

8

PS

100 %

67 %

CLK

OUT1A

OUT1B

OUT2A

OUT2B

33 %

1

3

7

5

OUT2B

OUT2A

2

6

4

100 %

67 %

33 %

OUT1B

IOUT(CH1)

IOUT(CH2)

8CLK = Electrical angle 360°

-33 %

-67 %

-100 %

100 %

67 %

33 %

-33 %

-67 %

-100 %

6

QUARTER STEP A (MODE0=H, MODE1=H, MODE2=L, CW_CCW=L, ENABLE=H)

① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪ ⑫ ⑬ ⑭ ⑮ ⑯ ① ② ③ ④

OUT1A

100 %

67 %

PS

CLK

15

14

16

13

1

5

33 %

OUT1A

12

11

10

2

3

4

OUT2A

OUT2B

OUT1B

9

8

6

OUT2A

OUT2B

7

OUT1B

16CLK = Electrical angle 360°

100 %

67 %

33 %

IOUT(CH1)

-33 %

-67 %

-100 %

100 %

67 %

33 %

IOUT(CH2)

-33 %

-67 %

-100 %

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

16/28

BD63731EFV

Translator Circuit - continued

7

Step sequence table (MODE2=H, CW_CCW=L, initial electrical angle = step angle 45°)

FULL STEP B QUARTER STEP B 1/8 STEP 1/16 STEP CH1 CURRENT[%] CH2 CURRENT[%] STEP ANGLE[°]

1

2

1

2

3

4

5

6

7

8

9

100.00

99.52

98.08

95.69

92.39

88.19

83.15

77.30

70.71

63.44

55.56

47.14

38.27

29.03

19.51

9.80

0.00

9.80

0.0

5.6

11.3

16.9

22.5

28.1

33.8

39.4

45.0

50.6

56.3

61.9

67.5

73.1

78.8

84.4

90.0

19.51

29.03

38.27

47.14

55.56

63.44

70.71

77.30

83.15

88.19

92.39

95.69

98.08

99.52

100.00

99.52

98.08

95.69

92.39

88.19

83.15

77.30

70.71

63.44

55.56

47.14

38.27

29.03

19.51

9.80

2

3

4

Initial

electrical angle →

1

2

3

4

3

5

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

6

4

7

8

5

9

0.00

-9.80

95.6

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

-19.51

-29.03

-38.27

-47.14

-55.56

-63.44

-70.71

-77.30

-83.15

-88.19

-92.39

-95.69

-98.08

-99.52

-100.00

-99.52

-98.08

-95.69

-92.39

-88.19

-83.15

-77.30

-70.71

-63.44

-55.56

-47.14

-38.27

-29.03

-19.51

-9.80

101.3

106.9

112.5

118.1

123.8

129.4

135.0

140.6

146.3

151.9

157.5

163.1

168.8

174.4

180.0

185.6

191.3

196.9

202.5

208.1

213.8

219.4

225.0

230.6

236.3

241.9

247.5

253.1

258.8

264.4

270.0

275.6

281.3

286.9

292.5

298.1

303.8

309.4

315.0

320.6

326.3

331.9

337.5

343.1

348.8

354.4

6

7

8

9

0.00

-9.80

-19.51

-29.03

-38.27

-47.14

-55.56

-63.44

-70.71

-77.30

-83.15

-88.19

-92.39

-95.69

-98.08

-99.52

-100.00

-99.52

-98.08

-95.69

-92.39

-88.19

-83.15

-77.30

-70.71

-63.44

-55.56

-47.14

-38.27

-29.03

-19.51

-9.80

10

11

12

13

14

15

16

0.00

9.80

19.51

29.03

38.27

47.14

55.56

63.44

70.71

77.30

83.15

88.19

92.39

95.69

98.08

99.52

www.rohm.com

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

17/28

TSZ22111 • 15 • 001

BD63731EFV

Translator Circuit - continued

8

Reset Timing Chart (QUARTER STEP A, MODE0=H, MODE1=H, MODE2=L, CW_CCW=L, ENABLE=H)

To reset the translator circuit during motor operation regardless of the other input signals, enter the PS pin input to L.

At this time, IC internal circuit enters the standby mode, and makes the motor output OPEN.

RESET

①

②

③

④

⑤

⑥

⑦

⑧

⑨

⑩

①

②

③

④

⑤

⑥

⑦

⑧

PS

CLK

OUT1A

OUT1B

OUT2A

OUT2B

100 %

67 %

33 %

IOUT(CH1)

IOUT(CH2)

-33 %

-67 %

-100 %

100 %

67 %

33 %

-33 %

-67 %

-100 %

9

CW_CCW Switch Timing Chart (FULL STEP A, MODE0=L, MODE1=L, MODE2=L, ENABLE=H)

The switch of CW_CCW is reflected by the rising edge of CLK that comes immediately after CW_CCW signal has

changed. However, depending on the state of operation of the motor at the time of switching, the motor cannot follow

even if the control on driver IC corresponds. There are possibilities of step-out and mistake step in motor, so evaluate

the sequence of the switch enough.

CW

CCW

①

②

③

②

①

PS

CW_CCW

CLK

OUT1A

OUT1B

OUT2A

OUT2B

100 %

IOUT(CH1)

IOUT(CH2)

-100 %

100 %

-100 %

www.rohm.com

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

18/28

TSZ22111 • 15 • 001

BD63731EFV

Translator Circuit - continued

10 ENABLE Switch Timing Chart (FULL STEP A, MODE0=L, MODE1=L, MODE2=L)

The switch of the ENABLE signal is reflected by the change in the ENABLE signal with regardless of other input

signals.

The translator circuit stop and the electrical angle doesn't advance in the section of ENABLE=L. Because the output

for motor is OPEN and CLK input is blocked. When ENABLE=L to H, the output state returns immediately to the last

state before the input of ENABLE=L. Excitation mode (MODE0, MODE1, MODE2) also switches within ENABLE=L

interval. Where excitation mode switched within ENABLE=L interval, restoring of ENABLE=L to H was done in the

excitation mode after switch.

Output off & Translator stop

①

②

③

PS

ENABLE

CLK

OUT1A

OUT1B

OUT2A

OUT2B

100 %

IOUT(CH1)

IOUT(CH2)

-100 %

100 %

-100 %

Restoring in the state prior to input of ENABLE=L

11 About the Switch of the Motor Excitation Mode

The switch of the excitation mode can be done with regardless of the CLK signal at the same time as changing of the

signal MODE0, MODE1 and MODE2. The following built-in function can prevent motor out-of-step caused by

discrepancies of torque vector of transitional excitations during switch between excitation modes. This function is

limited to fixed MODE2 signal only. Depending on the state of operation of the motor at the switch the motor cannot

follow even if the control on driver IC side is correspondent and there are possibilities of step-out and mistake step in

motor. Therefore, switch sequence shall be evaluated sufficiently before any decision.

12 Cautions of Bidirectional Switch of CW_CCW and Excitation Modes (MODE0, MODE1, MODE2)

As shown in the figure below, the area between the end of reset discharge (PS=L to H) and beginning of the first CLK

signal input is defined as interval A, while the area until the end of the first CLK signal input is defined as interval B.

Interval A

=> For CW_CCW, no limitation is applied on switch of excitation mode.

Interval B

=> In CLK1 period, or within ENABLE=L interval, CW_CCW and excitation mode can’t be switched together.

Violation of this restriction may lead to false step (with one extra leading phase) or out-of-step.

Therefore, in case that CW_CCW and excitation modes are switched simultaneously, the PS pin must be input

with reset signal. Then start to operate in interval A before carrying out such bidirectional switch.

Interval A

Interval B

PS

CLK

www.rohm.com

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

19/28

TSZ22111 • 15 • 001

BD63731EFV

Power Dissipation

In consideration of the IC’s power consumption (W), thermal resistance (°C/W), and ambient temperature (Ta), confirm that the

IC’s chip temperature Tj is not over 150 °C. When Tj=150 °C is exceeded, the functions as a semiconductor do not operate and

problems such as parasitism and leaks occur. Constant use under these circumstances leads to deterioration and eventually

destruction of the IC. Tjmax=150 °C must be strictly obeyed under all circumstances.

1

Thermal Calculation

The IC’s consumed power can be estimated roughly with the power supply voltage (V_CC), circuit current (I_CC), output

ON resistance (R_ONH, R_ONL) and motor output current value (I_OUT).

The calculation method during FULL STEP drive, SLOW DECAY mode is shown here:

푊_푉ꢅꢅ= ꢄ_ꢅꢅ× 퐼_ꢅꢅ

[W]

Where:

W_VCC

V_CC

I_CC

:

is the consumed power of the V_CC

is the power supply voltage.

is the circuit current.

.

푊_퐷푀푂푆= 푊_푂푁ꢆ 푊_{퐷퐸ꢅ퐴푌}[W]

푊_푂푁= 푅_푂푁퐻ꢆ 푅_푂푁퐿× 퐼_푂푈푇²× ꢉ × 표푛_푑푢푡푦 [W]

ꢇ

ꢈ

2

ꢇ

ꢈ

ꢇ

ꢈ

푊_{퐷퐸ꢅ퐴푌}= ꢉ × 푅_푂푁퐿× 퐼_푂푈푇× ꢉ × ꢊ ꢋ 표푛_푑푢푡푦 [W]

Where:

W_DMOS

W_ON

W_DECAY

R_ONH

R_ONL

:

is the consumed power of the output DMOS.

is the consumed power during output ON.

is the consumed power during current decay.

is the upper P-channel DMOS ON-resistance.

is the lower N-channel DMOS ON-resistance.

is the motor output current value.

I_OUT

푡_푂푁

on_duty

:

PWM on duty=

⁄

푡_ꢅ퐻푂푃

t_ONvaries depending on the L and R values of the motor coil and the current set value. Confirm by actual

measurement, or make an approximate calculation.

t_CHOPis the chopping period, which depends on the CR pin. Refer to P.10 for details.

Upper Pch DMOS ON Resistance

Lower Nch DMOS ON Resistance

IC number

R_ONH[Ω] (Typ)

R_ONL[Ω] (Typ)

BD63731EFV

0.18

0.10

푊_푡표푡푎푙 = 푊_푉ꢅꢅꢆ 푊_퐷푀푂푆[W]

ꢌ푗 = ꢌ푎 ꢆ 휃푗푎 × 푊_푡표푡푎푙 [°C]

Where:

W_total

Tj

Ta

:

is the consumed total power of IC.

is the junction temperature.

is the ambient temperature.

is the thermal resistance value.

θja

However, the thermal resistance value θja [°C/W] differs greatly depending on circuit board conditions. The calculated

values above are only theoretical. For actual thermal design, perform sufficient thermal evaluation for the application

board used, and create the thermal design with enough margin not to exceed Tjmax=150 °C. Although unnecessary

with normal use, if the IC is used under especially strict heat conditions, consider externally attaching a Schottky diode

between the motor output pin and GND to abate heat from the IC.

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

20/28

BD63731EFV

Power Dissipation - continued

2

Temperature Monitoring

In respect of BD63731EFV, there is a way to directly measure the approximate chip temperature by using the TEST

pin with a protection diode for prevention from electrostatic discharge. However, temperature monitor way is used only

for evaluation and experimenting, and must not be used in actual usage conditions.

Process 1 Measure the pin voltage when a current of I_DIODE=50 μA flows from the TEST pin to the GND,

without supplying VCC to the IC. This measurement is for measuring the V_Fvoltage of the internal diode.

Process 2 Measure the temperature characteristics of this pin voltage. (V_Fhas a linear negative temperature factor

against the temperature.) With the results of these temperature characteristics, chip temperature can be

calibrated from the TEST pin voltage.

Process 3 Supply VCC, confirm the TEST pin voltage while running the motor, and the chip temperature can be

approximated from the results of Process 2.

-VF［mV］

TEST pin

Internal Circuit

IDIODE

V_F

25

Figure 6. Model diagram for measuring chip temperature

150

Chip Temperature Tj［°C］

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

21/28

BD63731EFV

Application Example

Power save pin.

Refer to P.3 for detail.

Logic input pin.

Refer to P.3 for detail.

TSD

OCP

CLK 15

16

GND

9

OVLO

RESET

UVLO

CW_CCW

MODE0 18

14 PS

Translator

MODE1

MODE2

ENABLE

19

11

20

Bypass capacitor.

Setting range is

100 μF to 470 μF (electrolytic)

0.01 μF to 0.1 μF (multilayer ceramic etc.)

Refer to P.4 for detail.

Be sure to short VCC1 and VCC2.

VREF

13

4 bit DAC

VCC1

7

5

2

Set the output current.

Input by resistor division.

Refer to P.5 for detail.

OUT1A

OUT1B

M

RNF1S

RNF1

Set the chopping frequency.

Setting range is

C:470 pF to 1500 pF

R:10 kΩ to 200 kΩ

3

4

RNF2S

0.2 Ω

100 µF

0.1 µF

RNF1S

Refer to P.5, 10 for detail.

Blank time

PWM control

VCC2

22

24

27

CR

OUT2A

OUT2B

OSC

10

M

Resistor for current detection.

Setting range is

0.1 Ω to 0.2 Ω.

1000 pF

39 kΩ

Mix decay

control

RNF2

MTH 12

26

25

Refer to P.4 for detail.

0.2 Ω

RNF2S

TEST

Regulator

17

GND

1

Set the current decay mode.

1) SLOW DECAY

=>Connect to GND.

Resistor for current detection.

Setting range is

0.1 Ω to 0.2 Ω.

2) MIX DECAY/AUTO DECAY

=>Input by resistor division.

Refer to P.5, 12 for detail.

Test pin.

Applied upon connecting with GND

Refer to P.5 for detail

Refer to P.4 for detail.

www.rohm.com

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

22/28

TSZ22111 • 15 • 001

BD63731EFV

I/O Equivalence Circuit

CW_CCW

MODE0

MODE1

MODE2

ENABLE

PS

CLK

215 kΩ

100 kΩ

10 kΩ

VREF

5 kΩ

10 kΩ

100 kΩ

VREG (internal regulator）

5 kΩ

10 kΩ

RNF1S

RNF2S

MTH

5 kΩ

CR

5 kΩ

100 kΩ

5 kΩ

VCC

OUT1A

OUT2A

OUT1B

OUT2B

RNF1

RNF2

Internal

Circuit

www.rohm.com

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

23/28

TSZ22111 • 15 • 001

BD63731EFV

Operational Notes

1

2

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3

4

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5

6

Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and

routing of connections.

7

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

8

9

Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

24/28

BD63731EFV

Operational Notes – continued

10 Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 7. Example of Monolithic IC Structure

11 Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

12 Thermal Shutdown Circuit (TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the

junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj

falls below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

13 Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

www.rohm.com

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

25/28

TSZ22111 • 15 • 001

BD63731EFV

Ordering Information

E F V

B D 6 3 7 3 1

-

E 2

Package type

EFV: HTSSOP-B28

Packing, Forming specification

E2: Reel-wound embossed taping

ROHM Model

Marking Diagram

HTSSOP-B28 (TOP VIEW)

Part Number Marking

LOT Number

BD63731EFV

Pin 1 Mark

www.rohm.com

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

26/28

TSZ22111 • 15 • 001

BD63731EFV

Physical Dimension and Packing Information

Package Name

HTSSOP-B28

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

27/28

BD63731EFV

Revision History

Date

Revision

001

Changes

21.Jun.2019

New Release

www.rohm.com

TSZ02201-0P1P0C702140-1-2

21.Jun.2019 Rev.001

28/28

TSZ22111 • 15 • 001

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.004


型号：	BD63731EFV
厂家：	ROHM
描述：	BD63731EFV是额定电源36V、额定输出电流3.0A的低功耗双极PWM恒流驱动器。输入接口采用CLK-IN驱动方式，通过内置DAC，励磁模式可适用FULL STEP(2种)、HALF STEP(2种)、QUARTER STEP(2种)、1/8STEP、1/16STEP模式。电流衰减方式方面可任意设定SLOW/FAST DECAY的比率，可对各种电机实现优良控制状态。另外，也可使用一个系统电源进行驱动，有助于提高整机设计的便利性。电机驱动驱动器
文件：	总31页 (文件大小：1993K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD63731EFV [ROHM]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB

SI9137LG

SI9122E