BD63847EFV [ROHM]

Silicon monolithic integrated circuits; 硅单片集成电路


型号：	BD63847EFV
厂家：	ROHM
描述：	Silicon monolithic integrated circuits 硅单片集成电路
文件：	总5页 (文件大小：133K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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STRUCTURE

PRODUCT SERIES

TYPE

Silicon monolithic integrated circuits

Bipolar stepping motor driver

BD63847EFV

FUNCTION

・PWM constant current controllable two H bridge driver

・Built-in translator circuit for CLK-IN control

・Full, Half, Eighth, and Sixteenth step modes

・Mix decay control

○Absolute maximum ratings(Ta=25°C)

Item

Symbol

V_CC1,2

Ratings

Unit

Supply voltage

-0.3～+36.0

1.45^※

4.70^※

Power dissipation

Input voltage for control pin

RNF voltage

V_IN

V_RNF

I_OUT

-0.3～+7.0

0.7

2.0^※

2.5^※

Output current

Output current(peak)^※

A/phase

°C

I_OUTPEAK

T_opr

Operating temperature range

Storage temperature range

Junction temperature

-25～+85

-55～+150

+150

T_stg

°C

T_jmax

°C

※

70mm×70mm×1.6mm glass epoxy board. Derating in done at 11.6mW/°C for operating above Ta=25°C.

4-layer recommended board. Derating in done at 37.6mW/°C for operating above Ta=25°C.

Do not, however exceed Pd, ASO and Tjmax=150°C.

Pulse width tw≦1ms, duty 20%.

○Operating conditions (Ta=-25～+85°C)

Item

Symbol

V_CC1,2

V_IN

Min.

Typ.

Max.

Unit

Supply voltage

Input voltage for control pin

5.5

This product isn’t designed for protection against radioactive rays.

REV. A

2/4

○Electrical characteristics (Unless otherwise specified, Ta=25°C, V_CC1,2=24V)

Limit

Item

Symbol

Unit

Conditions

Min.

Typ.

Max.

Whole

Circuit current at standby

Circuit current

I_CCST

I_CC

1.0

2.5

5.0

PS=L

PS=H, VREF=3V

Control input (CLK, CW_CCW, MODE0, MODE1, ENABLE, PS)

H level input voltage

L level input voltage

H level input current

L level input current

V_INH

V_INL

I_INH

I_INL

2.0

0.8

100

-10

µA

V_IN=5V

V_IN=0V

Output (OUT1A, OUT1B, OUT2A, OUT2B)

I_OUT=1.5A,

Output ON resistance

R_ON

0.85

1.10

Ω

Sum of upper and lower

Output leak current

Current control

I_LEAK

µA

RNFXS input current

RNFX input current

I_RNFS

I_RNF

-2.0

-40

-0.1

-20

µA

RNFXS=0V

RNFX=0V

VREF=0V

VREF input current

I_VREF

V_REF

I_MTH

-2.0

-0.1

VREF input voltage range

MTH input current

3.0

-2.0

-0.1

µA

MTH=0V

MTH input voltage range

Minimum on time (Blank time)

Comparator threshold 1

Comparator threshold 2

Comparator threshold 3

V_MTH

t_ONMIN

V_CTH1

V_CTH2

V_CTH3

3.5

1.5

0.630

0.445

0.264

0.3

0.8

µs

C=1000pF, R=39kΩ

VREF=3V, 100%

0.570

0.403

0.196

0.600

0.424

0.230

VREF=3V, 70.71%

VREF=3V, 38.27%

REV. A

3/4

○Package outline

Product No.

BD63847EFV

Lot No.

HTSSOP-B28 (Unit:mm)

○Block diagram

○Pin No. / Pin name

Pin No.

Pin name

GND

OUT1B

RNF1

RNF1S

OUT1A

Pin No.

Pin name

CLK

Regulator

CLK 15

9 GND

CW_CCW

TEST

MODE0 18

Translator

RESET

MODE1

UVLO

OVLO

TSD

ENABLE

MODE0

MODE1

ENABLE

＋

－

VREF 13

4bit DAC

OCP

VCC1

VCC2

VCC1

GND

＋

－

OUT1A

OUT1B

RNF1S 4

RNF2S 25

OUT2A

RNF2S

RNF2

RNF1

＋

－

MTH

VREF

Blank time

OUT2B

PWM control

VCC2

OUT2A

OUT2B

CR 10

OSC

NC : Non Connection

RNF2

Mix decay

control

MTH 12

TEST 17

GND

REV. A

4/4

○Operation Notes

(1) Absolute maximum ratings

An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating

conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a

short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings,

consider adding circuit protection devices, such as fuses.

(2) Power supply lines

As return of current regenerated by back EMF of motor happens, take steps such as putting capacitor

between power supply and GND as an electric pathway for the regenerated current. Be sure that there is no

problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor

to decide capacity value. If the connected power supply does not have sufficient current absorption capacity,

regenerative current will cause the voltage on the power supply line to rise, which combined with the

product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to

implement a physical safety measure such as the insertion of a voltage clamp diode between the power

supply and GND pins.

(3) GND potential

The potential of GND pin must be minimum potential in all operating conditions.

(4) Metal on the backside (Define the side where product markings are printed as front)

The metal on the backside is shorted with the backside of IC chip therefore it should be connected to GND.

Be aware that there is a possibility of malfunction or destruction if it is shorted with any potential other than

GND.

(5) Thermal design

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual

operating conditions. This IC exposes the metal on the backside of package. Note that this part is assumed

to use after providing heat dissipation treatment to improve heat dissipation efficiency. Try to occupy as

wide as possible with heat dissipation pattern not only on the board surface but also the backside.

(6) Operation in strong electromagnetic field

Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the

IC to malfunction.

(7) ASO

When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.

(8) Thermal shutdown circuit

The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150°C,

and higher, coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to

prevent runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not

use the TSD function to protect peripheral equipment.

(9) Ground wiring pattern

When using both large current and small signal GND patterns, it is recommended to isolate the two ground

patterns, placing a single ground point at the ground potential of application so that the pattern wiring

resistance and voltage variations caused by large currents do not cause variations in the small signal

ground voltage. Be careful not to change the GND wiring pattern of any external components, either.

(10) TEST pin

Be sure to connect TEST pin to GND.

REV. A

Notice

N o t e s

No copying or reproduction of this document, in part or in whole, is permitted without the

consent of ROHM Co.,Ltd.

The content speciﬁed herein is subject to change for improvement without notice.

The content speciﬁed herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the speciﬁcations,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information speciﬁed in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information speciﬁed herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

use of such technical information.

The Products speciﬁed in this document are intended to be used with general-use electronic

equipment or devices (such as audio visual equipment, ofﬁce-automation equipment, commu-

nication devices, electronic appliances and amusement devices).

The Products speciﬁed in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

against the possibility of physical injury, ﬁre or any other damage caused in the event of the

failure of any Product, such as derating, redundancy, ﬁre control and fail-safe designs. ROHM

shall bear no responsibility whatsoever for your use of any Product outside of the prescribed

scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or

system which requires an extremely high level of reliability the failure or malfunction of which

may result in a direct threat to human life or create a risk of human injury (such as a medical

instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-

controller or other safety device). ROHM shall bear no responsibility in any way for use of any

of the Products for the above special purposes. If a Product is intended to be used for any

such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology speciﬁed herein that may

be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to

obtain a license or permit under the Law.

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

http://www.rohm.com/contact/

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R1010

BD63847EFV [ROHM]

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