BD6395FP_11 [ROHM]
Silicon monolithic integrated circuits; 硅单片集成电路
| 型号： | BD6395FP_11 |
| 厂家： | 
ROHM |
| 描述： | Silicon monolithic integrated circuits |
| 文件： | 总5页 (文件大小：973K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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STRUCTURE
PRODUCT SERIES
TYPE
Silicon monolithic integrated circuits
Stepping motor driver
BD6395FP
FUNCTION
・PWM constant current controllable two H bridge driver
・Full, Half, Quarter step
・Parallel IN control
○Absolute maximum ratings(Ta=25℃)
Item
Symbol
VCC1,2
Limit
Unit
Supply voltage
-0.2～+36.0
V
1
1.45※
3.47※
W
Power dissipation
Pd
2
W
Input voltage for control pin
Maximum input voltage for RNF
Maximum output current
Operating temperature range
Storage temperature range
Junction temperature
VIN
VRNF
IOUT
Topr
-0.2～+5.5
V
0.5
1.5※
V
A/phase
℃
3
-25～+75
-55～+150
+150
Tstg
℃
Tjmax
℃
1
2
3
※
※
※
glass epoxy board. Derating in done at 11.6mW/℃ for operating above Ta=25℃.
Recommended 4 layers board. Derating in done at 27.8mW/℃ or operating above Ta=25℃.
Do not, however exceed Pd, ASO and Tjmax=150℃.
○Operating conditions (Ta=-25～+75℃)
Item
Supply voltage
Output current
Symbol
VCC1,2
IOUT
Min
16
-
Typ
24
Max
28
1.2※
Unit
V
4
1.0
A/phase
4
※
Do not, however exceed Pd, ASO.
This product isn’t designed for protection against radioactive rays.
REV. A
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○Electrical characteristics (Unless otherwise specified Ta=25℃, VCC0,1,2=24V)
Limit
Item
Symbol
Unit
Conditions
Min
Typ
Max
Whole
Circuit current at standby
Circuit current
ICCST
ICC
-
-
0.4
3.0
2.0
mA
mA
PS=L
PS=H, VREFX=2V
10.0
Control input
H level input voltage
L level input voltage
Output
VINH
VINL
2.0
-
-
-
-
V
V
0.8
I
OUT=1.0A,
Output ON resistance
RON
-
-
1.0
-
1.3
10
Ω
Sum of upper and lower
Output leak current
Current control
ILEAK
μA
RNFX input current
IRNF
-40
-1.0
0
-20
-0.1
-
μA
μA
V
RNFX=0V
VREF=0V
VREF input current
IVREF
-
VREF input voltage range
Comparator threshold 100%
Comparator threshold 67%
Comparator threshold 33%
Minimum on time
VREF
-
2.0
VCTHLL
VCTHHL
VCTHLH
TONMIN
0.340
0.227
0.113
0.3
0.400
0.267
0.133
0.85
0.460
0.307
0.153
1.40
V
VREF=2V, I0x=L, I1x=L
VREF=2V, I0x=H, I1x=L
VREF=2V, I0x=L, I1x=H
V
V
μsec R=39kΩ, C=1000pF
REV. A
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○Package outline
Type
BD6395FP
Lot No.
HSOP25 (Unit : mm)
○Block diagram
○Pin No. / Pin name
Pin No.
Pin name
Pin No.
14
Pin name
NC
3
VCC1
1
2
PGND
OUT1B
VCC1
RNF1
NC
6
2
OUT1A
OUT1B
PHASE1
CR1
8
7
Predriver
LOGIC
15
GND
I02
ONE
3
16
SHOT
4
RNF1
4
17
I12
10
9
I01
I11
OCP
DAC
5
18
PHASE2
CR2
Current
Limit
Comp.
6
OUT1A
FIN
19
23 VCC2
FIN
7
FIN
20
FIN
20 OUT2A
24 OUT2B
PHASE2
18
CR1
OUT2A
NC
Predriver
LOGIC
ONE
CR2 19
8
PHASE1
I11
21
SHOT
22 RNF2
9
22
RNF2
VCC2
OUT2B
NC
16
17
I02
I12
OCP
DAC
10
11
12
13
I01
23
Current
Limit
Comp.
VREF
PS
24
VREF 11
1 PGND
25
Buffer
NC
TSD
Reference
PS 12
NC : Non Connection
UVLO
OVLO
GND 15
REV. A
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○Operation Notes
(1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature
range may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode
or open mode) when such damage is suffered. A physical safety measure such as a fuse should be
implemented when use of the IC in a special mode where the absolute maximum ratings may be exceeded
is anticipated.
(2) Power supply lines
As return of current regenerated by back EMF of motor happens, take steps such as putting capacitor
between power supply and GND as an electric pathway for the regenerated current. Be sure that there is no
problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor
to decide capacity value. If the connected power supply does not have sufficient current absorption capacity,
regenerative current will cause the voltage on the power supply line to rise, which combined with the
product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to
implement a physical safety measure such as the insertion of a voltage clamp diode between the power
supply and GND pins.
(3) GND potential
Ensure a minimum GND pin potential in all operating conditions.
(4) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual
operating conditions. This IC is equipped with FIN heat dissipation terminals, but dissipation efficiency can
be improved by applying heat dissipation treatment in this area. It is important to consider actual usage
conditions and to take as large a dissipation pattern as possible.
(5) Actions in strong magnetic field
Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to
malfunction.
(6) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(7) Thermal shutdown circuit
The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150℃,
and higher, coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to
prevent runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not
use the TSD function to protect peripheral equipment.
(8) Ground Wiring Pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground
patterns, placing a single ground point at the ground potential of application so that the pattern wiring
resistance and voltage variations caused by large currents do not cause variations in the small signal
ground voltage. Be careful not to change the GND wiring pattern of any external components, either.
REV. A
Notice
N o t e s
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
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which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
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use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, commu-
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The Products specified in this document are not designed to be radiation tolerant.
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