BD6712AF_11 [ROHM]

Silicon Monolithic Integrated Circuit; 硅单片集成电路


型号：	BD6712AF_11
厂家：	ROHM
描述：	Silicon Monolithic Integrated Circuit 硅单片集成电路
文件：	总5页 (文件大小：102K)
中文：	中文翻译
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STRUCTURE

PRODUCT SERIES

TYPE

Silicon Monolithic Integrated Circuit

2-Phase Half-Wave Pre Driver for Fan Motor

ＢＤ６７１２ＡＦ

FEATURES

Built - in zenner diode for Vcc clamp

〇ABSOLUTE MAXIMUM RATINGS

Parameter

Symbol

Limit

780＊

-35～+95

-55～+150

Unit

℃

Power dissipation

Topr

Tstg

Operating temperature

Storage temperature

℃

Iomax

IAL

Output current

AL Signal output current

VAL

AL Signal output voltage

Junction temperature

Tjmax

150

℃

＊

To use at temperature above Ta=25℃ reduce 6.24mW/℃.

(On 70.0mm×70.0mm×1.6mm glass epoxy board)

〇OPERATING CONDITIONS

Parameter

Symbol

Vcc

Limit

3.5～Vcz

1～30

Unit

Operating supply voltage range

Icc

Operating supply current range

FG output voltage range，AL output

voltage range

VSI

0～48

0～Vcz-1.5

Hall input voltage range

＊This product is not designed for production against radioactive rays.

＊This document may be strategic data subject to COCOM regulations.

REV. B

2/4

〇ELECTRICAL CHARACTERISTICS (Unless otherwise specified Ta=25℃,Vcc=5V)

Limit

Symbol

Parameter

Internal voltage

Unit

Conditions

Icc=10mA

Min.

5.5

0.5

Typ.

6.0

1.5

6.7

Max.

6.5

3.0

9.5

Vcz

Icc1

Circuit current1

mA ＊

mA ＊＊

Circuit current2

Icc2

Hall input hysteresis voltage

Lock detection ON time

Lock detection OFF time

Output H voltage

Vhys

TON

TOFF

VOH

VOL

VFGL

IFGL

VALL

IALL

0.25

2.5

0.5

sec

Vcc-0.5 Vcc-0.2

Vcc

0.5

Io=-10mA

Io=10mA

IFG=5mA

VFG=48V

IAL=5mA

VAL=48V

Output L voltage

0.2

0.15

Hall output L voltage

Hall output leak current

Alarm output L voltage

Alarm output leak current

μA

0.15

0.5

μA

＊

＊＊

H+:3V,H-:2V,Output,FG,AL terminal are open.

Hall-input is 100Hz square wave.Output is connected with 1kΩto ground.

FG and AL are connected with 50kΩto Vcc.

REV. B

3/4

〇PACKAGE OUTLINES

5.0 0.2

6712A

Lot No.

0.15 0.1

0.1

1.27

0.4 0.1

SOP 8(UNIT:mm)

〇BLOCK DIAGRAM

〇Terminal name

Terminal

Vcc

OUT2

Pin No.

name

Vcc

H+

H-

GND

OUT1

OUT2

REG

TSD

OUT1

H+

Control

HALL

AMP

LOCK

DETECTION

AND

AUTO

RESTART

H-

GND

REV. B

4/4

〇CAUTIONS

1) Absolute maximum ratings

There is possibility of destruction in using beyond the absolute maximum rating. In case of destruction,

a failure mode can not be defined (short mode or open mode). Therefore when special mode is

envisaged where absolute maximum rating may be exceeded, please take a physical safety measure

such as fuse.

2) Reverse connection of power supply connector

Reverse connection of power supply connector may break IC. Take a measure against reverse

connection destruction such as inserting a diode between power supply and Vcc terminal.

3) Power supply line

Back electromotive force causes regenerated current to power supply line, therefore take a measure

such as placing a capacitor between power supply and GND for routing regenerated current, and fully

ensure that the capacitor characteristics have no problem before determine a capacitor value

4) GND potential

Ensure that the potential of GND terminal is the minimum potential in any operating condition. Also

ensure that all terminals except GND terminal do not fall below GND voltage including transient

characteristics. However, it is possible that the motor output terminal may deflect below GND because

of influence by back electromotive force of motor. Malfunction may possibly occur depending on use

condition, environment, and property of individual motor. Please make fully confirmation that no

problem is found on operation of IC.

5) Thermal design

Consider the power dissipation under actual use condition and apply thermal design with sufficient

margin.

6) Mounting failures

In attaching IC to printed board, pay enough attention to the direction and dislocation of IC. Mounting

failures may break IC. In addition, destruction is also possible when circuit is shorted by foreign

substance brought between outputs or between output and power supply - GND.

7) Operation in strong electromagnetic field

Use in strong electromagnetic field may cause malfunction, please be careful.

8) ASO

Please consider that the output Tr does not exceed the absolute maximum rating and ASO.

9) Thermal shut down circuit

This IC has thermal shut down (TSD) circuit. Operation temperature is 175℃(typ.) and has a hysteresis

width of 25℃(typ.). When IC chip temperature rises and TSD circuit works, the output terminal

becomes an open state. TSD circuit is simply for the purpose of intercepting IC from overheating, and

not for protecting and assuring IC. Therefore do not continue to use IC thereafter with this circuit

operating and do not use IC assuming the operation of this circuit.

10) Inspection with a set board

When connecting a capacitor to a pin with low impedance in inspection on a set board, stress may

possibly be applied to IC, therefore be sure to apply discharging in each process. In attaching to and

detaching from jigs in inspection process, be sure to turn off power before connecting, and turn off

power before removing IC. In addition, apply grounding to assembling process as a measure of

anti-static electricity, and use full caution in transporting and storing.

11) GND wiring pattern

When there are small signal GND and large current GND, separate the large current GND pattern from

small signal GND pattern. It is recommended to apply one-point grounding at the reference point of the

set in order that resistance of wiring pattern and large current do not cause change of voltage of small

signal GND. Please be cautious not to fluctuate the wiring pattern of GND of external mounted parts.

12) Capacitor between output and GND

When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for

some cause, it is possible that the current charged in the capacitor may flow into the output resulting in

destruction. Keep the capacitor between output and GND below 100uF.

13) IC terminal input

When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above

Vcc or below GND is applied to the input terminal, parasitic element is actuated due to the structure of

IC. Operation of parasitic element causes mutual interference between circuits, resulting in malfunction

as well as destruction in the last. Do not use in a manner where parasitic element is actuated.

REV. B

Notice

N o t e s

No copying or reproduction of this document, in part or in whole, is permitted without the

consent of ROHM Co.,Ltd.

The content speciﬁed herein is subject to change for improvement without notice.

The content speciﬁed herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the speciﬁcations,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information speciﬁed in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information speciﬁed herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

use of such technical information.

The Products speciﬁed in this document are intended to be used with general-use electronic

equipment or devices (such as audio visual equipment, ofﬁce-automation equipment, commu-

nication devices, electronic appliances and amusement devices).

The Products speciﬁed in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

against the possibility of physical injury, ﬁre or any other damage caused in the event of the

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The Products are not designed or manufactured to be used with any equipment, device or

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R1120

BD6712AF_11 [ROHM]

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