BD725L05G-C (新产品)

Datasheet

For Automotive 45 V Input

50 mA Fixed Output LDO Regulators

BD7xxL05G-C Series

General Description

Applications

◼ Power Train

◼ Body

The BD7xxL05G-C linear regulators are designed

as low current consumption products for power

supplies in various automotive applications.

◼ Car Infotainment etc.

These products are designed for up to 45

V

absolute maximum supply voltage and operate until

50 mA output current with low current consumption

of 6 μA (Typ). It can regulate the output at a very

high accuracy of ±2 %.

This device features an integrated Over Current

Protection to keep the device from a damage that is

caused by short-circuit or overload. This product

also integrates a Thermal Shutdown protection to

avoid the damage from overheating.

Key Specifications

◼ Wide Temperature Range (Tj):

-40 °C to +150 °C

◼ Wide Operating Input Voltage Range: 3 V to 45 V

◼ Low Current Consumption:

◼ Output Current:

◼ Output Voltage:

◼ High Output Voltage Accuracy:

6 μA (Typ)

50 mA (Max)

2.5 V / 3 V / 3.3 V / 5.0 V (Typ)

±2 %

Package

Furthermore, low ESR ceramic capacitors are

sufficiently applicable for the output phase

compensation.

W (Typ) x D (Typ) x H (Max)

◼ SSOP5:

2.9 mm x 2.8 mm x 1.25 mm

Features

◼ AEC-Q100 Qualified^{(Note 1)}

◼ Functional Safety Supportive Automotive Products

◼ Qualification Planned for Automotive Application

◼ Over Current Protection (OCP)

◼ Thermal Shutdown Protection (TSD)

(Note 1) Grade 1

Typical Application Circuit

◼ Components Externally Connected

Capacitor^{(Note 2)}: 0.1 µF ≤ C_IN(Min), 0.5 µF ≤ C_OUT(Min)

(Note 2) Electrolytic, tantalum, and ceramic capacitors can be used.

Input

Output

VIN

VOUT

BD7xxL05G-C

C_IN

C_OUT

GND

〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.

www.rohm.com

TSZ22111 • 14 • 001

TSZ02201-0BJB0A600090-1-2

1/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Contents

General Description........................................................................................................................................................................1

Features..........................................................................................................................................................................................1

Applications ....................................................................................................................................................................................1

Key Specifications ..........................................................................................................................................................................1

Package..........................................................................................................................................................................................1

Typical Application Circuit ...............................................................................................................................................................1

Contents .........................................................................................................................................................................................2

Pin Configuration ............................................................................................................................................................................4

Pin Descriptions..............................................................................................................................................................................4

Block Diagram ................................................................................................................................................................................5

Description of Blocks ......................................................................................................................................................................5

Absolute Maximum Ratings ............................................................................................................................................................6

Thermal Resistance^{(Note 6)}...............................................................................................................................................................6

Operating Conditions......................................................................................................................................................................7

Electrical Characteristics.................................................................................................................................................................8

Typical Performance Curves (BD725L05G-C)................................................................................................................................9

Figure 1. Output Voltage vs Input Voltage...................................................................................................................................9

Figure 2. Output Voltage vs Input Voltage - Enlarged view .........................................................................................................9

Figure 3. Line Regulation vs Input Voltage..................................................................................................................................9

Figure 4. Output Voltage vs Junction Temperature .....................................................................................................................9

Figure 5. Circuit Current vs Input Voltage..................................................................................................................................10

Figure 6. Circuit Current vs Input Voltage - Enlarged view........................................................................................................10

Figure 7. Circuit Current vs Input Voltage..................................................................................................................................10

Figure 8. Circuit Current vs Input Voltage - Enlarged view........................................................................................................10

Figure 9. Circuit Current vs Junction Temperature ....................................................................................................................11

Figure 10. Circuit Current vs Output Current.............................................................................................................................11

Figure 11. Output Voltage vs Output Current ............................................................................................................................11

Figure 12. Load Regulation vs Output Current..........................................................................................................................11

Figure 13. Output Voltage vs Junction Temperature..................................................................................................................12

Figure 14. Ripple Rejection vs Frequency.................................................................................................................................12

Typical Performance Curves (BD730L05G-C)..............................................................................................................................13

Figure 15. Output Voltage vs Input Voltage...............................................................................................................................13

Figure 16. Output Voltage vs Input Voltage - Enlarged view .....................................................................................................13

Figure 17. Line Regulation vs Input Voltage..............................................................................................................................13

Figure 18. Output Voltage vs Junction Temperature..................................................................................................................13

Figure 19. Circuit Current vs Input Voltage................................................................................................................................14

Figure 20. Circuit Current vs Input Voltage - Enlarged view......................................................................................................14

Figure 21. Circuit Current vs Input Voltage................................................................................................................................14

Figure 22. Circuit Current vs Input Voltage - Enlarged view......................................................................................................14

Figure 23. Circuit Current vs Junction Temperature ..................................................................................................................15

Figure 24. Circuit Current vs Output Current.............................................................................................................................15

Figure 25. Output Voltage vs Output Current ............................................................................................................................15

Figure 26. Load Regulation vs Output Current..........................................................................................................................15

Figure 27. Dropout Voltage vs Output Current ..........................................................................................................................16

Figure 28. Output Voltage vs Junction Temperature..................................................................................................................16

Figure 29. Ripple Rejection vs Frequency.................................................................................................................................16

Typical Performance Curves (BD733L05G-C)..............................................................................................................................17

Figure 30. Output Voltage vs Input Voltage...............................................................................................................................17

Figure 31. Output Voltage vs Input Voltage - Enlarged view .....................................................................................................17

Figure 32. Line Regulation vs Input Voltage..............................................................................................................................17

Figure 33. Output Voltage vs Junction Temperature..................................................................................................................17

Figure 34. Circuit Current vs Input Voltage................................................................................................................................18

Figure 35. Circuit Current vs Input Voltage - Enlarged view......................................................................................................18

Figure 36. Circuit Current vs Input Voltage................................................................................................................................18

Figure 37. Circuit Current vs Input Voltage - Enlarged view......................................................................................................18

Figure 38. Circuit Current vs Junction Temperature ..................................................................................................................19

Figure 39. Circuit Current vs Output Current.............................................................................................................................19

Figure 40. Output Voltage vs Output Current ............................................................................................................................19

Figure 41. Load Regulation vs Output Current..........................................................................................................................19

Figure 42. Dropout Voltage vs Output Current ..........................................................................................................................20

Figure 43. Output Voltage vs Junction Temperature..................................................................................................................20

Figure 44. Ripple Rejection vs Frequency.................................................................................................................................20

Typical Performance Curves (BD750L05G-C)..............................................................................................................................21

Figure 45. Output Voltage vs Input Voltage...............................................................................................................................21

Figure 46. Output Voltage vs Input Voltage - Enlarged view .....................................................................................................21

Figure 47. Line Regulation vs Input Voltage..............................................................................................................................21

Figure 48. Output Voltage vs Junction Temperature..................................................................................................................21

Figure 49. Circuit Current vs Input Voltage................................................................................................................................22

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

2/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Figure 50. Circuit Current vs Input Voltage - Enlarged view......................................................................................................22

Figure 51. Circuit Current vs Input Voltage................................................................................................................................22

Figure 52. Circuit Current vs Input Voltage - Enlarged view......................................................................................................22

Figure 53. Circuit Current vs Junction Temperature ..................................................................................................................23

Figure 54. Circuit Current vs Output Current.............................................................................................................................23

Figure 55. Output Voltage vs Output Current ............................................................................................................................23

Figure 56. Load Regulation vs Output Current..........................................................................................................................23

Figure 57. Dropout Voltage vs Output Current ..........................................................................................................................24

Figure 58. Output Voltage vs Junction Temperature..................................................................................................................24

Figure 59. Ripple Rejection vs Frequency.................................................................................................................................24

Measurement Circuit for Typical Performance Curves..................................................................................................................25

Application and Implementation....................................................................................................................................................26

Selection of External Components............................................................................................................................................26

Input Pin Capacitor................................................................................................................................................................26

Output Pin Capacitor .............................................................................................................................................................26

Typical Application and Layout Example ...................................................................................................................................28

Surge Voltage Protection for Linear Regulators ........................................................................................................................29

Positive surge to the input .....................................................................................................................................................29

Negative surge to the input....................................................................................................................................................29

Reverse Voltage Protection for Linear Regulators ....................................................................................................................29

Protection against Reverse Input/Output Voltage..................................................................................................................29

Protection against Input Reverse Voltage..............................................................................................................................30

Protection against Reverse Output Voltage when the Output is connected to an Inductor....................................................31

Power Dissipation.........................................................................................................................................................................32

Thermal Design ............................................................................................................................................................................33

I/O Equivalence Circuit^{(Note 1)}.........................................................................................................................................................34

Operational Notes.........................................................................................................................................................................35

1.

2.

3.

4.

5.

6.

7.

8.

Reverse Connection of Power Supply............................................................................................................................35

Power Supply Lines........................................................................................................................................................35

Ground Voltage...............................................................................................................................................................35

Ground Wiring Pattern....................................................................................................................................................35

Operating Conditions......................................................................................................................................................35

Inrush Current.................................................................................................................................................................35

Testing on Application Boards ........................................................................................................................................35

Inter-pin Short and Mounting Errors ...............................................................................................................................35

Regarding the Input Pin of the IC ...................................................................................................................................36

Ceramic Capacitor..........................................................................................................................................................36

Thermal Shutdown Circuit (TSD)....................................................................................................................................36

Over Current Protection Circuit (OCP) ...........................................................................................................................36

Thermal Consideration ...................................................................................................................................................36

Functional Safety............................................................................................................................................................36

9.

10.

11.

12.

13.

14.

Ordering Information.....................................................................................................................................................................37

Marking Diagram ..........................................................................................................................................................................37

Lineup...........................................................................................................................................................................................37

Physical Dimension and Packing Information...............................................................................................................................38

Revision History............................................................................................................................................................................39

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

3/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Pin Configuration

SSOP5

(Top View)

Pin Descriptions

Pin No.

Pin Name

Function

Descriptions

This pin is not connected to the chip.

It can kept open or it’s also possible to connect to GND.

1

N.C.

Not Connected

This is the Ground pin.

It should be connected to the lowest potential.

2

3

GND

N.C.

Ground Pin

This pin is not connected to the chip.

It can kept open or it’s also possible to connect to GND.

Not Connected

This pin supplies the input voltage.

It is necessary to connect a capacitor which is 0.1 μF (Min) or higher

4

5

VIN

Supply Voltage Input Pin between VIN pin and GND.

The detailed selecting guide is described in Selection of External

Components.

This pin outputs the voltage setting.

It is necessary to connect a capacitor which is 0.5 μF (Min) or higher

between the VOUT pin and GND.

VOUT

Output Pin

The detailed selecting guide is described in Selection of External

Components.

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

4/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Block Diagram

N.C. ( 3Pin )

GND ( 2Pin )

N.C. ( 1Pin )

OCP

PREREG

VREF

AMP

DRIVER

TSD

VIN ( 4Pin )

VOUT ( 5Pin )

Description of Blocks

Block Name

Function

Description of Blocks

Provides Power Supply for the Internal Circuit.

PREREG

Internal Power Supply

In case maximum power dissipation is exceeded or the ambient

temperature is higher than the Maximum Junction Temperature,

overheating causes the chip temperature (Tj) to rise.

The TSD protection circuit detects this and forces the output to turn off in

order to protect the device from overheating.

TSD

Thermal Shutdown

When the junction temperature decreases, the output turns on

automatically.

Output pin is discharged when the TSD protection circuit is operating.

VREF

AMP

Reference Voltage

Error Amplifier

Generates the Reference Voltage.

The Error Amplifier amplifies the difference between the divided feedback

voltage and the reference voltage, and then it regulates Output Power Tr.

via the DRIVER.

DRIVER

Output MOSFET Driver

Drives the Output MOSFET (Power Tr.).

If the output current increases higher than the maximum Output Current,

it will be limited by the Over Current Protection in order to protect the

device from damage that will be caused by over current.

At this operating condition, the output voltage may decrease because the

output current is limited.

OCP

Over Current Protection

If an abnormal state is removed, and the output current value returns

normally, the output voltage will also return to normal state.

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

5/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Absolute Maximum Ratings

Parameter

Symbol

Ratings

Unit

Input Supply Voltage^{(Note 1)}

Output Voltage^{(Note 2)}

V_IN

V_OUT

-0.3 to +45

-0.3 to +18

-40 to +150

-55 to +150

150

V

Junction Temperature Range

Storage Temperature Range

Tj

°C

V

Tstg

Maximum Junction Temperature

ESD Withstand Voltage (HBM) ^{(Note 3)}

ESD Withstand Voltage (CDM) ^{(Note 4)}

Tjmax

V_{ESD_HBM}

V_{ESD_CDM}

± 2000

± 750

V

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance and power dissipation taken into

consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating.

(Note 1) Do not exceed Tjmax.

(Note 2) Do not exceed V_IN+ 0.3 V.

(Note 3) ESD susceptibility Human Body Model “HBM”; base on ANSI/ESDA/JEDEC JS001 (1.5 kΩ, 100 pF).

(Note 4) ESD susceptibility Charged Device Model “CDM”; base on JEDEC JESD22-C101.

Thermal Resistance^{(Note 6)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 8)}

2s2p^{(Note 9)}

SSOP5

Junction to Ambient

θ_JA

247.3

43

155.5

33

°C/W

Junction to Top Characterization Parameter^{(Note 7)}

Ψ_JT

(Note 6) Based on JESD51-2A (Still-Air). Using BD750L05G-C Chips.

(Note 7) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface

of the component package.

(Note 8) Using a PCB board based on JESD51-3.

(Note 9) Using a PCB board based on JESD51-7.

Layer Number of

Measurement Board

Material

Board Size

Single

FR-4

114.3 mm x 76.2 mm x 1.57 mmt

Top

Copper Pattern

Thickness

70 μm

Footprints and Traces

Layer Number of

Measurement Board

Material

Board Size

4 Layers

FR-4

114.3 mm x 76.2 mm x 1.6 mmt

2 Internal Layers

Top

Bottom

Copper Pattern

Thickness

70 μm

Copper Pattern

Thickness

35 μm

Thickness

70 μm

Footprints and Traces

74.2 mm x 74.2 mm

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

6/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Operating Conditions

Parameter

BD725L05G-C /

Symbol

V_IN

Min

3.5

Max

42.0

Unit

V

BD730L05G-C

BD733L05G-C

BD750L05G-C

Input Supply Voltage^{(Note 1)}

( I_OUT≤ 50 mA )

V_IN

3.8

5.6

3

42.0

-

V

Start-up Voltage^{(Note 2)}

Output Current

V_{IN Start-up}

I_OUT

V

0

50

mA

µF

Ω

Input Capacitor^{(Note 3)}

Output Capacitor^{(Note 4)}

C_IN

0.1

0.5

-

C_OUT

1000

100

+125

Output Capacitor Equivalent Series Resistance^{(Note 5)}

ESR (C_OUT

Ta

)

Operating Temperature

-40

°C

(Note 1) Minimum Input Supply Voltage must be V_{IN Start-up}= 3 V or more.

Consider that the output voltage would be reduced (Dropout Voltage) by the output current.

(Note 2) When I_OUT= 0 mA

(Note 3) If the inductance of power supply line is high, adjust input capacitor value.

(Note 4) Set the value of the capacitor so that it does not fall below the minimum value. Take into consideration the temperature characteristics and DC device

characteristics.

(Note 5) Refer to Selection of External Components and select the parts.

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

7/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Electrical Characteristics

Unless otherwise specified, Tj = -40 °C to +150 °C, V_IN= 13.5 V, I_OUT= 0 mA

Typical values are defined at Tj = 25 °C, V_IN= 13.5 V, I_OUT= 0 mA.

Limits

Parameter

Symbol

Unit

Conditions

Min

Typ

Max

9

I_OUT= 0 mA

Tj ≤ +25 °C

I_OUT= 0 mA

Tj ≤ +105 °C

I_OUT= 0 mA

Tj ≤ +125 °C

I_OUT≤ 50 mA

Tj ≤ +150 °C

-

6

μA

%

-

6

-

12

13

15

+2

Circuit Current

I_CC

-

V_OUT+ 1 V ≤ V_IN≤ 42 V

100 μA ≤ I_OUT≤ 50 mA

V_OUT+ 1 V ≤ V_IN≤ 42 V

I_OUT≤ 100 μA

-2

Output Voltage Accuracy

ΔV_OUT

-2

-

+2

%

Tj ≤ +125 °C

V_IN= V_OUT× 0.95 (= 2.85 V / 3.135 V)

I_OUT= 0.1 mA

-

100

180

300

200

260

350

200

280

400

350

410

500

mV

Dropout Voltage^{(Note 1)}

(BD730L05G-C / BD733L05G-C)

V_IN= V_OUT× 0.95 (= 2.85 V / 3.135 V)

I_OUT= 20 mA

ΔVd

V_IN= V_OUT× 0.95 (= 2.85 V / 3.135 V)

I_OUT= 50 mA

V_IN= V_OUT× 0.95 (= 4.75 V)

I_OUT= 0.1 mA

V_IN= V_OUT× 0.95 (= 4.75 V)

I_OUT= 20 mA

Dropout Voltage

(BD750L05G-C)

ΔVd

R.R.

V_IN= V_OUT× 0.95 (= 4.75 V)

I_OUT= 50 mA

f = 120 Hz

Ripple Rejection

55

60

-

dB

Vripple = 1 Vrms

I_OUT= 50 mA

Line Regulation

Reg.I

Reg.L

TSD

-

0.1

0.6

-

% × V_OUTV_OUT+ 1 V ≤ V_IN≤ 42 V

% × V_OUT100 μA ≤ I_OUT≤ 50 mA

Load Regulation

Thermal Shutdown

Over Current Protection

151

51

175

120

°C

Tj at TSD ON

I_OCP

-

mA

(Note 1) Minimum Input Supply Voltage of BD725L05G-C must be V_{IN Start-up}= 3 V or more.

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

18.Nov.2022 Rev.002

8/39

BD7xxL05G-C Series

Typical Performance Curves (BD725L05G-C)

Unless otherwise specified, V_IN= 13.5 V, I_OUT= 0 mA, C_IN= 0.1 μF, C_OUT= 1.0 μF

6

5

4

3

2

1

0

6

5

4

3

2

1

0

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

0

1

2

3

4

5

0

10

20

30

40

50

Input Voltage: V_IN[V]

Figure 1. Output Voltage vs Input Voltage

Figure 2. Output Voltage vs Input Voltage - Enlarged view

0.6

0.5

0.4

0.3

0.2

0.1

0.0

2.56

2.53

2.50

2.47

2.44

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

0

10

20

30

40

50

-40

0

40

80

120

160

Input Voltage: V_IN[V]

Junction Temperature: Tj [°C]

Figure 3. Line Regulation vs Input Voltage

(V_IN= 3.5 V to 45 V)

Figure 4. Output Voltage vs Junction Temperature

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

9/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Typical Performance Curves (BD725L05G-C) – continued

Unless otherwise specified, V_IN= 13.5 V, I_OUT= 0 mA, C_IN= 0.1 μF, C_OUT= 1.0 μF

30

25

20

15

10

5

15

12

9

Tj = -40 °C

Tj = +25 °C

Tj = +125 °C

Tj = +150 °C

6

Tj = -40 °C

Tj = +25 °C

Tj = +125 °C

Tj = +150 °C

3

0

10

20

30

40

50

0

10

20

30

40

50

Input Voltage: V_IN[V]

Figure 5. Circuit Current vs Input Voltage

(I_OUT= 0 mA)

Figure 6. Circuit Current vs Input Voltage - Enlarged view

(I_OUT= 0 mA)

60

50

40

30

20

10

0

15

12

9

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

6

Tj = -40 °C

3

Tj = +25 °C

Tj = +150 °C

40 50

0

10

20

30

40

50

0

10

20

30

Input Voltage: V_IN[V]

Figure 7. Circuit Current vs Input Voltage

(I_OUT= 50 mA)

Figure 8. Circuit Current vs Input Voltage - Enlarged view

(I_OUT= 50 mA)

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

18.Nov.2022 Rev.002

10/39

BD7xxL05G-C Series

Typical Performance Curves (BD725L05G-C) – continued

Unless otherwise specified, V_IN= 13.5 V, I_OUT= 0 mA, C_IN= 0.1 μF, C_OUT= 1.0 μF

15

12

9

15

12

9

6

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

3

0

10

20

30

40

50

-40

0

40

80

120

160

Output Current: I_OUT[mA]

Junction Temperature: Tj [°C]

Figure 9. Circuit Current vs Junction Temperature

(I_OUT= 0 mA)

Figure 10. Circuit Current vs Output Current

6

0.0

-0.1

-0.2

-0.3

-0.4

-0.5

-0.6

5

Tj = -40 °C

Tj = -40 ℃

Tj = +25 ℃

Tj = +150 ℃

4

3

2

1

0

Tj = +25 °C

Tj = +150 °C

0

50

100

150

200

0

10

20

30

40

50

Output Current: I_OUT[mA]

Figure 11. Output Voltage vs Output Current

(Over Current Protection)

Figure 12. Load Regulation vs Output Current

(I_OUT= 100 μA to 50 mA)

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

11/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Typical Performance Curves (BD725L05G-C) – continued

Unless otherwise specified, V_IN= 13.5 V, I_OUT= 0 mA, C_IN= 0.1 μF, C_OUT= 1.0 μF

100

80

60

40

20

0

6

5

4

3

2

1

0

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

0.01

0.1

1

10

100

1000

100

120

140

160

180

200

Frequency: f [kHz]

Junction Temperature: Tj [°C]

Figure 13. Output Voltage vs Junction Temperature

(Thermal Shutdown Protection)

Figure 14. Ripple Rejection vs Frequency

(I_OUT= 50 mA)

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

12/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Typical Performance Curves (BD730L05G-C)

Unless otherwise specified, V_IN= 13.5 V, I_OUT= 0 mA, C_IN= 0.1 μF, C_OUT= 1.0 μF

6

5

4

3

2

1

0

6

5

4

3

2

1

0

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

0

10

20

30

40

50

0

1

2

3

4

5

Input Voltage: V_IN[V]

Figure 15. Output Voltage vs Input Voltage

Figure 16. Output Voltage vs Input Voltage - Enlarged view

3.06

3.03

3.00

2.97

2.94

0.6

0.5

0.4

0.3

0.2

0.1

0.0

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

0

10

20

30

40

50

-40

0

40

80

120

160

Input Voltage: V_IN[V]

Junction Temperature: Tj [°C]

Figure 17. Line Regulation vs Input Voltage

(V_IN= 4 V to 45 V)

Figure 18. Output Voltage vs Junction Temperature

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

13/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Typical Performance Curves (BD730L05G-C) – continued

Unless otherwise specified, V_IN= 13.5 V, I_OUT= 0 mA, C_IN= 0.1 μF, C_OUT= 1.0 μF

30

25

20

15

10

5

15

12

9

Tj = -40 °C

Tj = +25 °C

Tj = +125 °C

Tj = +150 °C

6

Tj = -40 °C

Tj = +25 °C

Tj = +125 °C

Tj = +150 °C

3

0

10

20

30

40

50

0

10

20

30

40

50

Input Voltage: V_IN[V]

Figure 19. Circuit Current vs Input Voltage

(I_OUT= 0 mA)

Figure 20. Circuit Current vs Input Voltage - Enlarged view

(I_OUT= 0 mA)

60

50

40

30

20

10

0

15

12

9

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

6

Tj = -40 °C

3

Tj = +25 °C

Tj = +150 °C

40 50

0

10

20

30

40

50

0

10

20

30

Input Voltage: V_IN[V]

Figure 21. Circuit Current vs Input Voltage

(I_OUT= 50 mA)

Figure 22. Circuit Current vs Input Voltage - Enlarged view

(I_OUT= 50 mA)

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

14/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Typical Performance Curves (BD730L05G-C) – continued

Unless otherwise specified, V_IN= 13.5 V, I_OUT= 0 mA, C_IN= 0.1 μF, C_OUT= 1.0 μF

15

12

9

15

12

9

6

Tj = -40 °C

Tj = +25 °C

Tj= +150 °C

3

0

-40

0

40

80

120

160

0

10

20

30

40

50

Junction Temperature: Tj [°C]

Output Current: I_OUT[mA]

Figure 23. Circuit Current vs Junction Temperature

(I_OUT= 0 mA)

Figure 24. Circuit Current vs Output Current

0.0

-0.1

-0.2

-0.3

-0.4

-0.5

-0.6

6

5

4

3

2

1

0

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

0

50

100

150

200

0

10

20

30

40

50

Output Current: I_OUT[mA]

Figure 25. Output Voltage vs Output Current

(Over Current Protection)

Figure 26. Load Regulation vs Output Current

(I_OUT= 100 μA to 50 mA)

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

15/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Typical Performance Curves (BD730L05G-C) – continued

Unless otherwise specified, V_IN= 13.5 V, I_OUT= 0 mA, C_IN= 0.1 μF, C_OUT= 1.0 μF

0.5

0.4

0.3

0.2

0.1

0.0

6

5

4

3

2

1

0

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

0

10

20

30

40

50

100

120

140

160

180

200

Output Current: I_OUT[mA]

Junction Temperature: Tj [°C]

Figure 27. Dropout Voltage vs Output Current

(V_IN= V_OUT× 0.95 = 2.85 V)

Figure 28. Output Voltage vs Junction Temperature

(Thermal Shutdown Protection)

100

80

60

40

20

0

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

0.01

0.1

1

10

100

1000

Frequency: f [kHz]

Figure 29. Ripple Rejection vs Frequency

(I_OUT= 50 mA)

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

16/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Typical Performance Curves (BD733L05G-C)

Unless otherwise specified, V_IN= 13.5 V, I_OUT= 0 mA, C_IN= 0.1 μF, C_OUT= 1.0 μF

6

5

4

3

2

1

0

6

5

4

3

2

1

0

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

0

10

20

30

40

50

0

1

2

3

4

5

Input Voltage: V_IN[V]

Figure 30. Output Voltage vs Input Voltage

Figure 31. Output Voltage vs Input Voltage - Enlarged view

3.36

3.33

3.30

3.27

3.24

0.6

0.5

0.4

0.3

0.2

0.1

0.0

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

0

10

20

30

40

50

-40

0

40

80

120

160

Input Voltage: V_IN[V]

Junction Temperature: Tj [°C]

Figure 32. Line Regulation vs Input Voltage

(V_IN= 4.3 V to 45 V)

Figure 33. Output Voltage vs Junction Temperature

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

17/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Typical Performance Curves (BD733L05G-C) – continued

Unless otherwise specified, V_IN= 13.5 V, I_OUT= 0 mA, C_IN= 0.1 μF, C_OUT= 1.0 μF

15

12

9

30

25

20

15

10

5

Tj = -40 °C

Tj = +25 °C

Tj = +125 °C

Tj = +150 °C

6

Tj = -40 °C

Tj = +25 °C

Tj = +125 °C

Tj = +150 °C

3

0

10

20

30

40

50

0

10

20

30

40

50

Input Voltage: V_IN[V]

Figure 34. Circuit Current vs Input Voltage

(I_OUT= 0 mA)

Figure 35. Circuit Current vs Input Voltage - Enlarged view

(I_OUT= 0 mA)

60

50

40

30

20

10

0

15

12

9

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

6

Tj = -40 °C

3

Tj = +25 °C

Tj = +150 °C

40 50

0

10

20

30

40

50

0

10

20

30

Input Voltage: V_IN[V]

Figure 36. Circuit Current vs Input Voltage

(I_OUT= 50 mA)

Figure 37. Circuit Current vs Input Voltage - Enlarged view

(I_OUT= 50 mA)

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

18/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Typical Performance Curves (BD733L05G-C) – continued

Unless otherwise specified, V_IN= 13.5 V, I_OUT= 0 mA, C_IN= 0.1 μF, C_OUT= 1.0 μF

15

12

9

15

12

9

6

Tj = -40 °C

Tj = +25 °C

Tj= +150 °C

3

0

-40

0

40

80

120

160

0

10

20

30

40

50

Junction Temperature: Tj [°C]

Output Current: I_OUT[mA]

Figure 38. Circuit Current vs Junction Temperature

(I_OUT= 0 mA)

Figure 39. Circuit Current vs Output Current

(I_OUT= 0 mA)

6

0.0

-0.1

-0.2

-0.3

-0.4

-0.5

-0.6

Tj = -40 °C

5

Tj = +25 °C

Tj = -40 ℃

Tj = +25 ℃

Tj = +150 ℃

Tj = +150 °C

4

3

2

1

0

50

100

150

200

0

10

20

30

40

50

Output Current: I_OUT[mA]

Figure 40. Output Voltage vs Output Current

(Over Current Protection)

Figure 41. Load Regulation vs Output Current

(I_OUT= 100 μA to 50 mA)

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

19/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Typical Performance Curves (BD733L05G-C) – continued

Unless otherwise specified, V_IN= 13.5 V, I_OUT= 0 mA, C_IN= 0.1 μF, C_OUT= 1.0 μF

6

5

4

3

2

1

0

0.5

0.4

0.3

0.2

0.1

0.0

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

0

10

20

30

40

50

100

120

140

160

180

200

Output Current: I_OUT[mA]

Junction Temperature: Tj [°C]

Figure 42. Dropout Voltage vs Output Current

(V_IN= V_OUT× 0.95 V = 3.135 V)

Figure 43. Output Voltage vs Junction Temperature

(Thermal Shutdown Protection)

100

80

60

40

20

0

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

0.01

0.1

1

10

100

1000

Frequency: f [kHz]

Figure 44. Ripple Rejection vs Frequency

(I_OUT= 50 mA)

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

20/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Typical Performance Curves (BD750L05G-C)

Unless otherwise specified, V_IN= 13.5 V, I_OUT= 0 mA, C_IN= 0.1 μF, C_OUT= 1.0 μF

6

5

4

3

2

1

0

6

5

4

3

2

1

0

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

0

10

20

30

40

50

0

1

2

3

4

5

Input Voltage: V_IN[V]

Figure 45. Output Voltage vs Input Voltage

Figure 46. Output Voltage vs Input Voltage - Enlarged view

5.10

5.05

5.00

4.95

4.90

0.6

0.5

0.4

0.3

0.2

0.1

0.0

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

-40

0

40

80

120

160

0

10

20

30

40

50

Junction Temperature: Tj [°C]

Input Voltage: V_IN[V]

Figure 47. Line Regulation vs Input Voltage

(V_IN= 6 V to 45 V)

Figure 48. Output Voltage vs Junction Temperature

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

21/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Typical Performance Curves (BD750L05G-C) – continued

Unless otherwise specified, V_IN= 13.5 V, I_OUT= 0 mA, C_IN= 0.1 μF, C_OUT= 1.0 μF

30

25

20

15

10

5

15

12

9

Tj = -40 °C

Tj = +25 °C

Tj = +125 °C

Tj = +150 °C

6

Tj = -40 °C

Tj = +25 °C

Tj = +125 °C

Tj = +150 °C

3

0

10

20

30

40

50

0

10

20

30

40

50

Input Voltage: V_IN[V]

Figure 49. Circuit Current vs Input Voltage

(I_OUT= 0 mA)

Figure 50. Circuit Current vs Input Voltage - Enlarged view

(I_OUT= 0 mA)

60

50

40

30

20

10

0

15

12

9

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

6

Tj = -40 °C

3

Tj = +25 °C

Tj = +150 °C

40 50

0

10

20

30

40

50

0

10

20

30

Input Voltage: V_IN[V]

Figure 51. Circuit Current vs Input Voltage

(I_OUT= 50 mA)

Figure 52. Circuit Current vs Input Voltage - Enlarged view

(I_OUT= 50 mA)

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

22/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Typical Performance Curves (BD750L05G-C) – continued

Unless otherwise specified, V_IN= 13.5 V, I_OUT= 0 mA, C_IN= 0.1 μF, C_OUT= 1.0 μF

15

12

9

15

12

9

6

Tj = -40 °C

Tj = +25 °C

Tj= +150 °C

3

0

-40

0

40

80

120

160

0

10

20

30

40

50

Junction Temperature: Tj [°C]

Output Current: I_OUT[mA]

Figure 53. Circuit Current vs Junction Temperature

(I_OUT= 0 mA)

Figure 54. Circuit Current vs Output Current

6

5

4

3

0.0

-0.1

-0.2

-0.3

-0.4

-0.5

-0.6

Tj = -40 ℃

Tj = +25 ℃

Tj = +150 ℃

2

1

0

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

0

50

100

150

200

0

10

20

30

40

50

Output Current: I_OUT[mA]

Figure 55. Output Voltage vs Output Current

(Over Current Protection)

Figure 56. Load Regulation vs Output Current

(I_OUT= 100 μA to 50 mA)

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

23/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Typical Performance Curves (BD750L05G-C) – continued

Unless otherwise specified, V_IN= 13.5 V, I_OUT= 0 mA, C_IN= 0.1 μF, C_OUT= 1.0 μF

0.5

0.4

0.3

0.2

0.1

0.0

6

5

4

3

2

1

0

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

0

10

20

30

40

50

100

120

140

160

180

200

Output Current: I_OUT[mA]

Junction Temperature: Tj [°C]

Figure 57. Dropout Voltage vs Output Current

(V_IN= V_OUT× 0.95 V = 4.75 V)

Figure 58. Output Voltage vs Junction Temperature

(Thermal Shutdown Protection)

100

80

60

40

20

0

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

0.01

0.1

1

10

100

1000

Frequency: f [kHz]

Figure 59. Ripple Rejection vs Frequency

(I_OUT= 50 mA)

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

24/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Measurement Circuit for Typical Performance Curves

VIN

VOUT

VIN

VOUT

I_OUT

V_IN

C_IN

V_IN

C_IN

C_OUT

GND

A

V

Measurement Setup for

Figure 1, 2, 3, 4, 13,

Figure 15, 16, 17, 18, 28,

Figure 30, 31, 32, 33, 43,

Figure 45, 46, 47, 48, 58

Measurement Setup for

Figure 5, 6, 7, 8, 9,

Figure 19, 20, 21, 22, 23,

Figure 34, 35, 36, 37, 38,

Figure 49, 50, 51, 52, 53

VIN

VOUT

VIN

VOUT

I_OUT

V_IN

C_IN

C_OUT

GND

A

I_OUT

C_IN

V_IN

C_OUT

GND

V

Measurement Setup for

Figure 10, 24, 39, 54

Measurement Setup for

Figure 11, 12, 25, 26,

Figure 40, 41, 55, 56

V

VIN

VOUT

VIN

VOUT

I_OUT

1 V_rms

V_IN

C_IN

C_OUT

GND

I_OUT

C_IN

C_OUT

GND

M

V_IN

Measurement Setup for

Figure 27, 42, 57

Measurement Setup for

Figure 14, 29, 44, 59

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

25/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Application and Implementation

Notice: The following information is given as a reference or hint for the application and the implementation. Therefore, it does

not guarantee its operation on the specific function, accuracy or external components in the application. In the

application, it shall be designed with sufficient margin by enough understanding about characteristics of the external

components, e.g. capacitor, and also by appropriate verification in the actual operating conditions.

Selection of External Components

Input Pin Capacitor

If the battery is placed far from the regulator or the impedance of the input-side is high, higher capacitance is required for

the input capacitor in order to prevent the voltage-drop at the input line. The input capacitor and its capacitance should be

selected depending on the line impedance which is between the input pin and the smoothing filter circuit of the power

supply. At this time, the capacitance value setting is different each application. Generally, the capacitor with capacitance

value of 0.1 µF (Min) or more with good high frequency characteristic is recommended for this regulator.

In addition, to prevent an influence to the regulator’s characteristic from the deviation or the variation of the external

capacitor’s characteristic. All input capacitors mentioned above are recommended to have a good DC bias characteristic

and a temperature characteristic (approximately ±15 %, e.g. X7R, X8R) with being satisfied high absolute maximum

voltage rating based on EIA standard. These capacitors should be placed close to the input pin and mounted on the same

board side of the regulator not to be influenced by implementation impedance.

Output Pin Capacitor

The output capacitor is mandatory that stop oscillation for the regulator in order to realize stable operation. The output

capacitor with effective capacitance value ≥ 0.5 µF (Min) and ESR up to 100 Ω (Max) must be required between the output

pin and the GND pin. By using a ceramic capacitor, enables to expect smaller set and long-life.

A proper selection of appropriate both the capacitance value and ESR for the output capacitor can improve the transient

response of the regulator and can also keep the stability with better regulation loop. The correlation of the output

capacitance value and ESR is shown in the graph (Figure 60 Output Capacitance C_OUT, ESR Stable Available Area) on the

next page as the output capacitor’s capacitance value and the stability region for ESR. As described in this graph, this

regulator is designed to be stable with ceramic capacitors as of MLCC, with the capacitance value from 0.5 µF to 1000 µF

and with ESR value within almost 0 Ω to 100 Ω. The frequency range of ESR can be generally considered as within about

10 kHz to 100 kHz.

Note that the provided the stable area of the capacitance value and ESR in the graph is obtained under a specific set of

conditions which is based on the measurement result in single IC on our board with a resistive load. In the actual

environment, the stability is affected by wire impedance on the board, input power supply impedance and also loads

impedance. Therefore, note that a careful evaluation of the actual application, the actual usage environment and the

actual conditions should be done to confirm the actual stability of the system.

Generally, in the transient event which is caused by the input voltage fluctuation or the load fluctuation beyond the gain

bandwidth of the regulation loop, the transient response ability of the regulator depends on the capacitance value of the

output capacitor. Basically the capacitance value of ≥ 1.0 µF (Typ) for the output capacitor is recommended. Using bigger

capacitance value can be expected to improve better the output voltage fluctuation in a high frequency. Various types of

capacitors can be used for the output capacitor with high capacity which includes electrolytic capacitor, electro-conductive

polymer capacitor and tantalum capacitor. Noted that, depending on the type of capacitors, its characteristics such as ESR

(≤ 100 Ω) absolute value range, a temperature dependency of capacitance value and increased ESR at cold temperature

needs to be taken into consideration. Especially when the ESR is large, the voltage generated by charge current and

discharge current to capacitor and ESR are large. When transient response such that charge current and discharge

current flow, noted that output voltage fluctuation.

In addition, the same consideration should be taken as the input pin capacitor, to prevent an influence to the regulator’s

characteristic from the deviation or the variation of the external capacitor’s characteristic. All output capacitors mentioned

above are recommended to have a good DC bias characteristic and a temperature characteristic (approximately ±15 %,

e.g. X7R, X8R) with being satisfied high absolute maximum voltage rating based on EIA standard. These capacitors

should be placed close to the output pin and mounted on the same board side of the regulator not to be influenced by

implementation impedance.

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

26/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Output Pin Capacitor - continued

120

100

80

60

40

20

0

Unstable Available Area

Stable Available Area

0.5 μF ≤ C_OUT

ESR (C_OUT) ≤ 100 Ω

0.1

1

10

100

1000

Output Capacitance C_OUT[μF]

Figure 60. Output Capacitance C_OUT, ESR Stable Available Area

Parameter

Symbol

V_IN

Conditions

BD725L05G-C /

BD730L05G-C

3.5 V ≤ V_IN≤ 42.0 V

Input Supply Voltage

BD733L05G-C

BD750L05G-C

V_IN

I_OUT

Tj

3.8 V ≤ V_IN≤ 42.0 V

5.6 V ≤ V_IN≤ 42.0 V

0 mA ≤ I_OUT≤ 50 mA

-40 °C ≤ Tj ≤ +150 °C

Output Current

Junction Temperature

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

27/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Typical Application and Layout Example

Output Voltage

VOUT

Input Voltage

VIN

Ground

C_OUT

C_IN

5:VOUT

4:VIN

BD7xxL05G-C

1:N.C. 2:GND

3:N.C.

Ground

Parameter

Symbol

Recommended Value

Output Current Range

Output Capacitor

I_OUT

C_OUT

I_OUT≤ 50 mA

1 μF ≤ C_OUT≤ 1000 μF

ESR ≤ 100 Ω

Output Capacitor ESR for stability^{(Note 1)}

ESR (C_OUT

)

BD725L05G-C /

V_IN

3.5 V ≤ V_IN≤ 42.0 V

BD730L05G-C

BD733L05G-C

BD750L05G-C

Input Voltage Range^{(Note 2)}

V_IN

C_IN

3.8 V ≤ V_IN≤ 42.0 V

5.6 V ≤ V_IN≤ 42.0 V

0.1 µF ≤ C_IN

Input Capacitor^{(Note 3)}

(Note 1) Refer to Selection of External Components and select the parts.

(Note 2) Minimum Input Supply Voltage must be V_{IN Start-up}= 3 V or more.

Consider that the output voltage would be reduced (Dropout Voltage) by the output current.

(Note 3) If the inductance of power supply line is high, adjust input capacitor value.

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

28/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Application and Implementation - continued

Surge Voltage Protection for Linear Regulators

The following shows some helpful tips to protect ICs from possible inputting surge voltage which exceeds absolute maximum

ratings.

Positive surge to the input

If there is any potential risk that positive surges higher than absolute maximum ratings 45 V, it is applied to the input, a

Zener Diode should be inserted between the VIN pin and the GND to protect the device as shown in Figure 61.

VIN

VOUT

GND

V_IN

V_OUT

C_OUT

D₁

C_IN

Figure 61. Surges Higher than 45 V is Applied to the Input

Negative surge to the input

If there is any potential risk that negative surges below the absolute maximum ratings, (e.g.) -0.3 V, is applied to the input,

a Schottky barrier diode should be inserted between the VIN pin and the GND to protect the device as shown in Figure

62.

VIN

VOUT

GND

V_IN

V_OUT

C_OUT

D₁

C_IN

Figure 62. Surges Lower than -0.3 V is Applied to the Input

Reverse Voltage Protection for Linear Regulators

A linear regulator integrated circuit (IC) requires the input voltage to be always higher than the regulated voltage. Output

voltage, however, may become higher than the input voltage under specific situations or circuit configurations. In such

circumstances reverse voltage and current may cause damage to the IC. A reverse polarity connection of power supply or

certain inductor components can also cause a polarity reversal between the input and output pins. The following provides

instructions on reversed voltage polarity protection for ICs.

Protection against Reverse Input/Output Voltage

In the MOS linear regulator, a parasitic body diode between the drain-source of MOSFET generally exists. If the output

voltage becomes higher than the input voltage and if its voltage difference exceeds V_Fof the body diode, a reverse current

flows from the output to the input through the body diode as shown in Figure 63. The current flows in the parasitic body

diode is not limited in the protection circuit because it is the parasitic element, therefore too much reverse current may

cause damage to degrade or destroy the semiconductor elements of the regulator.

Reverse Current

V_OUT

V_IN

Error

AMP.

V_REF

Figure 63. Reverse Current Path in a MOS Linear Regulator

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

18.Nov.2022 Rev.002

29/39

BD7xxL05G-C Series

Protection against Reverse Input/Output Voltage – continued

An effective solution for this problem is to implement an external bypass diode in order to prevent the reverse current flow

inside the IC as shown in Figure 64. Note that the bypass diode must be turned on prior to the internal body diode of the IC.

This external bypass diode should be chosen as being lower forward voltage V_Fthan the internal body diode. If the reverse

current of this bypass diode is large, even if the output is OFF, a lot of diode leakage current flows from the input to the

output, so it is necessary to select one with a small value. It should to be selected a diode which has a rated reverse

voltage greater than the IC’s input maximum voltage and also which has a rated forward current greater than the

anticipated reverse current in the actual application.

D₁

VIN

VOUT

GND

V_IN

V_OUT

C_OUT

C_IN

Figure 64. Bypass Diode for Reverse Current Diversion

A Schottky barrier diode which has a characteristic of low forward voltage (V_F) can meet to the requirement for the external

diode to protect the IC from the reverse current. However, it also has a characteristic that the leakage (I_R) caused by the

reverse voltage is bigger than other diodes. Therefore, it should be taken into the consideration to choose it because if I_Ris

large, it may cause increase of the current consumption, or raise of the output voltage in the light-load current condition. I_R

characteristic of Schottky diode has positive temperature characteristic, which the details shall be checked with the

datasheet of the products, and the careful confirmation of behavior in the actual application is mandatory.

Even in the condition when the input/output voltage is inverted, if the VIN pin is open as shown in Figure 65, or if the VIN

pin becomes high-impedance condition as designed in the system, it cannot damage or degrade the parasitic element. It's

because a reverse current via the pass transistor becomes extremely low. In this case, therefore, the protection external

diode is not necessary.

ON→OFF

IBIAS

VIN

VOUT

GND

V_OUT

C_OUT

V_IN

CIN

Figure 65. Open VIN

Protection against Input Reverse Voltage

When the input of the IC is connected to the power supply, accidentally if plus and minus are routed in reverse, or if there

is a possibility that the input may become lower than the GND pin, it may cause to destroy the IC because a large current

passes via the internal electrostatic breakdown prevention diode between the input pin and the GND pin inside the IC as

shown in Figure 66.

The simplest solution to avoid this problem is to connect a Schottky barrier diode or a rectifier diode in series to the power

supply line as shown in Figure 67. However, it causes the voltage drop by a forward voltage V_Fat the supply voltage while

normal operation.

Generally, since the Schottky barrier diode has lower V_F, so it contributes to rather smaller power loss than rectifier diodes.

If IC has load currents, this external diode generates heat more, therefore select a diode with enough margin in power

dissipation. On the other hand, a reverse current passes this diode in the reverse connection condition, however, it is

negligible because its small amount.

VIN

V_OUT

C_OUT

GND

VIN

VOUT

D1

-

VIN

VOUT

GND

V_OUT

C_OUT

VIN

GND

CIN

+

GND

Figure 66. Current Path in Reverse Input Connection

Figure 67. Protection against Reverse Polarity 1

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

30/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Protection against Input Reverse Voltage - continued

Figure 68 shows a circuit in which a P-channel MOSFET is connected in series to the power. The body diode (parasitic

element) is located in the drain-source junction area of the MOSFET. Since the Pch MOSFET is turned on in the correct

connection, the drop voltage in a forward connection is calculated from the on state resistance of the MOSFET and the

output current I_OUT. It is smaller than the drop voltage by the diode as shown in Figure 67 and results in less of a power

loss. No current flows in a reverse connection where the MOSFET remains off in Figure 68.

If the gate-source voltage exceeds maximum rating of MOSFET gate-source junction with derating curve in consideration,

reduce the gate-source junction voltage by connecting resistor voltage divider as shown in Figure 69.

Q1

VIN

Q1

V_OUT

VIN

VOUT

GND

VIN

VOUT

GND

VIN

V_OUT

C_OUT

R1

R2

CIN

C_OUT

CIN

Figure 68. Protection against Reverse Polarity 2

Figure 69. Protection against Reverse Polarity 3

Protection against Reverse Output Voltage when the Output is connected to an Inductor

If the output load is inductive, electrical energy accumulated in the inductive load is released to the ground at the moment

that the output voltage is turned off. IC integrates ESD protection diodes between the IC output and ground pins. A large

current may flow in such condition finally resulting on destruction of the IC. To prevent this situation, connect a Schottky

barrier diode in parallel to the integrated diodes as shown in Figure 70.

Further, if a long wire is in use for the connection between the output pin of the IC and the load, confirm that the negative

voltage is not generated at the VOUT pin when the output voltage is turned off by observation of the waveform on an

oscilloscope, since it is possible that the load becomes inductive. An additional diode is required for a motor load that is

affected by its counter electromotive force, as it produces an electrical current in a similar way.

VOUT

VIN

VOUT

GND

D1

CIN

XLL

COUT

GND

Figure 70. Current Path in Inductive Load (Output: Off)

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

31/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Power Dissipation

SSOP5

0.9

(2) 0.80 W

(1): 1-layer PCB

(Copper foil area on the reverse side of PCB: 0 mm × 0 mm)

Board material: FR-4

Board size: 114.3 mm × 76.2 mm × 1.57 mmt

Top copper foil: Footprints and Traces, 70 μm copper.

0.8

0.7

0.6

(1) 0.51 W

0.5

(2): 4-layer PCB

(Copper foil area on the reverse side of PCB: 74.2 mm × 74.2 mm)

Board material: FR-4

0.4

0.3

0.2

0.1

0.0

Board size: 114.3 mm × 76.2 mm × 1.6 mmt

Top copper foil: Footprints and Traces, 70 μm copper.

2 inner layers copper foil area of PCB:

74.2 mm × 74.2 mm, 35 μm copper.

Bottom copper foil area of PCB:

74.2 mm × 74.2 mm, 70 μm copper.

0

25

50

75

100

125

150

Condition (1): θJA = 247.3 °C/W, ΨJT (top center) = 43 °C/W

Condition (2): θJA = 155.5 °C/W, ΨJT (top center) = 33 °C/W

Ambient Temperature: Ta [°C]

Figure 71. Power Dissipation Graph (SSOP5)

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

32/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Thermal Design

The power consumption of the IC is decided by the dropout voltage condition, the load current and the current consumption.

Refer to power dissipation curves illustrated in Figure 71 when using the IC in an environment of Ta ≥ +25 °C. Even if the

ambient temperature Ta is at +25 °C, chip junction temperature (Tj) can be very high depending on the input voltage and the

load current. Consider the design to be Tj ≤ Tjmax = +150 °C in whole operating temperature range.

Should by any condition the maximum junction temperature Tjmax = +150 °C rating be exceeded by the temperature

increase of the chip, it may result in deterioration of the properties of the chip. The thermal resistance in this specification is

based on recommended PCB and measurement condition by JEDEC standard. Therefore, need to be careful because it

might be different from the actual use condition. Verify the application and allow sufficient margins in the thermal design by

the following method to calculate the junction temperature Tj. Tj can be calculated by either of the two following methods.

1. The following method is used to calculate the junction temperature Tj with ambient temperature Ta.

푇푗 = 푇푎 + 푃_퐶× 휃_퐽퐴[°C]

Where:

푇푗

is the Junction Temperature

푇푎 is the Ambient Temperature

is the Power Consumption

푃_퐶

휃_퐽퐴is the Thermal Resistance (Junction to Ambient)

2. The following method is also used to calculate the junction temperature Tj with top center of case’s (mold) temperature T_T.

푇푗 = 푇_ꢀ+ 푃_퐶× 훹 [°C]

퐽ꢀ

Where:

푇푗

푇_ꢀ

푃_퐶

훹

is the Junction Temperature

is the Top Center of Case’s (mold) Temperature

is the Power consumption

is the Thermal Resistance (Junction to Top Center of Case)

퐽ꢀ

3. The following method is used to calculate the power consumption P_C(W).

푃푐 = (푉 − 푉_푂푈ꢀ) × ꢁ_푂푈ꢀ+ 푉 × ꢁ_퐶퐶[W]

퐼푁

Where:

푃푐 is the Power Consumption

is the Input Voltage

푉

퐼푁

푉_푂푈ꢀis the Output Voltage

ꢁ_푂푈ꢀis the Load Current

ꢁ_퐶퐶is the Current Consumption

Calculation Example

If V_IN= 13.5 V, V_OUT= 3.0 V, I_OUT= 10 mA, I_CC= 6 μA, the power consumption P_Ccan be calculated as follows:

푃_퐶= (푉 − 푉_푂푈ꢀ) × ꢁ_푂푈ꢀ+ 푉 × ꢁ_퐶퐶

퐼푁

(

)

= 13.5 푉 – 3.0 푉 × 10 푚ꢂ + 13.5 푉 × 6 휇ꢂ

≂ 0.11 푊

At the maximum ambient temperature Tamax = 85 °C,

the thermal resistance (Junction to Ambient) θ_JA= 155.5 °C/W (4-layer PCB)

푇푗 = 푇푎푚푎푥 + 푃_퐶× 휃_퐽퐴

= 85 °ꢃ + 0.11 푊 × 155.5 °ꢃ/푊

≂ 102.1 °ꢃ

When operating the IC, the top center of case’s (mold) temperature T_T= 100 °C, Ψ_JT= 43 °C/W (1-layer PCB)

푇푗 = 푇_ꢀ+ 푃_퐶× 훹

퐽ꢀ

= 100 °ꢃ + 0.11 푊 × 43 °ꢃ/푊

= 104.7 °ꢃ

If it is difficult to ensure the margin by the calculations above, it is recommended to expand the copper foil area of the board,

increasing the layer and thermal via between thermal land pad for optimum thermal performance.

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

33/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

I/O Equivalence Circuit^{(Note 1)}

VIN Pin

VOUT Pin

VIN

VOUT

2.5 V: 10.3 MΩ

3.0 V: 13.0 MΩ

3.3 V: 14.8 MΩ

5.0 V: 24.1 MΩ

VOUT

3.6 MΩ

(Note 1) Resistance value is Typical.

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

34/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

6. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and

routing of connections.

7. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

8. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

35/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Operational Notes – continued

9. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 72. Example of Monolithic IC Structure

10. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

11. Thermal Shutdown Circuit (TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the

junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj

falls below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

12. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

13. Thermal Consideration

The power dissipation under actual operating conditions should be taken into consideration and a sufficient margin

should be allowed in the thermal design. On the reverse side of the package this product has an exposed heat pad for

improving the heat dissipation. The amount of heat generation depends on the voltage difference between the input

and output, load current, and bias current. Therefore, when actually using the chip, ensure that the generated heat

does not exceed the Pd rating. If Junction temperature is over Tjmax (= 150 °C), IC characteristics may be worse due

to rising chip temperature. Heat resistance in specification is measurement under PCB condition and environment

recommended in JEDEC. Ensure that heat resistance in specification is different from actual environment.

14. Functional Safety

“ISO 26262 process compliant to support ASIL-*”

A product that has been developed based on an ISO 26262 design process compliant to the ASIL level described in

the datasheet.

“Safety mechanism is implemented to support functional safety (ASIL-*)”

A product that has implemented safety mechanism to meet ASIL level requirements described in the datasheet.

“Functional safety supportive automotive products”

A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the

functional safety.

Note: “ASIL-*” is stands for the ratings of “ASIL-A”, “-B”, “-C” or “-D” specified by each product's datasheet.

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

36/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Ordering Information

B D 7

x

L

0

5 G - C T R

Part Number

Output Voltage

25: 2.5 V

Package

G: SSOP5

Product Rank

C: for Automotive

Packaging and forming specification

TR: Embossed tape and reel

30: 3.0 V

33: 3.3 V

50: 5.0 V

Marking Diagram

SSOP5 (TOP VIEW)

Part Number Marking

LOT Number

Lineup

Part Number Marking

Output Voltage

2.5 V

Orderable Part Number

BD725L05G-CTR

BD730L05G-CTR

BD733L05G-CTR

BD750L05G-CTR

dq

du

dr

3.0 V

3.3 V

dy

5.0 V

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

37/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Physical Dimension and Packing Information

Package Name

SSOP5

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

38/39

18.Nov.2022 Rev.002

BD7xxL05G-C Series

Revision History

Date

Revision

001

Changes

29.Mar.2022

New Release

18.Nov.2022

002

Added about functional safety

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0BJB0A600090-1-2

39/39

18.Nov.2022 Rev.002

Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

,

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.004


型号：	BD725L05G-C (新产品)
厂家：	ROHM
描述：	BD725L05G-C是消耗电流很低的线性稳压器，非常适用于直接连接电池的车载系统。本IC的耐压为45V，输出电流为50mA，电流消耗为6µA(Typ)，输出电压精度为±2%。另外，本IC还内置过电流保护电路，可防止输出短路等导致的IC损坏；内置过热保护电路，可防止IC因过负载状态等导致的热损坏。输出的相位补偿电容可使用低ESR的陶瓷电容器。电池过电流保护电容器陶瓷电容器稳压器
文件：	总42页 (文件大小：3123K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD725L05G-C (新产品) [ROHM]

相关型号：

BD726

BD7280YG-C (新产品)

BD7281YG-C (新产品)

BD7282FVM-LB (开发中)

BD7284F-LB (开发中)

BD730L05G-C (新产品)

BD733

BD733L05G-C (新产品)

BD733L2EFJ-C

BD733L2EFJ-CE2

BD733L2FP-C

BD733L2FP-CE2