BD7693FJ [ROHM]
BD7693FJ是一款功率因数校正（Power Factor Correction：PFC）转换器，可为各种需要改善功率因数的产品提供理想系统。PFC部分采用临界模式，通过检测过零电流，可以降低开关损耗和噪声。内置了可减少总谐波失真（THD）的电路，因此可以支持 IEC61000-3-2 Class-C。BD7693FJ的评估板信息点击这里获取。此外，ROHM还提供支持各种功率段和拓扑的评估板。a.productlink{color: #dc2039; text-decoration: underline !important;}a.productlink:hover {opacity: 0.6;};
| 型号： | BD7693FJ |
| 厂家： | 
ROHM |
| 描述： | BD7693FJ是一款功率因数校正（Power Factor Correction：PFC）转换器，可为各种需要改善功率因数的产品提供理想系统。PFC部分采用临界模式，通过检测过零电流，可以降低开关损耗和噪声。内置了可减少总谐波失真（THD）的电路，因此可以支持 IEC61000-3-2 Class-C。BD7693FJ的评估板信息点击这里获取。此外，ROHM还提供支持各种功率段和拓扑的评估板。a.productlink{color: #dc2039; text-decoration: underline !important;}a.productlink:hover {opacity: 0.6;} 开关 功率因数校正 转换器 |
| 文件： | 总25页 (文件大小：1166K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Boundary Conduction Mode
Power Factor Correction Controller IC
BD7693FJ BD7694FJ
General Description
Key Specifications
BD7693FJ and BD7694FJ are Power Factor Correction
IC for AC/DC supplies the system which is suitable for all
the products needing power factor improvement. The
PFC adopts boundary conduction mode (BCM), and
switching loss reduction and noise reduction are possible
by Zero Current Detection (ZCD). This IC incorporates a
circuit lowering total harmonics distortion (THD) and can
support IEC61000-3-2 Class-C.
◼ Input VCC Voltage Range:
◼ Operating Current:
◼ Operating Temperature Range: -40 °C to +105 °C
10 V to 38 V
0.58 mA (Typ)
Package
SOP-J8
W (Typ) x D (Typ) x H (Max)
4.9 mm x 6.0 mm x 1.65 mm
Features
◼
◼
◼
◼
◼
◼
◼
◼
◼
Boundary Conduction Mode PFC
Low THD Circuit Incorporation
Low Power Consumption
VCC UVLO Function
ZCD by Auxiliary Winding
Static OVP by the VS Pin
Error Amplifier Input Short Protection
Stable MOSFET Gate Drive
Soft Start
Lineup
Product name
Brown Out
BD7693FJ-E2
BD7694FJ-E2
-
○
Applications
Lighting Equipment, AC Adopter, TV, Refrigerator,
etc.
◼
Typical Application Circuit
Diode
Bridge
VS
MULT
CS
VCC
6
5
8
7
VCC
OUT
GND
ZCD
VS
EO
MULT
CS
1
2
3
4
VS
MULT
CS
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
www.rohm.com
© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 14 • 001
TSZ02201-0F1F0A200730-1-2
25.Nov.2020 Rev.001
1/22
BD7693FJ BD7694FJ
Pin Configuration
(TOP VIEW)
6
5
8
7
VCC
OUT
GND
ZCD
VS
EO
MULT
CS
1
2
3
4
Pin Description
ESD Diode
VCC GND
Pin No.
Pin Name
I/O
Function
1
2
3
4
5
6
7
8
VS
EO
MULT
CS
ZCD
GND
OUT
VCC
I
O
I
I
I
-
O
I
Feedback input pin
Error amplifier output pin
Multiplier input pin
Over current detection pin
Zero current detection pin
GND pin
-
-
-
-
-
○
-
-
○
○
○
○
○
-
External MOSFET driver pin
Power supply pin
○
○
Block Diagram
VOUT
FUSE
Diode
Bridge
Filter
Vac
MULT
VS
VCC
GND
ZCD
+
0.67 V / 0.9 V
-
1 shot
Internal
Supply
+
-
UVLO
BGR
Reg
5.0 V
13.0 V / 8.0 V
Timer
30 µs
out reset
TSD
TSD
OVR Comp
SHORT Comp
SP
+
-
+
-
OVR
OVR
0.3 V
GCLAMP
(12 V)
2.250 V
VS
SOVP Comp
SOVP
VS
+
-
Comp
2.7 V / 2.6 V
OR
ErrAmp
S
R
POUT
-
+
OUT
UVLO
Q
PRE
Driver
EO
2.5 V
PWM Comp
SOVP
AND
-
NOUT
UVLO
OVR
SP
1.5 V
100 kΩ
MULT
+
MULT
TSD
BROUT
(BD7694 only)
Multplier
Brown Out
(BD7694 only)
BROUT
CS
www.rohm.com
© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0F1F0A200730-1-2
2/22
25.Nov.2020 Rev.001
BD7693FJ BD7694FJ
Description of Blocks
1
VCC Protection
This IC has VCC UVLO (Under Voltage Lock Out) of the VCC pin. Switching stops at the time of VCC voltage drop.
In addition, when the VCC voltage becomes higher than the VCC_DIS1 (38 V Typ) voltage, it increases operating current and
suppresses the rise in VCC voltage. When the VCC voltage lowers than the VCC_DIS2 (34 V Typ) voltage, the operating
current becomes usual. This function assumes the case that the VCC voltage rises by startup resistance.
2
PFC: Power Factor Correction
The power factor improvement circuit is a voltage control method of Boundary Conduction Mode.
The outline operation circuit diagram is shown in Figure 1. The switching operation is shown in Figure 2.
Auxiliary winding for zero
current detection
Bridge
IL
Diode
PFC OUT
AC IN
Diode
ZCD
MOSFET
OUT
PFC OUT
Feedback Resistor
MULT
EO
VS
CS
GND
RCS
GND
OCP Detect Resistor
Figure 1. Operation Circuit Outline
OUT
(Gate)
MOSFET
(Vds)
IL
VCS
VZCD
3
2
4
1
Figure 2. Switching Operation Timing Chart
Switching Operation
1. MOSFET is turned on, and IL increases.
2. The IC compares Multiplier out with VCS slope, and MOSFET is off when the VCS voltage higher than Multiplier out.
3. MOSFET is off, and IL decreases.
4. The ZCD pin detects a zero point of the IL and turns on MOSFET.
www.rohm.com
© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0F1F0A200730-1-2
3/22
25.Nov.2020 Rev.001
BD7693FJ BD7694FJ
Description of Blocks - continued
3
About ErrAMP
3.1
GmAMP
The VS pin monitors a divided point for resistance of the output voltage. The ripple voltage of AC frequency (50 Hz / 60
Hz) overlaps with the VS pin. GmAMP removes this ripple voltage. GmAMP compares VAMP1 (2.500 V Typ) with the
removed voltage, GmAMP controls the EO voltage by this gap. When the EO pin voltage rises, ON width of the OUT pin
becomes wide. When the EO voltage less than VBURST (1.9 V Typ), the IC stops switching. Therefore, it can stop
switching operation when the EO pin connects to the GND.
Also, you must set the error amplifier constant so that the AC frequency does not overlap on the EO pin. And, please
confirm it by an actual board.
PFC Output
VS
-
+
2.500 V
EO
Figure 3. GmAMP Block Diagram
3.2
VS Short Protection
The VS pin has a short protection function.
A state of the VS pin voltage < VSHORT (0.3 V Typ) continues tVS_SH (150 µs Typ) or more, it stops switching.
Figure 4 shows the operation.
PFC
Output
VOUT
VS
VSHORT
tVS_SH
OUT
Switching Stop
Figure 4. Operation of VS Short Protection
www.rohm.com
© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0F1F0A200730-1-2
4/22
25.Nov.2020 Rev.001
BD7693FJ BD7694FJ
3
About ErrAMP - continued
3.3
VS Overvoltage Protection Function (SOVP)
The VS pin voltage rises from VOVP1 (2.7 V Typ), it stops switching immediately. The VS pin voltage less than VOVP2 (2.6
V Typ), it starts switching. Figure 5 shows the operation.
PFC
Output
VOVP1
VOVP2
VS
OUT
Switching
Stop
Figure 5. VS Overvoltage Protection Operation
3.4
Over Voltage Reduce Function at Start Up (OVR)
When the VS pin voltage performs a rise in startup to VOVR (2.25 V Typ) (equivalent to -10 % of output voltage), it
discharges the EO voltage to the VBURST forcibly. OUT pulse width is narrows when the EO voltage falls, through rate of
output voltage becomes slow and reduces over voltage in the startup.
This function is effective only once after VCC UVLO cancellation.
www.rohm.com
© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0F1F0A200730-1-2
5/22
25.Nov.2020 Rev.001
BD7693FJ BD7694FJ
Description of Blocks - continued
4
ZCD pin
The zero current detection circuit is a function to detect a zero cross of the inductor current (IL) (Figure 6, 7).
If the voltage at the ZCD pin becomes lower than VZCD2 (0.67 V Typ) after becoming higher than VZCD1 (0.9 V Typ), the
OUT output becomes High after the ZCD output delay time (tZCD 260 ns Typ) has elapsed.
When the ZCD voltage does not reach VZCD1 (0.9 V Typ), it becomes the restart timer operation. After the OUT output
became Low, OUT becomes High after tREST (30 μs Typ) progress (Figure 8).
Diode
T1
ZCD
OUT
Control
Logic
+
-
MOSFET
RCS
Figure 6. Zero Current Detection Circuit
OUT
(Gate)
VZCD1
VZCD2
VZCD
tZCD
Figure 7. Zero Current Detection
OUT
(Gate)
VZCD1
VZCD
tREST
Figure 8. Restart Timer
www.rohm.com
© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0F1F0A200730-1-2
6/22
25.Nov.2020 Rev.001
BD7693FJ BD7694FJ
Description of Blocks - continued
5
MULTIPLIER
The ON width of the OUT pin is fixed in Multiplier out and VCS as it showed in Figure 2.
VCS is expressed in the following formula.
푉퐶푆 = 퐾 × 푉푀푈퐿푇(푉퐸푂 − 푉퐵푈푅푆푇
)
K:
VMULT
VEO
VBURST
MULTIPLIER GAIN
:
MULT pin voltage
EO pin voltage
Burst voltage
:
:
AC voltage information is input into VMULT. The IC improves a power factor by controlling AC current with the AC
voltage. In addition, VCS in AC voltage 0 V (VMULT = 0 V) is expressed in the following formula.
(
)
푉퐶푆 = 퐾 × 푉푀푈퐿푇 푉퐸푂 − 푉퐵푈푅푆푇 + 푉푂퐹퐹푆퐸푇 = 푉푂퐹퐹푆퐸푇
The ON width of the OUT pin at the age of AC voltage 0 V (VMULT = 0 V) becomes long by adding VOFFSET (25 mV Typ).
Because ON width gets longer, diode bridge output voltage is discharged. As a result, an AC current distortion is improved
without the current supply from a diode bridge stopping (Figure 9).
VOFFSET less
VOFFSET case
case
V
IL
Diode
Bridge
V1
V1
AC IN
Remain
voltage
No remain
voltage
t
t
V
OUT
I
Stop
Non stop
->High AC current
distortion
->Improvement of the
AC current distortion
AC
current
Figure 9. Improvement of the AC Current Distortion
www.rohm.com
© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0F1F0A200730-1-2
7/22
25.Nov.2020 Rev.001
BD7693FJ BD7694FJ
Description of Blocks - continued
6
MULT pin
When the state that the MULT pin voltage is lower than VBROUT1 (0.8 V Typ) continues tBROUT (160 ms Typ) or more,
the IC stops switching by a brown out function (only in BD7694).
When the MULT pin voltage becomes higher than VBROUT2 (0.97 V Typ), the IC switches again.
Switching
Switching
Stop
OUT
VBROUT2
VBROUT1
tBROUT
VMULT
Figure 10. Brown Out
7
CS pin
In normal operation, turn OFF of the switching is usually decided by ON width by the EO pin and the MULT pin
voltage. However, the IC is off in a pulse by pulse in overcurrent protection when the CS pin rises than VCS (1.5 V
Typ). By this protection, it prevents an overcurrent to MOSFET.
The overcurrent protection function limits ON width. When this protection becomes the working PFC load, PFC
output voltage decreases. You must decide sense resistance of PFC so that this protection does not work in rated
load with the minimum input voltage at the time of the application design.
Control
Logic
OUT
CS
Over Current
Protection
1.5 V
Figure 11. Current Limit
www.rohm.com
© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0F1F0A200730-1-2
8/22
25.Nov.2020 Rev.001
BD7693FJ BD7694FJ
Operation Mode of Protection Circuit
Table 1 showed the operation mode of each protection function.
Table 1. Operation Mode of Each Protective Circuit
Protection Mode
Parameter
VCC UVLO
Contents
Detection
Method
Detection
Operation
Cancellation
Method
Cancellation
Operation
Under Voltage Lock Out
on the VCC pin
VCC < 8 V (Typ)
OUT OFF
EO discharge
VCC > 13 V (Typ)
Startup
Operation
(VCC drop)
(VCC rise)
Over Current Protection
on the CS pin
CS > 1.5 V (Typ)
CS < 1.5 V (Typ)
Normal
Operation
CS OCP
VS Short
OUT OFF
(CS rise)
(CS drop)
Short Protection
on the VS pin
VS < 0.3 V (Typ)
OUT OFF
EO discharge
VS > 0.3 V (Typ)
Normal
Operation
(VS drop)
(VS rise)
Over Voltage Protection
on the VS pin
VS > 2.7 V (Typ)
VS < 2.6 V (Typ)
Normal
Operation
VS Static OVP
OUT OFF
(VS rise)
(VS drop)
MULT < 0.8 V
(Typ)
(MULT drop)
MULT > 0.97 V
(Typ)
(MULT rise)
Brown Out
(Only BD7694)
Low Voltage Protection
on the MULT pin
OUT OFF
EO discharge
Normal
Operation
www.rohm.com
© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0F1F0A200730-1-2
9/22
25.Nov.2020 Rev.001
BD7693FJ BD7694FJ
Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
Condition
Maximum Voltage 1
Maximum Voltage 2
Maximum Voltage 3
Maximum Current 1
OUT Pin Output Peak Current 1
OUT Pin Output Peak Current 2
Maximum Junction Temperature
Storage Temperature Range
VMAX1
VMAX2
VMAX3
IZCD1
IOUT1
IOUT2
-0.3 to +40
-0.3 to +14
-0.3 to +6.5
-10 to +10
-0.5
+1
+150
-55 to +150
V
V
V
mA
A
A
VCC
OUT
CS, MULT, VS, EO
ZCD current
Source current
Sink current
Tjmax
Tstg
°C
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 1)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 3)
2s2p(Note 4)
SOP-J8
Junction to Ambient
Junction to Top Characterization Parameter(Note 2)
θJA
149.3
18
76.9
11
°C/W
°C/W
ΨJT
(Note 1) Based on JESD51-2A(Still-Air)
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of
the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70 μm
Footprints and Traces
Layer Number of
Measurement Board
Material
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
4 Layers
FR-4
Top
Copper Pattern
Bottom
Copper Pattern
74.2 mm x 74.2 mm
Thickness
70 μm
Copper Pattern
Thickness
35 μm
Thickness
70 μm
Footprints and Traces
74.2 mm x 74.2 mm
Recommended Operating Conditions
Parameter Symbol
Supply Voltage
Operating Temperature
Min
Typ
Max
Unit
Condition
VCC Voltage
VCC
Topr
10
-40
15
+25
38
+105
V
°C
Recommended Range of the External Component (Ta = 25 °C)
Parameter
Symbol
CVCC
Rating
Unit
μF
VCC Pin Connection Capacity
22 or more
www.rohm.com
© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0F1F0A200730-1-2
10/22
25.Nov.2020 Rev.001
BD7693FJ BD7694FJ
Electrical Characteristics (Unless otherwise specified VCC = 15 V, Ta = -40 °C to +105 °C)
Parameter
[Circuit Current]
Symbol
Min
Typ
Max
Unit
Condition
Circuit Current (ON) 1
Circuit Current (ON) 2
Circuit Current (ON) 3
ION1
ION2
-
-
0.58
0.95
1.20
2.00
mA
mA
VS = 0 V
50 kHz switching
VCC discharge
Switching stop
ION3
4.5
9.0
13.5
200
mA
µA
Start Up Current
ISTART
-
100
VCC = 12 V
[VCC Pin Protection]
VCC UVLO Voltage1
VCC UVLO Voltage2
VCC UVLO Hysteresis
VCC Discharge Voltage1
VCC Discharge Voltage2
[Gm Amplifier Block]
VS Pin Pull-up Current
Gm Amplifier
Reference Voltage1
Gm Amplifier
Reference Voltage2
Gm Amplifier Line Regulation
Gm Amplifier
VUVLO1
VUVLO2
VUVLO3
VCC_DIS1
VCC_DIS2
12
7
3.8
-
13
8
5.0
38
34
14
9
6.2
-
V
V
V
V
V
VCC rise
VCC drop
VUVLO3 = VUVLO1 -VUVLO2
VCC rise
VCC drop
-
-
IVS
-
0.1
0.5
µA
V
VS = 0 V
VAMP1
2.465
2.500
2.535
Ta = 25 °C
VAMP2
VAMP_LINE
TVS
2.44
-
-
1
2.54
10
V
Ta = -40 °C to +105 °C
VCC = 10 V to 38 V
EO = 2.5 V, Ta = 25 °C
mV
80
100
130
µA/V
Trans Conductance
Gm Amplifier Source Current
Gm Amplifier Sink Current
[EO Block]
IEO_SOURCE
IEO_SINK
5
5
10
10
20
20
µA
µA
VS = 2.3 V
VS = 2.7 V
EO L Voltage
Burst Voltage
EO Discharge Current
[MULT Block]
MULT Pin Pull-up Current
MULT Pin Dynamic Range
VEOL
VBURST
IEO
-
1.6
1.9
1.8
1.8
-
3.0
V
V
mA
VS = 2.7 V
1.8
0.8
VCC = 12 V, EO = 1.0 V
MULT = 0 V
IMULT
VMULT
-
0.1
0 to 3.5
VBURST
to
0.5
-
µA
V
0 to 2.5
VBURST
to
EO Pin Dynamic Range
VEOD
-
V
2.9
3.4
MULTIPLIER Gain
K
0.43
0.65
0.87
0.9
1/V
V
MULT = 0.5 V, EO = 3.0 V
MULT drop
BD7694FJ Only
MULT rise
BD7694FJ Only
BD7694FJ Only
Brown Out Detect Voltage1
VBROUT1
0.7
0.8
Brown Out Detect Voltage2
VBROUT2
tBROUT
0.87
80
0.97
160
1.07
320
V
Brown Out Detect Timer
[ZCD Block]
ms
ZCD Threshold Voltage1
ZCD Threshold Voltage2
ZCD Output Delay
Input H Clamp Voltage
Input L Clamp Voltage
Restart Timer
VZCD1
VZCD2
tZCD
VIH
VIL
0.8
0.55
-
6.1
-0.3
15
0.9
0.67
260
6.7
-0.1
30
1.0
0.79
520
-
-
45
V
V
ns
V
V
µs
ZCD rise
ZCD drop
Isink = 3 mA
Isource = -3 mA
tREST
[VS Protection Block]
VS Short Protection
Detection Voltage
VS Shortstop Protection
Detection Time
VSHORT
tVS_SH
VOVR
0.2
50
-
0.3
0.4
300
-
V
µs
V
150
Over Voltage Reduce Detection
Voltage
0.9 x
VAMP1
VS Overvoltage Protection
Detection Voltage 1
VS Overvoltage Protection
Detection Voltage 2
1.065 x
VAMP1
1.020 x
VAMP1
1.080 x
VAMP1
1.040 x
VAMP1
1.095 x
VAMP1
1.060 x
VAMP1
VOVP1
VOVP2
V
VS rise Ta = 25 °C
VS drop Ta = 25 °C
V
www.rohm.com
© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0F1F0A200730-1-2
11/22
25.Nov.2020 Rev.001
BD7693FJ BD7694FJ
Electrical Characteristics (Unless otherwise specified VCC = 15 V, Ta = -40 °C to +105 °C) - continued
Parameter
Symbol
Min
Typ
Max
Unit
Condition
[CS Block]
CS Threshold Voltage
Output Delay Time
CS Pin Pull-up Current
CS Offset Voltage
[OUT Block]
VCS
tDELAY
ICS
1.3
1.5
150
0.15
25
1.8
300
1.00
-
V
ns
µA
mV
-
-
-
CS = 0 V
MULT = 0 V
VOFFSET
OUT H Voltage
OUT L Voltage
VPOUTH
VPOUTL
9.0
-
10.2
-
11.4
0.8
V
V
OUT = -20 mA
OUT = +20 mA
OUT load capacitor = 1000 pF
OUT L Voltage to 5 V
OUT load capacitor = 1000 pF
OUT H Voltage to 5 V
Rise Time
tr
-
50
-
ns
Fall Time
tf
-
50
-
ns
OUT Pull-down Resistance
RPDOUT
50
100
150
kΩ
www.rohm.com
© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0F1F0A200730-1-2
12/22
25.Nov.2020 Rev.001
BD7693FJ BD7694FJ
Typical Performance Curves
(Reference data)
1.6
VEO = 4.50 V
VEO = 4.00 V
1.4
1.2
1
VEO = 3.50 V
VEO = 2.75 V
VEO = 2.50 V
VEO = 3.00 V
0.8
0.6
0.4
0.2
0
VEO = 2.25 V
VEO = 2.00 V
0
1
2
3
4
VMULT[V]
Figure 12. VCS vs VMULT
2.535
2.530
2.525
2.520
2.515
2.510
2.505
2.500
2.495
2.490
2.485
2.480
2.475
2.470
2.465
2.535
2.530
2.525
2.520
2.515
2.510
2.505
2.500
2.495
2.490
2.485
2.480
2.475
2.470
2.465
10
15
20
25
30
35
-40
-10
20
50
80
110
VCC Supply Voltage: VCC[V]
Temperature: Ta[˚C]
Figure 13. Gm Amplifier Reference Voltage1 vs Temperature
Figure 14. Gm Amplifier Reference Voltage1 vs VCC
www.rohm.com
© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0F1F0A200730-1-2
25.Nov.2020 Rev.001
13/22
BD7693FJ BD7694FJ
Typical Performance Curves - continued
200
180
160
140
120
100
80
1.095
1.090
1.085
1.080
1.075
1.070
1.065
60
40
20
0
-40
-10
20
50
80
110
-40 -10
20
50
80 110
Temperature: Ta[˚C]
Temperature: Ta[˚C]
Figure 15. VS Overvoltage Protection Detection
Voltage1 vs Temperature
Figure 16. Start Up Current vs Temperature
12
10
8
14
VUVLO1
13
12
11
10
6
4
9
VUVLO2
2
8
7
0
-40
-10
20
50
80
110
10
16
22
28
34
40
Temperature: Ta[˚C]
VCC Supply Voltage: VCC[V]
Figure 17. VCC UVLO Voltage vs Temperature
Figure 18. OUT H Voltage vs VCC
www.rohm.com
© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0F1F0A200730-1-2
14/22
25.Nov.2020 Rev.001
BD7693FJ BD7694FJ
Application Example
F1
D3
L
DB1
R1
R2
R3
LF1
VOUT +
D4
T1
C3
C4
ZNR1
R16
C16
N
R7
C1
C2
D2
R4
R17
D1
R9
C5
M1
R15
C15
R10
R11
R12
C14
R18
R5
VCC OUT GND ZCD
BD7693FJ/BD7694FJ
IC1
C6
C17
VS
EO
CS
MULT
R13
R8
R19
R20
R6 C7
C10
C8
C9
C11
C13
R14
C12
GND
Figure 19. Application Example
1
Output Voltage Setting
The output voltage is decided on feedback resistance by the VS pin.
(푅 ꢂ푅
푉푂푈푇 = ꢀ1 + (푅 //푅 ))ꢃ × 푉
= ꢀ1 + ꢄ5ꢅꢆ 푘훺ꢃ × ꢈ.ꢉ 푉 = 3ꢊꢋ [V]
ꢁ7
ꢁ8
퐴푀푃
ꢄꢇ 푘훺
ꢁ9
20
ꢌꢄꢍ + ꢌꢄꢅ:
ꢌꢄꢎ//ꢌꢆꢇ:
Upper side resister of the output feedback
Bottom side resister of the output feedback
Gm amplifier reference voltage1
푉
:
퐴푀푃
2
3
Calculation of the Inductance
Reference value in case of VOUT = 400 V, Output power = 200 W
ꢏ = ꢈꢉꢐ [μH]
Setting a large value of inductance will reduce the THD but increase the component size.
External Parts of VCC
The VCC pin can reduce VCC voltage change at the time of the switching by attaching capacitor.
This IC drives gate capacitor of the external MOSFET by the OUT pin. The VCC capacitor recommends electric field
capacitor 22 µF or more withstand pressure 50 V or more.
In addition, you must confirm VCC voltage evaluation at the time of startup and the protection detection with an actual board
when VCC is generated by startup resistance and the auxiliary winding of the transformer.
Because the consumption current of the IC decreases when an IC becomes the switching stop state after startup, the VCC
voltage may rise by startup resistance. The overvoltage destruction of VCC is prevented by VCC voltage discharge function.
The startup resistor value makes small by this function, boot-time becomes fast.
www.rohm.com
© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0F1F0A200730-1-2
15/22
25.Nov.2020 Rev.001
BD7693FJ BD7694FJ
Attention in the Board Design
About parts placement
You must locate the parts in the Figure 20 inside dot line near the IC. In addition, please do parts placement to avoid the
interference with switching lines and high current lines such as inductor, DRAIN.
F1
D3
L
DB1
R1
R2
R3
LF1
VOUT +
D4
T1
C3
C4
ZNR1
R16
C16
N
R7
C1
C2
D2
R4
R17
D1
R9
C5
M1
R15
C15
R10
R11
R12
C14
R18
R5
VCC OUT GND ZCD
BD7693FJ/BD7694FJ
IC1
C6
C17
VS
EO
CS
MULT
R13
R8
R19
R20
R6 C7
C10
C8
C9
C11
C13
R14
C12
GND
Figure 20. Parts Placement
About GND wiring guidance
The red line of Figure 21 is the GND lines which large current flows. Draw each line as an independent wire. In addition, pull
the wiring thick and short. The blue line is the GND of the IC. Make the GND of the IC and the GND of the peripheral parts
common.
F1
D3
L
DB1
R1
R2
R3
LF1
VOUT +
D4
T1
C3
C4
ZNR1
R16
C16
N
R7
C1
C2
D2
R4
R17
D1
R9
C5
M1
R15
C15
R10
R11
R12
C14
R18
R5
VCC OUT GND ZCD
BD7693FJ/BD7694FJ
IC1
C6
C17
VS
EO
CS
MULT
R13
R8
R19
R20
R6 C7
C10
C8
C9
C11
C13
R14
C12
GND
Figure 21. GND Line Layout
www.rohm.com
© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0F1F0A200730-1-2
16/22
25.Nov.2020 Rev.001
BD7693FJ BD7694FJ
Attention in the Board – continued
About large current line
Large circuit current flows through the part of the red line of Figure 22. You must wire it short and thickly. Do not place IC and
high impedance line near the red line because it has large noise.
F1
D3
L
DB1
R1
R2
R3
LF1
VOUT +
D4
T1
C3
C4
ZNR1
R16
C16
N
R7
C1
C2
D2
R4
R17
D1
R9
C5
M1
R15
C15
R10
R11
R12
C14
R18
R5
VCC OUT GND ZCD
BD7693FJ/BD7694FJ
IC1
C6
C17
VS
EO
CS
MULT
R13
R8
R19
R20
R6 C7
C10
C8
C9
C11
C13
R14
C12
GND
Figure 22. High Current Line Layout
I/O Equivalence Circuits
1
VS
2
EO
3
MULT
4
CS
Internal Reg
Internal Reg
Internal Reg
5
ZCD
6
GND
7
OUT
8
VCC
www.rohm.com
© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0F1F0A200730-1-2
17/22
25.Nov.2020 Rev.001
BD7693FJ BD7694FJ
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a
voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
www.rohm.com
TSZ02201-0F1F0A200730-1-2
© 2020 ROHM Co., Ltd. All rights reserved.
18/22
TSZ22111 • 15 • 001
25.Nov.2020 Rev.001
BD7693FJ BD7694FJ
Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 23. Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
www.rohm.com
© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0F1F0A200730-1-2
19/22
25.Nov.2020 Rev.001
BD7693FJ BD7694FJ
Ordering Information
B D 7
6
9
x
F
J
-
E 2
x: Brown Out Package
Packaging and forming specification
E2: Embossed tape and reel
3: None-
FJ: SOP-J8
4: With
Marking Diagram
SOP-J8 (TOP VIEW)
Part Number Marking
LOT Number
Pin 1 Mark
Product name
BD7693FJ-E2
BD7694FJ-E2
Part Number Marking
D7693
D7694
www.rohm.com
© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0F1F0A200730-1-2
25.Nov.2020 Rev.001
20/22
BD7693FJ BD7694FJ
Physical Dimension and Packing Information
Package Name
SOP-J8
www.rohm.com
© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0F1F0A200730-1-2
21/22
25.Nov.2020 Rev.001
BD7693FJ BD7694FJ
Revision History
Date
Revision
001
Changes
25.Nov.2020
New Release
www.rohm.com
© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0F1F0A200730-1-2
22/22
25.Nov.2020 Rev.001
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
相关型号：
BD7694FJ
BD7694FJ是一款功率因数校正（Power Factor Correction：PFC）转换器，可为各种需要改善功率因数的产品提供理想系统。PFC部分采用临界模式，通过检测过零电流，可以降低开关损耗和噪声。内置了可减少总谐波失真（THD）的电路，因此可以支持 IEC61000-3-2 Class-C。提供支持各种功率段和拓扑的评估板。a.productlink{color: #dc2039; text-decoration: underline !important;}a.productlink:hover {opacity: 0.6;}
ROHM
BD7695FJ (新产品)
BD7695FJ is Power Factor Correction ICs for AC/DC supply, which are suitable for all products needing power factor improvement. The PFC adopts boundary conduction mode (BCM) and switching loss reduction and noise reduction are possible by Zero Current Detection (ZCD). This IC incorporates a circuit for reducing total harmonics distortion (THD) and can support IEC61000-3-2 Class-C.
ROHM
BD7696FJ (新产品)
BD7696FJ is Power Factor Correction ICs for AC/DC supply, which are suitable for all products needing power factor improvement. The PFC adopts boundary conduction mode (BCM) and switching loss reduction and noise reduction are possible by Zero Current Detection (ZCD). This IC incorporates a circuit for reducing total harmonics distortion (THD) and can support IEC61000-3-2 Class-C.
ROHM
©2020 ICPDF网 联系我们和版权申明