BD7693FJ [ROHM]

BD7693FJ是一款功率因数校正(Power Factor Correction:PFC)转换器,可为各种需要改善功率因数的产品提供理想系统。PFC部分采用临界模式,通过检测过零电流,可以降低开关损耗和噪声。内置了可减少总谐波失真(THD)的电路,因此可以支持 IEC61000-3-2 Class-C。BD7693FJ的评估板信息点击这里获取。此外,ROHM还提供支持各种功率段和拓扑的评估板。a.productlink{color: #dc2039; text-decoration: underline !important;}a.productlink:hover {opacity: 0.6;};
BD7693FJ
型号: BD7693FJ
厂家: ROHM    ROHM
描述:

BD7693FJ是一款功率因数校正(Power Factor Correction:PFC)转换器,可为各种需要改善功率因数的产品提供理想系统。PFC部分采用临界模式,通过检测过零电流,可以降低开关损耗和噪声。内置了可减少总谐波失真(THD)的电路,因此可以支持 IEC61000-3-2 Class-C。BD7693FJ的评估板信息点击这里获取。此外,ROHM还提供支持各种功率段和拓扑的评估板。a.productlink{color: #dc2039; text-decoration: underline !important;}a.productlink:hover {opacity: 0.6;}

开关 功率因数校正 转换器
文件: 总25页 (文件大小:1166K)
中文:  中文翻译
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Datasheet  
Boundary Conduction Mode  
Power Factor Correction Controller IC  
BD7693FJ BD7694FJ  
General Description  
Key Specifications  
BD7693FJ and BD7694FJ are Power Factor Correction  
IC for AC/DC supplies the system which is suitable for all  
the products needing power factor improvement. The  
PFC adopts boundary conduction mode (BCM), and  
switching loss reduction and noise reduction are possible  
by Zero Current Detection (ZCD). This IC incorporates a  
circuit lowering total harmonics distortion (THD) and can  
support IEC61000-3-2 Class-C.  
Input VCC Voltage Range:  
Operating Current:  
Operating Temperature Range: -40 °C to +105 °C  
10 V to 38 V  
0.58 mA (Typ)  
Package  
SOP-J8  
W (Typ) x D (Typ) x H (Max)  
4.9 mm x 6.0 mm x 1.65 mm  
Features  
Boundary Conduction Mode PFC  
Low THD Circuit Incorporation  
Low Power Consumption  
VCC UVLO Function  
ZCD by Auxiliary Winding  
Static OVP by the VS Pin  
Error Amplifier Input Short Protection  
Stable MOSFET Gate Drive  
Soft Start  
Lineup  
Product name  
Brown Out  
BD7693FJ-E2  
BD7694FJ-E2  
-
Applications  
Lighting Equipment, AC Adopter, TV, Refrigerator,  
etc.  
Typical Application Circuit  
Diode  
Bridge  
VS  
MULT  
CS  
VCC  
6
5
8
7
VCC  
OUT  
GND  
ZCD  
VS  
EO  
MULT  
CS  
1
2
3
4
VS  
MULT  
CS  
Product structure : Silicon integrated circuit This product has no designed protection against radioactive rays.  
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BD7693FJ BD7694FJ  
Pin Configuration  
(TOP VIEW)  
6
5
8
7
VCC  
OUT  
GND  
ZCD  
VS  
EO  
MULT  
CS  
1
2
3
4
Pin Description  
ESD Diode  
VCC GND  
Pin No.  
Pin Name  
I/O  
Function  
1
2
3
4
5
6
7
8
VS  
EO  
MULT  
CS  
ZCD  
GND  
OUT  
VCC  
I
O
I
I
I
-
O
I
Feedback input pin  
Error amplifier output pin  
Multiplier input pin  
Over current detection pin  
Zero current detection pin  
GND pin  
-
-
-
-
-
-
-
-
External MOSFET driver pin  
Power supply pin  
Block Diagram  
VOUT  
FUSE  
Diode  
Bridge  
Filter  
Vac  
MULT  
VS  
VCC  
GND  
ZCD  
+
0.67 V / 0.9 V  
-
1 shot  
Internal  
Supply  
+
-
UVLO  
BGR  
Reg  
5.0 V  
13.0 V / 8.0 V  
Timer  
30 µs  
out reset  
TSD  
TSD  
OVR Comp  
SHORT Comp  
SP  
+
-
+
-
OVR  
OVR  
0.3 V  
GCLAMP  
(12 V)  
2.250 V  
VS  
SOVP Comp  
SOVP  
VS  
+
-
Comp  
2.7 V / 2.6 V  
OR  
ErrAmp  
S
R
POUT  
-
+
OUT  
UVLO  
Q
PRE  
Driver  
EO  
2.5 V  
PWM Comp  
SOVP  
AND  
-
NOUT  
UVLO  
OVR  
SP  
1.5 V  
100 k  
MULT  
+
MULT  
TSD  
BROUT  
(BD7694 only)  
Multplier  
Brown Out  
(BD7694 only)  
BROUT  
CS  
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Description of Blocks  
1
VCC Protection  
This IC has VCC UVLO (Under Voltage Lock Out) of the VCC pin. Switching stops at the time of VCC voltage drop.  
In addition, when the VCC voltage becomes higher than the VCC_DIS1 (38 V Typ) voltage, it increases operating current and  
suppresses the rise in VCC voltage. When the VCC voltage lowers than the VCC_DIS2 (34 V Typ) voltage, the operating  
current becomes usual. This function assumes the case that the VCC voltage rises by startup resistance.  
2
PFC: Power Factor Correction  
The power factor improvement circuit is a voltage control method of Boundary Conduction Mode.  
The outline operation circuit diagram is shown in Figure 1. The switching operation is shown in Figure 2.  
Auxiliary winding for zero  
current detection  
Bridge  
IL  
Diode  
PFC OUT  
AC IN  
Diode  
ZCD  
MOSFET  
OUT  
PFC OUT  
Feedback Resistor  
MULT  
EO  
VS  
CS  
GND  
RCS  
GND  
OCP Detect Resistor  
Figure 1. Operation Circuit Outline  
OUT  
(Gate)  
MOSFET  
(Vds)  
IL  
VCS  
VZCD  
3
2
4
1
Figure 2. Switching Operation Timing Chart  
Switching Operation  
1. MOSFET is turned on, and IL increases.  
2. The IC compares Multiplier out with VCS slope, and MOSFET is off when the VCS voltage higher than Multiplier out.  
3. MOSFET is off, and IL decreases.  
4. The ZCD pin detects a zero point of the IL and turns on MOSFET.  
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Description of Blocks - continued  
3
About ErrAMP  
3.1  
GmAMP  
The VS pin monitors a divided point for resistance of the output voltage. The ripple voltage of AC frequency (50 Hz / 60  
Hz) overlaps with the VS pin. GmAMP removes this ripple voltage. GmAMP compares VAMP1 (2.500 V Typ) with the  
removed voltage, GmAMP controls the EO voltage by this gap. When the EO pin voltage rises, ON width of the OUT pin  
becomes wide. When the EO voltage less than VBURST (1.9 V Typ), the IC stops switching. Therefore, it can stop  
switching operation when the EO pin connects to the GND.  
Also, you must set the error amplifier constant so that the AC frequency does not overlap on the EO pin. And, please  
confirm it by an actual board.  
PFC Output  
VS  
-
+
2.500 V  
EO  
Figure 3. GmAMP Block Diagram  
3.2  
VS Short Protection  
The VS pin has a short protection function.  
A state of the VS pin voltage < VSHORT (0.3 V Typ) continues tVS_SH (150 µs Typ) or more, it stops switching.  
Figure 4 shows the operation.  
PFC  
Output  
VOUT  
VS  
VSHORT  
tVS_SH  
OUT  
Switching Stop  
Figure 4. Operation of VS Short Protection  
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3
About ErrAMP - continued  
3.3  
VS Overvoltage Protection Function (SOVP)  
The VS pin voltage rises from VOVP1 (2.7 V Typ), it stops switching immediately. The VS pin voltage less than VOVP2 (2.6  
V Typ), it starts switching. Figure 5 shows the operation.  
PFC  
Output  
VOVP1  
VOVP2  
VS  
OUT  
Switching  
Stop  
Figure 5. VS Overvoltage Protection Operation  
3.4  
Over Voltage Reduce Function at Start Up (OVR)  
When the VS pin voltage performs a rise in startup to VOVR (2.25 V Typ) (equivalent to -10 % of output voltage), it  
discharges the EO voltage to the VBURST forcibly. OUT pulse width is narrows when the EO voltage falls, through rate of  
output voltage becomes slow and reduces over voltage in the startup.  
This function is effective only once after VCC UVLO cancellation.  
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Description of Blocks - continued  
4
ZCD pin  
The zero current detection circuit is a function to detect a zero cross of the inductor current (IL) (Figure 6, 7).  
If the voltage at the ZCD pin becomes lower than VZCD2 (0.67 V Typ) after becoming higher than VZCD1 (0.9 V Typ), the  
OUT output becomes High after the ZCD output delay time (tZCD 260 ns Typ) has elapsed.  
When the ZCD voltage does not reach VZCD1 (0.9 V Typ), it becomes the restart timer operation. After the OUT output  
became Low, OUT becomes High after tREST (30 μs Typ) progress (Figure 8).  
Diode  
T1  
ZCD  
OUT  
Control  
Logic  
+
-
MOSFET  
RCS  
Figure 6. Zero Current Detection Circuit  
OUT  
(Gate)  
VZCD1  
VZCD2  
VZCD  
tZCD  
Figure 7. Zero Current Detection  
OUT  
(Gate)  
VZCD1  
VZCD  
tREST  
Figure 8. Restart Timer  
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Description of Blocks - continued  
5
MULTIPLIER  
The ON width of the OUT pin is fixed in Multiplier out and VCS as it showed in Figure 2.  
VCS is expressed in the following formula.  
퐶푆 = 퐾 × 푀푈퐿(퐸푂 퐵푈푅푆푇  
)
K:  
VMULT  
VEO  
VBURST  
MULTIPLIER GAIN  
:
MULT pin voltage  
EO pin voltage  
Burst voltage  
:
:
AC voltage information is input into VMULT. The IC improves a power factor by controlling AC current with the AC  
voltage. In addition, VCS in AC voltage 0 V (VMULT = 0 V) is expressed in the following formula.  
(
)
퐶푆 = 퐾 × 푀푈퐿푇 퐸푂 퐵푈푅푆푇 + 푂퐹퐹푆퐸푇 = 푂퐹퐹푆퐸푇  
The ON width of the OUT pin at the age of AC voltage 0 V (VMULT = 0 V) becomes long by adding VOFFSET (25 mV Typ).  
Because ON width gets longer, diode bridge output voltage is discharged. As a result, an AC current distortion is improved  
without the current supply from a diode bridge stopping (Figure 9).  
VOFFSET less  
VOFFSET case  
case  
V
IL  
Diode  
Bridge  
V1  
V1  
AC IN  
Remain  
voltage  
No remain  
voltage  
t
t
V
OUT  
I
Stop  
Non stop  
->High AC current  
distortion  
->Improvement of the  
AC current distortion  
AC  
current  
Figure 9. Improvement of the AC Current Distortion  
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Description of Blocks - continued  
6
MULT pin  
When the state that the MULT pin voltage is lower than VBROUT1 (0.8 V Typ) continues tBROUT (160 ms Typ) or more,  
the IC stops switching by a brown out function (only in BD7694).  
When the MULT pin voltage becomes higher than VBROUT2 (0.97 V Typ), the IC switches again.  
Switching  
Switching  
Stop  
OUT  
VBROUT2  
VBROUT1  
tBROUT  
VMULT  
Figure 10. Brown Out  
7
CS pin  
In normal operation, turn OFF of the switching is usually decided by ON width by the EO pin and the MULT pin  
voltage. However, the IC is off in a pulse by pulse in overcurrent protection when the CS pin rises than VCS (1.5 V  
Typ). By this protection, it prevents an overcurrent to MOSFET.  
The overcurrent protection function limits ON width. When this protection becomes the working PFC load, PFC  
output voltage decreases. You must decide sense resistance of PFC so that this protection does not work in rated  
load with the minimum input voltage at the time of the application design.  
Control  
Logic  
OUT  
CS  
Over Current  
Protection  
1.5 V  
Figure 11. Current Limit  
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Operation Mode of Protection Circuit  
Table 1 showed the operation mode of each protection function.  
Table 1. Operation Mode of Each Protective Circuit  
Protection Mode  
Parameter  
VCC UVLO  
Contents  
Detection  
Method  
Detection  
Operation  
Cancellation  
Method  
Cancellation  
Operation  
Under Voltage Lock Out  
on the VCC pin  
VCC < 8 V (Typ)  
OUT OFF  
EO discharge  
VCC > 13 V (Typ)  
Startup  
Operation  
(VCC drop)  
(VCC rise)  
Over Current Protection  
on the CS pin  
CS > 1.5 V (Typ)  
CS < 1.5 V (Typ)  
Normal  
Operation  
CS OCP  
VS Short  
OUT OFF  
(CS rise)  
(CS drop)  
Short Protection  
on the VS pin  
VS < 0.3 V (Typ)  
OUT OFF  
EO discharge  
VS > 0.3 V (Typ)  
Normal  
Operation  
(VS drop)  
(VS rise)  
Over Voltage Protection  
on the VS pin  
VS > 2.7 V (Typ)  
VS < 2.6 V (Typ)  
Normal  
Operation  
VS Static OVP  
OUT OFF  
(VS rise)  
(VS drop)  
MULT < 0.8 V  
(Typ)  
(MULT drop)  
MULT > 0.97 V  
(Typ)  
(MULT rise)  
Brown Out  
(Only BD7694)  
Low Voltage Protection  
on the MULT pin  
OUT OFF  
EO discharge  
Normal  
Operation  
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Absolute Maximum Ratings (Ta = 25 °C)  
Parameter  
Symbol  
Rating  
Unit  
Condition  
Maximum Voltage 1  
Maximum Voltage 2  
Maximum Voltage 3  
Maximum Current 1  
OUT Pin Output Peak Current 1  
OUT Pin Output Peak Current 2  
Maximum Junction Temperature  
Storage Temperature Range  
VMAX1  
VMAX2  
VMAX3  
IZCD1  
IOUT1  
IOUT2  
-0.3 to +40  
-0.3 to +14  
-0.3 to +6.5  
-10 to +10  
-0.5  
+1  
+150  
-55 to +150  
V
V
V
mA  
A
A
VCC  
OUT  
CS, MULT, VS, EO  
ZCD current  
Source current  
Sink current  
Tjmax  
Tstg  
°C  
°C  
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit  
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated  
over the absolute maximum ratings.  
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the  
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing  
board size and copper area so as not to exceed the maximum junction temperature rating.  
Thermal Resistance(Note 1)  
Thermal Resistance (Typ)  
Parameter  
Symbol  
Unit  
1s(Note 3)  
2s2p(Note 4)  
SOP-J8  
Junction to Ambient  
Junction to Top Characterization Parameter(Note 2)  
θJA  
149.3  
18  
76.9  
11  
°C/W  
°C/W  
ΨJT  
(Note 1) Based on JESD51-2A(Still-Air)  
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of  
the component package.  
(Note 3) Using a PCB board based on JESD51-3.  
(Note 4) Using a PCB board based on JESD51-7.  
Layer Number of  
Measurement Board  
Material  
Board Size  
Single  
FR-4  
114.3 mm x 76.2 mm x 1.57 mmt  
Top  
Copper Pattern  
Thickness  
70 μm  
Footprints and Traces  
Layer Number of  
Measurement Board  
Material  
Board Size  
114.3 mm x 76.2 mm x 1.6 mmt  
2 Internal Layers  
4 Layers  
FR-4  
Top  
Copper Pattern  
Bottom  
Copper Pattern  
74.2 mm x 74.2 mm  
Thickness  
70 μm  
Copper Pattern  
Thickness  
35 μm  
Thickness  
70 μm  
Footprints and Traces  
74.2 mm x 74.2 mm  
Recommended Operating Conditions  
Parameter Symbol  
Supply Voltage  
Operating Temperature  
Min  
Typ  
Max  
Unit  
Condition  
VCC Voltage  
VCC  
Topr  
10  
-40  
15  
+25  
38  
+105  
V
°C  
Recommended Range of the External Component (Ta = 25 °C)  
Parameter  
Symbol  
CVCC  
Rating  
Unit  
μF  
VCC Pin Connection Capacity  
22 or more  
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BD7693FJ BD7694FJ  
Electrical Characteristics (Unless otherwise specified VCC = 15 V, Ta = -40 °C to +105 °C)  
Parameter  
[Circuit Current]  
Symbol  
Min  
Typ  
Max  
Unit  
Condition  
Circuit Current (ON) 1  
Circuit Current (ON) 2  
Circuit Current (ON) 3  
ION1  
ION2  
-
-
0.58  
0.95  
1.20  
2.00  
mA  
mA  
VS = 0 V  
50 kHz switching  
VCC discharge  
Switching stop  
ION3  
4.5  
9.0  
13.5  
200  
mA  
µA  
Start Up Current  
ISTART  
-
100  
VCC = 12 V  
[VCC Pin Protection]  
VCC UVLO Voltage1  
VCC UVLO Voltage2  
VCC UVLO Hysteresis  
VCC Discharge Voltage1  
VCC Discharge Voltage2  
[Gm Amplifier Block]  
VS Pin Pull-up Current  
Gm Amplifier  
Reference Voltage1  
Gm Amplifier  
Reference Voltage2  
Gm Amplifier Line Regulation  
Gm Amplifier  
VUVLO1  
VUVLO2  
VUVLO3  
VCC_DIS1  
VCC_DIS2  
12  
7
3.8  
-
13  
8
5.0  
38  
34  
14  
9
6.2  
-
V
V
V
V
V
VCC rise  
VCC drop  
VUVLO3 = VUVLO1 -VUVLO2  
VCC rise  
VCC drop  
-
-
IVS  
-
0.1  
0.5  
µA  
V
VS = 0 V  
VAMP1  
2.465  
2.500  
2.535  
Ta = 25 °C  
VAMP2  
VAMP_LINE  
TVS  
2.44  
-
-
1
2.54  
10  
V
Ta = -40 °C to +105 °C  
VCC = 10 V to 38 V  
EO = 2.5 V, Ta = 25 °C  
mV  
80  
100  
130  
µA/V  
Trans Conductance  
Gm Amplifier Source Current  
Gm Amplifier Sink Current  
[EO Block]  
IEO_SOURCE  
IEO_SINK  
5
5
10  
10  
20  
20  
µA  
µA  
VS = 2.3 V  
VS = 2.7 V  
EO L Voltage  
Burst Voltage  
EO Discharge Current  
[MULT Block]  
MULT Pin Pull-up Current  
MULT Pin Dynamic Range  
VEOL  
VBURST  
IEO  
-
1.6  
1.9  
1.8  
1.8  
-
3.0  
V
V
mA  
VS = 2.7 V  
1.8  
0.8  
VCC = 12 V, EO = 1.0 V  
MULT = 0 V  
IMULT  
VMULT  
-
0.1  
0 to 3.5  
VBURST  
to  
0.5  
-
µA  
V
0 to 2.5  
VBURST  
to  
EO Pin Dynamic Range  
VEOD  
-
V
2.9  
3.4  
MULTIPLIER Gain  
K
0.43  
0.65  
0.87  
0.9  
1/V  
V
MULT = 0.5 V, EO = 3.0 V  
MULT drop  
BD7694FJ Only  
MULT rise  
BD7694FJ Only  
BD7694FJ Only  
Brown Out Detect Voltage1  
VBROUT1  
0.7  
0.8  
Brown Out Detect Voltage2  
VBROUT2  
tBROUT  
0.87  
80  
0.97  
160  
1.07  
320  
V
Brown Out Detect Timer  
[ZCD Block]  
ms  
ZCD Threshold Voltage1  
ZCD Threshold Voltage2  
ZCD Output Delay  
Input H Clamp Voltage  
Input L Clamp Voltage  
Restart Timer  
VZCD1  
VZCD2  
tZCD  
VIH  
VIL  
0.8  
0.55  
-
6.1  
-0.3  
15  
0.9  
0.67  
260  
6.7  
-0.1  
30  
1.0  
0.79  
520  
-
-
45  
V
V
ns  
V
V
µs  
ZCD rise  
ZCD drop  
Isink = 3 mA  
Isource = -3 mA  
tREST  
[VS Protection Block]  
VS Short Protection  
Detection Voltage  
VS Shortstop Protection  
Detection Time  
VSHORT  
tVS_SH  
VOVR  
0.2  
50  
-
0.3  
0.4  
300  
-
V
µs  
V
150  
Over Voltage Reduce Detection  
Voltage  
0.9 x  
VAMP1  
VS Overvoltage Protection  
Detection Voltage 1  
VS Overvoltage Protection  
Detection Voltage 2  
1.065 x  
VAMP1  
1.020 x  
VAMP1  
1.080 x  
VAMP1  
1.040 x  
VAMP1  
1.095 x  
VAMP1  
1.060 x  
VAMP1  
VOVP1  
VOVP2  
V
VS rise Ta = 25 °C  
VS drop Ta = 25 °C  
V
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BD7693FJ BD7694FJ  
Electrical Characteristics (Unless otherwise specified VCC = 15 V, Ta = -40 °C to +105 °C) - continued  
Parameter  
Symbol  
Min  
Typ  
Max  
Unit  
Condition  
[CS Block]  
CS Threshold Voltage  
Output Delay Time  
CS Pin Pull-up Current  
CS Offset Voltage  
[OUT Block]  
VCS  
tDELAY  
ICS  
1.3  
1.5  
150  
0.15  
25  
1.8  
300  
1.00  
-
V
ns  
µA  
mV  
-
-
-
CS = 0 V  
MULT = 0 V  
VOFFSET  
OUT H Voltage  
OUT L Voltage  
VPOUTH  
VPOUTL  
9.0  
-
10.2  
-
11.4  
0.8  
V
V
OUT = -20 mA  
OUT = +20 mA  
OUT load capacitor = 1000 pF  
OUT L Voltage to 5 V  
OUT load capacitor = 1000 pF  
OUT H Voltage to 5 V  
Rise Time  
tr  
-
50  
-
ns  
Fall Time  
tf  
-
50  
-
ns  
OUT Pull-down Resistance  
RPDOUT  
50  
100  
150  
kΩ  
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BD7693FJ BD7694FJ  
Typical Performance Curves  
(Reference data)  
1.6  
VEO = 4.50 V  
VEO = 4.00 V  
1.4  
1.2  
1
VEO = 3.50 V  
VEO = 2.75 V  
VEO = 2.50 V  
VEO = 3.00 V  
0.8  
0.6  
0.4  
0.2  
0
VEO = 2.25 V  
VEO = 2.00 V  
0
1
2
3
4
VMULT[V]  
Figure 12. VCS vs VMULT  
2.535  
2.530  
2.525  
2.520  
2.515  
2.510  
2.505  
2.500  
2.495  
2.490  
2.485  
2.480  
2.475  
2.470  
2.465  
2.535  
2.530  
2.525  
2.520  
2.515  
2.510  
2.505  
2.500  
2.495  
2.490  
2.485  
2.480  
2.475  
2.470  
2.465  
10  
15  
20  
25  
30  
35  
-40  
-10  
20  
50  
80  
110  
VCC Supply Voltage: VCC[V]  
Temperature: Ta[˚C]  
Figure 13. Gm Amplifier Reference Voltage1 vs Temperature  
Figure 14. Gm Amplifier Reference Voltage1 vs VCC  
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BD7693FJ BD7694FJ  
Typical Performance Curves - continued  
200  
180  
160  
140  
120  
100  
80  
1.095  
1.090  
1.085  
1.080  
1.075  
1.070  
1.065  
60  
40  
20  
0
-40  
-10  
20  
50  
80  
110  
-40 -10  
20  
50  
80 110  
Temperature: Ta[˚C]  
Temperature: Ta[˚C]  
Figure 15. VS Overvoltage Protection Detection  
Voltage1 vs Temperature  
Figure 16. Start Up Current vs Temperature  
12  
10  
8
14  
VUVLO1  
13  
12  
11  
10  
6
4
9
VUVLO2  
2
8
7
0
-40  
-10  
20  
50  
80  
110  
10  
16  
22  
28  
34  
40  
Temperature: Ta[˚C]  
VCC Supply Voltage: VCC[V]  
Figure 17. VCC UVLO Voltage vs Temperature  
Figure 18. OUT H Voltage vs VCC  
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BD7693FJ BD7694FJ  
Application Example  
F1  
D3  
L
DB1  
R1  
R2  
R3  
LF1  
VOUT +  
D4  
T1  
C3  
C4  
ZNR1  
R16  
C16  
N
R7  
C1  
C2  
D2  
R4  
R17  
D1  
R9  
C5  
M1  
R15  
C15  
R10  
R11  
R12  
C14  
R18  
R5  
VCC OUT GND ZCD  
BD7693FJ/BD7694FJ  
IC1  
C6  
C17  
VS  
EO  
CS  
MULT  
R13  
R8  
R19  
R20  
R6 C7  
C10  
C8  
C9  
C11  
C13  
R14  
C12  
GND  
Figure 19. Application Example  
1
Output Voltage Setting  
The output voltage is decided on feedback resistance by the VS pin.  
(푅 ꢂ푅  
푂푈푇 = ꢀ1 + (푅 //푅 ))ꢃ × 푉  
= ꢀ1 + ꢄ5ꢅꢆ 푘훺ꢃ × ꢈ.ꢉ 푉 = 3ꢊꢋ [V]  
ꢁ7  
ꢁ8  
퐴푀푃  
ꢄꢇ 푘훺  
ꢁ9  
20  
ꢄꢍ + ꢌꢄꢅ:  
ꢄꢎ//ꢌꢆꢇ:  
Upper side resister of the output feedback  
Bottom side resister of the output feedback  
Gm amplifier reference voltage1  
:
퐴푀푃  
2
3
Calculation of the Inductance  
Reference value in case of VOUT = 400 V, Output power = 200 W  
ꢏ = ꢈꢉꢐ [μH]  
Setting a large value of inductance will reduce the THD but increase the component size.  
External Parts of VCC  
The VCC pin can reduce VCC voltage change at the time of the switching by attaching capacitor.  
This IC drives gate capacitor of the external MOSFET by the OUT pin. The VCC capacitor recommends electric field  
capacitor 22 µF or more withstand pressure 50 V or more.  
In addition, you must confirm VCC voltage evaluation at the time of startup and the protection detection with an actual board  
when VCC is generated by startup resistance and the auxiliary winding of the transformer.  
Because the consumption current of the IC decreases when an IC becomes the switching stop state after startup, the VCC  
voltage may rise by startup resistance. The overvoltage destruction of VCC is prevented by VCC voltage discharge function.  
The startup resistor value makes small by this function, boot-time becomes fast.  
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BD7693FJ BD7694FJ  
Attention in the Board Design  
About parts placement  
You must locate the parts in the Figure 20 inside dot line near the IC. In addition, please do parts placement to avoid the  
interference with switching lines and high current lines such as inductor, DRAIN.  
F1  
D3  
L
DB1  
R1  
R2  
R3  
LF1  
VOUT +  
D4  
T1  
C3  
C4  
ZNR1  
R16  
C16  
N
R7  
C1  
C2  
D2  
R4  
R17  
D1  
R9  
C5  
M1  
R15  
C15  
R10  
R11  
R12  
C14  
R18  
R5  
VCC OUT GND ZCD  
BD7693FJ/BD7694FJ  
IC1  
C6  
C17  
VS  
EO  
CS  
MULT  
R13  
R8  
R19  
R20  
R6 C7  
C10  
C8  
C9  
C11  
C13  
R14  
C12  
GND  
Figure 20. Parts Placement  
About GND wiring guidance  
The red line of Figure 21 is the GND lines which large current flows. Draw each line as an independent wire. In addition, pull  
the wiring thick and short. The blue line is the GND of the IC. Make the GND of the IC and the GND of the peripheral parts  
common.  
F1  
D3  
L
DB1  
R1  
R2  
R3  
LF1  
VOUT +  
D4  
T1  
C3  
C4  
ZNR1  
R16  
C16  
N
R7  
C1  
C2  
D2  
R4  
R17  
D1  
R9  
C5  
M1  
R15  
C15  
R10  
R11  
R12  
C14  
R18  
R5  
VCC OUT GND ZCD  
BD7693FJ/BD7694FJ  
IC1  
C6  
C17  
VS  
EO  
CS  
MULT  
R13  
R8  
R19  
R20  
R6 C7  
C10  
C8  
C9  
C11  
C13  
R14  
C12  
GND  
Figure 21. GND Line Layout  
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BD7693FJ BD7694FJ  
Attention in the Board – continued  
About large current line  
Large circuit current flows through the part of the red line of Figure 22. You must wire it short and thickly. Do not place IC and  
high impedance line near the red line because it has large noise.  
F1  
D3  
L
DB1  
R1  
R2  
R3  
LF1  
VOUT +  
D4  
T1  
C3  
C4  
ZNR1  
R16  
C16  
N
R7  
C1  
C2  
D2  
R4  
R17  
D1  
R9  
C5  
M1  
R15  
C15  
R10  
R11  
R12  
C14  
R18  
R5  
VCC OUT GND ZCD  
BD7693FJ/BD7694FJ  
IC1  
C6  
C17  
VS  
EO  
CS  
MULT  
R13  
R8  
R19  
R20  
R6 C7  
C10  
C8  
C9  
C11  
C13  
R14  
C12  
GND  
Figure 22. High Current Line Layout  
I/O Equivalence Circuits  
1
VS  
2
EO  
3
MULT  
4
CS  
Internal Reg  
Internal Reg  
Internal Reg  
5
ZCD  
6
GND  
7
OUT  
8
VCC  
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BD7693FJ BD7694FJ  
Operational Notes  
1. Reverse Connection of Power Supply  
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when  
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power  
supply pins.  
2. Power Supply Lines  
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at  
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic  
capacitors.  
3. Ground Voltage  
Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a  
voltage below that of the ground pin at any time, even during transient condition.  
4. Ground Wiring Pattern  
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but  
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal  
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations  
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.  
5. Recommended Operating Conditions  
The function and operation of the IC are guaranteed within the range specified by the recommended operating  
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical  
characteristics.  
6. Inrush Current  
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow  
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power  
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and  
routing of connections.  
7. Testing on Application Boards  
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may  
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply  
should always be turned off completely before connecting or removing it from the test setup during the inspection  
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during  
transport and storage.  
8. Inter-pin Short and Mounting Errors  
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in  
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.  
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and  
unintentional solder bridge deposited in between pins during assembly to name a few.  
9. Unused Input Pins  
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and  
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small  
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and  
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the  
power supply or ground line.  
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BD7693FJ BD7694FJ  
Operational Notes – continued  
10. Regarding the Input Pin of the IC  
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them  
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a  
parasitic diode or transistor. For example (refer to figure below):  
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.  
When GND > Pin B, the P-N junction operates as a parasitic transistor.  
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual  
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to  
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be  
avoided.  
Resistor  
Transistor (NPN)  
Pin A  
Pin B  
Pin B  
B
E
C
Pin A  
B
C
E
P
P+  
P+  
N
P+  
P
P+  
N
N
N
N
N
N
N
Parasitic  
Elements  
Parasitic  
Elements  
P Substrate  
GND GND  
P Substrate  
GND  
GND  
Parasitic  
Elements  
Parasitic  
Elements  
N Region  
close-by  
Figure 23. Example of Monolithic IC Structure  
11. Ceramic Capacitor  
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with  
temperature and the decrease in nominal capacitance due to DC bias and others.  
12. Thermal Shutdown Circuit (TSD)  
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always  
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the  
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj  
falls below the TSD threshold, the circuits are automatically restored to normal operation.  
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no  
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from  
heat damage.  
13. Over Current Protection Circuit (OCP)  
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This  
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should  
not be used in applications characterized by continuous operation or transitioning of the protection circuit.  
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BD7693FJ BD7694FJ  
Ordering Information  
B D 7  
6
9
x
F
J
-
E 2  
x: Brown Out Package  
Packaging and forming specification  
E2: Embossed tape and reel  
3: None-  
FJ: SOP-J8  
4: With  
Marking Diagram  
SOP-J8 (TOP VIEW)  
Part Number Marking  
LOT Number  
Pin 1 Mark  
Product name  
BD7693FJ-E2  
BD7694FJ-E2  
Part Number Marking  
D7693  
D7694  
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25.Nov.2020 Rev.001  
20/22  
BD7693FJ BD7694FJ  
Physical Dimension and Packing Information  
Package Name  
SOP-J8  
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BD7693FJ BD7694FJ  
Revision History  
Date  
Revision  
001  
Changes  
25.Nov.2020  
New Release  
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Notice  
Precaution on using ROHM Products  
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,  
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you  
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport  
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car  
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or  
serious damage to property (Specific Applications), please consult with the ROHM sales representative in advance.  
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any  
damages, expenses or losses incurred by you or third parties arising from the use of any ROHMs Products for Specific  
Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASS  
CLASSⅣ  
CLASSb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are designed and manufactured for use under standard conditions and not under any special or  
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any  
special or extraordinary environments or conditions. If you intend to use our Products under any special or  
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of  
product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.  
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble  
cleaning agents for cleaning residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in  
the range that does not exceed the maximum junction temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must  
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,  
please consult with the ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice-PGA-E  
Rev.004  
© 2015 ROHM Co., Ltd. All rights reserved.  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
A two-dimensional barcode printed on ROHM Products label is for ROHMs internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign  
trade act, please consult with ROHM in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data.  
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the  
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