BD7695FJ (新产品) [ROHM]

BD7695FJ is Power Factor Correction ICs for AC/DC supply, which are suitable for all products needing power factor improvement. The PFC adopts boundary conduction mode (BCM) and switching loss reduction and noise reduction are possible by Zero Current Detection (ZCD). This IC incorporates a circuit for reducing total harmonics distortion (THD) and can support IEC61000-3-2 Class-C.;
BD7695FJ (新产品)
型号: BD7695FJ (新产品)
厂家: ROHM    ROHM
描述:

BD7695FJ is Power Factor Correction ICs for AC/DC supply, which are suitable for all products needing power factor improvement. The PFC adopts boundary conduction mode (BCM) and switching loss reduction and noise reduction are possible by Zero Current Detection (ZCD). This IC incorporates a circuit for reducing total harmonics distortion (THD) and can support IEC61000-3-2 Class-C.

CD 功率因数校正
文件: 总27页 (文件大小:1355K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Datasheet  
Boundary Conduction Mode  
Power Factor Correction Controller IC  
BD7695FJ BD7696FJ  
General Description  
Key Specifications  
BD7695FJ and BD7696FJ are Power Factor Correction  
ICs for AC/DC supply, which are suitable for all products  
needing power factor improvement. The PFC adopts  
boundary conduction mode (BCM) and switching loss  
reduction and noise reduction are possible by Zero  
Current Detection (ZCD). This IC incorporates a circuit for  
reducing total harmonics distortion (THD) and can  
support IEC61000-3-2 Class-C.  
Input VCC Voltage Range:  
Operating Current:  
Operating Temperature Range: -40 °C to +105 °C  
12 V to 38 V  
0.60 mA (Typ)  
Package  
SOP-J8  
W (Typ) x D (Typ) x H (Max)  
4.9 mm x 6.0 mm x 1.65 mm  
Features  
Boundary Conduction Mode PFC  
Low THD Circuit Incorporation  
Low Power Consumption  
VCC UVLO Function  
ZCD by Auxiliary Winding  
Static OVP by the VS Pin  
Error Amplifier Input Short Protection  
Stable MOSFET Gate Drive  
Soft Start  
Lineup  
Product name  
Brown Out  
BD7695FJ-E2  
BD7696FJ-E2  
-
Applications  
Lighting Equipment, AC Adopter, TV, Refrigerator,  
etc.  
Typical Application Circuit  
400 V  
Diode  
Bridge  
VS  
MULT  
CS  
VCC  
6
5
8
7
VCC  
OUT  
GND  
ZCD  
VS  
EO  
MULT  
CS  
1
2
3
4
VS  
MULT  
CS  
Product structure : Silicon integrated circuit This product has no designed protection against radioactive rays.  
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Pin Configuration  
(TOP VIEW)  
6
5
8
7
VCC  
OUT  
GND  
ZCD  
VS  
EO  
MULT  
CS  
1
2
3
4
Pin Description  
ESD Diode  
VCC GND  
Pin No.  
Pin Name  
I/O  
Function  
1
2
3
4
5
6
7
8
VS  
EO  
MULT  
CS  
ZCD  
GND  
OUT  
VCC  
I
O
I
I
I
-
O
I
Feedback input pin  
Error amplifier output pin  
Multiplier input pin  
Over current detection pin  
Zero current detection pin  
GND pin  
-
-
-
-
-
-
-
-
External MOSFET driver pin  
Power supply pin  
Block Diagram  
VOUT  
FUSE  
Diode  
Bridge  
Filter  
Vac  
MULT  
VS  
VCC  
GND  
ZCD  
+
0.67 V / 0.9 V  
-
1 shot  
Internal  
Supply  
+
-
UVLO  
BGR  
Reg  
5.0 V  
12.5 V / 10.0 V  
Timer  
30 µs  
out reset  
TSD  
TSD  
GCLAMP  
(12 V)  
VS  
SHORT Comp  
SP  
VS  
+
-
ErrAmp  
OR  
S
R
POUT  
0.3 V  
-
+
27 µA / 7 µA  
SOVP  
OUT  
UVLO  
OVP  
Detecter  
Q
2.5 V  
PRE  
Driver  
EO  
PWM Comp  
-
SOVP  
AND  
Quarter Gain  
COMP  
NOUT  
SP  
1.08 V  
UVLO  
100 k  
-
+
MULT  
+
MULT  
MULTIPLIER  
TSD  
0.85 V / 0.90 V  
BROUT  
(BD7696 only)  
Brown Out  
(BD7696 only)  
BROUT  
CS  
CS  
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Description of Blocks  
1
VCC Protection  
This IC has VCC UVLO (Under Voltage Lock Out) of the VCC pin. Switching stops at the time of the VCC voltage fall.  
In addition, when the VCC voltage becomes higher than the VCC_DIS1 (38 V Typ) voltage, it increases operating current and  
suppresses the rise in VCC voltage. When the VCC voltage is lower than the VCC_DIS2 (34 V Typ) voltage, the operating  
current becomes usual. This function assumes the case that the VCC voltage rises by startup resistance.  
2
PFC: Power Factor Correction  
The power factor improvement circuit is a voltage control method in the Boundary Conduction Mode.  
The outline of the operation circuit diagram is shown in Figure 1. The switching operation is shown in Figure 2.  
Auxiliary winding for zero  
IL  
Diode  
current detection  
Bridge  
PFC OUT  
AC IN  
Diode  
ZCD  
MOSFET  
OUT  
PFC OUT  
Feedback Resistance  
MULT  
VS  
EO  
CS  
GND  
RCS  
GND  
OCP Detect Resistor  
Figure 1. Operation Circuit Outline  
OUT  
(Gate)  
MOSFET  
(Vds)  
IL  
VCS  
VZCD  
3
2
4
1
Figure 2. Switching Operation Timing Chart  
Switching Operation  
1. The MOSFET is turned on, and IL increases.  
2. The IC compares Multiplier out with VCS slope, and the MOSFET is off when VCS voltage is higher than Multiplier out.  
3. The MOSFET is turned off, and IL decreases.  
4. The ZCD pin detects the zero point of the IL and turns on the MOSFET.  
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Description of Blocks - continued  
3
About ErrAMP  
3.1  
GmAMP  
The VS pin monitors a divided point for resistance of the output voltage. The ripple voltage of the AC frequency (50 Hz  
/ 60 Hz) overlaps with the VS pin. GmAMP removes this ripple voltage. GmAMP compares VAMP1 (2.500 V Typ) with  
the removed voltage, GmAMP controls the EO voltage by this gap. When the EO pin voltage rises, the ON width of the  
OUT pin becomes wide. Also, you must set the error amplifier constant so that the AC frequency does not overlap on  
the EO pin.  
PFC Output  
VS  
-
2.5 V  
+
EO  
Figure 3. GmAMP Block Diagram  
3.2  
VS Short Protection  
The VS pin has a short protection function.  
When a state of the VS pin voltage < VSHORT (0.3 V Typ) continues for tVS_SH (150 µs Typ) or more, IC stops switching.  
Figure 4 shows the operation.  
PFC  
Output  
VOUT  
VS  
VSHORT  
tVS_SH  
OUT  
Switching Stop  
Figure 4. Operation of VS Short Protection  
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3
About ErrAMP - continued  
3.3  
Overvoltage Protection Function (IOVP)  
When the PFC output voltage becomes overvoltage, it stops switching by a protection function. It shows below the  
setting method of the overvoltage protection voltage.  
Figure 5. Overvoltage Protection Operation  
When PFC output voltage exceeds 391 V, sink current flows in the EO pin. When this current grows to IOVPDET1 (27  
µA_Typ) or more, the IC stops switching and activates protection. In addition, the IC cancels protection when this  
current becomes or less IOVPDET2 (7 µA Typ).  
The overvoltage protection detection voltage is IOVPDET1 × R1 + PFCOUT voltage. 27 µA × 1.5 MΩ + 391 V = 431.5 V  
The release voltage is IOVPDET2 × R1 + PFCOUT voltage. 7 µA × 1.5 MΩ + 391 V = 401.5 V  
When output voltage rises, the EO pin voltage falls down, too.  
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BD7695FJ BD7696FJ  
Description of Blocks - continued  
4
ZCD Pin  
The zero current detection circuit is a function to detect a zero cross of the inductor current (IL) (Figure 6, 7).  
If the voltage at the ZCD pin becomes lower than VZCD2 (0.67 V Typ) after becoming higher than VZCD1 (0.9 V Typ), the  
OUT output becomes High after the ZCD output delay time (tZCD 260 ns Typ) has elapsed.  
When the ZCD voltage does not reach VZCD1 (0.9 V Typ), it becomes the restart timer operation. After the OUT output  
becomes Low, OUT becomes High after tREST (30 μs Typ) progresses (Figure 8).  
Diode  
T1  
ZCD  
OUT  
Control  
Logic  
+
-
MOSFET  
RCS  
Figure 6. Zero Current Detection Circuit  
OUT  
(Gate)  
VZCD1  
VZCD2  
VZCD  
tZCD  
Figure 7. Zero Current Detection  
OUT  
(Gate)  
VZCD1  
VZCD  
tREST  
Figure 8. Restart Timer  
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Description of Blocks - continued  
5
MULTIPLIER  
The ON width of the OUT pin is fixed in Multiplier out and VCS as shown in Figure 2.  
The VCS can be expressed in the following formula.  
퐶푆 = 퐾 × 푀푈퐿(퐸푂 − 0.9 푉)  
K:  
VMULT  
VEO  
MULTIPLIER GAIN  
MULT pin voltage  
EO pin voltage  
:
:
AC voltage information is input into VMULT. The IC improves the power factor by controlling AC current with the AC  
voltage. In addition, VCS in AC voltage of 0 V (VMULT = 0 V) is expressed in the following formula.  
(
)
퐶푆 = 퐾 × 푀푈퐿푇 퐸푂 − 0.9 푉 + 푂퐹퐹푆퐸푇 = 푂퐹퐹푆퐸푇  
The ON width of the OUT pin at the age of AC voltage 0 V (VMULT = 0 V) becomes long by adding VOFFSET (30 mV Typ).  
Because the ON width gets longer, the diode bridge output voltage is discharged. As a result, the AC current distortion is  
improved without the current supply from a diode bridge stopping (Figure 9).  
VOFFSET less  
VOFFSET case  
case  
V
IL  
Diode  
Bridge  
V1  
V1  
AC IN  
Remain  
voltage  
No remain  
voltage  
t
t
V
OUT  
I
Stop  
Non stop  
->High AC current  
distortion  
->Improvement of the  
AC current distortion  
AC  
current  
Figure 9. Improvement of the AC Current Distortion  
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Description of Blocks - continued  
For light load conditions (EO < 0.85 V), the gain of the Multiplier block is reduced by a quarter. Decreasing the gain will  
prevent early overvoltage protection at light load, which causes non-continuous switching operation. This function continues  
switching even at light load, as shown in Figure 11.  
Figure 10. Multiplier Gain  
Figure 11. Improvement in Light Load Operation  
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Description of Blocks - continued  
6
MULT Pin  
When the state that the MULT pin voltage is lower than VBROUT1 (0.8 V Typ) continues for tBROUT (160 ms Typ) or  
more, the IC stops switching by a brownout function (only in BD7696FJ).  
When the MULT pin voltage becomes higher than VBROUT2 (0.97 V Typ), the IC switches again.  
Switching  
Switching  
Stop  
OUT  
VBROUT2  
VBROUT1  
tBROUT  
VMULT  
Figure 12. Brown Out  
7
CS Pin  
In normal operation, the turn-off decides by the ON width of the EO pin and the MULT pin voltage. However, the IC  
is off in a pulse by pulse overcurrent protection when the CS pin rises more than VCS (1.08 V Typ). Through this  
protection, it prevents an overcurrent to the MOSFET.  
The overcurrent protection function limits the ON width. When this protection becomes the working PFC load, PFC  
output voltage decreases. You must decide sense resistance of PFC so that this protection does not work in rated  
load with the minimum input voltage at the time of the application design.  
Control  
Logic  
OUT  
CS  
Over Current  
Protection  
1.08 V  
Figure 13. Current Limit  
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Operation Mode of Protection Circuit  
Table 1 showed the operation mode of each protection function.  
Table 1. Operation Mode of Each Protective Circuit  
Protection Mode  
Parameter  
VCC UVLO  
Contents  
Detection  
Method  
Detection  
Operation  
Cancellation  
Method  
Cancellation  
Operation  
Under Voltage Lock Out VCC < 10 V (Typ)  
on the VCC pin (VCC fall)  
OUT OFF  
EO discharge  
VCC > 12.5 V (Typ)  
Startup  
Operation  
(VCC rise)  
Over Current Protection CS > 1.08 V (Typ)  
CS < 1.08 V (Typ)  
Normal  
Operation  
CS OCP  
OUT OFF  
on the CS pin  
(CS rise)  
(CS fall)  
VS Short  
Protection  
Short Protection  
on the VS pin  
VS < 0.3 V (Typ)  
OUT OFF  
EO discharge  
VS > 0.3 V (Typ)  
Normal  
Operation  
(VS fall)  
(VS rise)  
EO > 27 µA (Typ)  
EO < 7 µA (Typ)  
Normal  
Operation  
IOVP  
Over Voltage Protection  
OUT OFF  
(EO rise)  
(EO fall)  
Brown Out  
(Only  
BD7696FJ)  
MULT < 0.8 V  
(Typ)  
(MULT fall)  
MULT > 0.97 V  
(Typ)  
(MULT rise)  
Low Voltage Protection  
on the MULT pin  
OUT OFF  
EO discharge  
Normal  
Operation  
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Absolute Maximum Ratings (Ta = 25 °C)  
Parameter  
Symbol  
Rating  
Unit  
Condition  
Maximum Voltage 1  
Maximum Voltage 2  
Maximum Voltage 3  
Maximum Current  
OUT Pin Output Peak Current 1  
OUT Pin Output Peak Current 2  
Maximum Junction Temperature  
Storage Temperature Range  
VMAX1  
VMAX2  
VMAX3  
IZCD  
IOUT1  
IOUT2  
Tjmax  
Tstg  
-0.3 to +40  
-0.3 to +14  
-0.3 to +6.5  
-10 to +10  
-0.5  
+1  
+150  
-55 to +150  
V
V
V
mA  
A
A
VCC  
OUT  
CS, MULT, VS, EO  
ZCD current  
Source current  
Sink current  
°C  
°C  
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit  
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated  
over the absolute maximum ratings.  
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties  
of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size  
and copper area so as not to exceed the maximum junction temperature rating.  
Thermal Resistance(Note 1)  
Thermal Resistance (Typ)  
Parameter  
Symbol  
Unit  
1s(Note 3)  
2s2p(Note 4)  
SOP-J8  
Junction to Ambient  
Junction to Top Characterization Parameter(Note 2)  
θJA  
149.3  
18  
76.9  
11  
°C/W  
°C/W  
ΨJT  
(Note 1) Based on JESD51-2A(Still-Air)  
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of  
the component package.  
(Note 3) Using a PCB board based on JESD51-3.  
(Note 4) Using a PCB board based on JESD51-7.  
Layer Number of  
Measurement Board  
Material  
FR-4  
Board Size  
Single  
114.3 mm x 76.2 mm x 1.57 mmt  
Top  
Copper Pattern  
Thickness  
70 μm  
Footprints and Traces  
Layer Number of  
Measurement Board  
Material  
FR-4  
Board Size  
114.3 mm x 76.2 mm x 1.6 mmt  
2 Internal Layers  
4 Layers  
Top  
Copper Pattern  
Bottom  
Copper Pattern  
74.2 mm x 74.2 mm  
Thickness  
70 μm  
Copper Pattern  
Thickness  
35 μm  
Thickness  
70 μm  
Footprints and Traces  
74.2 mm x 74.2 mm  
Recommended Operating Conditions  
Parameter Symbol  
Supply Voltage  
Operating Temperature  
Min  
Typ  
Max  
Unit  
Condition  
VCC Voltage  
VCC  
Topr  
12  
-40  
15  
+25  
38  
+105  
V
°C  
Recommended Range of the External Component (Ta = 25 °C)  
Parameter  
Symbol  
CVCC  
Rating  
Unit  
μF  
VCC Pin Connection Capacity  
22 or more  
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Electrical Characteristics (Unless otherwise specified VCC = 15 V, Ta = -40 °C to +105 °C)  
Parameter  
Symbol  
Min  
Typ  
Max  
Unit  
Condition  
[Circuit Current]  
Circuit Current (ON) 1  
Circuit Current (ON) 2  
ION1  
ION2  
-
-
0.60  
0.95  
1.20  
2.00  
mA  
mA  
VS = 0 V  
50 kHz switching  
VCC discharge  
Switching stop  
VCC = 11 V  
Circuit Current (ON) 3  
ION3  
4.5  
-
9.0  
60  
13.5  
110  
mA  
µA  
Start Up Current  
ISTART  
[VCC Pin Protection]  
VCC UVLO Voltage1  
VCC UVLO Voltage2  
VCC UVLO Hysteresis  
VCC Discharge Voltage1  
VCC Discharge Voltage2  
[Gm Amplifier Block]  
VS Pin Pull up Current  
Gm Amplifier  
VUVLO1  
VUVLO2  
VUVLO3  
VCC_DIS1  
VCC_DIS2  
11.5  
12.5  
10  
2.5  
38  
13.5  
11  
3.0  
-
V
V
V
V
V
VCC rise  
VCC fall  
VUVLO3 = VUVLO1 -VUVLO2  
VCC rise  
VCC fall  
9
2.0  
-
-
34  
-
IVS  
-
0.1  
0.5  
µA  
V
VS = 0 V  
VAMP1  
2.465  
2.500  
2.535  
Ta = 25 °C  
Reference Voltage1  
Gm Amplifier  
Reference Voltage2  
VAMP2  
2.44  
-
2.54  
V
Ta = -40 °C to +105 °C  
Gm Amplifier Line Regulation  
Gm Amplifier Source Current  
Gm Amplifier Sink Current  
[EO Block]  
VAMP_LINE  
IEO_SOURCE  
IEO_SINK  
-
50  
50  
1
130  
130  
10  
200  
200  
mV  
µA  
µA  
VCC = 10 V to 38 V  
VS = 2.3 V  
VS = 2.7 V  
EO Low Voltage  
VEOL  
VQGAIN1  
VQGAIN2  
IEO  
-
0.80  
-
0.4  
0.85  
0.90  
1.8  
0.8  
-
0.95  
3.0  
V
V
V
VS = 2.7 V  
Quarter Gain Detect Voltage1  
Quarter Gain Detect Voltage2  
EO Discharge Current  
[MULT Block]  
MULT = 50 mV, CS = 20 mV  
MULT = 50 mV, CS = 20 mV  
VCC = 12 V, EO = 1.0 V  
0.8  
mA  
MULT Pin Pull up Current  
MULT Pin Dynamic Range  
IMULT  
VMULT  
-
0 to 2.5  
0.9  
0.1  
0 to 3.5  
0.9  
0.5  
-
µA  
V
MULT = 0 V  
EO Pin Dynamic Range  
VEOD  
to  
to  
-
V
2.9  
3.4  
MULTIPLIER Gain  
MULTIPLIER Quarter Gain  
K
K/4  
0.33  
-
0.42  
0.11  
0.51  
-
1/V  
1/V  
MULT = 1 V, EO = 2.5 V  
MULT = 1 V, EO = 0.8 V  
MULT fall  
BD7696FJ Only  
MULT rise  
Brown Out Detect Voltage1  
Brown Out Detect Voltage2  
VBROUT1  
0.7  
0.8  
0.9  
V
VBROUT2  
tBROUT  
0.87  
80  
0.97  
160  
1.07  
320  
V
BD7696FJ Only  
BD7696FJ Only  
Brown Out Detect Timer  
[ZCD Block]  
ms  
ZCD Threshold Voltage1  
ZCD Threshold Voltage2  
ZCD Output Delay  
Input H Clamp Voltage  
Input L Clamp Voltage  
Restart Timer  
VZCD1  
VZCD2  
tZCD  
VIH  
VIL  
0.8  
0.55  
-
6.1  
-0.3  
15  
0.9  
0.67  
260  
6.7  
-0.1  
30  
1.0  
0.79  
520  
-
-
45  
V
V
ns  
V
V
µs  
ZCD rise  
ZCD fall  
Isink = 3 mA  
Isource = -3 mA  
tREST  
[Protection Block]  
VS Short Protection  
Detection Voltage  
VS Shortstop Protection  
Detection Time  
IOVP  
Detection Current 1  
IOVP  
Detection Current 2  
VSHORT  
tVS_SH  
IOVPDET1  
IOVPDET2  
0.2  
50  
0.3  
150  
27.0  
7
0.4  
300  
30.5  
-
V
µs  
µA  
µA  
19.5  
-
IEO_SINK rise Ta = 25 °C  
IEO_SINK fall Ta = 25 °C  
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BD7695FJ BD7696FJ  
Electrical Characteristics (Unless otherwise specified VCC = 15 V, Ta = -40 °C to +105 °C) - continued  
Parameter  
Symbol  
Min  
Typ  
Max  
Unit  
Condition  
[CS Block]  
CS Threshold Voltage  
Output Delay Time  
CS Pin Pull up Current  
CS Offset Voltage  
[OUT Block]  
VCS  
tDELAY  
ICS  
1.00  
1.08  
150  
0.15  
30  
1.16  
300  
1.00  
-
V
ns  
µA  
mV  
-
-
-
CS = 0 V  
MULT = 0 V  
VOFFSET  
OUT H Voltage  
OUT L Voltage  
VPOUTH  
VPOUTL  
9.0  
-
10.2  
-
11.4  
0.8  
V
V
OUT = -20 mA  
OUT = +20 mA  
OUT load capacitor = 1000 pF  
OUTL Voltage to 5 V  
OUT load capacitor = 1000 pF  
OUTH Voltage to 5 V  
Rise Time  
tr  
-
50  
-
ns  
Fall Time  
tf  
-
50  
-
ns  
OUT Pull down Resistance  
RPDOUT  
50  
100  
150  
kΩ  
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© 2021 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0F1F0A200740-1-2  
15.Jul.2022 Rev.001  
13/24  
BD7695FJ BD7696FJ  
Typical Performance Curves  
(Reference data)  
1.2  
VEO = 4.5 V  
VEO = 1.5 V  
1.0  
0.8  
0.6  
0.4  
0.2  
VEO = 4 V  
VEO = 2.5 V  
VEO = 2 V  
VEO = 3 V  
VEO = 1.1 V  
VEO = 0.8 V  
0.0  
0
1
2
3
4
VMULT[V]  
Figure 14. VCS vs VMULT  
0.05  
0.04  
0.03  
0.02  
0.01  
0.00  
0
1
2
3
4
VMULT[V]  
Figure 15. VCS vs VMULT at Quarter Gain Operation  
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Typical Performance Curves – continued  
2.535  
2.530  
2.525  
2.520  
2.515  
2.510  
2.505  
2.500  
2.495  
2.490  
2.485  
2.480  
2.475  
2.470  
2.465  
2.535  
2.530  
2.525  
2.520  
2.515  
2.510  
2.505  
2.500  
2.495  
2.490  
2.485  
2.480  
2.475  
2.470  
2.465  
10  
15  
20  
25  
30  
35  
40  
-40  
-10  
20  
50  
80  
110  
VCC Supply Voltage: VCC[V]  
Temperature: Ta[˚C]  
Figure 16. Gm Amplifier Reference Voltage1 vs Temperature  
Figure 17. Gm Amplifier Reference Voltage1 vs VCC  
30.0  
29.0  
28.0  
27.0  
26.0  
25.0  
24.0  
23.0  
22.0  
21.0  
20.0  
200  
180  
160  
140  
120  
100  
80  
60  
40  
20  
0
-40  
-10  
20  
50  
80  
110  
-40  
-10  
20  
50  
80  
110  
Temperature: Ta[˚C]  
Temperature: Ta[˚C]  
Figure 18. Overvoltage Protection Detection  
Current 1 vs Temperature  
Figure 19. Start Up Current vs Temperature  
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BD7695FJ BD7696FJ  
Typical Performance Curves – continued  
14  
14  
12  
10  
8
13  
VUVLO1  
12  
11  
VUVLO2  
10  
6
9
8
7
4
2
0
-40  
-10  
20  
50  
80  
110  
10  
16  
22  
28  
34  
40  
Temperature: Ta[˚C]  
VCC Supply Voltage: VCC[V]  
Figure 20. VCC UVLO Voltage vs Temperature  
Figure 21. OUT H Voltage vs VCC  
1.000  
0.975  
0.950  
0.925  
VQGAIN2  
0.900  
0.875  
VQGAIN1  
0.850  
0.825  
0.800  
-40  
-10  
20  
50  
80  
110  
Temperature: Ta[˚C]  
Figure 22. Quarter Gain Detect Voltage vs Temperature  
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15.Jul.2022 Rev.001  
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BD7695FJ BD7696FJ  
Application Example  
F1  
D3  
L
DB1  
R1  
R2  
R3  
LF1  
VOUT +  
D4  
T1  
C3  
C4  
ZNR1  
R16  
C16  
N
R7  
C1  
C2  
D2  
R4  
R17  
D1  
R9  
C5  
M1  
R15  
C15  
R10  
R11  
R12  
C14  
R18  
R5  
VCC OUT GND ZCD  
BD7695FJ/BD7696FJ  
IC1  
C6  
C17  
VS  
EO  
CS  
MULT  
R13  
C12  
C11  
R8  
R19  
R20  
R6 C7  
C8  
C9  
C13  
R14  
GND  
Figure 23. Application Example  
1
Output Voltage Setting  
The output voltage is decided on feedback resistance by the VS pin.  
(푅 ꢂ푅  
푂푈푇 = ꢀ1 + (푅 //푅 ))ꢅ × 푉  
= ꢀ1 + ꢆ5ꢇꢈ 푘훺ꢅ × ꢊ.ꢋ 푉 = 39ꢌ [V]  
ꢁ7  
ꢁ8  
퐴푀푃  
ꢆꢉ 푘훺  
ꢁꢃ  
2ꢄ  
ꢆꢎ + ꢍꢆꢇ:  
ꢆꢏ//ꢍꢈꢉ:  
Upper side resister of the output feedback  
Bottom side resister of the output feedback  
Gm amplifier reference voltage1  
:
퐴푀푃  
2
3
Calculation of the Inductance  
Reference value in case of VOUT = 400 V, Output power = 200 W  
ꢐ = ꢊꢋ0 [μH]  
Setting a large value of inductance will reduce the THD but increase the component size.  
External Parts of VCC  
The VCC pin can reduce the VCC voltage change at the time of the switching by attaching a capacitor.  
The VCC capacitor recommends electric field capacitor of 22 µF or more withstand pressure of 50 V or more.  
In addition, you must confirm the VCC voltage evaluation at the time of startup and the protection detection with an actual  
board when VCC is generated by startup resistance and the auxiliary winding of the transformer.  
Because the consumption current of the IC decreases when an IC becomes the switching stop state after startup, the VCC  
voltage may rise by startup resistance. The overvoltage destruction of VCC is prevented by VCC voltage discharge function.  
The startup resistor value is made small by this function, so boot-time becomes fast.  
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BD7695FJ BD7696FJ  
Attention in the Board Design  
About parts placement  
You must locate the parts in the Figure 24 inside dot line near the IC. In addition, it is necessary to parts placement to avoid  
the interference with switching lines and high current lines such as inductor, DRAIN.  
F1  
D3  
L
DB1  
R1  
R2  
R3  
LF1  
VOUT +  
D4  
T1  
C3  
C4  
ZNR1  
R16  
C16  
N
R7  
C1  
C2  
D2  
R4  
R17  
D1  
R9  
C5  
M1  
R15  
C15  
R10  
R11  
R12  
C14  
R18  
R5  
VCC OUT GND ZCD  
BD7695FJ/BD7696FJ  
IC1  
C6  
C17  
VS  
EO  
CS  
MULT  
R13  
C12  
C11  
R8  
R19  
R20  
R6 C7  
C8  
C9  
C13  
R14  
GND  
Figure 24. Parts Placement  
About GND wiring guidance  
The red line in Figure 25 is the GND lines which large current flows. Draw each line as an independent wire. In addition, pull  
the wiring thick and short. The blue line is the GND of the IC. Make the GND of the IC and the GND of the peripheral parts  
common.  
F1  
D3  
L
DB1  
R1  
R2  
R3  
LF1  
VOUT +  
D4  
T1  
C3  
C4  
ZNR1  
R16  
C16  
N
R7  
C1  
C2  
D2  
R4  
R17  
D1  
R9  
C5  
M1  
R15  
C15  
R10  
R11  
R12  
C14  
R18  
R5  
VCC OUT GND ZCD  
BD7695FJ/BD7696FJ  
IC1  
C6  
C17  
VS  
EO  
CS  
MULT  
R13  
C12  
C11  
R8  
R19  
R20  
R6 C7  
C8  
C9  
C13  
R14  
C12  
GND  
Figure 25. GND Line Layout  
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Attention in the Board Design – continued  
About a large current line  
Large circuit current flows through the part of the red line in Figure 26. You must wire it short and thickly. Do not place the IC  
and high impedance line near the red line because it has large noise.  
F1  
D3  
L
DB1  
R1  
R2  
R3  
LF1  
VOUT +  
D4  
T1  
C3  
C4  
ZNR1  
R16  
C16  
N
R7  
C1  
C2  
D2  
R4  
R17  
D1  
R9  
C5  
M1  
R15  
C15  
R10  
R11  
R12  
C14  
R18  
R5  
VCC OUT GND ZCD  
BD7695FJ/BD7696FJ  
IC1  
C6  
C17  
VS  
EO  
CS  
MULT  
R13  
C12  
C11  
R8  
R19  
R20  
R6 C7  
C8  
C9  
C13  
R14  
GND  
Figure 26. High Current Line Layout  
I/O Equivalence Circuits  
1
VS  
2
EO  
3
MULT  
4
CS  
Internal Reg  
Internal Reg  
Internal Reg  
5
ZCD  
6
GND  
7
OUT  
8
VCC  
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TSZ22111 • 15 • 001  
TSZ02201-0F1F0A200740-1-2  
15.Jul.2022 Rev.001  
19/24  
BD7695FJ BD7696FJ  
Operational Notes  
1. Reverse Connection of Power Supply  
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when  
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply  
pins.  
2. Power Supply Lines  
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at  
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic  
capacitors.  
3. Ground Voltage  
Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a  
voltage below that of the ground pin at any time, even during transient condition.  
4. Ground Wiring Pattern  
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but  
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal  
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations  
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.  
5. Recommended Operating Conditions  
The function and operation of the IC are guaranteed within the range specified by the recommended operating  
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical  
characteristics.  
6. Inrush Current  
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow  
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.  
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing  
of connections.  
7. Testing on Application Boards  
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject  
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should  
always be turned off completely before connecting or removing it from the test setup during the inspection process. To  
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and  
storage.  
8. Inter-pin Short and Mounting Errors  
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in  
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.  
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and  
unintentional solder bridge deposited in between pins during assembly to name a few.  
9. Unused Input Pins  
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and  
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge  
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause  
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power  
supply or ground line.  
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TSZ22111 • 15 • 001  
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BD7695FJ BD7696FJ  
Operational Notes – continued  
10. Regarding the Input Pin of the IC  
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them  
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a  
parasitic diode or transistor. For example (refer to figure below):  
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.  
When GND > Pin B, the P-N junction operates as a parasitic transistor.  
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual  
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to  
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be  
avoided.  
Resistor  
Transistor (NPN)  
Pin A  
Pin B  
Pin B  
B
E
C
Pin A  
B
C
E
P
P+  
P+  
N
P+  
P
P+  
N
N
N
N
N
N
N
Parasitic  
Elements  
Parasitic  
Elements  
P Substrate  
GND GND  
P Substrate  
GND  
GND  
Parasitic  
Elements  
Parasitic  
Elements  
N Region  
close-by  
Figure 27. Example of Monolithic IC Structure  
11. Ceramic Capacitor  
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with  
temperature and the decrease in nominal capacitance due to DC bias and others.  
12. Thermal Shutdown Circuit (TSD)  
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always  
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the  
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj  
falls below the TSD threshold, the circuits are automatically restored to normal operation.  
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no  
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat  
damage.  
13. Over Current Protection Circuit (OCP)  
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This  
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should  
not be used in applications characterized by continuous operation or transitioning of the protection circuit.  
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15.Jul.2022 Rev.001  
21/24  
BD7695FJ BD7696FJ  
Ordering Information  
B D 7  
6
9
x
F
J
-
E 2  
x: Brown out Package  
Packaging and forming specification  
E2: Embossed tape and reel  
5: None-  
6: With  
FJ: SOP-J8  
Marking Diagram  
SOP-J8 (TOP VIEW)  
Part Number Marking  
LOT Number  
Pin 1 Mark  
Part Number Marking  
D7695  
Product name  
BD7695FJ-E2  
BD7696FJ-E2  
D7696  
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TSZ02201-0F1F0A200740-1-2  
15.Jul.2022 Rev.001  
22/24  
BD7695FJ BD7696FJ  
Physical Dimension and Packing Information  
Package Name  
SOP-J8  
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BD7695FJ BD7696FJ  
Revision History  
Date  
Revision  
001  
Changes  
15.Jul.2022  
New Release  
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Notice  
Precaution on using ROHM Products  
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,  
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you  
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport  
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car  
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or  
serious damage to property (Specific Applications), please consult with the ROHM sales representative in advance.  
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any  
damages, expenses or losses incurred by you or third parties arising from the use of any ROHMs Products for Specific  
Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASS  
CLASSⅣ  
CLASSb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are designed and manufactured for use under standard conditions and not under any special or  
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any  
special or extraordinary environments or conditions. If you intend to use our Products under any special or  
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of  
product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.  
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble  
cleaning agents for cleaning residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in  
the range that does not exceed the maximum junction temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must  
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,  
please consult with the ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice-PGA-E  
Rev.004  
© 2015 ROHM Co., Ltd. All rights reserved.  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
A two-dimensional barcode printed on ROHM Products label is for ROHMs internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign  
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