BD77501G [ROHM]
High Speed Ground Sense Excellent EMI Characteristics CMOS Operational Amplifier;型号: | BD77501G |
厂家: | ROHM |
描述: | High Speed Ground Sense Excellent EMI Characteristics CMOS Operational Amplifier |
文件: | 总29页 (文件大小:1896K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
EMARMOURTM
Nano CapTM
Datasheet
Operational Amplifier
High Speed Ground Sense
Excellent EMI Characteristics
CMOS Operational Amplifier
BD77501G BD77502FVM BD77504FV
General Description
Key Specifications
BD77501G, BD77502FVM and BD77504FV are
single/dual/quad Ground Sense CMOS operational
amplifier. An operating voltage range is wide with 7 V to
15 V. This operational amplifier is the most suitable for
various applications especially sensor amplifier and so on
because it has features of high slew rate and low input
bias current.
Also, BD77501G, BD77502FVM and BD77504FV have
the advantage of EMI tolerance. It makes easier replacing
with conventional products or simpler designing EMI.
Furthermore, this circuit type does not oscillate even with
a capacitance of several nF. Set design is possible
without worrying about oscillation due to output
capacitance.
◼ Input Offset Voltage:
4 mV (Typ)
◼ Common-mode Input Voltage Range:
VSS to VDD-2.0 V
◼ Slew Rate:
◼ Operating Supply Voltage Range
Single Supply:
10 V/µs (Typ)
7 V to 15 V
±3.5 V to ±7.5 V
-40 °C to +85 °C
Dual Supply:
◼ Operating Temperature Range:
Package
SSOP5
W (Typ) x D (Typ) x H (Max)
2.9 mm x 2.8 mm x 1.25 mm
2.9 mm x 4.0 mm x 0.9 mm
5.0 mm x 6.4 mm x 1.35 mm
MSOP8
SSOP-B14
Features
◼ EMARMOURTM Series
◼ Nano CapTM integrated OPAMP
◼ Operating with a Single Power Supply
◼ Input and output are operable GND sense
◼ High Slew Rate
◼ Wide Operating Supply Voltage Range
◼ High Open Loop Voltage Gain
SSOP5
MSOP8
Applications
◼ Sensor Amplifier
◼ Buffer Application Amplifier
◼ Current Monitoring Amplifier
◼ Consumer Electronics
Typical Application Circuit
CF = 10 pF
SSOP-B14
RF = 10 kΩ
VDD = +6.0 V
푅퐹
푉푂푈푇 = −
푉
퐼푁
RIN = 100 Ω
푅퐼푁
VIN
OUT
VSS = -6.0 V
EMARMOURTM and Nano CapTM are a trademark or a registered trademark of ROHM Co., Ltd.
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
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BD77501G BD77502FVM BD77504FV
Pin Configuration
BD77501G
1
5
4
VDD
OUT
+IN
+
-
2
3
VSS
-IN
(TOP VIEW)
BD77502FVM
OUT1
-IN1
1
2
3
4
8
7
6
5
VDD
CH1
OUT2
-IN2
+
-
+IN1
CH2
-
+
+IN2
VSS
(TOP VIEW)
BD77504FV
OUT1
-IN1
OUT4
1
14
13
CH1
CH4
-IN4
+IN4
VSS
2
+
+
+IN1
VDD
+IN2
-IN2
3
4
5
12
11
10 +IN3
-
-
+
+
9
8
-IN3
6
7
CH2
CH3
OUT2
OUT3
(TOP VIEW)
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BD77501G BD77502FVM BD77504FV
Pin Description
BD77501G
Pin No.
Pin Name
+IN
Function
1
2
3
4
5
Non-inverting input
VSS
Negative power supply / Ground
Inverting input
-IN
OUT
VDD
Output
Positive power supply
BD77502FVM
Pin No.
Pin Name
OUT1
-IN1
Function
1
2
3
4
5
6
7
8
Output (1ch)
Inverting input (1ch)
Non-inverting input (1ch)
Negative power supply / Ground
Non-inverting input (2ch)
Inverting input (2ch)
Output (2ch)
+IN1
VSS
+IN2
-IN2
OUT2
VDD
Positive power supply
BD77504FV
Pin No.
Pin Name
OUT1
-IN1
Function
1
2
Output (1ch)
Inverting input (1ch)
Non-inverting input (1ch)
Positive power supply
Non-inverting input (2ch)
Inverting input (2ch)
Output (2ch)
3
+IN1
VDD
4
5
+IN2
-IN2
6
7
OUT2
OUT3
-IN3
8
Output (3ch)
9
Inverting input (3ch)
Non-inverting input (3ch)
Negative power supply / Ground
Non-inverting input (4ch)
Inverting input (4ch)
Output (4ch)
10
11
12
13
14
+IN3
VSS
+IN4
-IN4
OUT4
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BD77501G BD77502FVM BD77504FV
Block Diagram
BD77501G
+IN
VSS
-IN
1
2
5
4
VDD
OUT
Iref
+
OPAMP
-
3
BD77502FVM
OUT1
-IN1
1
8
7
VDD
Iref
2
OUT2
-IN2
OPAMP
(CH1)
-
+
OPAMP
(CH2)
+IN1
VSS
3
4
6
5
+
-
+IN2
BD77504FV
OUT1
-IN1
1
2
14
13
OUT4
-IN4
Iref
OPAMP
(CH4)
OPAMP
(CH1)
+
-
-
+
+IN1
3
4
5
12 +IN4
11
VDD
+IN2
VSS
10 +IN3
+
-
-
+
OPAMP
(CH2)
-IN2
-IN3
9
OPAMP
(CH3)
6
7
OUT2
8
OUT3
Description of Blocks
1. OPAMP:
This block is a full-swing output operational amplifier with class-AB output circuit and ground-sense differential input
stage.
2. Iref:
This block supplies reference current which is needed to operate OPAMP block.
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BD77501G BD77502FVM BD77504FV
Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
Supply Voltage
VDD-VSS
VID
15.5
VDD-VSS
V
V
V
Differential Input Voltage(Note 1)
Common-mode Input Voltage Range
VICMR
(VSS - 0.3) to (VDD + 0.3)
Input Current
II
±10
150
mA
°C
Maximum Junction Temperature
Storage Temperature Range
Tjmax
Tstg
-55 to +150
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operate over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) The differential input voltage indicates the voltage difference between inverting input and non-inverting input.
The input pin voltage is set to VSS or more.
Thermal Resistance(Note 2)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 4)
2s2p(Note 5)
SSOP5
Junction to Ambient
Junction to Top Characterization Parameter(Note 3)
θJA
376.5
40
185.4
30
°C/W
°C/W
ΨJT
MSOP8
Junction to Ambient
Junction to Top Characterization Parameter(Note 3)
θJA
284.1
21
135.4
11
°C/W
°C/W
ΨJT
SSOP-B14
Junction to Ambient
Junction to Top Characterization Parameter(Note 3)
θJA
159.6
13
92.8
9
°C/W
°C/W
ΨJT
(Note 2) Based on JESD51-2A (Still-Air).
(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
(Note 4) Using a PCB board based on JESD51-3.
(Note 5) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70 μm
Footprints and Traces
Layer Number of
Measurement Board
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
4 Layers
Top
Copper Pattern
Bottom
Copper Pattern
Thickness
70 μm
Copper Pattern
Thickness
35 μm
Thickness
70 μm
Footprints and Traces
74.2 mm x 74.2 mm
74.2 mm x 74.2 mm
Recommended Operating Conditions
Parameter
Symbol
VDD
Min
Typ
Max
Unit
V
7.0
±3.5
12.0
±6.0
15.0
±7.5
Operating Supply Voltage
Operating Temperature
Output Load Capacitance(Note 6)
Topr
CL
-40
-
+25
+85
-
°C
nF
0.01
(Note 6) This parameter obtained VDD = 12 V. Not 100 % tested.
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BD77501G BD77502FVM BD77504FV
Function Explanation
1. EMARMOURTM
EMARMOURTM is the brand name given to ROHM products developed by leveraging proprietary technologies covering
layout, process, and circuit design to achieve ultra-high noise immunity that limits output voltage fluctuation to ±300 mV
or less across the entire noise frequency band during noise evaluation testing under the international ISO11452-2
standard. This unprecedented noise immunity reduces design load while improving reliability by solving issues related
to noise in the development of vehicle electrical systems.
2. Nano CapTM
Nano CapTM is a combination of technologies which allow stable operation even if output capacitance is connected with
the range of nF unit. This circuit type does not oscillate even with a capacitance of several nF. Set design is possible
without worrying about oscillation due to output capacitance.
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Electrical Characteristics (Unless otherwise specified VDD = 12 V, VSS = 0 V, Ta = 25 °C)
○BD77501G
Limit
Temperature
Parameter
Symbol
Unit
Conditions
Range
Min
-
Typ
Max
Input Offset Voltage
Input Offset Current
Input Bias Current
VIO
IIO
IB
25 °C
25 °C
4
27
mV
nA
nA
Absolute value
-
0.001
-
Absolute value
Absolute value
25 °C
-
0.001
-
25 °C
-
1.3
3.0
Supply Current
IDD
VOH
VOL
mA
V
RL = ∞, G = 0 dB
-40 °C to +85 °C
25 °C
-
-
0.06
-
4.5
-
0.25
RL = 10 kΩ,
VOH = VDD-VOUT
Output Voltage High
Output Voltage Low
Large Signal Voltage Gain
-40 °C to +85 °C
25 °C
-
0.3
-
0.07
-
0.25
V
RL = 10 kΩ
-40 °C to +85 °C
25 °C
-
0.3
60
55
0
75
-
-
AV
dB
V
-
-
-
-40 °C to +85 °C
25 °C
-
Common-mode Input Voltage
Range(Note 1)
VICMR
CMRR
-
VDD-2.0
25 °C
50
45
50
40
2
70
-
-
-
-
-
-
-
-
-
-
-
Common-mode Rejection
Ratio
dB
-40 °C to +85 °C
25 °C
70
-
Power Supply Rejection
Ratio
PSRR
IOH
dB
mA
mA
-
-40 °C to +85 °C
25 °C
7.5
-
VOUT = VDD-0.4 V
Absolute value
Output Source Current(Note 2)
Output Sink Current(Note 2)
-40 °C to +85 °C
25 °C
1
3.5
1
6.0
-
VOUT = VSS+0.4 V
Absolute value
IOL
-40 °C to +85 °C
25 °C
Slew Rate
SR
-
10
8
V/μs
MHz
CL = 10 pF
G = 40 dB
Gain Bandwidth Product
GBW
25 °C
-
VOUT = 4 VP-P
LPF = 80 kHz,
f = 1 kHz
,
Total Harmonic Distortion +
Noise
THD+N
25 °C
-
0.05
-
%
(Note 1) Not 100% tested.
(Note 2) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. When the output pin is short-
circuited continuously, the output current may decrease due to the temperature rise by the heat generation of inside the IC.
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BD77501G BD77502FVM BD77504FV
Electrical Characteristics (Unless otherwise specified VDD = 12 V, VSS = 0 V, Ta = 25 °C) - continued
○BD77502FVM
Limit
Temperature
Parameter
Symbol
Unit
Conditions
Range
Min
-
Typ
Max
Input Offset Voltage
Input Offset Current
Input Bias Current
VIO
IIO
IB
25 °C
25 °C
4
27
mV
nA
nA
Absolute value
-
0.001
-
Absolute value
Absolute value
25 °C
-
0.001
-
25 °C
-
2.6
6.0
Supply Current
IDD
VOH
VOL
mA
V
RL = ∞, G = 0 dB
-40 °C to +85 °C
25 °C
-
-
0.06
-
9.0
-
0.25
RL = 10 kΩ,
VOH = VDD-VOUT
Output Voltage High
Output Voltage Low
Large Signal Voltage Gain
-40 °C to +85 °C
25 °C
-
0.3
-
0.07
-
0.25
V
RL = 10 kΩ
-40 °C to +85 °C
25 °C
-
0.3
60
55
0
75
-
-
AV
dB
V
-
-
-
-40 °C to +85 °C
25 °C
-
Common-mode Input Voltage
Range(Note 1)
VICMR
CMRR
-
VDD-2.0
25 °C
50
45
50
40
2
70
-
-
-
-
-
-
-
-
-
-
-
Common-mode Rejection
Ratio
dB
-40 °C to +85 °C
25 °C
70
-
Power Supply Rejection
Ratio
PSRR
IOH
dB
mA
mA
-
-40 °C to +85 °C
25 °C
7.5
-
VOUT = VDD-0.4 V
Absolute value
Output Source Current(Note 2)
Output Sink Current(Note 2)
-40 °C to +85 °C
25 °C
1
3.5
1
6.0
-
VOUT = VSS+0.4 V
Absolute value
IOL
-40 °C to +85 °C
25 °C
Slew Rate
SR
-
10
8
V/μs
MHz
CL = 10 pF
G = 40 dB
Gain Bandwidth Product
GBW
25 °C
-
VOUT = 4 VP-P
LPF = 80 kHz,
f = 1 kHz
f = 1 kHz, input
referred
,
Total Harmonic Distortion +
Noise
THD+N
CS
25 °C
25 °C
-
-
0.05
120
-
-
%
Channel Separation
dB
(Note 1) Not 100% tested.
(Note 2) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. When the output pin is short-
circuited continuously, the output current may decrease due to the temperature rise by the heat generation of inside the IC.
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BD77501G BD77502FVM BD77504FV
Electrical Characteristics (Unless otherwise specified VDD = 12 V, VSS = 0 V, Ta = 25 °C) - continued
○BD77504FV
Limit
Temperature
Parameter
Symbol
Unit
Conditions
Range
Min
-
Typ
Max
Input Offset Voltage
Input Offset Current
Input Bias Current
VIO
IIO
IB
25 °C
25 °C
4
27
mV
nA
nA
Absolute value
-
0.001
-
Absolute value
Absolute value
25 °C
-
0.001
-
25 °C
-
5.2
12.0
Supply Current
IDD
VOH
VOL
mA
V
RL = ∞, G = 0 dB
-40 °C to +85 °C
25 °C
-
-
0.06
-
18.0
-
0.25
RL = 10 kΩ,
VOH = VDD-VOUT
Output Voltage High
Output Voltage Low
Large Signal Voltage Gain
-40 °C to +85 °C
25 °C
-
0.3
-
0.07
-
0.25
V
RL = 10 kΩ
-40 °C to +85 °C
25 °C
-
0.3
60
55
0
75
-
-
AV
dB
V
-
-
-
-40 °C to +85 °C
25 °C
-
Common-mode Input Voltage
Range(Note 1)
VICMR
CMRR
-
VDD-2.0
25 °C
50
45
50
40
2
70
-
-
-
-
-
-
-
-
-
-
-
Common-mode Rejection
Ratio
dB
-40 °C to +85 °C
25 °C
70
-
Power Supply Rejection
Ratio
PSRR
IOH
dB
mA
mA
-
-40 °C to +85 °C
25 °C
7.5
-
VOUT = VDD-0.4 V
Absolute value
Output Source Current(Note 2)
Output Sink Current(Note 2)
-40 °C to +85 °C
25 °C
1
3.5
1
6.0
-
VOUT = VSS+0.4 V
Absolute value
IOL
-40 °C to +85 °C
25 °C
Slew Rate
SR
-
10
8
V/μs
MHz
CL = 10 pF
G = 40 dB
Gain Bandwidth Product
GBW
25 °C
-
VOUT = 4 VP-P
LPF = 80 kHz,
f = 1 kHz
f = 1 kHz, input
referred
,
Total Harmonic Distortion +
Noise
THD+N
CS
25 °C
25 °C
-
-
0.05
120
-
-
%
Channel Separation
dB
(Note 1) Not 100% tested.
(Note 2) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. When the output pin is short-
circuited continuously, the output current may decrease due to the temperature rise by the heat generation of inside the IC.
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BD77501G BD77502FVM BD77504FV
Typical Performance Curves
VSS = 0 V
10.0
10.0
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
Ta = -40 °C
Ta = +25 °C
Ta = +85 °C
BD77501G
BD77501G
VDD = 7.0 V
DD
V = 12 V
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
BD77502FVM
BD77504FV
BD77502FVM
BD77504FV
V
= 15 V
DD
7
8
9
10
11
12
13
14
15
-50
-25
0
25
50
75
100
Ambient Temperature: Ta [°C]
Supply Voltage: VDD [V]
Figure 1. Supply Current vs Supply Voltage
Figure 2. Supply Current vs Ambient Temperature
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0.00
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0.00
Ta = +85 °C
VDD = 15.0 V
Ta = +25 °C
Ta = -40 °C
VDD = 12.0 V
VDD = 7.0 V
-50
-25
0
25
50
75
100
7
8
9
10
11
12
13
14
15
Ambient Temperature: Ta [°C]
Supply Voltage: VDD [V]
Figure 3. Output Voltage High vs Supply Voltage
(RL = 10 kΩ, VOH = VDD-VOUT
Figure 4. Output Voltage High vs Ambient Temperature
(RL = 10 kΩ, VOH = VDD-VOUT
)
)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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BD77501G BD77502FVM BD77504FV
Typical Performance Curves - continued
VSS = 0 V
0.12
0.11
0.10
0.12
0.11
0.10
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0.00
0.09
VDD = 15.0 V
Ta = +85 °C
0.08
0.07
Ta = +25 °C
0.06
VDD = 12.0 V
VDD = 7.0 V
0.05
Ta = -40 °C
0.04
0.03
0.02
0.01
0.00
-50
-25
0
25
50
75
100
6
8
10
12
14
16
Ambient Temperature: Ta [°C]
Supply Voltage: VDD [V]
Figure 5. Output Voltage Low vs Supply Voltage
(RL = 10 kΩ)
Figure 6. Output Voltage Low vs Ambient Temperature
(RL = 10 kΩ)
100
90
80
70
60
50
40
30
20
10
0
30
25
20
15
10
5
Ta = -40 °C
Ta = -40 °C
Ta = +25 °C
Ta = +25 °C
Ta = +85 °C
Ta = +85 °C
0
0
2
4
6
8
10
12
14
0
2
4
6
8
10
12
14
Output Voltage: VOUT [V]
Output Voltage: VOUT [V]
Figure 7. Output Source Current vs Output Voltage
(VDD = 12 V)
Figure 8. Output Sink Current vs Output Voltage
(VDD = 12 V)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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BD77501G BD77502FVM BD77504FV
Typical Performance Curves - continued
VSS = 0 V
10
8
10
8
6
6
4
4
2
2
0
0
Ta = -40 °C
VDD = 7.0 V
VDD = 12.0 V
Ta = +25 °C
-2
-4
-6
-8
-10
-2
-4
-6
VDD = 15.0 V
Ta = +85 °C
-8
-10
-50
-25
0
25
50
75
100
6
8
10
12
14
16
Ambient Temperature: Ta [°C]
Supply Voltage: VDD [V]
Figure 9. Input Offset Voltage vs Supply Voltage
Figure 10. Input Offset Voltage vs Ambient Temperature
10
8
140
6
120
100
80
4
2
0
Ta = -40 °C
Ta = +25 °C
Ta = -40 °C
-2
-4
-6
-8
-10
Ta = +25 °C
Ta = +85 °C
60
Ta = +85 °C
40
-1 0
1
2
3
4
5
6
7
8
9 10 11 12 13
6
8
10
12
14
16
Common-mode Input Voltage: VICM [V]
Supply Voltage: VDD [V]
Figure 11. Input Offset Voltage vs Common-mode Input
Figure 12. Large Signal Voltage Gain vs Supply Voltage
(RL = 10 kΩ)
Voltage
(VDD = 12 V)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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Typical Performance Curves - continued
VSS = 0 V
160
140
120
100
80
140
120
100
VDD = 7.0 V
VDD = 12.0 V
80
Ta = +85 °C
Ta = +25 °C
VDD = 15.0 V
60
60
Ta = -40 °C
40
40
6
8
10
12
14
16
-50
-25
0
25
50
75
100
Ambient Temperature: Ta [°C]
Supply Voltage: VDD [V]
Figure 13. Large Signal Voltage Gain vs Ambient
Temperature
Figure 14. Common-mode Rejection Ratio vs Supply Voltage
160
160
140
120
100
80
140
120
100
80
VDD = 15.0 V
VDD = 12.0 V
60
60
VDD = 7.0 V
40
40
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature: Ta [°C]
Ambient Temperature: Ta [°C]
Figure 15. Common-mode Rejection Ratio vs Ambient
Temperature
Figure 16. Power Supply Rejection Ratio vs Ambient
Temperature
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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Typical Performance Curves – continued
VSS = 0 V
20
18
16
14
12
10
8
20
18
16
14
Rise
12
Rise
10
Fall
Fall
8
6
6
4
2
0
4
2
0
-50
-25
0
25
50
75
100
6
8
10
12
14
16
Ambient Temperature: Ta [°C]
Supply Voltage: VDD [V]
Figure 17. Slew Rate vs Supply Voltage
(Ta = 25 °C)
Figure 18. Slew Rate vs Ambient Temperature
(VDD = 12 V)
45
12
10
8
40
35
30
25
20
15
10
5
6
4
2
0
0
10
100
1000
10000 100000 1000000
7
8
9
10
11
12
13
14
15
Load Capacitance: CL [pF]
Supply Voltage: VDD [V]
Figure 19. Gain Bandwidth Product vs Supply Voltage
(Inverting Amplifier, Ta = 25 °C)
Figure 20. Phase Margin vs Load Capacitance
(RF = 10 kΩ, G = 40 dB, Ta = 25 °C, VDD = 12 V)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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Application Information
EMI Immunity
BD7750xxxx series have high tolerance for electromagnetic interference from the outside because they have EMI filter, and
the EMI design is simple. They are most suitable to replace from conventional products. The data of the IC simple substance
on ROHM board are as follows. The test condition is based on ISO11452-2.
<Test Condition> Based on ISO11452-2
Test Circuit: Voltage Follower
VDD: 12 V
VIN+: 6 V
Test Method: Substituted Law
Conventional Product
BD7750xxxx
(Progressive Wave)
Field Intensity: 200 V/m
Test Wave: CW (Continuous Wave)
Frequency: 200 MHz to 1000 MHz (2 % step)
Figure 21. EMI Characteristics
EMI Evaluation Board (BD77501G)
EMI Evaluation Board (BD77502FVM)
Figure 22. EMI Evaluation Board
EMI Evaluation Board (BD77504FV)
VDD
BIAS
Tee
Battery
6 V
Oscillo
Scope
Battery
12 V
-
VSS
+
Antenna
Figure 23. Measurement Circuit of EMI Evaluation
(Note) The above data is obtained using typical IC simple substance on ROHM board. These values are not guaranteed. Design and Evaluate in actual
application before use.
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Application Information - continued
1. Unused Circuits
When there are unused circuits, it is recommended that they are connected
as in the right figure, and set the non-inverting input pin to electric potential
within the input common-mode voltage range (VICM).
VDD
VSS
Connect
to VICM
+
-
2. Input Voltage
Applying VDD+0.3V to the input pin is possible without causing deterioration
of the electrical characteristics or destruction, regardless of the supply
voltage. However, this does not ensure circuit operation. Note that the circuit
operates normally only when the input voltage is within the common-mode
input voltage range of the electric characteristics.
VICM
3. Power Supply (single/dual)
Figure 24. Example of application
unused circuit processing
The Op-Amp operates when the voltage is supplied between the VDD and
VSS pin. Therefore, the single supply Op-Amp can be used as dual supply
Op-Amp as well.
4. Output Capacitor
When the VDD pin is shorted to VSS (GND) electric potential in a state where electric charge is accumulated in the external
capacitor that is connected to the output pin, the accumulated electric charge flow through parasitic elements or pin
protection elements inside the circuit and discharges to the VDD pin. It may cause damage to the elements inside the
circuit (thermal destruction). When using this IC as an application circuit which does not constitute a negative feedback
circuit and does not occur the oscillation by an output capacitive load such as a voltage comparator, connect a capacitor
of 0.1 µF or less to the output pin to prevent IC damage caused by the accumulation of electric charge as mentioned above.
5. Oscillation by Output Capacitor
Pay attention to the oscillation by capacitive load in designing an application which constitutes a negative feedback loop
circuit with this IC.
6. Handling the IC
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations of the electrical
characteristics due to the piezo resistance effects. Pay attention to defecting or bending the board.
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Application Examples
○Voltage Follower
Using this circuit, the output voltage (VOUT) is configured
to be equal to the input voltage (VIN). This circuit also
stabilizes the output voltage (VOUT) due to high input
impedance and low output impedance. Computation for
output voltage (VOUT) is shown below.
VDD
OUT
IN
푉푂푈푇 = 푉
퐼푁
VSS
Figure 25. Voltage Follower Circuit
○Inverting Amplifier
RF
For inverting amplifier, input voltage (VIN) is amplified by
a voltage gain which depends on the ratio of RIN and RF,
and then it outputs phase-inverted voltage. The output
voltage is shown in the next expression.
VDD
RIN
VIN
OUT
푅퐹
푉푂푈푇 = −
푉
퐼푁
푅퐼푁
This circuit has input impedance equal to RIN.
VSS
Figure 26. Inverting Amplifier Circuit
○Non-inverting Amplifier
RIN
RF
For non-inverting amplifier, input voltage (VIN) is amplified
by a voltage gain, which depends on the ratio of RIN and
RF. The output voltage (VOUT) is in-phase with the input
voltage (VIN) and is shown in the next expression.
VDD
VSS
푅퐹
OUT
푉푂푈푇 = (1 +
) 푉
퐼푁
푅퐼푁
VIN
Effectively, this circuit has high input impedance since its
input side is the same as that of the operational amplifier.
Figure 27. Non-inverting Amplifier Circuit
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I/O Equivalence Circuits
○BD77501G
Pin No.
Pin Name
Pin Description
Equivalence Circuit
5
4
OUT
Output
4
2
5
1
3
+IN
-IN
1, 3
Input
2
○BD77502FVM
Pin No.
Pin Name
Pin Description
Equivalence Circuit
8
1
7
OUT1
OUT2
Output
1,7
4
8
2
3
5
6
-IN1
+IN1
+IN2
-IN2
Input
2, 3, 5, 6
4
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I/O Equivalence Circuits - continued
○BD77504FV
Pin No.
Pin Name
Pin Description
Equivalence Circuit
4
1
7
8
OUT1
OUT2
OUT3
OUT4
Output
1,7,8,14
14
11
4
2
3
5
6
9
10
12
13
-IN1
+IN1
+IN2
-IN2
-IN3
+IN3
+IN4
-IN4
2, 3, 5, 6,
9, 10, 12, 13
Input
11
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Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
8.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example, (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 28. Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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Ordering Information
B D 7 7 5 0 x x x x
-
x
x
Product Rank
Number of Channels
1: Single
2: Dual
Package
G: SSOP5
FVM: MSOP8
FV: SSOP-B14
Packaging and forming specification
TR: Embossed tape and reel
E2: Embossed tape and reel
4: Quad
Lineup
Operating
Temperature
Range
Operating Supply
Voltage
Number of
Channels
Orderable Part
Package
Number
Single
Dual
SSOP5
Reel of 3000 BD77501G-TR
Reel of 3000 BD77502FVM-TR
Reel of 2500 BD77504FV-E2
7.0 V to 15.0 V
±3.5 V to ±7.5 V
-40 °C to +85 °C
MSOP8
Quad
SSOP-B14
Marking Diagram
SSOP5 (TOP VIEW)
Part Number Marking
LOT Number
MSOP8 (TOP VIEW)
Part Number Marking
LOT Number
7
7
5
2
0
Pin 1 Mark
SSOP-B14 (TOP VIEW)
Part Number Marking
77504
LOT Number
Pin 1 Mark
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Physical Dimension and Packing Information
Package Name
SSOP5
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Physical Dimension and Packing Information – continued
Package Name
MSOP8
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Physical Dimension and Packing Information – continued
Package Name
SSOP-B14
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Revision History
Date
Revision
001
Changes
11.Nov.2019
06.Jul.2020
30.Oct.2020
New Release
Add Lineup
Add Lineup
002
003
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
相关型号:
BD7757MWX
BD7757MWX是同步整流升压DC/DC型1ch的1.5A FLASH LED驱动器。外接应用不需要整流用二极管,有助于实现高效率以及减少贴装面积。通过一线串行控制不仅可实现FLASH电流、TORCH电流的16级调节,还可调整计时器时间、UVLO阈值等。
ROHM
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