BD77502FVM_技术文档

EMARMOUR^TM

Nano Cap^TM

Datasheet

Operational Amplifier

High Speed Ground Sense

Excellent EMI Characteristics

CMOS Operational Amplifier

BD77501G BD77502FVM BD77504FV

General Description

Key Specifications

BD77501G, BD77502FVM and BD77504FV are

single/dual/quad Ground Sense CMOS operational

amplifier. An operating voltage range is wide with 7 V to

15 V. This operational amplifier is the most suitable for

various applications especially sensor amplifier and so on

because it has features of high slew rate and low input

bias current.

Also, BD77501G, BD77502FVM and BD77504FV have

the advantage of EMI tolerance. It makes easier replacing

with conventional products or simpler designing EMI.

Furthermore, this circuit type does not oscillate even with

a capacitance of several nF. Set design is possible

without worrying about oscillation due to output

capacitance.

◼ Input Offset Voltage:

4 mV (Typ)

◼ Common-mode Input Voltage Range:

V_SSto V_DD-2.0 V

◼ Slew Rate:

◼ Operating Supply Voltage Range

Single Supply:

10 V/µs (Typ)

7 V to 15 V

±3.5 V to ±7.5 V

-40 °C to +85 °C

Dual Supply:

◼ Operating Temperature Range:

Package

SSOP5

W (Typ) x D (Typ) x H (Max)

2.9 mm x 2.8 mm x 1.25 mm

2.9 mm x 4.0 mm x 0.9 mm

5.0 mm x 6.4 mm x 1.35 mm

MSOP8

SSOP-B14

Features

◼ EMARMOUR^TMSeries

◼ Nano Cap^TMintegrated OPAMP

◼ Operating with a Single Power Supply

◼ Input and output are operable GND sense

◼ High Slew Rate

◼ Wide Operating Supply Voltage Range

◼ High Open Loop Voltage Gain

SSOP5

MSOP8

Applications

◼ Sensor Amplifier

◼ Buffer Application Amplifier

◼ Current Monitoring Amplifier

◼ Consumer Electronics

Typical Application Circuit

C_F= 10 pF

SSOP-B14

R_F= 10 kΩ

VDD = +6.0 V

푅_퐹

푉_푂푈푇= −

푉

퐼푁

R_IN= 100 Ω

푅_퐼푁

V_IN

OUT

VSS = -6.0 V

EMARMOUR^TMand Nano Cap^TMare a trademark or a registered trademark of ROHM Co., Ltd.

〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.

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BD77501G BD77502FVM BD77504FV

Pin Configuration

BD77501G

1

5

4

VDD

OUT

+IN

+

-

2

3

VSS

-IN

(TOP VIEW)

BD77502FVM

OUT1

-IN1

1

2

3

4

8

7

6

5

VDD

CH1

OUT2

-IN2

+

-

+IN1

CH2

-

+

+IN2

VSS

(TOP VIEW)

BD77504FV

OUT1

-IN1

OUT4

1

14

13

CH1

CH4

-IN4

+IN4

VSS

2

-

+

-

+IN1

VDD

+IN2

-IN2

3

4

5

12

11

10 +IN3

-

+

9

8

-IN3

6

7

CH2

CH3

OUT2

OUT3

(TOP VIEW)

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Pin Description

BD77501G

Pin No.

Pin Name

+IN

Function

1

2

3

4

5

Non-inverting input

VSS

Negative power supply / Ground

Inverting input

-IN

OUT

VDD

Output

Positive power supply

BD77502FVM

Pin No.

Pin Name

OUT1

-IN1

Function

1

2

3

4

5

6

7

8

Output (1ch)

Inverting input (1ch)

Non-inverting input (1ch)

Negative power supply / Ground

Non-inverting input (2ch)

Inverting input (2ch)

Output (2ch)

+IN1

VSS

+IN2

-IN2

OUT2

VDD

Positive power supply

BD77504FV

Pin No.

Pin Name

OUT1

-IN1

Function

1

2

Output (1ch)

Inverting input (1ch)

Non-inverting input (1ch)

Positive power supply

Non-inverting input (2ch)

Inverting input (2ch)

Output (2ch)

3

+IN1

VDD

4

5

+IN2

-IN2

6

7

OUT2

OUT3

-IN3

8

Output (3ch)

9

Inverting input (3ch)

Non-inverting input (3ch)

Negative power supply / Ground

Non-inverting input (4ch)

Inverting input (4ch)

Output (4ch)

10

11

12

13

14

+IN3

VSS

+IN4

-IN4

OUT4

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Block Diagram

BD77501G

+IN

VSS

-IN

1

2

5

4

VDD

OUT

Iref

+

OPAMP

-

3

BD77502FVM

OUT1

-IN1

1

8

7

VDD

Iref

2

OUT2

-IN2

OPAMP

(CH1)

-

+

OPAMP

(CH2)

+IN1

VSS

3

4

6

5

+

-

+IN2

BD77504FV

OUT1

-IN1

1

2

14

13

OUT4

-IN4

Iref

OPAMP

(CH4)

OPAMP

(CH1)

+

-

+

+IN1

3

4

5

12 +IN4

11

VDD

+IN2

VSS

10 +IN3

+

-

+

OPAMP

(CH2)

-IN2

-IN3

9

OPAMP

(CH3)

6

7

OUT2

8

OUT3

Description of Blocks

1. OPAMP:

This block is a full-swing output operational amplifier with class-AB output circuit and ground-sense differential input

stage.

2. Iref:

This block supplies reference current which is needed to operate OPAMP block.

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Absolute Maximum Ratings (Ta = 25 °C)

Parameter

Symbol

Rating

Unit

Supply Voltage

V_DD-V_SS

V_ID

15.5

V_DD-V_SS

V

Differential Input Voltage^{(Note 1)}

Common-mode Input Voltage Range

V_ICMR

(V_SS- 0.3) to (V_DD+ 0.3)

Input Current

I_I

±10

150

mA

°C

Maximum Junction Temperature

Storage Temperature Range

Tjmax

Tstg

-55 to +150

°C

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operate over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing

board size and copper area so as not to exceed the maximum junction temperature rating.

(Note 1) The differential input voltage indicates the voltage difference between inverting input and non-inverting input.

The input pin voltage is set to V_SSor more.

Thermal Resistance^{(Note 2)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 4)}

2s2p^{(Note 5)}

SSOP5

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 3)}

θ_JA

376.5

40

185.4

30

°C/W

Ψ_JT

MSOP8

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 3)}

θ_JA

284.1

21

135.4

11

°C/W

Ψ_JT

SSOP-B14

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 3)}

θ_JA

159.6

13

92.8

9

°C/W

Ψ_JT

(Note 2) Based on JESD51-2A (Still-Air).

(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface

of the component package.

(Note 4) Using a PCB board based on JESD51-3.

(Note 5) Using a PCB board based on JESD51-7.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3 mm x 76.2 mm x 1.57 mmt

Top

Copper Pattern

Thickness

70 μm

Footprints and Traces

Layer Number of

Measurement Board

Material

FR-4

Board Size

114.3 mm x 76.2 mm x 1.6 mmt

2 Internal Layers

4 Layers

Top

Copper Pattern

Bottom

Copper Pattern

Thickness

70 μm

Copper Pattern

Thickness

35 μm

Thickness

70 μm

Footprints and Traces

74.2 mm x 74.2 mm

Recommended Operating Conditions

Parameter

Symbol

V_DD

Min

Typ

Max

Unit

V

7.0

±3.5

12.0

±6.0

15.0

±7.5

Operating Supply Voltage

Operating Temperature

Output Load Capacitance^{(Note 6)}

Topr

C_L

-40

-

+25

+85

-

°C

nF

0.01

(Note 6) This parameter obtained V_DD= 12 V. Not 100 % tested.

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Function Explanation

1. EMARMOUR^TM

EMARMOUR^TMis the brand name given to ROHM products developed by leveraging proprietary technologies covering

layout, process, and circuit design to achieve ultra-high noise immunity that limits output voltage fluctuation to ±300 mV

or less across the entire noise frequency band during noise evaluation testing under the international ISO11452-2

standard. This unprecedented noise immunity reduces design load while improving reliability by solving issues related

to noise in the development of vehicle electrical systems.

2. Nano Cap^TM

Nano Cap^TMis a combination of technologies which allow stable operation even if output capacitance is connected with

the range of nF unit. This circuit type does not oscillate even with a capacitance of several nF. Set design is possible

without worrying about oscillation due to output capacitance.

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Electrical Characteristics (Unless otherwise specified V_DD= 12 V, V_SS= 0 V, Ta = 25 °C)

○BD77501G

Limit

Temperature

Parameter

Symbol

Unit

Conditions

Range

Min

-

Typ

Max

Input Offset Voltage

Input Offset Current

Input Bias Current

V_IO

I_IO

I_B

25 °C

4

27

mV

nA

Absolute value

-

0.001

-

Absolute value

25 °C

-

0.001

-

25 °C

-

1.3

3.0

Supply Current

I_DD

V_OH

V_OL

mA

V

R_L= ∞, G = 0 dB

-40 °C to +85 °C

25 °C

-

0.06

-

4.5

-

0.25

R_L= 10 kΩ,

V_OH= V_DD-V_OUT

Output Voltage High

Output Voltage Low

Large Signal Voltage Gain

-40 °C to +85 °C

25 °C

-

0.3

-

0.07

-

0.25

V

R_L= 10 kΩ

-40 °C to +85 °C

25 °C

-

0.3

60

55

0

75

-

A_V

dB

V

-

-40 °C to +85 °C

25 °C

-

Common-mode Input Voltage

Range^{(Note 1)}

V_ICMR

CMRR

-

V_DD-2.0

25 °C

50

45

50

40

2

70

-

Common-mode Rejection

Ratio

dB

-40 °C to +85 °C

25 °C

70

-

Power Supply Rejection

Ratio

PSRR

I_OH

dB

mA

-

-40 °C to +85 °C

25 °C

7.5

-

V_OUT= V_DD-0.4 V

Absolute value

Output Source Current^{(Note 2)}

Output Sink Current^{(Note 2)}

-40 °C to +85 °C

25 °C

1

3.5

1

6.0

-

V_OUT= V_SS+0.4 V

Absolute value

I_OL

-40 °C to +85 °C

25 °C

Slew Rate

SR

-

10

8

V/μs

MHz

C_L= 10 pF

G = 40 dB

Gain Bandwidth Product

GBW

25 °C

-

V_OUT= 4 V_P-P

LPF = 80 kHz,

f = 1 kHz

,

Total Harmonic Distortion +

Noise

THD+N

25 °C

-

0.05

-

%

(Note 1) Not 100% tested.

(Note 2) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. When the output pin is short-

circuited continuously, the output current may decrease due to the temperature rise by the heat generation of inside the IC.

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BD77501G BD77502FVM BD77504FV

Electrical Characteristics (Unless otherwise specified V_DD= 12 V, V_SS= 0 V, Ta = 25 °C) - continued

○BD77502FVM

Limit

Temperature

Parameter

Symbol

Unit

Conditions

Range

Min

-

Typ

Max

Input Offset Voltage

Input Offset Current

Input Bias Current

V_IO

I_IO

I_B

25 °C

4

27

mV

nA

Absolute value

-

0.001

-

Absolute value

25 °C

-

0.001

-

25 °C

-

2.6

6.0

Supply Current

I_DD

V_OH

V_OL

mA

V

R_L= ∞, G = 0 dB

-40 °C to +85 °C

25 °C

-

0.06

-

9.0

-

0.25

R_L= 10 kΩ,

V_OH= V_DD-V_OUT

Output Voltage High

Output Voltage Low

Large Signal Voltage Gain

-40 °C to +85 °C

25 °C

-

0.3

-

0.07

-

0.25

V

R_L= 10 kΩ

-40 °C to +85 °C

25 °C

-

0.3

60

55

0

75

-

A_V

dB

V

-

-40 °C to +85 °C

25 °C

-

Common-mode Input Voltage

Range^{(Note 1)}

V_ICMR

CMRR

-

V_DD-2.0

25 °C

50

45

50

40

2

70

-

Common-mode Rejection

Ratio

dB

-40 °C to +85 °C

25 °C

70

-

Power Supply Rejection

Ratio

PSRR

I_OH

dB

mA

-

-40 °C to +85 °C

25 °C

7.5

-

V_OUT= V_DD-0.4 V

Absolute value

Output Source Current^{(Note 2)}

Output Sink Current^{(Note 2)}

-40 °C to +85 °C

25 °C

1

3.5

1

6.0

-

V_OUT= V_SS+0.4 V

Absolute value

I_OL

-40 °C to +85 °C

25 °C

Slew Rate

SR

-

10

8

V/μs

MHz

C_L= 10 pF

G = 40 dB

Gain Bandwidth Product

GBW

25 °C

-

V_OUT= 4 V_P-P

LPF = 80 kHz,

f = 1 kHz

f = 1 kHz, input

referred

,

Total Harmonic Distortion +

Noise

THD+N

CS

25 °C

-

0.05

120

-

%

Channel Separation

dB

(Note 1) Not 100% tested.

(Note 2) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. When the output pin is short-

circuited continuously, the output current may decrease due to the temperature rise by the heat generation of inside the IC.

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BD77501G BD77502FVM BD77504FV

Electrical Characteristics (Unless otherwise specified V_DD= 12 V, V_SS= 0 V, Ta = 25 °C) - continued

○BD77504FV

Limit

Temperature

Parameter

Symbol

Unit

Conditions

Range

Min

-

Typ

Max

Input Offset Voltage

Input Offset Current

Input Bias Current

V_IO

I_IO

I_B

25 °C

4

27

mV

nA

Absolute value

-

0.001

-

Absolute value

25 °C

-

0.001

-

25 °C

-

5.2

12.0

Supply Current

I_DD

V_OH

V_OL

mA

V

R_L= ∞, G = 0 dB

-40 °C to +85 °C

25 °C

-

0.06

-

18.0

-

0.25

R_L= 10 kΩ,

V_OH= V_DD-V_OUT

Output Voltage High

Output Voltage Low

Large Signal Voltage Gain

-40 °C to +85 °C

25 °C

-

0.3

-

0.07

-

0.25

V

R_L= 10 kΩ

-40 °C to +85 °C

25 °C

-

0.3

60

55

0

75

-

A_V

dB

V

-

-40 °C to +85 °C

25 °C

-

Common-mode Input Voltage

Range^{(Note 1)}

V_ICMR

CMRR

-

V_DD-2.0

25 °C

50

45

50

40

2

70

-

Common-mode Rejection

Ratio

dB

-40 °C to +85 °C

25 °C

70

-

Power Supply Rejection

Ratio

PSRR

I_OH

dB

mA

-

-40 °C to +85 °C

25 °C

7.5

-

V_OUT= V_DD-0.4 V

Absolute value

Output Source Current^{(Note 2)}

Output Sink Current^{(Note 2)}

-40 °C to +85 °C

25 °C

1

3.5

1

6.0

-

V_OUT= V_SS+0.4 V

Absolute value

I_OL

-40 °C to +85 °C

25 °C

Slew Rate

SR

-

10

8

V/μs

MHz

C_L= 10 pF

G = 40 dB

Gain Bandwidth Product

GBW

25 °C

-

V_OUT= 4 V_P-P

LPF = 80 kHz,

f = 1 kHz

f = 1 kHz, input

referred

,

Total Harmonic Distortion +

Noise

THD+N

CS

25 °C

-

0.05

120

-

%

Channel Separation

dB

(Note 1) Not 100% tested.

(Note 2) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. When the output pin is short-

circuited continuously, the output current may decrease due to the temperature rise by the heat generation of inside the IC.

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BD77501G BD77502FVM BD77504FV

Typical Performance Curves

V_SS= 0 V

10.0

9.0

8.0

7.0

6.0

5.0

4.0

3.0

2.0

1.0

0.0

Ta = -40 °C

Ta = +25 °C

Ta = +85 °C

BD77501G

V_DD= 7.0 V

V_D_D_D_D= 12 V

V = 12 V

9.0

8.0

7.0

6.0

5.0

4.0

3.0

2.0

1.0

0.0

BD77502FVM

BD77504FV

BD77502FVM

BD77504FV

V

= 15 V

V_D_D_D_D= 7.0 V

7

8

9

10

11

12

13

14

15

-50

-25

0

25

50

75

100

Ambient Temperature: Ta [°C]

Supply Voltage: V_DD[V]

Figure 1. Supply Current vs Supply Voltage

Figure 2. Supply Current vs Ambient Temperature

0.09

0.08

0.07

0.06

0.05

0.04

0.03

0.02

0.01

0.00

0.09

0.08

0.07

0.06

0.05

0.04

0.03

0.02

0.01

0.00

Ta = +85 °C

V_DD= 15.0 V

Ta = +25 °C

Ta = -40 °C

V_DD= 12.0 V

V_DD= 7.0 V

-50

-25

0

25

50

75

100

7

8

9

10

11

12

13

14

15

Ambient Temperature: Ta [°C]

Supply Voltage: V_DD[V]

Figure 3. Output Voltage High vs Supply Voltage

(R_L= 10 kΩ, V_OH= V_DD-V_OUT

Figure 4. Output Voltage High vs Ambient Temperature

(R_L= 10 kΩ, V_OH= V_DD-V_OUT

)

(Note) The above data are measurement value of typical sample; it is not guaranteed.

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Typical Performance Curves - continued

V_SS= 0 V

0.12

0.11

0.10

0.12

0.11

0.10

0.09

0.08

0.07

0.06

0.05

0.04

0.03

0.02

0.01

0.00

0.09

V_DD= 15.0 V

Ta = +85 °C

0.08

0.07

Ta = +25 °C

0.06

V_DD= 12.0 V

V_DD= 7.0 V

0.05

Ta = -40 °C

0.04

0.03

0.02

0.01

0.00

-50

-25

0

25

50

75

100

6

8

10

12

14

16

Ambient Temperature: Ta [°C]

Supply Voltage: V_DD[V]

Figure 5. Output Voltage Low vs Supply Voltage

(R_L= 10 kΩ)

Figure 6. Output Voltage Low vs Ambient Temperature

(R_L= 10 kΩ)

100

90

80

70

60

50

40

30

20

10

0

30

25

20

15

10

5

Ta = -40 °C

Ta = +25 °C

Ta = +85 °C

0

2

4

6

8

10

12

14

0

2

4

6

8

10

12

14

Output Voltage: V_OUT[V]

Figure 7. Output Source Current vs Output Voltage

(V_DD= 12 V)

Figure 8. Output Sink Current vs Output Voltage

(V_DD= 12 V)

(Note) The above data are measurement value of typical sample; it is not guaranteed.

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Typical Performance Curves - continued

V_SS= 0 V

10

8

10

8

6

4

2

0

Ta = -40 °C

V_DD= 7.0 V

V_DD= 12.0 V

Ta = +25 °C

-2

-4

-6

-8

-10

-2

-4

-6

V_DD= 15.0 V

Ta = +85 °C

-8

-10

-50

-25

0

25

50

75

100

6

8

10

12

14

16

Ambient Temperature: Ta [°C]

Supply Voltage: V_DD[V]

Figure 9. Input Offset Voltage vs Supply Voltage

Figure 10. Input Offset Voltage vs Ambient Temperature

10

8

140

6

120

100

80

4

2

0

Ta = -40 °C

Ta = +25 °C

Ta = -40 °C

-2

-4

-6

-8

-10

Ta = +25 °C

Ta = +85 °C

60

Ta = +85 °C

40

-1 0

1

2

3

4

5

6

7

8

9 10 11 12 13

6

8

10

12

14

16

Common-mode Input Voltage: V_ICM[V]

Supply Voltage: V_DD[V]

Figure 11. Input Offset Voltage vs Common-mode Input

Figure 12. Large Signal Voltage Gain vs Supply Voltage

(R_L= 10 kΩ)

Voltage

(V_DD= 12 V)

(Note) The above data are measurement value of typical sample; it is not guaranteed.

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Typical Performance Curves - continued

V_SS= 0 V

160

140

120

100

80

140

120

100

V_DD= 7.0 V

V_DD= 12.0 V

80

Ta = +85 °C

Ta = +25 °C

V_DD= 15.0 V

60

Ta = -40 °C

40

6

8

10

12

14

16

-50

-25

0

25

50

75

100

Ambient Temperature: Ta [°C]

Supply Voltage: V_DD[V]

Figure 13. Large Signal Voltage Gain vs Ambient

Temperature

Figure 14. Common-mode Rejection Ratio vs Supply Voltage

160

140

120

100

80

140

120

100

80

V_DD= 15.0 V

V_DD= 12.0 V

60

V_DD= 7.0 V

40

-50

-25

0

25

50

75

100

-50

-25

0

25

50

75

100

Ambient Temperature: Ta [°C]

Figure 15. Common-mode Rejection Ratio vs Ambient

Temperature

Figure 16. Power Supply Rejection Ratio vs Ambient

Temperature

(Note) The above data are measurement value of typical sample; it is not guaranteed.

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Typical Performance Curves – continued

V_SS= 0 V

20

18

16

14

12

10

8

20

18

16

14

Rise

12

Rise

10

Fall

8

6

4

2

0

4

2

0

-50

-25

0

25

50

75

100

6

8

10

12

14

16

Ambient Temperature: Ta [°C]

Supply Voltage: V_DD[V]

Figure 17. Slew Rate vs Supply Voltage

(Ta = 25 °C)

Figure 18. Slew Rate vs Ambient Temperature

(V_DD= 12 V)

45

12

10

8

40

35

30

25

20

15

10

5

6

4

2

0

10

100

1000

10000 100000 1000000

7

8

9

10

11

12

13

14

15

Load Capacitance: C_L[pF]

Supply Voltage: V_DD[V]

Figure 19. Gain Bandwidth Product vs Supply Voltage

(Inverting Amplifier, Ta = 25 °C)

Figure 20. Phase Margin vs Load Capacitance

(R_F= 10 kΩ, G = 40 dB, Ta = 25 °C, V_DD= 12 V)

(Note) The above data are measurement value of typical sample; it is not guaranteed.

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Application Information

EMI Immunity

BD7750xxxx series have high tolerance for electromagnetic interference from the outside because they have EMI filter, and

the EMI design is simple. They are most suitable to replace from conventional products. The data of the IC simple substance

on ROHM board are as follows. The test condition is based on ISO11452-2.

<Test Condition> Based on ISO11452-2

Test Circuit: Voltage Follower

V_DD: 12 V

V_IN+: 6 V

Test Method: Substituted Law

Conventional Product

BD7750xxxx

(Progressive Wave)

Field Intensity: 200 V/m

Test Wave: CW (Continuous Wave)

Frequency: 200 MHz to 1000 MHz (2 % step)

Figure 21. EMI Characteristics

EMI Evaluation Board (BD77501G)

EMI Evaluation Board (BD77502FVM)

Figure 22. EMI Evaluation Board

EMI Evaluation Board (BD77504FV)

VDD

BIAS

Tee

Battery

6 V

Oscillo

Scope

Battery

12 V

-

VSS

+

Antenna

Figure 23. Measurement Circuit of EMI Evaluation

(Note) The above data is obtained using typical IC simple substance on ROHM board. These values are not guaranteed. Design and Evaluate in actual

application before use.

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Application Information - continued

1. Unused Circuits

When there are unused circuits, it is recommended that they are connected

as in the right figure, and set the non-inverting input pin to electric potential

within the input common-mode voltage range (V_ICM).

VDD

VSS

Connect

to V_ICM

+

-

2. Input Voltage

Applying V_DD+0.3V to the input pin is possible without causing deterioration

of the electrical characteristics or destruction, regardless of the supply

voltage. However, this does not ensure circuit operation. Note that the circuit

operates normally only when the input voltage is within the common-mode

input voltage range of the electric characteristics.

V_ICM

3. Power Supply (single/dual)

Figure 24. Example of application

unused circuit processing

The Op-Amp operates when the voltage is supplied between the VDD and

VSS pin. Therefore, the single supply Op-Amp can be used as dual supply

Op-Amp as well.

4. Output Capacitor

When the VDD pin is shorted to VSS (GND) electric potential in a state where electric charge is accumulated in the external

capacitor that is connected to the output pin, the accumulated electric charge flow through parasitic elements or pin

protection elements inside the circuit and discharges to the VDD pin. It may cause damage to the elements inside the

circuit (thermal destruction). When using this IC as an application circuit which does not constitute a negative feedback

circuit and does not occur the oscillation by an output capacitive load such as a voltage comparator, connect a capacitor

of 0.1 µF or less to the output pin to prevent IC damage caused by the accumulation of electric charge as mentioned above.

5. Oscillation by Output Capacitor

Pay attention to the oscillation by capacitive load in designing an application which constitutes a negative feedback loop

circuit with this IC.

6. Handling the IC

Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations of the electrical

characteristics due to the piezo resistance effects. Pay attention to defecting or bending the board.

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Application Examples

○Voltage Follower

Using this circuit, the output voltage (V_OUT) is configured

to be equal to the input voltage (V_IN). This circuit also

stabilizes the output voltage (V_OUT) due to high input

impedance and low output impedance. Computation for

output voltage (V_OUT) is shown below.

VDD

OUT

IN

푉_푂푈푇= 푉

퐼푁

VSS

Figure 25. Voltage Follower Circuit

○Inverting Amplifier

R_F

For inverting amplifier, input voltage (V_IN) is amplified by

a voltage gain which depends on the ratio of R_INand R_F,

and then it outputs phase-inverted voltage. The output

voltage is shown in the next expression.

VDD

R_IN

V_IN

OUT

푅_퐹

푉_푂푈푇= −

푉

퐼푁

푅_퐼푁

This circuit has input impedance equal to R_IN.

VSS

Figure 26. Inverting Amplifier Circuit

○Non-inverting Amplifier

R_IN

R_F

For non-inverting amplifier, input voltage (V_IN) is amplified

by a voltage gain, which depends on the ratio of R_INand

R_F. The output voltage (V_OUT) is in-phase with the input

voltage (V_IN) and is shown in the next expression.

VDD

VSS

푅_퐹

OUT

푉_푂푈푇= (1 +

) 푉

퐼푁

푅_퐼푁

V_IN

Effectively, this circuit has high input impedance since its

input side is the same as that of the operational amplifier.

Figure 27. Non-inverting Amplifier Circuit

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I/O Equivalence Circuits

○BD77501G

Pin No.

Pin Name

Pin Description

Equivalence Circuit

5

4

OUT

Output

4

2

5

1

3

+IN

-IN

1, 3

Input

2

○BD77502FVM

Pin No.

Pin Name

Pin Description

Equivalence Circuit

8

1

7

OUT1

OUT2

Output

1,7

4

8

2

3

5

6

-IN1

+IN1

+IN2

-IN2

Input

2, 3, 5, 6

4

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I/O Equivalence Circuits - continued

○BD77504FV

Pin No.

Pin Name

Pin Description

Equivalence Circuit

4

1

7

8

OUT1

OUT2

OUT3

OUT4

Output

1,7,8,14

14

11

4

2

3

5

6

9

10

12

13

-IN1

+IN1

+IN2

-IN2

-IN3

+IN3

+IN4

-IN4

2, 3, 5, 6,

9, 10, 12, 13

Input

11

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Operational Notes

1.

2.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3.

4.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

6.

Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing

of connections.

7.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

8.

9.

Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power

supply or ground line.

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Operational Notes – continued

10. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example, (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 28. Example of Monolithic IC Structure

11. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

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Ordering Information

B D 7 7 5 0 x x x x

-

x

Product Rank

Number of Channels

1: Single

2: Dual

Package

G: SSOP5

FVM: MSOP8

FV: SSOP-B14

Packaging and forming specification

TR: Embossed tape and reel

E2: Embossed tape and reel

4: Quad

Lineup

Operating

Temperature

Range

Operating Supply

Voltage

Number of

Channels

Orderable Part

Package

Number

Single

Dual

SSOP5

Reel of 3000 BD77501G-TR

Reel of 3000 BD77502FVM-TR

Reel of 2500 BD77504FV-E2

7.0 V to 15.0 V

±3.5 V to ±7.5 V

-40 °C to +85 °C

MSOP8

Quad

SSOP-B14

Marking Diagram

SSOP5 (TOP VIEW)

Part Number Marking

LOT Number

MSOP8 (TOP VIEW)

Part Number Marking

LOT Number

7

5

2

0

Pin 1 Mark

SSOP-B14 (TOP VIEW)

Part Number Marking

77504

LOT Number

Pin 1 Mark

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Physical Dimension and Packing Information

Package Name

SSOP5

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Physical Dimension and Packing Information – continued

Package Name

MSOP8

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Physical Dimension and Packing Information – continued

Package Name

SSOP-B14

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Revision History

Date

Revision

001

Changes

11.Nov.2019

06.Jul.2020

30.Oct.2020

New Release

Add Lineup

002

003

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.004


型号：	BD77502FVM
厂家：	ROHM
描述：	High Speed Ground Sense Excellent EMI Characteristics CMOS Operational Amplifier
文件：	总29页 (文件大小：1896K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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