BD7LS07G-C [ROHM]
BD7LS07G-C是适用于车载应用的Single Buffer with Open-drain。可保证在1.65V到5.5V的电源电压下工作。具备output tolerant电路，可在断电时防止电流从连接对象流入，保护输出电路。;
| 型号： | BD7LS07G-C |
| 厂家： | 
ROHM |
| 描述： | BD7LS07G-C是适用于车载应用的Single Buffer with Open-drain。可保证在1.65V到5.5V的电源电压下工作。具备output tolerant电路，可在断电时防止电流从连接对象流入，保护输出电路。 |
| 文件： | 总13页 (文件大小：1433K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
General Purpose CMOS Logic IC
Automotive Single Buffer with
Open-drain
BD7LS07G-C
General Description
Key Specifications
The BD7LS07G-C is a Single Buffer with Open-drain
and qualified for automotive applications. This is
designed for 1.65 V to 5.5 V power supply voltage
operation.
When it is power down, the Output Tolerant circuit
protects the output circuit from the back flow current
through the connected system.
◼ Supply Voltage Range:
◼ Low Current Consumption (ICC):
◼ Operating Temperature Range:-40 °C to +125 °C
◼ Max Propagation Delay Time:
◼ Output Drive Capability:
1.65 V to 5.5 V
10 μA (Max)
10.0 ns (@3.0 V)
±24 mA (@3.0 V)
Package
SSOP5
W(Typ) x D (Typ) x H (Max)
2.9 mm x 2.8 mm x 1.25 mm
Features
◼ AEC-Q100 Qualified(Note 1)
➢ 4000 V Human-body Model
➢ 1000 V Charged-device Model
◼ Low Power Consumption
◼ 5.5 V Tolerant Inputs
◼ Output Tolerant Supports Partial Power Down Mode
Operation
◼ Package SSOP5 is Similar to SOT-23-5(JEDEC)
(Note 1) Grade 1
SSOP5
Applications
◼
Automotive
Pin Descriptions
Pin Configuration and Logic Diagram
Truth Table
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays
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Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
Supply Voltage Range
VCC
VIN
-0.5 to +6.5
-0.5 to +6.5
-50
V
Input Voltage Range
V
Input Diode Current (VIN < 0)
Output Diode Current (VO < 0)
Output Current
IIK
mA
mA
mA
mA
°C
IOK
-50
IO
±50
VCC-GND Current
ICC
±50
Maximum Junction Temperature
Tjmax
+150
Storage Temperature Range
Tstg
-55 to +150
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open
circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in
case the IC is operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration
of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into
consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance (Note 1)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 3)
2s2p(Note 4)
SSOP5
Junction to Ambient
Junction to Top Characterization Parameter(Note 2)
θJA
376.5
40
185.4
30
°C/W
°C/W
ΨJT
Layer Number of
Material
Board Size
114.3 mm x 76.2 mm x 1.57 mmt
Measurement Board
Single
FR-4
Top
Copper Pattern
Thickness
70 μm
Footprints and Traces
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
Top
Copper Pattern
Bottom
Thickness
70 μm
Copper Pattern
Thickness
35 μm
Copper Pattern
74.2 mm x 74.2 mm
Thickness
70 μm
Footprints and Traces
(Note 1) Based on JESD51-2A (Still-Air).
74.2 mm x 74.2 mm
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the
outside surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-7.
Recommended Operating Conditions
Parameter
Symbol
Min
1.65
1.5
0
Typ
Max
5.5
5.5
5.5
VCC
Unit
V
Conditions
-
-
-
-
Operating
Supply Voltage
VCC
V
Data Retention Only
Input Voltage
VIN
VO
V
-
Output Voltage
0
V
-
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
-
-
-
20
Input Transition Rise or Fall
Rate
Δt/Δv
ns/V
-
-
-
-
-
10
5
Operating Temperature
Topr
-40
+125
°C
(Note) The recommended operating conditions are the range where operation is guaranteed. If this ranges are exceeded, operation is not guaranteed
even within the absolute maximum ratings. Unused inputs must be tied to either VCC or GND.
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Electrical Characteristics
(Unless otherwise specified VCC = 1.65 V to 5.5 V and Ta = -40 °C to +125 °C)
Conditions
Parameter
Symbol
Min
Typ
Max
Unit
VCC
Input “H” Voltage
Input “L” Voltage
VIH
VIL
VCC × 0.7
-
-
-
-
-
-
-
-
-
-
VCC × 0.3
0.10
0.45
0.40
0.60
0.90
1.00
±2
V
V
1.65 V to 5.5 V -
-
-
-
-
-
-
-
-
1.65 V to 5.5 V -
1.65 V to 5.5 V IOL = 100 μA
1.65 V
2.3 V
IOL = 4 mA
IOL = 8 mA
Output “L” Voltage
VOL
V
3.0 V
IOL = 16 mA
IOL = 24 mA
IOL = 32 mA
VIN = 5.5 V or GND
3.0 V
4.5 V
Input Current
Power Off
Output Pin Current
Off-state
Output Pin Current
Quiescent Supply
Current
Supply Current
Increase
IIN
μA
μA
0 V to 5.5 V
IOFF
-
-
10
±10
10
0 V
VIN or VO = 5.5 V
VIN = VCC
VO = VCC or GND
IOZ
ICC
μA
μA
μA
pF
1.65 V to 5.5 V
1.65 V to 5.5 V -
3.0 V to 5.5 V
3.3 V
-
-
-
-
-
Input:
ΔICC
CI
600
-
VCC - 0.6 V
VIN = VCC or GND
Ta = 25 °C
Input Capacitance
4
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Switching Characteristics
(Unless otherwise specified VCC = 1.65 V to 5.5 V and Ta = -40 °C to +125 °C)
Conditions
FROM
TO
Parameter
Symbol
Min
Typ
Max
Unit
(Input) (Output)
VCC
1.0
0.4
0.4
0.4
-
-
-
-
12.0
10.0
10.0
9.0
1.65 V to 1.95 V
2.3 V to 2.7 V
3.0 V to 3.6 V
4.5 V to 5.5 V
-
-
Propagation
Delay Time
tPLZ
tPZL
A
Y
ns
-
-
f = 10 MHz,
Ta = 25 °C
f = 10 MHz,
Ta = 25 °C
-
-
-
-
-
-
2
4
-
-
pF
pF
3.3 V
5.0 V
Power
Dissipation
Capacitance
CPD
Parameter Measurement Conditions
Measurement Circuit and Timing Chart
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Typical Performance Curves
Figure 1. Propagation Delay Time: tPLZ vs Supply
Figure 2. Propagation Delay Time: tPLZ vs Ambient
Temperature: Ta
Voltage: VCC
(Ta = 25 °C)
(VCC = 3.3 V)
Figure 3. Propagation Delay Time: tPZL vs Supply
Figure 4. Propagation Delay Time: tPZL vs Ambient
Temperature: Ta
Voltage: VCC
(Ta = 25 °C)
(VCC = 3.3 V)
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Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity
when connecting the power supply, such as mounting an external diode between the power supply and the IC’s
power supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to
ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when
using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed
separately but connected to a single ground at the reference point of the application board to avoid fluctuations
in the small-signal ground caused by large currents. Also ensure that the ground traces of external components
do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce
line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the
electrical characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current
may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than
one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of
ground wiring, and routing of connections.
7. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
8. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power
supply should always be turned off completely before connecting or removing it from the test setup during the
inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar
precautions during transport and storage.
9. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may
result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply
and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very
humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The
small charge acquired in this way is enough to produce a significant effect on the conduction through the
transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be
connected to the power supply or ground line.
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Operational Notes – continued
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep
them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements,
creating a parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P
substrate) should be avoided.
Example of Monolithic IC Structure
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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Ordering Information
-
B D 7 L S 0 7 G
C T L
Package
Product Rank
G: SSOP5
C: for Automotive
Packaging and forming specification
TL: Embossed tape and reel
Marking Diagram
SSOP5 (TOP VIEW)
Part Number Marking
LOT Number
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Physical Dimension and Packing Information
Package Name
SSOP5
Packing Information
Packing Form
Quantity
Embossed carrier tape
3000 pcs
TL
Direction of feed
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Revision History
Date
Revision
001
Changes
21.Apr.2020
New Release
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
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will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
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Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
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