BD80C0AHFP-C_技术文档

Datasheet

Single-Output LDO Regulators

35V Voltage Resistance

1A LDO Regulators

BDxxC0A-C series BDxxC0AW-C series

General Description

Packages

W(Typ) x D(Typ) x H(Max)

The BDxxC0A-C series and the BDxxC0AW-C series are

low-saturation regulators. This series feature variable and

fixed voltage output with selectable Shutdown switch

(referred to as SW); Vout-3.3V, 5.0V, 8.0V and 9.0V.Five

conventional PKGs; TO252-3/5, HRP5 and TO263-3(F)/5

are available. This series has a built-in over-current

protection circuit that prevents the destruction of the IC due

to output short circuits and a thermal Shutdown circuit that

protects the IC from thermal damage due to overloading.

TO252-5

TO252-3

HRP5

6.50mm x 9.50mm x 2.50mm

9.395mm x 10.540mm x 2.005mm

10.16mm x 15.10mm x 4.70mm

Features

1) Output current capability: 1A

2) Output voltage: Variable, 3.3V, 5.0V, 8.0V and 9.0V

3) High output voltage accuracy

(Ta=25°C, TO252-3/5, HRP5): ±1%

4) Low saturation with PDMOS output

5) Built-in over-current protection circuit that prevents the

destruction of the IC due to output short circuits

6) Built-in thermal Shutdown circuit for protecting the IC

from thermal damage due to overloading

7) Low ESR Capacitor

TO263-5

8) TO252-3/5, HRP5, TO263-3(F)/5 package

9) AEC-Q100 Qualified ^{(Note 1)}

(Note 1: Grade 1)

Key Specifications

TO263-3(F)

10.16mm x 15.10mm x 4.70mm

・Supply Voltage(Vo ≥ 3.0V):

・Supply Voltage(Vo < 3.0V):

・Output Voltage(BD00C0AW):

・Output Current:

Vo+1.0V to 26.5V

4.0V to 26.5V

1.0V to 15.0V

1A

・Output Voltage Precision

(Ta=25°C): ±1% (TO252-3/5, HRP5)

(-40°C ≤ Ta ≤ +125°C): ±3%

・Operating Temperature Range: -40°C ≤ Ta ≤ +125°C

Applications

Automotive

(body, audio system, navigation system, etc.)

Ordering part number

B

D

x

C

0

A W

x

- C

x

Output voltage

00: Variable

33: 3.3V

50: 5.0V

80: 8.0V

Current

capacity

C0A: 1A

SW

W: With SW

None: Without SW

Package

FP: TO252-3/5

HFP: HRP5

Packaging and forming specification

E2: Embossed tape and reel

(TO252-3/5, TO263-3(F)/5)

TR: Embossed tape and reel

(HRP5)

FP2: TO263-3(F)/5

90: 9.0V

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.

www.rohm.com

TSZ22111・14・001

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

1/43

BDxxC0A-C series BDxxC0AW-C series

Lineup

Articles

Variable

3.3

○

5.0

○

8.0

○

9.0

○

Package

TO252-5

BDxxC0AWFP-CE2

BDxxC0AFP-CE2

BDxxC0AWHFP-CTR

BDxxC0AHFP-CTR

BDxxC0AWFP2-CE2

BDxxC0AFP2-CE2

○

-

Reel of 2000

Reel of 500

TO252-3

HRP5

○

-

HRP5

○

-

TO263-5

TO263-3(F)

Typical Application Circuits

〈Output Voltage Variable Type (With SW)〉

Vcc

CTL

Vo

R₂

Vcc

Cin

Cout

ADJ

GND

R₁

Figure 1. Typical Application Circuit

Output Voltage Variable Type (With SW)

〈Output Voltage Fixation Type (With SW)〉

Vcc

CTL

Vo

Vcc

Cin

Cout

N.C.

GND

Figure 2. Typical Application Circuit

Output Voltage Fixation Type (With SW)

〈Output Voltage Fixation Type (Without SW)〉

Vcc

Vo

Vcc

Cin

Cout

GND

Figure 3. Typical Application Circuit

Output Voltage Fixation Type (Without SW)

www.rohm.com

TSZ22111・15・001

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

2/43

BDxxC0A-C series BDxxC0AW-C series

Pin Configurations/Pin Descriptions

〈With SW (TO252-5/HRP5/TO263-5)〉

TO252-5

(TOP VIEW)

TO263-5

(TOP VIEW)

HRP5

(TOP VIEW)

FIN

1

2

3

4 5

1 2 3 4

5

1 2 3 4 5

HRP5

TO263-5

TO252-5

Figure 4. Pin Configurations (With SW)

Pin No.

Pin Name

CTL

Function

1

2

Output Control Pin

Power Supply Pin

Vcc

N.C. ^{(Note 1)}

GND

N.C. Pin (TO252-5)

GND (HRP5/TO263-5)

3

4

Vo

Output Pin

ADJ

Variable Pin (BD00C0AW)

N.C. Pin (BD33/50/80/90C0AW)

5

N.C. ^{(Note 1)}

FIN

GND

(Note 1) N.C.Pin can be open. Because it isn't connect it inside of IC.

〈Without SW (TO252-3/TO263-3(F))〉

TO263-3(F)

(TOP VIEW)

TO252-3

(TOP VIEW)

FIN

1

2

3

1

2

3

TO263-3(F)

TO252-3

Figure 5. Pin Descriptions (Without SW)

Pin No.

1

Pin Name

Vcc

Function

Power Supply Pin

N.C. ^{(Note 1)}

GND

N.C. Pin (TO252-3)

GND (TO263-3(F))

2

3

Vo

Output Pin

FIN

GND

(Note 1) N.C.Pin can be open. Because it isn't connect it inside of IC.

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

3/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

〈Without SW (HRP5)〉

HRP5

(TOP VIEW)

FIN

1

2

3

4 5

HRP5

Figure 6. Pin Descriptions (Without SW) (HRP5)

Pin No.

Pin Name

Vcc

Function

Power Supply Pin

N.C. Pin

1

2

N.C. ^{(Note 1)}

GND

3

GND

4

N.C.

N.C. Pin

5

Vo

Output Pin

GND

FIN

GND

(Note 1) N.C.Pin can be open. Because it isn't connect it inside of IC.

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

4/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

Block Diagrams

〈BD00C0AWFP/WHFP/WFP2-C (Output Voltage Variable Type, With SW) 〉

■TO252-5/HRP5/TO263-5

GND

FIN

VREF :Bandgap Reference

OCP :Over Current Protection Circuit

TSD :Thermal Shut Down Circuit

Driver :Power Transistor Driver

VREF

Driver

OCP

TSD

1

2

3

4

5

CTL

Vcc

N.C.(TO252-5）

GND(HRP5/TO263-5）

Vo

ADJ

Figure 7. Block diagram

BD00C0AWFP/WHFP/WFP2-C (Output Voltage Variable Type, With SW)

〈BDxxC0AWFP/WHFP/WFP2-C (Output Voltage Fixation Type, With SW) 〉

■TO252-5/HRP5/TO263-5

GND

FIN

VREF :Bandgap Reference

OCP :Over Current Protection Circuit

TSD :Thermal Shut Down Circuit

Driver :Power Transistor Driver

VREF

Driver

OCP

TSD

1

2

3

4

5

CTL

Vcc

N.C.(TO252-5）

GND(HRP5/TO263-5)

Vo

N.C.

Figure 8. Block diagram

BDxxC0AWFP/WHFP/WFP2-C (Output Voltage Fixation Type, With SW)

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

5/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

〈BDxxC0AFP/HFP/FP2-C (Output Voltage Fixation Type, Without SW) 〉

■TO252-3/TO263-3(F)

GND

FIN

VREF :Bandgap Reference

OCP :Over Current Protection Circuit

TSD :Thermal Shut Down Circuit

Driver :Power Transistor Driver

VREF

Driver

OCP

TSD

1

2

3

Vcc

N.C.(TO252-3）

GND(TO263-3(F)）

Vo

Figure 9. Block diagram

BDxxC0AFP/FP2-C (Output Voltage Fixation Type, Without SW)

■HRP5

GND

FIN

VREF :Bandgap Reference

OCP :Over Current Protection Circuit

TSD :Thermal Shut Down Circuit

Driver :Power Transistor Driver

VREF

Driver

OCP

TSD

1

2

3

4

5

Vcc

N.C.

GND

N.C.

Vo

Figure 10. Block diagram

BDxxC0AHFP-C (Output Voltage Fixation Type, Without SW)

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

6/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

Absolute Maximum Ratings (Ta= 25°C)

Parameter

Supply Voltage ^{(Note 1)}

Symbol

Vcc

Ratings

-0.3 to +35.0

-40 to +125

-55 to +150

150

Unit

V

°C

Output Control Voltage (With SW) ^{(Note 2)}V_CTL

Operating Temperature Range

Storage Temperature Range

Maximum Junction Temperature

Topr

Tstg

Tjmax

(Note 1) Do not exceed Pd (Please refer to Power Dissipation in P.27-29).

(Note 2) The order of starting up power supply (Vcc) and CTL pin doesn't have either in the problem within

the range of the operation power-supply voltage ahead.

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage

can either be a short circuit between pins or an open circuit between pins and the internal circuitry.

Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case

the IC is operated over the absolute maximum ratings.

Recommended Operating Conditions (-40°C ≤ Ta ≤ +125°C)

Parameter

Supply Voltage (Vo ≥ 3.0V)

Supply Voltage (Vo < 3.0V)

Startup Voltage (Io=0mA)

Output Control Voltage (With SW)

Output Current

Symbol

Vcc

V_CTL

Io

Min

Vo+1

4.0

-

0

Max.

26.5

3.8

26.5

1.0

Unit

V

A

V

Output Voltage (BD00C0AW)^{(Note 1)}

Vo

1.0

15.0

(Note 1) Please refer to Notes15 for use when you use BD00C0AW by output voltage 1.0V ≤ Vo < 3.0V.

Thermal Resistance ^{(Note 1)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 3)}

2s2p^{(Note 4)}

TO252-3, TO252-5

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

136

17

23

3

°C/W

Ψ_JT

HRP5

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

120

8

22

3

°C/W

Ψ_JT

TO263-3(F), TO263-5

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

81

8

21

2

°C/W

Ψ_JT

(Note 1)Based on JESD51-2A (Still-Air)

(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 3)Using a PCB board based on JESD51-3.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3mm x 76.2mm x 1.57mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70μm

(Note 4)Using a PCB board based on JESD51-5, 7.

Layer Number of

Material

Thermal Via^{(Note 5)}

Board Size

114.3mm x 76.2mm x 1.6mmt

2 Internal Layers

Measurement Board

Pitch

Diameter

4 Layers

FR-4

1.20mm

Φ0.30mm

Top

Bottom

Copper Pattern

Thickness

Copper Pattern

Thickness

Copper Pattern

Thickness

70μm

Footprints and Traces

70μm

74.2mm x 74.2mm

35μm

74.2mm x 74.2mm

(Note 5) This thermal via connects with the copper pattern of all layers. The placement and dimensions obey a land pattern.

www.rohm.com

TSZ22111・15・001

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

7/43

BDxxC0A-C series BDxxC0AW-C series

Electrical Characteristics

Unless otherwise specified, -40°C ≤ Ta ≤ +125°C, Vcc=13.5V, Io=0mA, VCTL=5.0V (With SW)

The resistor of between ADJ and Vo =56.7kΩ, ADJ and GND =10kΩ (BD00C0AW)

Guaranteed Limit

Parameter

Symbol

Unit

Conditions

Min.

Typ.

0

Max.

5

Shutdown Current (With SW)

Circuit Current

Isd

Ib

-

µA

VCTL=0V

0.5

2.5

mA

ADJ Terminal Voltage

(BD00C0AWFP/WHFP)

VADJ

Vo

0.742

0.727

0.750

Vo

0.758

0.773

V

Io=50mA, Ta=25°C

Io=50mA

ADJ Terminal Voltage (BD00C0AW)

Output Voltage

(BD33/50C0A(W9FP/(W)HFP)

Vo×0.99

Vo×0.97

Vo×0.99

Vo×0.97

-

Vo×1.01

Vo×1.03

Vo×1.01

Vo×1.03

0.5

Io=200mA, Ta=25°C

Io=200mA

Output Voltage (BD33/50C0A(W))

Vo

Output Voltage

(BD80/90C0A(W)FP/(W)HFP)

Vo

Io=500mA, Ta=25°C

Io=500mA

Output Voltage (BD80/90C0A(W))

Vo

Dropout Voltage

(BD00/50/80/90C0A(W))

ΔVd

0.3

Vcc=Vo×0.95,Io=500mA

f=120Hz,

Ripple Rejection (BD00/33/50C0A(W)) R.R.

45

40

55

50

-

dB Input Voltage Ripple =1Vms,

Io=100mA

f=120Hz,

dB Input Voltage Ripple =1Vms,

Io=100mA

Ripple Rejection (BD80/90C0A(W))

R.R.

Line Regulation

Load Regulation

Reg.I

-

20

Vo

80

Vo

mV Vo+1.0V ≤ V_CC≤ 26.5V

Reg.L

V

5mA ≤ Io ≤1A

×0.010 ×0.020

CTL ON Mode Voltage (With SW)

CTL OFF Mode Voltage (With SW)

CTL Bias Current (With SW)

VthH

VthL

I_CTL

2.0

－

25

－

0.8

50

V

ACTIVE MODE

OFF MODE

－

μA

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

8/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

Reference Data

■BD00C0AW-C series(Vo=5.0V)

Unless otherwise specified, -40°C ≤ Ta ≤ +125°C, Vcc=13.5V, V_CTL=5.0V, Io=0mA, Vo=5.0V

(The resistor of between ADJ and Vo =56.7kΩ, ADJ and GND =10kΩ)

18

15

12

9

1.0

0.8

0.6

0.4

0.2

0.0

Ta=-40℃

Ta=25℃

Ta=125℃

6

Ta=-40℃

Ta=25℃

Ta=125℃

3

0

2

4

6

8

10 12 14 16 18 20 22 24 26

0

2

4

6

8 10 12 14 16 18 20 22 24 26

Supply Voltage:Vcc [V]

Figure 12. Shutdown Current

(V_CTL=0V)

Figure 11. Circuit Current

(Note 1)

(IFEEDBACK_R

≈ 75µA)

(Note 1) IFEEDBACK_R is the current flowing into

external feedback resistance.

6

5

4

3

2

1

0

6

5

4

3

2

1

0

Ta=-40℃

Ta=25℃

Ta=125℃

Ta=-40℃

Ta=25℃

Ta=125℃

0

2

4

6

8 10 12 14 16 18 20 22 24 26

0

2

4

6

8 10 12 14 16 18 20 22 24 26

Supply Voltage:Vcc [V]

Figure 14. Line Regulation

(Io=500mA)

Figure 13. Line Regulation

(Io=0mA)

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

9/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

Reference Data - continued

1,000

900

800

700

600

500

400

300

200

100

0

6

5

4

3

Ta=-40℃

Ta=25℃

Ta=125℃

2

Ta=-40℃

1

Ta=25℃

Ta=125℃

0

400

800

1200 1600 2000 2400

0

200

400

600

800

1000

Output Current:Io [mA]

Figure 15. Load Regulation

Figure 16. Dropout Voltage

(Vcc=Vo×0.95=4.75V)

5.15

5.10

5.05

5.00

4.95

4.90

4.85

80

70

60

50

40

30

20

10

0

Ta=-40℃

Ta=25℃

Ta=125℃

10

100

1000

10000 100000 1000000

-40 -20

0

20

40

60

80 100 120

Frequency: f [Hz]

Ambient Temperature: [℃]

Figure 18. Output Voltage

Temperature Characteristic

Figure 17. Ripple Rejection

(lo=100mA)

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

10/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

Reference Data - continued

180

160

140

120

100

80

1.0

0.8

0.6

0.4

60

Ta=-40℃

Ta=25℃

Ta=125℃

0.2

40

Ta=25℃

Ta=125℃

20

0.0

0

200

400

600

800

1000

0

2

4

6

8

10 12 14 16 18 20 22 24 26

Output Current:Io [mA]

Control Voltage: V_CTL[V]

Figure 20. CTL Current vs CTL Voltage

Figure 19. Circuit Current

(0mA ≤ Io ≤ 1000mA, IFEEDBACK_R ≈ 75µA)

6

5

4

3

2

1

0

6

5

4

3

2

1

0

Ta=-40℃

Ta=25℃

Ta=125℃

130

140

150

160

170

180

190

0

2

4

6

8

10 12 14 16 18 20 22 24 26

Ambient Temperature:Ta [℃]

Control Voltage: V_CTL[V]

Figure 21. Output Voltage vs CTL Voltage

Figure 22. Thermal Shutdown

Circuit Characteristic

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

11/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

Measurement setup for reference data

■BD00C0AW-C series (Vo=5.0V)

Vcc

Vo

Vcc

Vo

Vcc

Vo

56.7kΩ

10kΩ

1µF

56.7kΩ

10kΩ

1µF

56.7kΩ

10kΩ

CTL

ADJ

CTL

ADJ

CTL

ADJ

1µF

GND

5V

FEEDBACK _R

Measurement setup for Figure 11

Measurement setup for Figure 12

Measurement setup for Figure 13

Vcc

Vo

Vcc

Vo

Vcc

Vo

56.7kΩ

10kΩ

56.7kΩ

10kΩ

56.7kΩ

10kΩ

1µF

CTL

ADJ

CTL

ADJ

CTL

ADJ

13.5V

1µF

4.75V

GND

500mA

GND

5V

Measurement setup for Figure 14

Measurement setup for Figure 15

Measurement setup for Figure 16

Vcc

Vo

Vcc

Vo

Vcc

Vo

56.7kΩ

10kΩ

56.7kΩ

10kΩ

56.7kΩ

10kΩ

1Vrms

13.5V

1µF

CTL

ADJ

13.5V

1µF

V

CTL

ADJ

CTL

ADJ

13.5V

1µF

GND

1µF

GND

100mA

GND

5V

FEEDBACK _R

5V

Measurement setup for Figure 17

Measurement setup for Figure 18

Measurement setup for Figure 19

Vcc

Vo

Vcc

Vo

Vcc

Vo

56.7kΩ

10kΩ

56.7kΩ

10kΩ

56.7kΩ

10kΩ

1µF

CTL

ADJ

CTL

ADJ

CTL

ADJ

13.5V

1µF

13.5V

1µF

13.5V

1µF

GND

5V

Measurement setup for Figure 20

Measurement setup for Figure 21

Measurement setup for Figure 22

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

12/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

Reference Data

■BD33C0A-C/ BD33C0AW-C series

Unless otherwise specified, -40°C ≤ Ta ≤ +125°C, Vcc=13.5V, V_CTL=5.0V (With SW), Io=0mA

1.0

18

Ta=-40℃

15

12

9

Ta=25℃

0.8

0.6

0.4

0.2

0.0

Ta=125℃

6

Ta=-40℃

Ta=25℃

Ta=125℃

3

0

2

4

6

8

10 12 14 16 18 20 22 24 26

0

2

4

6

8

10 12 14 16 18 20 22 24 26

Supply Voltage:Vcc [V]

Figure 23. Circuit Current

Figure 24. Shutdown Current

(V_CTL=0V)

6

5

4

3

2

1

0

6

5

4

3

2

1

0

Ta=-40℃

Ta=25℃

Ta=125℃

0

2

4

6

8

10 12 14 16 18 20 22 24 26

0

2

4

6

8

10 12 14 16 18 20 22 24 26

Supply Voltage:Vcc [V]

Figure 26. Line Regulation

(Io=500mA)

Figure 25. Line Regulation

(Io=0mA)

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

13/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

Reference Data - continued

6

80

70

60

50

40

30

20

10

0

Ta=-40℃

Ta=25℃

Ta=125℃

Ta=-40℃

5

4

3

2

1

0

Ta=25℃

Ta=125℃

0

400

800 1200 1600 2000 2400

Output Current:Io [mA]

10

100

1000

10000 100000 1000000

Frequency: f [Hz]

Figure 27. Load Regulation

Figure 28. Ripple Rejection

(lo=100mA)

3.38

3.36

3.34

3.32

3.30

3.28

3.26

3.24

3.22

1.0

0.8

0.6

0.4

0.2

0.0

Ta=-40℃

Ta=25℃

Ta=125℃

-40 -20

0

20

40

60

80 100 120

0

200

400

600

800

1000

Ambient Temperature: [℃]

Output Current:Io [mA]

Figure 29. Output Voltage Temperature Characteristic

Figure 30. Circuit Current

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

14/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

Reference Data - continued

180

160

140

120

100

80

6

5

4

3

2

1

0

60

Ta=-40℃

Ta=25℃

Ta=125℃

40

Ta=25℃

20

Ta=125℃

0

2

4

6

8

10 12 14 16 18 20 22 24 26

0

2

4

6

8

10 12 14 16 18 20 22 24 26

Control Voltage: V_CTL[V]

Figure 31. CTL Current vs CTL Voltage

Figure 32. Output Voltage vs CTL Voltage

6

5

4

3

2

1

0

130

140

Ambient Temperature:Ta [℃]

Figure 33. Thermal Shutdown Circuit Characteristic

150

160

170

180

190

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

15/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

Reference Data

■BD50C0A-C/ BD50C0AW-C series

Unless otherwise specified, -40°C ≤ Ta ≤ +125°C, Vcc=13.5V, V_CTL=5.0V (With SW), Io=0mA

1.0

18

Ta=-40℃

15

12

9

Ta=25℃

0.8

0.6

0.4

0.2

0.0

Ta=125℃

6

Ta=-40℃

Ta=25℃

Ta=125℃

3

0

2

4

6

8

10 12 14 16 18 20 22 24 26

0

2

4

6

8

10 12 14 16 18 20 22 24 26

Supply Voltage:Vcc [V]

Figure 34. Circuit Current

Figure 35. Shutdown Current

(V_CTL=0V)

6

5

4

3

2

1

0

6

5

4

3

2

1

0

Ta=-40℃

Ta=25℃

Ta=125℃

0

2

4

6

8

10 12 14 16 18 20 22 24 26

0

2

4

6

8

10 12 14 16 18 20 22 24 26

Supply Voltage:Vcc [V]

Figure 36. Line Regulation

(Io=0mA)

Figure 37. Line Regulation

(Io=500mA)

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

16/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

Reference Data - continued

6

5

4

3

1,000

900

800

700

600

500

400

300

200

100

0

Ta=-40℃

Ta=25℃

Ta=125℃

2

Ta=-40℃

1

Ta=25℃

Ta=125℃

0

400

800

1200 1600 2000 2400

0

200

400

600

800

1000

Output Current:Io [mA]

Figure 38. Load Regulation

Figure 39. Dropout Voltage

(Vcc=Vo×0.95V=4.75V)

80

70

60

50

40

30

20

10

0

5.15

5.10

5.05

5.00

4.95

4.90

4.85

Ta=-40℃

Ta=25℃

Ta=125℃

-40 -20

0

20

40

60

80 100 120

10

100

1000

10000 100000 1000000

Ambient Temperature: [℃]

Frequency: f [Hz]

Figure 41. Output Voltage

Temperature Characteristic

Figure 40. Ripple Rejection

(lo=100mA)

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

17/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

Reference Data - continued

1.0

0.8

0.6

180

160

140

120

100

80

0.4

60

Ta=-40℃

Ta=25℃

Ta=125℃

40

0.2

Ta=25℃

20

Ta=125℃

0.0

0

200

400

600

800

1000

0

2

4

6

8

10 12 14 16 18 20 22 24 26

Output Current:Io [mA]

Control Voltage: V_CTL[V]

Figure 43. CTL Current vs CTL Voltage

Figure 42. Circuit Current

6

5

4

3

2

1

0

6

5

4

3

2

1

0

Ta=-40℃

Ta=25℃

Ta=125℃

0

2

4

6

8

10 12 14 16 18 20 22 24 26

130

140

150

160

170

180

190

Control Voltage: V_CTL[V]

Ambient Temperature:Ta [℃]

Figure 45. Thermal Shutdown Circuit Characteristic

Figure 44. Output Voltage vs CTL Voltage

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

18/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

Reference Data

■BD80C0A-C/ BD80C0AW-C series

Unless otherwise specified, -40°C ≤ Ta ≤ +125°C, Vcc=13.5V, V_CTL=5.0V (With SW), Io=0mA

18

15

12

9

1.2

1.0

0.8

0.6

0.4

0.2

0.0

Ta=-40℃

Ta=25℃

Ta=125℃

6

Ta=-40℃

Ta=25℃

Ta=125℃

3

0

2

4

6

8

10 12 14 16 18 20 22 24 26

0

2

4

6

8

10 12 14 16 18 20 22 24 26

Supply Voltage:Vcc [V]

Figure 46. Circuit Current

Figure 47. Shutdown Current

(V_CTL=0V)

10

9

8

7

6

5

4

3

2

1

0

10

9

8

7

6

5

4

3

2

1

0

Ta=-40℃

Ta=25℃

Ta=125℃

0

2

4

6

8

10 12 14 16 18 20 22 24 26

0

2

4

6

8

10 12 14 16 18 20 22 24 26

Supply Voltage:Vcc [V]

Figure 48. Line Regulation

(Io=0mA)

Figure 49. Line Regulation

(Io=500mA)

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

19/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

Reference Data - continued

10

9

1,000

900

800

700

600

500

400

300

200

100

0

Ta=-40℃

Ta=25℃

Ta=125℃

8

7

6

5

4

3

Ta=-40℃

2

Ta=25℃

1

Ta=125℃

0

400

800

1200 1600 2000 2400

0

200

400

600

800

1000

Output Current:Io [mA]

Figure 51. Dropout Voltage

(Vcc=Vo×0.95V=7.6V)

Figure 50. Load Regulation

8.20

8.15

8.10

8.05

8.00

7.95

7.90

7.85

7.80

80

70

60

50

40

30

20

10

0

Ta=-40℃

Ta=25℃

Ta=125℃

-40 -20

0

20

40

60

80 100 120

10

100

1000

10000

100000 1000000

Ambient Temperature: [℃]

Frequency: f [Hz]

Figure 52. Ripple Rejection

(lo=100mA)

Figure 53. Output Voltage Temperature Characteristic

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

20/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

Reference Data - continued

180

160

140

120

100

80

1.0

0.8

0.6

0.4

60

Ta=-40℃

Ta=25℃

Ta=125℃

Ta=-40℃

40

0.2

Ta=25℃

20

Ta=125℃

0

0.0

0

200

400

600

800

1000

0

2

4

6

8

10 12 14 16 18 20 22 24 26

Output Current:Io [mA]

Control Voltage: V_CTL[V]

Figure 54. Circuit Current

Figure 55. CTL Current vs CTL Voltage

10

9

8

7

6

5

4

3

2

1

0

10

9

8

7

6

5

4

3

2

1

0

Ta=-40℃

Ta=25℃

Ta=125℃

0

2

4

6

8

10 12 14 16 18 20 22 24 26

130

140

150

160

170

180

190

Control Voltage: V_CTL[V]

Ambient Temperature:Ta [℃]

Figure 57. Thermal Shutdown Circuit Characteristic

Figure 56. Output Voltage vs CTL Voltage

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

21/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

Reference Data

■BD90C0A-C/ BD90C0AW-C series

Unless otherwise specified, -40°C ≤Ta ≤ +125°C, Vcc=13.5V, V_CTL=5.0V (With SW), Io=0mA

18

15

12

9

1.2

1.0

0.8

0.6

0.4

0.2

0.0

Ta=-40℃

Ta=25℃

Ta=125℃

6

Ta=-40℃

Ta=25℃

Ta=125℃

3

0

2

4

6

8

10 12 14 16 18 20 22 24 26

0

2

4

6

8

10 12 14 16 18 20 22 24 26

Supply Voltage:Vcc [V]

Figure 58. Circuit Current

Figure 59. Shutdown Current

(V_CTL=0V)

10

9

8

7

6

5

4

3

2

1

0

10

9

8

7

6

5

4

3

2

1

0

Ta=-40℃

Ta=25℃

Ta=125℃

0

2

4

6

8

10 12 14 16 18 20 22 24 26

0

2

4

6

8

10 12 14 16 18 20 22 24 26

Supply Voltage:Vcc [V]

Figure 60. Line Regulation

(Io=0mA)

Figure 61. Line Regulation

(Io=500mA)

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

22/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

Reference Data - continued

10

9

1,000

900

800

700

600

500

400

300

200

100

0

Ta=-40℃

Ta=25℃

Ta=125℃

8

7

6

5

4

3

Ta=-40℃

2

Ta=25℃

1

Ta=125℃

0

400

800

1200 1600 2000 2400

0

200

400

600

800

1000

Output Current:Io [mA]

Figure 62. Load Regulation

Figure 63. Dropout Voltage

(Vcc=Vo×0.95V=8.55V)

9.20

9.15

9.10

9.05

9.00

8.95

8.90

8.85

8.80

80

70

60

50

40

30

20

10

0

Ta=-40℃

Ta=25℃

Ta=125℃

10

100

1000

10000 100000 1000000

-40 -20

0

20

40

60

80 100 120

Ambient Temperature: [℃]

Frequency: f [Hz]

Figure 64. Ripple Rejection

(Io =100mA)

Figure 65. Output Voltage

Temperature Characteristic

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

23/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

Reference Data - continued

180

160

140

120

100

80

1.0

0.8

0.6

0.4

60

Ta=-40℃

Ta=25℃

Ta=125℃

Ta=-40℃

40

0.2

Ta=25℃

20

Ta=125℃

0

0.0

0

2

4

6

8

10 12 14 16 18 20 22 24 26

0

200

400

600

800

1000

Output Current:Io [mA]

Control Voltage: V_CTL[V]

Figure 66. Circuit Current

Figure 67. CTL Current vs CTL Voltage

10

9

8

7

6

5

4

3

2

1

0

10

9

8

7

6

5

4

3

2

1

0

Ta=-40℃

Ta=25℃

Ta=125℃

0

2

4

6

8

10 12 14 16 18 20 22 24 26

130

140

150

160

170

180

190

Control Voltage: V_CTL[V]

Ambient Temperature:Ta [℃]

Figure 69. Thermal Shutdown

Circuit Characteristic

Figure 68. Output Voltage vs CTL Voltage

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

24/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

Measurement setup for reference data

■BDxxC0AW-C series(Output Voltage Fixation Type)

Vcc

Vo

Vcc

Vo

Vcc

Vo

(1.0µF)

2.2µF

(1.0µF)

2.2µF

(1.0µF)

2.2µF

1µF

CTL

N.C.

CTL

N.C.

CTL

N.C.

GND

5V

Measurement setup for

Figure 23, 34, 46 and 58

Measurement setup for

Figure 24, 35, 47 and 59

Measurement setup for

Figure 25, 36, 48 and 60

Vcc

Vo

Vcc

Vo

Vcc

Vo

(1.0µF)

2.2µF

1µF

(1.0µF)

2.2µF

(1.0µF)

2.2µF

1µF

CTL

N.C.

CTL

N.C.

CTL

N.C.

13.5V

Vo×

ꢀꢀ0.95V

GND

500mA

GND

5V

Measurement setup for

Figure 26, 37, 49 and 61

Measurement setup for

Figure 39, 51 and 63

Measurement setup for

Figure 27, 38, 50 and 62

Vcc

Vo

Vcc

Vo

Vcc

Vo

(1.0µF)

2.2µF

(1.0µF)

2.2µF

(1.0µF)

2.2µF

1µF

V

CTL

N.C.

CTL

N.C.

CTL

N.C.

13.5V

GND

100mA

GND

13.5V

5V

Measurement setup for

Figure 28, 40, 52 and 64

Measurement setup for

Figure 29, 41, 53 and 65

Measurement setup for

Figure 30, 42, 54 and 66

Vcc

Vo

Vcc

Vo

Vcc

Vo

(1.0µF)

2.2µF

(1.0µF)

2.2µF

(1.0µF)

2.2µF

1µF

CTL

N.C.

CTL

N.C.

CTL

N.C.

13.5V

GND

5V

Measurement setup for

Figure 31, 43, 55 and 67

Measurement setup for

Figure 32, 44, 56 and 68

Measurement setup for

Figure 33, 45, 57 and 69

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

25/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

Application Examples

・Applying positive surge to the Vcc pin

If the possibility exists that surges higher than 35.0V will be applied to the Vcc pin, a zenar diode should be placed

between the Vcc pin and GND pin as shown in the Figure below.

Vcc

GND

Figure 70

・Applying negative surge to the Vcc pin

If the possibility exists that negative surges lower than the GND are applied to the Vcc pin, a schottky diode should be

place between the Vcc pin and GND pin as shown in the Figure below.

Vcc

GND

Figure 71

・Implementing a protection diode

If the possibility exists that a large inductive load is connected to the output pin resulting in back-EMF at time of startup

and Shutdown, a protection diode should be placed as shown in the Figure below.

Vo

Figure 72

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

26/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

Thermal Design

■TO252-3

10.0

IC mounted on ROHM standard board based on JEDEC.

①

: 1 - layer PCB

(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)

Board material: FR4

8.0

Board size: 114.3 mm x 76.2 mm x 1.57 mmt

Mount condition: PCB and exposed pad are soldered.

Top copper foil: ROHM recommended

footprint + wiring to measure, 2 oz. copper.

②5.43 W

6.0

②

: 4 - layer PCB

4.0

(2 inner layers and Copper foil area on the reverse side of PCB:

74.2 mm x 74.2 mm)

Board material: FR4

2.0

Board size: 114.3 mm x 76.2 mm x 1.60 mmt

Mount condition: PCB and exposed pad are soldered.

Top copper foil: ROHM recommended

footprint + wiring to measure, 2 oz. copper.

2 inner layers copper foil area of PCB

: 74.2 mm x 74.2 mm, 1 oz. copper.

Copper foil area on the reverse side of PCB

: 74.2 mm x 74.2 mm, 2 oz. copper.

①0.92 W

0.0

0

25

50

75

100

125

150

Ambient Temperature: Ta [ꢀC]

Figure 73. TO252-3 Package Data

Condition①: θ_JA= 81 ꢀC / W, Ψ_JT(top center) = 8 °C / W

Condition②: θ_JA= 21 ꢀC / W, Ψ_JT(top center) = 2 °C / W

■TO252-5

10.0

IC mounted on ROHM standard board based on JEDEC.

① : 1 - layer PCB

(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)

Board material: FR4

8.0

Board size: 114.3 mm x 76.2 mm x 1.57 mmt

Mount condition: PCB and exposed pad are soldered.

Top copper foil: ROHM recommended

②5.43 W

6.0

4.0

2.0

0.0

footprint + wiring to measure, 2 oz. copper.

② : 4 - layer PCB

(2 inner layers and Copper foil area on the reverse side of PCB:

74.2 mm x 74.2 mm)

Board material: FR4

Board size: 114.3 mm x 76.2 mm x 1.60 mmt

Mount condition: PCB and exposed pad are soldered.

Top copper foil: ROHM recommended

footprint + wiring to measure, 2 oz. copper.

2 inner layers copper foil area of PCB

: 74.2 mm x 74.2 mm, 1 oz. copper.

Copper foil area on the reverse side of PCB

: 74.2 mm x 74.2 mm, 2 oz. copper.

①0.92 W

0

25

50

75

100

125

150

Ambient Temperature: Ta [ꢀC]

Figure 74. TO252-5 Package Data

Condition①: θ_JA= 136 ꢀC / W, Ψ_JT(top center) = 17 °C / W

Condition②: θ_JA= 23 °C / W, Ψ_JT(top center) = 3 °C / W

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27/43

TSZ22111・15・001

27.Jan.2017 Rev.005

BDxxC0A-C series BDxxC0AW-C series

Thermal Design – continued

■HRP5

10.0

IC mounted on ROHM standard board based on JEDEC.

①

: 1 - layer PCB

(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)

Board material: FR4

8.0

Board size: 114.3 mm x 76.2 mm x 1.57 mmt

Mount condition: PCB and exposed pad are soldered.

Top copper foil: ROHM recommended

footprint + wiring to measure, 2 oz. copper.

②5.68 W

6.0

②

: 4 - layer PCB

4.0

(2 inner layers and Copper foil area on the reverse side of PCB:

74.2 mm x 74.2 mm)

Board material: FR4

2.0

Board size: 114.3 mm x 76.2 mm x 1.60 mmt

Mount condition: PCB and exposed pad are soldered.

Top copper foil: ROHM recommended

footprint + wiring to measure, 2 oz. copper.

2 inner layers copper foil area of PCB

: 74.2 mm x 74.2 mm, 1 oz. copper.

Copper foil area on the reverse side of PCB

: 74.2 mm x 74.2 mm, 2 oz. copper.

①1.04 W

0.0

0

25

50

75

100

125

150

Ambient Temperature: Ta [ꢀC]

Figure 75. HRP5 Package Data

Condition①: θ_JA= 120 ꢀC / W, Ψ_JT(top center) = 8 °C / W

Condition②: θ_JA= 22 ꢀC / W, Ψ_JT(top center) = 3 °C / W

www.rohm.com

TSZ02201-G1G0AN00640-1-2

28/43

TSZ22111・15・001

27.Jan.2017 Rev.005

BDxxC0A-C series BDxxC0AW-C series

Thermal Design – continued

■TO263-3(F)

10.0

IC mounted on ROHM standard board based on JEDEC.

①

: 1 - layer PCB

(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)

Board material: FR4

8.0

Board size: 114.3 mm x 76.2 mm x 1.57 mmt

Mount condition: PCB and exposed pad are soldered.

Top copper foil: ROHM recommended

footprint + wiring to measure, 2 oz. copper.

②5.95 W

6.0

②

: 4 - layer PCB

4.0

(2 inner layers and Copper foil area on the reverse side of PCB:

74.2 mm x 74.2 mm)

Board material: FR4

①1.54 W

2.0

Board size: 114.3 mm x 76.2 mm x 1.60 mmt

Mount condition: PCB and exposed pad are soldered.

Top copper foil: ROHM recommended

footprint + wiring to measure, 2 oz. copper.

2 inner layers copper foil area of PCB

: 74.2 mm x 74.2 mm, 1 oz. copper.

Copper foil area on the reverse side of PCB

: 74.2 mm x 74.2 mm, 2 oz. copper.

0.0

0

25

50

75

100

125

150

Ambient Temperature: Ta [ꢀC]

Figure 76. TO263-3 Package Data

Condition①: θ_JA= 81 ꢀC / W, Ψ_JT(top center) = 8 °C / W

Condition②: θ_JA= 21 ꢀC / W, Ψ_JT(top center) = 2 °C / W

■TO263-5

10.0

IC mounted on ROHM standard board based on JEDEC.

①

: 1 - layer PCB

(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)

Board material: FR4

8.0

Board size: 114.3 mm x 76.2 mm x 1.57 mmt

Mount condition: PCB and exposed pad are soldered.

Top copper foil: ROHM recommended

footprint + wiring to measure, 2 oz. copper.

②5.95 W

6.0

4.0

2.0

0.0

②

: 4 - layer PCB

(2 inner layers and Copper foil area on the reverse side of PCB:

74.2 mm x 74.2 mm)

Board material: FR4

①1.54 W

Board size: 114.3 mm x 76.2 mm x 1.60 mmt

Mount condition: PCB and exposed pad are soldered.

Top copper foil: ROHM recommended

footprint + wiring to measure, 2 oz. copper.

2 inner layers copper foil area of PCB

: 74.2 mm x 74.2 mm, 1 oz. copper.

Copper foil area on the reverse side of PCB

: 74.2 mm x 74.2 mm, 2 oz. copper.

0

25

50

75

100

125

150

Ambient Temperature: Ta [ꢀC]

Figure 77. TO263-5 Package Data

Condition①: θ_JA= 81 ꢀC / W, Ψ_JT(top center) = 8 °C / W

Condition②: θ_JA= 21 ꢀC / W, Ψ_JT(top center) = 2 °C / W

www.rohm.com

TSZ02201-G1G0AN00640-1-2

29/43

TSZ22111・15・001

27.Jan.2017 Rev.005

BDxxC0A-C series BDxxC0AW-C series

When operating at temperature more than Ta=25°C, please refer to the power dissipation characteristic curve shown in Figure 73

to 77.

The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC at

temperatures less than the maximum junction temperature Tjmax.

Figure. 73 to 77 shows the acceptable power dissipation characteristic curves of the TO252-3/5, HRP5 and TO263-3(F)/5

packages. Even when the ambient temperature (Ta) is at normal temperature (25°C), the chip junction temperature (Tj) may be

quite high so please operate the IC at temperatures less than the acceptable power dissipation.

The calculation method for power consumption Pc(W) is as follows

Pc=(Vcc－Vo)×Io+Vcc×Ib

Acceptable loss Pd ≥ Pc

Vcc : Input voltage

Solving this for load current Io in order to operate within the acceptable loss

Vo

Io

: Output voltage

: Load current

: Circuit current

Pd－Vcc×Ib

Vcc－Vo

Ib

Io ≤

(Please refer to 19, 30, 42, 54 and 66 about Ib.)

It is then possible to find the maximum load current Iomax with respect to the applied voltage Vcc at the time of thermal design.

Calculation Example) When TO252-3 / TO252-5, 4-layer PCB, Ta=85°C, Vcc=13.5V, Vo=5.0V

2.824－13.5×Ib

Io ≤

Figure 73, 74 ②θja=23°C /W → -43.5mW/°C

25°C = 5.43W → 85°C =2.824W

8.5

Io ≤ 331.3mA (Ib：0.6mA)

Calculation Example) When HRP5, 4-layer PCB, Ta=85°C, Vcc=13.5V, Vo=5.0V

2.954－13.5×Ib

Io ≤

Figure 75 ②θja=22°C /W →-45.5mW/°C

25°C =5.68W → 85°C =2.954W

8.5

Io ≤ 346.6mA (Ib: 0.6mA)

Calculation Example) When TO263-3(F) / TO263-5, 4-layer PCB, Ta=85°C, Vcc=13.5V, Vo=5.0V

3.094－13.5×Ib

Io ≤

Figure 76, 77 ②θja=21°C /W →-47.6mW/°C

25°C =5.95W → 85°C =3.094W

8.5

Io ≤ 363mA (Ib: 0.6mA)

Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating temperature

ranges.

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

30/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

I/O equivalence circuit

Vcc Terminal

CTL Terminal (With SW)

200kΩ

(Typ)

1kΩ

(Typ)

Vcc

CTL

200kΩ

(Typ)

IC

Vo Terminal BD33/50/80/90C0A(W)

Vcc

R₁(kΩ)

(Typ)

R₂(kΩ)

(Typ)

34

56.6

48.3

55

R₃(kΩ)

(Typ)

R₃

BD33C0A(W)

BD50C0A(W)

BD80C0A(W)

10

15

20

Vo

5

R₂

R₁

BD90C0A(W)

BD00C0AW

Vo Terminal

ADJ Terminal

Vcc

Vo

1kΩ

(Typ)

15kΩ

(Typ)

ADJ

Vo

1kΩ

(Typ)

20kΩ

(Typ)

Figure 78

Output Voltage Configuration Method (BD00C0AW)

Please connect resistors R₁and R₂(which determines the output voltage) as shown in Figure 79.

Please be aware that the offset due to the current that flows from the ADJ terminal becomes large when resistor values are

large. Due to this, resistance ranging from 5kΩ to 10kΩ is highly recommended for R₁.

Vo

Vo ≈ ADJ × (R₁+R₂) / R₁

R₂

R₁

IC

ADJ

ADJ ≈ 0.75V

(Typ)

The circuit current dependents on the resistance value of R₁and R_2.

Please determine the constant considering the actual application.

Figure 79

www.rohm.com

TSZ02201-G1G0AN00640-1-2

31/43

TSZ22111・15・001

27.Jan.2017 Rev.005

BDxxC0A-C series BDxxC0AW-C series

Operational Notes

1.

2.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3.

4.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. Power dissipation in the Thermal Design is the value when the IC is mounted

on a 114.3mm x 76.2mm x 1.57mm/1.6mm glass epoxy board. And in case this exceeds, take the measures like

enlarge the size of board; make copper foil area for heat dissipation big; and do not exceed the power dissipation.

6.

7.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing

of connections.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

8.

9.

Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power

supply or ground line.

www.rohm.com

TSZ22111・15・001

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

32/43

BDxxC0A-C series BDxxC0AW-C series

Operational Notes – continued

10. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

avoided.

11. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

12. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be

within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the

TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat

damage.

13. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

14.Vcc Pin

Insert a capacitor (Vo ≥ 5.0V:capacitor ≥ 1µF, 1.0 ≤ Vo < 5.0V:capacitor ≥ 2.2µF) between the Vcc and GND pins.

Choose the capacitance according to the line between the power smoothing circuit and the Vcc pin. Selection of the

capacitance also depends on the application. Verify the application and allow for sufficient margins in the design. We

recommend using a capacitor with excellent voltage and temperature characteristics.

Electric capacitor

IC

Ceramic capacitor, Low ESR capacitor

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

33/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

Operational Notes – continued

15.Output Pin

In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND pin. We recommend a

capacitor with a capacitance of more than 1μF(3.0V ≤ Vo ≤ 15.0V). Electrolytic, tantalum and ceramic capacitors can

be used. We recommend a capacitor with a capacitance of more than 4.7μF(1.0V ≤ Vo < 3.0V). Ceramic capacitors

can be used. If electrolytic and tantalum capacitors of more than 4.7uF with a high ESR characteristic are used(1.0V ≤

Vo < 3.0V), 10 µF ceramic capacitor needs to be connected in parallel. When selecting the capacitor ensure that the

capacitance of more than 1μF(3.0V ≤ Vo ≤ 15.0V) or more than 4.7μF(1.0V ≤ Vo < 3.0V) is maintained at the intended

applied voltage and temperature range. Due to changes in temperature, the capacitance can fluctuate possibly

resulting in oscillation. For selection of the capacitor refer to the Cout_ESR vs Io data. The stable operation range

given in the reference data is based on the standalone IC and resistive load. For actual applications the stable

operating range is influenced by the PCB impedance, input supply impedance and load impedance. Therefore

verification of the final operating environment is needed.

When selecting a ceramic type capacitor, we recommend using X5R, X7R or better with excellent temperature and

DC-biasing characteristics and high voltage tolerance.

Also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying

that the actual application meets with the required specification.

6.0V ≤ Vcc ≤ 26.5V

5.0V ≤ Vo ≤ 15.0V

4.0V ≤ Vcc ≤ 26.5V

3.0V ≤ Vo ≤ 15.0V

-40ꢀC ≤ Ta ≤ +125°C

0A ≤ Io ≤ 1A

-40ꢀC ≤ Ta ≤ +125ꢀC

5kΩ ≤ R₁≤ 10kΩ (BD00C0AW)

Cin=2.2µF ≤ Cin ≤ 100µF

1µF ≤ Cout ≤ 100µF

-40ꢀC ≤ Ta ≤ +125°C

0A ≤ Io ≤ 1A

5kΩ≤ R₁≤ 10kΩ (BD00C0AW)

100

Unstable operating region

Stable operating region

10

1

Stable operating region

10

Stable operating region

0.1

0.01

2.2

1

Unstable

operating region

1

0.001

1

10

100

1

10

100

0

200

400

600

Io(mA)

800

1000

Cout（μF）

Cout(µF)

Cout_ESR vs Io

3.0V ≤ Vo ≤ 15.0V

(Reference data)

Cin vs Cout

3.0V ≤ Vo ≤ 15.0V

(Reference data)

4.0V ≤ Vcc ≤ 26.5V

1.0V ≤ Vo < 1.5V

1.5V ≤ Vo < 3.0V

1.0V ≤ Vo < 3.0V

-40ꢀC ≤ Ta ≤ +125°C

5kΩ ≤ R₁≤ 10kΩ (BD00C0AW)

2.2µF ≤ Cin ≤ 100µF

4.7µF ≤ Cout ≤ 100µF

-40ꢀC ≤ Ta ≤ +125°C

5kΩ ≤ R₁≤ 10kΩ (BD00C0AW)

2.2µF ≤ Cin ≤ 100µF

4.7µF ≤ Cout ≤ 100µF

-40ꢀC ≤ Ta ≤ +125°C

0A ≤ Io ≤ 1A

5kΩ≤ R₁≤ 10kΩ (BD00C0AW)

100

10

100

Unstable operating region

Stable operating region

10

1

Unstable operating region

Stable operating region

Stable

operating region

1

0.5

Unstable

Stable

10

operating region

0.1

0.01

2.2

0.001

1

0

200

400

600

Io(mA)

800

1000

0

200

400

600

Io(mA)

800

1000

4.7

1

10

Cout（μF）

100

Cout_ESR vs Io

1.0V ≤ Vo < 3.0V

(Reference data)

Cin vs Cout

1.0V ≤ Vo < 3.0V

(Reference data)

Vcc

Vo

Cin

Cout

(1µF or higher)

R₂

(1µF or higher)

V_CC

(4.0V to 26.5V)

Io

(Rout)

CTL

ADJ

GND

ESR

(0.001Ω

or higher)

V_CTL

(5.0V)

R₁

(5k to 10kΩ)

Operation Note 15 Measurement circuit (BD00C0AW)

34/43

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

Operational Notes – continued

4.0V ≤ Vcc ≤ 26.5V

1.0V ≤ Vo < 3.0V

(Cout and Ceramic capacitor 10µF is connected in parallel.)

-40°C ≤ Ta ≤ +125°C

0A ≤ Io ≤ 1A

5kΩ≤ R₁≤ 10kΩ (BD00C0AW)

(Cout and Ceramic capacitor 10µF is connected in parallel.)

-40°C ≤ Ta ≤ +125°C

5kΩ ≤ R₁≤ 10kΩ (BD00C0AW)

2.2µF ≤ Cin ≤ 100µF

1µF ≤ Cout ≤ 100µF

100

発振領域

10

1

安定領域

10

安定領域

0.1

0.01

2.2

1

発振領域

0.001

1

10

100

0

200

400

600

Io(mA)

800

1000

Cout（μF）

Cin vs Cout

1.0V ≤ Vo < 3.0V

Cout and Ceramic capacitor 10µF is

connected in parallel.

Cout_ESR vs Io

1.0V ≤ Vo < 3.0V

Cout and Ceramic capacitor 10µF is

connected in parallel.

(Reference data)

Vcc

Vo

V_CC

Cin

R₂

(4.0V to 26.5V)

(1µF or higher)

Cout

(1µF

or higher)

CTL

ADJ

出力負荷

Io(Rout)

10µF

GND

ESR

(0.001Ω

or higher)

R₁

(5k to 10kΩ)

V_CTL

(5.0V)

Operation Note 15 Measurement circuit (BD00C0AW)

16. CTL Pin

Do not set the voltage level on the IC's enable pin in between VthH and VthL. Do not leave it floating or unconnected,

otherwise, the output voltage would be unstable.

17. Rapid variation in Vcc Voltage and load Current CTL Pin

In case of a rapidly changing input voltage, transients in the output voltage might occur due to the use of a MOSFET as

output transistor. Although the actual application might be the cause of the transients, the IC input voltage, output

current and temperature are also possible causes. In case problems arise within the actual operating range, use

countermeasures such as adjusting the output capacitance.

18. Minute variation in output voltage

In case of using an application susceptible to minute changes to the output voltage due to noise, changes in input and

load current, etc., use countermeasures such as implementing filters.

19. In some applications, the Vcc and pin potential might be reversed, possibly resulting in circuit internal damage or

damage to the elements. For example, while the external capacitor is charged, the Vcc shorts to the GND. Use a

capacitor with a capacitance with less than 1000μF. We also recommend using reverse polarity diodes in series or a

bypass between all pins and the Vcc pin.

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

35/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

Physical Dimension, Tape and Reel Information

Package Name

TO252-3

www.rohm.com

TSZ22111・15・001

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

36/43

BDxxC0A-C series BDxxC0AW-C series

Physical Dimension, Tape and Reel Information

Package Name

TO252-5

www.rohm.com

TSZ22111・15・001

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

37/43

BDxxC0A-C series BDxxC0AW-C series

Physical Dimension, Tape and Reel Information

Package Name

HRP5

www.rohm.com

TSZ22111・15・001

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

38/43

BDxxC0A-C series BDxxC0AW-C series

Physical Dimension, Tape and Reel Information

Package Name

TO263-3(F)

www.rohm.com

TSZ22111・15・001

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

39/43

BDxxC0A-C series BDxxC0AW-C series

Physical Dimension, Tape and Reel Information

Package Name

TO263-5

www.rohm.com

TSZ22111・15・001

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

40/43

BDxxC0A-C series BDxxC0AW-C series

Marking Diagrams (TOP VIEW)

TO252-3

(TOP VIEW)

Part Number Marking

Output

Voltage(V)

Part Number

Marking

3.3

5.0

8.0

9.0

33C0AC

50C0AC

80C0AC

90C0AC

LOT Number

TO252-5

(TOP VIEW)

Output

Voltage(V)

Part Number

Marking

Part Number Marking

Variable

3.3

00C0AWC

33C0AWC

50C0AWC

80C0AWC

90C0AWC

5.0

8.0

9.0

LOT Number

HRP5

HRP5 (TOP VIEW)

Output

Voltage(V)

Part Number

Marking

Output Control Pin

Part Number Marking

Variable

3.3

With SW

00C0AWHFPC

33C0AWHFPC

33C0AHFPC

50C0AWHFPC

50C0AHFPC

80C0AWHFPC

80C0AHFPC

90C0AWHFPC

90C0AHFPC

LOT Number

Without SW

With SW

5.0

8.0

9.0

Without SW

With SW

Without SW

With SW

1PIN MARK

Without SW

www.rohm.com

TSZ22111・15・001

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

41/43

BDxxC0A-C series BDxxC0AW-C series

TO263-3(F)

TO263-3(F) (TOP VIEW)

Part Number Marking

LOT Number

Output

Voltage(V)

Part Number

Marking

3.3

5.0

8.0

9.0

33C0AC

50C0AC

80C0AC

90C0AC

1PIN

TO263-5

TO263-5 (TOP VIEW)

Part Number Marking

LOT Number

Output

Voltage(V)

Part Number

Marking

Variable

3.3

00C0AWC

33C0AWC

50C0AWC

80C0AWC

90C0AWC

5.0

8.0

9.0

1PIN

www.rohm.com

TSZ02201-G1G0AN00640-1-2

27.Jan.2017 Rev.005

42/43

TSZ22111・15・001

BDxxC0A-C series BDxxC0AW-C series

Revision History

Date

Revision

001

Changes

16.Nov.2012

New Release

The condition of output pin is changed on Operational Note 11.

The mention of “Status of this document” is removed.

07.Mar.2013

2.Sep.2013

002

・ Error in writing were corrected

・ New release TO263-3F, TO263-5F, packages.

・ Thermal Resistance and Power Dissipation are changed to be compliant with JEDEC

standard.

・ All characters were conformed to the Chicago manual.

・ The sign in the annotation part was changed from “※n” into “(Note n).”

・ NOTE under the absolute maximum rating of P.2 was deleted because it had

overlapped with P.1.

003

・ Sentences of "Power consumption Pc of IC when short-circuited" that exists in P.30 are

deleted.

・ “Operational Notes” were updated.

・ Page. 31 Error in writing were corrected

11.Oct.2013

27.Jan.2017

004

005

・ TO263-3 and TO263-5 were added.

・ The description method of thermal Resistance was changed to unify.

・ AEC-Q100 (Note1:Grade1) was appended.

・ Drop voltage figure was corrected. (P.12, 25)

・ Figure 78 I/O equivalent was corrected. (P.31)

・ Error in direction of feed was corrected. (P.39, 40)

www.rohm.com

TSZ02201-G1G0AN00640-1-2

43/43

TSZ22111・15・001

27.Jan.2017 Rev.005

Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

,

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.003


型号：	BD80C0AHFP-C
厂家：	ROHM
描述：	BD80C0AHFP-C是可提供最大1A电流的低饱和型稳压器。本IC内置防止因输出短路等发生IC破坏的过电流保护、以及防止因过负荷状态等使IC发生热破坏的过热保护电路。过电流保护稳压器
文件：	总46页 (文件大小：3067K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD80C0AHFP-C [ROHM]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB

SI9137LG

SI9122E