BD8220EFV [ROHM]
Silicon Monolithic Integrated Circuit; 硅单片集成电路
| 型号： | BD8220EFV |
| 厂家： | 
ROHM |
| 描述： | Silicon Monolithic Integrated Circuit |
| 文件： | 总5页 (文件大小：126K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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Structure
：
：
：
Silicon Monolithic Integrated Circuit
Power Driver for Compact disc player
Product Series
type
ＢＤ８２２０ＥＦＶ
Feature
： ・4CH BTL Driver.
・Employs the HTSSOP-B24PIN power package for compaction.
・Has a wide dynamic range.（PowVcc1=8V, RL=8Ω、6.0Ｖ(typ.)）
・The thermal shutdown circuit contained.
・Switches CH2 input by Control input terminal(CNT).
・Incorporates mute function by CNT terminal and mute terminal.
○Absolute maximum ratings(Ta=25℃)
Parameter
Power supply voltage
Symbol
Limits
15
Unit
Ｖ
PowVcc1,PowVcc2
BIAS1, BIAS2, LDIN,
SLIN, IN1, IN3, IN4
CNT
Ｖ
Input terminal
PowVcc 2
Ｖ
Ｖ
CNT terminal
MUTE terminal
PowVcc 2
PowVcc 2
1.1*1
MUTE1,2, 3 4
Ｗ
Power dissipation
Pd
4.0*2
-40～+85 ℃
-55～+150 ℃
Operating temperature range
Storage temperature
Topr
Tstg
℃
Junction temperature
Tjmax
+150
*1 70mm×70mm×1.6mm,occupied copper foil is less than 3%,glass epoxy standard board mounting.
Reduce power by 8.8mW for each degree above 25℃.
*2 Exclusive standard board mounting. Reduce power by 32.0mW for each degree above 25℃.
○Operating conditions
(Set the power supply voltage taking allowable dissipation into considering.)
PowVcc 1,2 4.5 ～10（Ｖ）
Please use it with PowVcc 1= PowVcc 2
Status of this document
The Japanese version of this document is the formal specification.Acustomer may use this translation version only for a reference to help reading the formal version.
If there are any differences in translation version of this document, formal version takes priority.
Be careful to handle because the content of the description of this material might correspond to the labor (technology in the design, manufacturing, and use) in foreign country exchange
and Foreign Trade Control Law.
Aradiation is not designed.
REV.A
REV. A
2/4
○Electrical characteristics
（Unless otherwise noted, Ta=25℃, PowVcc1=PowVcc2=8V, BIAS1=1.65V, BIAS2=1.65V, RL=8Ω）
Parameter
Symbol
IQ
MIN
TYP
30
MAX
45
Unit
mA
Condition
－
Quiescent dissipation current
< Driver >
At no-load
Output offset voltage (CH1,2)
Output offset voltage (CH3,4)
Maximum output amplitude (CH1,2)
Maximum output amplitude (CH3,4)
Closed circuit voltage gain (CH1,2)
Closed circuit voltage gain (CH3,4)
Input impedance (CH1,2)
Voof1
Voof2
VOM1
VOM2
Gvc1
-100
-50
5.4
0
0
100
50
mV
mV
V
－
6.0
5.3
23.5
17.5
20
－
4.7
V
VIN=±0.3V
VIN=±0.3V
PIN21,22,24
PIN18,19
21.5
15.5
13
25.5
19.5
27
dB
dB
kΩ
kΩ
Gvc2
ZIN1
ZIN2
Input impedance (CH3,4)
31
47
63
< Each function terminal >
－
2.0
－
－
－
－
－
MUTE terminal low level input voltage
MUTE terminal high level input voltage
CNT terminal low level input voltage
CNT terminal high level input voltage
VML
VMH
0.5
－
V
PIN13,14,15
〃
V
VCNTL
VCNTH
IMTL
IMTH
ICNTL
ICNTH
IB1
0.5
－
V
2.0
-15
－
V
μA
μA
μA
μA
μA
μA
MUTE terminal low level input current
MUTE terminal high level input current
15
PIN13,14,15=0V
PIN13,14,15=5V
PIN23=0V
0
85
0
170
15
CNT terminal low level input current
CNT terminal high level input current
BIAS 1 input terminal input current
BIAS 2 input terminal input current
-15
－
85
52
52
170
104
104
PIN23=5V
－
PIN17=1.65V
PIN20=1.65V
－
IB2
VIN：IN1, SLIN, IN3, and the IN4 voltage are the BIAS1 voltages., LDIN voltage are the BIAS2 voltages
○Package outlines
Lot.No
HTSSOP-B24(UNIT：mm)
REV. A
3/4
○Block diagram
24
23
22
21
20
19
18
17
16
15
14
13
20k
80k
80k
20k
47k
20k
47k
PreGND
BIAS1
MUTE
34
CNT
MUTE2
MUTE1
BIAS2
94k
94k
80k
T.S.D
LEVEL
SHIFT
LEVEL
SHIFT
LEVEL
SHIFT
LEVEL
SHIFT
10k 10k
10k 10k
10k 10k
10k 10k
10k
10k
10k
10k
10k
CH3
10k
10k
10k
PowVcc2
PowVcc1 PowGND1
PowGND2
CH1
CH2
CH4
2
3
4
5
6
7
8
9
10
11
12
1
T.S.D：Thermal Shut-Down
○Pin description
No.
1
Symbol
Description
No.
13
14
15
16
17
18
19
20
21
22
23
24
Symbol
MUTE1
MUTE2
Description
MUTE 1 terminal
PowVcc1 CH1,2 power supply terminal
PowGND Power GND
2
MUTE 2 terminal
3
VO1(-)
VO1(+)
VO2(-)
VO2(+)
VO3(-)
VO3(+)
VO4(-)
VO4(+)
Driver CH1 negative output
Driver CH1 positive output
Driver CH2 negative output
Driver CH2 positive output
Driver CH3 negative output
Driver CH3 positive output
Driver CH4 negative output
Driver CH4 positive output
MUTE34 MUTE 3,4 terminal
4
PreGND
BIAS1
IN4
PreGND
5
BIAS1 input
6
CH4 input
7
IN3
CH3 input
8
BIAS2
LDIN
SLIN
CNT
LD Reference voltage switch terminal
LD input
9
10
11
12
SL input
PowGND Power GND
PowVcc2 Pre Block and CH3,4 power supply terminal
Control input terminal
IN1 input
IN1
REV. A
4/4
○Cautions in using the IC
1.
Absolute maximum ratings
We are careful enough for quality control about this IC. So, there is no problem under normal operation, excluding that it exceeds the absolute maximum ratings. However, this IC
might be destroyed when the absolute maximum ratings, such as impressed voltages or the operating temperature range, is exceeded, and whether the
destruction is short circuit mode or open circuit mode cannot be specified. Please take into consideration the physical countermeasures for safety, such as fusing, if a particular
mode that exceeds the absolute maximum rating is assumed.
2.
3.
Reverse polarity connection
Connecting the power line to the IC in reverse polarity (from that recommended) will damage the part. Please utilize the direction protection device as a
diode in the supply line and motor coil line.
Power supply line
Due to return of regenerative current by reverse electromotive force, using electrolytic and ceramic suppress filter capacitors (0.1µF) close to the IC power
input terminals (Vcc and GND) are recommended. Please note the electrolytic capacitor value decreases at lower temperatures and examine to dispense
physical measures for safety.
And, for ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the internal powering sequence and delays.
Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of wiring.
4.
5.
GND line
Please keep the GND line the lowest potential always, and check the GND voltage when transient voltages are connected to the IC.
Thermal design
Do not exceed the power dissipation (Pd) of the package specification rating under actual operation, and please design enough temperature margins.
This product has exposed the frame to the back side of the package, but please note that it is assumed to use heat radiation efficiency by the heat
radiation for this part. Please take the heat radiation pattern on not only the surface of the substrate but also the back of the substrate widely.
6.
Short circuit mode between terminals and wrong mounting
Do not mount the IC in the wrong direction and displacement, and be careful about the reverse-connection of the power connector. Moreover, this IC
might be destroyed when the dust short the terminals between them or GND.
7.
8.
9.
Radiation
Strong electromagnetic radiation can cause operation failures.
ASO (Area of Safety Operation)
Do not exceed the maximumASO and the absolute maximum ratings of the output driver.
TSD (Thermal Shut-Down)
The TSD is activated when the junction temperature (Tj) exceeds Tjmax, and the output terminal is switched to OPEN.
The guarantee and protection of set are not purpose. Therefore, please do not use this IC after TSD circuit operates, nor useit for assumption that
operates the TSD circuit.
10. Capacitor between output driver and GND
If a large capacitor is connected between the output driver and GND, this IC might be destroyed when Vcc becomes 0V or GND, because the electric
charge accumulated in the capacitor flows to the output driver. Please set said capacitor to smaller than 0.1µF.
11. Inspection by the set circuit board
The stress might hang to IC by connecting the capacitor to the terminal with low impedance. Then, please discharge electricity in each and all
process. Moreover, when attaching or detaching from jig in the inspection process, please turn off the power before mounting the IC, and turn on after
mounting the IC, and vice versa. In addition, please take into consideration the countermeasures for electrostatic damage, such as giving the earth in
assembly process, transportation or preservation.
12. Input terminal
This IC is a monolithic IC, and has P+ isolation and P substrate for the element separation. Therefore, a parasitic PN junction is firmed in this P-layer
and N-layer of each element. For instance, the resistor or the transistor is connected to the terminal as shown in the figure below. When the GND
voltage potential is greater than the voltage potential at TerminalsAon the resistor, at Terminal B on the transistor, the PN junction operates as a
parasitic diode. In addition, the parasitic NPN transistor is formed in said parasitic diode and the N layer of surrounding elements close to said
parasitic diode. These parasitic elements are formed in the IC because of the voltage relation. The parasitic element operatingcauses the interference
of circuit operation, then the wrong operation and destruction. Therefore, please be careful so as not to operate the parasiticelements by impressing to
input terminals lower voltage than GND (P substrate). Please do not apply the voltage to the input terminal when the power-supply voltage is
not impressed. Moreover, please impress each input terminal lower than the power-supply voltage or equal to the specified range in the guaranteed
voltage when the power-supply voltage is impressing.
Resistor
Transistor(NPN)
Terminal-A
Terminal-B
Terminal-B
C
B
E
Terminal-A
C
E
B
Parasitic
element
P+
P
P+
P+
P
P+
Surrounding
elements
Parasitic
element
P-Substrate
P-Substrate
GND
Parasitic
element
Parasitic
element
GND
GND
GND
Simplified structure of IC
13. Earth wiring pattern
If small signal GND and large current GND exist, disperse their pattern. In addition, for voltage change by pattern wiring impedance and large current
not to change voltage of small signal GND, each ground terminal of IC must be connected at the one point on the set circuit board.As for GND of external
parts, it is similar to the above-mentioned.
REV. A
Appendix
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any
means without prior permission of ROHM CO.,LTD.
The contents described herein are subject to change without notice. The specifications for the
product described in this document are for reference only. Upon actual use, therefore, please request
that specifications to be separately delivered.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard
use and operation. Please pay careful attention to the peripheral conditions when designing circuits
and deciding upon circuit constants in the set.
Any data, including, but not limited to application circuit diagrams information, described herein
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of
whatsoever nature in the event of any such infringement, or arising from or connected with or related
to the use of such devices.
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or
otherwise dispose of the same, no express or implied right or license to practice or commercially
exploit any intellectual property rights or other proprietary rights owned or controlled by
ROHM CO., LTD. is granted to any such buyer.
Products listed in this document are no antiradiation design.
The products listed in this document are designed to be used with ordinary electronic equipment or devices
(such as audio visual equipment, office-automation equipment, communications devices, electrical
appliances and electronic toys).
Should you intend to use these products with equipment or devices which require an extremely high level
of reliability and the malfunction of which would directly endanger human life (such as medical
instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers
and other safety devices), please be sure to consult with our sales representative in advance.
It is our top priority to supply products with the utmost quality and reliability. However, there is always a chance
of failure due to unexpected factors. Therefore, please take into account the derating characteristics and allow
for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in
order to prevent possible accidents that may result in bodily harm or fire caused by component failure. ROHM
cannot be held responsible for any damages arising from the use of the products under conditions out of the
range of the specifications or due to non-compliance with the NOTES specified in this catalog.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact your nearest sales office.
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Appendix1-Rev2.0
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