BD8306MUV [ROHM]
BD8306MUV通过一个线圈可以从2-3节干电池或1节锂电池获得3.3V等升降压输出。 采用特有的升降压驱动方式，和以前的Sepic方式、H桥方式的开关稳压器相比，实现高效率的电源。;
| 型号： | BD8306MUV |
| 厂家： | 
ROHM |
| 描述： | BD8306MUV通过一个线圈可以从2-3节干电池或1节锂电池获得3.3V等升降压输出。 采用特有的升降压驱动方式，和以前的Sepic方式、H桥方式的开关稳压器相比，实现高效率的电源。 电池 开关 驱动 稳压器 |
| 文件： | 总28页 (文件大小：1744K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
1.8V to 5.5V, Integrated 2.0A MOSFET 1ch
Buck-Boost Converter
BD8306MUV
General Description
Key Specifications
Input Voltage Range:
Output Voltage Range:
Output Current:
ROHM’s
highly-efficient
buck-boost
converter
+1.8V to +5.5V
+1.8V to +5.2V
BD8306MUV produces buck-boost output voltage
including 3.3 V from two-cell or three-cell alkaline
battery, or one-cell lithium-ion battery with just one
inductor. This IC adopts the original buck-boost drive
system and creates a more efficient power supply than
the conventional SEPIC-system or H-bridge system
switching regulators.
(at 3.3V Output, +2.8V to +5.5V Input)
(at 5.0V Output, +2.8V to +5.5V Input)
Pch FET ON-Resistance:
Nch FET ON-Resistance:
Standby Current:
1.0A
0.7A
120mΩ(Typ)
100mΩ(Typ)
0μA (Typ)
Operating Temperature Range:
-40°C to +85°C
Features
Package
W (Typ) x D (Typ) x H (Max)
Highly-Efficient Buck-Boost DC/DC Converter
Constructed with just one Inductor.
Maximum output current changes depending on the
input and output voltages. Input current for PVCC
terminal should be less than 2.0A including the DC
current and ripple current of the inductor. Please
refer to Figure 25 and Figure 34 for details about
the maximum output current at 3.3V and 5.0V
output.
Incorporates a Soft-Start Function.
Incorporates a Timer Latch System with Short
Protection Function.
VQFN016V3030
3.00mm x 3.00mm x 1.00mm
Application
General Portable Equipment
DSC
DVC
Cellular Phone
PDA
LED
Typical Application Circuit
2.8V to 5.5V, Output: 3.3V / 1.0 A, Frequency 1MHz
10µF (ceramic)
murata
GRM31CB11A106KA01
2.8Vto5.5V
12
11
10
9
4.7µH
TOKO DE3518C
13
14
15
16
8
RVCC
0Ω
PVCC
VCC
PGND
LX2
7
6
5
LX2
ON/OFF
STB
10µF (ceramic)
murata
GRM31CB11A106KA01
VOUT
RT
3.3V/1.0A
RRT
39kΩ
1
2
3
4
V
CVCC
1µF
CC
120pF
CFB
2200pF
RINV1
56kΩ
RC
4.7kΩ
RINV2
10kΩ
RFB4.7kΩ
○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays
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BD8306MUV
Pin Configuration
(TOP VIEW)
12
11
10
9
13
14
15
16
PVCC
8 PGND
7 LX2
VCC
STB
RT
6 LX2
5
VOUT
1
2
3
4
Pin Descriptions
Pin No.
Pin Name
FB
Function
1
2
Output pin of error amp
Input pin of error amp
Ground pin
INV
3
GND
VOUT
LX2
4 to 5
6 to 7
8 to 9
10 to 11
12 to 13
14
Output voltage pin
Output side pin for inductor
Ground pin for POW-MOS
Input side pin for inductor
PGND
LX1
PVCC
VCC
STB
Voltage supply pin for DC/DC converter
Voltage supply pin for control block
ON/OFF pin
15
16
RT
Pin for configuration of frequency
Block Diagram
RT
STB
VCC
PVCC
GND
TIMING
CONTOL
LX1
FB
TIMING
CONTOL
PGND
INV
VOUT
LX2
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Description of Blocks
1. VREF
This block generates ERROR AMP reference voltage. The reference voltage is 0.5V.
2. UVLO
Circuit for preventing malfunction at low voltage input. This circuit prevents malfunction of the internal circuit while start
up of the power supply voltage or while low power supply voltage input. The circuit monitors VCC pin voltage then turns
OFF all output FETs and DC/DC converter output when VCC voltage is lower than 1.6V, and reset the timer latch of the
internal SCP circuit and soft-start circuit.
3. SCP
Short-circuit protection circuit based on timer latch system.
When the INV pin voltage is lower than 0.5V, the internal SCP circuit starts counting. SCP circuit detects high voltage
output of Error AMP. Since internal Error AMP has highly gain as high as 80dB or more, the output voltage of Error AMP
goes high and detects SCP even 1mV drop than set voltage (0.5V typ) occurs on INV pin voltage. The internal counter is
in synch with OSC, the latch circuit activates after the counter counts about 16400 oscillations to turn OFF DC/DC
converter output (about 16.4 msec when RRT =39KΩ). To reset the latch circuit, turn OFF the STB pin once. Then, turn it
ON again or turn on the power supply voltage again.
4. OSC
Oscillation circuit to change frequency by external resistance of the RT pin (Pin 16).
When RRT = 39 kΩ, operation frequency of DC/DC converter is set at 1 MHz.
5. ERROR AMP
Error amplifier for monitoring output voltage and output PWM control signals.
The internal reference voltage for Error AMP is set at 0.5 V.
6. PWM COMP
Voltage-pulse width converter for controlling output voltage corresponding to input voltage. Comparing the internal
SLOPE waveform with the ERROR AMP output voltage, PWM COMP controls the pulse width and outputs to the driver.
Max Duty and Min Duty are set at the primary side (LX1) and the secondary side (LX2) of the inductor respectively,
which are as follows:
Primary side (LX1)
Max Duty : 100 %(LX1 High side PMOS ON Duty)
Min Duty :
Max Duty :
Min Duty :
0 %(LX1 High side PMOS ON Duty)
85 %(LX2 Low side NMOS ON Duty)
0 %(LX2 Low side NMOS ON Duty)
Secondary side (LX2)
7. SOFT START
Circuit for preventing in-rush current at startup by bringing the output voltage of the DC/DC converter into a soft-start.
Soft-start time is in synch with the internal OSC, and the output voltage of the DC/DC converter reaches the set voltage
after about 1000 oscillations (About 1 msec when RRT = 39 kΩ).
8. PRE DRIVER
CMOS inverter circuit for driving the built-in Pch/Nch FET.Dead time is provided for preventing feed through during
switching. The dead time is set at about 15 nsec for each individual SWs.
9. STBY_IO
Voltage applied on STB pin (Pin 15) to control ON/OFF of IC.
Turned ON when a voltage of 1.5V or higher is applied and turned OFF when the terminal is open or 0V is applied.
Incorporates approximately 400 kΩ pull-down resistance.
10.Pch/Nch FET SW
Built-in SW for switching the inductor current of the DC/DC converter. Pch FET is about 120mΩ and Nch is 100mΩ.
Since the current rating of this FET is 2A, it should be used within 2A in total including the DC current and ripple current
of the inductor. The peak current of the inductor can be calculated by equation (1), (2), (3).
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BD8306MUV
Absolute Maximum Ratings
Parameter
Symbol
VCC,PVCC
IINMAX
VLX1
Rating
-0.3 to +7
2.0
Unit
V
Maximum Input Supply Voltage
Maximum Input Current
A
7.0
V
Maximum Input Voltage
VLX2
7.0
V
Power Dissipation (Note 1)
Storage Temperature
Junction Temperature
Pd
0.62
W
°C
°C
Tstg
-55 to +150
+150
Tjmax
(Note 1) When mounted on 74.2x74.2x1.6mm and operated over 25°C Pd reduces by 4.96mW/°C.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions(Ta=25°C)
Rating
Parameter
Symbol
Unit
Min
1.8
1.8
-40
Typ
Max
5.5
Power Supply Voltage Range
Output Voltage Range
VCC
VOUT
Topr
-
-
-
V
V
5.2
Operating Temperature Range
+85
°C
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BD8306MUV
Electrical Characteristics (Unless otherwise specified Ta=25°C, VCC=3V)
Limit
Parameter
Symbol
Unit
Conditions
Min
Typ
Max
[Under Voltage Lock Out Circuit]
Reset Voltage
VUV
-
1.7
1.8
V
VCC sweep up
Hysteresis Width
[Oscillator]
ΔVUVHY
50
100
150
mV
Frequency
fOSC
0.9
1.0
1.1
MHz RRT=39KΩ
[Error AMP]
Input Threshold Voltage
Input Bias Current
Soft Start Time
VINV
IINV
tSS
0.495
-50
0.500
0
0.505
+50
1.40
30
V
nA
VCC=7.0V , VINV=3.5V
0.60
10
1.00
20
msec RRT=39kΩ
Output Source Current
Output Sink Current
[PWM Comparator]
LX1 Max Duty
IEO
IEI
µA
VINV=0.2V , VFB =1.5V
0.6
1.2
2.4
mA
VINV=0.8V , VFB =1.5V
DMAX1
DMAX2
-
-
100
93
%
%
High side ON Duty
Low side ON Duty
LX2 Max Duty
77
85
[Output]
LX1 PMOS ON-Resistance
LX1 NMOS ON-Resistance
LX2 PMOS ON-Resistance
LX2 NMOS ON-Resistance
VOUT Discharge Switch
LX1 OCP Threshold
LX1 Leak Current
LX2 Leak Current
[STB]
RON1P
RON1N
RON2P
RON2N
RDVO
IOCP
-
-
120
100
120
100
100
3.0
0
200
160
200
160
160
-
mΩ
mΩ
mΩ
mΩ
Ω
VGS=3.0V
VGS=3.0V
-
VGS=3.0V
-
VGS=3.0V
-
VGS=3.0V, on at STB OFF
PVCC=3.0V
2.0
-1
-1
A
ILEAK1
ILEAK2
+1
µA
µA
0
+1
STB Pin
Control
Voltage
Enable
Disable
VSTBH
VSTBL
RSTB
1.5
-0.3
250
-
-
5.5
+0.3
700
V
V
STB Pull Down Resistance
[Circuit Current]
400
kΩ
VCC Pin
ISTB1
ISTB2
-
-
-
-
1
1
µA
µA
Stand-By
Current
PVCC Pin
(Note 2)
V =0.8V,
INV
VCC Circuit Current
PVCC Circuit Current
VOUT Circuit Current
ICC1
ICC2
ICC3
-
-
-
500
10
750
20
µA
µA
µA
stop DC/DC
(Note 2)
V =0.8V,
INV
stop DC/DC
(Note 2)
V =0.8V,
INV
10
20
stop DC/DC
(Note 2) ICC1, ICC2, ICC3 are currents flowing to VCC, PVCC, VOUT terminals. When the input voltage of INV pin is 0.8V, DC/DC converter operation stops.
Total input current on DC/DC converter operation would be greater than the limit mentioned above. Please refer to Figure 26 and Figure 35 for details about the
total input current under DC/DC converter operation at 3.3V and 5.0V output.
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BD8306MUV
Typical Performance Curves
(Unless otherwise specified, Ta = 25°C, VCC = 3.7V)
0.510
0.505
0.500
VCC=5.0V
0.495
VCC=3.0V
VCC=1.8V
VCC=7.0V
0.490
-50
0
50
100
150
Temperature : Ta [°C]
Power Supply Voltage : VCC [V]
Figure 1. INV Threshold vs Temperature
Figure 2. INV Threshold vs Power Supply Voltage
1.200
1.100
1.000
0.900
0.800
1.200
1.100
1.000
0.900
0.800
0
2
4
6
8
-50
0
50
100
150
Temperature : Ta [°C]
Power Supply Voltage : VCC [V]
Figure 3. Oscillation Frequency vs Temperature
Figure 4. Oscillation Frequency vs Power Supply
Voltage
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BD8306MUV
Typical Performance Curves - continued
1.0
0.8
1.0
0.8
0.6
0.4
0.2
0.0
Ta=-25deg
0.6
0.4
Ta=-25deg
Ta=25deg
Ta=85de
Ta=25deg
0.2
0.0
Ta=85deg
1.5
1.6
1.7
1.8
1.5
1.6
1.7
1.8
Power Supply Voltage : VCC [V]
Power Supply Voltage : VCC [V]
Figure 6. ErrorAmp Buffer Voltage vs Power Supply Voltage
(UVLO Reset Threshold)
Figure 5. ErrorAmp Buffer Voltage vs Power Supply Voltage
(UVLO Detect Threshold)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
40
35
30
25
20
15
10
5
0
0.0
0.5
1.0
1.5
2.0
0.0
0.5
1.0
1.5
2.0
VFB [V]
VFB [V]
Figure 7. FB Sink Current vs VFB
(VINV=0.8V)
Figure 8. FB Source Current vs VFB
(VINV=0.2V)
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BD8306MUV
Typical Performance Curves - continued
1.0
0.8
300
250
200
150
100
50
Ta=150deg
Ta=150deg
Ta=25deg
0.6
Ta=-60deg
0.4
Ta=25deg
Ta=-60deg
0.2
0.0
0
0
2
4
6
8
0.0
0.4
0.8
1.2
1.6
2.0
STB Threshold Voltage [V]
Power Supply Voltage : VCC [V]
Figure 10. ON-Resistance vs Power Supply Voltage
(LX1 Pch FET)
Figure 9. ErrorAmp Buffer Voltage vs STB Threshold Voltage
300
300
Ta=150deg
Ta=150deg
250
250
200
150
100
50
200
Ta=25deg
Ta=25deg
150
Ta=-60deg
Ta=-60deg
100
50
0
0
0
2
4
6
8
0
2
4
6
8
Power Supply Voltage : VCC [V]
Power Supply Voltage : VCC [V]
Figure 12. ON-Resistance vs Power Supply Voltage
(LX2 Pch FET)
Figure 11. ON-Resistance vs Power Supply Voltage
(LX1 Nch FET)
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TSZ22111・15・001
BD8306MUV
Typical Performance Curves - continued
300
1,000
900
800
700
600
500
400
300
200
100
0
Ta=150deg
250
200
Ta=25deg
150
Ta=-60deg
100
50
0
0
2
4
6
8
0
2
4
6
8
Power Supply Voltage : VCC [V]
Power Supply Voltage : VCC [V]
Figure 13. ON-Resistance vs Power Supply Voltage
(LX2 Nch FET)
Figure 14. VCC Input Current vs Power Supply Voltage
(VINV=0.8V, stop DC/DC)
300
20
15
10
5
250
Ta=150deg
200
Ta=25deg
Ta=-60deg
150
100
50
0
0
0
2
4
6
8
0
2
4
6
8
Power Supply Voltage : VCC [V]
Power Supply Voltage : VCC [V]
Figure 15. PVCC Input Current vs Power Supply
Voltage
Figure 16. ON-Resistance vs Power Supply Voltage
(VSTB=0V)
(VINV=0.8V, stop DC/DC)
(Vout discharge SW)
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BD8306MUV
Typical Performance Curves - continued
5.0
Ta=85deg
4.0
3.0
Ta=25deg
2.0
Ta=-25deg
1.0
0.0
0
2
4
6
8
Power Supply Voltage : VCC [V]
Figure 17. OCP Detect Current vs Power Supply Voltage
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BD8306MUV
Application Information
1. Application Circuit [1] Input: 2.8V to 5.5V, Output: 3.3V / 1.0A, Frequency 1MHz
10µF (ceramic)
murata
GRM31CB11A106KA01
2.8V to 5.5V
12
11
10
9
4.7μH
TOKO DE3518C
13
14
15
16
8
7
6
5
R
0Ω
VCC
PVCC
VCC
PGND
LX2
LX2
ON/OFF
STB
10µF (ceramic)
murata
GRM31CB11A106KA01
VOUT
RT
3.3V/1.0A
R
RT
39kΩ
1
2
3
4
CVCC
1µF
CC
120pF
CFB
2200pF
RINV1
56kΩ
RC
4.7kΩ
RIN
V2
10kΩ
RFB4.7kΩ
Figure 18. Example of Application Circuit [1]
2. Application Circuit [2] Input: 2.8V to 5.5V, Output: 5.0V / 0.7A, Frequency 1MHz
10μF (ceramic)
murata
GRM31CB11A106KA01
2.8～5.5V
12
11
10
9
4.7μH
13
14
15
16
8
7
6
5
TOKO DE3518C
RVCC
PVCC
VCC
PGND
0Ω
LX2
ON/OFF
LX2
STB
10μF e mic)
ra
(c
murata
GRM31CB11A106KA01
VOUT
5.0V/0.7A
RT
RRT
39kΩ
1
2
3
4
CC
120pF
C 1µF
VCC
CFB
2200pF
RINV1
RC
82kΩ
4.7kΩ
RFB
4.7kΩ
RINV2
9.1kΩ
Figure 19. Example of Application Circuit [2]
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3. Sample Board Layout
Figure 20. Assembly Layer
Figure 21. Bottom Layer
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BD8306MUV
4. Reference Application Data (Unless otherwise specified, Ta = 25°C, VCC = 3.7 V)
Sample Application 1
100
90
80
70
60
50
40
30
20
10
0
3.36
3.34
3.32
3.30
3.28
3.26
3.24
VCC=4.2V
VCC=3.7V
VCC=2.8V
1
10
100
1,000
1.5
2.5
3.5
4.5
5.5
Output Current : IOUT [mA]
Power Supply Voltage : VCC [V]
Figure 22. Total Efficiency vs Output Current
(Power Conversion Efficiency)
Figure 23. Output Voltage vs Power Supply Voltage
(Output Current = 500mA)
2,000
3.36
3.34
3.32
3.30
3.28
3.26
3.24
1,800
1,600
1,400
1,200
1,000
800
600
400
200
0
1.5
2.5
3.5
4.5
5.5
1
10
100
[mA]
1000
Power Supply Voltage : VCC [V]
Output Current : I
OUT
Figure 25. Maximum Output Current vs Power Supply Voltage
Figure 24. Output Voltage vs Output Current
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BD8306MUV
20
16
12
8
100
95
90
85
80
75
70
65
60
55
50
LX2
LX1
4
0
1.5
2.5
3.5
4.5
5.5
1.50
2.50
3.50
4.50
5.50
Power Supply Voltage : VCC [V]
Power Supply Voltage : VCC [V]
Figure 26. Total Input Current vs Power Supply Voltage
(Output Current = 0mA)
Figure 27. High Side ON Duty vs Power Supply Voltage
(LX1, LX2)
VOUT [100mV/div]
IOUT [500mA/div]
STB [5.0V/div]
VOUT [1.0V/div]
Figure 28. Output Current Response
(Output Current = 100mA ⇔ 500mA
Figure 29. Soft Start Waveform
(STB: Low to High
5msec/div)
500μsec/div)
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BD8306MUV
STB [5.0V/div]
VOUT [1.0V/div]
Figure 30. Discharge Waveform
(STB: High to Low
500μsec/div)
5. Reference Application Data (Unless otherwise specified, Ta = 25°C, VCC = 3.7V)
Sample Application 2
5.10
5.05
5.00
4.95
4.90
100
90
80
70
60
50
40
30
20
10
0
VCC=4.2V
VCC=3.7V
VCC=2.8V
1.5
2.5
3.5
4.5
5.5
1
10
100
1,000
Power Supply Voltage : VCC [V]
Output Current [mA]
Figure 31. Total Efficiency vs Output Current
(Power Conversion Efficiency)
Figure 32. Output Voltage vs Power Supply Voltage
(Output Current = 500mA)
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2,000
1,800
1,600
1,400
1,200
1,000
800
5.10
5.05
5.00
4.95
600
400
200
0
4.90
1
1.5
2.5
3.5
4.5
5.5
10
tp
100
1000
Power Supply Voltage : VCC [V]
O
u
u
t
C
ur
re
n
t [
m
A
]
Figure 33. Output Voltage vs Output Current
Figure 34. Maximum Output Current vs Power Supply
Voltage
100
20
16
12
8
95
LX1
90
85
80
75
70
65
60
55
50
LX2
4
0
1.5
2.5
3.5
4.5
5.5
1.50
2.50
3.50
4.50
5.50
Power Supply Voltage : VCC [V]
Power Supply Voltage : VCC [V]
Figure 35. Total Input Current vs Power Supply Voltage
(Output Current = 0mA)
Figure 36. High Side ON Duty vs Power Supply Voltage
(LX1, LX2)
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6. Selection of Parts for Application
(1) Output Inductor
A shielded inductor that satisfies the current rating (current value, IPEAK
as shown in the drawing below) and has a low DCR (direct current
resistance component) is recommended. Inductor values affect output
ripple current greatly. Ripple current can be reduced as the inductor L
value becomes larger and the switching frequency becomes higher as
shown in the equations below.
Δ IL
Figure 37. Ripple Current
VIN VOUT
2 LVIN f
VOUT
IPEAK IOUT
A
; (in step-down mode)
(1)
IOUT
VIN VOUT
[VIN VOUT ]VOUT Dc
IPEAK
A
; (in buck-boost mode) (2)
2 DcVIN
L
VIN VOUT f
IOUT VOUT
VIN
VOUT VIN
2 LVOUT f
VIN
IPEAK
A
; (in step-up mode)
(3)
Where:
η is the Efficiency (<0.96)
Dc is the Cross Point Duty (≈0.91)
f is the Switching Frequency
L is the Inductance
As a guide, output ripple current should be set at about 20% to 50% of the maximum output current.
(Note) Current flow that exceeds the coil rating brings the coil into magnetic saturation, which may lead to lower
efficiency or output oscillation. Select an inductor with an adequate margin so that the peak current does not exceed
the rated current of the coil.
.
(2) Output Capacitor
A ceramic capacitor with a low ESR is recommended at the output in order to reduce output ripple. There must be an
adequate margin between the maximum rating and output voltage of the capacitor, taking the DC bias property into
consideration. Output ripple voltage when ceramic capacitor is used is obtained by the following equation. Setting
must be performed so that output ripple is within the allowable ripple voltage.
1
(4)
Vpp IL
IL RESR
V
2 f CO
(3) Setting of Oscillation Frequency
Oscillation frequency can be set using a resistance value connected to the RT pin (Pin 16). The oscillation frequency
is set at 1 [MHz] when RRT = 39 [KΩ], wherein frequency is inversely proportional to RT value. See Figure 38 for the
relationship between RT [KΩ] and frequency. Soft-start time changes along with oscillation frequency. See Figure 39
for the relationship between RT [KΩ] and soft-start time. Frequency is calculated by the following equation.
(5)
fOSC 39 RT1000
KHz
10,000
1,000
100
10
1
0
1
10
100
1,000
1
10
100
1,000
RT[kΩ]
RT[kΩ]
Figure 38. Oscillation Frequency vs RT Pin Resistance
Figure 39. Soft-Start Time vs RT Pin Resistance
Note: that the above example of frequency setting is just a design target value, and may differ from the actual equipment.
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(4) Output Voltage Setting
The internal reference voltage of the ERROR AMP is 0.5V. Output voltage should be obtained by referring to
Equation (6) of Figure 40.
VOUT
ERROR AMP
R1
INV
R R2
R2
0.5
1
(6)
VOUT
V
R2
VREF
0.5V
Figure 40. Setting of Feedback Resistance
(5) Determination of Phase Compensation
The condition for feedback system stability under negative feedback is as follows:
Phase delay must be 135 °or lower when gain is 1 (0 dB) (Phase margin is 45° or higher). Since DCDC converter
application is sampled according to the switching frequency, the Gain-BW of the whole system (frequency at which
gain is 0dB) must be set to be equal to or lower than 1/5 of the switching frequency.
(a) Phase delay must be 135 °or lower when gain is 1 (0 dB) (Phase margin is 45° or higher).
(b) The Gain-BW at that time (frequency when gain is 0dB) must be equal to or lower than 1/5 of the switching
frequency. For this reason, switching frequency must be increased to improve responsiveness.
One of the points to secure stability by phase compensation is to cancel the second dimensional phase delay (-180°)
generated by LC resonance of the second dimensional phase lead (i.e. put two phase leads).
Since fGBW is determined by the phase compensation capacitor attached to the error amplifier, the capacitor should be
made larger when it is necessary to reduce fGBW
.
(A)
-20dB/decade
(B)
A
0
C
GAIN
[dB]
R
FB
0°
PHASE
[degree]
-90°
Phase margin
-180°
Figure 41. General Integrator
Figure 42. Frequency Property of Integrator
Error AMP is a low-pass filter because phase compensation by RC is
performed as shown below. For DC/DC converter application, R is a
parallel feedback resistance.
1
(7)
Point
A
fp
Hz
2RCA
1
Point
B
fGBW
Hz
(8)
2RC
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Phase compensation using an output capacitor with a low ESR such as ceramic capacitor is as follows:
When an output capacitor with a low ESR (several tens of mΩ) is used at the output, the secondary phase lead (two
phase leads) must be put to cancel the secondary phase lead caused by LC. One example of phase compensation
methods is as follows:
VOUT
1
Phaselead fz1
Phaselead fz2
Hz
(9)
2R1C1
C1
R3
C2
R4
R1
R2
1
(10)
(11)
Hz
FB
2R4C2
1
Phasedelay fp1
Hz
2R3C1
Figure 43. Example of Setting of Phase Compensation
1
LC resonance frequency (in step-down mode)
(12)
Hz
VOUT VIN
2
LCout
D : ON
VOUT
1 D
LCout
LC resonance frequency (in step-up mode)
(13)
Hz
Cout :OutputCapacitor
2
For setting of phase-lead frequency (9) and (10), both of them should be put near the LC resonance
frequency (12) or (13).
When GBW frequency becomes too high due to the secondary phase lead, it may be stabilized by setting the primary
phase delay (11) to a frequency slightly higher than the LC resonance frequency by R3 to compensate it.
The fGBW of the whole system (frequency at which gain is 0 dB) which set responsiveness of the DC/DC converter can
be calculated by getting DC gain and the first dimension pole by equations below.
The responsiveness can be set high by setting the fGBW to high frequency, but the whole system would be operated as
bad oscillation if the fGBW is set too high since there are not enough phase margin.
The fGBW must be equal to or lower than 1/5 of the switching frequency.
DC gain of the DC/DC converter can be expressed as below.
A
VIN
DC gain (in step-down mode)
DC gain (in step-up mode)
DC gain (in buck-boost mode)
(14)
(15)
(16)
DC gain VREF
B
VOUT
A
VOUT
DC gain VREF
B
VOUT VIN
VIN VOUT
2DCVOUT
A
DC gain VREF
B
The DC gain of the DC/DC converter declines by 20dB/decade from the first dimension pole which is as shown below.
1
The first dimension pole
(17)
fp
Hz
R R2
1
2 A
C2
R R2
1
where:
A is the Error AMP gain=100dB=105
B is the oscillator amplification=0.4V
VREF is the reference voltage of Error AMP=0.5V
The fGBW at 0 dB under limitation of the band width of the DC gain at the first dimension pole point is as shown below.
Zero cross frequency
(18)
fGBW DC gain fp
Hz
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I/O Equivalent Circuits
FB
INV
VCC
VCC
VCC
VCC
FB
INV
VOUT, LX2, PGND
PVCC, LX1, PGND
PVCC
VOUT
LX2
LX1
VCC
VCC
PGND
PGND
STB
RT
VCC
VCC
STB
VCC
RT
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Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
7.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8.
9.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 44. Example of monolithic IC structure
13. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
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Ordering Information
M U
V
B D 8
3
0
6
-
E 2
Part Number
Package
Packaging and forming specification
E2: Embossed tape and reel
MUV: VQFN016V3030
Marking Diagram
VQFN016V3030 (TOP VIEW)
Part Number Marking
B D 8
3 0 6
LOT Number
1PIN MARK
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Physical Dimension, Tape and Reel Information
Package Name
VQFN016V3030
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BD8306MUV
Revision History
Date
26.Nov.2014
17.Feb.2015
Revision
001
002
Changes
New Release
Correction of the writing.
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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SI9122E
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