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BD8389FV-M [ROHM]

BD8389FV-M是40V高耐压的串行输入并行输出控制LED驱动器。根据3线串行数据对12ch漏极开路输出进行ON/OFF。由于是小型封装，适合省空间用途。;
BD8389FV-M
型号： BD8389FV-M
厂家： ROHM    ROHM
描述：

BD8389FV-M是40V高耐压的串行输入并行输出控制LED驱动器。根据3线串行数据对12ch漏极开路输出进行ON/OFF。由于是小型封装，适合省空间用途。

驱动 驱动器
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中文：  中文翻译
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Datasheet  
Serial-in Parallel-out LED Driver  
12ch LED Driver IC for Automotive  
with 3-line Serial Interface  
BD8389FV-M  
General Description  
Key Specifications  
The BD8389FV-M is a serial-in parallel-out controlled  
LED driver with 40V output voltage rating.  
With the input of 3-line serial data, it turns the 12ch open  
drain output on/off.  
Input Voltage Range:  
Output Voltage Range:  
DC Output Current:  
Output ON Resistance:  
Static Current:  
3.0V to 5.5V  
40V(Max)  
50mA(Max)  
6Ω(Typ)  
Due to its compact size, it is optimal for small space.  
0μA(Typ)  
Operating Temperature Range:  
-40°C to +125°C  
Features  
AEC-Q100 Qualified(Note 1)  
Open Drain Output  
Package  
SSOP-B20  
W(Typ) x D(Typ) x H(Max)  
6.50mm x 6.40mm x 1.45mm  
3-line Serial Control + Enable Signal  
Cascade Connection Compatible  
SSOP-B20 Package  
Internal 12ch Power Transistor  
Output Slew Rate 20V/μs(Typ)  
(for Low EMC Noise)  
(Note 1) Grade 1  
SSOP-B20  
Application  
For Indicator of Cluster Panel  
Typical Application Circuit  
VBAT  
VCC  
VCC  
D0  
D1  
D2  
OEN_B  
LATCH  
RST_B  
CLK  
Micro  
Computer  
D3  
D4  
SERIN  
SEROUT  
GND  
D5  
D6  
D7  
D8  
D9  
D10  
D11  
VCC  
VCC  
D0  
D1  
OEN_B  
LATCH  
RST_B  
CLK  
D2  
D3  
D4  
SERIN  
SEROUT  
GND  
D5  
D6  
D7  
D8  
D9  
D10  
D11  
VBAT: Battery  
Figure 1. Typical Application Circuit  
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays  
.
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TSZ22111 • 14 • 001  
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BD8389FV-M  
Pin Configuration  
Pin Description  
Pin No. Pin Name  
Function  
Power supply voltage input  
Serial data input  
Drain output 0  
(TOP VIEW)  
1
2
3
4
5
6
7
8
VCC  
SERIN  
D0  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
1
VCC  
GND  
CLK  
D11  
2
SERIN  
D1  
Drain output 1  
3
D0  
D2  
Drain output 2  
4
D1  
D10  
D3  
Drain output 3  
D4  
Drain output 4  
5
D2  
D9  
D5  
Drain output 5  
Reset invert input  
(Low: Shift register data 0)  
Output enable  
(High: Output OFF)  
6
D3  
D8  
9
RST_B  
OEN_B  
7
D4  
D7  
10  
11  
12  
8
D5  
D6  
SEROUT Serial data output  
Latch signal input  
(High: Data latch)  
9
RST_B  
LATCH  
SEROUT  
LATCH  
10  
13  
14  
15  
16  
17  
18  
19  
20  
D6  
D7  
Drain output 6  
Drain output 7  
Drain output 8  
Drain output 9  
Drain output 10  
Drain output 11  
Clock input  
OEN_B  
D8  
Figure 2. Pin Configuration  
D9  
D10  
D11  
CLK  
GND  
GND  
Block Diagram  
VCC  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
D8  
D9  
D10  
D11  
SERIN  
CLK  
SEROUT  
LATCH  
RST_B  
OEN_B  
GND  
Figure 3. Block Diagram  
2/18  
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TSZ22111 • 15 • 001  
BD8389FV-M  
Description of Function  
If there is no description, please refer as typical value.  
1. Serial Communication  
The serial I/F is composed of a shift register which changes the CLK and SERIN serial signals to parallel signals, and a  
register to store those signals with a LATCH signal. The registers are reset by applying a voltage below VTL to the RST_B  
pin, and D11 to D0 become open. To prevent erroneous LED lighting, please apply voltage below VTL to RST_B during  
start-up.  
CLK  
12bit  
12bit  
Shift  
Register  
Driver  
SERIN  
LATCH  
Register  
Figure 4. Block Diagram of Serial Communication  
(1) Serial Communication Timing  
The 12bit serial data input from the SERIN pin is taken into the shift register by the rising edge of the CLK signal,  
and is recorded in the register by the rising edge of the LATCH signal. The recorded data is valid until the next rising  
edge of the LATCH signal.  
(2) Serial Communication Data  
The serial data input configuration of the SERIN pin is shown below:  
First →  
d11 d10 d9 d8  
→ Last  
d7 d6 d5 d4 d3 d2 d1 d0  
Data  
Data  
Output  
Condition  
Pin  
d11 d10 d9 d8 d7 d6 d5 d4 d3 d2 d1 d0  
ON  
OFF  
ON  
OFF  
ON  
OFF  
ON  
OFF  
1
0
*
*
*
*
*
*
*
*
1
0
*
*
*
*
*
*
*
*
*
*
*
*
*
1
0
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
D11  
D10  
D9  
*
1
0
*
D8  
*
…
…
…
…
…
…
…
…
…
…
…
…
…
…
ON  
OFF  
ON  
OFF  
ON  
OFF  
ON  
OFF  
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
1
0
*
*
*
*
*
*
*
*
1
0
*
*
*
*
*
*
*
*
*
*
*
*
*
1
0
D3  
D2  
D1  
D0  
*
1
0
*
*
* Indicate don’t care.  
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BD8389FV-M  
Description of Function - continued  
(3) Enable Signal  
By applying voltage VTH or more to the OEN_B pin, D11 to D0 become open forcibly.  
All output terminals become PWM operation by having the PWM signal to the OEN_B pin at the same time.  
VTH  
L
H
OEN_B  
(Input)  
VTL  
VBAT  
VOL  
LED OFF  
D11 to D0  
(Output)  
LED ON  
LED ON  
ON  
ILED  
LED OFF  
OFF  
Figure 5. PWM Dimming Control  
(4) SEROUT  
A cascade connection can be made(connecting at least 2 or more IC’s in serial). Serial signal input from SERIN is  
transferred into the receiver IC by the falling edge of the CLK signal. Since this functionality gives enough margins  
for the setup time prior to the rising edge of the CLK signal on the receiver IC(using the exact same CLK signal of  
the sender IC), the application reliability can be improved as cascade connection functionality.  
LATCH  
SERIN  
d11 d10  
d9  
d8  
d7  
d6  
d5  
d4  
d3  
d2  
d1  
d0  
1
2
3
4
5
6
7
8
9
10  
11  
12  
CLK  
d11  
SEROUT  
Figure 6. SEROUT Output Signal  
2. Cascade Connection  
As an application, BD8389FV-M can turn on 13 or more LED lights. By making a cascade connection between 2 ICs, the  
LED application of up to 24 lights can be constructed. In this case, connect the SEROUT pin of the sender IC and the  
SERIN pin of the receiver IC. When send 24bit signal to the sender IC, the serial data is sent to the receiver IC from the  
SEROUT pin of the sender IC. In addition, it is possible to construct 3 or more applications.  
Receiver IC  
Sender IC  
LATCH  
SERIN  
CLK  
d23 d22 d21  
d14  
d13 d12 d11 d10  
d9  
d2  
d1  
d0  
10  
1
2
3
11  
12  
13  
14  
15  
22  
23  
24  
Figure 7. Cascade Connection  
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4/18  
TSZ22111 • 15 • 001  
BD8389FV-M  
Absolute Maximum Ratings(Ta=-40°C to +125°C)  
Parameter  
Symbol  
VCC  
Rating  
Unit  
V
Power Supply Voltage  
-0.3 to +7  
VD0, VD1,  
VD2, VD3,  
VD4, VD5,  
VD6, VD7,  
VD8, VD9,  
VD10, VD11  
Output Pin Voltage  
(D0, D1, D2, D3, D4, D5, D6, D7, D8, D9, D10, D11)  
-0.3 to +40  
V
V
VSERIN  
VRST_B  
VCLK  
VOEN_B  
,
,
SERIN, RST_B, CLK, OEN_B, LATCH  
Pin Voltage  
,
-0.3 to +VCC  
,
VLATCH  
SEROUT Pin Voltage  
Power Dissipation(Note 1)  
VSEROUT  
-0.3 to +VCC  
1083  
V
Pd  
mW  
°C  
Storage Temperature  
Tstg  
-55 to +150  
50  
DC Output Current  
Pulse Output Current(Note 2)  
IomaxD  
IomaxP  
Tjmax  
mA  
mA  
°C  
150  
Maximum Junction Temperature  
150  
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit  
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is  
operated over the absolute maximum ratings.  
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the  
properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the  
maximum junction temperature rating.  
(Note 1) Pd decreased at 7.5mW/℃ for temperatures above Ta=25℃, mounted on 70x70x1.6mm Glass-epoxy PCB.  
(Note 2) Do not however exceed Pd. Time to impress ≦ 200msec.  
Thermal Resistance(Note 1)  
Thermal Resistance (Typ)  
Parameter  
Symbol  
Unit  
1s(Note 3)  
2s2p(Note 4)  
SSOP-B20  
Junction to Ambient  
Junction to Top Characterization Parameter(Note 2)  
θJA  
115.4  
10  
57.3  
8
°C/W  
°C/W  
ΨJT  
(Note 1) Based on JESD51-2A(Still-Air),  
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside  
surface of the component package.  
(Note 3) Using a PCB board based on JESD51-3.  
Layer Number of  
Measurement Board  
Material  
FR-4  
Board Size  
Single  
114.3mm x 76.2mm x 1.57mmt  
Top  
Copper Pattern  
Thickness  
Footprints and Traces  
70μm  
(Note 4) Using a PCB board based on JESD51-7.  
Layer Number of  
Material  
Board Size  
114.3mm x 76.2mm x 1.6mmt  
2 Internal Layers  
Measurement Board  
4 Layers  
FR-4  
Top  
Bottom  
Copper Pattern  
74.2mm x 74.2mm  
Copper Pattern  
Thickness  
Copper Pattern  
Thickness  
Thickness  
Footprints and Traces  
70μm  
74.2mm x 74.2mm  
35μm  
70μm  
Recommended Operating Condition  
Parameter  
Symbol  
Min  
Typ  
Max  
Unit  
Power Supply Voltage  
Operating Temperature  
VCC  
Topr  
3.0  
-40  
-
-
5.5  
V
+125  
°C  
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TSZ22111 • 15 • 001  
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26.Sep.2018 Rev.003  
5/18  
BD8389FV-M  
Electrical Characteristics(Unless otherwise specified Ta=-40°C to +125°C, VCC=3.0V to 5.5V)  
Limit  
Parameter  
Output D0 to D11  
Symbol  
Unit  
Condition  
Min  
Typ  
Max  
ON Resistance 1(Note 1)  
ON Resistance 2(Note 1)  
Output Leakage Current(Note 2)  
Logic Input  
RON1  
RON2  
IDL  
-
-
-
6
9
-
12  
18  
Ω
Ω
IDn=20mA, VCC=4.5V to 5.5V  
IDn=20mA, VCC=3.0V to 4.5V  
VDn=39V  
0.3  
μA  
VCC  
x 0.7  
Upper Limit Threshold Voltage  
Bottom Limit Threshold Voltage  
Serial Clock Frequency  
Input Leakage Current L  
Input Leakage Current H  
WHOLE  
VTH  
VTL  
-
-
-
V
V
VCC  
x 0.2  
-
-
fCLK  
IINLL  
IINLH  
-
1.25  
MHz  
μA  
μA  
-5  
-
0
0
-
VTL=0V  
VTH=5V  
5
Serial Data Input,  
VCC=5V, fCLK=500kHz,  
VTH=VCC, VTL=0V,  
SEROUT=OPEN  
Circuit Current  
ICC  
-
-
0.05  
0
1
mA  
Static Current  
ISTN  
50  
μA  
SEROUT=OPEN  
SEROUT  
Output Voltage High1(Note 3)  
Output Voltage Low1(Note 3)  
Output Voltage High2(Note 3)  
Output Voltage Low2(Note 3)  
VOH1  
VOL1  
VOH2  
VOL2  
4.6  
-
4.8  
0.2  
3.0  
0.3  
-
V
V
V
V
VCC=5V, ISO=-4mA  
VCC=5V, ISO=4mA  
VCC=3.3V, ISO=-4mA  
VCC=3.3V, ISO=4mA  
0.4  
-
2.7  
-
0.6  
(Note 1) IDn: Current flowing to the output Dn pin. (n: 0 to 11)  
(Note 2) VDn: Output Dn pin voltage. (n: 0 to 11)  
(Note 3) ISO: Current flowing to the SEROUT pin.  
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TSZ22111 • 15 • 001  
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26.Sep.2018 Rev.003  
6/18  
BD8389FV-M  
Typical Performance Curves  
50  
50  
40  
30  
20  
10  
0
3.0V  
3.6V  
5.0V  
3.3V  
4.5V  
5.5V  
-40°C  
40  
30  
20  
10  
0
+25°C  
+125°C  
-40  
-15  
10  
35  
60  
85  
110  
0
1
2
3
4
5
Ambient Temperature : Ta [ꢀC]  
Power Supply Voltage : VCC [V]  
Figure 8. Circuit Current vs Power Supply Voltage  
Figure 9. Circuit Current vs Ambient Temperature  
14  
12  
10  
8
14  
12  
10  
8
6
6
4
4
-40°C  
3.0V  
3.6V  
5.0V  
3.3V  
4.5V  
5.5V  
+25°C  
2
2
0
+125°C  
0
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
-40  
-15  
10  
35  
60  
85  
110  
Power Supply Voltage : VCC [V]  
Ambient Temperature : Ta [ꢀC]  
Figure 10. Output On Resistance vs  
Power Supply Voltage  
(@IDn=20mA)  
Figure 11. Output On Resistance vs Ambient Temperature  
(@IDn=20mA)  
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BD8389FV-M  
Typical Performance Curves - continued  
6.0  
5.5  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
400  
350  
300  
250  
200  
150  
100  
-40°C  
+25°C  
+125°C  
3.0V  
3.6V  
5.0V  
3.3V  
4.5V  
5.5V  
50  
0
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
10  
20  
30  
40  
50  
Input Current : IDn [mA]  
Supply Voltage : VCC [V]  
Figure 12. Output Voltage vs Input Current  
Figure 13. Output Voltage vs Supply Voltage  
(@ISO=-4mA)  
0.35  
0.30  
0.25  
0.20  
0.15  
6.0  
5.5  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
0.10  
-40°C  
+25°C  
0.05  
3.0V  
3.6V  
5.0V  
3.3V  
4.5V  
5.5V  
+125°C  
0.00  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
-40  
-10  
20  
50  
80  
110  
Supply Voltage : VCC [V]  
Ambient Temperature : Ta [ꢀC]  
Figure 14. Output Voltage vs Ambient Temperature  
(@ISO=-4mA)  
Figure 15. Output Voltage vs Supply Voltage  
(@ISO=4mA)  
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TSZ02201-0T2T0B100260-1-2  
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8/18  
TSZ22111 • 15 • 001  
BD8389FV-M  
Typical Performance Curves - continued  
0.35  
0.30  
0.25  
0.20  
0.15  
0.10  
3.0V  
3.6V  
5V  
3.3V  
4.5V  
5.5V  
0.05  
0.00  
-40  
-15  
10  
35  
60  
85  
110  
Ambient Temperature : Ta [ꢀC]  
Figure 16. Output Voltage vs Ambient Temperature  
(@ISO=4mA)  
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9/18  
TSZ22111 • 15 • 001  
BD8389FV-M  
Input Signal’s Timing Chart  
tCK  
50%  
CLK  
tCKH  
tCKL  
tSEST  
tSEHD  
50%  
SERIN  
tLADZ  
tSEW  
tLAH  
50%  
LATCH  
Figure 17. Timing Chart of Input Signal  
Input Signal’s Timing Rule (Ta=-40°C to +125°C, VCC=3.0V to 5.5V)  
Parameter  
Symbol  
tCK  
Min  
800  
380  
380  
780  
150  
150  
380  
200  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
CLK Period  
CLK High Pulse Width  
tCKH  
CLK Low Pulse Width  
tCKL  
SERIN High and Low Pulse Width  
SERIN Setup Time  
tSEW  
tSEST  
tSEHD  
tLAH  
SERIN Hold Time  
LATCH High Pulse Time  
D0 to D11 Output Terminal Setup Time  
tLADZ  
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TSZ22111 • 15 • 001  
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26.Sep.2018 Rev.003  
10/18  
BD8389FV-M  
Output Signal’s Timing Chart  
50%  
OEN_B  
tDOENH  
tDOENL  
90%  
50%  
OUTPUT  
10%  
(D11 to D0)  
SRRISE  
SRFALL  
50%  
tDLAH  
LATCH  
50%  
OUTPUT  
(D11 to D0)  
CLK  
50%  
tDSOH  
tDSOL  
50%  
SEROUT  
Figure 18. Timing Chart of Output Signal  
Output Signal’s Delay Time (Ta=-40°C to +125°C, VCC=3.0V to 5.5V)  
Parameter  
Symbol  
tDOENH  
tDOENL  
tDLAH  
Min  
Typ  
Max  
3000  
2000  
3000  
350  
350  
-
Unit  
ns  
Condition  
OEN_B Switching Time (Low→High)  
OEN_B Switching Time (High→Low)  
LATCH Switching Delay Time  
-
-
-
-
-
-
-
-
-
ns  
-
ns  
SEROUT Propagation Delay Time  
tDSOH  
-
ns  
(Low→High)  
SEROUT Propagation Delay Time  
tDSOL  
-
ns  
(High→Low)  
Ta=25°C, VCC=5V,  
RL=500Ω, VBAT=10V  
Output Rising Slew Rate(Note 1)  
Output Falling Slew Rate(Note 1)  
SRRISE  
SRFALL  
20  
20  
V/μs  
V/μs  
Ta=25°C, VCC=5V,  
RL=500Ω, VBAT=10V  
-
(Note 1) Please refer to the application circuit example on P.12 for measurement conditions. However, LED load is not used and it is shorted.  
www.rohm.com  
TSZ02201-0T2T0B100260-1-2  
26.Sep.2018 Rev.003  
© 2017 ROHM Co., Ltd. All rights reserved.  
11/18  
TSZ22111 • 15 • 001  
BD8389FV-M  
Application Example  
CVBAT  
VBAT  
VCC  
CVCC1  
RL  
VCC  
D0  
D1  
D2  
OEN_B  
LATCH  
RST_B  
CLK  
Micro  
Computer  
D3  
D4  
SERIN  
SEROUT  
GND  
D5  
D6  
D7  
D8  
D9  
D10  
D11  
VCC  
RL  
CVCC2  
VCC  
D0  
D1  
OEN_B  
LATCH  
RST_B  
CLK  
D2  
D3  
D4  
SERI N  
SEROUT  
GND  
D5  
D6  
D7  
D8  
D9  
D10  
D11  
Figure 19. Application Example  
Component Name  
Component Value  
0.1μF  
Product Name  
Manufacturer  
murata  
CVCC1  
CVCC2  
CVBAT  
RL  
GCM155R11A104KA01  
GCM155R11A104KA01  
GCM32ER71H475KA40  
ESR10EZPJ621  
0.1μF  
murata  
4.7μF  
murata  
620Ω  
Rohm  
www.rohm.com  
TSZ02201-0T2T0B100260-1-2  
26.Sep.2018 Rev.003  
© 2017 ROHM Co., Ltd. All rights reserved.  
12/18  
TSZ22111 • 15 • 001  
BD8389FV-M  
I/O Equivalence Circuit  
3. D0  
7. D4  
15. D8  
4. D1  
8. D5  
16. D9  
5. D2  
13. D6  
17. D10  
6. D3  
14. D7  
18. D11  
2. SERIN  
12. LATCH  
9. RST_B  
19. CLK  
10. OEN_B  
VCC  
11. SEROUT  
VCC  
www.rohm.com  
TSZ02201-0T2T0B100260-1-2  
26.Sep.2018 Rev.003  
© 2017 ROHM Co., Ltd. All rights reserved.  
13/18  
TSZ22111 • 15 • 001  
BD8389FV-M  
Operational Notes  
1. Reverse Connection of Power Supply  
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when  
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power  
supply pins.  
2. Power Supply Lines  
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at  
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic  
capacitors.  
3. Ground Voltage  
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.  
4. Ground Wiring Pattern  
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but  
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal  
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations  
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.  
5. Recommended Operating Conditions  
The function and operation of the IC are guaranteed within the range specified by the recommended operating  
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical  
characteristics.  
6. Inrush Current  
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow  
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power  
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and  
routing of connections.  
7. Operation Under Strong Electromagnetic Field  
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.  
8. Testing on Application Boards  
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may  
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply  
should always be turned off completely before connecting or removing it from the test setup during the inspection  
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during  
transport and storage.  
9. Inter-pin Short and Mounting Errors  
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in  
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.  
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and  
unintentional solder bridge deposited in between pins during assembly to name a few.  
10. Unused Input Pins  
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and  
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small  
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and  
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the  
power supply or ground line.  
www.rohm.com  
TSZ02201-0T2T0B100260-1-2  
© 2017 ROHM Co., Ltd. All rights reserved.  
14/18  
TSZ22111 • 15 • 001  
26.Sep.2018 Rev.003  
BD8389FV-M  
Operational Notes - continued  
11. Regarding the Input Pin of the IC  
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them  
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a  
parasitic diode or transistor. For example (refer to figure below):  
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.  
When GND > Pin B, the P-N junction operates as a parasitic transistor.  
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual  
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to  
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be  
avoided.  
Resistor  
Transistor (NPN)  
Pin A  
Pin B  
Pin B  
B
E
C
Pin A  
B
C
E
P
P+  
P+  
N
P+  
P
P+  
N
N
N
N
N
N
N
Parasitic  
Elements  
Parasitic  
Elements  
P Substrate  
GND GND  
P Substrate  
GND  
GND  
Parasitic  
Elements  
Parasitic  
Elements  
N Region  
close-by  
Figure 20. Example of monolithic IC structure  
12. Ceramic Capacitor  
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with  
temperature and the decrease in nominal capacitance due to DC bias and others.  
13. Area of Safe Operation (ASO)  
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within  
the Area of Safe Operation (ASO).  
www.rohm.com  
TSZ02201-0T2T0B100260-1-2  
26.Sep.2018 Rev.003  
© 2017 ROHM Co., Ltd. All rights reserved.  
15/18  
TSZ22111 • 15 • 001  
BD8389FV-M  
Ordering Information  
B D 8  
3
8
9
F
V
-
M E 2  
Part Number  
Package  
FV: SSOP-B20  
Product Rank  
M: for Automotive  
Packaging and forming specification  
E2: Embossed tape and reel  
(SSOP-B20)  
Marking Diagram  
SSOP-B20(TOP VIEW)  
Part Number Marking  
LOT Number  
D 8 3 8 9 F V  
1PIN MARK  
www.rohm.com  
TSZ02201-0T2T0B100260-1-2  
26.Sep.2018 Rev.003  
© 2017 ROHM Co., Ltd. All rights reserved.  
16/18  
TSZ22111 • 15 • 001  
BD8389FV-M  
Physical Dimension, Tape and Reel Information  
Package Name  
SSOP-B20  
www.rohm.com  
© 2017 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0T2T0B100260-1-2  
26.Sep.2018 Rev.003  
17/18  
BD8389FV-M  
Revision History  
Date  
Rev.  
001  
Changes  
16.Jan.2018  
New release of specification.  
P.5  
○Absolute Maximum Ratings  
Add Power Dissipation、Pulse output current item  
And symbol of DC output current item change for additional Pulse output current item.  
15.Jun.2018  
002  
003  
○Thermal Resistance  
Modify that Junction to Top Characterization Parameter.  
P.16  
○Marking Diagram  
Modify Marking Diagram  
26.Sep.2018  
www.rohm.com  
TSZ02201-0T2T0B100260-1-2  
© 2017 ROHM Co., Ltd. All rights reserved.  
18/18  
TSZ22111 • 15 • 001  
26.Sep.2018 Rev.003  
Notice  
Precaution on using ROHM Products  
(Note 1)  
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment  
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,  
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales  
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any  
ROHM’s Products for Specific Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASSⅢ  
CLASSⅣ  
CLASSⅡb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.  
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the  
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our  
Products under any special or extraordinary environments or conditions (as exemplified below), your independent  
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in  
the range that does not exceed the maximum junction temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must  
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,  
please consult with the ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice-PAA-E  
Rev.003  
© 2015 ROHM Co., Ltd. All rights reserved.  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign  
trade act, please consult with ROHM in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data.  
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the  
Products with other articles such as components, circuits, systems or external equipment (including software).  
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM  
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to  
manufacture or sell products containing the Products, subject to the terms and conditions herein.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice-PAA-E  
Rev.003  
© 2015 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.  
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this document is current as of the issuing date and subject to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales  
representative.  
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
Notice – WE  
Rev.001  
© 2015 ROHM Co., Ltd. All rights reserved.  

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