BD83A04EFV-M [ROHM]

该IC是一款适用于LCD背光的白色LED驱动器,内置升压用的MOS和LED驱动用的4通道电流驱动器,非常适合用来驱动高亮度LED。由于LED引脚支持的最大电压为50V,因此适合驱动中型LCD显示器。可通过PWM信号进行调光,最高可设置为20,000:1@100Hz。该产品还支持模拟调光,通过与PWM调光相组合,可以支持更高亮度范围。可控制支持升压应用的DC-DC转换器,工作输入电压范围为4.5V ~ 48V。;
BD83A04EFV-M
型号: BD83A04EFV-M
厂家: ROHM    ROHM
描述:

该IC是一款适用于LCD背光的白色LED驱动器,内置升压用的MOS和LED驱动用的4通道电流驱动器,非常适合用来驱动高亮度LED。由于LED引脚支持的最大电压为50V,因此适合驱动中型LCD显示器。可通过PWM信号进行调光,最高可设置为20,000:1@100Hz。该产品还支持模拟调光,通过与PWM调光相组合,可以支持更高亮度范围。可控制支持升压应用的DC-DC转换器,工作输入电压范围为4.5V ~ 48V。

驱动 DC-DC转换器 CD 驱动器 显示器
文件: 总49页 (文件大小:1738K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Datasheet  
4 ch Current Driver Integrated, Built-in MOS for Boost, Boost DC/DC Converter  
White LED Driver for Automotive  
BD83A04EFV-M  
General Description  
Key Specifications  
This IC is a white LED driver for LCD backlight.  
It has MOS for boost and 4 ch current drivers for LED drive,  
making it ideal for high brightness LED drive. LED pin  
maximum voltage is 50 V, making it suitable for driving  
medium LCD panels.  
The dimming is controlled by the PWM signal and can be  
set up to 20,000: 1@100 Hz. It also supports analog  
dimming and can accommodate even higher brightness  
ranges by combining with PWM dimming. DC/DC  
converters can be controlled for boost applications, and the  
input operating voltage range is 4.5 V to 48 V.  
Input Operating Voltage Range:  
Output LED Current Absolute Accuracy:  
4.5 V to 48 V  
±5.0 %@80.1 mA  
Ta = -40 °C to +125 °C  
200 kHz to 2420 kHz  
-40 °C to +125 °C  
120 mA/ ch  
DC/DC Oscillation Frequency:  
Operating Temperature:  
LED Maximum Current:  
LED Maximum Dimming Ratio:  
LED1 to LED4 Pin Maximum Voltage:  
20,000: 1@100 Hz  
50 V  
Package  
HTSSOP-B24  
W (Typ) x D (Typ) x H (Max)  
7.8 mm x 7.6 mm x 1.0 mm  
Features  
AEC-Q100 Qualified(Note 1)  
Functional Safety Supportive Automotive Products  
Built-in 4 ch Current Driver for LED Drive  
Built-in MOS for Boost  
Current Mode Boost DC/DC Converter  
Load Switch (M1) Control Pin  
PWM Dimming  
(20,000: 1@100 Hz, 100 Hz to 25 kHz)  
Spread Spectrum Function  
Applications  
Automotive CID (Center Information Display) Panel  
DC/DC Converter Oscillation Frequency External  
Synchronization Function  
Navigation  
Cluster Panel  
LSI Protect Functions (UVLO, OVP, TSD, OCP)  
LED Anode/Cathode Short Circuit Protection Function  
LED Open/Short Protection Function  
(Note 1) Grade 1  
HUD (Head Up Display)  
Other Small and Medium Sized LCD Panel for  
Automotive  
Typical Application Circuit  
VCC  
CVCC  
RCSH  
VREG  
1
2
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
REG  
GND  
EN  
VCC  
CSH  
CREG  
M1  
EN  
PWM  
3
LDSW  
N.C.  
D1  
CIN  
L1  
4
PWM  
SYNC  
RT  
D2  
VOUT  
SYNC  
5
SW  
RRT  
COUT  
6
ROVP2  
PGND  
OVP  
CCOMP RCOMP  
EXP-PAD  
7
COMP  
ADIM  
ISET  
LGND  
LED1  
LED2  
RFAIL  
VREG  
8
VREG  
VFAIL  
ROVP1  
FAIL  
RISET  
9
PLSET  
N.C.  
CPLSET  
10  
11  
12  
LED4  
LED3  
Figure 1. Boost Application Circuit Diagram  
Product structure : Silicon integrated circuit This product has no designed protection against radioactive rays.  
This product is protected by U.S. Patent No.7,235,954, No.7,541,785 and No.7,944,189.  
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BD83A04EFV-M  
Contents  
General Description........................................................................................................................................................................1  
Features..........................................................................................................................................................................................1  
Key Specifications ..........................................................................................................................................................................1  
Package..........................................................................................................................................................................................1  
Applications ....................................................................................................................................................................................1  
Typical Application Circuit ...............................................................................................................................................................1  
Contents .........................................................................................................................................................................................2  
Pin Configuration ............................................................................................................................................................................3  
Pin Descriptions..............................................................................................................................................................................3  
Block Diagram ................................................................................................................................................................................5  
Description of Blocks ......................................................................................................................................................................6  
Absolute Maximum Ratings ..........................................................................................................................................................10  
Thermal Resistance......................................................................................................................................................................10  
Recommended Operating Conditions...........................................................................................................................................11  
Operating Conditions (External Constant Range).........................................................................................................................11  
Electrical Characteristics...............................................................................................................................................................12  
Typical Performance Curves.........................................................................................................................................................15  
Function Descriptions ...................................................................................................................................................................17  
PCB Application Circuit Diagram ..................................................................................................................................................28  
List of External Components.........................................................................................................................................................29  
Application Components Selection Method ..................................................................................................................................31  
Precautions for PCB Layout..........................................................................................................................................................37  
Power Consumption Calculation Example....................................................................................................................................38  
Application Circuit Example ..........................................................................................................................................................40  
I/O Equivalence Circuit .................................................................................................................................................................41  
Operational Notes.........................................................................................................................................................................42  
Ordering Information.....................................................................................................................................................................44  
Marking Diagram ..........................................................................................................................................................................44  
Physical Dimension and Packing Information...............................................................................................................................45  
Revision History............................................................................................................................................................................46  
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BD83A04EFV-M  
Pin Configuration  
(TOP VIEW)  
1
2
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
REG  
GND  
EN  
VCC  
CSH  
3
LDSW  
N.C.  
4
PWM  
SYNC  
RT  
5
SW  
6
PGND  
OVP  
FAIL  
EXP-PAD  
7
COMP  
ADIM  
ISET  
LGND  
LED1  
LED2  
8
9
PLSET  
N.C.  
10  
11  
12  
LED4  
LED3  
Figure 2. Pin Configuration  
Pin Descriptions  
Signal Type  
Pin No. Pin Name  
Function  
(Note 1)  
Internal reference voltage: Used as the reference voltage for the internal circuit. 5 V (Typ) is  
generated and output by setting the EN pin to High. Connect a capacitance of 2.2 μF for  
phase compensation.  
1
REG  
A
Small signal ground: Use this for the ground of external components connected to the REG,  
RT, COMP, ADIM, ISET, PLSET, OVP, and VCC pins.  
2
3
4
GND  
EN  
A
I
Enable input: The EN pin is turned High to activate the internal circuit. The internal circuit  
stops and the standby state is set by setting to Low.  
PWM dimming signal: The LED current can be controlled according to On Duty of the  
input PWM signal.  
PWM  
I
External synchronization frequency input / SSCG setting: The internal oscillation  
frequency can be externally synchronized by inputting an external clock signal to the SYNC  
pin before the Self Diagnosis is completed. When using spread spectrum mode (SSCG),  
short the SYNC pin and the REG pin beforehand.  
5
6
SYNC  
RT  
I
Resistor connection for oscillation frequency setting: The oscillation frequency (fOSC) of  
DC/DC converter can be set by connecting a resistor (RRT) between the RT pin and the GND  
pin.  
A
Phase compensating capacitor connection: The reference voltage and LED pin voltage  
generated by REF Voltage block are compared and output by Error AMP. Connect a filter for  
phase compensation.  
7
8
COMP  
ADIM  
A
A
DC dimming setting: ISET pin voltage can be changed according to the voltage input to the  
ADIM pin. When using only PWM dimming, short the ADIM pin with the REG pin.  
Resistor connection for LED current setting: LED current (ILED) can be set by connecting a  
resistor (RISET) between the ISET pin and the GND pin.  
9
ISET  
LGND  
LED1  
A
P
P
10  
11  
Large current ground 1: GND of the current driver (the LED1, LED2, LED3, and LED4 pins).  
LED cathode connection 1: Open drain output of the current driver ch 1 for LED drive.  
Connect to the LED cathode.  
LED cathode connection 2: Open drain output of the current driver ch 2 for LED drive.  
Connect to the LED cathode.  
12  
13  
14  
LED2  
LED3  
LED4  
P
P
P
LED cathode connection 3: Open drain output of the current driver ch 3 for LED drive.  
Connect to the LED cathode.  
LED cathode connection 4: Open drain output of the current driver ch 4 for LED drive.  
Connect to the LED cathode.  
(Note 1) A: Sensitive signal such as detect and reference, I: Input signal from other units, P: Large current signal susceptible to impedance, including transient  
current.  
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Pin Descriptions – continued  
Signal Type  
Pin No. Pin Name  
Function  
(Note 1)  
15  
N.C.  
Not connected internally.  
-
Switching pulse number setting: Pulse addition function is provided to stabilize DC/DC  
converter output voltage even when PWM Duty is low. The number of switching pulses to be  
added can be set by the capacitance value connected between the PLSET pin and the GND  
pin.  
16  
PLSET  
A
Error output flag: Outputs the status of protective operation from the FAIL pin. Since this pin  
is an open drain output, use a resistor to pull it up to the REG pin, etc.  
17  
18  
FAIL  
OVP  
O
A
Overvoltage protection and short circuit protection detection input: When OVP pin  
voltage rises to 1.21 V or more, the overvoltage protection (OVP) is activated, and DC/DC  
converters are switched OFF. If OVP pin voltage is 0.1 V or less for 3.56 ms, Short Circuit  
Protection (SCP) is activated, and both DC/DC converter and the current driver are turned  
OFF.  
19  
20  
21  
PGND  
SW  
P
P
-
Large current ground 2: GND of DC/DC converter. Use it for COUT ground.  
FET drain signal for boost: Switching signal output of DC/DC converter. Connect the SW  
pin to the node between the inductor and the rectifier diode.  
N.C.  
Not connected internally.  
Output for driving the load switch gate: The signal output for driving the gate of the load  
switch. When the input overcurrent protection is activated, the load switch is turned OFF as  
LDSW pin voltage = VCC pin voltage.  
22  
23  
LDSW  
CSH  
P
A
Input current detection input: The input current is converted to voltage by the input current  
detection resistor (RCSH) connected between the VCC-CSH pin and detected by the CSH pin.  
Turns the load switch OFF when the input overcurrent protection is activated.  
Power supply voltage input: The input operating voltage range is 4.5 V to 48 V, but when  
the IC is started, start it with VCC ≥ 5.5 V. The decoupling capacitor (CVCC) between the VCC  
pin and the GND pin should be as close to the IC pin as possible.  
24  
-
VCC  
P
-
EXP-  
PAD  
The EXP-PAD should be connected to the board ground.  
(Note 1) A: Sensitive signal such as detect and reference, I: Input signal from other units, O: Output signal to other units, P: Large current signal susceptible to  
impedance, including transient current.  
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Block Diagram  
VCC  
CSH  
LDSW  
EN  
LDSW  
Driver  
VREF  
PROTECT  
REG  
PLSET  
RT  
Low side FET /  
Pre Driver  
PROTECT  
Additional  
Pulse  
DC/DC  
Control  
LOGIC  
SW  
REG  
OSC  
SLOPE  
+
SSCG  
PWM  
COMP  
PGND  
SYNC  
COMP  
Error  
AMP  
+
LED1  
LED2  
LED3  
LED4  
Soft  
Start  
LDSW  
Driver  
Minimum  
Channel  
Selector  
PROTECT  
UVLO  
DC/DC  
Control  
LOGIC  
ꢀꢀꢀꢀꢀꢀꢀFAIL  
TSD  
SCP  
OCPH  
ISET SCP  
FAIL  
OCPL  
OVP  
OPEN Det  
SHORT Det  
OVP  
Current  
Driver  
Internal  
CLK  
REF  
Voltage  
Dimming  
Control  
PWM  
VCC  
ADIM  
ISET  
ISET  
CH1 CH2 CH3 CH4  
Current Driver  
GND  
LGND  
Figure 3. Internal Block Diagram  
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BD83A04EFV-M  
Description of Blocks  
Unless otherwise stated, the value in the sentence is the typical value.  
1 VREF  
Internal reference voltage circuit. By setting the EN pin to High, 5 V is generated and output to the REG pin. REG voltage  
is used as the power supply for the internal circuit. Also, this is used to fix each input pin to High voltage outside the IC.  
Connect REG capacitance (CREG = 2.2 μF) to the REG pin for the phase compensation. Note that if CREG is not connected,  
unstable operation such as oscillation will occur.  
2 LDSW Driver  
Input overcurrent protection circuit. If the voltage between the VCC-CSH pin is 0.1 V or more and continues for 10 μs or  
more, the input overcurrent protection is activated, and the load switch (M1) is turned OFF as LDSW pin voltage = VCC  
pin voltage. Then, after 3.56 ms elapses, the load switch is turned ON. At this time, if the voltage between the VCC-CSH  
pin is 0.1 V or more, the load switch is turned OFF again. If the voltage between the VCC-CSH pin is less than 0.1 V, Self  
Diagnosis is performed and restarted. When the input overcurrent protection is detected, the FAIL pin goes Low. The VCC-  
LDSW pin is connected by a 3 MΩ resistor inside the IC. Do not connect a resistor between the VCC-LDSW pin because  
connecting a resistor between the VCC-LDSW pin outside the IC may prevent the load switch from being turned ON.  
When the VCC voltage is turned ON setting the EN pin to Low, the voltage between the VCC-LDSW pins may open  
momentarily and an inrush current may flow depending on the VCC startup speed and the type of load switch used. Be  
sure to check with the actual application.  
3 OSC (Oscillator)  
Oscillation frequency generator. The oscillation frequency (fOSC) of DC/DC converter can be set by connecting a resistor  
for oscillation frequency setting (RRT) between the RT pin and ground. In addition, the oscillation frequency of DC/DC  
converter can be externally synchronized by inputting the external synchronization frequency (fSYNC) to the SYNC pin.  
4 SSCG (Spread Spectrum Clock Generator)  
Spread spectrum circuit. The spread spectrum function (SSCG) is activated by shorting the SYNC pin and the REG pin.  
Noise peaks can be reduced by periodically changing the oscillation frequency by SSCG. The fluctuation range of the  
frequency due to SSCG is from 100 % to 92 % of the set oscillation frequency. The oscillation frequency fluctuation period  
is 2.3 kHz.  
5 SLOPE  
This circuit generates a saw wave that serves as the source of the switching pulse of DC/DC converter. SLOPE output  
signal and COMP pin voltage are compared, and a switching pulse is generated.  
6 Minimum Channel Selector  
Selector circuit for detecting LED pin voltages. Selects the lowest pin voltage among LED1 to LED4 pin voltages and inputs  
it in Error AMP.  
7 Error AMP (Error Amplifier)  
This is an error amplifier that takes LED control voltage and the smallest value of the LED1 to LED4 pin voltages as input.  
Phase compensation can be set by connecting a resistor and a capacitor to the COMP pin.  
8 Soft Start  
Soft start circuit for DC/DC converters. This function is used to suppress a steep increase in the inductor current at startup  
and an overshoot in the output voltage. Controls the change in switching Duty by limiting the rising edge of the output of  
Error AMP (COMP pin voltage) with the soft start function.  
9 PWM COMP (PWM Comparator)  
This comparator compares COMP pin voltage, which is the output of Error AMP, with SLOPE output signal. Controls the  
Duty of the switching pulse of DC/DC converter.  
10 Additional Pulse  
This circuit adds switching pulses of DC/DC converter. With the pulse addition function, the LED current can be supplied  
stably even when the PWM dimming ratio decreases.  
11 DC/DC Control LOGIC  
This circuit generates the logic of the built-in Low side FET for boost output from the SW pin.  
12 Low side FET / Pre Driver  
Built-in Low side FET for boost output from the SW pin and its driving circuit.  
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Description of Blocks - continued  
13 Internal CLK  
This circuit generates the internal reference clock. It is a clock of 2.3 MHz and used as a counter.  
14 Dimming Control  
This circuit controls the dimming rate during PWM dimming.  
15 Current Driver / ISET  
Current driver circuit for lighting LED. LED current can be set by connecting a resistor to the ISET pin.  
16 PROTECT  
Outputs the status of protective operation from the FAIL pin. Since this pin is an open drain output, connect it to the REG  
pin with a resistor. If the status of protective operation is not monitored, turn the FAIL pin to OPEN or connect to the GND  
pin.  
16.1 UVLO (Under Voltage Lockout)  
Under Voltage Lockout. When VCC pin voltage is 4.10 V or less or REG pin voltage is 3.95 V or less, Under  
Voltage Lockout (UVLO) is activated, and the load switch (M1), DC/DC switching, and current driver turn OFF.  
When VCC pin voltage is 4.25 V or more and REG pin voltage is 4.10 V or more, UVLO is released and the IC  
restarts from Self Diagnosis. When UVLO is detected, output of the FAIL pin does not change. When the FAIL pin  
is pulled up to REG, FAIL pin voltage will also drop as REG decreases.  
16.2 TSDLED (Thermal Shutdown for Current Driver)  
This is a temperature protection circuit that monitors the vicinity of the current driver on the chip. Prevents chip  
temperature from rising due to output current fault. When the chip temperature rises to 175 °C or more, the  
temperature protection circuit (TSDLED) is activated, the load switch (M1), DC/DC switching, and current driver  
are turned OFF. When the chip temperature falls 150 °C or less, TSDLED is released, the IC restarts from Self  
Diagnosis. When TSDLED is detected, the output of the FAIL pin does not change.  
16.3 TSDREG (Thermal Shutdown for REG)  
This is a temperature protection circuit that monitors the vicinity of the REG pin on the chip. Prevents chip  
temperature rising due to the REG pin failure. When the chip temperature rises to 175 °C or more, the temperature  
protection circuit (TSDREG) is activated, and REG pin voltage, load switch (M1), DC/DC switching, and current  
driver turn OFF. When the FAIL pin is pulled up to the REG pin, FAIL pin voltage drops as REG pin voltage is  
turned OFF, and it is output to Low. When the FAIL pin is pulled up to an external power supply, the FAIL pin is  
output to High. When the chip temperature falls 150 °C or less, TSDREG is released and the IC restarts from Self  
Diagnosis.  
16.4 OCPL (Over Current Protection for Low side)  
When the current flowing through Low side FET (the SW pin) becomes 3.6 A or more, the overcurrent protection  
(OCPL) is activated and only DC/DC switching is stopped. If the current is less than 3.6 A, the overcurrent  
protection is released, and switching is resumed. When OCPL is detected, output of the FAIL pin does not change.  
16.5 OVP (Over Voltage Protection)  
Output overvoltage protection circuit. When OVP pin voltage (resistor division of DC/DC converter output voltage)  
becomes to 1.21 V or more, the overvoltage protection circuit (OVP) activates and only DC/DC switching is  
stopped. When OVP pin voltage falls 1.16 V or less, OVP is released. When OVP is detected, the output of the  
FAIL pin goes Low.  
16.6 OPEN Det (LED Open Detection)  
LED open protection circuit. When any of LED1 to LED4 pin voltages is 0.2 V or less and OVP pin voltage is 1.21  
V or more, LED open protection (OPEN Det) is activated, and the current driver is latched OFF only for the LED  
row that is open. OPEN Det is released when VEN = Low or UVLO is detected. When OPEN Det is detected, the  
FAIL pin goes Low.  
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16 PROTECT – continued  
16.7 SHORT Det (LED Short Detection)  
LED short protection circuit. When LED pin voltage is 5 V or more for 3.56 ms (counter), LED short protection  
(SHORT Det) is activated, and the current driver is latched OFF only for the corresponding LED row. However,  
the counter is reset when LED pin voltage does not satisfy the detection condition prior to SHORT Det being  
activated. SHORT Det is released when VEN = Low or UVLO is detected. Since the 3.56 ms counter is counted up  
only when PWM = High, the time until SHORT Det is detected varies depending on PWM Duty. When SHORT  
Det is detected, the FAIL pin goes Low. SHORT Det can be detected when the PWM pulse width is 20 μs (MIN)  
or more.  
16.8 SCP (Short Circuit Protection)  
Short Circuit Protection circuit. If any of the LED1 to LED4 pin voltages are 0.2 V or less or OVP pin voltage is 0.1  
V or less for 3.56 ms (counter), the Short Circuit Protection (SCP) is activated, and the load switch (M1), DC/DC  
switching, and current driver turn OFF. However, the counter is reset when each pin voltage does not satisfy the  
condition prior to SCP being activated. The SCP is released when VEN = Low or UVLO is detected. When SCP is  
detected, the FAIL pin goes Low. Also, DC/DC converter attempts to output higher voltage because the grounded  
LED pin voltage (lowest LED pin voltage) is controlled to be VLEDCTL. Depending on the power supply voltage and  
the load condition, OVP pin voltage may become 1.21 V or more prior to SCP being activated, and LED open  
protection may be activated first. In this case, current driver turns OFF only for the grounded LED pin, but the LED  
continues to light in a state where the current control is lost because it has been grounded. Even when LED open  
protection is detected, the FAIL pin goes Low. Therefore, abnormality can be detected by monitoring this.  
16.9 OCPH (Over Current Protection for High side) / LDSW Driver  
Input overcurrent protection circuit. If a condition in which the voltage between the VCC-CSH pin is 0.1 V or more  
continues for 10 μs or more, the input overcurrent protection (OCPH) is activated. It becomes LDSW pin voltage  
= VCC pin voltage and the load switch (M1), DC/DC switching, and current driver turn OFF. Then, after 3.56 ms  
(counter) elapses, the load switch is turned ON. At this time, if the voltage between VCC-CSH is 0.1 V or more,  
the load switch, DC/DC switching, and current driver are turned OFF again. Also, if the voltage between VCC-  
CSH is less than 0.1 V, Self Diagnosis is performed and restarted. When OCPH is detected, the FAIL pin goes  
Low. The components on the overcurrent path may generate current again with restart, resulting in heat generation.  
Check the calorific value on the actual device.  
16.10 ISET Pin Fault (ISET-GND Short Protection)  
ISET pin fault protection circuit. When the resistance value connected to the ISET pin falls 3.5 kΩ or less (when  
ADIM = REG), ISET pin fault protection is activated, and the load switch (M1), DC/DC switching, and current driver  
are turned OFF. If the resistance value connected to the ISET pin is more than 3.5 kΩ (when ADIM = REG), ISET  
pin fault protection is released, and the load switch, DC/DC switching, and current driver are turned ON. When  
ISET pin fault is detected, the FAIL pin goes Low.  
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BD83A04EFV-M  
Description of Blocks – continued  
Detect Conditions and Operation at Detection of Each Protection Function (All values in the table are Typ values)  
Operation at Detection  
Detect Condition  
Protection Function  
(Block Name)  
No.  
1
Load  
DC/DC  
Current  
Driver  
FAIL  
[Detect]  
[Release]  
Switch Switching  
Under Voltage  
Lockout  
VCC ≤ 4.10 V  
or  
VCC ≥ 4.25 V  
and  
High  
(Note 5)  
OFF  
OFF  
OFF  
OFF  
OFF  
(UVLO)  
VREG ≤ 3.95 V  
VREG ≥ 4.10 V  
Thermal Shutdown  
LED  
High  
(Note 5)  
2
3
Tj ≥ 175 °C  
Tj ≥ 175 °C  
Tj ≤ 150 °C  
Tj ≤ 150 °C  
OFF  
(TSDLED)  
Thermal Shutdown  
REG  
High  
(Note 5)  
OFF  
OFF  
OFF  
(Note 6)  
(TSDREG)  
Overcurrent  
Protection  
(OCPL)  
High  
(Note 5)  
4
5
ISW ≥ 3.6 A  
ISW < 3.6 A  
ON  
ON  
OFF  
OFF  
ON  
ON  
Overvoltage  
Protection  
(OVP)  
VOVP ≥ 1.21 V  
VOVP ≤ 1.16 V  
Low  
Only  
detection  
LED pin  
is OFF  
Only  
LED Open  
Protection  
(OPEN Det)  
VLEDn ≤ 0.2 V(Note 1)  
and  
VEN = Low  
or  
Latch  
Low  
6
7
ON  
ON  
ON  
ON  
VOVP ≥ 1.21 V  
Detects UVLO  
LED Short  
Protection  
VEN = Low  
or  
Detects VLEDn ≥ 5.0 V  
for 3.56 ms or more(Note 2)  
detection  
LED pin  
is OFF  
Latch  
Low  
(SHORT Det)  
Detects UVLO  
Detects  
VLEDn ≤ 0.2 V  
or  
Short Circuit  
Protection  
(SCP)(Note 3)  
VEN = Low  
or  
Latch  
Low  
8
9
OFF  
OFF  
OFF  
VOVP ≤ 0.1 V  
Detects UVLO  
for 3.56 ms or more  
Detects  
Input Overcurrent  
Protection  
(OCPH)(Note 3)  
Voltage between the  
voltage between the  
VCC-CSH pin ≥ 0.1 V  
for 10 μs or more  
VCC-CSH pin < 0.1 V  
OFF  
OFF  
OFF  
OFF  
OFF  
OFF  
Low  
Low  
(Note 4)  
ISET-GND  
ISET resistor  
> 3.5 kΩ  
ISET resistor ≤ 3.5 kΩ  
(when ADIM = REG)  
10 Short Protection  
(ISET Pin Fault)  
(when ADIM = REG)  
(Note 1) LEDn indicates one of the LED1 to LED4 pins.  
(Note 2) LED pin voltage of at least 1channel shall be less than VLEDCTL(MIN) x 1.2. When LED pin voltages of all channels are 2.4 V or more, the LED short protection  
does not operate. Since the 3.56 ms counter is counted up only when PWM = High, the time until SHORT Det is detected varies depending on PWM Duty.  
(Note 3) When Short Circuit Protection (SCP) and Input Overcurrent Protection (OCPH) are detected at the same time, the operation of Input Overcurrent Protection  
takes precedence.  
(Note 4) When 3.56 ms elapses after the load switch is turned OFF, the load switch turns ON. At this time, when the voltage between VCC-CSH ≥ 0.1 V, the load  
switch, DC/DC switching, and current driver are turned OFF again. Also, when the voltage between VCC-CSH < 0.1 V, Self Diagnosis is performed and  
restarted.  
(Note 5) When pulled up to any voltage, it becomes High output.  
(Note 6) REG is also turned OFF during TSDREG, so if pulled up to the REG pin, FAIL pin voltage drops with REG pin voltage.  
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TSZ22111 • 15 • 001  
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BD83A04EFV-M  
Absolute Maximum Ratings (Ta = 25 °C)  
Parameter  
Symbol  
Rating  
Unit  
V
VCC, LDSW, CSH, SW Pin Voltage  
VCC, VLDSW, VCSH, VSW  
VCC-VLDSW, VCC-VCSH  
VLED1, VLED2, VLED3, VLED4  
-0.3 to +50.0  
-0.3 to +7.0  
-0.3 to +50.0  
Voltage Between VCC-LDSW, VCC-CSH Pin  
V
LED1, LED2, LED3, LED4 Pin Voltage  
V
RT, COMP, ISET, PLSET,  
VRT, VCOMP, VISET,  
-0.3 to VREG  
V
OVP, ADIM, FAIL Pin Voltage  
VPLSET, VOVP, VADIM, VFAIL  
EN, REG, SYNC, PWM Pin Voltage  
Storage Temperature Range  
VEN, VREG, VSYNC, VPWM  
-0.3 to +7.0  
-55 to +150  
150  
V
Tstg  
°C  
Maximum Junction Temperature  
Tjmax  
°C  
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit  
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is  
operated over the absolute maximum ratings.  
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the  
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing  
board size and copper area so as not to exceed the maximum junction temperature rating.  
Thermal Resistance(Note 1)  
Thermal Resistance (Typ)  
Parameter  
Symbol  
Unit  
1s(Note 3)  
2s2p(Note 4)  
HTSSOP-B24  
Junction to Ambient  
Junction to Top Characterization Parameter(Note 2)  
θJA  
90.9  
6
30.1  
4
°C/W  
°C/W  
ΨJT  
(Note 1) Based on JESD51-2A (Still-Air). The BD83A04EFV-M chip is used.  
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside  
surface of the component package.  
(Note 3) Using a PCB board based on JESD51-3.  
(Note 4) Using a PCB board based on JESD51-5, 7.  
Layer Number of  
Measurement Board  
Material  
FR-4  
Board Size  
Single  
114.3 mm x 76.2 mm x 1.57 mmt  
Top  
Copper Pattern  
Thickness  
70 μm  
Footprints and Traces  
Layer Number of  
Measurement Board  
Thermal Via(Note 5)  
Material  
FR-4  
Board Size  
114.3 mm x 76.2 mm x 1.6 mmt  
2 Internal Layers  
Pitch  
Diameter  
4 Layers  
1.20 mm  
Φ0.30 mm  
Top  
Copper Pattern  
Bottom  
Thickness  
70 μm  
Copper Pattern  
Thickness  
35 μm  
Copper Pattern  
Thickness  
70 μm  
Footprints and Traces  
74.2 mm x 74.2 mm  
74.2 mm x 74.2 mm  
(Note 5) This thermal via connects with the copper pattern of all layers.  
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10/46  
BD83A04EFV-M  
Recommended Operating Conditions  
Operating Range  
Parameter  
Symbol  
Unit  
Min  
4.5  
Max  
48.0  
Power Supply Voltage(Note 1)  
VCC  
fOSC  
V
DC/DC Oscillation Frequency Range  
(SSCG = OFF)  
200  
2420  
kHz  
PWM Frequency Range(Note 2)  
ADIM Input Voltage Range(Note 3)  
fPWM  
0.1  
0.4  
25.0  
VREG  
kHz  
V
VADIM  
Higher of  
Lower of  
External Synchronized Frequency Range(Note 4)  
fSYNC  
kHz  
200 or fOSC x 0.9  
700 or fOSC x 1.1  
External Synchronized Pulse Duty Range(Note 5)  
LED Current Setting Range(Note 6)  
Operating Temperature  
fSDUTY  
ILED  
40  
20  
60  
%
mA  
°C  
120  
Topr  
-40  
+125  
(Note 1) When IC is started, the voltage must be UVLO release voltage or more. Therefore, consider the power supply drop caused by the parasitic resistor  
and start the IC at VCC ≥ 5.5 V.  
VCC(MIN) = 4.5 V is the minimum value of VCC that can operate the IC alone. The minimum value of power supply voltage that can be set depends on  
the connected LED load and external components.  
(Note 2) Generally, flickering of LEDs is easier to see when the dimming frequency is set lower than 100 Hz. Set after confirming with the actual device evaluation.  
(Note 3) Even if 1.21 V or more is input to the ADIM pin, it is fixed at 1.21 V inside the IC.  
(Note 4) When the external synchronization function is not used, connect the SYNC pin to VREG (SSCG = ON) or GND (SSCG = OFF).  
(Note 5) When using the external synchronization function, switching from the external synchronization state to the internal oscillation frequency is not possible  
during stable operation.  
(Note 6) The amount of current per channel. Set the LED current so that the maximum junction temperature (Tjmax) is not exceeded.  
Operating Conditions (External Constant Range)  
Operating Range  
Parameter  
Symbol  
Unit  
Min  
1.0  
Typ  
Max  
4.7  
53  
REG Capacitance  
CREG  
RISET  
RRT  
2.2  
μF  
kΩ  
kΩ  
nF  
μF  
μF  
μF  
LED Current Setting Resistor  
Oscillation Frequency Setting Resistor  
PLSET Capacitance  
11  
-
-
-
-
-
-
4.6  
51.0  
10  
CPLSET  
CVCC  
-
Input Capacitance 1  
1(Note 7)  
10(Note 7)  
20(Note 7)  
-
(Note 8)  
Input Capacitance 2  
CINVCC  
-
Output Capacitance  
COUT  
100  
(Note 7) Set the capacitance so that it does not fall below the minimum value in consideration of temperature characteristics, DC bias characteristics, etc.  
(Note 8) CINVCC means the total capacitance of CIN and CVCC  
.
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TSZ22111 • 15 • 001  
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11/46  
BD83A04EFV-M  
Electrical Characteristics  
(Unless otherwise specified, VCC = 12 V, Ta = -40 °C to +125 °C)  
Standard Value  
Unit  
mA  
Conditions  
Parameter  
Symbol  
Min  
Typ  
Max  
10  
VEN = 5 V, VSYNC = 0 V,  
VPWM = 0 V, CIN = 10 μF,  
RT = OPEN, ISET = OPEN,  
Circuit Current  
ICC  
-
-
VADIM = VREG  
,
Resistance between  
LEDn-GND = 10 kΩ  
Standby Current  
[VREF]  
IST  
-
0
10  
μA  
V
VEN = Low  
Reference Voltage  
[DC/DC Converter]  
SW Pin ON Resistor  
VREG  
4.7  
5.0  
5.3  
IREG = -5 mA, CREG = 2.2 μF  
RON_SW  
VLEDCTL  
-
0.2  
0.4  
Ω
V
ISW = 50 mA  
RISET = 15.1 kΩ,  
VADIM = VREG  
RISET = 15.1 kΩ,  
VCOMP = 1.0 V,  
VLED = 1.5 V,  
VADIM = VREG  
RISET = 15.1 kΩ,  
VCOMP = 1.0 V,  
VLED = 0 V,  
LED Control Voltage  
0.66  
0.76  
0.86  
COMP Sink Current  
ICOMPSINK  
150  
220  
290  
μA  
μA  
COMP Source Current  
ICOMPSOURCE  
-290  
-220  
-150  
VADIM = VREG  
Oscillation Frequency 1  
Max Duty 1  
fOSC1  
DUTY_MAX1  
fOSC2  
306  
95  
340  
-
374  
-
kHz  
%
RRT = 33.3 kΩ  
RRT = 33.3 kΩ  
RRT = 4.6 kΩ  
VPLSET = 0 V  
Oscillation Frequency 2  
PLSET Charge Current  
PLSET Set Voltage  
1980  
35  
2200  
50  
2420  
65  
kHz  
μA  
V
IPLSET  
VPLSET  
0.4  
0.5  
0.6  
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TSZ22111 • 15 • 001  
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12/46  
BD83A04EFV-M  
Electrical Characteristics – continued  
(Unless otherwise specified, VCC = 12 V, Ta = -40 °C to +125 °C)  
Standard Value  
Parameter  
[Current Driver]  
Symbol  
Unit  
Conditions  
Min  
Typ  
Max  
RISET = 15.1 kΩ,  
mA  
%
LED Current Absolute Variation  
ILEDn  
76.1  
0
80.1  
-
84.1  
5
VADIM = VREG  
RISET = 15.1 kΩ,  
VADIM = VREG  
LED Current Relative Variation  
(Note 1)  
ILEDREL  
ISET-GND Short Protection  
Resistor  
RISETLIM  
IADIM  
-
3.5  
0
-
+1.0  
-
kΩ  
μA  
μs  
VADIM = VREG  
VADIM = 5 V  
ADIM Pin Input Current  
-1.0  
0.5  
PWM Dimming Minimum Pulse  
Width  
fPWM = 100 Hz to 25 kHz,  
ILED = 80.1 mA  
tPWMMIN  
-
PWM Dimming Frequency  
PWM Low Section Detect Time  
[Logic Input (EN)]  
Input High Voltage  
fPWM  
0.1  
-
25.0  
35.6  
kHz  
ms  
tPWML  
21.4  
28.5  
VINH1  
VINL1  
RIN1  
2.1  
-
-
-
-
V
V
Input Low Voltage  
0.5  
150  
Input Resistor  
50  
100  
kΩ  
VEN = 5 V  
[Logic Input (PWM, SYNC)]  
Input High Voltage  
VINH2  
VINL2  
RIN2  
2.1  
-
-
-
-
V
V
Input Low Voltage  
0.5  
150  
Input Resistor  
50  
100  
kΩ  
VPWM = VSYNC = 5 V  
(Note 1) ILEDREL = (ILEDn(MAX) – ILEDn(MIN)) / ILEDn(Ave) x 100  
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BD83A04EFV-M  
Electrical Characteristics – continued  
(Unless otherwise specified, VCC = 12 V, Ta = -40 °C to +125 °C)  
Standard Value  
Parameter  
[PROTECT]  
Symbol  
Unit  
Conditions  
Min  
Typ  
Max  
VCCUVLO Detect Voltage  
VCCUVLO Release Voltage  
REGUVLO Detect Voltage  
REGUVLO Release Voltage  
OVP Detect Voltage  
VUVLOVCC1  
VUVLOVCC2  
VUVLOREG1  
VUVLOREG2  
VOVPDET  
3.90  
4.05  
3.75  
3.90  
1.16  
4.10  
4.25  
3.95  
4.10  
1.21  
4.30  
4.45  
4.15  
4.30  
1.26  
V
V
V
V
V
VCC = Sweep down  
VCC = Sweep up  
VREG = Sweep down  
VREG = Sweep up  
VOVP = Sweep up  
OVP Detect Voltage  
Hysteresis Width  
VOVPHYS  
VOCPH  
VLDSW  
IOCPL  
-
50  
100  
5.4  
-
mV  
mV  
V
VOVP = Sweep down  
Input OCP Detect Voltage  
80  
120  
6.4  
VCC-VCSH = Sweep up  
VCSH = VCC  
VCC-VLDSW  
LDSW Operation Voltage  
at Input OCP Release  
4.4  
3.14  
0.1  
0.05  
0.1  
OCPL Detect Current  
3.60  
0.2  
4.06  
0.3  
A
LED Open Protection Detect  
Voltage  
VLED = Sweep down  
VOVP ≥ VOVPDET  
VOPEN  
VSCP1  
VSCP2  
V
LED Anode SCP Detect Voltage  
0.10  
0.2  
0.15  
0.3  
V
VOVP = Sweep down  
VLED = Sweep down  
LED Cathode SCP Detect  
Voltage  
V
LED Anode SCP Detect  
Delay Time  
tSCP1  
tSCP2  
2.67  
2.67  
4.7  
3.56  
3.56  
5.0  
4.45  
4.45  
5.3  
ms  
ms  
V
LED Cathode SCP Detect  
Delay Time  
LED Short Protection Detect  
Voltage  
VSHORT  
VLED = Sweep up  
Initial Check Time  
tINICK  
RFAIL  
5.34  
-
7.12  
1.0  
8.90  
2.0  
ms  
kΩ  
FAIL Pin ON Resistor  
IFAIL = 1 mA  
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14/46  
BD83A04EFV-M  
Typical Performance Curves  
(Reference data, unless otherwise specified VCC = 12 V)  
10  
8
5.3  
5.2  
5.1  
5.0  
4.9  
4.8  
4.7  
6
4
2
0
4
15  
26  
37  
48  
-40 -20  
0
20 40 60 80 100 120  
Power Supply Voltage : VCC [V]  
Temperature : Ta [°C]  
Figure 4. Circuit Current vs Power Supply Voltage  
Figure 5. Reference Voltage vs Temperature  
380  
370  
360  
350  
340  
330  
320  
310  
300  
2.42  
2.31  
2.20  
2.09  
1.98  
-40 -20  
0
20 40 60 80 100 120  
-40 -20  
0
20 40 60 80 100 120  
Temperature : Ta [°C]  
Temperature : Ta [°C]  
Figure 6. Oscillation Frequency 1 vs Temperature  
(RRT = 33.3 kΩ)  
Figure 7. Oscillation Frequency 2 vs Temperature  
(RRT = 4.6 kΩ)  
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15/46  
BD83A04EFV-M  
Typical Performance Curves – continued  
(Reference Data)  
84  
83  
82  
81  
80  
79  
78  
77  
76  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
-40 -20  
0
20 40 60 80 100 120  
20  
40  
60  
80  
100  
120  
Temperature : Ta [°C]  
LED Current : ILED [mA/ch]  
Figure 8. LED Control Voltage vs LED Current  
Figure 9. LED Current vs Temperature  
100  
90  
80  
70  
60  
50  
100  
90  
80  
70  
60  
50  
8
10  
12  
14  
16  
8
10  
12  
14  
16  
Power Supply Voltage : VCC [V]  
Power Supply Voltage : VCC [V]  
Figure 10. Efficiency 1 vs Power Supply Voltage  
(RRT = 33.3 kΩ, RISET = 15.1 kΩ,  
Figure 11. Efficiency 2 vs Power Supply Voltage  
(RRT = 4.6 kΩ, RISET = 15.1 kΩ,  
Number of LED Series = 10, Number of LED Parallels = 4)  
Number of LED Series = 10, Number of LED Parallels = 4)  
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16/46  
BD83A04EFV-M  
Function Descriptions  
Unless otherwise stated, the value in the sentence is the Typ value.  
1 Current Driver  
This model has a built-in 4 ch current driver. The LED current setting range per channel is 20 mA to 120 mA, and the LED  
current can be adjusted by the resistance value between the ISET pin and GND.  
1.1 How to Set LED Current  
1.4 PWM Low Section Detect Function  
1.2 When Using Analog Dimming  
1.3 When Using PWM Dimming  
1.5 LED Pin Handling of Unused Channels  
1.6 When Setting the LED Current Above 120 mA  
1.1 How to Set LED Current  
The LED current ILED can be calculated using the following equation.  
퐿퐸퐷  
=
ꢀ푆ꢁ푇 × 106  
[mA]  
Resistance Value Setting Example (VADIM = VREG  
)
ꢀ푆ꢁ푇  
ISET Resistor [kΩ]  
LED Current [mA]  
퐿퐸퐷: Output current per channel (LED current)  
(Recommended operating condition:  
20 mA to 120 mA)  
53  
30  
22.8  
40.3  
80.1  
110.0  
ꢃꢄ퐸ꢅ: ISET pin voltage 1.21 V  
15.1  
11  
(When ADIM pin voltage VADIM = VREG  
ꢃꢄ퐸ꢅ: LED current setting resistor  
)
(Recommended operating condition:  
When RISET ≤ 3.5 kΩ, ISET pin short protection detect is  
activated and, output of the LED current is stopped.  
11 kΩ to 53 kΩ)  
120  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
11  
16  
21  
26  
31  
36  
41  
46  
51  
ISET Resistor : RISET [kΩ]  
Figure 12. ILED vs RISET (VADIM = VREG  
)
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BD83A04EFV-M  
1 Current Driver – continued  
1.2 When Using Analog Dimming  
ISET pin voltage can be adjusted according to the voltage input to the ADIM pin. The LED current ILED can be calculated  
from the following equation as described above.  
퐿퐸퐷: Output current per channel (LED current)  
(Recommended operating condition:  
20 mA to 120 mA)  
퐿퐸퐷  
=
ꢀ푆ꢁ푇 × 106  
[mA]  
ꢀ푆ꢁ푇  
ꢃꢄ퐸ꢅ: ISET pin voltage 1.21 V  
However, VISET can be adjusted according to ADIM pin  
voltage VADIM as follows:  
(ADIM pin voltage VADIM = VREG  
)
ꢃꢄ퐸ꢅ: LED current setting resistor  
(Recommended operating conditions:  
11 kΩ to 53 kΩ)  
ꢃꢄ퐸ꢅ  
= 1.21 [V] (1.21 V ≤ VADIM ≤ VREG)  
퐴퐷ꢃ푀: ADIM pin Input voltage  
(Recommended operating conditions:  
0.40 V to VREG  
ꢃꢄ퐸ꢅ  
= ꢂ  
[V] (0.40 V < VADIM < 1.21 V)  
퐴퐷ꢃ푀  
)
Note that ILED set by RISET and VADIM can’t be set to less than 20 mA.  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
0.4  
0.5  
0.6  
0.7  
0.8  
0.9  
1
1.1  
1.2  
1.3  
VADIM [V]  
Figure 13. ILED vs VADIM (RISET = 15.1 kΩ)  
1.3 When Using PWM Dimming  
The LED current can be controlled according to On Duty of the PWM signal input to the PWM pin. However, in the region  
where the ON time of the LED current is less than 0.5 μs or the OFF time is less than 0.5 μs, the pulse time is shorter than  
PWM dimming minimum pulse width, so it cannot be used regularly. It is okay to use this region transiently, so it is also  
possible to set PWM Duty = 0 % and 100 %.  
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18.Aug.2022 Rev.006  
18/46  
BD83A04EFV-M  
1 Current Driver – continued  
1.4 PWM Low Section Detect Function  
Counting starts when PWM = High is switched to Low in the VEN = High state. When PWM Low section reaches 28.5 ms,  
the operation is regarded as OFF state. After that, when PWM input is turned High, switching operation (pre-boost) is  
restarted.  
1.5 LED Pin Handling of Unused Channels  
VOUT  
This model has four built-in constant current circuits.  
The current can be supplied to the LED by setting the  
PWM pin to High, and the LED current can be set by  
inserting a resistor between the ISET pin and GND. The  
LED current that can be supplied per row is 20 mA to  
120 mA.  
Pull down the LED pin of the unused channel to GND  
with 10 kΩ.  
10 kΩ  
LED4  
LED3  
LED2  
LED1  
Figure 14. When Setting LED4 Unused  
1.6 When Setting the LED Current Above 120 mA  
The LED1 to LED4 pins can be used in bundles.  
For example, as shown in the figure on the right, if  
LED1, LED2, LED3, and LED4 are shorted, 4 times the  
current set by the ISET pin can be passed.  
VOUT  
When using only 2 channels in a bundle, mount a  
resistor for each LED pin for unused channels (2  
channels).  
When connected to multiple LED pins with a resistor,  
the voltage may deviate from the set value and may not  
be recognized as an unused channel. In this case, the  
unintentional protection function may be activated, so  
perform the LED pin handling correctly.  
LED4  
LED3  
LED2  
LED1  
Figure 15. Application Example When LED Pins are Shorted  
VOUT  
VOUT  
10 kΩ  
10 kΩ  
LED4  
LED4  
10 kΩ  
LED3  
LED2  
LED1  
LED3  
LED2  
LED1  
Figure 16. Correct LED Pin Handling When Multiple  
Channels are Unused  
Figure 17. Wrong LED Pin Handling When Multiple  
Channels are Unused  
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BD83A04EFV-M  
Functional Descriptions – continued  
Unless otherwise stated, the value in the sentence is the Typ value.  
2 DC/DC Converter  
Detects the lowest voltage among LED1 to LED4 pin voltages (LED cathode voltages) in Minimum Channel Selector block  
and inputs it to Error AMP. The reference voltage of Error AMP is generated in REF Voltage block based on RISET resistance  
value, which becomes LED pin control voltage. The output of Error AMP is compared with the output of SLOPE block by  
PWM COMP block, and a switching signal is output to the SW pin through DC/DC Control LOGIC.  
2.1 LED Pin Control Voltage VLEDCTL  
2.5 DC/DC Converter Oscillation Frequency fOSC  
2.6 Pulse Addition Function  
2.7 External Synchronization / Spread Spectrum  
Function (SSCG)  
2.2 VCC Input Voltage and Number of LED Series  
2.3 LED Variation and Series Number  
2.4 Overvoltage Protection Function OVP  
2.8 LSDET Function  
2.1 LED Control Voltage VLEDCTL  
DC/DC converter operates so that the lowest voltage among LED1 to LED4 pin voltages (LED cathode voltages) is equal  
to the LED control voltage (VLEDCTL). Power dissipation can be minimized by optimizing the LED control voltage (VLEDCTL  
)
according to the LED current (ILED).  
LED Control Voltage Reference Value (ADIM = REG)  
1.2  
1.1  
LED Control  
ISET Resistor  
RISET [kΩ]  
LED Current  
ILED [mA]  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
Voltage  
VLEDCTL [V]  
53  
30  
22.8  
40.3  
80.1  
110.0  
0.42  
0.52  
0.76  
0.93  
15.1  
11  
20  
40  
60  
80  
100  
120  
LED Current : ILED [mA/ch]  
Figure 18. VLEDCTL vs ILED  
2.2 VCC Input Voltage and Number of LED Series  
To drive the boost DC/DC converter, the LED must be selected so that the output voltage (VOUT) is higher than the input  
voltage (VCC).  
ꢂ퐶퐶  
: Input voltage  
ꢂ퐶퐶(  
ꢂ퐶퐶(  
< ꢂ푂푈ꢇ  
< ꢂ푓  
)
)
푀퐴푋  
푀퐴푋  
(푀ꢃ푁)  
ꢂ푂푈ꢇ : DC/DC converter output voltage  
: Number of LED series  
: LED Vf voltage  
: LED control voltage  
× ꢈ + ꢂ  
(푀ꢃ푁)  
퐿퐸퐷ꢉꢅ퐿 (푀ꢃ푁)  
ꢂ푓  
퐿퐸퐷ꢉꢅ퐿  
Select the number of LED series and Vf characteristics that satisfy  
the above equation.  
2.3 LED Variation and Series Number  
When operating multiple LED outputs, the LED anode voltages in each row are commonly connected to DC/DC converter  
output VOUT. LED pin voltage (LED cathode voltage) in the row where the Vf voltage of the LED is the highest is the lowest,  
and this is controlled to be VLEDCTL. Therefore, the voltage of other LED pin outputs will be higher by the amount of Vf  
variation. Select the number of LED series and Vf characteristics so that the LED short protection (VLEDn ≥ 5.0 V) does not  
operate.  
ꢈ × ꢊꢂ푓  
) − ꢂ푓  
)ꢋ < ꢂ  
) − ꢂ  
(
(
(
푀퐴푋  
푀ꢃ푁  
ꢄ퐻ꢌ푅ꢅ 푀ꢃ푁 퐿퐸퐷ꢉꢅ퐿 (푀퐴푋)  
ꢄ퐻ꢌ푅ꢅ  
: LED short protection voltage  
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BD83A04EFV-M  
2 DC/DC Converter – continued  
VOUT  
2.4 Overvoltage Protection Function OVP  
Inputs the resistor division of the output voltage VOUT  
in the OVP pin. When OVP pin voltage rises the  
overvoltage protection detect voltage VOVP (1.21 V) or  
more, the overvoltage protection is activated, and the  
switching of DC/DC converter is turned OFF. After that  
when OVP pin voltage drops to 1.16 V, OVP is released.  
ROVP2  
OVP  
+
 
ROVP1  
1.21 V /  
1.16 V  
Figure 19. OVP Pin Voltage Setting Sample  
{(  
)
}
ꢂ푂푈ꢌ푉푃 = ꢆꢌ푉푃ꢍ + ꢆꢌ푉푃ꢎ ∕ ꢆꢌ푉푃ꢍ × ꢌ푉푃 [V]  
ꢂ푂푈ꢌ푉푃 : DC/DC converter output voltage (VOUT) during overvoltage protection operation  
ꢌ푉푃 : Overvoltage protection detect voltage  
2.5 DC/DC Converter Oscillator Frequency fOSC  
The oscillation frequency (fOSC) of DC/DC converter can be set by connecting RRT between the RT pin and GND. The  
oscillator frequency of DC/DC converter is generated in the OSC block. Set the resistor of RRT referring to the data and  
theoretical formula below.  
7
: Oscillation frequency of DC/DC converter  
ꢌꢄꢉ  
(
)
ꢌꢄꢉ  
= 1.132 × 10 ∕ ꢆ푅ꢅ × 훼 [kHz]  
1.132 × 107: Constants determined inside the circuit  
푅ꢅ  
: RT pin connecting resistor  
: Correction factor  
α is the correction factor. For the relation between fOSC and RRT including the correction factor, refer to fOSC vs RRT below.  
Note that operation cannot be guaranteed if fOSC setting value exceeds the recommended range of 200 kHz to 2420 kHz.  
Determine fOSC setting value in consideration of the variation in electrical characteristics, variation in RRT, and ON/OFF of  
spread spectrum  
fOSC vs RRT  
2400  
Example of Resistance Value for fOSC Setting  
2200  
2000  
RRT [kΩ]  
51  
α
1800  
1600  
1400  
1200  
1000  
800  
1.013  
1.000  
0.980  
0.947  
0.894  
33.3  
20  
10  
600  
400  
4.6  
200  
4
6
8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52  
RRT [kΩ]  
Figure 20. fOSC vs RRT  
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BD83A04EFV-M  
2 DC/DC Converter – continued  
2.6 Pulse Addition Function  
A pulse addition function is provided to output a stable DC/DC converter output voltage and LED current even when PWM  
Duty is low. The output voltage can be held by outputting additional switching of several pulses after the falling edge of the  
PWM input signal, and the LED can be turned on normally. When the pulse addition function is not used, set the PLSET  
pin to OPEN  
VPWM  
0.5 V  
VPLSET  
Additional  
Pulse Time  
tPLSET  
VSW  
VOUT  
VOUT Hold  
Stable LED Current  
ILED  
Figure 21. Pulse Addition Function  
The number of additional switching pulses is set in the capacitance value CPLSET connected to the PLSET pin. The additional  
pulse time tPLSET is calculated as follows:  
푃퐿ꢄ퐸ꢅ = 10ꢍꢏ × 퐶푃퐿ꢄ퐸ꢅ [µs]  
푃퐿ꢄ퐸ꢅ  
푃퐿ꢄ퐸ꢅ  
: Additional pulse time  
: PLSET pin capacitance  
1000  
100  
10  
1
0
0.1  
1.0  
10.0  
PLSET Pin Capacity : CPLSET [nF]  
Figure 22. tPLSET vs CPLSET  
The additional pulse time required to hold the output voltage VOUT varies depending on various factors such as PWM  
frequency, output voltage, output capacitance, LED current, as well as the minimum value of PWM Duty used for dimming.  
Contact your sales representative when you request design verification of the required additional pulse time for your usage  
conditions.  
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BD83A04EFV-M  
2 DC/DC Converter – continued  
2.7 External Synchronization /Spread Spectrum Function (SSCG)  
Three switching modes can be selected  
according to the voltage input to the  
SYNC pin.  
Mode  
1
VSYNC  
Low  
DC/DC Switching Frequency  
Fixed Frequency Mode Determined by RRT  
Spread Spectrum Mode of the Frequency  
Determined by RRT  
2
3
High (= VREG  
Pulse Input  
)
Mode to Synchronize with the Frequency Input to  
the SYNC Pin  
Mode 1:  
When the SYNC pin is fixed Low, DC/DC converter switches at a fixed frequency determined by RRT  
.
Mode 2:  
By shorting the SYNC pin and the REG pin, operation in spread spectrum mode (SSCG) is enabled. With SSCG, noise  
peaks can be reduced by periodically changing the oscillation frequency. The fluctuation range (Δf) of the frequency due to  
SSCG is -8 % of the set oscillation frequency from the set oscillation frequency. The oscillation frequency fluctuation period  
(tSSCG) is 1/(2.3 kHz).  
VCC  
Δf = fOSC x 0.08  
VEN  
VSYNC  
VPWM  
Noise  
reduction  
1.21 V  
Pre-boost  
Self Diagnosis  
VOVP  
VSW  
Δf = -8 %  
fOSC  
tSSCG = 1/(2.3 kHz)  
fOSC x 0.92  
fOSC Frequency  
Band  
Figure 23. Spread Spectrum Function Timing Chart  
Figure 24. Spread Spectrum Function  
훥푓  
ꢌꢄꢉ  
: Fluctuation range of the oscillation frequency by SSCG  
: DC/DC oscillation frequency  
훥푓 = 푓 × 0.08  
ꢌꢄꢉ  
ꢄꢄꢉ퐺 : The oscillation frequency fluctuation period by SSCG  
ꢄꢄꢉ퐺 = 1/(2.3 푘ꢐ푧)  
When not using SSCG function, short the SYNC pin and the GND pin.  
SSCG function cannot be turned ON/OFF during operation.  
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BD83A04EFV-M  
2.7 External Synchronization / Spread Spectrum Function (SSCG) – continued  
Mode 3:  
By inputting an external clock signal to the SYNC pin, the internal oscillation frequency can be externally synchronized.  
However, note the following points.  
·Since Mode is judged during Self Diagnosis (Initial Check), input the clock signal to the SYNC pin prior to turning the EN  
pin to High.  
·After the clock signal is input to the SYNC pin and the EN pin is turned High, it is not possible to switch between internal  
oscillation and external synchronization. Operation may become unstable. Similarly, after turning the EN pin to High, the  
frequency of external synchronization cannot be switched.  
·When using the external synchronization function, connect an RC filter with a cutoff frequency equivalent to the input  
external synchronization frequency to the SYNC terminal as a countermeasure against interference with the RT terminal.  
Be sure to check whether the output voltage of the RC filter satisfies the input threshold of the SYNC pin.  
·When using external synchronization, SSCG cannot be used.  
·For the external synchronization frequency, input a frequency within ±10 % of the theoretical value of the oscillation  
frequency fOSC set by the RT pin.  
Internal SYNC  
4.0 V  
1.0 V  
VEN  
VREG  
VSYNC  
REG  
MODE  
Selector  
SYNC  
SSCG: ON, SYNC: OFF  
4.0 V  
1.0 V  
Internal  
VSYNC  
SSCG: OFF, SYNC: ON  
SSCG: OFF, SYNC: OFF  
7.12 ms  
SSCG block  
To OSC  
Initial Check  
Figure 25. Synchronous Signal (VSYNC) Input and  
Mode Check (Initial Check) Timing  
Figure 26. SYNC Pin Equivalence Circuit  
LSDET  
OFF  
LSDET  
ON  
LSDET  
OFF  
2.8 LSDET Function  
When the lowest LED pin voltage among LED pins is 2.4 V  
or more, DC/DC converter is turned OFF, and COMP voltage  
is held. DC/DC converter resumes switching when the lowest  
LED pin voltage is less than VLEDCTL x 1.2.  
VPWM  
LSDET function is intended to reduce the voltage quickly  
when the output is over boosted. It also prevents the LEDs  
from flickering by resuming the switching of DC/DC converter  
just before returning to normal operation.  
VSW  
The LED4 pin becomes open and LED4 pin voltage  
VCOMP  
becomes 0.2 V or less ().  
DC/DC converter output begins boosting further to raise  
LED4 pin voltage. In conjunction with this, OVP pin  
1.21 V  
VOVP  
voltage also rises ().  
When OVP pin voltage reaches 1.21 V () due to the  
boost of DC/DC converter, the LED open protection is  
activated.  
When the LED open protection is activated, the LED4  
pin that was open is pulled up to REG pin voltage VREG  
VLED1 to  
VLED3  
VLEDCTL  
VLEDCTL x 1.2  
inside the IC ().  
REG Pull Up (VREG  
)
LSDET function operates because LED4 pin voltage,  
which is the lowest LED pin voltage in the LED pins, is  
VLED4  
VLEDCTL  
2.4 V  
0.2 V  
2.4 V or more ().  
LSDET function turns OFF DC/DC converters and holds  
LED4  
Open  
LED4  
Open  
Detection  
COMP voltage ().  
DC/DC converter turns OFF, the output voltage drops,  
and OVP pin voltage also drops ().  
ILED1  
to  
ILED3  
When the lowest LED pin voltage is less than VLEDCTL  
x
ILED4  
1.2 (), DC/DC converter resumes switching ().  
Figure 27. LSDET Function When LEDs are Open  
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BD83A04EFV-M  
Functional Descriptions – continued  
Unless otherwise stated, the value in the sentence is the Typ value.  
3 Starting Sequence and Effective Section of Each Protection Function  
The timing chart at startup and the effective section of each protection function are shown in the figure below.  
Power ON  
Self Diagnosis  
(Initial check)  
: Input EN voltage after the VCC voltage is input.  
: After inputting EN voltage, this IC becomes the Self Diagnosis status, determines the channel to  
be used, and sets the external synchronization / spread spectrum function, etc. Self Diagnosis is  
completed after 7.12 ms, and the diagnostic status is latched.  
Pre-boost  
: After Self Diagnosis, pre-boost starts at VPWM = High, and after 7.12 ms, pre-boost is completed.  
Stable operation : The LED current flows according to On Duty of the PWM signal input to the PWM pin. The output  
transition section voltage of DC/DC converter with switching turned OFF drops according to the load current.  
Stable state  
: When LED voltage (the lowest voltage in LED1 to LED4) drops to LED control voltage x 1.2, DC/DC  
converter switches again.  
VCC  
VEN  
VREG  
VPWM  
4.1 V  
(UVLO Release)  
 Self Diagnosis  
After Self Diagnosis,  
pre-boost starts with VPWM = High  
7.12 ms  
Determination of CH to use  
Setting external  
synchronization  
 Stable Operation  
 Pre-boost  
 Stable State  
7.12 ms  
Transition Section  
Setting spread spectrum  
OVP pin fault detection  
ISET pin fault detection  
1.21 V  
VOVP  
VSW  
ILED  
LED Setting Current Output Section  
LED Control Voltage × 1.2  
VLED  
LED Control Voltage  
During Self Diagnosis  
FAIL is Low  
VFAIL  
DC/DC Converter Operating Section  
Current Driver Operating Section  
Under Voltage Lockout (UVLO) Effective when EN = High  
Thermal Shutdown REG (TSDREG) Effective when EN = High  
Thermal Shutdown LED (TSDLED) Effective when EN = High  
Overcurrent Protection (OCPL) Effective when UVLO is released  
Overvoltage Protection (OVP) Effective when UVLO is released  
Overvoltage Protection (OVP) / FAIL Flag Effective when LSDET is OFF  
Input Overcurrent Protection (OCPH) / FAIL Flag Effective when UVLO is released  
ISET-GND Short Protection / FAIL Flag Effective when Self Diagnosis is completed  
LED Open Protection / FAIL Flag Effective when pre-boost is completed  
LED Short Protection / FAIL Flag Effective when pre-boost is completed  
Short Circuit Protection (SCP) / FAIL Flag Effective when pre-boost is completed  
Figure 28. Timing Chart at Startup and Effective Section of Each Protection Function  
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3 Starting Sequence and Effective Section of Each Protection Function – continued  
Unless otherwise stated, the value in the sentence is the Typ value.  
3.1 Self Diagnosis (Initial Check)  
The contents of Self Diagnosis are as follows.  
3.1.1 LED Pin Used/Unused Check  
It is possible to check whether the LED pin is used or not by LED pin voltage at the end of Self Diagnosis. If LED pin  
voltage is 0.2 V or more and 2.0 V or less during Self Diagnosis, the LED pin is diagnosed as unused. If it is diagnosed  
as unused, the LED pin does not operate and is pulled up to REG pin voltage VREG inside the IC. To select unused  
channels correctly, the capacitance value to be connected to the LED pin should be 470 pF or less.  
3.1.2 SYNC Pin Setting Check  
ON/OFF of the external synchronization or spread spectrum function can be set by SYNC pin voltage at the end of Self  
Diagnosis.  
3.1.3 FAIL Pin Connection Check  
During Self Diagnosis, the FAIL pin can check the connection between the monitor pin of MCU and the FAIL pin by  
turning ON the open drain output (ON resistor = 1 kΩ). Determine the pull up voltage and pull up resistor according to  
FAIL detection voltage on the MCU. Also, be careful of startup failure when starting by pulling up to the external power  
supply, not REG pin voltage. The pull up resistor must satisfy the following conditions.  
Example of  
External Power Supply  
REG Pin  
Voltage  
Pull Up Voltage (V)  
5.0  
20  
3.3  
10  
5.0  
10  
Minimum Value of Pull Up Resistor (kΩ)  
3.1.4 ISET-GND Short Check  
In Self Diagnosis, ISET-GND Short Check is done under the same conditions as ISET pin fault (ISET-GND short  
protection). When ISET-GND short is confirmed, the load switch, DC/DC switching, and current driver are latched OFF.  
It is reset when VEN = Low or UVLO is detected.  
3.1.5 OVP Pin Setting Check  
Self Diagnosis checks OVP pin setting. The OVP pin during Self Diagnosis is pulled down with IC built-in resistor of 1  
MΩ. When an open failure of the OVP pin occurs, OVP pin voltage falls to 0.1 V or less, and the load switch, DC/DC  
switching, and the current driver latch OFF. It is reset when VEN = Low or UVLO is detected.  
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Functional Descriptions – continued  
4 Stopping Sequence and Effective Section of Each Protection Function  
The figure below shows the timing chart when stopping and the effective section of each protection function.  
Stable state  
: When LED voltage (the lowest voltage in LED1 to LED4) drops to the LED control voltage x 1.2,  
DC/DC converter is switched again.  
Standby state : Decrease EN voltage prior to the VCC voltage falling. Internal circuit is stopped by falling EN  
voltage, and IC is in standby state.  
VCC  
VEN  
REG output  
function is OFF  
when EN = Low  
VREG  
VPWM  
Standby State  
Stable State  
VOVP  
VOUTL  
ILED  
DCDC converter operation is OFF  
when EN = Low  
Current driver operation is OFF  
when EN = Low  
VLED  
LED Control Voltage  
VFAIL  
DC/DC Converter Operating Section  
Current Driver Operating Section  
Under Voltage Lockout (UVLO) Effective when EN = High  
Thermal Shutdown REG (TSDREG) Effective when EN = High  
Thermal Shutdown LED (TSDLED) Effective when EN = High  
Overcurrent Protection (OCPL) Effective when UVLO is released  
Overvoltage Protection (OVP) Effective when UVLO is released  
Overvoltage Protection (OVP) / FAIL Flag Effective when LSDET is OFF  
Input Overcurrent Protection (OCPH) / FAIL Flag Effective when UVLO is released  
ISET-GND Short Protection / FAIL Flag Effective when Self Diagnosis is completed  
LED Open Protection / FAIL Flag Effective when pre-boost is completed  
LED Short Protection / FAIL Flag Effective when pre-boost is completed  
Short Circuit Protection (SCP) / FAIL Flag Effective when pre-boost is completed  
By setting EN = Low,  
the state is set to standby  
and all functions are stopped.  
Figure 29. Timing Chart at Stopping and Effective Section of Each Protection Function  
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BD83A04EFV-M  
PCB Application Circuit Diagram  
L1  
B+  
B-  
CM  
CB2  
CB1  
CCSH  
RCSH3  
CVCC2 CVCC1  
CVCC3  
RCSH2 RCSH1  
M1  
REG  
L2  
D2  
VOUT  
REG  
GND  
EN  
VCC  
CSH  
REG  
CLDSW  
CREG  
CIN1 CIN2  
D1  
COUT1 COUT2 COUT3 COUT4  
EN  
PWM  
LDSW  
N.C.  
RSYNCU  
ROVP3  
PWM  
SYNC  
RT  
RFL  
SYNC  
SW  
ROVP2  
PGND  
OVP  
RSYNCD  
CFL  
COMP  
ADIM  
ISET  
LGND  
LED1  
LED2  
RRT1  
RFAIL  
CCOMP2  
FAIL  
REG  
FAIL  
RCOMP1  
CCOMP1  
COVP  
ROVP1  
PLSET  
N.C.  
RRT2  
RISET1  
LED4  
LED3  
CPLSET1 CPLSET2  
VOUT  
REG  
RISET2  
LED4  
LED3  
LED2  
LED1  
RADIM3  
CLED1U CLED2U CLED3U CLED4U  
RADIM2  
ADIM  
RADIM1  
CLED1D CLED2D CLED3D CLED4D  
RLED1 RLED2 RLED3 RLED4  
Figure 30. PCB Application Circuit Diagram  
Place the current detect resistor RCSH1, RCSH2 VCC pin capacitors CVCC1, CVCC2, and the load switch M1 so that they are  
shortest. Also, place the input filters RCSH3, CCSH for detecting the input current close to the CSH pin (pin 23). They can be  
placed on the opposite side of the IC and connected with a via.  
Place the input capacitors CIN1, CIN2 and the Diode D1 so that they are as short as the components of both the inductor L2  
and the load switch M1. Connect the ground of CIN1, CIN2, D1 to the PGND pin via EXP-PAD on the surface layer  
To reduce high frequency noises, the wires of the boost "Loop" must be as short as possible. Do not widen the wiring width  
more than necessary.  
·Place the SW pin (pin 20), the inductor L2 and the anodes of the diode D2 so that they are the shortest.  
·Place the cathode of D2 and the output decoupling capacitors COUT1, COUT2, COUT3, and COUT4 so that they are the  
shortest.  
·Place the output decoupling capacitors COUT1, COUT2, COUT3, COUT4 and the PGND pin (pin 19) so that they are the  
shortest.  
·Place the IC and each component on the same surface layer of the board and make connections in the same layer.  
Place the ground plane on the layer closest to the surface layer where the IC is placed.  
Connect the EXP-PAD to the board ground. Wire the ground pattern connected from the EXP-PAD as wide as possible to  
improve heat dissipation and connect it to the ground plane with many vias. To ensure heat dissipation according to power  
loss, place the required number of thermal vias directly under the EXP-PAD and connect them to the ground plane.  
There is no problem if the GND pin (pin 2), the LGND pin (pin 10) and the PGND pin (pin 19) are connected via the EXP-  
PAD. However, the power system ground such as the ground of the output decoupling capacitor and the PGND pin contains  
the noise component of the switching frequency. To reduce this noise component, it is recommended to connect to the  
ground plane using many vias in the ground pattern around the power system ground.  
Place the bypass capacitor (CREG) between the REG pin (pin 1) and the GND pin as close to pin as possible.  
The connection from VOUT to the anode of the LED panel and the connection from the cathode of the LED panel to the  
LED1, LED2, LED3, LED4 pins should be as short as possible. Depending on the parasitic inductance component, the LED  
current may become unstable.  
Do not run the wiring from the cathode of the LED panel to the LED1, LED2, LED3, LED4 pins in parallel with other active  
lines. Also, place the noise reduction capacitors (CLED1D, CLED2D, CLED3D, CLED4D) so that they are as short as the LED pin.  
RLED1, RLED2, RLED3, RLED4 are pull-down resistors connected to the LED pin of unused channel and is required to generate  
LED pin voltage that is judged to be unused.  
When using the PWM function, the PWM pin (pin 4) is the active line, so keep it away from other sense lines.  
When using the external synchronization function, the SYNC pin (pin 5) is an active line, so keep it away from other sense  
lines. Also, when using the external synchronization function, connect an RC filter with a cutoff frequency equivalent to the  
input external synchronization frequency to the SYNC terminal as a countermeasure against interference with the RT  
terminal. Be sure to check whether the output voltage of the RC filter satisfies the input threshold of the SYNC pin.  
Place R and C connected to the RT pin (pin 6), the COMP pin (pin 7), the ADIM pin (pin 8), the ISET pin (pin 9), the PLSET  
pin (pin 16), and the OVP pin (pin 18) as close to the IC as possible. They can be placed on the opposite side of the IC and  
connected with a via.  
Since OVP pin voltage must be 0.1 V or more during Self Diagnosis, when installing the COVP, use about 1000 pF as a guide.  
When the VCC voltage is turned ON with setting the EN pin to Low,, the voltage between the VCC-LDSW pins may open  
momentarily and an inrush current may flow depending on the VCC startup speed and the type of load switch (M1) used.  
Be sure to check with the actual application.  
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BD83A04EFV-M  
List of External Components  
Serial No.  
1
Component Name  
Component Value  
Product Name  
Manufacturer  
CB1  
CM  
-
-
-
2
Short  
-
-
3
CB2  
-
-
-
4
L1  
Short  
-
-
5
CVCC1  
CVCC2  
CVCC3  
RCSH1  
RCSH2  
RCSH3  
CCSH  
CLDSW  
M1  
1 μF  
GCM21BR71H105KA03  
murata  
6
-
-
-
7
1 μF  
GCM21BR71H105KA03  
murata  
8
15 mΩ  
LTR18 Series  
Rohm  
9
-
-
-
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
100 Ω  
MCR03 Series  
Rohm  
100 pF  
GCM1882C1H101JA01  
murata  
-
-
-
60 V / 36 A  
SQJ457EP  
VISHAY  
CIN1  
10 μF  
GCM32EC71H106KA03L  
murata  
CIN2  
10 μF  
GCM32EC71H106KA03L  
murata  
D1  
60 V / 1 A  
RBR1MM60ATF  
Rohm  
L2  
22 μH  
CLF10060NIT-220M-D  
TDK  
D2  
60 V / 5 A  
RB088LAM-60TF  
Rohm  
COUT1  
COUT2  
COUT3  
COUT4  
ROVP1  
ROVP2  
ROVP3  
COVP  
RFAIL  
10 μF  
GCM32EC71H106KA03L  
murata  
10 μF  
GCM32EC71H106KA03L  
murata  
-
-
-
33 μF  
GYA1H330MCQ1GS  
nichicon  
10 kΩ  
MCR03 Series  
Rohm  
330 kΩ  
MCR03 Series  
Rohm  
Short  
-
-
1000 pF  
GCM1882C1H102JA01  
murata  
100 kΩ  
MCR03 Series  
Rohm  
CPLSET1  
CPLSET2  
RLED1  
RLED2  
RLED3  
RLED4  
CLED1U  
CLED2U  
CLED3U  
CLED4U  
CLED1D  
CLED2D  
CLED3D  
CLED4D  
1000 pF  
GCM1882C1H102JA01  
murata  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
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BD83A04EFV-M  
List of External Components – continued  
Serial No.  
42  
Component Name  
CREG  
Component Value  
Product Name  
Manufacturer  
2.2 μF  
-
GCM21BR71C225KA49  
murata  
43  
RFL  
-
-
44  
CFL  
-
-
-
45  
RSYNCU  
RSYNCD  
RRT1  
-
-
-
46  
100 kΩ  
33 kΩ  
Short  
200 Ω  
0.1 μF  
-
MCR03 Series  
Rohm  
47  
MCR03 Series  
Rohm  
48  
RRT2  
-
-
49  
RCOMP1  
CCOMP1  
CCOMP2  
RISET1  
MCR03 Series  
Rohm  
50  
GCM155R11C104KA40D  
Murata  
51  
-
-
52  
15 kΩ  
Short  
100 kΩ  
Short  
-
MCR03 Series  
Rohm  
53  
RISET2  
-
-
54  
RADIM1  
RADIM2  
RADIM3  
MCR03 Series  
Rohm  
55  
-
-
-
-
56  
Note: The component constants vary depending on the operating conditions and the load used.  
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TSZ22111 • 15 • 001  
BD83A04EFV-M  
Application Components Selection Method  
Unless otherwise stated, the values in sentences are the values in continuous mode.  
Select the application components according to the following procedure.  
1. Derivating Maximum Input (Inductor) Peak Current IL(MAX)  
2. Selecting Inductor Constant  
Feedbacks the L value  
NG  
3. Setting Input Current Detect Resistor (RCSH  
)
4. Selecting PLSET Capacitance  
5. Selecting Output Capacitance  
6. Selecting Input Capacitance  
7. Setting Overvoltage Protection (OVP)  
8. Checking Rated Voltage/Current of Inductor (L), Diode (D1, D2), MOSFET  
(M1), Resistor (RCSH), and Capacitance (CIN, COUT  
)
9. Setting Phase Compensation Circuit  
10. Operation Check on Actual Device  
Figure 31. Application Components Selection Procedure  
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BD83A04EFV-M  
Application Components Selection Method – continued  
1 Derivating Maximum Input (Inductor) Peak Current IL(MAX)  
VCC  
CVCC  
RCSH  
CSH  
LDSW  
M1  
L1  
D1  
CIN  
D2  
SW  
VOUT  
COUT  
Figure 32. Output Application Circuit Diagram  
1.1 Calculating Maximum Output Voltage VOUT(MAX)  
Calculates VOUT(MAX) in consideration of LED Vf variation and the number of LED stages.  
ꢂ푂푈ꢇ  
= ꢂ푓  
× ꢈ + ꢂ  
(푀퐴푋)  
(푀퐴푋) 퐿퐸퐷ꢉꢅ퐿(푀퐴푋)  
ꢂ푂푈ꢇ  
ꢂ푓  
: Maximum output voltage  
(푀퐴푋)  
: Maximum value of LED Vf voltage  
: Number of LED series  
: Maximum value of LED control voltage  
(푀퐴푋)  
퐿퐸퐷ꢉꢅ퐿(푀퐴푋)  
1.2 Calculating Maximum Output Current IOUT(MAX)  
: Maximum output current  
ꢌꢑꢅ(푀퐴푋)  
퐿퐸퐷(푀퐴푋)  
ꢌꢑꢅ(푀퐴푋) = 퐼퐿퐸퐷(푀퐴푋) × ꢒ  
: Maximum value of LED current per  
channel  
: Number of LED parallels  
1.3 Calculating Maximum Input (Inductor) Peak Current IL(MAX)  
1
퐿(푀퐴푋) = 퐼퐿퐴푉퐺(푀퐴푋) + ∆퐼퐿(푀퐴푋)  
: Maximum input (inductor) peak  
current  
퐿(푀퐴푋)  
2
퐿퐴푉퐺(푀퐴푋) : Maximum input (inductor) average  
current  
IOUT(MAX)  
: Maximum input (inductor) current  
amplitude  
: Minimum power supply voltage  
∆퐼퐿(푀퐴푋)  
퐿퐴푉퐺(푀퐴푋) = ꢂ푂푈ꢇ  
×
(푀퐴푋)  
휂 × ꢂ퐶퐶(푀ꢃ푁)  
ꢂ퐶퐶(푀ꢃ푁)  
(푀ꢃ푁)  
푉ꢉꢉ  
VOUT  
푉ꢉꢉ  
(ꢓꢀꢔ)  
: Efficiency (about. 85 %)  
: Minimum value of inductance  
(ꢓꢀꢔ)  
(ꢘꢙꢚ)  
∆퐼퐿(푀퐴푋)  
=
×
×
VOUT  
(ꢘꢙꢚ)  
(ꢓꢀꢔ)  
ꢖ푆ꢗ(ꢓꢀꢔ)  
: Minimum value of DC/DC oscillator  
frequency  
ꢌꢄꢉ(푀ꢃ푁)  
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BD83A04EFV-M  
Application Components Selection Method – continued  
2 Selecting Inductor Constant  
To maintain stable continuous operation of the current mode DC/DC converter, the L (inductance) value must satisfy the  
following requirements:  
푉ꢌꢑꢅꢛ푉ꢉꢉ  
ꢍ5ꢞ.ꢞꢟ  
ꢂ푂푈ꢇ  
ꢂ퐶퐶  
: Output voltage  
: Power supply voltage  
: Inductance value  
퐿×ꢍꢏ  
ꢠ푇  
푅ꢅ  
: RT pin connecting resistor  
Rewriting about L is as follows  
(푉ꢌꢑꢅꢛ푉ꢉꢉ)×푅  
ꢠ푇  
ꢜ ≥  
ꢍ5ꢞ.ꢞꢟ×ꢍꢏ  
Consider the variation of the L value and set it with sufficient margin.  
3 Setting Input Current Detect Resistor (RCSH  
)
ꢌꢉ푃퐻(푀ꢃ푁)  
: Minimum value of input overcurrent  
protection detect current  
: Minimum value of input overcurrent  
protection detect voltage  
ꢌꢉ푃퐻(푀ꢃ푁)  
ꢌꢉ푃퐻(푀ꢃ푁)  
=
ꢉꢄ퐻(푀퐴푋)  
ꢌꢉ푃퐻(푀ꢃ푁)  
ꢂ퐶퐶(푀퐴푋)  
(푀ꢃ푁)  
> 4.0ꢡꢢ +  
× 푡ꢌꢉ푃퐿  
ꢉꢄ퐻(푀퐴푋) : Maximum value of input current detect  
resistor  
ꢌꢉ푃퐿  
: OCPL detect delay time (MAX = 150 ns)  
Select the RCSH value so that it will be as above.  
4 Selecting PLSET Capacitance  
푉ꢌꢑꢅ  
ꢌ퐹퐹퐿ꢌ퐴퐷 푀퐴푋  
=
(ꢓꢣꢤ) + 퐼ꢄ퐵퐷 푀퐴푋  
( )  
ꢖꢥꢦ(ꢓꢀꢔ)  
: Maximum value of load current when  
PWM = OFF  
: Minimum value of overvoltage protection  
detect resistor  
ꢌ퐹퐹퐿ꢌ퐴퐷(푀퐴푋)  
ꢌ푉푃(푀ꢃ푁)  
(
)
ꢌ퐹퐹퐿ꢌꢄꢄ 푀퐴푋 = 퐼  
) × 푡푃푊푀ꢌ퐹퐹 푀퐴푋  
(
(
)
(
)
ꢌ퐹퐹퐿ꢌ퐴퐷 푀퐴푋  
ꢄ퐵퐷(푀퐴푋)  
: Maximum value of rectifier diode leakage  
current  
: Maximum value of consumed charge  
when PWM = OFF  
ꢎ.5  
푃푊푀푅ꢃꢄ퐸  
=
× 퐼ꢌꢑꢅ(푀ꢃ푁)  
ꢖ푆ꢗ(ꢓꢀꢔ)  
ꢌ퐹퐹퐿ꢌꢄꢄ(푀퐴푋)  
푃푊푀ꢌ퐹퐹(푀퐴푋) : Maximum value of PWM = OFF time  
×ꢉ  
ꢦꢧ푆ꢁ푇(ꢓꢀꢔ)  
푃퐿ꢄ퐸ꢅ 푀ꢃ푁  
=
ꢦꢧ푆ꢁ푇(ꢓꢀꢔ) × 퐼ꢌꢑꢅ(푀ꢃ푁)  
(
)
푃푊푀푅ꢃꢄ퐸  
푃퐿ꢄ퐸ꢅ(푀ꢃ푁)  
: Insufficient charge after PWM rise  
: Minimum value of additional pulse output  
supply charge  
ꢦꢧ푆ꢁ푇(ꢓꢣꢤ)  
푃퐿ꢄ퐸ꢅ 푀ꢃ푁 > 푄  
) + 푄푃푊푀푅ꢃꢄ퐸  
: Minimum value of PLSET threshold  
voltage  
푃퐿ꢄ퐸ꢅ(푀ꢃ푁)  
(
)
(
ꢌ퐹퐹퐿ꢌꢄꢄ 푀퐴푋  
: Minimum value of PLSET pin capacitance  
푃퐿ꢄ퐸ꢅ(푀ꢃ푁)  
푃퐿ꢄ퐸ꢅ(푀퐴푋)  
Select the CPLSET value so that it will be as above.  
: Maximum value of PLSET charging  
current  
: Minimum output current  
ꢌꢑꢅ(푀ꢃ푁)  
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BD83A04EFV-M  
Application Components Selection Method – continued  
5 Selecting Output Capacitance  
The capacitor COUT used for the output is determined by the allowable amount of VOUTPP which is the ripple voltage of  
VOUT.  
×ꢉ  
×ꢃ  
)
(
)
ꢦꢧ푆ꢁ푇(ꢓꢣꢤ)  
(
)
(
(
)
ꢦꢧ푆ꢁ푇 ꢓꢣꢤ  
ꢖꢨ푇 ꢓꢣꢤ  
ꢖꢨ푇 ꢓꢣꢤ × ꢖꢔ ꢓꢣꢤ  
ꢂ푂푈푃푃(푀퐴푋)  
=
+
+ 퐼퐿(푀퐴푋) × ꢆ퐸ꢄ푅(푀퐴푋)  
)
×ꢉ  
×ꢕ  
)
ꢖꢨ푇 ꢓꢀꢔ ꢖ푆ꢗ ꢓꢀꢔ  
(
)
(
)
(
(
ꢦꢧ푆ꢁ푇 ꢓꢀꢔ  
ꢖꢨ푇 ꢓꢀꢔ  
: Maximum value of VOUT ripple voltage  
: Maximum value of PLSET threshold  
voltage  
푃퐿ꢄ퐸ꢅ(푀퐴푋) : Maximum value of PLSET pin capacitance  
ꢂ푂푈푃푃(푀퐴푋)  
푃퐿ꢄ퐸ꢅ(푀ꢃ푁)  
푃퐿ꢄ퐸ꢅ(푀퐴푋)  
: Minimum value of PLSET charging  
current  
: Maximum output current  
: Maximum value of DCDC-Duty  
ꢌꢑꢅ(푀퐴푋)  
ꢌꢑꢅ(푀ꢃ푁)  
ꢌ푁(푀퐴푋)  
: Minimum value of VOUT capacitance  
: Minimum value of DC/DC oscillator  
frequency  
ꢌꢄꢉ(푀ꢃ푁)  
퐿(푀퐴푋)  
: Maximum input (inductor) peak current  
퐸ꢄ푅(푀퐴푋)  
: Maximum value of equivalence serial  
resistor for output capacitance COUT  
The actual VOUT ripple voltage is affected by board layout and component characteristics. Be sure to check on the actual  
device and set the capacitance value considering sufficient margin so that it will be within the allowable ripple voltage.  
The maximum value of COUT that can be set is 100 μF.  
6 Selecting Input Capacitance  
A ceramic capacitor with an input capacitance of 10 μF or more and a low ESR is recommended. If a capacitor outside  
this range is selected, an excessive ripple voltage may be superimposed on the input voltage, causing IC malfunction.  
In addition, the capacitor CIN used for the input is determined by the allowable amount of VINPP which is the ripple voltage  
of VIN.  
7 Setting Overvoltage Protection (OVP)  
Overvoltage protection (OVP) is set by an external resistors ROVP1  
,
VOUT  
ROVP2. When the OVP pin becomes 1.21 V or more, it detects  
overvoltage and stops DC/DC switching. Also, when the OVP pin is  
1.21 V or more and the LED1 to LED4 pin voltage is 0.2 V or less,  
the open state is detected, and the circuit is latched off (Reference  
protection function).  
ROVP2  
OVP  
To prevent an open false detection, the resistor division voltage of  
the maximum value of the output voltage must be below the minimum  
value of open detection voltage.  
+
 
ROVP1  
1.21 V /  
1.16 V  
Set ROVP1, ROVP2 so that they satisfy the following formulas.  
Figure 33. OVP Application Circuit Diagram  
ꢂ푂푈ꢇ  
: Maximum output voltage  
ꢌ푉푃ꢍ  
(푀퐴푋)  
ꢂ푂푈ꢇ  
×
< ꢌ푉푃퐷퐸ꢅ(푀ꢃ푁)  
(푀퐴푋)  
ꢌ푉푃ꢍ  
: Overvoltage protection detect  
resistor (GND side)  
(
)
ꢌ푉푃ꢍ + ꢆꢌ푉푃ꢎ  
ꢌ푉푃ꢎ  
: Overvoltage protection detect  
resistor (VCC side)  
(1)  
ꢌ푉푃퐷퐸ꢅ(푀ꢃ푁) : Minimum value of overvoltage  
e.g.) When using 8 series of LEDs with RISET = 15.1 kΩ and Vf = 3.2  
V ±0.2 V.  
protection detect voltage  
ꢃꢄ퐸ꢅ  
ꢂ푂푈ꢇ  
: Resistor for LED current setting  
: Maximum output voltage  
(
)
ꢂ푂푈ꢇ  
= 3.2 + 0.2 × 8 + ꢂ  
(
)
(
)
푀퐴푋  
퐿퐸퐷ꢉꢅ퐿 푀퐴푋  
(푀퐴푋)  
: Maximum value of LED control  
voltage  
퐿퐸퐷ꢉꢅ퐿(푀퐴푋)  
= 28.0ꢡ [V]  
ꢌ푉푃ꢍ  
: Overvoltage protection detect  
resistor (GND side)  
ꢌ푉푃퐷퐸ꢅ(푀ꢃ푁) = 1.1ꢡ [V]  
ꢌ푉푃ꢎ  
: Overvoltage protection detect  
resistor (VCC side)  
ꢌ푉푃퐷퐸ꢅ(푀ꢃ푁) : Minimum value of overvoltage  
If ROVP1 = 20 kΩ, it is necessary to set ROVP2 > 464 kΩ from equation  
(1).  
protection detect voltage  
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BD83A04EFV-M  
Application Components Selection Method – continued  
8 Checking Rated Voltage/Current of Inductor (L), Diode (D1, D2), MOSFET (M1), Resistor (RCSH), and Capacitance  
(CIN, COUT  
)
(Note 1)  
Rated Current  
-
Rated Voltage  
-
Power Dissipation  
> IOCPH(MAX)2 x RCSH(MIN)  
Current Detect Resistor RCSH  
MOSFET M1  
(Note 2)  
(Note 3)  
> IOCPH(MAX)  
> VCC(MAX)  
-
-
-
-
-
-
Diode D1(Note 3)  
> VCC(MAX)  
> VCC(MAX)  
-
(Note 4)  
Input Capacitance CIN  
Inductor L  
-
(Note 5)  
> IA(MAX)  
(Note 5)  
(Note 6)  
Diode D2  
> IA(MAX)  
> VOUTOVP(MAX)  
Output Capacitance COUT  
-
> VOUTOVP(MAX)  
(Note 1) Consider the variation of external components and make setting with sufficient margin.  
(Note 2)ꢌꢉ푃퐻(푀퐴푋) = ꢌꢉ푃퐻(푀퐴푋)/ꢆꢉꢄ퐻(푀ꢃ푁)  
(Note 3) If diode D1 is not mounted, ringing will occur on the drain side of MOSFET M1 when MOSFET M1 is turned OFF due to input overcurrent  
protection. Ringing causes the drain side of MOSFET M1 to have a negative potential, which may cause the IC to malfunction.  
It is recommended to mount the diode D1 when using the input overcurrent protection function  
(Note 4) Set so that the rated value of the peak forward surge current > D1 generated current when input overcurrent protection is detected.  
When the input overcurrent protection is detected, check the D1 generated current on the actual device.  
푉ꢉꢉ(ꢓꢣꢤ)  
(Note 5)퐴(푀퐴푋) = 퐼ꢌꢉ푃퐿(푀퐴푋)  
+
× ꢌꢉ푃퐿  
: OCPL detect delay time (MAX = 150 ns)  
ꢌꢉ푃퐿  
Since the inductor current reaches IOCPL at startup, the recommended setting is Rated Current > IA (MAX)  
However, it is possible to set Rated Current > IL(MAX) after confirming that no damage occurs in the actual device.  
(Note 6) DC reverse voltage  
(ꢓꢀꢔ)  
.
9 Setting Phase Compensation Circuit  
About application stability conditions  
The stability conditions of the LED voltage feedback system are as follows.  
(1) Phase delay when gain is 1 (0 dB) is 150° or less (i.e., phase margin is 30° or more)  
(2) Frequency (unity gain frequency) when gain is 1 (0 dB) is 1/10 or less of switching frequency  
By inserting phase lead fz near the unity gain frequency,  
VOUT  
stability can be ensured by phase compensation.  
The phase delay fp1 is determined by COUT and the  
output impedance RL. Each is as follows.  
Phase lead 푓푧 = 1/(2휋 × ꢆ푃ꢉ × 퐶) [Hz]  
Phase delay 푓푝1 = 1/(2휋 × ꢆ× 퐶ꢌꢑꢅ  
)
[Hz]  
LED1 to  
LED 4  
Error  
AMP  
* Output impedance calculated by = ꢂ푂푈ꢇ/퐼ꢌꢑꢅ  
COMP  
Good results can be obtained by setting fz from 1 kHz to  
10 kHz. Substitute the value at maximum load for RL.  
+
RCOMP  
CCOMP  
PWM  
COMP  
Figure 34. Error AMP Block Application Circuit Diagram  
In addition, this setting is a simple calculation and is not calculated exactly, so it may be necessary to make adjustments  
on the actual device. Also, these characteristics will change depending on the board layout, load conditions, etc., so  
when designing for mass production, make sure to check the actual device before setting.  
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Application Components Selection Method – continued  
10 Operation Check on Actual Device  
Select the constant according to the above procedure and precautions regarding constant setting. In addition, since this  
selection is calculated by theoretical calculation, it does not include variations in external components or changes in their  
characteristics and is not guaranteed. The parameters that affect the characteristics of the product will change depending  
on the actual layout pattern, such as power supply voltage, LED current / number of lamps, inductor, output capacitance,  
and switching frequency, so be sure to check with the actual device.  
Additional Components for EMC Countermeasure  
The figure below shows the examples of EMC countermeasure components.  
(1) Capacitor for built-in FET current loop noise reduction  
(2) Capacitor for output current loop noise reduction  
(3) Capacitor for power line high frequency noise reduction  
(4) Low-pass filter for power line noise reduction  
(5) Common mode filter for power line noise reduction  
(6) Snubber circuit for built-in FET high frequency noise reduction  
(7) Snubber circuit for ringing reduction during built-in FET switching  
5
4
3
RCSH  
M1  
VCC  
CVCC  
1
D1  
CIN  
L1  
VREG  
1
2
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
REG  
GND  
EN  
VCC  
7
CREG  
CSH  
LDSW  
N.C.  
EN  
PWM  
3
VOUT  
4
PWM  
SYNC  
RT  
D2  
6
2
SYNC  
5
SW  
RRT  
COUT  
6
ROVP2  
PGND  
OVP  
CCOMP RCOMP  
EXP-PAD  
7
COMP  
ADIM  
ISET  
LGND  
LED1  
LED2  
RFAIL  
VREG  
8
VREG  
VFAIL  
ROVP1  
FAIL  
RISET  
9
PLSET  
N.C.  
CPLSET  
10  
11  
12  
LED4  
LED3  
Figure 35. Application Circuit Diagram Reference Example (including EMC countermeasure components)  
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BD83A04EFV-M  
Precautions for PCB Layout  
PCB layout patterns have a significant impact on efficiency and ripple  
characteristics, so care must be taken when designing. In the boost  
configuration, there is a "Loop" as shown in the figure on the right.  
Place the components in the Loop as close as possible (e.g., place  
GND of COUT and PGND as close together).  
VCC  
RCSH  
VCC  
CVCC  
Also, make sure that the wiring in each loop is as low impedance as  
possible.  
CSH  
Refer to "page 28 PCB Application Circuit Diagram" for other detailed  
precautions regarding PCB layout.  
LDSW  
M1  
D1  
CIN  
L1  
D2  
SW  
VOUT  
COUT  
Loop  
PGND  
Figure 36. Circuit of DC/DC Block  
Loop  
COUT  
D2  
Figure 37. BD83A04EFV-M PCB TOP-layer  
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BD83A04EFV-M  
Power Consumption Calculation Example  
The maximum value of IC power consumption can be easily calculated by the following procedure. Take heat dissipation  
measures so that the rise in chip temperature due to this power consumption does not exceed Tjmax under the environmental  
conditions (ambient temperature, heat dissipation fins, etc.) used by the customer.  
ꢉ(푀퐴푋) = 퐼ꢉꢉ(푀퐴푋) × ꢂ퐶퐶(푀ꢃ푁)  
+퐶ꢃꢄꢄ(푀퐴푋) × 푅퐸퐺(푀퐴푋) × 푓  
(1) Circuit power  
× 푅퐸퐺(푀퐴푋)  
(2) SW FET drive stage power  
ꢌꢄꢉ(푀퐴푋)  
( )  
) − ꢂ푓 )) × ꢈ × ꢒ − 1 } × 퐼퐿퐸퐷 푀퐴푋  
( ( )  
푀퐴푋 푀ꢃ푁  
+{ꢂ  
) × ꢒ + (ꢂ푓  
(
(
퐿퐸퐷ꢉꢅ퐿 푀퐴푋  
(3) Current driver power  
) × ꢆꢌ푁_ꢄ푊(푀퐴푋) × 퐼퐿퐴푉퐺(푀퐴푋) × 퐼퐿퐴푉퐺(푀퐴푋)  
(푉ꢌꢑꢅ ꢛ푉ꢉꢉ  
(
)
(
)
ꢓꢣꢤ  
ꢓꢀꢔ  
+
푉ꢌꢑꢅ  
(
)
ꢓꢣꢤ  
(4) Power during SW FET ON  
1
+퐼퐿퐴푉퐺 푀퐴푋) × ꢂ푂푈ꢇ  
) × × ꢊꢇ  
) + ꢇ  
)ꢋ × 푓  
(
(
(
(
(
)
푀퐴푋  
푟 푀퐴푋  
ꢕ 푀퐴푋 ꢌꢄꢉ 푀퐴푋  
(5) SW FET switching power  
ꢂ푂푈ꢇ  
= ꢂ푓  
× ꢈ + ꢂ  
(6) Output voltage  
(푀퐴푋)  
(푀퐴푋) 퐿퐸퐷ꢉꢅ퐿(푀퐴푋)  
ꢌꢑꢅ(푀퐴푋) = 퐼퐿퐸퐷(푀퐴푋) × ꢒ  
× 퐼ꢌꢑꢅ(푀퐴푋)/(휂 × ꢂ퐶퐶(푀ꢃ푁)  
(7) Output current  
퐿퐴푉퐺(푀퐴푋) = ꢂ푂푈ꢇ  
)
(8) Input (inductor) average current  
(푀퐴푋)  
ꢉ(푀퐴푋)  
: Maximum value of IC power consumption  
: Maximum value of circuit current  
: Minimum value of power supply voltage  
: Number of LED series  
ꢉꢉ(푀퐴푋)  
ꢂ퐶퐶(푀ꢃ푁)  
ꢃꢄꢄ(푀퐴푋)  
퐿퐸퐷(푀퐴푋)  
: Maximum value of LED current per channel  
: Maximum value of SW pin ON resistor  
: Maximum output voltage  
ꢌ푁_ꢄ푊(푀퐴푋)  
: Maximum value of SW FET gating  
capacitance  
ꢂ푂푈ꢇ  
(푀퐴푋)  
: Maximum value of oscillation frequency  
푟(푀퐴푋)  
: Maximum value of SW rise time  
: Maximum value of SW fall time  
: Maximum value of output current  
ꢌꢄꢉ(푀퐴푋)  
: Maximum value of reference voltage  
: Maximum value of LED control voltage  
: Number of LED parallels  
푅퐸퐺(푀퐴푋)  
ꢕ(푀퐴푋)  
ꢌꢑꢅ(푀퐴푋)  
퐿퐸퐷ꢉꢅ퐿(푀퐴푋)  
퐿퐴푉퐺(푀퐴푋) : Maximum value of input (inductor) average  
current  
: Maximum value of LED Vf voltage  
: Minimum value of LED Vf voltage  
: Efficiency (about 85 %)  
ꢂ푓  
(푀퐴푋)  
ꢂ푓  
(푀ꢃ푁)  
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Power Consumption Calculation Example – continued  
<Calculation Example>  
Calculate IC power consumption using the following conditions as an example.  
ꢉꢉ(푀퐴푋)  
ꢂ푓  
(푀퐴푋)  
Maximum value of circuit current 10 mA  
Maximum value of LED Vf voltage 3.4 V  
Minimum value of LED Vf voltage 3.0 V  
Minimum value of power supply  
ꢂ퐶퐶(푀ꢃ푁)  
ꢂ푓  
(푀ꢃ푁)  
10.5 V  
voltage  
Maximum value of SW FET gating  
capacitance  
ꢃꢄꢄ(푀퐴푋)  
100 pF  
Number of LED series  
8 stages  
Maximum value of oscillation  
frequency  
Maximum value of reference  
voltage  
Maximum value of LED control  
voltage  
Maximum value of LED current per  
channel  
Maximum value of SW pin ON  
resistor  
퐿퐸퐷(푀퐴푋)  
ꢌ푁_ꢄ푊(푀퐴푋)  
푟(푀퐴푋)  
374 kHz  
65 mA  
0.4 Ω  
20 ns  
ꢌꢄꢉ(푀퐴푋)  
푅퐸퐺(푀퐴푋)  
5.3 V  
0.74 V  
SW rise time  
퐿퐸퐷ꢉꢅ퐿(푀퐴푋)  
Number of LED parallels  
4 rows  
SW fall time  
20 ns  
0.9  
ꢕ(푀퐴푋)  
Efficiency (about 90 %)  
From equation (6),  
ꢂ푂푈ꢇ  
= ꢂ푓  
× ꢈ + ꢂ  
(푀퐴푋)  
(푀퐴푋) 퐿퐸퐷ꢉꢅ퐿(푀퐴푋)  
= 3.4 ꢂ × 8 + 0.ꢫ4 ꢂ  
= 2ꢫ.94 [V]  
From equation (7),  
ꢌꢑꢅ(푀퐴푋) = 퐼퐿퐸퐷(푀퐴푋) × ꢒ  
= ꢡꢬ 푚ꢢ × 4  
= 2ꢡ0 [mA]  
Substituting the values obtained in equations (6) and (7) into equation (8),  
퐿퐴푉퐺(푀퐴푋) = ꢂ푂푈ꢇ  
× 퐼ꢌꢑꢅ(푀퐴푋)/(휂 × ꢂ퐶퐶(푀ꢃ푁))  
(푀퐴푋)  
= 2ꢫ.94 ꢂ × 2ꢡ0 푚ꢢ/(0.9 × 10.ꢬ ꢂ)  
= 0.ꢫꢫ [A]  
Therefore, the maximum value of IC power consumption PC(MAX) is calculated as follows:  
ꢉ(푀퐴푋) = 10 푚ꢢ × 10.ꢬ ꢂ  
+100 푝ꢭ × ꢬ.3 ꢂ × 3ꢫ4 푘ꢐ푧 × ꢬ.3 ꢂ  
{
(
)
(
)}  
+ 0.ꢫ4 ꢂ × 4 + 3.4 ꢂ − 3.0 ꢂ × 8 × 4 − 1 × ꢡꢬ 푚ꢢ  
{(  
)
}
+ 2ꢫ.9 ꢂ − 10.ꢬ ꢂ /2ꢫ.9 ꢂ × 0.4 훺 × 0.ꢫꢫ ꢢ × 0.ꢫꢫ ꢢ  
(
)
+0.ꢫꢫ ꢢ × 2ꢫ.9 ꢂ/ꢡ × 20 푛푠 + 20 푛푠 × 3ꢫ4 푘ꢐ푧  
= 1.12 [W]  
From thermal resistance θja = 30.1 °C/W, the maximum calorific value Δt(MAX) can be estimated by the following equation.  
훥푡(푀퐴푋) = ꢉ(푀퐴푋) × 휃푗푎 = 1.12 ꢮ × 30.1 ℃/ꢮ = 33.ꢫ  
[°C]  
When the ambient temperature is 85 °C, the maximum chip temperature tC(MAX) is following.  
ꢉ(푀퐴푋) = 8ꢬ ℃ + 33.ꢫ ℃ = 118.ꢫ [°C]  
Make sure that tC(MAX) calculated here is less than Tjmax = 150 °C.  
The above is a simple calculation example only. The value of thermal resistance varies depending on the actual board  
conditions and layout. Confirm the calculation here as a guide for thermal design.  
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Application Circuit Example  
1 Peripheral Circuit When PMOS Is Not Used  
When the load switch M1 is not required, such as when using FUSE on the input side, connect the CSH pin and inductor  
L1 and open the LDSW pin.  
Also, set FUSE rating to IFUSE or more.  
퐹ꢑꢄ퐸 > 4.0ꢡ ꢢ + 푉ꢉꢉ(ꢓꢣꢤ) × 푡ꢌꢉ푃퐿  
퐹ꢑꢄ퐸  
: FUSE rated current  
: Maximum value of power supply voltage  
: Minimum value of inductance  
: OCPL detect delay time (MAX = 150 ns)  
ꢂ퐶퐶(푀퐴푋)  
(푀ꢃ푁)  
ꢌꢉ푃퐿  
(ꢓꢀꢔ)  
VCC  
CVCC  
VREG  
1
2
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
REG  
GND  
EN  
VCC  
CSH  
CREG  
M1  
Non-  
EN  
PWM  
3
mounted  
LDSW  
N.C.  
L1  
D1  
CIN  
4
PWM  
SYNC  
RT  
D2  
VOUT  
SYNC  
5
SW  
RRT  
COUT  
6
ROVP2  
PGND  
OVP  
CCOMP RCOMP  
EXP-PAD  
7
COMP  
ADIM  
ISET  
LGND  
LED1  
LED2  
RFAIL  
VREG  
8
VREG  
VFAIL  
ROVP1  
FAIL  
RISET  
9
PLSET  
N.C.  
CPLSET  
10  
11  
12  
LED4  
LED3  
2 Monitoring the Status of the FAIL Pin with Microcontroller  
OCPH function starts operation again after stopping operation for the specified timer time. Therefore, the FAIL pin  
periodically outputs the detect/release flag until the error is cleared. In the case of a system configuration that monitors the  
FAIL pin with a microcontroller, there is a possibility that it will be erroneously determined as a normal state even though it  
is in an abnormal state. By adding CFAIL as shown below, it is possible to fix the FAIL output to Low in an abnormal state.  
VCC  
CVCC  
RCSH  
VREG  
1
2
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
REG  
GND  
EN  
VCC  
CSH  
CREG  
M1  
L1  
EN  
PWM  
3
LDSW  
N.C.  
D1  
CIN  
4
PWM  
SYNC  
RT  
D2  
VOUT  
SYNC  
5
SW  
RRT  
COUT  
6
ROVP2  
PGND  
OVP  
CCOMP RCOMP  
EXP-PAD  
7
COMP  
ADIM  
ISET  
LGND  
LED1  
LED2  
RFAIL  
VREG  
8
VREG  
VFAIL  
ROVP1  
FAIL  
RISET  
9
CPLSET  
CFAIL  
PLSET  
N.C.  
10  
11  
12  
LED4  
LED3  
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BD83A04EFV-M  
I/O Equivalence Circuit  
1.REG, 24.VCC  
2.GND, 10.LGND,  
19.PGND  
3.EN  
VCC  
PGND  
EN  
30 kΩ  
360 kΩ  
REG  
GND  
363 kΩ  
50 kΩ  
150 kΩ  
150 kΩ 150 kΩ  
GND  
LGND  
GND  
4.PWM, 5.SYNC  
6.RT  
7.COMP  
REG  
10 kΩ  
10 kΩ  
10 kΩ  
PWM  
SYNC  
RT  
COMP  
GND  
400 Ω  
100 kΩ  
GND  
GND  
8.ADIM  
9.ISET  
11 14.LED1 - LED4  
REG  
REG  
ADIM  
GND  
REG  
ISET  
GND  
40 kΩ  
LED1  
10 kΩ  
10 kΩ  
LED2  
LED3  
LED4  
10 kΩ  
10 kΩ  
650 kΩ  
100 kΩ  
2 Ω 200 kΩ  
LGND  
16.PLSET  
17.FAIL  
18.OVP  
REG  
REG  
REG  
10 kΩ  
10 kΩ  
10 kΩ  
10 kΩ  
PLSET  
FAIL  
GND  
OVP  
GND  
1 kΩ  
100 kΩ  
GND  
20.SW  
22.LDSW  
23.CSH  
VCC  
VCC  
SW  
1 pF  
3 MΩ  
25 kΩ  
LDSW  
GND  
CSH  
GND  
PGND  
All values are Typ values.  
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BD83A04EFV-M  
Operational Notes  
1. Reverse Connection of Power Supply  
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when  
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply  
pins.  
2. Power Supply Lines  
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at  
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic  
capacitors.  
3. Ground Voltage  
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.  
4. Ground Wiring Pattern  
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but  
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal  
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations  
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.  
5. Recommended Operating Conditions  
The function and operation of the IC are guaranteed within the range specified by the recommended operating  
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical  
characteristics.  
6. Inrush Current  
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow  
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.  
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing  
of connections.  
7. Testing on Application Boards  
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject  
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should  
always be turned off completely before connecting or removing it from the test setup during the inspection process. To  
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and  
storage.  
8. Inter-pin Short and Mounting Errors  
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in  
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.  
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and  
unintentional solder bridge deposited in between pins during assembly to name a few.  
9. Unused Input Pins  
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and  
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge  
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause  
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power  
supply or ground line.  
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TSZ02201-0T2T0B200390-1-2  
© 2021 ROHM Co., Ltd. All rights reserved.  
42/46  
TSZ22111 • 15 • 001  
18.Aug.2022 Rev.006  
BD83A04EFV-M  
Operational Notes - continued  
10. Regarding the Input Pin of the IC  
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them  
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a  
parasitic diode or transistor. For example (refer to figure below):  
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.  
When GND > Pin B, the P-N junction operates as a parasitic transistor.  
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual  
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to  
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be  
avoided.  
Resistor  
Transistor (NPN)  
Pin A  
Pin B  
Pin B  
B
E
C
Pin A  
B
C
E
P
P+  
P+  
N
P+  
P
P+  
N
N
N
N
N
N
N
Parasitic  
Elements  
Parasitic  
Elements  
P Substrate  
GND GND  
P Substrate  
GND  
GND  
Parasitic  
Elements  
Parasitic  
Elements  
N Region  
close-by  
Figure 38. Example of Monolithic IC Structure  
11. Ceramic Capacitor  
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with  
temperature and the decrease in nominal capacitance due to DC bias and others.  
12. Thermal Shutdown Circuit (TSD)  
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always  
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the  
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj  
falls below the TSD threshold, the circuits are automatically restored to normal operation.  
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no  
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat  
damage.  
13. Over Current Protection Circuit (OCP)  
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This  
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should  
not be used in applications characterized by continuous operation or transitioning of the protection circuit.  
14. Functional Safety  
“ISO 26262 Process Compliant to Support ASIL-*”  
A product that has been developed based on an ISO 26262 design process compliant to the ASIL level described in  
the datasheet.  
“Safety Mechanism is Implemented to Support Functional Safety (ASIL-*)”  
A product that has implemented safety mechanism to meet ASIL level requirements described in the datasheet.  
“Functional Safety Supportive Automotive Products”  
A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the  
functional safety.  
Note: “ASIL-*” is stands for the ratings of “ASIL-A”, “-B”, “-C” or “-D” specified by each product's datasheet.  
www.rohm.com  
© 2021 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0T2T0B200390-1-2  
18.Aug.2022 Rev.006  
43/46  
BD83A04EFV-M  
Ordering Information  
B D 8 3 A 0 4 E F V -  
M E 2  
Package  
Product rank  
EFV: HTSSOP-B24  
M: for Automotive  
Packaging and forming specification  
E2: Embossed tape and reel  
Marking Diagram  
HTSSOP-B24 (TOP VIEW)  
Part Number Marking  
LOT Number  
D83A04EF  
Pin 1 Mark  
www.rohm.com  
© 2021 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0T2T0B200390-1-2  
18.Aug.2022 Rev.006  
44/46  
BD83A04EFV-M  
Physical Dimension and Packing Information  
Package Name  
HTSSOP-B24  
www.rohm.com  
© 2021 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0T2T0B200390-1-2  
18.Aug.2022 Rev.006  
45/46  
BD83A04EFV-M  
Revision History  
Date  
Revision  
Changes  
005  
New Release  
P.6, 28  
17.Feb.2022  
Added a note about the possibility of inrush current flowing when VCC is turned on with  
EN=L.  
006  
18.Aug.2022  
P.24, 28  
Changed description about RC filter for external synchronization and corrected typos.  
www.rohm.com  
© 2021 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0T2T0B200390-1-2  
46/46  
18.Aug.2022 Rev.006  
Notice  
Precaution on using ROHM Products  
(Note 1)  
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment  
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,  
bodily injury or serious damage to property (Specific Applications), please consult with the ROHM sales  
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any  
ROHMs Products for Specific Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASS  
CLASSⅣ  
CLASSb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.  
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the  
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our  
Products under any special or extraordinary environments or conditions (as exemplified below), your independent  
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.  
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble  
cleaning agents for cleaning residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in  
the range that does not exceed the maximum junction temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must  
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,  
please consult with the ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice-PAA-E  
Rev.004  
© 2015 ROHM Co., Ltd. All rights reserved.  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
A two-dimensional barcode printed on ROHM Products label is for ROHMs internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign  
trade act, please consult with ROHM in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data.  
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the  
Products with other articles such as components, circuits, systems or external equipment (including software).  
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM  
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to  
manufacture or sell products containing the Products, subject to the terms and conditions herein.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice-PAA-E  
Rev.004  
© 2015 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.  
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this document is current as of the issuing date and subject to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales  
representative.  
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
Notice – WE  
Rev.001  
© 2015 ROHM Co., Ltd. All rights reserved.  

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