BD868A0MUF-C [ROHM]

PMIC BD868XXMUF-C系列产品内置有一次侧DC-DC、两个二次侧DC-DC、CMOS传感器用的二次侧线性稳压器和图像传感电源。该系列IC采用小型封装VQFN20FV3535，非常适用于需要小型电路板的摄像头模块。另外，该系列产品还具有展频功能，可提供更低噪声的稳压输出。;


型号：	BD868A0MUF-C
厂家：	ROHM
描述：	PMIC BD868XXMUF-C系列产品内置有一次侧DC-DC、两个二次侧DC-DC、CMOS传感器用的二次侧线性稳压器和图像传感电源。该系列IC采用小型封装VQFN20FV3535，非常适用于需要小型电路板的摄像头模块。另外，该系列产品还具有展频功能，可提供更低噪声的稳压输出。集成电源管理电路传感器稳压器
文件：	总10页 (文件大小：946K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Product Brief

Automotive Power Management IC

PMIC for Automotive Camera

BD868xxMUF-C Series

General Description

Key Specifications

The PMIC BD868XXMUF-C series consists of primary

DCDC, dual secondary DCDC, secondary liner regulator

for CMOS sensor, and image sensing power supply.

This IC is optimal for camera module, which requires

small board with small package VQFN20FV3535.

This IC has the spread spectrum providing a lower noise

regulated outputs.

◼ Input Voltage Rating:

◼ Power Supply Voltage:

◼ Output Voltage (VO1):

◼ Output Voltage (VO2):

◼ Output Voltage (VO3):

◼ Output Voltage (VO4):

◼ Output Current (IO1):

◼ Output Current (IO2):

◼ Output Current (IO3):BD868A0 base

◼ Output Current (IO3):BD868B0 base

◼ Output Current (IO4):

◼ Switching Frequency:

◼ Operating Temperature Range:

(Note 2) Setting available range.

20 V (Max)

4.0 V to 18 V

3.0-5.0 V ^(Note2)(±2%)

0.95-1.5,1.8 V ^(Note2)(±2%)

2.7-3.5 V ^(Note2)(±2%)

2 A (Max)

1.2 A (Max)

Features

◼ AEC-Q100 Qualified ^{(Note 1)}

1 A (Max)

0.4 A (Max)

0.3 A (Max)

◼ ISO 26262 Process Compliant to Support ASIL-B

◼ Primary Buck DCDC Converter (VO1)

DCDC with Built-in FET

High Efficiency with Synchronous Rectification

◼ Dual Secondary Buck DCDC Converter (VO2, VO3)

DCDC with Built-in FET

2.25 MHz (±250 kHz)

-40 °C to +125 °C

Package

VQFN20FV3535

W (Typ) x D (Typ) x H (Max)

3.5 mm x 3.5 mm x 1.0 mm

High Efficiency with Synchronous Rectification

◼ Secondary LDO (VO4)

◼ Spread Spectrum Frequency Modulation

◼ Each Protection Function

◼ BIST at Startup

◼ 2-wire Interface communication (I²C protocol)

◼ GPO terminal for heater driver (BD868B0 base only)

(Note 1) Grade 1

Enlarged View

Applications

◼ ADAS

VQFN20FV3535

Wettable Flank Package

◼ Camera System Using CMOS Sensor

Typical Application Circuit

BD868A0 base

BD868B0 base

VO1

heater

driver

GPO

FB2

VO1

VIN

FB2

PVIN23

SW2

VIN

PVIN2

SW2

VO2

L₂

L₃

C_IN23

C_IN0

C_O2

C_O3

VO2

VREG50

VREG15

PGND23

SW3

VREG50

VREG15

L₂

C_IN23

VO3

VO4

Sensor

ISP

C_O2

C_O3

Sensor

ISP

PGND23

SW3

L₃

VO3

VO4

PVIN3

FB3

C₅₀

C₁₅

C₅₀

C₁₅

FB3

BOOT1

SW1

VO4

BOOT1

SW1

VO4

C_IN1C_B1

C_O4

L₁

VO3

L₁

VO3

VO1

C_O1

PGND1

FB1

C_O1

PGND1

FB1

RSTOUTB

POC

Serializer

POC

Serializer

WAROUTB

SCL

WAROUTB

SCL

I²

SDA

GND

〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.

www.rohm.com

Product Brief

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Product Brief

BD868xxMUF-C Series

Product Lineups

DC/DC

CH2

Function

LDO

CH4

part No.

Base Part

item

ISO 26262

supported

Protection

SSCG

CH1

CH3

Ouptut voltage

(Typ.)

3.7V 1.1V 1.8V 3.3V

2.0A 1.2A 1.0A 0.3A

3.7V 1.1V 1.8V 3.3V

2.0A 1.2A 0.4A 0.3A

3.3V 1.2V 1.8V 2.8V

2.0A 1.2A 1.0A 0.3A

3.8V 1.1V 1.8V 3.3V

2.0A 1.2A 1.0A 0.3A

3.3V 1.2V 1.8V 2.8V

2.0A 1.2A 1.0A 0.3A

☆BD868A0MUF-C

✓

Output current

(Max,)

Ouptut voltage

(Typ.)

☆BD868B0MUF-C

BD868C0MUF-C

☆BD868C1MUF-C

BD868D0MUF-C

✓

Output current

(Max,)

Ouptut voltage

(Typ.)

Output current

(Max,)

Ouptut voltage

(Typ.)

Output current

(Max,)

Ouptut voltage

(Typ.)

✓

Output current

(Max,)

*C0 and D0 have the same output voltage but different sequence control.

☆In development

＜ComfySIL^TMbrand＞

ROHM has launched the ComfySIL^TMbrand for its stakeholders, including customers who design functional safety, so that

its products can contribute to the safety, security, and comfort of social systems.

This, ComfySIL^TM, is awarded to products that follow the ComfySIL^TMphilosophy for functional safety, not only in the

automotive field but also in the industrial equipment field.

ComfySIL^TMWeb site：

https://www.rohm.co.jp/functional-safety

※ComfySIL^TMis a trademark or registered trademark of

ROHM Co.

Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

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BD868xxMUF-C Series

5. Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

6. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing

of connections.

7. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

8. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other espeially to ground, power supply and output pin. Inter-

pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

9. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. Unless otherwise specified, unused input pins should be connected to the power supply

or ground line.

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BD868xxMUF-C Series

Operational Notes – continued

10. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

Pin A

P⁺

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure. Example of monolithic IC structure

11. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

12. Thermal Shutdown Circuit (TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s maximum junction temperature rating. If However the rating is exceeded for a continued period, the

junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj

falls below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat

damage.

13. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

14. Functional Safety

“ISO 26262 Process Compliant to Support ASIL-*”

A product that has been developed based on an ISO 26262 design process compliant to the ASIL level described in

the datasheet.

“Safety Mechanism is Implemented to Support Functional Safety (ASIL-*)”

A product that has implemented safety mechanism to meet ASIL level requirements described in the datasheet.

“Functional Safety Supportive Automotive Products”

A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the

functional safety.

Note: “ASIL-*” is stands for the ratings of “ASIL-A”, “-B”, “-C” or “-D” specified by each product's datasheet.

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BD868xxMUF-C Series

Ordering Information

B D 8

x M U

C E 2

Part Number

Package

Product Rank

MUF: VQFN20FV3535

C: for Automotive

E2: Embossed tape and reel

Marking Diagrams

VQFN20FV3535 (TOP VIEW)

Part Number Marking

BD868

xxMUF

LOT Number

Pin 1 Mark

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BD868xxMUF-C Series

Physical Dimension and Packing Information

Package Name

VQFN20FV3535

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BD868xxMUF-C Series

Revision History

Date

Revision

001

Changes

06. Apr. 2022

New Release

Product Brief

06.Apr.2022 Rev.001

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7/7

Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.004

Daattaasshheeeett

General Precaution

1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this document is current as of the issuing date and subject to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales

representative.

3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

BD868A0MUF-C [ROHM]

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