BD90302NUF-C [ROHM]
BD90302NUF-C是BD8Pxxx系列专用的升压用驱动器MOSFET。BD8Pxxx系列是带升压功能的降压DC/DC转换器。通过连接使用BD8Pxxx系列和BD90302NUF-C，可构成同步整流升降压DC/DC转换器。;
| 型号： | BD90302NUF-C |
| 厂家： | 
ROHM |
| 描述： | BD90302NUF-C是BD8Pxxx系列专用的升压用驱动器MOSFET。BD8Pxxx系列是带升压功能的降压DC/DC转换器。通过连接使用BD8Pxxx系列和BD90302NUF-C，可构成同步整流升降压DC/DC转换器。 驱动 驱动器 转换器 |
| 文件： | 总19页 (文件大小：1507K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
5.5 V, 2 A
Pch/Nch Power MOSFET with Drivers
For Automotive
BD90302NUF-C
General Description
Key Specifications
PVOUT Pin Voltage:
SW2 Pin Current:
BD90302NUF-C are boost MOSFET with drivers for
BD8Pxxx Series(Note 1) exclusive use.
BD8Pxxx Series is a buck DC/DC Converter with
boost function.
3.0 V to 5.5 V
2 A (Max)
Pch Power MOSFET ON Resistance: 55 mΩ (Typ)
Nch Power MOSFET ON Resistance: 65 mΩ (Typ)
When used with BD8Pxxx Series, a synchronous
buck-boost DC/DC Converter is constituted.
(Note 1) About whether it supports BD90302NUF-C, refer to
Datasheet of BD8Pxxx Series.
Shutdown Circuit Current:
Operating Temperature:
0 μA (Typ)
-40 °C to +125 °C
Package
VSON10FV3030
W(Typ) x D(Typ) x H(Max)
3.00 mm x 3.00 mm x 1.00 mm
Features
AEC-Q100 Qualified(Note 1)
Built-in Pch/Nch Power MOSFET with Drivers
CTLIN Pin Enables to Control Pch/Nch Power
MOSFET
Wettable Flank SON Package
(Note 1) Grade 1
Enlarged View
Applications
Automotive Equipment
(Cluster Panel, Infotainment Systems)
Other Electronic Equipment
VSON10FV3030
Wettable Flank Package
Typical Application Circuit
Buck-Boost DC/DC Converter using BD8P250MUF-C.
BD8P250MUF-C
VIN
CBOOT
VIN
BOOT
BD90302NUF-C
SW2 PVOUT
CTLIN
L1
VOUT
SW
PVIN
EN
VOUT
CIN
COUT
PGND
VCC_EX
VMODE
MODE
SSCG
CTLOUT
PGOOD
VREG
RPGOOD
GND PGND
CREG
Figure 1. Application Circuit
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays
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Pin Configuration
10
9
SW2
SW2
SW2
1
2
3
PVOUT
PVOUT
PVOUT
N.C.
EXP-PAD
8
PGND
PGND
4
5
7
6
CTLIN
(TOP VIEW)
Figure 2. Pin Configuration
Pin Descriptions
Pin No.
Pin Name
SW2
Function
Inductor connection pins.
1, 2, 3
4, 5
These pins are connected to the drain of Pch/Nch Power MOSFET.
Ground pins.
PGND
CTLIN
These pins are connected to the source of Nch Power MOSFET.
The pin for control of Pch/Nch Power MOSFET.
Connect to the CTLOUT pin of BD8Pxxx Series.
6
No connection pin.
Leave this pin open.
7
N.C.
Output and internal power supply pins.
These pins are connected to the source of Pch Power MOSFET.
8, 9, 10
-
PVOUT
EXP-PAD
A backside heat dissipation pad. Connecting to the internal PCB ground plane by using
via provides excellent heat dissipation characteristics.
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Block Diagram
PVOUT
DRVH
HG
PVOUT
CTLIN
6
Driver
Logic
DRVL
LG
HG
SW2
1
PVOUT
8
9
2
3
10
LG
4
5
PGND
Figure 3. Block Diagram
Description of Blocks
1. Driver Logic
This circuit receives the CTLOUT signal output from BD8Pxxx Series and controls the Pch/Nch Power MOSFET for
boost.
Pch Power MOSFET is OFF and Nch Power MOSFET is ON when the CTLIN pin is 2.0 V or more.
Pch Power MOSFET is ON and Nch Power MOSFET is OFF when the CTLIN pin is 0.8 V or less.
2. DRVH
This is the driver circuit to drive the gate of Pch Power MOSFET.
3. DRVL
This is the driver circuit to drive the gate of Nch Power MOSFET.
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Absolute Maximum Ratings (Ta = 25 °C)
Parameter
PVOUT Pin Voltage
Symbol
Rating
Unit
VPVOUT
VSW2
VCTLIN
ISW2
-0.3 to +7.0
-0.3 to +7.0
-0.3 to +7.0
3.5
V
V
SW2 Pin Voltage
CTLIN Pin Voltage
V
SW2 Pin Current
A
Maximum Junction Temperature
Tjmax
150
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Caution 3: This IC does not have built-in thermal shutdown circuit and over current protection circuit that prevent damage to the IC. Operation of IC should
always be within the IC’s absolute maximum ratings.
Thermal Resistance (Note 1)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 3)
2s2p(Note 4)
VSON10FV3030
Junction to Ambient
Junction to Top Characterization Parameter(Note 2)
θJA
223.3
56
41.5
6
°C/W
°C/W
ΨJT
(Note 1) Based on JESD51-2A(Still-Air).
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
Thermal Via(Note 5)
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
Pitch
Diameter
4 Layers
1.20 mm
Φ0.30 mm
Top
Copper Pattern
Bottom
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
(Note 5) This thermal via connects with the copper pattern of all layers.
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Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
PVOUT Pin Voltage
Operating Temperature
SW2 Pin Current
VPVOUT
Topr
3.0
-40
-
5.0
5.5
+125
2
V
°C
-
-
-
ISW2
A
CTLIN Frequency
fCTLIN
-
2.4
MHz
Electrical Characteristics (Unless otherwise specified Ta = -40 °C~+125 °C, VPVOUT = 5.0 V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Shutdown Circuit Current
ISDN
ICC
-
-
0
65
55
65
-
1
μA
μA
mΩ
mΩ
V
VCTLIN = 0 V, Ta = 25 °C
VCTLIN = 5 V, Ta = 25 °C
VCTLIN = 0 V, ISW2 = -50 mA
VCTLIN = 5 V, ISW2 = +50 mA
Circuit Current
105
90
Pch Power MOSFET ON Resistance
Nch Power MOSFET ON Resistance
CTLIN Threshold Voltage High
CTLIN Threshold Voltage Low
CTLIN Input Current
RONP
RONN
VCTLINH
VCTLINL
ICTLIN
-
-
110
5.5
0.8
1
2.0
0
-
-
V
0
μA
VCTLIN = 5 V
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Typical Performance Curves
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
105
95
85
75
65
55
45
35
25
VPVOUT = 5.5 V
VPVOUT = 5.5 V
VPVOUT = 5.0 V
VPVOUT = 5.0 V
VPVOUT = 3.0 V
VPVOUT = 3.0 V
0.2
0.1
0.0
-50 -25
0
25
Temperature[°C]
Figure 4. Shutdown Circuit Current vs Temperature
50
75 100 125
-50 -25
0
25
50
75 100 125
Temperature[°C]
Figure 5. Circuit Current vs Temperature
105
95
85
75
65
55
45
35
25
85
VPVOUT = 3.0 V
VPVOUT = 3.0 V
75
65
55
VPVOUT = 5.0 V
VPVOUT = 5.5 V
VPVOUT = 5.0 V
VPVOUT = 5.5 V
45
35
25
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Temperature[°C]
Temperature[°C]
Figure 7. Nch Power MOSFET ON Resistance
vs Temperature
Figure 6. Pch Power MOSFET ON Resistance
vs Temperature
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Typical Performance Curves – continued
1.0
0.9
105
95
85
75
65
55
45
35
25
0.8
Ta = +125 °C
0.7
0.6
0.5
0.4
0.3
0.2
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
Ta = -40 °C, +25 °C
0.1
0.0
3.0
3.5
4.0
4.5
5.0
5.5
3.0
3.5
4.0
4.5
5.0
5.5
PVOUT Pin Voltage : VPVOUT[V]
PVOUT Pin Voltage : VPVOUT [V]
Figure 6. Shutdown Circuit Current vs PVOUT Pin Voltage
Figure 7. Circuit Current vs PVOUT Pin Voltage
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Ta = -40 °C, +25 °C, +125 °C
0.1
0.0
0
1
2
3
4
5
6
CTLIN Pin Voltage : VCTLIN[V]
Figure 8. CTLIN Input Current vs CTLIN Pin Voltage
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Function Explanations
Control Function
ON or OFF of Power MOSFET can be controlled by the voltage applied to the CTLIN pin.
Pch Power MOSFET is OFF and Nch Power MOSFET is ON when the CTLIN pin is 2.0 V or more.
Pch Power MOSFET is ON and Nch Power MOSFET is OFF when the CTLIN pin is 0.8 V or less.
VCTLINH
2.0 V
VCTLINL
0.8 V
VCTLIN
0
10 ns(Typ)
10 ns(Typ)
ON
OFF
ON
Pch Power MOSFET
10 ns(Typ)
10 ns(Typ)
OFF
OFF
Nch Power MOSFET
ON
Figure 11. Control Function Timing Chart
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Application Example
For Application Example, refer to Datasheet of BD8Pxxx Series.
PCB Layout Design
For the PCB Layout Design, refer to Datasheet of BD8Pxxx Series.
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Power Dissipation
For thermal design, be sure to operate the IC within the following conditions.
(Since the temperatures described hereunder are all guaranteed temperatures, take margin into account.)
1. The ambient temperature Ta is to be 125 °C or less.
2. The chip junction temperature Tj is to be 150 °C or less.
The chip junction temperature Tj can be obtained in the following two equations:
1. To obtain Tj from the package surface center temperature Tt in actual use
푇푗 = 푇푡 + 휓퐽ꢀ × 푊 [°C]
2. To obtain Tj from the ambient temperature Ta
푇푗 = 푇푎 + 휃퐽퐴 × 푊 [°C]
Where:
휓퐽ꢀ
휃퐽퐴
is junction to top characterization parameter [°C/W] (Refer to page 4)
is junction to ambient [°C/W] (Refer to page 4)
The heat loss W of the IC in the Shutdown can be obtained by the formula shown below:
2
푊 = 푅푂푁푃 × 퐼푂푈ꢀ + 푉푂푈ꢀ × 퐼푆퐷푁 [W]
Where:
푅푂푁푃
퐼푂푈ꢀ
푉푂푈ꢀ
퐼푆퐷푁
is the Pch Power MOSFET ON Resistance [Ω] (Refer to page 5)
is the Output Current [A]
is the Output Voltage [V]
is the Shutdown Circuit Current [A] (Refer to page 5)
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I/O Equivalence Circuits
1.2.3. SW2
6. CTLIN
PVOUT
PVOUT
SW2
100 kΩ
PGND
PVOUT
10 kΩ
CTLIN
PGND
PGND
PGND
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Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example, (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 12. Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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Ordering Information
B D 9
0
3
0
2 N U
F
-
C E 2
Part Number
Package
VSON10FV3030
Product class
C for Automotive applications
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
VSON10FV3030 (TOP VIEW)
Part Number Marking
D 9 0
3 0 2
LOT Number
Pin 1 Mark
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Physical Dimension and Packing Information
Package Name
VSON10FV3030
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Revision History
Date
Revision
001
Changes
12.Sep.2018
New Release
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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