BD9555FVM-C [ROHM]
罗姆的BD9555FVM-C是50V高耐压1ch CR定时器IC。通过外置零件的电阻、电容器可设置周期、Duty幅度。输入电压范围、动作温度范围都很大，适合用作车载定时器、振荡器。;
| 型号： | BD9555FVM-C |
| 厂家： | 
ROHM |
| 描述： | 罗姆的BD9555FVM-C是50V高耐压1ch CR定时器IC。通过外置零件的电阻、电容器可设置周期、Duty幅度。输入电压范围、动作温度范围都很大，适合用作车载定时器、振荡器。 电容器 振荡器 |
| 文件： | 总15页 (文件大小：915K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
CR Timer IC
50V 1ch Timer IC for Automotive
BD9555FVM-C
General Description
Key Specifications
ROHM’s BD9555FVM-C is 50V-withstanding 1ch CR
timer IC. Cycle and duty width can be set through
external resistance and capacity. It is most suitable as
timer and OSC for Automotive, so input voltage range
and operating temperature range are wide.
Input Voltage Range:
Operating Temperature Range: -40°C to +125°C
4.5V to 42V
Special Characteristics
PWM Frequency Range:
Duty Range:
1Hz to 10000Hz
1% to 99%
Features
AEC-Q100 Qualified(Note1)
Package
W(Typ) x D(Typ) x H(Max)
2.90mm x 4.00mm x 0.90mm
Frequency and Duty Width Setting
Through External Resistance and Capacity
Wide Input Voltage Range
MSOP8:
Wide Operating Temperature Range
Very Small MSOP8 Package
(Note1:Grade1)
Applications
All set for Automotive using timer or OSC
such as Automotive LED module, etc.
Typical Application Circuit
VIN
CVIN
REN
Q1
VIN
CRT
DCENB
BD9555FVM-C
RCRT
DCIN
DISC
OUT
OUT
GND
CCRT
GND
Pin Configurations, Descriptions and Marking Diagram
DISC
8
N.C.
5
CRT
7
GND
6
Pin
Symbol
VIN
Function
No.
Part Number Marking
LOT Number
1
Power supply
D
9
5
2
DCENB “L”:Output fixed “H” / “H”:PWM output
3
N.C.
OUT
N.C.
GND
CRT
DISC
N.C.
5
5
4
Output
N.C.
5
1PIN MARK
6
3
4
1
2
GND
VIN
OUT
DCENB N.C.
7
CR connection
Discharge setting
8
MSOP8 (TOP VIEW)
Ordering Information
B
D
9
5
5
5
F
V
M
-
C
T
R
Part
Number
Timer IC
Package
FVM : MSOP8
Product Rank
Packaging and forming specification
C : for Automotive Embossed tape and reel
TR : The pin number 1 is the upper right
○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays
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Physical Dimension, Tape and Reel Information
Package Name
MSOP8
<Tape and Reel information>
Tape
Embossed carrier tape
3000pcs
Quantity
TR
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1pin
Direction of feed
Order quantity needs to be multiple of the minimum quantity.
Reel
∗
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Absolute Maximum Ratings
Parameter
Symbol
Rating
-0.3 to +50
GND-0.3 to VIN +0.3
70
Unit
V
Power Supply Voltage
CRT, DISC, DCENB, OUT Terminal Voltage
Output Current
VIN
VCRT, VDISC, VDCENB, VOUT
V
Io
mA
W
Power Dissipation
Pd
0.38 (Note1)
Operating Temperature Range
Storage Temperature Range
Topr
Tstg
-40 to +125
-55 to +150
150
°C
°C
°C
Junction Temperature
Tjmax
(Note1) Pd deleted at 3.8mW/°C at temperatures above Ta=25°C.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Range
Parameter
Symbol
VIN
Limit
4.5 ~ 42
-40 ~ +125
1~10000
1
Unit
V
Power Supply Voltage
Operating Temperature Range
CR Timer Frequency Range
PWM Minimum Pulse Width
Topr
°C
Hz
µs
FPWM
TMIN
Recommended Operating Conditions
Limit
Parameter
Symbol
Unit
Conditions
Min
0.1
Typ
Max
-
Input Capacitor
CIN
-
-
-
µF Ceramic capacitor recommended
CRT Terminal Capacitor
CRT Terminal Resistor
CCRT
19p
18µ
F
Ceramic capacitor recommended
RCRT
500
5M
Ω
(Note2) The minimum value of capacitor must be met this specifications over full operating conditions. (ex. Temperature, DC bias, aging conditions)
(Note3) Set CCRT, RCRT to become desired frequency and Duty width by using equations shown in P.8.
Electrical Characteristics (Unless Otherwise Specified Ta=-40 to +125°C, VIN =13.0V)
Limit
Parameter
Symbol
Unit
mA
Conditions
Min
-
Typ
Max
3.00
Circuit Current
IIN
1.00
CRT Terminal
Charge Current
ICRT_SO
29.75 35.00 40.25 µA
VCRT=0.9V
CRT Terminal
Charge ON Voltage
CRT Terminal
Discharge ON Voltage
CRT Terminal
VCRT_CHA
VCRT_DIS
RCHA
0.99
2.7
51.6
-
1.10
3.0
54.3
50.0
-
1.21
3.3
V
V
57.0
100
kΩ
Ω
V
RCHA = (VCRT_DIS - VCRT_CHA) / ICRT_SO
VCRT=3.4V
Charge Resistance
DISC Terminal
RD
Discharge Resistance
DCENB Terminal
“H” Input Voltage
DCENB Terminal
“L” Input Voltage
VIN
+0.2
VIH_DCENB
VIL_DCENB
4.4
GND
-0.2
-
3.6
V
“H” Output Voltage
“L” Output Voltage
VOH
VOL
11.0
-
12.3
1.28
-
V
V
IOH=-10mA
IOL=50mA
3.8
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Typical Performance Curves
(Reference Data : Unless Otherwise Specified VIN=13.0V, RCRT =2.7kΩ, CCRT =0.033µF, <FPWM=500Hz, Duty=5% setting>)
3
2
1
0
40
35
30
Ta=125°C
Ta=-40°C
Ta=25°C
0
10
20
30
40
50
-50 -25
0
25 50 75 100 125 150
Temperature Ta [°C]
Input Voltage VIN [V]
Figure 1. Circuit Current vs Input Voltage
Figure 2. CRT Charge Current vs Temperature
3.5
1.5
1.0
0.5
3.0
2.5
-50 -25
0
25 50 75 100 125 150
Temperature Ta [°C]
-50 -25
0
25 50 75 100 125 150
Temperature Ta [°C]
Figure 3. CRT Charge ON Voltage vs Temperature
Figure 4. CRT Discharge ON Voltage vs Temperature
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Typical Performance Curves – continued
(Reference Data : Unless Otherwise Specified VIN=13.0V, RCRT =2.7kΩ, CCRT =0.033µF, <FPWM=500Hz, Duty=5% setting>)
70
60
50
40
80
70
60
50
40
30
20
-50 -25
0
25 50 75 100 125 150
Temperature Ta [°C]
-50 -25
0
25 50 75 100 125 150
Temperature Ta [°C]
Figure 5. CRT Charge Resistance vs Temperature
Figure 6. DISC Discharge Resistance vs Temperature
5
4
3
2
5
4
3
2
-50 -25
0
25
50
75 100 125 150
-50 -25
0
25
50
75 100 125 150
Temperature Ta [°C]
Temperature Ta [°C]
Figure 7. DCENB “H” Input Voltage vs Temperature
Figure 8. DCENB “L” Input Voltage vs Temperatute
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Typical Performance Curves – continued
(Reference Data : Unless Otherwise Specified VIN=13.0V, RCRT =2.7kΩ, CCRT =0.033µF, <FPWM=500Hz, Duty=5% setting>)
13
4
Ta=-40°C
Ta=25°C
3
12
Ta=125°C
Ta=25°C
Ta=-40°C
2
1
0
Ta=125°C
11
10
0
10 20 30 40 50 60 70 80 90 100
"L" Output Current IOL [mA]
0
10
20
30
"H" Output Current IOH [mA]
Figure 10. “L” Output Voltage vs “L” Output Current
Figure 9. “H” Output Voltage vs “H” Output Current
600
6
500
400
5
4
-50 -25
0
25 50 75 100 125 150
Temperature Ta [°C]
-50
-25
0
25
50
75
100
Temperature Ta [°C]
Figure 11. PWM Frequency vs Temperature
Figure 12. PWM On Duty vs Temperature
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Block Diagram
VIN
VREF
EN
OSC
CRT
OUT
DISC
GND
DCENB
Figure 13. BD9555FVM-C Block Diagram
Functional Description
Timer operation ON switches to OFF depending on DCENB terminal voltage.
When DCENB terminal voltage under VIL_DCENB(3.6V(Max)), timer operation turns to OFF and output is “H”.
When DCENB terminal voltage over VIH_DCENB(4.4V(Min)), CR timer function in IC is activated and triangular waveform is
generated at CRT terminal.
Output is “L” while CRT voltage is ramping up, and output is “H” while CRT voltage is ramping down.
Ramp up / down time of CRT voltage can be set by values of external components (CCRT, RCRT
)
VIN
+B
VREF
ICRT=35uA
(Typ)
EN
CRT
RCRT
OUT
OSC
CCRT
RD=50Ω(Typ)
DISC
GND
DCENB
CRT Voltage Ramp-up
3.0V
CRT Voltage Ramp-down
VCRT_DIS
CRT Terminal
Waveform
ΔVCRT
VCRT_CHA
1.1V
T1
T2
ΔVCRT x CCRT
ICRT_SO
VCRT_CHA
(1) T1=
(2) T2= -CCRT x (RCRT + RD) x ln(
)
VCRT_DIS
VOH
OUT Terminal
Waveform
VOL
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(1)CRT Ramp up Time T1
CRT ramp up time can be obtained from the following equations:
ΔVCRT x CCRT
T1 =
[s]
ICRT_SO
where:
ICRT_SO is the CRT Terminal Charge Current 35µA (Typ)
(2)CRT Ramp down Time T2
CRT ramp down time is defined by discharge period due to external capacity CCRT and resistance (RCRT+RD).
(CRT Terminal Charge Current is OFF at CRT ramp down.)
Make sure that T2 is set at not smaller than Min. pulse width 1µs.
VCRT_CHA
T2 =-CCRT x (RCRT + RD) x ln(
)
[s]
VCRT_DIS
where:
RD is the CRT Terminal Discharge Resistance
VCRT_CHA is the CRT Terminal Charge ON Voltage
VCRT_DIS is the CRT Terminal Discharge ON Voltage
50Ω(Typ)
1.1V(Typ)
3.0V(Typ)
(3)Frequency FPWM
PWM Frequency is defined by T1 and T2.
1
10000
1000
100
10
FPWM =
[Hz]
T1 + T2
(4)ON Duty (DON
)
Like the above, PWM ON duty is defined by T1 and T2.
T2
DON
=
T1 + T2
(Ex) In case of FPWM=500Hz and 6% Duty(Typ)
From FPWM=500Hz;
T1 + T2 = 1 / FPWM = 1 / 500Hz = 2000µs
From ON Duty = 6%; CRT ramp up time T1 is
T1 = (T1 + T2) x 0.94 = 1880µs
1
0.0001
0.001
0.01
0.1
1
10
100
CCRT - Capacitance ［uF]
External capacity CCRT is;
CCRT = T1 x (ICRT_SO /ΔVCRT) = 1880µs x 35µA / 1.9V ≒ 0.035µF
CRT ramp down time T2 is;
T2 = (T1 + T2) x 0.06 = 120µs
RCRT=10MΩ
RCRT=1MΩ
100
90
80
70
60
50
40
30
20
10
0
External resistance RCRT is;
RCRT = -T2 / (CCRT x ln(VCRT_CHA / VCRT_DIS)) – RD
= -120µs / (0.035µF x ln(1.1 / 3.0)) - 50Ω ≒ 3.4kΩ
RCRT=100kΩ
And the characteristics example of frequency and duty
is shown by the right figure.
This is the reference value of external components,
please decide its value by the above equations.
RCRT=10kΩ
RCRT=1kΩ
0.0001
0.001
0.01
0.1
1
10
100
CCRT - Capacitance ［uF]
Figure 14. Frequency and Duty
Characteristics Example
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Timing Chart
VIN
V
IN
VREF
ICRT=35uA
(Typ)
EN
CRT
OUT
OSC
CCRT
RCRT
DISC
RD=50Ω(Typ)
DRL/Po
Signal
GND
DCENB
ON
Vcc
OFF
H
DRL/Po
Signal
L
H
VDCENB
L
VCRT
OUT
③
①
②
Figure 15. Recommended Application Circuit and Timing Chart
① If VIN is switched ON and DCENB voltage is ”H” (VDCENB≧4.4V), VCRT will start oscillation, and according to its
waveform rectangular wave is output by OUT.
② If DCENB voltage is ”L”(VDCENB≦3.6V), OUT will be fixed at ”H”(ON Duty=100%)
③ And DCENB voltage is ”H”, oscillation will start again.
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Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Operational Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure 16. Example of hic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
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Revision History
Date
Revision
Changes
27.Oct.2014
29.Mar.2016
001
002
New Release
Correction of erroneous description
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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