BD9B200MUV_技术文档

Datasheet

2.7V to 5.5V Input, 2.0A Integrated MOSFET

Single Synchronous Buck DC/DC Converter

BD9B200MUV

General Description

Key Specifications

BD9B200MUV is

a

synchronous buck switching



Input Voltage Range:

2.7V to 5.5V

0.8 V to VPVIN x 0.8 V

2A (Max)

regulator with built-in low on-resistance power MOSFETs.

This IC, which is capable of providing current up to 2A,

features fast transient response by employing constant

on-time control system. It offers high oscillating

frequency at low inductance. With its original constant

on-time control method which operates low consumption

at light load, this product is ideal for equipment and

devices that demand minimal standby power

consumption.

Output Voltage Range:

Maximum Operating Current:

Switching Frequency:

High-Side MOSFET ON Resistance: 50mΩ (Typ)

Low-Side MOSFET ON Resistance: 50mΩ (Typ)

2MHz/1MHz (Typ)

Standby Current:

0μA (Typ)

Package

W (Typ) x D (Typ) x H (Max)

VQFN016V3030

3.00 mm x 3.00 mm x 1.00 mm

Features



Synchronous Single DC/DC Converter



Constant on-time control suitable to Deep-SLLM

Over Current Protection

Short Circuit Protection

Thermal Shutdown Protection

Under Voltage Lockout Protection

Adjustable Soft Start

Power Good Output

VQFN016V3030 Package

(Backside Heat Dissipation)

Applications

VQFN016V3030



Step-down Power Supply for DSPs, FPGAs,

Microprocessors, etc.



Laptop PCs/Tablet PCs/Servers

LCD TVs

Storage Devices (HDDs/SSDs)

Printers, OA Equipment

Entertainment Devices

Distributed Power Supply, Secondary Power Supply

Typical Application Circuit

Figure 1. Application Circuit

〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays

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Pin Configuration

(TOP VIEW)

16

15

14

13

PVIN

1

2

3

4

12 SW

11 SW

10 SW

E-Pad

PGND

9

SS

5

6

7

8

Figure 2. Pin Assignment

Pin Descriptions

Pin No.

Pin Name

PVIN

Function

Power supply terminals for the switching regulator.

These terminals supply power to the output stage of the switching regulator.

Connecting a 10µF ceramic capacitor is recommended.

1, 2

3, 4

5

PGND

AGND

Ground terminals for the output stage of the switching regulator.

Ground terminal for the control circuit.

An inverting input node for the error amplifier and main comparator.

See page 22 for how to calculate the resistance of the output voltage setting.

6

FB

Terminal for setting switching frequency. Connecting this terminal to ground makes

switching to operate constant on-time corresponding to 2.0MHz. Connecting this

terminal to AVIN makes switching to operate constant on-time corresponding to

1.0MHz. Please fix this terminal to AVIN or ground in operation.

7

FREQ

Terminal for setting switching control mode. Connecting this terminal to AVIN forces

the device to operate in the fixed frequency PWM mode. Connecting this terminal to

ground enables the Deep-SLLM control and the mode is automatically switched

between the Deep-SLLM control and fixed frequency PWM mode. Please fix this

terminal to AVIN or ground in operation.

8

9

MODE

SS

Terminal for setting the soft start time. The rise time of the output voltage can be

specified by connecting a capacitor to this terminal. See page 23 for how to calculate

the capacitance.

Switch nodes. These terminals are connected to the source of the High-Side

MOSFET and drain of the Low-Side MOSFET. Connect a bootstrap capacitor of 0.1

µF between these terminals and BOOT terminal. In addition, connect an inductor of

0.47µH to 1µH (FREQ=L), 1μH to 1.5μH (FREQ=H) considering the direct current

superimposition characteristic.

10, 11, 12

SW

Terminal for bootstrap. Connect a bootstrap capacitor of 0.1 µF between this terminal

and SW terminals. The voltage of this terminal is the gate drive voltage of the

High-Side MOSFET.

13

14

15

BOOT

PGD

EN

A “Power Good” terminal, an open drain output. Use of pull up resistor is needed. See

page 17 for how to specify the resistance. When the FB terminal voltage reaches

more than 80% of 0.8 V, the internal Nch MOSFET turns off and the output turns High.

Enable terminal. Turning this terminal signal Low (0.8V or lower) forces the device to

enter the shutdown mode. Turning this terminal signal High (2.0V or higher) enables

the device. This terminal must be terminated.

Terminal for supplying power to the control circuit of the switching regulator.

Connecting a 0.1µF ceramic capacitor is recommended.

This terminal must be connected to PVIN.

16

-

AVIN

A backside heat dissipation exposed pad. Connecting to the internal PCB ground

plane by using multiple vias provides excellent heat dissipation characteristics.

E-Pad

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Block Diagram

Figure 3. Block Diagram

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Description of Blocks

●

VREF

The VREF block generates the internal reference voltage.

●

UVLO

The UVLO block is for Under Voltage lockout protection. It will shut down the IC when VIN falls to 2.45 V (Typ) or

lower. The threshold voltage has a hysteresis of 100mV (Typ).

●

TSD

The TSD block is for thermal protection. The thermal protection circuit shuts down the device when the internal

temperature of IC rises to 175°C (Typ) or higher. Thermal protection circuit resets when the temperature falls. The

circuit has a hysteresis of 25°C (Typ).

Soft Start

The Soft Start circuit slows down the rise of output voltage during start-up and controls the current, which allows the

prevention of output voltage overshoot and inrush current. A built-in soft start function is provided and a soft start is

initiated in 1msec (Typ) when the SS terminal is open.

●

Control Logic + DRV

This block is a DC/DC driver. A signal from On Time is applied to drive the MOSFETs.

PGOOD

When the FB terminal voltage reaches more than 80% of 0.8 V, the Nch MOSFET of the built-in open drain output

turns off and the output turns High.

●

OCP/SCP

After soft start is completed and in condition where output voltage is below 70% (Typ) of voltage setting, it counts the

number of times of which current flowing in High side FET reaches over current limit. When 512 times is counted it

stops operation for 1m sec (Typ) and re-operates. Counting is reset when output voltage is above 80% (Typ) of

voltage setting or when EN, UVLO, SCP function is re-operated.

●

Error Amplifier

Adjusts Main Comparator input to make internal reference voltage equal to FB terminal voltage.

Main Comparator

Main comparator compares Error Amplifier output and FB terminal voltage. When FB terminal voltage becomes low it

outputs High and reports to the On Time block that the output voltage has dropped below control voltage.

●

On Time

This is a block which creates On Time. Requested On Time is created when Main Comparator output becomes High.

On Time is adjusted to restrict frequency change even with input and output voltage change.

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Absolute Maximum Ratings (Ta = 25°C)

Parameter

Symbol

Rating

Unit

Supply Voltage

VPVIN, VAVIN

VEN

-0.3 to +7

-0.3 to +14

-0.3 to +7

-0.3 to VPVIN + 0.3

2.5

V

EN Terminal Voltage

MODE Terminal Voltage

FREQ Terminal Voltage

PGD Terminal Voltage

Voltage from GND to BOOT

Voltage from SW to BOOT

FB Terminal Voltage

VMODE

VFREQ

VPGD

VBOOT

⊿VBOOT

VFB

V

SW Terminal Voltage

VSW

V

Output Current

IOUT

A

Allowable Power Dissipation^{(Note 1)}

Operating Temperature Range

Storage Temperature Range

Pd

2.66

W

C

Topr

-40 to 85

Tstg

-55 to 150

(Note 1) VQFN016V3030: Derate by 21.3mW when operating above 25C

PCB size: 70mm x 70mm x 1.6mm when mounted on a 4-layer glass epoxy board (copper foil area: 70mm x 70mm)

Copper foil thickness: Front side and reverse side 70µm be used, 2nd and 3rd 35µm be used.

Caution1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over

the absolute maximum ratings.

Recommended Operating Conditions (Ta= -40°C to +85°C)

Parameter

Symbol

Min

Typ

Max

Unit

Supply Voltage

Output Current ^{(Note 2)}

VPVIN, VAVIN

IOUT

2.7

-

5.5

2

V

A

V

Output Voltage Range

VRANGE

0.8

VPVIN × 0.8

(Note 2) Pd, ASO should not be exceeded.

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Electrical Characteristics (Unless otherwise specified Ta=25°C, V_AVIN= V_PVIN= 5V, V_EN= 5V, V_MODE= GND)

Parameter

Symbol

Min

Typ

Max

Unit

Conditions

AVIN pin

Standby Supply Current

Operating Supply Current

ISTB

ICC

-

0

10

60

µA

EN=GND

FREQ=AVIN, IOUT=0mA

Non switching

40

UVLO Detection Threshold

UVLO Release Threshold

UVLO Hysteresis

VUVLO1

VUVLO2

2.35

2.425

50

2.45

2.55

100

2.55

2.7

V

VIN falling

VIN rising

VUVLOHYS

200

mV

Enable

EN Input High Level Voltage

EN Input Low Level Voltage

EN Input Current

VENH

VENL

IEN

2.0

-

V

-

0.8

10

5

µA

EN=5V

Reference Voltage, Error Amplifier

FB Terminal Voltage

VFB1

IFB

0.792

-

0.8

-

0.808

1

V

FB Input Bias Current

Internal Soft Start Time

Soft Start Terminal Current

Control

µA

ms

µA

FB=0.8V

TSS

ISS

0.5

1.0

2.0

With internal constant

VFRQH

VFRQL

VAVIN-0.3

-

V

FREQ Input High Level Voltage

FREQ Input Low Level Voltage

MODE Input High Level Voltage

MODE Input Low Level Voltage

On time1

-

0.3

-

VMODEH

VMODEL

ONT1

VAVIN-0.3

V

-

0.3

144

288

V

96

120

240

ns

VOUT=1.2V, FREQ=GND

VOUT=1.2V, FREQ=AVIN

ONT2

192

On time2

Power Good

Power Good Rising Threshold

Power Good Falling Threshold

Output Leakage Current

Power Good On Resistance

Power Good Low Level Voltage

SW

VPGDH

75

65

-

80

70

85

75

%

µA

Ω

FB rising, VPGDH=FB/VFBx100

FB falling, VPGDL=FB/VFBx100

PGD=5V

VPGD

L

ILKPGD

RPGD

0

5

-

100

0.1

200

0.2

PGDV

-

V

I_PGD=1mA

L

High Side FET On Resistance

Low Side FET On Resistance

High Side Output Leakage Current

Low Side Output Leakage Current

RONH

RONL

RILH

RILL

-

50

0

100

10

mΩ

µA

BOOT-SW=5V

No switching

0

10

µA

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Typical Performance Curves

45

3.0

2.5

2.0

1.5

1.0

0.5

0.0

40

VIN=5V

35

30

VIN=3.3V

25

20

15

10

5

VIN=5V

VIN=3.3V

0

-40

-20

0

20

40

60

80

-40

-20

0

20

40

60

80

Temperature [°C]

Figure 4. Operating Supply Current vs Temperature

Figure 5. Stand-by Supply Current vs Temperature

100

MODE=L

MODE=H

90

80

70

60

50

40

30

20

10

0

MODE=L

80

70

60

50

MODE=H

40

30

20

VOUT=1.2V

FREQ=L

VOUT=1.2V

FREQ=H

10

0

1

10

100

1000

10000

1

10

100

1000

10000

Load Current [mA]

Figure 6. Efficiency vs Load Current

(VIN=5V, VOUT=1.2V, L=1.0µH, FREQ=L)

Figure 7. Efficiency vs Load Current

(VIN=5V, VOUT=1.2V, L=1.5µH, FREQ=H)

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Typical Performance Curves - continued

100

90

80

70

60

50

40

30

20

10

0

100

90

MODE=L

MODE=H

80

MODE=L

70

MODE=H

60

50

40

30

20

VOUT=3.3V

FREQ=L

VOUT=3.3V

FREQ=H

10

0

1

10

100

1000

10000

1

10

100

1000

10000

Load Current [mA]

Figure 8. Efficiency vs Load Current

(VIN=5V, VOUT=3.3V, L=1.0µH, FREQ=L)

Figure 9. Efficiency vs Load Current

(VIN=5V, VOUT=3.3V, L=1.5µH, FREQ=H)

0.808

0.806

0.804

0.802

0.800

0.798

0.796

0.794

0.792

2.60

2.56

2.52

2.48

2.44

2.40

2.36

Release

VIN=5V

VIN=3.3V

Detect

-40

-20

0

20

40

60

80

-40

-20

0

20

40

60

80

Temperature [°C]

Figure 10. FB Voltage vs Temperature

Figure 11. UVLO Threshold vs Temperature

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Typical Performance Curves - continued

2.0

1.8

7.0

6.0

5.0

4.0

3.0

2.0

VIN=5V

VIN=5.0V

UP

1.6

VIN=3.3V

1.4

1.2

1.0

DOWN

VIN =5.0V

VIN=3.3V

60

-40

-20

0

20

40

80

-40

-20

0

20

40

60

80

Temperature [°C]

Figure 12. EN Threshold vs Temperature

Figure 13. EN Input Current vs Temperature

3.5

3.0

2.5

2.0

1.5

1.0

0.5

2.5

2.0

1.5

1.0

0.5

0.0

VIN=5V

VIN=3.3V

-40

-20

0

20

40

60

80

-40

-20

0

20

40

60

80

Temperature [°C]

Figure 14. FREQ Threshold vs Temperature

Figure 15. FREQ Input Current vs Temperature

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Typical Performance Curves - continued

3.5

6.0

5.5

5.0

4.5

4.0

3.5

3.0

VIN=5V

3.0

2.5

2.0

VIN=3.3V

1.5

1.0

0.5

-40

-20

0

20

40

60

80

-40

-20

0

20

40

60

80

Temperature [°C]

Figure 16. MODE Threshold Voltage vs Temperature

Figure 17. MODE Input Current vs Temperature

60

55

50

60

55

50

45

40

35

30

25

20

VIN=3.3V

45

40

35

V

IN

=5V

VIN=5V

30

25

20

-40

-20

0

20

40

60

80

-40

-20

0

20

40

60

80

Temperature [°C]

Figure 18. High Side ON-Resistance vs Temperature

Figure 19. Low Side ON-Resistance vs Temperature

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Typical Performance Curves - continued

85

120

110

100

90

RISING

80

75

70

VIN=3.3V

80

FALLING

65

VIN=5V

70

60

-40

-20

0

20

40

60

80

-40

-20

0

20

40

60

80

Temperature [°C]

Figure 20. PGD Threshold vs Temperature

Figure 21. PGD ON ON-Resistance vs Temperature

2.0

1.5

1.0

0.5

0.0

2.0

1.6

VIN=3.3V

VIN=5V

1.2

0.8

0.4

0.0

VIN=3.3V

-40

-20

0

20

40

60

80

-40

-20

0

20

40

60

80

Temperature [°C]

Figure 22. Soft Start Time vs Temperature

Figure 23. SS Terminal Current vs Temperature

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Typical Performance Curves - continued

2400

1200

1000

800

600

400

200

0

MODE=H

2000

1600

1200

800

400

FREQ=L

VIN=5V

FREQ=H

VIN=5V

MODE=L

0

250 500 750 1000 1250 1500 1750 2000

Load Current [mA]

0

250 500 750 1000 1250 1500 1750 2000

Load Current [mA]

Figure 24. Switching Frequency vs Load Current

Figure 25. Switching Frequency vs Load Current

2400

2300

2200

2100

2000

1900

1800

1700

1600

1200

1150

1100

1050

1000

950

900

VOUT=1.2V

MODE=H

FREQ=L

IOUT=2A

VOUT=1.2V

MODE=H

FREQ=H

IOUT=2A

850

800

3.0

3.5

4.0

4.5

5.0

5.5

3.0

3.5

4.0

4.5

5.0

5.5

VIN Input Voltage [V]

Figure 26. Switching Frequency vs Input Voltage

fSW[kHz]

Figure 27. Switching Frequency vs Input Voltage

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Typical Performance Curves - continued

VIN=5V/div

EN=5V/div

VIN=5V/div

EN=5V/div

Time=1ms/div

VOUT=1V/div

SW=5V/div

VOUT=1V/div

SW=5V/div

Figure 29. Power Down Waveform with EN

(FREQ=H, RLOAD=0.6Ω)

Figure 28. Power Up Waveform with EN

(FREQ=H, RLOAD=0.6Ω)

VIN=5V/div

EN=5V/div

VOUT=1V/div

SW=5V/div

VIN=5V/div

EN=5V/div

Time=1ms/div

VOUT=1V/div

SW=5V/div

Figure 30. Power Up Waveform with VIN

Figure 31. Power Down Waveform with VIN

(FREQ=H, RLOAD=0.6Ω)

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Typical Performance Curves - continued

VOUT=20mV/div

SW=2V/div

VOUT=20mV/div

Time=1µs/div

SW=2V/div

Figure 32. Switching Waveform

(VIN=5V, VOUT=1.2V, FREQ=L, IOUT=0.1A)

Figure 33. Switching Waveform

(VIN=5V, VOUT=1.2V, FREQ=L, IOUT=2A)

VOUT=20mV/div

Time=1µs/div

SW=2V/div

Figure 34. Switching Waveform

(VIN=5V, VOUT=1.2V, FREQ=H, IOUT=0.2A)

Figure 35. Switching Waveform

(VIN=5V, VOUT=1.2V, FREQ=H, IOUT=2A)

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Typical Performance Curves - continued

1.0

0.8

0.6

0.4

1.0

0.8

0.6

MODE=L

MODE=H

0.4

0.2

MODE=H

0.0

-0.2

-0.4

-0.6

-0.8

-1.0

-0.4

-0.6

-0.8

-1.0

MODE=L

2.5

3.0

3.5

4.0

4.5

5.0

5.5

0.0 0.3 0.5 0.8 1.0 1.3 1.5 1.8 2.0

Load Current [A]

V_INInput Voltage[V]

Figure 36. Line Regulation

(VOUT=1.2V, L=1.5μH, FREQ=H, IOUT=2A)

Figure 37. Load Regulation

(VIN=5V, VOUT=1.2V, L=1.5μH, FREQ=H)

VOUT=50mV/div

IOUT=1A/div

Time=0.5m/div

IOUT=1A/div

Time=0.5m/div

Figure 39. Load Transient Response IOUT=0A to 2A

(VIN=5V, VOUT=1.2V, FREQ=L, MODE=H, COUT=Ceramic 44µF)

Figure 38. Load Transient Response IOUT=0.1A to 2A

(VIN=5V, VOUT=1.2V, FREQ=L, MODE=L, COUT=Ceramic 44µF)

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Application Example(s)

1. Basic Operation

(1) DC/DC Converter operation

BD9B200MUV is a synchronous rectifying step-down switching regulator that achieves faster transient response by

employing constant on-time control system. It utilizes switching operation in PWM (Pulse Width Modulation) mode

for heavier load, while it utilizes Deep-SLLM (Deep-Simple Light Load Mode) control for lighter load to improve

efficiency.

①

Deep-SLLM Control

② PWM Control

Output Current IOUT [A]

Figure 40. Efficiency (Deep-SLLM Control and PWM Control)

②PWM Control

①

Deep-SLLM Control

VOUT

20mV/div

SW

2.0V/div

Figure 41. Switching Waveform at Deep-SLLM Control

(VIN=5.0V, VOUT=1.2V, IOUT=100mA)

Figure 42. Switching Waveform at PWM Control

(VIN=5.0V, VOUT=1.2V, IOUT=2A)

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(2) Enable Control

The IC shutdown can be controlled by the voltage applied to the EN terminal. When VEN reaches 2.0 V(Min), the

internal circuit is activated and the IC starts up. To enable shutdown control with the EN terminal, the shutdown

interval (Low level interval of EN) must be set to 100 µs or longer. Startup by EN must be at the same time or after

the input of power supply voltage.

VEN

EN terminal

VENH

VENL

0

t

VOUT

Output setting voltage

0

t

Soft start 1 msec

(typ.)

Figure 43. Start Up and Down with Enable

(3) Power Good

When the output voltage reaches more than 80% of the voltage setting, the open drain NMOSFET, internally

connected to the PGD terminal, turns off and the PGD terminal turns to Hi-z condition. Also when the output voltage

falls below 70% of voltage setting, the open drain NMOS FET turns on and PGD terminal pulls down with 100Ω.

Connecting a pull up resistor (10KΩ to 100KΩ) is recommended.

Figure 44. Power Good Timing Chart

(4) Soft Start

When EN terminal is turned High, Soft Start operates and output voltage gradually rises. With the Soft Start Function,

over shoot of output voltage and rush current can be prevented. Rising time of output voltage when SS terminal is

open is 1msec (Typ). Capacitor connected to SS terminal makes rising time more than 1msec. Please refer to page

23 for the method of setting rising time.

Figure 45. Soft Start Timing Chart

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2. Protection

The protective circuits are intended for prevention of damage caused by unexpected accidents. Do not use them

for continuous protective operation

(1) Over Current Protection (OCP) / Short Circuit Protection (SCP)

Setting of Over current protection is 4.5A (Typ). When OCP is triggered, over current protection is realized by

restricting On / Off Duty of current flowing in upper MOSFET by each switching cycle. Also, if Over current protection

operates 512 cycles in a condition where FB terminal voltage reaches below 70% of internal standard voltage, Short

Circuit protection (SCP) operates and stops switching for 1msec (Typ) before it initiates restart. However, during

startup, Short circuit protection will not operate even if the IC is still in the SCP condition.

Table 1. Over Current Protection / Short Circuit Protection Function

Over current

protection

Short circuit

protection

EN terminal

PGD

Startup

While start up

Valid

Invalid

Valid

L

More than 2.0V

Less than 0.8V

Startup completed

H

＊

Valid

Invalid

＊

Invalid

1ms(typ.)

V_OUT

FB

High side

MOSFET gate

Low side

MOSFET gate

OCP threshold

Coil current

Inside IC

OCP signal

512 Cycle

PGD

Figure 46. Short Circuit Protection (SCP) Timing Chart

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(2) Under Voltage Lockout Protection (UVLO)

The Under Voltage Lockout Protection circuit monitors the AVIN terminal voltage.

The operation enters standby when the AVIN terminal voltage is 2.45V (Typ) or lower.

The operation starts when the AVIN terminal voltage is 2.55V (Typ) or higher.

V_IN

0V

UVLO OFF

hys

UVLO ON

V_OUT

Soft start

FB

terminal

High side

MOSFET gate

Low side

MOSFET gate

Normal operation

UVLO

Normal operation

Figure 47. UVLO Timing Chart

(3) Thermal Shutdown

When the chip temperature exceeds Tj=175C (Typ), the DC/DC converter output is stopped. The circuits are

automatically restored to normal operation when the chip temperature falls. It has a hysteresis of 25C (Typ). The

thermal shutdown circuit is intended for shutting down the IC from thermal runaway in an abnormal state with the

temperature exceeding Tjmax=150C. It is not meant to protect or guarantee the soundness of the application. Do

not use the function of this circuit for application protection design.

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Application Example

Figure 48. Application Circuit

Table 2. Recommended Component Values (VIN=5V, FREQ=H)

VOUT

Reference

Designator

Description

1.0V

100kΩ

75kΩ

300kΩ

10μF

0.1μF

22μF

120p

1.2V

100kΩ

75kΩ

150kΩ

10μF

1.5V

100kΩ

160kΩ

180kΩ

10μF

1.8V

100kΩ

150kΩ

120kΩ

10μF

3.3V

100kΩ

160kΩ

51kΩ

10μF

R5

R7

-

R8

C2^{(Note 3)}

10V, X5R, 3216

25V, X5R, 1608

-

C4

0.1μF

22μF

0.1μF

22μF

0.1μF

22μF

0.1μF

22μF

C8^{(Note 4)}

C9

6.3V, X5R, 3225

-

C10

C14

L1

22μF

120pF

1.5μH

150pF

1.5μH

180pF

1.5μH

180pF

1.5μH

TOKO, FDSD0420

Table 3. Recommended Component Values (VIN=5V, FREQ=L)

VOUT

Reference

Designator

Description

1.0V

100kΩ

75kΩ

300kΩ

10μF

0.1μF

22μF

100p

1.2V

100kΩ

75kΩ

150kΩ

10μF

1.5V

100kΩ

160kΩ

180kΩ

10μF

1.8V

100kΩ

150kΩ

120kΩ

10μF

3.3V

100kΩ

160kΩ

51kΩ

10μF

R5

R7

-

R8

C2^{(Note 3)}

-

10V, X5R, 3216

25V, X5R, 1608

-

C4

0.1μF

22μF

0.1μF

22μF

0.1μF

22μF

0.1μF

22μF

C8^{(Note 4)}

C9

6.3V, X5R, 3225

-

C10

C14

L1

22μF

120pF

1.0μH

100pF

1.0μH

120pF

1.0μH

120pF

1.0μH

TOKO, FDSD0420

(Note 3) For capacitance of input capacitor take temperature characteristics, DC bias characteristics, etc. into consideration to set minimum value to no

less than 4.7μF.

(Note 4) For capacitance of bootstrap capacitor take temperature characteristics, DC bias characteristics, etc. into consideration to set minimum value

to no less than 0.047μF.

※Evaluation using the actual machine must be done for above constant is only a value on our evaluation board.

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Selection of Components Externally Connected

1. Output LC Filter Constant

In order to supply a continuous current to the load, the DC/DC converter requires an LC filter for smoothing the

output voltage. It is recommended to use inductors of values 0.47µH to 1.0µH when FREQ=L or 1.0µH to 1.5µH at

FREQ=H.

IL

Inductor saturation current > I_OUTMAX+⊿I_L/2

IOUTMAX

⊿I_L

Average inductor current

t

Figure 49. Waveform of current through inductor

Figure 50. Output LC filter circuit

Inductor ripple current ∆IL

1

ΔI_LꢀV_OUTꢁ ꢃV_IN-V_OUTꢂ ꢁ

ꢀ 608



mA



V_INꢁ F_SWꢁ L

Where:

VIN= 5V

VOUT= 1.2V

L=1.5µH

F_SW=1MHz (switching frequency)

The saturation current of the inductor must be larger than the sum of the maximum output current and 1/2 of the inductor

ripple current ꢀIL.

The output capacitor COUT affects the output ripple voltage characteristics. The output capacitor COUT must satisfy the

required ripple voltage characteristics.

The output ripple voltage can be represented by the following equation.

1

ΔV _RPLꢀ ΔI _Lꢁ ꢃR _ESR

ꢅ

ꢂ

V

 

8 ꢁ C _OUTꢁ F_SW

where RESR is the Equivalent Series Resistance (ESR) of the output capacitor.

* The capacitor rating must allow a sufficient margin with respect to the output voltage.

The output ripple voltage can be decreased with a smaller ESR.

A ceramic capacitor of about 22 µF to 47 µF is recommended.

*Be careful of total capacitance value, when additional capacitor C_LOADis connected in addition to output capacitor C_OUT

Use maximum additional capacitor C_LOAD(Max) condition which satisfies the following condition.

.

Maximum starting inductor ripple current IL_STARTꢄ Over Current limit 2.9AꢃMinꢂ

Maximum starting inductor ripple current I^LSTARTcan be expressed using the following equation.

ΔI_L

IL_STARTꢀ Maximum starting output currentꢃI_OMAXꢂ ꢅ Charge current to output capacitorꢃI_CAPꢂ ꢅ

2

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Charge current to output capacitor I_CAPcan be expressed using the following equation.

ꢃC_OUTꢅ C_LOADꢂ ꢁV_OUT

T_SS

[ ]

A

I_CAP

ꢀ

For example, given VIN= 5V, VOUT= 3.3V, L= 1.5µH, switching frequency F_SW= 800kHz(Min), Output capacitor COUT=

44µF, Soft Start time TSS= 0.5ms(Min), and load current during soft start IOSS= 2A, maximum C_LOADcan be computed

using the following equation.

ꢃ2.9 ‐ I_OSS‐ ΔI _L/2ꢂꢁT_SS

C _LOADꢃMaxꢂꢆ

‐C_OUT 21.6

μF

 

V_OUT

If the value of CLOAD is large, and cannot meet the above equation, adjust the value of the capacitor CSS to meet the

condition below.

ꢃ2.9 ‐ I_OSS‐ ΔI _L/2ꢂ ꢁV _FB

C _LOADꢃMaxꢂ ꢄ

ꢁ C _SS‐C _OUT

V_OUTꢁ I _SS

(Refer to the following items (3) Soft Start Setting equation of time TSS and soft-start value of the capacitor to be

connected to the CSS.)

For example, given VIN = 5V, VOUT = 3.3V, L = 1.5µH, load current during soft start IOSS = 2A, switching frequency FSW=

800kHz (Min), Output capacitor COUT = 44µF, VFB = 0.792V(Max), ISS = 2.0µA(Max), with CLOAD = 220uF, capacitor CSS

is computed as follows.

V_OUTꢁ I_SS

ꢃ2.9 ‐ I_OSS‐ ΔI _L/2ꢂ ꢁV_FB

C_SS

ꢇ

ꢁ ꢃC _LOADꢅ C_OUTꢂ ꢀ 5086

pF

 

2. Output Voltage Setting

The output voltage value can be set by the feedback resistance ratio.

For stable operation, it is recommended to use feedback resistance R1 of more than 20kΩ.

V_OUT

R1ꢅ R2

V

OUT

ꢀ

ꢁ 0.8



V



R1

R2

Error Amplifier

FB

0.8V

0.8

R2 ꢀ

ꢁ R1ꢆꢆ Ω



V

OUT ‐ 0.8

Figure 51. Feedback Resistor Circuit

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3. Soft Start Setting

Turning the EN terminal signal High activates the soft start function. This causes the output voltage to rise gradually

while the current at startup is placed under control. This allows the prevention of output voltage overshoot and inrush

current. The rise time depends on the value of the capacitor connected to the SS terminal.

T_SSꢀ ꢃC _SSꢁV_FBꢂ/I_SS

C_SSꢀ ꢃI_SSꢁT_SSꢂ/V_FB

ꢆ

Where :

^ꢆꢆTꢆ _SS

is Soft Start Time

ꢆꢆ

is Capacitor connected to Soft Start Time Terminal

isFB Terminal Voltage (0.8V (Typ))

SS

FB

ꢆꢆI_SSis Soft Start Terminal Source Current (1.0μA(Typ))

with C_SSꢀ 0.01μF ,

T_SSꢀ ꢃ0.01



μF



ꢁ 0.8



V



)/1.0



μA



ꢀ 8.0



msec



Turning the EN terminal signal High with the SS terminal open or with the terminal signal High (no capacitor

connected) causes the output voltage to rise in 1msec (Typ).

4. FB Capacitor

Generally, in fixed ON time control (hysteresis control), sufficient ripple voltage in FB voltage is needed to operate

comparator stably. Regarding this IC, by injecting ripple voltage to FB voltage inside IC it is designed to correspond

to low ESR output capacitor. Please set the FB capacitor within the range of the following expression to inject an

appropriate ripple.

V_OUT

V_IN

V_OUT

V_IN

V_OUTꢁ ꢃ1‐

ꢂ

V_OUTꢁ ꢃ1‐

ꢂ

ꢆ C_FBꢄ

F_SWꢁ 7.65 ꢁꢆꢆ10³

F_SWꢁ 3.3 ꢁꢆꢆ10³

ꢆ

Where:

ꢆꢆ ^INis Input Voltage

ꢆꢆ ^{OUT ꢆꢆꢆ}is Output Voltage

ꢆꢆFSW ꢆꢆꢆis Switching Frequency

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PCB Layout Design

In the step-down DC/DC converter, a large pulse current flows into two loops. The first loop is the one into which the current

flows when the High-Side FET is turned ON. The flow starts from the input capacitor CIN, runs through the FET, inductor L

and output capacitor COUT and back to GND of CIN via GND of COUT. The second loop is the one into which the current

flows when the Low-Side FET is turned on. The flow starts from the Low-Side FET, runs through the inductor L and output

capacitor COUT and back to GND of the Low-Side FET via GND of COUT. Route these two loops as thick and as short as

possible to allow noise to be reduced for improved efficiency. It is recommended to connect the input and output capacitors

directly to the GND plane. The PCB layout has a great influence on the DC/DC converter in terms of all of the heat

generation, noise and efficiency characteristics.

Figure 52. Current Loop of Buck Converter

Accordingly, design the PCB layout considering the following points.



Connect an input capacitor as close as possible to the IC PVIN terminal on the same plane as the IC.

If there is any unused area on the PCB, provide a copper foil plane for the GND node to assist heat dissipation from

the IC and the surrounding components.



Switching nodes such as SW are susceptible to noise due to AC coupling with other nodes. Route the coil pattern as

thick and as short as possible.



Provide lines connected to FB far from the SW nodes.

Place the output capacitor away from the input capacitor in order to avoid the effect of harmonic noise from the input.

Power Dissipation

When designing the PCB layout and peripheral circuitry, sufficient consideration must be given to ensure that the power

dissipation is within the allowable dissipation curve.

4.0

(1) 4-layer board (surface heat dissipation copper foil 5505 mm²)

(copper foil laminated on each layer)

θJA = 47.0°C/W

(2) 4-layer board (surface heat dissipation copper foil 6.28 mm²)

3.0

(1)2.66 W

(copper foil laminated on each layer)

θJA = 70.62°C/W

(3) 1-layer board (surface heat dissipation copper foil 6.28 mm²)

2.0

(2)1.77 W

θJA = 201.6°C/W

(4) IC only

θJA = 462.9°C/W

(3)0.62 W

Board specification: Glass-Epoxy, 70mm x 70mm x 1.6mm

Copper foil thickness: Front side and reverse side 70µm be used,

(4)0.27 W

0

2nd and 3rd 35µm be used.

0

25

50

75

100

125 150

Ambient temperature: Ta [°C]

Figure 53. Thermal Derating Characteristics

(VQFN016V3030)

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I/O equivalence circuit(s)

6. FB

7. FREQ

8. MODE

9. SS

10.11.12. SW

13. BOOT

PVIN

BOOT

PVIN

BOOT

SW

14. PGD

15. EN

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Operational Notes

1.

2.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3.

4.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

Thermal Consideration

Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when

the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum

rating, increase the board size and copper area to prevent exceeding the Pd rating.

6.

7.

Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may

flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and

routing of connections.

8.

9.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

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Operational Notes – continued

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided.

Figure 54. Example of monolithic IC structure

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

14. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe

Operation (ASO).

15. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below

the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

16. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

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Ordering Information

B D 9 B 2 0 0 M U V -

E 2

Part Number

Package

VQFN016V3030

Packaging and forming specification

E2: Embossed tape and reel

Marking Diagrams

VQFN016V3030 (TOP VIEW)

Part Number Marking

D

2

9

0

B

0

LOT Number

1PIN MARK

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Physical Dimension, Tape and Reel Information

Package Name

VQFN016V3030

Tape

Embossed carrier tape

3000pcs

Quantity

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

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Revision History

Date

Revision

001

Changes

28.Aug.2015

New Release

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.001

Daattaasshheeeett

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.001

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001


型号：	BD9B200MUV
厂家：	ROHM
描述：	BD9B200MUV是内置低导通电阻的功率MOSFET的同步整流降压型开关稳压器。最大可输出2A的电流。采用轻负载时进行低消耗动作的独创恒定时间控制方式，适用于要降低待机功耗的设备。振荡频率高，适用于小型电感。是恒定时间控制DC/DC转换器，具有高速瞬态响应性能。开关转换器稳压器
文件：	总33页 (文件大小：1122K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD9B200MUV [ROHM]

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