BD9D320EFJ [ROHM]

BD9D320EFJ是内置低导通电阻的功率MOSFET的同步整流降压型开关稳压器。最大可输出3A的电流。是恒定时间控制DC/DC转换器，具有高速瞬态响应性能，无需外接的相位补偿电路。;


型号：	BD9D320EFJ
厂家：	ROHM
描述：	BD9D320EFJ是内置低导通电阻的功率MOSFET的同步整流降压型开关稳压器。最大可输出3A的电流。是恒定时间控制DC/DC转换器，具有高速瞬态响应性能，无需外接的相位补偿电路。开关转换器稳压器
文件：	总26页 (文件大小：1085K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Datasheet

4.5V to 18V Input, 3.0A Integrated MOSFET

1ch Synchronous Buck DC/DC Converter

BD9D320EFJ

General Description

Key Specifications

BD9D320EFJ is a synchronous buck switching regulator

with built-in low on-resistance power MOSFETs. It is

capable of providing current of up to 3 A. External phase

compensation circuit is not necessary for it is a constant

on-time control DC/DC converter with high speed

response.



Input Voltage Range:

Output Voltage Setting Range:

4.5V to 18.0 V

0.765V to 7V

(V_IN×0.07)V to (V_IN×0.65)V



Reference Voltage:

Output Current:

Switching Frequency:

High Side MOSFET On-Resistance:100 m Ω (Typ)

Low Side MOSFET On-Resistance: 70 m Ω (Typ)

Standby Current:

0.765V ± 1.5%

3 A (Max)

700 kHz (Typ)

Features



Synchronous Single DC/DC Converter

Constant On-time Control

Over Current Protection

2 μA (Typ)

Package

HTSOP-J8

W (Typ) x D (Typ) x H (Max)

4.90mm x 6.00mm x 1.00mm

Short Circuit Protection

Thermal Shutdown Protection

Under Voltage Lockout Protection

Adjustable Soft Start

HTSOP-J8 Package (Backside Heat Dissipation)

Applications



Step-down Power Supply for DSPs, FPGAs,

Microprocessors, etc.

Set-top Box

LCD TVs

DVD / Blu-ray Player / Recorder

Entertainment Devices



HTSOP-J8

Typical Application Circuit

Figure 1. Typical Application Circuit

○Product structure: Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays.

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Pin Configuration

(TOP VIEW)

VIN

BOOT

VREG

GND

Figure 2. Pin Assignment

Pin Descriptions

Terminal

No.

Symbol

Function

Turning this terminal signal low level (0.3 V or lower) forces the device to enter the shutdown

mode. Turning this terminal signal high level (2.2 V or higher) enables the device. This

terminal must be terminated.

An inverting input terminal of comparator which compares with reference voltage (V_REF).

Refer to page.15 for how to calculate the resistance of the output voltage setting.

Power supply voltage terminal inside IC.

Voltage of 5.25V (Typ) is outputted with more than 2.2V is impressed to EN terminal.

Connect 1µF ceramic capacitor to ground.

VREG

Terminal for setting the soft start time. The rise time of the output voltage can be specified by

connecting a capacitor to this terminal. Refer to page.15 for how to calculate the capacitance.

GND

Ground terminal for the output stage of the switching regulator and the control circuit

Switch node. This terminal is connected to the source of the high-side MOSFET and drain of

the low-side MOSFET. Connect a bootstrap capacitor of 0.1µF between this terminal and

BOOT terminal. In addition, connect an inductor considering the direct current

superimposition characteristic.

Connect a bootstrap capacitor of 0.1µF between this terminal and SW terminal.

The voltage of this capacitor is the gate drive voltage of the high-side MOSFET.

BOOT

VIN

Power supply terminal for the switching regulator.

Connecting a 20µF(10µF×2) and 0.1µF ceramic capacitor to ground is recommended.

A backside heat dissipation pad. Connecting to the internal PCB ground plane by using

multiple via provides excellent heat dissipation characteristics.

FIN

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Block Diagram

VREG

VIN

VREG

VIN

5V REG

Thermal

Protection

TSD

VOUT

VREG

BOOT

UVLO

TSD

VOUT

On Time

Controller

Block

Soft

Start

Driver

Circuit

OCP

REF

GND

UVLO

OCP

TSD

EN Logic

UVLO

Figure 3. Block Diagram

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Absolute Maximum Ratings (Ta = 25C)

Parameter

Input Voltage ^{(Note 1)}

BOOT Voltage ^{(Note 1)}

Symbol

VIN

Rating

Unit

VBOOT

BOOT-SW Voltage ^{(Note 1)}

Output Feedback Voltage

SW Voltage ^{(Note 1)}

VBOOT-VSW

VFB

VREG

VSW

VREG Voltage ^{(Note 1)}

SS Voltage ^{(Note 1)}

VREG

VSS

Logic Input Voltage ^{(Note 1)}

VEN

(Note 2)

Power dissipation

3.75

°C

Operating Temperature Range

Storage Temperature Range

Topr

-40 to +85

-55 to +150

+150

Tstg

Junction Temperature

Tjmax

(Note 1) No need to exceed Pd.

(Note 2) Derating in done 30.08 mW/°C for operating above Ta ≥ 25°C (Mount on 4-layer 70.0mm×70.0mm×1.6mm board)

Caution1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over

the absolute maximum ratings.

Caution2: The operating temperature range is intended to guarantee functional operation and does not guarantee the life of the LSI within this range. The life of

the LSI is subject to derating depending on usage environment such as the voltage applied, ambient temperature and humidity. Consider derating in the design

of equipment and devices.

Recommended Operating Conditions

Limit

Parameter

Symbol

Unit

Min

Typ

Max

Input voltage

VIN

VBOOT

VSW

4.5

BOOT voltage

4.5

SW Voltage

-0.7

+18

5.5

BOOT-SW voltage

Logic Input Voltage

Output Current

VBOOT-VSW

VEN

4.5

IOUT

Output Voltage Range

VRANGE

0.765 ^{(Note 3)}

7 ^{(Note 4)}

(Note 3) Please use under the condition of VOUT ≥ VIN×0.07 [V].

(Note 4) Please use under the condition of VOUT ≤ VIN×0.65 [V].

(Refer to the page 15 for how to calculate the output voltage setting.)

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Electrical Characteristics

(Ta = 25°C, VIN = 12V, VEN = 3V unless otherwise specified)

Limit

Typ

Parameter

Symbol

Unit

Conditions

Min

Max

Standby Circuit Current

I_STB

µA

VEN=GND

VEN=3V, IOUT=0mA

when no switching

Operating Circuit Current

I_VIN

EN Low Voltage

V_ENL

V_ENH

I_EN

2.2

0.3

VIN

EN High Voltage

EN Bias Current

µA

VEN=3V

<5V Linear Regulator Block >

VREG Standby Voltage

V_{VREG_STB}

V_VREG

0.1

5.5

VEN=GND

VREG Output Voltage

5.25

Maximum Current

I_REG

< Under-Voltage Lock-Out Block >

UVLO Threshold Voltage

UVLO Hysteresis Voltage

< Reference Voltage Block >

V_{VREG_UVLO}

3.4

3.8

4.2

VREG: Sweep up

dV_{VREG_UVLO}

200

300

400

VREG: Sweep down

VIN=12V,

VOUT=1.8V

FB Threshold Voltage

V_REF

0.753

0.765

0.777

FB Input Current

I_FB

µA

SS Charge Current

I_SSC

1.4

2.0

2.6

VREG=5.25V,

VSS=0.5V

SS Discharge Current

I_SSD

0.1

0.2

< On Time Control Block >

On Time

VIN=12V,

VOUT=1.8V

Ton

215

200

nsec

Minimum Off Time

Toffmin

100

High Side FET ON Resistance

Low Side FET ON Resistance

< Over Current Protection Block >

R_ONH

R_ONL

100

200

140

mΩ

(Note 5)

Over Current Protection Current Limit

Iocp

(Note 5) No tested on outgoing inspection.

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Typical Performance Curves

1200

1000

800

600

400

200

VIN=12V

-50

100

-50

100

Tj [°C]

Figure 4. VIN Current vs Junction Temperature

Figure 5. VIN Shutdown Current vs Junction Temperature

100

1.86

1.84

1.82

1.80

1.78

1.76

1.74

VIN=12V

0.5

1.5

2.5

I_OUT[A]

EN [V]

Figure 6. EN Current vs EN Voltage

Figure 7. Output Voltage vs Output Current

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Typical Performance Curves (Continued)

1.86

VOUT

50mV/div

1.84

1.82

IOUT=0A

1.80

IOUT

2.0A/div

1.78

1.76

1.74

100µsec/div

VIN[V]

Figure 9. Load Transient Response

(VIN=12V, VOUT=1.8V, IOUT=50mA to 3A)

Figure 8. Output Voltage vs Input Voltage

EN 5V/div

VIN 10V/div

VREG 5V/div

SW 10V/div

VREG 5V/div

SW 10V/div

VOUT 1V/div

500µsec/div

Figure 10. Start-up Waveform（EN=0V→5V）

Figure 11. Start-up Waveform（VIN=EN）

(VIN=12V, VOUT=1.8V, IOUT=3A, Css=3300pF)

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Typical Performance Curves (Continued)

VIN 10V/div

EN 5V/div

VREG 5V/div

SW 10V/div

VOUT 1V/div

500µsec/div

Figure 12. Shutdown Waveform（EN=5V→0V）

Figure 13. Shutdown Waveform（VIN=EN）

(VIN=12V, VOUT=1.8V, IOUT=3A, Css=3300pF)

100

VOUT =7.0V

VOUT =5.0V

VOUT =3.3V

VOUT =1.8V

VOUT =1.05V

VIN=12V

0.5

1.5

2.5

I_OUT[A]

Figure 14. Efficiency vs Output Current

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Typical Performance Curves (Continued)

900

850

800

750

900

850

800

750

700

650

600

550

500

450

400

VOUT=1.8V

700

650

600

550

500

450

400

IOUT=1A

VIN=12V

0.5

1.5

2.5

OUT

[A]

VIN[V]

Figure 15. Switching Frequency vs Input Voltage

Figure 16. Switching Frequency vs Output Current

VOUT

VIN

20mV/div

100mV/div

5V/div

500nsec/div

Figure 18. Voltage Ripple at Input

(VIN=12V, VOUT=1.8V, IOUT=2A, L=2.2µH, CIN=10µF x 2)

Figure 17. Voltage Ripple at Output

(VIN=12V, VOUT=1.8V, IOUT=2A, L=2.2µH, COUT=22µF x 2)

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Function Explanations

1 Basic Operation

1-1 Constant On Time Control

BD9D320EFJ is a single synchronous buck switching regulator employing a constant on-time control system.

It controls the on-time by using the duty ratio of VOUT /VIN inside IC so that a switching frequency becomes 700 kHz.

Therefore it runs with the frequency of 700 kHz under the constant on-time decided with VOUT / VIN.

1-2 Enable Control

The IC shutdown can be controlled by the voltage applied to the EN terminal. When VEN reaches 2.2 V (Typ), the

internal circuit is activated and the IC starts up.

VEN

EN terminal

VENH

VENL

VOUT

Output setting voltage

Soft start time

Figure19. Start-up with EN pin

1-3 Soft Start Function

By turning EN terminal to High, the soft start function operates and it gradually starts output voltage by controlling the

current at start-up. Also soft start function prevents sudden current and over shoot of output voltage. Rising time can

be set by connecting capacitor to SS terminal. For setting the rising time, please refer to page.15.

VTH

V_OUT

0.765V

Tss

Figure 20. Soft Start Timing chart

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2 Protective Functions

The protective circuits are intended for prevention of damage caused by unexpected accidents. Do not use them

for continuous protective operation.

2-1Over Current Protection (OCP)

Over current protection function is effective by controlling current which flows in low side MOSFET by 1 cycle each of

switching period. With inductor current exceeding the current restriction setting value I_OCPwhen LG is ON, the HG

pulse cannot be hit even with FB voltage under REF voltage and LG continues to be ON until it is below I_OCP. It hits

HG when it goes below I_OCP. As a result both frequency and duty fluctuates and output voltage may decrease.

In a case where output is decreased because of OCP, output may rise after OCP is released due to the action at high

speed load response. This is non-latch protection and after over current situation is released the output voltage will

recover.

V_OUT

High side

MOSFET gate

(HG)

Low side

MOSFET gate

(LG)

OCP threshold (Iocp)

Inductor current

OCP signal

inside IC

Output load

current

Over

Current

Normal

Figure 21. Over current protection timing chart

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2-2 Under Voltage Lockout Protection (UVLO)

The Under Voltage Lockout Protection circuit monitors the VREG terminal voltage.

The operation enters standby when the VREG terminal voltage is 3.5 V (Typ) or lower.

The operation starts when the VREG terminal voltage is 3.8 V (Typ) or higher.

Figure 22. UVLO Timing Chart

※Load at Startup

Ensure that the respective output has light load at startup of this IC. Also, restrain the power supply line noise at startup and

voltage drop generated by operating current within the hysteresis width of UVLO. Noise exceeding the hysteresis noise width

may cause the IC to malfunction.

2-3 Thermal Shutdown Function

When the chip temperature exceeds Tj = 175°C, the DC/DC converter is stopped. The thermal shutdown circuit is

intended for shutting down the IC from thermal runaway in an abnormal state with the temperature exceeding Tjmax =

150°C. Do not use this function for application protection design. This is non-latch protection.

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Application Example

Figure 23. Application Circuit

Table 1. Recommended Component values

VOUT [V]

1.0

R1 [kΩ]

6.8

R2 [kΩ]

C1 [pF]

L [µH] ^{(Note 7)}

(Note 6)

1.5

2.2

3.3

(Note 6)

1.05

1.2

8.2

(Note 6)

12+0.51

(Note 6)

1.8

(Note 6)

3.3

68+5.1

120+1.8

180

(Note 6)

5.0

(Note 6)

7.0

(Note 6) C1 is a feed forward capacitor. The IC can operate normally even if the capacitor is not connected.

Additional phase boost can be achieved by adding the 5pF to 100pF capacitor (C1) in parallel with R1.

(Note 7) Recommended Inductor ・ALPS GLMC series

・TDK SPM6530 series

Selection of Components Externally Connected

(1) Output LC Filter Constant

The DC/DC converter requires an LC filter for smoothing the output voltage in order to supply a continuous current to the

load. Selecting an inductor with a large inductance causes the ripple current ∆I_Lthat flows into the inductor to be small.

However, decreasing the ripple voltage generated in the output is not advantageous in terms of the load transient

response characteristic. An inductor with a small inductance improves the transient response characteristic but causes the

inductor ripple current to be large which increases the ripple voltage in the output voltage, showing a trade-off relationship.

The recommended inductor values are shown in Table 1.

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Inductor saturation current > I_OUTMAX+⊿I_L/2

⊿I_L

Average inductor current

(Output Current：IOUT)

Figure 24. Waveform of current through inductor

Figure 25. Output LC filter circuit

The inductor peak to peak ripple current ⊿IL is calculated using the following equation.

ΔI_L=V_OUT×(V_IN－V_OUT)×

[A]

V_IN×F_OSC×L

For example, with VIN = 12 V, VOUT = 1.8 V, L = 2.2µH and the switching frequency F_OSC= 700 kHz, the calculated peak

current ⊿IL is 1.0A.

Then, the inductor saturation current must be larger than the sum of the maximum output current (IOUTMAX) and 1/2 of the

inductor ripple current (∆IL / 2).

The output capacitor C_OUTaffects the output ripple voltage characteristics. The output capacitor C_OUTmust satisfy the

required ripple voltage characteristics.

The output ripple voltage can be represented by the following equation.

ΔV_RPL= ΔI_L×(R_ESR

)

[V]

8 ×C_OUT×F_OSC

R_ESRis the Equivalent Series Resistance (ESR) of the output capacitor.

※The capacitor rating must allow a sufficient margin with respect to the output voltage.

The output ripple voltage can be decreased with a smaller ESR.

A ceramic capacitor of about 22 µF to 100 µF is recommended.

※Pay attention to total capacitance value, when additional capacitor CLOAD is connected in addition to output capacitor

COUT. Then, please determine CLOAD and soft start time Tss (Refer to (3) Soft Start Setting) as satisfying the following

equation.

(I_OCP－I_OUT)×T_SS

C_OUT+C_LOAD

≤

[μF]

V_OUT

IOCP is Over Current Protection Current limit value.

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(2) Output Voltage Setting

The output voltage value can be set by the feedback resistance ratio.

V_OUT

R₁+R₂

V_OUT

×0.765

[V]

R₂

BD9D320EFJ can operate under the condition which satisfies

the following equation.

Voltage

Reference

V_OUT

0.07 ≤

≤ 0.65

V_IN

Figure 26. Feedback Resistor Circuit

(3) Soft Start Setting

Turning the EN terminal signal High activates the soft start function. This causes the output voltage to rise gradually while

the current at startup is placed under control. This allows the prevention of output voltage overshoot and inrush current.

The rise time depends on the value of the capacitor connected to the SS terminal.

T_d= (C_SS× V_TH) I_SS

T_SS (C_SS V_FB1.15) I_SS

: Soft Start Delay Time

Tss : Soft Start Time

Css : Capacitor connected to Soft Start Time Terminal

V^FB: FB Terminal Voltage (0.765V Typ)

V^TH: Internal MOS threshold voltage (0.7V Typ)

Iss

: Soft Start Terminal Source Current (2.0µA Typ)

With Css = 3300pF,

Td = ( 3300 pF x 0.7 V ) / 2.0 µA

= 1.16msec

Tss= ( 3300 pF x 0.765 V x 1.15 ) / 2.0 µA

= 1.45 msec

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PCB Layout Design

In the step-down DC/DC converter, a large pulse current flows into two loops. The first loop is the one into which the current

flows when the high side FET is turned ON. The flow starts from the input capacitor C_IN, runs through the FET, inductor L

and output capacitor C_OUTand back to ground of C_INvia ground of C_OUT. The second loop is the one into which the current

flows when the low side FET is turned on. The flow starts from the low side FET, runs through the inductor L and output

capacitor C_OUTand back to ground of the low side FET via ground of C_OUT. Route these two loops as thick and as short as

possible to allow noise to be reduced for improved efficiency. It is recommended to connect the input and output capacitors

directly to the ground plane. The PCB layout has a great influence on the DC/DC converter in terms of all of the heat

generation, noise and efficiency characteristics.

V_IN

V_OUT

MOS FET

C_IN

C_OUT

Figure 27. Current Loop of Buck Converter

Accordingly, design the PCB layout considering the following points.



Connect an input capacitor as close as possible to the IC VIN terminal on the same plane as the IC.

If there is any unused area on the PCB, provide a copper foil plane for the ground node to assist heat dissipation from

the IC and the surrounding components.



Switching nodes such as SW are susceptible to noise due to AC coupling with other nodes. Route the coil pattern as

thick and as short as possible.



Provide lines connected to FB and SS far from the SW nodes.

Place the output capacitor away from the input capacitor in order to avoid the effect of harmonic noise from the input.

EN GND_S GND

VIN

VIN_S

EN GND_S GND

VIN

VIN_S

VOUT_S

VOUT

CBOOT

R1 R2

VOUT

GND

VREG

GND

OUT

GND_S

TOP Layer

Bottom Layer

Figure 28. Example of PCB layout

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Power Dissipation

When designing the PCB layout and peripheral circuitry, sufficient consideration must be given to ensure that the power

dissipation is within the allowable dissipation curve.

HTSOP-J8 Package

70  70  1.6 mm assembled glass epoxide board

(1) 4-layer board (Copper foil area 70 mm  70 mm)

(2) 2-layer board (Copper foil area 70 mm  70 mm)

(3) 2-layer board (Copper foil area 15 mm  15 mm)

(4) 1-layer board (Copper foil area 0 mm 0 mm)

Figure 29. Power dissipation (HTSOP-J8)

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I/O Equivalent Circuit

1. EN

2. FB

166kΩ

333kΩ

500kΩ

3. VREG

4. SS

VIN

VREG

2.3kΩ

6. SW

7. BOOT

BOOT

VREG

VIN

BOOT

Figure 30. I/O equivalence circuit

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Operational Notes

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

terminals.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when

the IC is mounted on 4 - layer 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum

rating, increase the board size and copper area to prevent exceeding the Pd rating.

Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

Rush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush

current may flow instantaneously due to the internal powering sequence and delays, especially if the IC

has more than one power supply. Therefore, give special consideration to power coupling capacitance,

power wiring, width of ground wiring, and routing of connections.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

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Operational Notes – continued

11. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Figure 31. Example of monolithic IC structure

12. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

13. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be

within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the

TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat

damage.

14. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

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Ordering Information

B D 9 D 3 2 0 E F

E 2

Part Number

Package

EFJ: HTSOP-J8

Packaging and forming specification

E2: Embossed tape and reel

Marking Diagram

HTSOP-J8 (TOP VIEW)

Part Number Marking

LOT Number

D 9 D 3 2 0

1PIN MARK

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Physical Dimension, Tape and Reel Information

Package Name

HTSOP-J8

Tape

Embossed carrier tape

2500pcs

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

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Revision History

Date

Revision

Changes

07.Aug.2013

001

Created

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice - GE

Rev.002

Daattaasshheeeett

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice - GE

Rev.002

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

BD9D320EFJ [ROHM]

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