BD9P208MUF-C [ROHM]
BD9P208MUF-C是内置功率MOSFET的电流模式同步整流式降压DC-DC转换器。;型号: | BD9P208MUF-C |
厂家: | ROHM |
描述: | BD9P208MUF-C是内置功率MOSFET的电流模式同步整流式降压DC-DC转换器。 DC-DC转换器 |
文件: | 总53页 (文件大小:1995K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Nano Pulse ControlTM
Datasheet
3.5 V to 40 V Input, 2 A
Single 2.2 MHz Buck DC/DC Converter
For Automotive
BD9P208MUF-C
General Description
Key Specifications
BD9P208MUF-C is current mode synchronous buck
DC/DC converter integrating POWER MOSFETs.
◼ Input Voltage Range:
3.5 V to 40 V
(Initial startup is 4.0 V or more)
◼ Output Voltage Range
BD9P208MUF-C:
◼ Output Current:
OCP_SEL = H
OCP_SEL = L
◼ Switching Frequency:
◼ Output Voltage Accuracy:
Features
0.8 V to 8.5 V
◼
◼
◼
◼
Nano Pulse ControlTM
AEC-Q100 Qualified(Note 1)
Minimum ON Pulse 50 ns (Max)
Synchronous Buck DC/DC Converter Integrating
POWER MOSFETs
1.5 A (Max)
2.0 A (Max)
2.2 MHz (Typ)
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
Soft Start Function
Current Mode Control
Reset Function
Light Load Mode (LLM)
±1.75 % (-40 °C to +125 °C)
±1.5 % (-30 °C to +105 °C)
2.1 μA (Typ)
◼ Shutdown Current:
◼ Operating Temperature Range: -40 °C to +125 °C
Forced Pulse Wide Modulation (PWM) Mode
Phase Compensation Included
Selectable Spread Spectrum Switching
External Synchronization Function
Selectable Over Current Protection (OCP)
Input Under Voltage Lockout (UVLO) Protection
Thermal Shut Down (TSD) Protection
Output Over Voltage Protection (OVP)
Short Circuit Protection (SCP)
Package
W (Typ) x D (Typ) x H (Max)
4.0 mm x 4.0 mm x 1.0 mm
VQFN24FV4040
(Note 1) Grade 1
Applications
◼
◼
Automotive Powered Supplies
Consumer Powered Supplies
VQFN24FV4040
Wettable Flank Package
Typical Application Circuit
CBST
VIN
VIN
BST
SW
VOUT
L1
PVIN
VCC_EX
VOUT_DIS
FB
RFB1
CIN
EN
PGND
VREG
OCP_SEL
VOUT_SNS
RESET
MODE
COUT
RRST
CREG
RFB2
VMODE
VSSCG
SSCG
GND
Figure 1. Application Circuit with Discharge Function
Nano Pulse ControlTM is a trademark or a registered trademark of ROHM Co., Ltd.
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays
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BD9P208MUF-C
Typical Application Circuit - continued
CBST
VIN
VIN
BST
SW
VOUT
L1
PVIN
VCC_EX
VOUT_DIS
FB
RFB1
CIN
EN
PGND
VREG
OCP_SEL
VOUT_SNS
RESET
MODE
COUT
RRST
CREG
RFB2
VMODE
VSSCG
SSCG
GND
Figure 2. Application Circuit without Discharge Function
Pin Configuration
VIN
1
2
18 FB
PVIN
17 VOUT_SNS
PVIN
N.C.
3
4
5
16 VOUT_DIS
15 GND
PGND
14 RESET
13 SSCG
PGND
6
(TOP VIEW)
Figure 3. Pin Configuration
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BD9P208MUF-C
Pin Description
Pin No.
Pin Name
VIN
Function
Power supply input pins for the internal circuit.
Connect this pin to the PVIN pins.
1
Power supply input pins that are used for the output stage of the switching
regulator. Connect input ceramic capacitors referring Page 30 between the
PGND pins and these pins.
2, 3
PVIN
This pin is not connected to the chip. Use this as open. If this pin is used other
than open and adjacent pins are expected to be shorted, please confirm if there
is any problem with the actual application.
4
N.C.
PGND
SW
5, 6
7, 8
Ground pins for the output stage of the switching regulator.
Switching node pins. These pins are connected to the source of the internal High
Side FET and the drain of the internal Low Side FET. Connect the power inductor
and the bootstrap capacitor.
Connect a bootstrap capacitor of 0.1 µF (Typ) between this pin and the SW pins.
The voltage of this capacitor is the gate drive of the High Side FET.
9
BST
N.C.
This pin is not connected to the chip. Use this as open. If this pin is used other
than open and adjacent pins are expected to be shorted, please confirm if there
is any problem with the actual application.
10
This is OCP threshold selective pin. OCP threshold is set to 2.250 A (Typ) at
high, and 3.000 A (Typ) at low. These values mean the average inductor current.
Connect this pin to VREG (High) or GND (Low).
11
12
OCP_SEL
MODE
Pin to select FPWM (Forced PWM) mode, AUTO (Automatically switched
between PWM mode and LLM) mode, or SYNC (Activate synchronization)
mode. In case of using FPWM mode, set high. In case of using AUTO mode, set
low or open. In case of using SYNC mode, apply a clock to this pin.
Pin to select Spread Spectrum function. Set high to enable Spread Spectrum
and set low to disable Spread Spectrum. Connect this pin to VREG (High) or
GND (Low).
13
14
SSCG
Output reset pin with open drain. Connect a pull-up resistor to the VREG pin or
the power supply within the absolute maximum voltage ratings of the RESET
pin. Using a 5 kΩ to 100 kΩ resistance is recommended.
RESET
15
16
GND
Ground pin.
This pin discharges the VOUT node. Connect this pin to the VOUT when
discharge function is required. Otherwise, connect this pin to GND.
VOUT_DIS
Pin to define the clamp voltage of GmAmp2 output and phase compensation.
Connect this pin to the output voltage.
17
18
VOUT_SNS
FB
Inverting input node of the GmAmp1. This pin is used for OVP, SCP and RESET
detection. Connect output voltage divider to this pin to set the output voltage.
This pin is not connected to the chip. Use this as open. If this pin is used other
than open and adjacent pins are expected to be shorted, please confirm if there
is any problem with the actual application.
19
20
21
N.C.
VCC_EX
VREG
This pin is power supply input for internal circuit. VREG voltage is supplied from
VCC_EX when voltage between 3.2 V (VTEXH, Max) and 5.65 V (VEXOVPL, Min) is
connected to this pin. Connecting this pin to VOUT improves efficiency. In case
of not use this function, connect this pin to GND.
Pin to output 3.3 V (Typ) for internal circuit. Connect a ceramic capacitor of 1.0
µF (Typ). Do not connect to any external loads except the OCP_SEL pin, the
MODE pin, the SSCG pin and a pull-up resistor to the RESET pin.
This pin is not connected to the chip. Use this as open. If this pin is used other
than open and adjacent pins are expected to be shorted, please confirm if there
is any problem with the actual application.
22
23
24
N.C.
EN
Enable pin. Apply low level (0.8 V or lower) to disable device and apply high
level (2.0 V or higher) to enable device. This pin must not be left open.
This pin is not connected to the chip. Use this as open. If this pin is used other
than open and adjacent pins are expected to be shorted, please confirm if there
is any problem with the actual application.
N.C.
Exposed pad. The EXP-PAD is connected to the P substrate of the IC. Connect
this pad to the internal PCB ground plane using multiple via holes to obtain
excellent heat dissipation characteristics.
-
EXP-PAD
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BD9P208MUF-C
Block Diagram
VCC_EX
VREG
VIN
VREF
Pre Reg
VREG
tsdout
VREF
VIN
porout
uvloout
UVLO
REG
TSD
VREF
POR
GND
EN
OSC
clk
SSCG
MODE
mode
MODE
Discharge
VOUT_DIS
OCP_SEL
vout_det
OCP_SEL
VOUT_SNS
FB
vout_dis
VREG
VREF
scpout
porout
VOUT_SNS
SCP
uvloout
scpout
ovpout
mode
HOCP Comp
BST
VREG
GmAmp1
OCP_SEL
Clamper1
PVIN
GmAmp2
PWM Comp
VREF
Vc
Control
Logic
Driver
Soft
Start
VOUT_SNS
SW
Clamper2
EN
clk
Vr
Ramp
Sleep Comp
ZX Comp
sleep
VREF
Current
Sense
VREF
VREF
Reset
OVP
PGND
EN
porout
uvloout
tsdout
RESET
VOUT_SNS
VCC_EX
ovpout
Figure 4. Block Diagram
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BD9P208MUF-C
Description of Blocks
-
PreReg
This block is the internal power supply for TSD and VREF circuits.
-
VREG
This block is the internal power supply circuit. It outputs 3.3 V (Typ) and is the power supply to the control circuit and
Driver.
-
TSD
This is the thermal shutdown circuit. It will shut down the device when the junction temperature (Tj) reaches to 175 °C
(Typ) or more. When the Tj falls below the TSD threshold with hysteresis of 25 °C (Typ), the circuits are automatically
restored to normal operation.
-
-
VREF
The VREF block generates the internal reference voltage.
POR
The POR block is power on reset for internal logic circuit. The IC releases power on reset and starts operation with soft
start when the VIN rises to 3.8 V (Typ) or more.
-
-
UVLO REG
The UVLO block is for under voltage lockout protection. It will shut down the device when the VREG falls to 2.85 V (Typ)
or less. This protection is released when VREG voltage increase to 2.95 V (Typ) or more.
MODE
This block detects the MODE pin signal and controls switching mode. When the MODE pin is logic high level or is applied
external clock, switching operation becomes forced PWM mode regardless load current. When the MODE pin is open
or logic low level, switching operation changes between PWM and light load operation depending on load current.
-
-
-
OSC
This block generates the clock frequency. When the clock is applied to the MODE pin, it synchronizes to external clock.
Connect the SSCG pin to GND to disable Spread Spectrum function and connect the SSCG pin to the VREG pin to
enable it.
OVP
This is the output over voltage protection (OVP) circuit. If the output/feedback voltage becomes 0.860 V (Typ) or more
of the normal regulation voltage, VOUT is reduced by forced PWM switching. After output/feedback voltage falls 0.840 V
(Typ) or less, the operation recovers into normal condition.
SCP
This is the short circuit protection circuit. After soft start is completed, the switching is disabled if the output voltage falls
SCP Threshold voltage or less for 0.9 ms (Typ). This short circuit protection is maintained for 30 ms (Typ) and then
automatically released.
-
-
-
-
Soft Start
This function starts up the output voltage taking 3 ms (Typ) to prevent the overshoot.
GmAmp1
This block is an error amplifier and its inputs are the reference voltage 0.8 V (Typ) and the FB voltage.
GmAmp2
This block sends the signal Vc which is composed of the GmAmp1 output and the current sense signal to PWM Comp.
Clamper1
This block limits inductor current by clamping GmAmp1 output voltage. It works as the over current protection and LLM
control current.
-
-
Clamper2
This block clamps GmAmp2 output voltage.
Current Sense
This block detects the amount of change in inductor current through the Low Side FET and sends a current sense signal
to GmAmp2.
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BD9P208MUF-C
Description of Blocks - continued
-
PWM Comp
This block compares the output voltage of the GmAmp2 (Vc) and the saw tooth waveform (Vr) to control the switching
duty.
-
-
Ramp
This block generates the saw tooth waveform (Vr) from the clock signal generated by OSC.
Control Logic
This block controls switching operation and protection functions.
-
-
Driver
This circuit drives the gates of the output FETs.
Sleep Comp
If output/feedback voltage becomes 0.812 V (Typ) or more, this block puts the device into SLEEP state. This state is
released when output/feedback voltage becomes 0.810 V (Typ) or less.
-
-
ZX Comp
This block stops the switching by detecting reverse current of the SW current at LLM control.
HOCP Comp
This block detects the current flowing through the High Side FET and limits the current of 4.0 A (Min) or more. This
function works in abnormal situation such as the SW pin shorted to GND condition in order to prevent the High Side FET
from destruction.
-
-
Reset
When the output/feedback voltage reaches 0.764 V (Typ) or more of the normal regulation voltage, the open drain
MOSFET connected to the RESET pin turns off in 3.6 ms (Typ) and the output of the RESET pin becomes high by its
external pull-up resistor.
When the output/feedback voltage reaches 0.744 V (Typ) or less, the RESET pin open drain MOSFET turns on and the
RESET pin is pulled down with an impedance of 190 Ω (Typ).
Discharge
This block discharges the output voltage during EN is low and before VOUT start up. The VOUT_DIS pin is pulled down
with an impedance of 75 Ω (Typ).
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BD9P208MUF-C
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
VVIN, VPVIN
VEN
-0.3 to +42
-0.3 to +42
V
V
V
V
Input Voltage
EN Voltage
VBST
-0.3 to +49
BST Voltage
Voltage from SW to BST
ΔVBST
VSW -0.3 to VSW +7
VFB, VRESET,
VMODE, VSSCG
VOCP_SEL
FB, RESET, MODE,
SSCG, OCP_SEL Voltage
-0.3 to +7
V
VOUT_DIS Voltage
VVOUT_DIS
VVOUT_SNS
VVCC_EX
VREG
-0.3 to +10
-0.3 to +10
-0.3 to +7
-0.3 to +7
-55 to +150
150
V
V
VOUT_SNS Voltage
VCC_EX Voltage
V
VREG Voltage
V
Storage Temperature Range
Maximum Junction Temperature
Human Body Model (HBM)(Note 1)
Tstg
˚C
˚C
kV
Tjmax
VESD_HBM
±2
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) These voltages are guaranteed by design. Not tested.
Thermal Resistance(Note 2)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 4)
2s2p(Note 5)
VQFN24FV4040
Junction to Ambient
Junction to Top Characterization Parameter(Note 3)
θJA
123.1
13
40.5
9
°C/W
°C/W
ΨJT
(Note 2) Based on JESD51-2A(Still-Air), using a BD9P208MUF-C Chip.
(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 4) Using a PCB board based on JESD51-3.
(Note 5) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70 μm
Footprints and Traces
Layer Number of
Measurement Board
Thermal Via(Note 6)
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
Pitch
Diameter
4 Layers
1.20 mm
Φ0.30 mm
Top
Copper Pattern
Bottom
Thickness
70 μm
Copper Pattern
Thickness
35 μm
Copper Pattern
Thickness
70 μm
Footprints and Traces
74.2 mm x 74.2 mm
74.2 mm x 74.2 mm
(Note 6) This thermal via connects with the copper pattern of all layers.
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BD9P208MUF-C
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
VVIN, VPVIN
Ta
3.5
-
-
-
-
-
-
-
40
+125
8.5
50
V
˚C
V
Input Voltage
-40
Operating Temperature
Output Voltage(Note 1)
SW Minimum ON Time(Note 2)
SW Minimum OFF Time (VREG = 3.3 V)
SW Minimum OFF Time (VREG = 5.0 V)
Output Current
VOUT
0.8
tONMIN
tOFFMIN
tOFFMIN
IOUT
-
-
-
-
ns
ns
ns
A
130
100
2
Input Capacitor
CIN
2.3
-
-
µF
(VIN Continuous Condition) (Note 3)
VREG Capacitor(Note 3)
BST Capacitor(Note 3)
CREG
CBST
0.6
1.0
0.1
2.0
0.2
µF
µF
0.05
(Note 1) Although the output voltage is configurable at 0.8 V and higher, it may be limited by the SW min ON pulse width.
For the same reason, although the output voltage is configurable at 8.5 V and more, it may be limited by the SW minimum OFF pulse width.
For the configurable range, please refer to the Output Voltage Setting in Selection of Components Externally Connected (page 27).
(Note 2) This parameter is for 1.0 A output. Not tested.
(Note 3) Ceramic capacitor is recommended. The capacitor value including temperature change, DC bias change, and aging change must be considered. If a bulk
capacitor is used with Input ceramic capacitors, please select capacitors referring page 30.
Electrical Characteristics (Unless otherwise specified Ta = -40 ˚C to +125 ˚C, VIN = 12 V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
General
VEN = 0 V,
Shutdown Current
ISDWN
IQ_VIN1
-
-
-
-
-
-
-
2.1
2.1
10.0
6.0
µA
µA
µA
µA
µA
µA
µA
Ta = -40 ˚C to +105 ˚C
VMODE = 0 V, VVCC_EX = 5 V
VFB = VFB1 x 1.04 (SLEEP)
VMODE = 0 V, VVCC_EX = 0 V
VFB = VFB1 x 1.04 (SLEEP)
VMODE = 5 V, VVCC_EX = 5 V
VFB =VFB1 x 1.04 (No SLEEP)
VMODE = 5 V, VVCC_EX = 0 V
VFB = VFB1 x 1.04 (No SLEEP)
VMODE = 0 V
IQ_VIN2
15
30
Quiescent Current from VIN
IQ_VIN3
33
66
IQ_VIN4
1200
16
2400
60
IQ_VCC_EX1
IQ_VCC_EX2
VFB = VFB1 x 1.04 (SLEEP)
VMODE = 5 V
VFB = VFB1 x 1.04 (No SLEEP)
Quiescent Current from VCC_EX
1500
3000
VIN Power On Reset Rising
VREG Under Voltage Lockout Falling
VREG Under Voltage Lockout Rising
EN/MODE/OCP_SEL/SSCG
EN Input Voltage High
VPOR_R
VUVLO_F
VUVLO_R
3.6
3.8
4.0
V
V
V
VIN Sweep Up
2.70
2.75
2.85
2.95
3.00
3.15
VREG Sweep Down
VREG Sweep Up
VENH
VENL
2.0
-
40
0.8
0.50
1
V
V
V
EN Input Voltage Low
0
-
EN Hysteresis Voltage
VENHYS
IEN
0.10
0.25
EN Input Current
-
0
-
µA VEN = 5 V
MODE Input Voltage High
MODE Input Voltage Low
MODE Input Current
VMODEH
VMODEL
IMODE
VSELH
VSELL
ISEL
2.0
5.5
0.8
10
V
-
-
V
-
6
-
µA VMODE = 5 V
OCP_SEL Input Voltage High
OCP_SEL Input Voltage Low
OCP_SEL Input Current
SSCG Input Voltage High
SSCG Input Voltage Low
SSCG Input Current
2.0
5.5
0.8
1
V
-
-
V
-
2.0
-
0
-
µA VOCP_SEL = 5 V
VSSCGH
VSSCGL
ISSCG
5.5
0.8
1
V
-
V
-
0
µA VSSCG = 5 V
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BD9P208MUF-C
Electrical Characteristics - continued (Unless otherwise specified Ta = -40 ˚C to +125 ˚C, VIN = 12 V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
VREG
Voltage Follower
VVCC_EX = 0 V
VREG Voltage
VREG
3.0
3.3
3.6
V
VCC_EX Switch ON Resistance
VCC_EX Threshold Voltage High
VCC_EX Threshold Voltage Low
VCC_EX OVP Threshold Voltage High
VCC_EX OVP Threshold Voltage Low
RONEX
VTEXH
-
6
12
Ω
V
V
V
V
VVCC_EX = 5 V
2.90
2.70
5.85
5.65
3.05
2.90
6.20
6.00
3.20
3.10
6.55
6.35
VVCC_EX Sweep Up
VVCC_EX Sweep Down
VTEXL
VEXOVPH
VEXOVPL
VEN = 0 V,
VOUT_DIS = 0.3 V
VOUT_DIS Discharge ON Resistance
RDIS
-
75
150
300
Ω
VOUT Discharge Deactivate Voltage
Oscillator
VDISL
100
200
mV VOUT_DIS Sweep Down
Switching Frequency
fSW
2.0
1.8
2.2
-
2.4
2.5
MHz
Synchronization Frequency Range
fSW_EX
MHz External Clock Input
Switching Frequency
(Spread Spectrum)
fSWSSR
1.90
-
2.52
MHz VSSCG = 5 V
Spread Spectrum Modulation Rate
Spread Spectrum Modulation Cycle
VREF/GmAmp
ΔfSSCG
-
-
4.5
-
-
%
VSSCG = 5 V
tSSCG_CYCLE
466
µs VSSCG = 5 V
VFB Voltage,
V
0.788
0.790
0.802
0.802
0.816
0.814
PWM Mode
Feedback Reference Voltage
VFB1
VFB Voltage,
V
PWM Mode
Ta = -30 ˚C to +105 ˚C
VFB Rising,
Light Load Mode
VFB Falling,
Enter SLEEP State Voltage
Exit SLEEP State Voltage
VFB2
VFB3
0.794
0.792
0.812
0.810
0.830
0.828
V
V
Light Load Mode
FB Input Currents
IFB
IVOUT_SNS
tDLY
-
-
0
0.1
2.0
800
3.9
µA VFB = 5 V
µA VOUT_SNS = 5 V
µs
VOUT_SNS Input Current
Start Delay Time
0.5
500
3.0
-
Soft Start Time
tSS
2.5
ms VFB1 x 0.1 to VFB1 x 0.9
Driver
High Side FET ON Resistance
Low Side FET ON Resistance
RONH
RONL
-
-
140
90
310
210
mΩ VBST-VSW = 3.3 V
mΩ VVCC_EX = 3.3 V
VIN = 40 V, VEN = 0 V,
Ta = 25 ˚C, VSW = 0 V
VIN = 40 V, VEN = 0 V,
Ta = 25 ˚C, VSW = 40 V
VOCP_SEL = 0 V
VOCP_SEL = 5 V
High Side FET Leakage Current
Low Side FET Leakage Current
ILKH
-10
-
0
0
-
µA
ILKL
IOCP20
IOCP15
10
µA
2.400
1.800
3.000
2.250
3.600
2.700
A
A
Over Current Protection Threshold
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Electrical Characteristics - continued (Unless otherwise specified Ta = -40 ˚C to +125 ˚C, VIN = 12 V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Reset
Reset Threshold Voltage Low
Reset Threshold Voltage High
VRTL
VRTH
0.718
0.738
0.744
0.764
0.770
0.790
V
V
VFB Sweep Down
VFB Sweep Up
VRESET = 5.0 V,
VFB = 0.8 V
VIN = 2 V, VEN = 0 V
IRESET = 1 mA
Reset Leakage Current
Reset ON Resistance
IRSTLK
-
-
0
1
µA
Ω
RRST
tRSTNACT
tRSTNFILT
190
400
Reset Active Time
2.0
1
3.6
5
5.0
10
ms
µs
Reset Filtering Time
OVP/SCP
FB OVP Threshold Voltage High
FB OVP Threshold Voltage Low
VOUT_SNS OVP Threshold Voltage High
VOUT_SNS OVP Threshold Voltage Low
SCP Threshold Voltage High
SCP Threshold Voltage Low
VOVPH
VOVPL
0.825
0.805
9.0
0.860
0.840
9.5
0.895
0.875
10.0
9.5
V
V
V
V
V
V
VFB Sweep Up
VFB Sweep Down
VOUT_SNS Sweep Up
VOUT_SNS Sweep Down
VFB Sweep Up
VSNSOVPH
VSNSOVPL
VSCPH
8.5
9.0
0.68
0.60
0.72
0.64
0.76
0.68
VSCPL
VFB Sweep Down
SCP function is
SCP Deactivate Rate of VIN/VOUT_SNS
VSCP_DACT
1.20
1.33
1.45
V/V deactivated this value
or less
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BD9P208MUF-C
Typical Performance Curves
0.816
0.812
0.808
0.804
0.800
0.796
0.792
0.788
0.784
10
9
8
7
Ta = +125 ˚C
6
5
Ta = +25 ˚C
4
3
2
1
0
Ta = -40 ˚C
-50 -25
0
25
50
75 100 125
0
5
10 15 20 25 30 35 40
Input Voltage : V [V]
Temperature : Ta[˚C]
IN
Figure 5. Shutdown Current vs Input Voltage
Figure 6. Feedback Reference Voltage vs Temperature
3.15
3.10
4.0
3.9
3.8
3.7
3.6
3.05
Rising
3.00
2.95
2.90
2.85
2.80
Falling
2.75
2.70
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Temperature : Ta[˚C]
Temperature : Ta[˚C]
Figure 7. VIN Power On Reset Rising vs Temperature
Figure 8. VREG Under Voltage Lockout vs Temperature
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Typical Performance Curves - continued
1.00
0.80
0.60
0.40
0.20
0.00
-0.20
-0.40
-0.60
-0.80
-1.00
2.0
1.8
High
Ta = -40 ˚C, +25 ˚C, +125 ˚C
1.6
1.4
1.2
Low
1.0
0.8
-50 -25
0
25
50
75 100 125
0
5
10 15 20 25 30 35 40
EN Voltage : VEN[V]
Temperature : Ta[˚C]
Figure 10. EN Input Current vs EN Voltage
Figure 9. VIN Power On Reset Rising vs Temperature
2.0
10
9
8
7
6
5
4
3
2
1
0
MODE
1.8
Ta = +125 ˚C
Ta = +25 ˚C
Ta = -40 ˚C
High
1.6
1.4
Low
1.2
OCP_SEL, SSCG
Ta = -40 ˚C, +25 ˚C, +125 ˚C
1.0
0.8
-1
-50
-25
0
25
50
75
100 125
0
1
2
3
4
5
6
Temperature : Ta[˚C]
MODE, OCP_SEL, SSCG Voltage :
VMODE,VOCP_SEL,VSSCG[V]
Figure 12. MODE, OCP_SEL, SSCG Input Current
vs MODE, OCP_SEL, SSCG Voltage
Figure 11. MODE, OCP_SEL, SSCG Input Voltage vs
Temperature
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Typical Performance Curves - continued
2.40
2.35
2.30
2.25
2.20
2.15
2.10
2.05
2.00
3.6
3.4
3.2
3.0
2.8
2.6
2.4
2.2
2.0
1.8
IOCP20 (OCP_SEL = Low)
IOCP15 (OCP_SEL = High)
-50 -25
0
25
50
75
100 125
-50 -25
0
25
50
75
100 125
Temperature : Ta[˚C]
Temperature : Ta[˚C]
Figure 13. Switching Frequency vs Temperature
Figure 14. Over Current Protection Threshold vs
Temperature
350
210
270
190
110
30
160
VVCC_EX = 3.3 V
VBST-VSW = 3.3 V
110
60
VVCC_EX = 5.0 V
VBST-VSW = 5.0 V
10
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Temperature : Ta[˚C]
Temperature : Ta[˚C]
Figure 15. High Side FET ON Resistance vs Temperature
Figure 16. Low Side FET ON Resistance vs Temperature
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Typical Performance Curves - continued
0.880
0.870
0.860
0.850
0.840
0.830
0.820
0.780
High
High
0.767
0.754
0.741
Low
Low
0.728
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Temperature : Ta[˚C]
Temperature : Ta[˚C]
Figure 17. Reset Threshold Voltage vs Temperature
Figure 18. FB OVP Threshold Voltage vs Temperature
10.00
9.75
9.50
9.25
9.00
8.75
8.50
High
Low
-50 -25
0
25
50
75 100 125
Temperature : Ta[˚C]
Figure 19. VOUT_SNS OVP Threshold Voltage vs
Temperature
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BD9P208MUF-C
Function Explanation
1. Nano Pulse ControlTM
Nano Pulse ControlTM is an original technology developed by ROHM Co., Ltd. It enables to control voltage stably, which
is difficult in the conventional technology, even in a narrow SW ON time such as less than 50 ns at typical condition.
Narrow SW ON Pulse enables direct convert of high input voltage to low output voltage. The output voltage VOUT 3.3 V
can be output directly from the supply voltage VIN 24 V at 2.2 MHz.
VSW
(5 V/div)
VIN = 24 V
VOUT = 3.3 V
fSW = 2.2 MHz
(5 V/div)
Time (100 ns/div)
Figure 20. Switching Waveform (VIN = 24 V, VOUT = 3.3 V, IOUT = 1.0 A, fSW = 2.2 MHz)
2. Light Load Mode Control and Forced PWM Mode Control
BD9P208MUF-C is a synchronous DC/DC converter with integrated POWER MOSFETs and realizes high transient
response by using current mode Pulse Width Modulation (PWM) mode control architecture. Under a heavy load, the
switching operation is performed with the PWM mode control at a fixed frequency. When the load is lighter, the operation
is changed over to the Light Load Mode (LLM) control to improve the efficiency.
Light Load Mode
PWM Mode
Output Current IOUT [A]
Figure 21. Efficiency (Light Load Mode, PWM Mode)
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2. Light Load Mode control and Forced PWM Mode control - continued
If the output load decreases below 400 mA (Typ) (OCP_SEL = L), the output voltage rises and power state is changed
to SLEEP state when the output voltage exceeds to VFB2 (0.812 V, Typ). During SLEEP state, switching operation is
stopped and the circuit current is reduced by stopping the circuit operation except for the monitor circuit of output voltage
monitor. Then, the switching operation restarts when the output voltage decreases less than VFB3 (0.810 V, Typ) by the
load current.
If the light load mode operation is not required, the IC operates in forced PWM mode by applying high voltage or an
external clock to the MODE pin. In forced PWM mode, the IC operates with fixed frequency regardless of the output load
and the ripple voltage of output can be reduced. Also, during soft start time, the IC operates in forced PWM mode
regardless of the condition of the MODE pin. After detecting RESET high, the IC operates according to the MODE pin
condition.
If OCP_SEL set high level, then the threshold current of switched between PWM mode and LLM is changed to 300 mA
(Typ).
In addition, good EMI performance in AM band may not be provided by a load condition in LLM. To avoid this, use Forced
PWM mode.
VEN
VFB2 = 0.812 V (Typ)
VFB3 = 0.810 V (Typ)
VFB1
VOUT
400 mA
IL
400 mA
IOUT
VRESET
Figure 22. Timing Chart in Light Load Mode (OCP_SEL = L)
VEN
VFB2 = 0.812 V (Typ)
VFB3 = 0.810 V (Typ)
VFB1
VOUT
400 mA
IL
400 mA
IOUT
VRESET
Figure 23. Timing Chart in Light Load Mode after Detecting RESET High (OCP_SEL = L)
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Function Explanation - continued
3.
Enable Control
The device shutdown can be controlled by the EN pin. When VEN reaches VENH (2.0 V) or higher, the internal circuit is
activated. When the VOUT_DIS pin is connected to output voltage and the EN pin is low, the VOUT_DIS pin is pulled
down by the resistance of RDIS (75 Ω, Typ) and discharges the output voltage. This discharge function is deactivated
when VOUT_DIS voltage falls below VDISL (200 mV, Typ) at once or 30 ms (Typ) pass after the EN pin becomes high.
After being deactivated, the VOUT starts up with soft start operation. The delay time tDLY (500 µs, Typ) is implemented
from the EN pin becoming high to VOUT starting up regardless of VOUT_DIS voltage. The soft start time (VOUT x 0.1 to
VOUT x 0.9) is set to tSS (3.0 ms, Typ). When an EN voltage becomes VENL (0.8 V) or less, the device is shut down. When
discharge function is not required, connect the VOUT_DIS pin to GND.
VENH
2.0 V
VENL
0.8 V
VEN
90 %
VDISL
200 mV
(Typ)
VDISL
200 mV
(Typ)
10 %
tDLY
VOUT
tSS
500 µs 3.0 ms
(Typ)
(Typ)
tSS x 1.25
ON
Discharge
OFF
tDLY
500 µs
(Typ)
30 ms
(Typ)
Figure 24. Enable ON/OFF Timing Chart
4. Reset Function
For BD9P208MUF-C, the reset function monitors the FB pin voltage. When the FB pin voltage reaches VRTH (0.764 V,
Typ) or more, the open drain MOSFET on the RESET pin is turned off in tRSTNACT (3.6 ms, Typ) and the output of the
RESET pin becomes high by its pull-up resistor. In addition, when the FB pin voltage reaches VRTL (0.744 V, Typ) or less,
the open drain MOSFET on the RESET pin is turned on and the RESET pin is pulled down with an impedance of RRST
(190 Ω, Typ). To reject noise, the filtering time tRSTNFILT (5 µs, Typ) is implemented after the FB pin voltage decreases
below its threshold voltage (VRTL).
The reset function also works when output over voltage is detected. If the FB pin voltage reaches VOVPH (0.860 V, Typ)
or more, the open drain MOSFET on the RESET pin is turned on. Then, when the FB pin voltage goes below VOVPL
(0.840 V, Typ) or less, the open drain MOSFET on the RESET pin is turned off. The reset active time and filtering time
are activated when over voltage conditions are detected.
The RESET output voltage low level (VRESET_LOW(Max)) when the open drain MOSFET is turned on is calculated by the
following equation. It is recommended to use resistance of 5 kΩ to 100 kΩ and pull it up to the VREG pin or the power
supply in the absolute maximum voltage ratings of the RESET pin.
During shutdown condition, the RESET pin is pulled down regardless the output voltage as far as VIN is 2 V or higher.
VOVPH = 0.860 V (Typ)
VOVPL = 0.840 V (Typ)
VFB1
VRTH = 0.764 V (Typ)
VRTL = 0.744 V (Typ)
VOUT
VRESET
tRSTNACT Under tRSTNFILT
tRSTNFILT
5 µs
(Typ)
tRSTNACT Under tRSTNFILT
tRSTNFILT tRSTNACT
3.6 ms
Under 5 µs
(Typ)
3.6 ms
Under 5 µs
(Typ)
5 µs
3.6 ms
(Typ)
(Typ)
(Typ)
(Typ)
Figure 25. Reset Timing Chart
푅
ꢀꢁꢂ(ꢃꢄꢅ)
푉푅퐸푆퐸푇_퐿푂푊(푀푎푥) = 푉푃푈퐿퐿−푈푃
×
[V]
푅
+푅
ꢀꢁꢂ(ꢃꢄꢅ)
ꢆꢇꢈꢈꢉꢇꢆ
Where:
푉푅퐸푆퐸푇_퐿푂푊(푀푎푥)
푉푃푈퐿퐿−푈푃
ꢊ푅푆푇(푀푎푥)
is the RESET Low voltage level (Max) [V]
is the Voltage of pull-up power source [V]
is the RESET ON Resistance (Max) [Ω]
ꢊ푃푈퐿퐿−푈푃
is the value of pull-up resistor to VPULL_UP [Ω]
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Function Explanation – continued
5. External Synchronization Function
By applying clock signal to the MODE pin, the switching frequency can be synchronized to the external clock signal.
When clock signal is applied with the synchronization frequency range between 1.8 MHz and 2.5 MHz and the duty range
between 25 % and 75 %, the Synchronous mode is started after 4 rising edges of the clock signal. In addition, this
function is enabled after VRESET becomes high. If the duration between each rising edge exceeds 0.9 µs (Typ) or more,
the Synchronous mode is deactivated and switching operation by internal clock is activated (the Non-Synchronous mode).
The Spread Spectrum function cannot be activated during the Synchronous mode.
VIN
VEN
VRTH
VOUT
VSW
tRSTNACT
3.6 ms
(Typ)
tDLY
500 µs
(Typ)
VRESET
VMODE
0.9 μs (Typ)
Non-Synchronous
Synchronous
Synchronous
Non-Synchronous
Figure 26. External Synchronization Function
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Function Explanation - continued
6. Frequency Division Function
This device drives the High Side FET with a bootstrap and requires the ON time of the Low Side FET to charge the BST
pin. Therefore, the minimum OFF time of the SW pin is specified, and the output voltage is limited by the minimum OFF
time under the condition in which the voltage between input and output are close. To prevent this situation, OFF pulses
are skipped when the voltage between input and output are small to keep the High Side FET turned on and increase the
ON duty of the SW pin. The OFF pulse skip is done for 7 consecutive switching cycles in maximum (The switching
frequency becomes a one eighth of nominal frequency). In this case, the output voltage can be calculated with the
following equation.
(
ꢁꢒ
)
푉푂푈푇 = ꢋꢌꢍ퐷푢푡푦 × 푉 ꢎ ꢊ푂푁퐻 × ꢏ푂푈푇 ꢎ ꢊꢐ퐶 × ꢏ푂푈푇
퐼푁
푓
( )
ꢓ × 푉 ꢎ ꢊ푂푁퐻 × ꢏ푂푈푇 ꢎ ꢊꢐ퐶 × ꢏ푂푈푇 [V]
퐼푁
= ꢑ1 ꢎ 푡푂퐹퐹푀퐼푁
×
8
Where:
ꢋꢌꢍ퐷푢푡푦
푉
퐼푁
is the SW pin Maximum ON Duty Cycle [%]
is the Input Voltage [V]
ꢊ푂푁퐻
ꢏ푂푈푇
is the High Side FET ON Resistance [Ω]
is the Output Current [A]
(Refer to page 9)
ꢊꢐ퐶
is the DCR of Inductor [Ω]
푡푂퐹퐹푀퐼푁
ꢔ
푆푊
is the SW pin Minimum OFF Time [s]
is the Switching Frequency [Hz]
(Refer to page 8)
(Refer to page 9)
VIN
VOUT
VSW
Figure 27. Frequency Division Function
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Function Explanation - continued
7. Spread Spectrum Function
Connecting the SSCG pin with the VREG pin activates the Spread Spectrum function, reducing the EMI noise level.
When the Spread Spectrum function is activated, the switching frequency is varied with triangular wave of ΔfSSCG (±4.5 %,
Typ) amplitude centered on typical frequency fSW (2.2 MHz, Typ). The period of the triangular wave is tSSCG_CYCLE (466
µs, Typ). However, this function is masked when the RESET output is low. Connecting the SSCG pin with GND
deactivates this function.
VIN
VEN
VRTH
tSSCG_CYCLE
466 µs
(Typ)
VOUT
fSW
2.2 MHz
(Typ)
ΔfSSCG = +4.5 % (Typ)
ΔfSSCG = -4.5 % (Typ)
fSW
tRSTNACT
3.6 ms
(Typ)
tDLY
500 µs
(Typ)
VRESET
VSSCG
SSCG OFF
SSCG ON
Figure 28. Spread Spectrum Function
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Function Explanation - continued
8. VCC_EX Function
This IC has the function that supplies power from VOUT to internal supply VREG to improve the efficiency. When VVCC_EX
goes above VTEXH (3.05 V, Typ) or more, VREG is supplied from the VCC_EX pin. In case of the VCC_EX pin connected
with VOUT, the output voltage is used as a power supply for the internal circuitry and driver block. To protect the internal
circuit, VOUT is reduced with PWM switching when VCC_EX voltage exceeds VEXOVPH (6.2 V, Typ). Therefore, the
VCC_EX pin connection can be used when the output voltage is in the range of between VTEXH (3.2 V, Max) and VEXOVPL
(5.65 V, Min). Connect the VCC_EX pin with GND when VCC_EX function is not required.
The bias current IBIAS using VCC_EX function can be calculated using the following formula.
ꢏ퐵퐼퐴푆 = ꢏ푄_ꢕ퐼푁ꢖ ꢗ ꢏ푄_ꢕ퐶퐶_퐸푋ꢖ × 휂ꢖ × ꢕ
[μA]
ꢘꢙꢙ_ꢚꢛ
ꢕ
ꢜꢝ
Where:
ꢏ퐵퐼퐴푆
is total current from VIN [µA]
ꢏ푄_ꢕ퐼푁ꢖ
ꢏ푄_ꢕ퐶퐶_퐸푋ꢖ
ꢞ
is quiescent current from VIN (without current from VCC_EX) [µA]
is quiescent current from VCC_EX [µA]
(Refer to page 8)
(Refer to page 8)
is efficiency of Buck Converter
is the VCC_EX voltage [V]
is the input voltage [V]
푉ꢕ퐶퐶_퐸푋
푉
퐼푁
VIN
VREG
VCC_EX
VREG
(LDO)
+
-
ON/OFF
ON/OFF
VTEXH = 3.05 V (Typ)
/ VTEXL = 2.90 V (Typ)
Figure 29. VCC_EX Block Diagram
VIN
VEN
Vout Setting Level
VTEXH
3.05 V (Typ)
VTEXL
2.90 V (Typ)
VOUT = VVCC_EX
(Short)
VSW
Vout Setting Level
VREG
3.3 V (Typ)
VREG
VCC_EX State
VCC_EX OFF
VCC_EX ON
VCC_EX OFF
Figure 30. VCC_EX Timing Chart
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BD9P208MUF-C
Protect Function
1. Over Current Protection (OCP)
The Over Current Protection (OCP) monitors the average inductor current. The OCP detection level can be selected by
the OCP_SEL pin. When the OCP_SEL voltage is high, it is IOCP15 (2.250 A, Typ) and when the OCP_SEL voltage is low,
it is IOCP20 (3.000 A, Typ). When the average inductor current exceeds to its setting value, the duty cycle of the switching
is limited and the output voltage decreases. This protection circuit is effective in preventing damage due to sudden and
unexpected incidents. However, the IC should never be used in applications where the protection circuit operates
continuously (e.g. when a load that significantly exceeds the output current capability of the chip is connected).
IOCP
IL
IOUT
VOUT
Figure 31. Over Current Protection
2. Short Circuit Protection (SCP)
For BD9P208MUF-C, the Short Circuit Protection (SCP) block compares the FB pin voltage with the internal reference
voltage VREF. When the FB pin voltage has decreased to VSCPL (0.64 V, Typ) or less and remained there for 0.9 ms
(Typ), SCP stops the operation for 30 ms (Typ) and subsequently initiates a restart. If the FB pin voltage decreases to
VSCPL (0.64 V, Typ) or less and increases to VSCPH (0.72 V, Typ) or more within 0.9 ms afterwards, SCP protection is
released and output voltage recovers to normal operation.
The SCP function is deactivated during 7 ms (Typ) from VOUT starting up. In addition, when VIN decreases and VOUT
also decreases, the SCP function is deactivated not to detect short circuit protection. The SCP function is likewise
deactivated when VIN voltage is lower than VSCP_DACT (133 %, Typ) of the VOUT_SNS pin voltage, and then is activated
after 7 ms (Typ) from VIN voltage exceeds VSCP_DACT (133 %, Typ) of the VOUT_SNS pin voltage. Therefore, in the case
of short circuit from VIN close to VOUT condition, SCP stops the switching operation after 7.9 ms (Typ) from short circuit.
However, the device should never be used in applications characterized by continuous operation of the protection circuit
(e.g. when a load that significantly exceeds the output current capability of the chip is connected).
Output
Load
Condition
Normal
Over Load
Normal
VIN
VOUT x 133 %
33 %
VOUT
VOUT x 133 %
33 %
100 %
100 %
VFB
VSCPH:0.72 V (Typ)
VSCPL:0.64 V (Typ)
0.9 ms
(Typ)
0.9 ms
(Typ)
0.9 ms
(Typ)
VSW
HiZ
HiZ
OCP
Threshold
OCP
Threshold
Inductor
Current
(Internal)
SCP Mask
Delay Signal
7 ms (Typ)
7 ms (Typ)
7 ms (Typ)
7.9 ms (Typ)
(Internal)
HICCUP
Delay Signal
30 ms (Typ)
30 ms (Typ)
SCP Reset
SCP Reset
Figure 32. Short Circuit Protection (SCP) Timing Chart
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BD9P208MUF-C
Protect Function - continued
3. Power On Reset (POR)/Under Voltage Lockout Protection (UVLO)
The UVLO and POR are integrated to prevent the malfunction when the power supply voltage is decreased. The POR
monitors the VIN pin voltage. On the other hand, UVLO monitors the VREG pin voltage.
In the sequence of VIN rising, the VREG pin voltage also rises up to 3.3 V (Typ) following VIN voltage. First, UVLO is
released when VREG voltage increase above VUVLO_R (2.95 V, Typ). Next, POR is released when VIN voltage increase
above VPOR_R (3.8 V, Typ). When both POR and UVLO are released, the IC starts up with soft start.
In the sequence of VIN falling, VREG voltage also falls. When VREG voltage decreases below VUVLO_F (2.85 V, Typ),
UVLO is detected and puts the IC goes into standby state. At the same time, POR is detected. When the VCC_EX pin is
connected to VOUT, VREG voltage supplied from VCC_EX. In this case, drop voltage between VIN and VREG becomes
larger than the case of VCC_EX connected to GND because VOUT voltage is restricted by maximum duty at low VIN
condition. Therefore, UVLO is detected at higher VIN condition than the case when the VCC_EX pin is connected to
GND.
VPOR_R
3.8 V (Typ)
3.3 V (Typ)
VUVLO_R
2.95 V (Typ)
VUVLO_F
2.85 V (Typ)
VIN
VREG
POR
UVLO
VOUT
Figure 33. POR/UVLO Timing Chart
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BD9P208MUF-C
Protect Function - continued
4. Thermal Shutdown (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. If junction temperature (Tj) exceeds
TSD detection temperature (175 °C, Typ), the POWER MOSFETs are turned off. When the Tj falls below the TSD
temperature (150 °C, Typ), the IC restarts up with soft start. Where the input voltage required for the restart is the same
as that for the initial startup (Input voltage 4.0 V or more). Note that the TSD circuit operates in a situation that exceeds
the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or
for any purpose other than protecting the IC from heat damage.
VIN
VEN
TSD Detect
175 °C (Typ)
TSD Release
150 °C (Typ)
Tj
VREG
VRTH
VOUT
tRSTNACT
3.6 ms
(Typ)
tDLY
500 µs
(Typ)
VRESET
Figure 34. TSD Timing Chart
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BD9P208MUF-C
Protect Function – continued
5. Over Voltage Protection (OVP)
This IC has Over Voltage Protection (OVP) monitoring FB to prevent the increase of output voltage in case of external
injected current to VOUT. If the FB pin voltage exceeds VOVPH (0.860 V, Typ), the switching regulator sinks current from
VOUT by changing state to PWM. The sink current during OVP is restricted to INCP (2.500 A, Typ) (OCP_SEL = L). In
addition, the RESET pin is pulled down to GND during OVP detection. To prevent the malfunction by noise, the internal
delay tRSTNFILT of 5 µs (Typ) is implemented after OVP detection. When the FB pin voltage falls below VOVPL (0.840 V,
Typ), OVP function is released. The RESET pin is kept low and PWM switching is also kept during tRSTNACT (3.6 ms, Typ)
after OVP function is released. When OCP_SEL is set high level, then INCP value is changed to INCP (1.875 A, Typ).
If the FB pin is open, this IC cannot regulate VOUT correctly. In this case, if VOUT voltage exceeds VSNSOVPH or VCC_EX
voltage exceed VEXOVPH, the VOUT is pulled down by PWM switching to protect internal devices same as the situation
that the FB pin over voltage is detected.
VOUT
VOVPH
VOVPL
VFB
IL
INCP
VSW
tRSTNACT
VRESET
tRSTNFILT
Figure 35. FB OVP Timing Chart
VEXOVPH/VSNSOVPH
VEXOVPL/VSNSOVPL
VOUT
VFB
IOCP
IL
INCP
VSW
VRESET
< tRSTNACT
tRSTNFILT
Figure 36. VCC_EX/VOUT_SNS OVP Timing Chart
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BD9P208MUF-C
5. Over Voltage Protection (OVP) - continued
If VOUT is shorted to the Battery Line as following figure, the DC/DC converter (BD9P208MUF-C) sinks current from
VOUT to the Low Side FET. If a Reverse Polarity Protection Diode is on the Battery Line, the VIN voltage results in being
boosted up and might exceed the absolute maximum ratings.
Battery Line
Reverse Polarity
Protection Diode
D
Battery Line
VIN
L1
VOUT
SW
DC/DC Converter
Figure 37. VOUT shorted to Battery Line
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BD9P208MUF-C
Selection of Components Externally Connected
Contact us if not use the recommended constant in the application circuit.
Necessary parameters in designing the power supply are as follows:
Table 1. Application Sample Specification
Parameter
Input Voltage
Symbol
VIN
Specification Case
3.5 V to 40 V
5.0 V
Output Voltage
VOUT
ΔVP-P
IOUT
Output Ripple Voltage
Output Current
20 mVp-p
Typ 1.0 A/Max 2.0 A
2.2 MHz
Switching Frequency
Operating Temperature Range
fSW
Ta
-40 °C to +125 °C
CBST
VIN
VIN
BST
SW
L1
VOUT
PVIN
VCC_EX
RFB1
EN
VOUT_DIS
FB
CBLK CIN
PGND
VREG
OCP_SEL
VOUT_SNS
COUT
RRST
RESET
MODE
SSCG
RFB2
VMODE
VSSCG
CREG
GND
Figure 38. Application Sample Circuit
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BD9P208MUF-C
Selection of Components Externally Connected - continued
1. Selection of the inductor L1 value
The inductor in the switching regulator supplies a continuous current to the load and functions as a filter to smooth the
output voltage. In current mode control, the sub-harmonic oscillation may happen. The slope compensation is integrated
into the IC to prevent the sub-harmonic oscillation. The sub-harmonic oscillation depends on the rate of increase of output
switch current. If the inductor value is too small, the sub-harmonic oscillation may happen because the inductor ripple
current ΔIL is increased. If the inductor value is too large, the feedback loop may not achieve stability because the inductor
ripple current ΔIL is decreased.
The recommended inductor value for each output voltage and OCP_SEL setting is shown below.
Table 2. Recommended inductor value
Output voltage
OCP_SEL
Maximum output current
Inductor value
3.3 μH
L
H
L
2.0 A
1.5 A
2.0 A
1.5 A
1.1 V < VOUT
4.7 μH
4.7 μH
VOUT ≤ 1.1 V
H
6.8 μH
The peak to peak inductor current is shown by the following equation:
(
)
×ꢕ
ꢕ
−ꢕ
ꢜꢝ
ꢟꢇꢂ
ꢟꢇꢂ
∆ꢏ퐿 =
[A]
ꢕ
ꢜꢝ
×푓 ×퐿
ꢁꢒ
Where:
푉
퐼푁
is the input voltage [V]
푉푂푈푇
is the output voltage [V]
is the switching frequency [Hz]
is the inductor value [H]
ꢔ
푆푊
ꢠ
ΔVP-P (Output peak-to-peak ripple voltage) is shown in the following equation.
∆퐼
ꢈ
∆푉푃−푃 = ∆ꢏ퐿 × ꢡꢢꢊ ꢗ 8×퐶
[V]
ꢁꢒ
(a)
×푓
ꢟꢇꢂ
Where:
ꢡꢢꢊ
ꢣ푂푈푇
is the equivalent series resistance of the output capacitor [Ω]
is the output capacitance [F]
ꢔ
푆푊
is the switching frequency [Hz]
The shielded type (closed magnetic circuit type) is the recommended type of inductor to be used. It is important not to
magnetic saturate the core in any situation, so please make sure that the definition of rated current is different according
to the manufactures. Please check the rated current at maximum ambient temperature of application to inductor
manufacturer.
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BD9P208MUF-C
Selection of Components Externally Connected - continued
2. Selection of Output Capacitor COUT
The output capacitor is selected based on the ESR that is required from the previous page equation (a). ΔVP-P can be
reduced by using a capacitor with a small ESR.
The ceramic capacitor is the best option that meets this requirement. It is because not only it has a small ESR but the
ceramic capacitor also contributes to the size reduction of the application circuit. Please confirm the frequency
characteristics of ESR from the datasheet of the capacitor manufacturer, and consider a low ESR value for the switching
frequency being used. It is necessary to consider that the capacitance of the ceramic capacitor changes obviously
according to DC biasing characteristic. For the voltage rating of the ceramic capacitor, twice or more the maximum output
voltage is usually required. By selecting a high voltage rating, it is possible to reduce the influence of DC bias
characteristics. Moreover, in order to maintain good temperature characteristics, the one with the characteristics of X7R
or better is recommended. Because the voltage rating of a large ceramic capacitor is low, the selection becomes difficult
for an application with high output voltage. In that case, please connect multiple ceramic capacitors.
These capacitors are rated in ripple current. The RMS values of the ripple current that can be obtained in the following
equation and must not exceed the ripple current rating.
∆퐼
ꢈ
ꢏ퐶푂푈푇(푅푀푆)
=
[A]
ꢖ2
√
Where:
ꢏ퐶푂푈푇(푅푀푆)
is the value of the ripple electric current [A]
Next, when the output setting voltage is 3.3 V or more, it is recommended that the output ceramic capacitor COUT is 44
μF (Typ) or more for OCP_SEL = L and 32 μF (Typ) or more for OCP_SEL = H. When the output setting voltage less
than 3.3 V, the output ceramic capacitor COUT is recommended to the following equation.
Table 3. Output ceramic capacitor recommended capacitance value
OCP_SEL
VOUT ≥ 3.3 V
1.1 V < VOUT < 3.3 V
VOUT ≤ 1.1 V
2ꢖ7.8
ꢖꢤ5.2
ꢣ푂푈푇
ꢣ푂푈푇
≥
≥
[μF]
L
ꢣ푂푈푇
ꢣ푂푈푇
≥
≥
[μF]
[μF]
ꢣ푂푈푇 ≥ 44 [μF]
ꢕ
ꢟꢇꢂ
ꢕ
ꢟꢇꢂ
ꢖ26.7
ꢖ05.6
[μF]
H
ꢣ푂푈푇 ≥ 3ꢥ [μF]
ꢕ
ꢟꢇꢂ
ꢕ
ꢟꢇꢂ
When selecting the capacitor ensure that the capacitance COUT_WORST of the following equation is maintained at the
characteristics of DC Bias, AC Voltage, temperature, and tolerance.
Table 4. Output ceramic capacitor minimum capacitance value
OCP_SEL
VOUT ≥ 3.3 V
1.1 V < VOUT < 3.3 V
VOUT ≤ 1.1 V
ꢖꢤ8.5
99.0
ꢣ푂푈푇
ꢣ푂푈푇
≥
≥
[μF]
L
ꢣ푂푈푇
ꢣ푂푈푇
≥
≥
[μF]
[μF]
ꢣ푂푈푇 ≥ 3ꢦ [μF]
ꢕ
ꢟꢇꢂ
ꢕ
ꢟꢇꢂ
ꢖ00.0
66.0
[μF]
H
ꢣ푂푈푇 ≥ ꢥꢦ [μF]
ꢕ
ꢟꢇꢂ
ꢕ
ꢟꢇꢂ
If the capacitance falls below this value, the oscillation may happen. When using the electrolytic capacitor and the
conductive polymer hybrid aluminum electrolytic capacitor, please place it in addition to the ceramic capacitors with the
capacity described above. Actually, the changes in the frequency characteristic are greatly affected by the type and the
condition (temperature, etc.) of parts that are used, the wire routing and layout of the PCB. Please confirm stability and
responsiveness in actual application. And please place PCB patterns that allows COUT adjustment from the initial
design in case of insufficient stability and responsiveness.
In addition, for the total value of capacitance in the output line COUT(Max), please choose a capacitance value less than
the value obtained by the following equation:
ꢧ
×ꢖ.25×ꢨ퐼
−퐼
ꢪ
ꢁꢁ(ꢃ푖푛)
ꢟꢙꢆ(ꢃ푖푛) ꢟꢇꢂ_ꢁꢂꢩꢀꢂ(ꢃꢄꢅ)
ꢣ푂푈푇(푀푎푥)
<
[F]
ꢕ
ꢟꢇꢂ
Where:
ꢏ푂퐶푃(푀ꢫꢬ)
is the OCP operation current (Min) [A]
is the Soft Start Time (Min) [s]
푡푆푆(푀ꢫꢬ)
ꢏ푂푈푇_푆푇퐴푅푇(푀푎푥) is the maximum load current during startup [A]
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BD9P208MUF-C
2. Selection of Output Capacitor COUT - continued
If the limits from the above-mentioned are exceeded, Startup failure may happen in 7.9 ms after VOUT starts up. If the
capacitance value is extremely large, over-current protection may be activated by the inrush current at startup preventing
the output to turn on. Please confirm this on the actual application.
Also, in case of large changing input voltage and load current, select the capacitance by verifying that the actual
application setup meets the required specification.
3. Selection of Input Capacitor CIN, CBLK
For input capacitors, there are two types of capacitor: decoupling capacitors CIN and bulk capacitors CBLK
.
Ceramic capacitors with total values 2.3 µF or more are necessary for the decoupling capacitors CIN for ripple noise
reduction. If a low ESR electrolytic capacitor with large capacitance is connected parallel to the decoupling capacitors as
a bulk capacitor, ceramic capacitors with 0.5 µF or more are necessary for the decoupling capacitors. (However, to
reduce EMI noise level, 2.3 µF or more are recommended for ceramic capacitors.) These capacitor values including
device variation, temperature characteristics, DC bias characteristics, and aging change must be larger than minimum
value. It is effective for switching noise reduction to place one of ceramic capacitor close to the PVIN and the VIN pins.
The voltage rating of the capacitors is recommended to be 1.2 times or more the maximum input voltage, or twice the
normal input voltage. Also, the IC might not operate properly when the PCB layout or the position of the capacitor is not
good. Please check “PCB Layout Design” on page 41.
The bulk capacitor is optional. The bulk capacitor prevents the decrease in the line voltage and serves as a backup power
supply to keep the input voltage constant. A low ESR electrolytic capacitor with large capacitance is suitable for the bulk
capacitor. It is necessary to select the best capacitance value for each of application. In that case, please take note not
to exceed the rated ripple current of the capacitor.
The RMS value of the input ripple current ICIN(RMS) is obtained in the following equation:
ꢕ
ꢕ
ꢖ
ꢟꢇꢂ
2
ꢏ퐶퐼푁 푅푀푆
=
)
× {ꢏ푂푈푇(푀푎푥)2 × ꢑ1 ꢎ ꢟꢇꢂꢓ ꢗ ꢖ2 × 훥ꢏ퐿 } [A]
ꢕ
ꢜꢝ ꢜꢝ
ꢭ
(
ꢕ
Where:
ꢏ푂푈푇(푀푎푥)
is the output current (Max) [A]
In addition, in automotive and other applications requiring high reliability, it is recommended to connect the capacitors in
parallel to accommodate multiple electrolytic capacitors and minimize the chances of drying up. For ceramic capacitors,
it is recommended to make two series + two parallel structures to decrease the risk of capacitor destruction due to short
circuit conditions.
When the impedance on the input side is high for some reason (because the wiring from the power supply to the VIN pin
is long, etc.), then high capacitance is required. In actual conditions, it is necessary to verify that there are no problems
like IC is turned off, or the output overshoots due to the change in VIN at transient response.
4. Selection of the Bootstrap Capacitor
For Bootstrap capacitor CBST, please connect a 0.1 μF (Typ) ceramic capacitor as close as possible between the BST
pin and the SW pin.
5. Selection of the VREG Capacitor.
For VREG capacitor CREG, please connect a 1.0 μF (Typ) ceramic capacitor between the VREG pin and GND.
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BD9P208MUF-C
Selection of Components Externally Connected - continued
6. Selection of Output Voltage Setting Resistor RFB1, RFB2
For the BD9P208MUF-C, the output voltage is set with output voltage setting resistors RFB1 and RFB2. The reference
voltage of GmAmp1 is set to 0.8 V and the IC operates to regulate the FB pin voltage to 0.8 V. The output voltage is
defined by the formula (1). RFB1 and RFB2 should be adjusted to set the required output voltage. If RFB1 and RFB2 are large,
the current flowing through on these resistors is small and the circuit current at no load can be reduced. However, the
phase shift is likely to happen because of the parasitic capacitance of IC and PCB on the FB pin. Therefore, the combined
resistance RFB1//RFB2 should be set to 100 kΩ or less. If the combined resistance RFB1//RFB2 is 100 kΩ or more, CFB1 and
CFB2 should be chosen to satisfy the formula (2). In this case, the value of CFB1 and CFB2 should be chose the capacitor
of 47 pF or more that is much larger than CP.
푅
+푅
ꢮꢯꢰ
푉푂푈푇
=
ꢮꢯꢱ × ꢦ.ꢲ [V]
(1)
푅
ꢮꢯꢱ
푅
푅
×퐶
×퐶
ꢮꢯꢰ
ꢮꢯꢱ
ꢮꢯꢰ
≈ 1
(2)
ꢮꢯꢱ
VOUT
CFB1
RFB1
FB
Gm Amp1
comp
0.80 V
RFB2
CFB2
CP
Figure 39. Setting for Output Setting Resistor
The changes in the frequency characteristic are greatly affected by the type and the condition (temperature, etc.) of parts
that are used. Please ensure a phase margin of 45 ° or more and a gain margin of 5 dB or more in actual application. If
it cannot ensure, CFB1 and CFB2 should be chosen to satisfy the following equation as a guide. Please place PCB patterns
that allows CFB1 and CFB2 adjustment from the initial design in case of insufficient stability and responsiveness.
8000
ꢣ퐹퐵ꢖ
≤
[pF]
푅
ꢮꢯꢰ
ꢣ퐹퐵ꢖ × ꢑ푅푅ꢮꢯꢰꢓ ≤ ꢣ퐹퐵2 ≤ ꢣ퐹퐵ꢖ × ꢑ5×푅ꢮꢯꢰ ꢗ 4ꢓ [pF]
푅
ꢮꢯꢱ
ꢮꢯꢱ
Where:
ꢊ퐹퐵ꢖ
ꢊ퐹퐵2
is the output voltage setting resistors [kΩ]
is the output voltage setting resistors [kΩ]
If the voltage between input and output increases and the ON time of the SW decreases to under tONMIN, the switching
frequency is decreased. To ensure stable switching frequency, the output voltage must satisfy the following equation. If
this equation is not satisfied, the SW pulse is skipped. In this case, the switching frequency decreases and the output
voltage ripple increases.
푉푂푈푇 ≥ 푉
× ꢔ
× 푡푂푁푀퐼푁(푀푎푥) [V]
퐼푁(푀푎푥)
푆푊(푀푎푥)
Where:
푉
is the Input Voltage (Max) [V]
퐼푁(푀푎푥)
ꢔ
is the Switching Frequency (Max) [Hz]
(Refer to page 9)
(Refer to page 8)
푆푊(푀푎푥)
푡푂푁푀퐼푁(푀푎푥) is the SW Minimum ON time (Max) [s]
If the voltage between input and output decreases, the ON time of the SW increases by skipping the off time and the
switching frequency is decreased. To keep switching frequency stably, the following equation must be satisfied.
푉푂푈푇 ≤ 푉
× (1 ꢎ ꢔ
× 푡
)) [V]
(
)
(
)
(
퐼푁 푀ꢫꢬ
푆푊 푀푎푥
푂퐹퐹푀퐼푁 푀푎푥
Where:
푡푂퐹퐹푀퐼푁(푀푎푥) is the SW Minimum OFF Time (Max) [s]
(Refer to page 8)
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BD9P208MUF-C
Application Examples 1
Table 5. Specification Example 1
Parameter
Input Voltage
Symbol
VIN
Specification Case
8 V to 18 V
Output Voltage
VOUT
IOUT
3.3 V
Output Current
Typ 1.0 A / Max 2.0 A
-40 °C to +125 °C
Operating Temperature Range
Ta
CBST
LF1
VIN
VBAT
VIN
PVIN
EN
BST
SW
L1
VOUT
VCC_EX
VOUT_DIS
FB
RFB1
CIN2 CIN1
CF1
CF2 CBLK
PGND
VOUT_SNS
COUT1 COUT2
RRST
RESET
MODE
SSCG
VREG
RFB2
VMODE
VSSCG
OCP_SEL
CREG
GND
Π-type filter
Figure 40. Reference Circuit 1
Table 6. Application Example 1 Parts List
No.
CF1
LF1
CF2
Package
Parameters
4.7 µF, X7R, 50 V
2.2 µH
Part Name (Series)
Type
Manufacturer
MURATA
TDK
3225
GCM32ER71H475K
CLF6045NIT-2R2N-D
GCM155R71H104K
Ceramic
Inductor
Ceramic
W6.0 x H4.5 x L6.3 mm3
1005
0.1 µF, X7R, 50 V
MURATA
Electrolytic
capacitor
CBLK
φ10 mm x L10 mm
220 µF, 35 V
UWD1V221MCL1GS
NICHICON
CIN2
CIN1
3225
4.7 µF, X7R, 50 V
0.1 µF, X7R, 50 V
1 µF, X7R, 16 V
0.1 µF, X7R, 50 V
10 kΩ, 1 %, 1/16 W
3.3 µH
GCM32ER71H475K
GCM155R71H104K
GCM21BR71C105K
GCM155R71H104K
MCR01MZPF1002
CLF6045NIT-3R3N-D
GCM32ER71A226K
GCM32ER71A226K
MCR01MZPF7502
MCR01MZPF2402
Ceramic
Ceramic
MURATA
MURATA
MURATA
MURATA
ROHM
1005
CREG
CBST
RRST
L1
2012
Ceramic
1005
Ceramic
1005
Chip resistor
Inductor
W6.0 x H4.5 x L6.3 mm3
TDK
COUT1
COUT2
RFB1
RFB2
3225
3225
1005
1005
22 µF, X7R, 10 V
22 µF, X7R, 10 V
75 kΩ, 1 %, 1/16 W
24 kΩ, 1 %, 1/16 W
Ceramic
MURATA
MURATA
ROHM
Ceramic
Chip resistor
Chip resistor
ROHM
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BD9P208MUF-C
Application Examples 1 - continued
(Ta = 25 °C)
100
90
10000
1000
100
10
80
MODE = High
70
MODE = Low
60
50
40
30
20
10
0
1
MODE = High
0.1
MODE = Low
0.01
0.01
0.1
1
10
100
1000 10000
0.01
0.1
1
10
100
1000 10000
Output Current [mA]
Output Current [mA]
Figure 41. Efficiency vs Output Current
(VIN = 12 V)
Figure 42. Input Current vs Output Current
(VIN = 12 V)
80
60
180
135
90
Phase
VMODE (5 V/div)
VSW (5 V/div)
40
20
45
0
0
-20
-40
-60
-80
-45
-90
-135
-180
Gain
VOUT (100 mV/div) offset 3.3 V
Time (200 µs/div)
1k
10k
100k
1M
Frequency [Hz]
Figure 43. Frequency Characteristic
(VIN = 12 V, IOUT = 1.0 A)
Figure 44. MODE ON/OFF Response
(VIN = 12 V, IOUT = 50 mA)
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Application Examples 1 - continued
(Ta = 25 °C)
IOUT (1.0 A/div)
IOUT (1.0 A/div)
offset 3.3 V
VOUT (100 mV/div)
VOUT (100 mV/div) 3 V
Time (1 ms/div)
Time (1 ms/div)
Figure 45. Load Response 1
(VIN = 12 V, VMODE = 5 V, IOUT = 0 A to 2 A)
Figure 46. Load Response 2
(VIN = 12 V, VMODE = 0 V, IOUT = 0 A to 2 A)
VIN (5 V/div)
VIN (2 V/div)
VOUT (2 V/div)
set 3.3 V
VOUT (100 mV/div)
Time (200 µs/div)
Time (200 µs/div)
Figure 47. Line Response 1
(VIN = 16 V to 8 V, IOUT = 2 A)
Figure 48. Line Response 2
(VIN = 16 V to 3.5 V, IOUT = 2 A)
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BD9P208MUF-C
Application Examples 1 - continued
(Ta = 25 °C)
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
Input Voltage [V]
Input Voltage [V]
Figure 49. Output Voltage vs Input Voltage 1
(RLOAD = 165 Ω)
Figure 50. Output Voltage vs Input Voltage 2
(RLOAD = 1.65 Ω)
3.366
3.337
3.308
3.279
3.250
3.366
3.337
3.308
3.279
3.250
8
10
12
14
16
18
0
500
1000
1500
2000
Input Voltage [V]
Output Current [mA]
Figure 51. Line Regulation
(IOUT = 2 A)
Figure 52. Load Regulation
(VIN = 12 V)
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BD9P208MUF-C
Application Examples 2
Table 7. Specification Example 2
Parameter
Input Voltage
Symbol
VIN
Specification Case
8 V to 18 V
Output Voltage
VOUT
IOUT
5.0 V
Output Current
Typ 1.0 A / Max 2.0 A
-40 °C to +125 °C
Operating Temperature Range
Ta
CBST
LF1
VIN
VBAT
VIN
PVIN
EN
BST
SW
L1
VOUT
VCC_EX
VOUT_DIS
FB
RFB1
CIN2 CIN1
CF1
CF2 CBLK
PGND
VOUT_SNS
COUT1 COUT2
RRST
RESET
MODE
SSCG
VREG
RFB2
VMODE
VSSCG
OCP_SEL
CREG
GND
Π-type filter
Figure 53. Reference Circuit 2
Parameters
Table 8. Application Example 2 Parts List
No.
CF1
LF1
CF2
Package
Part Name (Series)
GCM32ER71H475K
Type
Manufacturer
MURATA
TDK
3225
4.7 µF, X7R, 50 V
2.2 µH
Ceramic
Inductor
Ceramic
W6.0 x H4.5 x L6.3 mm3
1005
CLF6045NIT-2R2N-D
GCM155R71H104K
0.1 µF, X7R, 50 V
MURATA
Electrolytic
capacitor
CBLK
φ10 mm x L10 mm
220 µF, 35 V
UWD1V221MCL1GS
NICHICON
CIN2
CIN1
3225
4.7 µF, X7R, 50 V
0.1 µF, X7R, 50 V
1 µF, X7R, 16 V
0.1 µF, X7R, 50 V
10 kΩ, 1 %, 1/16 W
3.3 µH
GCM32ER71H475K
GCM155R71H104K
GCM21BR71C105K
GCM155R71H104K
MCR01MZPF1002
CLF6045NIT-3R3N-D
GCM32ER71A226K
GCM32ER71A226K
MCR01MZPF6802
MCR01MZPF1302
Ceramic
Ceramic
MURATA
MURATA
MURATA
MURATA
ROHM
1005
CREG
CBST
RRST
L1
2012
Ceramic
1005
Ceramic
1005
Chip resistor
Inductor
W6.0 x H4.5 x L6.3 mm3
TDK
COUT1
COUT2
RFB1
RFB2
3225
3225
1005
1005
22 µF, X7R, 10 V
22 µF, X7R, 10 V
68 kΩ, 1 %, 1/16 W
13 kΩ, 1 %, 1/16 W
Ceramic
MURATA
MURATA
ROHM
Ceramic
Chip resistor
Chip resistor
ROHM
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Application Examples 2 - continued
(Ta = 25 °C)
10000
1000
100
10
100
90
80
MODE = High
70
MODE = Low
60
50
40
1
30
MODE = High
20
10
0
0.1
MODE = Low
0.01
0.01
0.1
1
10
100
1000 10000
0.01
0.1
1
10
100
1000 10000
Output Current [mA]
Output Current [mA]
Figure 54. Efficiency vs Output Current
(VIN = 12 V)
Figure 55. Input Current vs Output Current
(VIN = 12 V)
80
60
180
135
90
Phase
VMODE (5 V/div)
VSW (5 V/div)
40
20
45
0
0
-20
-40
-60
-80
-45
-90
-135
-180
Gain
VOUT (100 mV/div) offset 5 V
Time (200 µs/div)
1k
10k
100k
1M
Frequency [Hz]
Figure 56. Frequency Characteristic
(VIN = 12 V, IOUT = 1.0 A)
Figure 57. MODE ON/OFF Response
(VIN = 12 V, IOUT = 50 mA)
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Application Examples 2 - continued
(Ta = 25 °C)
IOUT (1.0 A/div)
IOUT (1.0 A/div)
offset 5 V
VOUT (100 mV/div)
VOUT (100 mV/div) V
Time (1 ms/div)
Time (1 ms/div)
Figure 58. Load Response 1
(VIN = 12 V, VMODE = 5 V, IOUT = 0 A to 2 A)
Figure 59. Load Response 2
(VIN = 12 V, VMODE = 0 V, IOUT = 0 A to 2 A)
VIN (5 V/div)
VIN (2 V/div)
VOUT (2 V/div)
set 5 V
VOUT (100 mV/div)
Time (200 µs/div)
Time (200 µs/div)
Figure 60. Line Response 1
(VIN = 16 V to 8 V, IOUT = 2 A)
Figure 61. Line Response 2
(VIN = 16 V to 4 V, IOUT = 2 A)
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BD9P208MUF-C
Application Examples 2 - continued
(Ta = 25 °C)
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
Input Voltage [V]
Input Voltage [V]
Figure 62. Output Voltage vs Input Voltage 1
(RLOAD = 250 Ω)
Figure 63. Output Voltage vs Input Voltage 2
(RLOAD = 2.5 Ω)
5.084
5.041
4.997
4.954
4.910
5.084
5.041
4.997
4.954
4.910
0
500
1000
1500
2000
8
10
12
14
16
18
Input Voltage [V]
Output Current [mA]
Figure 64. Line Regulation
(IOUT = 2 A)
Figure 65. Load Regulation
(VIN = 12 V)
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BD9P208MUF-C
Automotive Power Supply Line Circuit
Reverse Polarity
Protection Diode
D
Battery Line
VIN
DC/DC Converter
L
C
C
TVS
π-type filter
Figure 66. Automotive Power Supply Line Circuit
As a reference, the automotive power supply line circuit example is given in figure above.
The π-type filter is a third-order LC filter. In general, it is used in combination with decoupling capacitors for high frequency.
Since large attenuation characteristics can be obtained, excellent characteristic is also obtained as an EMI filter. Devices
used for π-type filters should be placed close to each other.
TVS (Transient Voltage Suppressors) is used for primary protection of the automotive power supply line. Since it is necessary
to withstand high energy of load dump surge, a general zener diode is insufficient. Recommended device is shown in the
following table.
In addition, a reverse polarity protection diode is needed considering if a power supply such as Battery is accidentally
connected in the opposite direction.
Table 9. Reference Parts of Automotive Power Supply Line Circuit
Device
Part name (series)
CLF series
Manufacturer
TDK
Device
TVS
D
Part name (series)
SMB series
Manufacturer
Vishay
L
L
XAL series
Coilcraft
S3A to S3M series
Vishay
C
CJ series / CZ series
NICHICON
Recommended Parts Manufacturer List
Shown below is the list of the recommended parts manufacturers for reference.
Type
Electrolytic Capacitor
Ceramic Capacitor
Hybrid Capacitor
Inductor
Manufacturer
NICHICON
Murata
URL
www.nichicon-us.com
www.murata.com
www.sunelec.co.jp
product.tdk.com
www.coilcraft.com
www.sumida.com
www.vishay.com
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Suncon
TDK
Inductor
Coilcraft
SUMIDA
Vishay
Inductor
Diode
Diode/Resistor
ROHM
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BD9P208MUF-C
PCB Layout Design
PCB layout design for DC/DC converter power supply IC is as important as the circuit design. Appropriate layout can avoid
various problems caused by power supply circuit. Figure 67 (a) to Figure 67 (c) figure the current path in a buck converter
circuit. The Loop1 in Figure 67 (a) is a current path when High Side Switch is ON and Low Side Switch is OFF, the Loop2 in
Figure 67 (b) is when High Side Switch is OFF and Low Side Switch is ON. The thick line in Figure 67 (c) shows the difference
between Loop1 and Loop2. The current in thick line changes sharply each time the switching element High Side Switch and
Low Side Switch change from OFF to ON, and vice versa. These sharp changes induce several harmonics in the waveform.
Therefore, the loop area of thick line that is consisted by input capacitor and IC should be as small as possible to minimize
noise. For more detail, refer to application note of switching regulator series “PCB Layout Techniques of Buck Converter”.
Loop1
VIN
VOUT
L
High Side Switch
CIN
COUT
Low Side Switch
GND
GND
Figure 67 (a). Current Path when High Side Switch = ON, Low Side Switch = OFF
VIN
VOUT
L
High Side Switch
CIN
COUT
Loop2
Low Side Switch
GND
VIN
GND
Figure 67 (b). Current Path when High Side Switch = OFF, Low Side Switch = ON
VOUT
L
High Side FET
CIN
COUT
Low Side FET
GND
GND
Figure 67 (c). Difference of Current and Critical Area in Layout
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BD9P208MUF-C
PCB Layout Design – continued
When designing the PCB layout, please pay extra attention to the following points.
1. The decoupling capacitors (CIN1) for the VIN pin (pin 1) and the PVIN pins (pin 2 and pin 3) should be placed closest
to the PVIN pins and the PGND pins (pin 5 and pin 6). In addition, placing a capacitor 0.1 μF close to the PVIN pin
results in minimizing the high-frequency noise.
2. The device, the input capacitor, the output inductor and the output capacitor should be placed on the same side of the
board and the connection of each part should be made on the same layer.
3. Place the ground plane in a layer closest to the surface layer where the device is mounted.
4. The GND pin (pin 15) is the reference ground and the PGND pins are the power ground. These pins should be
connected through the back side of the device. The power systems ground should be connected to the ground plane
using as many vias as possible.
5. The capacitor for VREG should be placed closest to the VREG pin (pin 21), the GND pin and the PGND pin. As shown
in the Recommended Board Layout Example, it can be realized that connecting with the shortest distance for the GND
pin and the PGND pins by placing the capacitor for VREG on the closest to the VREG pin and wiring at the back side
of the IC.
6. Place Bootstrap capacitor CBST close to the device with short traces to the SW pins (pin 7 and pin 8) and the BST pin
(pin 9).
7. To minimize the emission noise from switching node, the distance between the SW pins to inductor should be as short
as possible and not to expand the copper area more than necessary.
8. Place the output capacitor close to the inductor and power ground area.
9. Make the feedback line from the output away from the inductor and the switching node. If this line is affected by
external noise, an error may be occurred in the output voltage or the control may become unstable. Therefore, move
the feedback line to back side layer of the board through via and connect it to the VOUT_SNS pin (pin 17). When the
VCC_EX function and the output discharge function are used, connect it to the VCC_EX (pin 20) and the VOUT_DIS
pin (pin 18) as well, respectively.
10. RFB1 and RFB2 Feedback resistors are needed for BD9P208MUF-C. Place RFB1, RFB2 close to the FB pin (pin 18).
11. RFB0 is for measuring the frequency characteristic of the feedback. By inserting a resistor in RFB0, the frequency
characteristics (phase margin) of the feedback can be measured. RFB0 should be short-circuited for the normal use.
Reference Ground Area
Power Ground Area
Figure 68. Recommended Board Layout Example
L1
VOUT
SW
VCC_EX
COUT
( RFB0
)
VOUT_SNS
FB
( CFB1
( CFB2
)
)
RFB1
RFB2
Figure 69. The resistor for measuring the frequency characteristic of the feedback
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BD9P208MUF-C
Power Dissipation
For thermal design, be sure to operate the IC within the following conditions.
(Since the temperatures described hereunder are all guaranteed temperatures, take margin into account.)
1. The ambient temperature Ta is to be 125 °C or less.
2. The chip junction temperature Tj is to be 150 °C or less.
The chip junction temperature Tj can be considered in the following two patterns:
1. To obtain Tj from the package surface center temperature Tt in actual use
ꢳ푗 = ꢳ푡 ꢗ 휓퐽푇 × ꢴ [°C]
2. To obtain Tj from the ambient temperature Ta
ꢳ푗 = ꢳꢌ ꢗ 휃퐽퐴 × ꢴ [°C]
Where:
휓퐽푇
휃퐽퐴
is junction to top characterization parameter
is junction to ambient
(Refer to page 7)
(Refer to page 7)
The heat loss W of the IC can be obtained by the formula shown below.
This formula is approximation, please confirm this on the actual application circuit.
푉푂푈푇
푉푂푈푇
2
ꢴ = ꢊ푂푁퐻 × ꢏ푂푈푇
×
ꢗ ꢊ푂푁퐿 × ꢏ푂푈푇2 ꢵ1 ꢎ
ꢶ
푉
퐼푁
푉
퐼푁
ꢖ
(
)
ꢗ푉 × ꢏ푄_ꢕ퐼푁ꢤ ꢗ 푉푂푈푇 × ꢏ푄_ꢕ퐶퐶_퐸푋2 ꢗ × 푡푟 ꢗ 푡ꢔ × 푉 × ꢏ푂푈푇 × ꢔ
[W]
퐼푁
퐼푁
푆푊
2
Where:
ꢊ푂푁퐻
ꢊ푂푁퐿
ꢏ푂푈푇
is the High Side FET ON Resistance [Ω]
is the Low Side FET ON Resistance [Ω]
is the Load Current [A]
(Refer to page 9)
(Refer to page 9)
푉푂푈푇
is the Output Voltage [V]
푉
퐼푁
is the Input Voltage [V]
ꢏ푄_ꢕ퐼푁ꢤ
is the Quiescent Current from VIN [A]
is the Quiescent Current from VCC_EX [A]
is the Switching Rise Time [s] (5 ns, Typ)
is the Switching Fall Time [s] (5 ns, Typ)
is the Switching Frequency [Hz]
(Refer to page 8)
(Refer to page 8)
ꢏ푄_ꢕ퐶퐶_퐸푋2
푡푟
푡ꢔ
ꢔ
푆푊
(Refer to page 9)
tr
tf
2
1. ꢊ푂푁퐻 × ꢏ푂푈푇
2
2. ꢊ푂푁퐿 × ꢏ푂푈푇
3. ꢖ × (푡푟 ꢗ 푡ꢔ) × 푉 × ꢏ푂푈푇 × ꢔ
퐼푁
푆푊
2
Figure 70. SW Waveform
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BD9P208MUF-C
I/O Equivalence Circuits
23. EN
12. MODE
VREG
10 kΩ
EN
50 kΩ
MODE
850 kΩ
GND
GND
GND GND
14. RESET
GND
7,8. SW, 9.BST
BST
SW
VREG
PVIN
RESET
100 Ω
VREG
GND
GND
PGND
GND
11. OCP_SEL, 13. SSCG
16. VOUT_DIS
VREG
VOUT_DIS
56 Ω
50 kΩ
OCP_SEL/
SSCG
GND
GND
GND
GND
*Resistance value is Typ.
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BD9P208MUF-C
I/O Equivalence Circuits - continued
17. VOUT_SNS, 18. FB
20. VCC_EX, 21. VREG
VOUT_SNS
VIN
VREG
VREG
GND
10 kΩ
FB
GND
GND
VCC_EX
GND
15 MΩ
GND
*Resistance value is Typ.
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BD9P208MUF-C
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground
due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below
ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions
such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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BD9P208MUF-C
Operational Notes - continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 71. Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0T8T0AL01620-1-2
15.Jul.2022 Rev.002
47/50
BD9P208MUF-C
Ordering Information
B D 9 P 2
0
8 M U
F
-
C E 2
Part Number
Package
Product Rank
MUF: VQFN24FV4040
C: for Automotive
Packaging Specification
E2: Embossed tape and reel
Marking Diagram
VQFN24FV4040 (TOP VIEW)
Part Number Marking
9 P 2 0 8
LOT Number
Pin 1 Mark
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© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0T8T0AL01620-1-2
15.Jul.2022 Rev.002
48/50
BD9P208MUF-C
Physical Dimension and Packing Information
Package Name
VQFN24FV4040
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© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0T8T0AL01620-1-2
15.Jul.2022 Rev.002
49/50
BD9P208MUF-C
Revision History
Date
Revision
001
Changes
14.Jun.2021
New Release
Selection of Components Externally Connected
Change description of selection of the inductor L1 value
Change description of selection of Output Capacitor COUT
Change description of selection of Output Voltage Setting Resistor RFB1, RFB2
Application Examples
15.Jul.2022
002
Change 6.0 V output settings to 5.0 V and 3.3 V output settings.
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© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0T8T0AL01620-1-2
50/50
15.Jul.2022 Rev.002
Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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