BD9S400MUF-C [ROHM]
BD9S400MUF-C是内置低导通电阻的功率MOSFET的同步整流降压型DC/DC转换器。最大可输出4A的电流。凭借SLLM™控制，实现轻负载状态的良好效率特性，适用于降低设备的待机功耗。具有2.2MHz高速开关频率，适用于小型电感。具有基于电流模式控制的高速瞬态响应性能，可轻松设定相位补偿。还可与外部脉冲同步。8-channel power tree Reference DesignFor automotive ADAS and Info-Display;
| 型号： | BD9S400MUF-C |
| 厂家： | 
ROHM |
| 描述： | BD9S400MUF-C是内置低导通电阻的功率MOSFET的同步整流降压型DC/DC转换器。最大可输出4A的电流。凭借SLLM™控制，实现轻负载状态的良好效率特性，适用于降低设备的待机功耗。具有2.2MHz高速开关频率，适用于小型电感。具有基于电流模式控制的高速瞬态响应性能，可轻松设定相位补偿。还可与外部脉冲同步。8-channel power tree Reference DesignFor automotive ADAS and Info-Display 开关 脉冲 转换器 |
| 文件： | 总45页 (文件大小：3428K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
2.7V to 5.5V Input, 4A Integrated MOSFET
Single Synchronous Buck DC/DC Converter
For Automotive
BD9S400MUF-C
General Description
Key Specifications
BD9S400MUF-C is
a
synchronous buck DC/DC
Input Voltage:
Output Voltage Setting:
Output Current:
Switching Frequency:
High Side MOSFET ON Resistance: 35mΩ (Typ)
Low Side MOSFET ON Resistance: 35mΩ (Typ)
2.7V to 5.5V
0.8V to VPVIN x 0.8V
4A(Max)
Converter with built-in low On Resistance power
MOSFETs. It is capable of providing current up to 4A.
The SLLMTM control provides excellent efficiency
characteristics in light-load conditions which make the
product ideal for reducing standby power consumption of
equipment. Small inductor is applicable due to high
switching frequency of 2.2MHz. It is a current mode
control DC/DC Converter and features high-speed
transient response. Phase compensation can also be set
easily.
2.2MHz(Typ)
Shutdown Circuit Current:
Operating Temperature:
0μA (Typ)
-40°C to +125°C
Package
W(Typ) x D(Typ) x H(Max)
3.00mm x 3.00mm x 1.00mm
VQFN16FV3030
It can also be synchronized to external pulse.
Features
SLLMTM (Simple Light Load Mode) Control
AEC-Q100 Qualified(Note 1)
Single Synchronous Buck DC/DC Converter
Adjustable Soft Start Function
Power Good Output
Enlarged View
Input Under Voltage Lockout Protection
Short Circuit Protection
Output Over Voltage Protection
Over Current Protection
VQFN16FV3030
Wettable Flank Package
Thermal Shutdown Protection
Wettable Flank QFN Package
(Note 1) Grade 1
Applications
Automotive Equipment
(Cluster Panel, Infotainment Systems)
Other Electronic Equipment
Typical Application Circuit
VIN
PVIN
PGD
AVIN
BOOT
VMODE/SYNC
VEN
C1
L1
CIN1
CIN2
MODE/SYNC
VOUT
EN
SS
ITH
SW
FB
COUT
R1
R2
PGND
AGND
R3
C2
C3
Figure 1. Application Circuit
SLLMTM is a trademark of ROHM Co., Ltd.
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
.
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Pin Configuration
16
15
14
13
PVIN
PVIN
1
2
3
4
12 SW
11 SW
10 SW
EXP-PAD
PGND
PGND
9
SS
5
6
7
8
(TOP VIEW)
Figure 2. Pin Configuration
Pin Descriptions
Pin No.
Pin Name
Function
Power supply pins for the DC/DC Converter.
Connecting a 10µF ceramic capacitor is recommended.
1, 2
PVIN
3, 4
5
PGND
AGND
Ground pins for the DC/DC Converter.
Ground pin.
VOUT voltage feedback pin. An inverting input node for the gm error amplifier. Connect output
voltage divider to this pin to set the output voltage. See page 17 on how to compute for the
resistor values.
An output pin of the gm error amplifier and the input of PWM comparator.
Connect phase compensation components to this pin. See page 20 on calculate the
resistance and capacitance of phase compensation.
6
7
FB
ITH
Pin for selecting the SLLMTM control mode and the Forced PWM mode. Turning this pin
signal Low forces the device to operate in the Forced PWM mode. Turning this pin signal
High enables the SLLMTM control and the mode is automatically switched between the
SLLMTM control and PWM mode according to the load current. In addition, external
synchronization operation is started by inputting synchronous pulse signal to this pin.
MODE
/SYNC
8
Pin for setting the soft start time. The rise time of the output voltage can be specified by
connecting a capacitor to this pin. See page 19 on calculate the capacitance.
9
10, 11, 12
13
SS
SW
Switch pin. These pins are connected to the source of the High Side MOSFET and drain of
the Low Side MOSFET. Connect a bootstrap capacitor of 0.1µF between these pins and the
BOOT pin.
Connect a bootstrap capacitor of 0.1µF between this pin and the SW pins.
The voltage of this capacitor is the gate drive voltage of the High Side MOSFET.
BOOT
PGD
Power Good pin, an open drain output. Use of pull up resistor is needed. See page 12 on
setting the resistance.
14
Pin for controlling the device. Turning this pin signal Low forces the device to enter the
shutdown mode. Turning this pin signal High enables the device.
15
EN
Power supply input pin of the analog circuitry. Connect this pin to PVIN. Connecting a 0.1µF
ceramic capacitor is recommended.
16
AVIN
A backside heat dissipation pad. Connecting to the internal PCB ground plane by using via
provides excellent heat dissipation characteristics.
-
EXP-PAD
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Block Diagram
VIN
VIN
AVIN
PVIN
16
1
2
Slope
EN
15
6
PWM
Comparator
VREF
Error
Amplifier
BOOT
SW
13
Q
R
FB
SS
REF_OCP
S
Driver
Logic
OSC
Soft
Start
10
11
12
3
VOUT
9
PVIN
AVIN
UVLO
SCP
OVP
TSD
PGND
ITH
7
4
Power
Good
AGND
5
14
8
PGD
MODE/
SYNC
Figure 3. Block Diagram
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Description of Blocks
1. VREF
The VREF block generates the internal reference voltage.
2. UVLO (Under Voltage Lockout)
The UVLO block is for under voltage lockout protection. It will shutdown the device when the VIN falls to 2.45V(Typ) or
lower. The threshold voltage has a hysteresis of 100mV(Typ).
3. SCP (Short Circuit Protection)
This is the short circuit protection circuit. After soft start is judged to be completed, if the FB pin voltage falls to 0.56V(Typ)
or less and remain in that state for 1ms(Typ), output MOSFET will turn OFF for 14ms(Typ) and then restart the operation.
4. OVP (Over Voltage Protection)
This is the output over voltage protection circuit. When the FB pin voltage becomes 0.880V(Typ) or more, it turns the
output MOSFET OFF. After output voltage falls 0.856V(Typ) or less, the output MOSFET returns to normal operation.
5. TSD (Thermal Shutdown)
This is the thermal shutdown circuit. It will shutdown the device when the junction temperature (Tj) reaches to 175°C(Typ)
or more. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation with
hysteresis of 25°C(Typ).
6. OCP (Over Current Protection)
The Over Current Protection function operates by limiting the current that flows through High Side MOSFET at each cycle
of the switching frequency.
7. Soft Start
The Soft Start circuit slows down the rise of output voltage during startup, which allows the prevention of output voltage
overshoot. The soft start time of the output voltage can be specified by connecting a capacitor to the SS pin. See page 19
on calculate the capacitance. A built-in soft start function is provided and a soft start is initiated in 1ms(Typ) when the SS
pin is open.
8. Error Amplifier
The Error Amplifier block is an error amplifier and its inputs are the reference voltage 0.8V(Typ) and the FB pin voltage.
Phase compensation can be set by connecting a resistor and a capacitor to the ITH pin. See page 20 on calculate the
resistance and capacitance of phase compensation.
9. PWM Comparator
The PWM Comparator block compares the output voltage of the Error Amplifier and the Slope signal to determine the
switching duty.
10.OSC (Oscillator)
This block generates the oscillating frequency.
11.Driver Logic
This block controls switching operation and various protection functions.
12.Power Good
When the FB pin voltage reaches 0.8V(Typ) within ±7%, the built-in Nch MOSFET turns OFF and the PGD output turns
high. In addition, the PGD output turns low when the FB pin voltage reaches outside ±10% of 0.8V(Typ).
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BD9S400MUF-C
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
Input Voltage
VPVIN, VAVIN
VEN
VMODE/SYNC
VPGD
-0.3 to +7
-0.3 to VAVIN
-0.3 to VAVIN
-0.3 to +7
-0.3 to +14
-0.3 to +7
-0.3 to VAVIN
150
V
V
EN Voltage
MODE / SYNC Voltage
PGD Voltage
V
V
BOOT Voltage
VBOOT
V
Voltage from SW to BOOT
FB ITH SS Voltage
Maximum Junction Temperature
Storage Temperature Range
ΔVBOOT
VFB, VITH, VSS
Tjmax
V
V
°C
°C
Tstg
-55 to +150
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 1)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 3)
2s2p(Note 4)
VQFN16FV3030
Junction to Ambient
Junction to Top Characterization Parameter(Note 2)
θJA
189.0
23
57.5
10
°C/W
°C/W
ΨJT
(Note 1) Based on JESD51-2A(Still-Air)
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
70μm
Footprints and Traces
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Material
Thermal Via(Note 5)
Board Size
114.3mm x 76.2mm x 1.6mmt
2 Internal Layers
Measurement Board
Pitch
Diameter
4 Layers
FR-4
1.20mm
Φ0.30mm
Top
Bottom
Copper Pattern
Thickness
70μm
Copper Pattern
Thickness
35μm
Copper Pattern
Thickness
70μm
Footprints and Traces
74.2mm x 74.2mm
74.2mm x 74.2mm
(Note 5) This thermal via connects with the copper pattern of all layers.
Recommended Operating Conditions
Parameter
Symbol
Min
Max
Unit
Input Voltage
VPVIN, VAVIN
Topr
2.7
5.5
V
°C
A
-40
+125
Operating Temperature
Output Current
IOUT
-
4
VPVIN x 0.8
95
Output Voltage Setting
SW Minimum ON Time
External Clock Frequency
Synchronous Operation Input Duty
VOUT
0.8(Note 1)
V
tON_MIN
fSYNC
-
ns
MHz
%
1.8
25
2.4
DSYNC
75
(Note 1) Although the output voltage is configurable at 0.8V and higher, it may be limited by the SW min ON pulse width. For the configurable range,
please refer to the Output Voltage Setting in Selection of Components Externally Connected.
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Electrical Characteristics (Unless otherwise specified Ta=-40°C to +125°C, AVIN=PVIN=5V, EN=5V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
AVIN
Shutdown Circuit Current
Circuit Current
ISDN
ICC
-
0
10
µA
µA
VEN=0V, Ta=25°C
IOUT=0mA
Non-switching, Ta=25°C
400
650
900
UVLO Detection Voltage
UVLO Release Voltage
UVLO Hysteresis Voltage
ENABLE
VUVLO1
VUVLO2
2.30
2.40
50
2.45
2.55
100
2.60
2.70
125
V
V
VAVIN Falling
VAVIN Rising
Ta=25°C
VUVLO-HYS
mV
EN Threshold Voltage High
EN Threshold Voltage Low
EN Input Current
VENH
VENL
IEN
2.0
GND
2
-
-
VIN
0.8
8
V
V
5
µA
VEN=5V, Ta=25°C
MODE/SYNC
MODE/SYNC Threshold Voltage High VMODESYNCH
MODE/SYNC Threshold Voltage Low VMODESYNCL
2.0
-
VIN
V
GND
4
-
0.8
16
V
MODE/SYNC Input Current
IMODESYNC
10
µA
VMODESYNC=5V, Ta=25°C
Reference Voltage, Error Amplifier
FB Pin Voltage
VFB
IFB
0.788
-
0.8
0
0.812
0.2
V
FB Input Current
µA
µA
µA
VFB=0.8V, Ta=25°C
VFB=0.9V, Ta=25°C
VFB=0.7V, Ta=25°C
ITH Sink Current
IITHSI
IITHSO
12
19
-19
25
ITH Source Current
-25
-12
VAVIN=5V,
The SS Pin OPEN
0.5
1.0
2.0
ms
Soft Start Time
tSS
ISS
fSW
VAVIN=3.3V,
The SS Pin OPEN
0.6
1.2
2.4
ms
µA
SS Charge Current
Switching Frequency
Switching Frequency
Power Good
-2.34
-1.8
-1.26
2.0
2.2
2.4
MHz
VFB
x 0.87
VFB
x 0.90
VFB
x 1.07
VFB
x 1.04
VFB
x 0.90
VFB
x 0.93
VFB
x 1.10
VFB
x 1.07
VFB
x 0.93
VFB
x 0.96
VFB
x 1.13
VFB
x 1.10
PGD Falling (Fault) Voltage
PGD Rising (Good) Voltage
PGD Rising (Fault) Voltage
PGD Falling (Good) Voltage
VPGDTH_FF
VPGDTH_RG
VPGDTH_RF
VPGDTH_FG
V
V
V
V
VFB Falling
VFB Rising
VFB Rising
VFB Falling
PGD Output Leakage Current
PGD FET ON Resistance
PGD Output Low Level Voltage
Switch MOSFET
ILEAKPGD
RPGD
-
0
2
µA
Ω
VPGD=5V, Ta=25°C
10
30
60
VPGDL
0.01
0.03
0.06
V
IPGD=1mA
10
15
10
15
35
38
35
38
60
65
60
65
mΩ
mΩ
mΩ
mΩ
VPVIN=5V
High Side FET ON Resistance
Low Side FET ON Resistance
RONH
VPVIN=3.3V
VPVIN=5V
RONL
VPVIN=3.3V
VPVIN=5.5V, VSW=0V
Ta=25˚C
VPVIN=5.5V, VSW=5.5V
Ta=25˚C
High Side FET Leakage Current
Low Side FET Leakage Current
ILEAKSWH
ILEAKSWL
IOCP
-
-
0
0
5
5
µA
µA
A
SW Current of Over Current
Protection(Note1)
4.6
6.4
8.2
SCP, OVP
Short Circuit Protection Detection
Voltage
Output Over Voltage Protection
Detection Voltage
VSCP
VOVP
0.45
0.56
0.67
V
V
0.856
0.880
0.904
(Note 1) This is design value. Not production tested.
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BD9S400MUF-C
Typical Performance Curves
10
9
8
7
6
5
4
3
2
1
0
900
850
800
750
700
650
600
550
500
450
400
VIN = 5.0V
VIN = 5.0V
VIN = 3.3V
VIN = 3.3V
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Temperature[°C]
Temperature[°C]
Figure 4. Shutdown Circuit Current vs Temperature
Figure 5. Circuit Current vs Temperature
2.40
0.812
0.808
0.804
0.800
0.796
0.792
0.788
2.35
2.30
2.25
2.20
2.15
2.10
2.05
2.00
VIN = 5.0V
VIN = 5.0V
VIN = 3.3V
VIN = 3.3V
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Temperature[°C]
Temperature[°C]
Figure 6. Switching Frequency vs Temperature
Figure 7. FB Pin Voltage vs Temperature
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Typical Performance Curves – continued
30
28
-10
-12
-14
-16
-18
-20
-22
-24
-26
-28
-30
26
VIN = 2.7V
VIN = 5.0V
24
22
20
18
VIN = 5.0V
VIN = 2.7V
16
14
12
10
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Temperature[°C]
Temperature[°C]
Figure 8. ITH Sink Current vs Temperature
Figure 9. ITH Source Current vs Temperature
20
2.0
VIN = 5.0V
18
16
14
12
10
8
VMODESYNCH
1.8
1.6
1.4
1.2
1.0
0.8
VMODE/SYNC = 5.0V
VMODESYNCL
6
4
VMODE/SYNC = 3.3V
2
0
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Temperature[°C]
Temperature[°C]
Figure 10. MODE/SYNC Threshold Voltage vs Temperature
Figure 11. MODE/SYNC Input Current vs Temperature
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Typical Performance Curves – continued
-1.26
-1.44
-1.62
-1.80
-1.98
-2.16
-2.34
2.0
CSS = OPEN
1.5
1.0
0.5
0.0
VIN = 3.3V
VIN = 3.3V
VIN = 5.0V
VIN = 5.0V
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Temperature[°C]
Temperature[°C]
Figure 12. Soft Start Time vs Temperature
Figure 13. SS Charge Current vs Temperature
65
60
55
50
45
40
35
30
25
20
15
10
65
60
55
50
45
40
35
30
25
20
15
10
VIN = 3.3V
VIN = 3.3V
VIN = 5.0V
VIN = 5.0V
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Temperature[°C]
Temperature[°C]
Figure 14. High Side FET ON Resistance vs Temperature
Figure 15. Low Side FET ON Resistance vs Temperature
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Typical Performance Curves – continued
0.90
60
55
50
45
40
35
30
25
20
15
10
VIN = 5.0V
VIN = 5.0V
0.88
0.86
0.84
Rising Fault
Falling Good
Falling Fault
0.82
0.80
0.78
0.76
0.74
0.72
0.70
Rising Good
-50 -25
0
25
50
75 100 125
-50
-25
0
25
50
75
100 125
Temperature[°C]
Temperature[°C]
Figure 16. PGD Threshold Voltage vs Temperature
Figure 17. PGD FET ON Resistance vs Temperature
2.0
2.70
2.65
VIN = 5.0V
1.8
1.6
1.4
1.2
1.0
0.8
VUVLO2
VENH
2.60
2.55
2.50
2.45
2.40
VENL
VUVLO1
2.35
2.30
-50 -25
0
25
50
75
100 125
-50
-25
0
25
50
75
100 125
Temperature[°C]
Temperature[°C]
Figure 18. UVLO Voltage vs Temperature
Figure 19. EN Threshold Voltage vs Temperature
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BD9S400MUF-C
Typical Performance Curves – continued
10
9
7.6
7.2
6.8
6.4
6.0
5.6
5.2
8
7
VEN = 5.0V
6
5
4
3
2
VEN = 3.3V
1
0
-50 -25
0
25
50
75
100 125
-50 -25
0
25
50
75 100 125
Temperature[°C]
Temperature[°C]
Figure 20. EN Input Current vs Temperature
Figure 21 SW Current of Over Current Protection
vs Temperature
0.670
0.615
0.560
0.505
0.450
0.904
0.896
0.888
0.88
Release
Detection
0.872
0.864
0.856
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Temperature[℃]
Temperature[℃]
Figure 22. Short Circuit Protection Detection Voltage
vs Temperature
Figure 23. Output Over Voltage Protection Detection Voltage
vs Temperature
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BD9S400MUF-C
Function Explanations
1.
Enable Control
The device shutdown can be controlled by the voltage applied to the EN pin. When VEN becomes 2.0V or more, the
internal circuit is activated and the device starts up with soft start. When VEN becomes 0.8V or less, the device will be
shutdown.
VIN
0
t
t
t
VEN
VENH
VENL
0
VOUT
VOUT×0.93(Typ)
0
tSS
t_wait
200µs(Typ)
Figure 24. Enable ON/OFF Timing Chart
2.
Power Good Function
When the FB pin voltage reaches 0.8V(Typ) within ±7%, the PGD pin open drain MOSFET turns OFF and the output
turns high. In addition, when the FB pin voltage reaches outside ±10% of 0.8V(Typ), the PGD pin open drain MOSFET
turns ON and the PGD pin is pulled down with impedance of 30Ω(Typ). It is recommended to use a pull-up resistor of
about 10kΩ to 100kΩ for the power source.
+10%(Typ)
+7%(Typ)
VOUT
-7%(Typ)
-10%(Typ)
PGD
Figure 25. Power Good Timing Chart
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Function Explanations – continued
3.
External Synchronization Function
By inputting synchronous pulse signal to the MODE/SYNC pin, the switching frequency can be synchronized to
external synchronous pulse signal. When pulse signal is applied at a frequency of 1.8MHz or higher, the external
synchronization operation is started after the falls of the synchronous pulse are detected 7 times.
Input the signal with the synchronization frequency range between 1.8MHz and 2.4MHz and the duty range between
25% and 75%.
Please note that the output voltage fluctuates by about 2% for a moment when switching between the synchronized
operation to external signal and internal CLK frequency.
MODE/SYNC
1
2
3
4
5
6
7
SW
Internal CLK operation
Synchronizing operation
Figure 26. External Synchronization Function Timing Chart
When using the external synchronization function, connect a capacitor of 10pF in parallel to the phase compensation
components (resistor and capacitor) connected to the ITH pin, as a countermeasure against the interference to the
ITH pin of the Error Amplifier output.
7
8
ITH
MODE/
SYNC
RITH
CITH
10pF
Figure 27. Recommended Circuit When Using External Synchronization Function
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Function Explanations – continued
4.
SLLMTM Control and Forced PWM Control
SLLM TM(Simple Light Load Mode) is a technology that enables the OFF control of switching pulses while operating
with Pulse Width Modulation(PWM) control loop under light load condition. Therefore, it allows the linear operation
without excessive voltage drop or deterioration in transient response during the switching from light load to heavy load
or vice versa.
By utilizing this technology, BD9S400MUF-C operates in PWM mode switching under heavy load condition and
automatically switches to SLLMTM control under light load condition in order to improve the efficiency. By keeping the
MODE/SYNC pin voltage level 0.8V or less, it forces the device to operate with Forced PWM mode. And, by applying
2.0V or more to MODE/SYNC pin, it allows the device to operate with SLLMTM control. As for the Forced PWM mode, it
has lower efficiency compared to SLLMTM control under light load condition. However, since the device operates with a
constant switching frequency under varying load conditions, the countermeasure against noise is relatively easier.
Please note that SLLMTM does not operate adequately when the switching Duty is 50% or more.
① SLLMTM Control
② Forced PWM Control
Output Current IOUT [A]
Figure 28. Efficiency (SLLMTM Control and Forced PWM Control)
①
SLLMTM Control
②
Forced PWM Control
VOUT =50mV/div
VOUT =50mV/div
Time=2µs/div
Time=2µs/div
SW=2V/div
SW=2V/div
Figure 29. SW Waveform (SLLMTM Control)
(VIN=5.0V, VOUT=1.8V, IOUT=50mA)
Figure 30. SW Waveform (Forced PWM Control)
(VIN=5.0V, VOUT=1.8V, IOUT=1A)
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BD9S400MUF-C
Protection
1.
Short Circuit Protection (SCP)
The Short Circuit Protection block compares the FB pin voltage with the internal reference voltage VREF. When the
FB pin voltage has fallen to 0.56V(Typ) or less and remained there for 1ms(Typ), SCP stops the operation for
14ms(Typ) and subsequently initiates a restart. This protection circuit is effective in preventing damage due to sudden
and unexpected incidents. However, the device should not be used in applications characterized by continuous
operation of the protection circuit (e.g. when a load that significantly exceeds the output current capability of the chip is
connected).
Short Circuit
Protection
Short Circuit
Protection Operation
The EN Pin
The FB Pin
≤0.56V(Typ)
≥0.60V(Typ)
-
ON
OFF
OFF
2.0V or higher
0.8V or lower
Enabled
Disabled
Soft Start
VOUT
SCP Delay Time
1ms (Typ)
SCP Delay Time
1ms (Typ)
0.8V
VSCP : 0.56V(Typ)
FB
SCP OFF
SW
LOW
IOCP
Inductor Current
(Output Load
Current)
Internal
HICCUP
Delay Signal
14ms (Typ)
SCP Reset
Figure 31. Short Circuit Protection (SCP) Timing Chart
2.
Over Current Protection (OCP)
The Over Current Protection function operates by limiting the current that flows through High Side MOSFET at each
cycle of the switching frequency. This protection circuit is effective in preventing damage due to sudden and
unexpected incidents. However, the device should not be used in applications characterized by continuous operation
of the protection circuit (e.g. when a load that significantly exceeds the output current capability of the chip is
connected).
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Protection – continued
3.
Under Voltage Lockout Protection (UVLO)
It will shutdown the device when the AVIN pin falls to 2.45V(Typ) or lower.
The threshold voltage has a hysteresis of 100mV(Typ).
VIN
VUVLO-HYS
VUVLO2
VUVLO1
0V
t_wait
VOUT
SoftSstart
FB
SW
Normal operation
UVLO
Normal operation
Figure 32. UVLO Timing Chart
4.
5.
Thermal Shutdown
This is the thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within
the IC’s power dissipation rating. However, if the rating is exceeded for a continued period, the junction temperature
(Tj) will rise which will activate the TSD circuit[Tj ≥175°C (Typ)] that will turn OFF output MOSFET. When the Tj falls
below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit
operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the
TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage.
Over Voltage Protection (OVP)
The device incorporates an over voltage protection circuit to minimize the output voltage overshoot when recovering
from strong load transients or output fault conditions. If the FB pin voltage exceeds Output Over Voltage Protection
Detection Voltage at 0.880V(Typ), the MOSFET on the output stage is turned OFF to prevent the increase in the
output voltage. After the detection, the switching operation resumes if the output decreases and the over voltage state
is released. Output Over Voltage Protection Detection Voltage and release voltage have a hysteresis of 3%.
VOUT
VOVP : 0.880V(Typ)
hys
OVP Release
Threshold
FB
SW
Internal OVP
Signal
Figure 33. OVP Timing Chart
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BD9S400MUF-C
Selection of Components Externally Connected
Contact us if not use the recommended constant in the application circuit.
Necessary parameters in designing the power supply are as follows:
Table 1. Application Specification
Parameter
Input Voltage
Symbol
VIN
Example Value
5.0V
Output Voltage
VOUT
fSW
ΔIL
COUT
tSS
IOUTMAX
1.2V
2.2MHz(Typ)
0.4A
44μF
4.5ms(Typ)
4A
Switching Frequency
Inductor Ripple Current
Output Capacitor
Soft Start Time
Maximum Output Current
Application Example
R4
VIN
PVIN
PGD
PGD
AVIN
BOOT
MODE/SYNC
C1
CIN1
CIN2
Enable
EN
SS
ITH
SW
FB
VOUT
L1
R100
COUT1
COUT2
R1
R2
PGND
AGND
R3
C2
C3
Figure 34. Typical Application
1. Switching Frequency
The switching frequency fSW is fixed at 2.2MHz(Typ) inside the IC.
2. Selection of Output Voltage Setting
The output voltage value can be set by the feedback resistance ratio.
푅 +푅
1
2 × 0.8 [V]
푅
2
VOUT
푉푂푈푇
=
R1
R2
FB
SW Minimum ON Time that BD9S400MUF-C can output
stably in the entire load range is 95ns.
Use this value to calculate the input and output conditions
that satisfy the following equation
0.8V(Typ)
푉푂푈푇
[ ]
95 ns ≤
푉 × 푓
퐼푁
푂푆퐶
Figure 35. Feedback Resistor Circuit
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Selection of Components Externally Connected – continued
3. Selection of Input Capacitor
The input capacitor requires a large capacitor value for CIN1 and a small capacitor value for CIN2. Please use ceramic
type capacitor for these capacitors. CIN1 is used to suppress the ripple noise, and CIN2 is used to suppress the switching
noise. These ceramic capacitors are effective by being placed as close as possible to the PVIN pin and the AVIN pin.
Capacitor with value 4.7μF or more for CIN1, and 0.06μF or more for CIN2 are necessary. In addition, the voltage rating for
both capacitors has to be twice the typical input voltage. Set the capacitor value so that it does not fall to its minimum
required value against the capacitor value variances, temperature characteristics, DC bias characteristics, aging
characteristics, and etc. Please use components which are comparatively same with the components used in
“Application Example” on page 22. Moreover, factors like the PCB layout and the position of the capacitor may lead to IC
malfunction. Please refer to “Notes on the PCB layout Design” on page 34 and 35.
4. Selection of Output LC Filter
In order to supply a continuous current to the load, the DC/DC converter requires an LC filter for smoothing the output
voltage. When an inductor with a higher inductance value is selected, the ripple current flowing through the inductor ΔIL
and the ripple voltage generated in the output voltage are reduced. However, the load transient response characteristic
becomes slow. If an inductor with a lower inductance value is selected, its transient response characteristic is faster.
However, the ripple current flowing through the inductor becomes larger and the ripple voltage in the output voltage
becomes larger, causing a trade-off between the response characteristic and the ripple current and voltage. Here, the
inductance value is selected so that the ripple current component is in the range between 200mA and 1000mA.
VIN
IL
Inductor Saturation Current > IOUTMAX + ∆IL/2
L1
∆IL
VOUT
Driver
Maximum Output Current IOUTMAX
COUT
t
Figure 36. Waveform of Current Through Inductor
Figure 37. Output LC Filter Circuit
Inductor ripple current ΔIL can be represented by the following equation.
ꢁ
(
)
×
∆ꢀ퐿 = 푉푂푈푇 × 푉 − 푉푂푈푇
= 4ꢇ4 [mA]
퐼푁
ꢂ
ꢃꢄ
×ꢅ ×퐿
ꢆ푊
1
where
푉
퐼푁
is the 5.0V
푉푂푈푇 is the 1.2V
ꢈꢁ
푓
is the 1.0µH
is the 2.2MHz (Switching Frequency)
푆ꢉ
The rated current of the inductor must be larger than the sum of the maximum output current and 1/2 of the inductor
ripple current ΔIL. The output capacitor COUT affects the output ripple voltage characteristics. The output capacitor COUT
must satisfy the required ripple voltage characteristics.
The output ripple voltage can be represented by the following equation.
ꢁ
∆푉푅푃퐿 = ∆ꢀ퐿 × ꢊꢋ퐸푆푅 ꢌ ꢍ×퐶
ꢑ [V]
ꢆ푊
×ꢅ
ꢎꢏꢐ
Where
ꢋ퐸푆푅 is the Equivalent Series Resistance (ESR) of the output capacitor
The output ripple voltage ΔVRPL can be represented by the following equation.
ꢁ
∆푉푅푃퐿 = 0.4ꢇ4 × ꢊꢇ0 ꢌ ꢍ×ꢒꢒ×ꢓ.ꢓꢑ = 4.67 [mV]
where
ꢔ푂푈푇 is the 44µF
ꢋ퐸푆푅 is the 10mΩ
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BD9S400MUF-C
Selection of Components Externally Connected – continued
In addition, for the total value of capacitance in the output line COUT(Max), choose a capacitance value less than the
value obtained by the following equation:
[
]
(푡
ꢖꢓꢗꢗ µs )×(퐼
ꢖ퐼
)
(
)
ꢎꢘꢙ(ꢕ푖푛) ꢆ푊ꢆꢐ퐴ꢚꢐ
ꢆꢆ ꢕ푖푛
ꢔ푂푈푇(푀푎푥)
<
[F]
ꢂ
ꢎꢏꢐ
Where:
ꢀ푆ꢉ푆푇ꢛ푅푇 is the maximum output current during startup
ꢀ푂퐶푃(푀ꢜꢝ) is the minimum OCP operation SW current 4.6A
ꢞ푆푆(푀ꢜꢝ)
푉푂푈푇
is the minimum Soft Start Time
is the output voltage
Startup failure may happen if the limits from the above-mentioned are exceeded. Especially if the capacitance value is
extremely large, over current protection may be activated by the inrush current at startup and prevented to turn on the
output. Please confirm this on the actual application. Stable transient response and the loop is dependent to COUT
Please select after confirming the setting of the phase compensation circuit.
.
Also, in case of large changing input voltage and output current, select the capacitance accordingly by verifying that the
actual application setup meets the required specification.
5. Selection of Soft Start Capacitor
Turning the EN pin signal high activates the soft start function. This causes the output voltage to rise gradually while the
current at startup is placed under control. This allows the prevention of output voltage overshoot and inrush current. The
rise time tSS_EXT depends on the value of the capacitor connected to the SS pin. The capacitance value should be set to
0.22μF or less.
VEN
(
)
퐶 ×ꢂ
3
퐹퐵
VENH
VENL
ꢞ푆푆_퐸푋푇
=
[s]
퐼
ꢆꢆ
0
t
where
ꢞ푆푆_퐸푋푇 is the Soft Start Time
VOUT
ꢔꢟ
푉ꢠꢡ
is the Capacitor connected to the SS pin
is the FB pin Voltage 0.8V(Typ)
ꢀ푆푆
is the SS Charge Current 1.8µA(Typ)
0
t
tSS_EXT
With C3=0.01μF
t_wait
200µs(Typ)
(
)
ꢗ.ꢗꢁꢗ×ꢗ.ꢍ
ꢞ푆푆_
=
= 4.44 [ms]
Figure 38. Soft Start Timing chart
ꢢꢣꢐ
ꢁ.ꢍ
Turning the EN pin High without connecting capacitor to the SS pin and keeping the SS pin either OPEN condition or
about 10kΩ to 100kΩ pull up condition to power source, the output will rise in 1ms(Typ).
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BD9S400MUF-C
Selection of Components Externally Connected – continued
6. Selection of Phase Compensation Components
A current mode control buck DC/DC converter is two-pole, one-zero system. Two poles are formed by an error amplifier
and load, and the one zero point is added by phase compensation. The phase compensation resistor R3 determines the
crossover frequency fCRS that the total loop gain of the DC/DC converter is 0dB.The crossover frequency should be set
20kHz to 100kHz. A high value fCRS provides a good load transient response characteristic but instability. Conversely, a
low value fCRS greatly stabilizes the characteristics but the load transient response characteristic is impaired.
(1) Selection of Phase Compensation Resistor R3
The Phase Compensation Resistance R3 can be determined by using the following equation.
ꢓ휋×ꢂ
×ꢅ
×퐶
ꢘꢚꢆ ꢎꢏꢐ
ꢎꢏꢐ
ꢋꢟ =
[Ω]
ꢂ
퐹퐵
×퐺 ×퐺
ꢕꢙ ꢕ퐴
where
푉푂푈푇
is the Output Voltage
푓
ꢔ푂푈푇
푉ꢠꢡ
ꢤ푀푃
ꢤ푀ꢛ
is the Crossover Frequency
퐶푅푆
is the Output Capacitance
is the Feedback Reference Voltage 0.8V(Typ)
is the Current Sense Gain 14.3A/V(Typ)
is the Error Amplifier Trans conductance 260µA/V(Typ)
(2) Selection of Phase Compensation Capacitance C2
For stable operations of DC/DC converter, the zero point (phase lead) to cancel the phase lag formed by loads is
determined with C2.
C2 can be calculated with the following equation.
ꢁ
ꢔꢓ =
[F]
1
ꢓ휋×ꢅ
×
×ꢂ
ꢘꢚꢆ
ꢎꢏꢐ
ꢥ.ꢥꢥ3
(3) Loop Stability
Actually, characteristics will vary depending on PCB layout, arrangement of wiring, kinds of parts used and use
conditions (temperature, etc.). Be sure to check stability and responsiveness with actual apparatus. Phase margin of at
least 45° in the worst conditions is recommended. Gain Phase Analyzer or Frequency Response Analyzer FRA is used
to check frequency characteristics with actual apparatus. Contact the measurement apparatus manufacturer for
measurement method. When these measurement apparatuses are not available, there is a method of assuming Phase
margin by load response. Monitor variation of output when the apparatus shifts from no load state to maximum load. And
it can be said that responsiveness is low if variation amount is large, and phase margin is small if ringing occurs
frequently (twice or more as a guide) after variation.
However, confirmation of quantitative phase margin is not possible.
Maximum load
Load
IOUT
Inadequate phase margin
Adequate phase margin
Output voltage
VOUT
0
t
Figure 39. Load Response
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Selection of Components Externally Connected – continued
7. Input Voltage Startup
VIN
VIN ×0.8 ≥ VOUT
VOUT
UVLO release
Figure 40. Input Voltage Startup Time
The soft start function starts up the device according to the specified soft start time. After UVLO is released, the voltage
range that can be outputted during the soft start operation is 80% or less of the input voltage. Note that the input voltage
during the startup with soft start should satisfy the following expression
ꢂ
ꢎꢏꢐ
푉 ≥
퐼푁
[V]
ꢗ.ꢍ
8. Bootstrap Capacitor
Bootstrap capacitor C1 shall be 0.1μF. Connect a bootstrap capacitor between the SW pin and the BOOT pin.
For capacitance of bootstrap capacitor, take temperature characteristics, DC bias characteristics and etc. into
consideration to set minimum value to no less than 0.047μF.
Recommended Parts Manufacturer List
Shown below is the list of the recommended parts manufacturers for reference.
Table 2.
Device
Type
Ceramic capacitors
Ceramic capacitors
Inductors
Manufacturer
Murata
TDK
URL
www.murata.com
product.tdk.com
www.coilcraft.com
www.cyntec.com
www.murata.com
www.sumida.com
www.product.tdk.com
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C
C
L
Coilcraft
Cyntec
Murata
Sumida
TDK
L
Inductors
L
Inductors
L
Inductors
L
Inductors
R
Resisters
ROHM
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BD9S400MUF-C
Application Example 1
Table 3. Specification Example 1
Parameter
Product Name
Symbol
IC
VIN
Example Value
BD9S400MUF-C
3.3V
Supply Voltage
Output Voltage
Soft Start Time
Maximum Output Current
Operation Temperature Range
VOUT
tSS
IOUTMAX
Topr
1.0V
1.0ms(Typ)
4.0A
-40°C to +125°C
R4
VIN
PVIN
PGD
PGD
AVIN
BOOT
MODE/SYNC
C1
CIN1
CIN2
Enable
EN
SS
ITH
SW
VOUT
L1
R100
COUT1
COUT2
R1
C4
PGND
AGND
R3
C2
FB
R2
C3
Figure 41. Reference Circuit 1
Table 4. Parts List 1
No
Package
Parameters
Part Name(Series)
Type
Manufacturer
L1
COUT1
COUT2
CIN1
CIN2
R100
R1
1.0μH
CLF6045NIT-1R0N-D
GCM31CR70J226K
GCM31CR70J226K
GCM21BR71A106K
GCM155R71C104K
-
Inductor
Ceramic Capacitor
Ceramic Capacitor
Ceramic Capacitor
Ceramic Capacitor
-
TDK
Murata
Murata
Murata
Murata
-
3216
3216
2012
1005
-
22μF, X7R, 6.3V
22μF, X7R, 6.3V
10μF, X7R, 10V
0.1μF, X7R, 16V
SHORT
1005
1005
1005
1005
1005
1005
-
7.5kΩ, 1%, 1/16W
30kΩ, 1%, 1/16W
8.2kΩ, 1%, 1/16W
100kΩ, 1%, 1/16W
0.1μF, X7R, 16V
4700pF, X7R, 50V
-
MCR01MZPF7501
MCR01MZPF3002
MCR01MZPF8201
MCR01MZPF1003
GCM155R71C104K
GCM155R71H472K
-
Chip Resistor
Chip Resistor
Chip Resistor
Chip Resistor
Ceramic Capacitor
Ceramic Capacitor
-
ROHM
ROHM
ROHM
ROHM
Murata
Murata
-
R2
R3
R4
C1
C2
C3
C4
-
-
-
-
-
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BD9S400MUF-C
Characteristic Data (Application Examples 1)
100
90
80
70
60
50
40
30
20
10
0
80
60
180
135
90
40
20
45
0
0
-20
-40
-60
-80
-45
-90
-135
-180
Gain
Phase
0.0
1.0
2.0
3.0
4.0
0.1
1
10
Frequency[kHz]
100
1000
Output Current [A]
Figure 42. Efficiency vs Output Current
Figure 43. Frequency Characteristics
(IOUT=2A)
Time: 500ns/div
VOUT: 20mV/div
Time: 100μs/div
VOUT: 100mV/div
IOUT: 500mA/div
IOUT: 1A/div
Figure 44. Load Transient Response
Figure 45. Output Ripple Voltage
(IOUT=2A)
(IOUT=0A↔2A)
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BD9S400MUF-C
Application Example 2
Table 5. Specification Example 2
Parameter
Product Name
Symbol
IC
VIN
Example Value
BD9S400MUF-C
3.3V
Supply Voltage
Output Voltage
Soft Start Time
Maximum Output Current
Operation Temperature Range
Output Capacitor
VOUT
tSS
IOUTMAX
Topr
COUT
1.0V
1.0ms(Typ)
4.0A
-40°C to +125°C
88μF
R4
VIN
PVIN
AVIN
PGD
PGD
BOOT
MODE/SYNC
C1
CIN1
CIN2
Enable
VOUT
EN
SS
ITH
SW
L1
R100
R1
COUT1
COUT4
COUT2 COUT3
C4
PGND
AGND
R3
C2
FB
R2
C3
Figure 46. Reference Circuit 2
Table 6. Parts List 2
No
L1
Package
Parameters
0.47μH
Part Name(Series)
XEL4030-471ME
GCM31CR70J226K
GCM31CR70J226K
GCM31CR70J226K
GCM31CR70J226K
GCM21BR71A106K
GCM155R71C104K
-
Type
Manufacturer
Coilcraft
Murata
Murata
Murata
Murata
Murata
Murata
-
Inductor
COUT1
COUT2
COUT3
COUT4
CIN1
CIN2
R100
R1
3216
3216
3216
3216
2012
1005
-
22μF, X7R, 6.3V
22μF, X7R, 6.3V
22μF, X7R, 6.3V
22μF, X7R, 6.3V
10μF, X7R, 10V
0.1μF, X7R, 16V
SHORT
Ceramic Capacitor
Ceramic Capacitor
Ceramic Capacitor
Ceramic Capacitor
Ceramic Capacitor
Ceramic Capacitor
-
1005
1005
1005
1005
1005
1005
-
7.5kΩ, 1%, 1/16W
30kΩ, 1%, 1/16W
30kΩ, 1%, 1/16W
100kΩ, 1%, 1/16W
0.1μF, X7R, 16V
1000pF, X7R, 50V
-
MCR01MZPF7501
MCR01MZPF3002
MCR01MZPF3002
MCR01MZPF1003
GCM155R71C104K
GCM155R71H102K
-
Chip Resistor
Chip Resistor
Chip Resistor
Chip Resistor
Ceramic Capacitor
Ceramic Capacitor
-
ROHM
ROHM
ROHM
ROHM
Murata
Murata
-
R2
R3
R4
C1
C2
C3
C4
-
-
-
-
-
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BD9S400MUF-C
Characteristic Data (Application Examples 2)
80
60
180
135
90
100
90
80
70
60
50
40
30
20
10
0
40
20
45
0
0
-20
-40
-60
-80
-45
-90
-135
-180
Gain
Phase
0.0
1.0
2.0
3.0
4.0
0.1
1
10
Frequency[kHz]
100
1000
Output Current [A]
Figure 47. Efficiency vs Output Current
Figure 48. Frequency Characteristic
(IOUT=2A)
Time: 500ns/div
VOUT: 20mV/div
Time: 100μs/div
VOUT: 100mV/div
IOUT: 500mA/div
IOUT: 1A/div
Figure 49. Load Transient Response
(IOUT=0A↔2A)
Figure 50. Output Ripple Voltage
(IOUT=2A)
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BD9S400MUF-C
Application Example 3
Table 7. Specification Example 3
Parameter
Product Name
Symbol
IC
VIN
Example Value
BD9S400MUF-C
5.0V
Supply Voltage
Output Voltage
Soft Start Time
Maximum Output Current
Operation Temperature Range
VOUT
tSS
IOUTMAX
Topr
1.2V
1.0ms(Typ)
4.0A
-40°C to +125°C
R4
VIN
PVIN
AVIN
PGD
PGD
BOOT
MODE/SYNC
C1
CIN1
CIN2
Enable
EN
SS
ITH
SW
VOUT
L1
R100
COUT1
COUT2
R1
C4
PGND
AGND
R3
C2
FB
R2
C3
Figure 51. Reference Circuit 3
Table 8. Parts List 3
No
L1
Package
Parameters
Part Name(Series)
CLF6045NIT-1R0N-D
GCM31CR70J226K
GCM31CR70J226K
GCM21BR71A106K
GCM155R71C104K
-
Type
Manufacturer
TDK
1.0μH
Inductor
Ceramic Capacitor
Ceramic Capacitor
Ceramic Capacitor
Ceramic Capacitor
-
COUT1
COUT2
CIN1
CIN2
R100
R1
3216
3216
2012
1005
-
22μF, X7R, 6.3V
22μF, X7R, 6.3V
10μF, X7R, 10V
0.1μF, X7R, 16V
SHORT
Murata
Murata
Murata
Murata
-
1005
1005
1005
1005
1005
1005
-
10kΩ, 1%, 1/16W
20kΩ, 1%, 1/16W
8.2kΩ, 1%, 1/16W
100kΩ, 1%, 1/16W
0.1μF, X7R, 16V
4700pF, X7R, 50V
-
MCR01MZPF1002
MCR01MZPF2002
MCR01MZPF8201
MCR01MZPF1003
GCM155R71C104K
GCM155R71H472K
-
Chip Resistor
Chip Resistor
Chip Resistor
Chip Resistor
Ceramic Capacitor
Ceramic Capacitor
-
ROHM
ROHM
ROHM
ROHM
Murata
Murata
-
R2
R3
R4
C1
C2
C3
C4
-
-
-
-
-
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BD9S400MUF-C
Characteristic Data (Application Examples 3)
100
90
80
70
60
50
40
30
20
10
0
80
60
180
135
90
40
20
45
0
0
-20
-40
-60
-80
-45
-90
-135
-180
Gain
Phase
0.0
1.0
2.0
3.0
4.0
0.1
1.0
10.0
100.0
1000.0
Output Current [A]
Frequency[kHz]
Figure 52. Efficiency vs Output Current
Figure 53. Frequency Characteristics
(IOUT=2A)
Time: 500ns/div
VOUT: 20mV/div
Time: 100μs/div
VOUT: 100mV/div
IOUT: 500mA/div
IOUT: 1A/div
Figure 54. Load Transient Response
(IOUT=0A↔2A)
Figure 55. Output Ripple Voltage
(IOUT=2A)
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BD9S400MUF-C
Application Example 4
Table 9. Specification Example 4
Parameter
Product Name
Symbol
IC
VIN
Example Value
BD9S400MUF-C
5.0V
Supply Voltage
Output Voltage
Soft Start Time
Maximum Output Current
Operation Temperature Range
VOUT
tSS
IOUTMAX
Topr
1.5V
1.0ms(Typ)
4.0A
-40°C to +125°C
R4
VIN
PVIN
AVIN
PGD
PGD
BOOT
MODE/SYNC
C1
CIN1
CIN2
Enable
EN
SS
ITH
SW
VOUT
L1
R100
COUT1
COUT2
R1
C4
PGND
AGND
R3
C2
FB
R2
C3
Figure 56. Reference Circuit 4
Table 10. Parts List 4
No
L1
Package
Parameters
Part Name(Series)
CLF6045NIT-1R0N-D
GCM31CR70J226K
GCM31CR70J226K
GCM21BR71A106K
GCM155R71C104K
-
Type
Manufacturer
TDK
1.0μH
Inductor
Ceramic Capacitor
Ceramic Capacitor
Ceramic Capacitor
Ceramic Capacitor
-
COUT1
COUT2
CIN1
CIN2
R100
R1
3216
3216
2012
1005
-
22μF, X7R, 6.3V
22μF, X7R, 6.3V
10μF, X7R, 10V
0.1μF, X7R, 16V
SHORT
Murata
Murata
Murata
Murata
-
1005
1005
1005
1005
1005
1005
-
16kΩ, 1%, 1/16W
18kΩ, 1%, 1/16W
12kΩ, 1%, 1/16W
100kΩ, 1%, 1/16W
0.1μF, X7R, 16V
3300pF, X7R, 50V
-
MCR01MZPF1602
MCR01MZPF1802
MCR01MZPF1202
MCR01MZPF1003
GCM155R71C104K
GCM155R71H332K
-
Chip Resistor
Chip Resistor
Chip Resistor
Chip Resistor
Ceramic Capacitor
Ceramic Capacitor
-
ROHM
ROHM
ROHM
ROHM
Murata
Murata
-
R2
R3
R4
C1
C2
C3
C4
-
-
-
-
-
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BD9S400MUF-C
Characteristic Data (Application Examples 4)
80
60
180
135
90
100
90
80
70
60
50
40
30
20
10
0
40
20
45
0
0
-20
-40
-60
-80
-45
-90
-135
-180
Gain
Phase
0.0
1.0
2.0
3.0
4.0
0.1
1
10
Frequency[kHz]
100
1000
Figure 57. Efficiency vs Output Current
Figure 58. Frequency Characteristics
(IOUT =2A)
Time: 100μs/div
Time: 500ns/div
VOUT: 20mV/div
VOUT: 100mV/div
IOUT: 500mA/div
IOUT: 1A/div
Figure 59. Load Transient Response
(IOUT = 0A↔2A)
Figure 60. Output Ripple Voltage
(IOUT=2A)
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BD9S400MUF-C
Application Example 5
Table 11. Specification Example 5
Parameter
Product Name
Symbol
IC
VIN
Example Value
BD9S400MUF-C
5.0V
Supply Voltage
Output Voltage
Soft Start Time
Maximum Output Current
Operation Temperature Range
VOUT
tSS
IOUTMAX
Topr
1.8V
1.0ms(Typ)
4.0A
-40°C to +125°C
R4
VIN
PVIN
AVIN
PGD
PGD
BOOT
MODE/SYNC
C1
CIN1
CIN2
Enable
EN
SS
ITH
SW
VOUT
L1
R100
COUT1
COUT2
R1
R2
C4
PGND
AGND
R3
C2
FB
C3
Figure 61. Reference Circuit 5
Table 12. Parts List 5
No
L1
Package
Parameters
1.0μH
Part Name(Series)
CLF6045NIT-1R0N-D
GCM31CR70J226K
GCM31CR70J226K
GCM21BR71A106K
GCM155R71C104K
-
Type
Manufacturer
TDK
Inductor
Ceramic Capacitor
Ceramic Capacitor
Ceramic Capacitor
Ceramic Capacitor
-
COUT1
COUT2
CIN1
CIN2
R100
R1
3216
3216
2012
1005
-
22μF, X7R, 6.3V
22μF, X7R, 6.3V
10μF, X7R, 10V
0.1μF, X7R, 16V
SHORT
Murata
Murata
Murata
Murata
-
1005
1005
1005
1005
1005
1005
-
30kΩ, 1%, 1/16W
24kΩ, 1%, 1/16W
13kΩ, 1%, 1/16W
100kΩ, 1%, 1/16W
0.1μF, X7R, 16V
3300pF, X7R, 50V
-
MCR01MZPF3002
MCR01MZPF2402
MCR01MZPF1302
MCR01MZPF1003
GCM155R71C104K
GCM155R71H332K
-
Chip Resistor
Chip Resistor
Chip Resistor
Chip Resistor
Ceramic Capacitor
Ceramic Capacitor
-
ROHM
ROHM
ROHM
ROHM
Murata
Murata
-
R2
R3
R4
C1
C2
C3
C4
-
-
-
-
-
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BD9S400MUF-C
Characteristic Data (Application Examples 5)
100
90
80
70
60
50
40
30
20
10
0
80
60
180
135
90
40
20
45
0
0
-20
-40
-60
-80
-45
-90
-135
-180
Gain
Phase
0.0
1.0
2.0
3.0
4.0
0.1
1
10
Frequency[kHz]
100
1000
Output Current (A)
Figure 62. Efficiency vs Output Current
Figure 63. Frequency Characteristics
(IOUT=2A)
Time: 100μs/div
Time: 500ns/div
VOUT: 20mV/div
VOUT: 100mV/div
IOUT: 500mA/div
IOUT: 1A/div
Figure 64. Load Transient Response
(IOUT=0A↔2A)
Figure 65. Output Ripple Voltage
(IOUT=2A)
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BD9S400MUF-C
Application Example 6
Table 13. Specification Example 6
Parameter
Product Name
Symbol
IC
VIN
Example Value
BD9S400MUF-C
5.0V
Supply Voltage
Output Voltage
Soft Start Time
Maximum Output Current
Operation Temperature Range
VOUT
tSS
IOUTMAX
Topr
3.3V
1.0ms(Typ)
4.0A
-40°C to +125°C
R4
VIN
PVIN
AVIN
PGD
PGD
BOOT
MODE/SYNC
C1
CIN1
CIN2
Enable
EN
SS
ITH
SW
VOUT
L1
R100
COUT1
COUT2
R1
C4
PGND
AGND
R3
C2
FB
R2
C3
Figure 66. Reference Circuit 6
Table 14. Parts List 6
No
L1
Package
Parameters
1.0μH
Part Name(Series)
CLF6045NIT-1R0N-D
GCM31CR70J226K
GCM31CR70J226K
GCM21BR71A106K
GCM155R71C104K
-
Type
Manufacturer
TDK
Inductor
Ceramic Capacitor
Ceramic Capacitor
Ceramic Capacitor
Ceramic Capacitor
-
COUT1
COUT2
CIN1
CIN2
R100
R1
3216
3216
2012
1005
-
22μF, X7R, 6.3V
22μF, X7R, 6.3V
10μF, X7R, 10V
0.1μF, X7R, 16V
SHORT
Murata
Murata
Murata
Murata
-
1005
1005
1005
1005
1005
1005
-
75kΩ, 1%, 1/16W
24kΩ, 1%, 1/16W
20kΩ, 1%, 1/16W
100kΩ, 1%, 1/16W
0.1μF, X7R, 16V
2200pF, X7R, 50V
-
MCR01MZPF7502
MCR01MZPF2402
MCR01MZPF2002
MCR01MZPF1003
GCM155R71C104K
GCM155R71H222K
-
Chip Resistor
Chip Resistor
Chip Resistor
Chip Resistor
Ceramic Capacitor
Ceramic Capacitor
-
ROHM
ROHM
ROHM
ROHM
Murata
Murata
-
R2
R3
R4
C1
C2
C3
C4
-
-
-
-
-
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BD9S400MUF-C
Characteristic Data (Application Examples 6)
100
90
80
70
60
50
40
30
20
10
0
80
60
180
135
90
40
20
45
0
0
-20
-40
-60
-80
-45
-90
-135
-180
Gain
Phase
0.0
1.0
2.0
3.0
4.0
0.1
1
10
Frequency[kHz]
100
1000
Output Current [A]
Figure 67. Efficiency vs Output Current
Figure 68. Frequency Characteristics
(IOUT=2A)
Time: 100μs/div
Time: 500ns/div
VOUT: 20mV/div
VOUT: 100mV/div
IOUT: 500mA/div
IOUT: 1A/div
Figure 69. Load Transient Response
(IOUT=0A↔2A)
Figure 70. Output Ripple Voltage
(IOUT=2A)
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BD9S400MUF-C
PCB Layout Design
PCB layout design for DC/DC converter is as important as the circuit design. Appropriate layout can avoid various problems
concerning power supply circuit. Figure 71-a to 71-c show the current path in a buck DC/DC converter circuit. The Loop 1 in
Figure 71-a is a current path when H-side switch is ON and L-side switch is OFF, the Loop 2 in Figure 71-b is when H-side
switch is OFF and L-side switch is ON. The thick line in Figure 71-c shows the difference between Loop1 and Loop2. The
current in thick line change sharply each time the switching element H-side and L-side switch change from OFF to ON, and
vice versa. These sharp changes induce a waveform with harmonics in this loop. Therefore, the loop area of thick line that is
consisted by input capacitor and IC should be as small as possible to minimize noise. For more details, refer to application
note of switching regulator series “PCB Layout Techniques of Buck Converter”.
Loop1
VIN
VOUT
L
H-side Switch
CIN
COUT
L-side Switch
GND
GND
Figure 71-a. Current Path when H-side Switch = ON, L-side Switch = OFF
VIN
VOUT
L
H-side Switch
CIN
COUT
Loop2
L-side Switch
GND
GND
Figure 71-b. Current Path when H-side Switch = OFF, L-side Switch = ON
VIN
VOUT
L
CIN
COUT
H-side FET
L-side FET
GND
GND
Figure 71-c. Difference of Current and Critical Area in Layout
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PCB Layout Design – continued
When designing the PCB layout, please pay extra attention to the following points:
• Connect the input capacitor as close as possible to the PVIN pin on the same plane as the IC.
• Switching nodes such as SW are susceptible to noise due to AC coupling with other nodes. Route the inductor pattern as
thick and as short as possible.
• R1 and R2 shall be located as close as possible to the FB pin and the wiring between R1 and R2 to the FB pin shall be as
short as possible.
• Provide lines connected to FB and ITH far from the SW nodes.
• When using the external synchronization function, there is concern that the ITH node might be affected by noise.
Therefore, place the ITH node as far as possible from the external clock input node.
• Influence from the switching noise can be minimized, by isolating Power (Input and Output Capacitor) GND and
Reference (FB, ITH) GND.
• R100 is provided for the measurement of feedback frequency characteristics (optional). By inserting a resistor into R100, it
is possible to measure the frequency characteristics of feedback (phase margin) using FRA etc. R100 is short-circuited
for normal use.
C1
L1
CIN2
CIN1
IC
C3
COUT1
R2
COUT2
R3
C2
R1
C4
R100
Example of Evaluation Board Layout (Top View)
Example of Evaluation Board Layout (Bottom View)
Figure 72. Example of Evaluation Board Layout
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BD9S400MUF-C
Power Dissipation
For thermal design, be sure to operate the IC within the following conditions.
(Since the temperatures described hereunder are all guaranteed temperatures, take margin into account.)
1. The ambient temperature Ta is to be 125 °C or less.
2. The chip junction temperature Tj is to be 150 °C or less.
The chip junction temperature Tj can be considered in the following two patterns:
1. To obtain Tj from the package surface center temperature Tt in actual use
ꢦ푗 = ꢦꢞ ꢌ 휓퐽푇 × ꢧ [°C]
2. To obtain Tj from the ambient temperature Ta
ꢦ푗 = ꢦꢨ ꢌ 휃퐽ꢛ × ꢧ [°C]
Where:
휓퐽푇
휃퐽ꢛ
is junction to top characterization parameter (Refer to page 5)
is junction to ambient (Refer to page 5)
The heat loss W of the IC can be obtained by the formula shown below:
푉푂푈푇
푉푂푈푇
ꢓ
ꢧ = ꢋ푂푁퐻 × ꢀ푂푈푇
×
ꢌ ꢋ푂푁퐿 × ꢀ푂푈푇ꢓ ꢩꢇ −
ꢪ
푉
푉
퐼푁
퐼푁
ꢁ
(
)
ꢌ푉 × ꢀ퐶퐶 ꢌ × ꢞ푟 ꢌ ꢞ푓 × 푉 × ꢀ푂푈푇 × 푓
[W]
퐼푁
퐼푁
푆ꢉ
ꢓ
Where:
ꢋ푂푁퐻
is the High Side FET ON Resistance (Refer to page 6) [Ω]
is the Low Side FET ON Resistance (Refer to page 6) [Ω]
is the Output Current [A]
ꢋ푂푁퐿
ꢀ푂푈푇
푉푂푈푇
is the Output Voltage [V]
푉
퐼푁
is the Input Voltage [V]
ꢀ퐶퐶
ꢞ푟
ꢞ푓
is the Circuit Current (Refer to page 6) [A]
is the Switching Rise Time [s] (Typ:6ns)
is the Switching Fall Time [s] (Typ:6ns)
is the Switching Frequency (Refer to page 6) [Hz]
푓
푆ꢉ
ꢓ
1. ꢋ푂푁퐻 × ꢀ푂푈푇
ꢓ
2. ꢋ푂푁퐿 × ꢀ푂푈푇
3. ꢁ × (ꢞ푟 ꢌ ꢞ푓) × 푉 × ꢀ푂 × 푓
퐼푁
푆ꢉ
ꢓ
Figure 73. SW Waveform
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BD9S400MUF-C
I/O Equivalent Circuits
6. FB
7. ITH
20kΩ
10kΩ
10kΩ
10kΩ
10kΩ
FB
AVIN
AGND
ITH
40Ω
AGND
5kΩ
AGND
AGND
AGND
8. MODE/SYNC
9. SS
20kΩ
AVIN
150kΩ
MODE/
SYNC
AGND
SS
1kΩ
350kΩ
80kΩ
1kΩ
40kΩ
AGND
AGND
AGND
AGND
AGND
AGND
10.11.12. SW, 13. BOOT
14. PGD
PVIN
BOOT
PVIN
PGD
25Ω
SW
PVIN
AGND
AGND
PGND
15. EN
EN
430kΩ
10kΩ
570kΩ
AGND
AGND
AGND
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04.Dec.2017 Rev.002
BD9S400MUF-C
Operational Notes
1.
2.
3.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground
due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below
ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions
such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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04.Dec.2017 Rev.002
BD9S400MUF-C
Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 74. Example of monolithic IC structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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04.Dec.2017 Rev.002
BD9S400MUF-C
Ordering Information
B D 9 S 4 0 0 M U F
-
C E 2
Part Number
Package
VQFN16FV3030
Product class
C for Automotive applications
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
VQFN16FV3030 (TOP VIEW)
Part Number Marking
D 9 S
4 0 0
LOT Number
Pin 1 Mark
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BD9S400MUF-C
Physical Dimension and Packing Information
Package Name
VQFN16FV3030
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04.Dec.2017 Rev.002
BD9S400MUF-C
Revision History
Date
Revision
Changes
05.Sep.2017
04.Dec.2017
001
002
New Release
Update Operational Notes
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04.Dec.2017 Rev.002
Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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