BDJ0FC0WFP [ROHM]

BDJ0FC0WFP是可提供最大1A电流的低饱和型稳压器。输出电压固定型。封装是TO252-5。BDJ0FC0WFP内置防止因输出短路等发生IC破坏的过电流保护、以及防止因过负荷状态等使IC发生热破坏的过热保护电路。;


型号：	BDJ0FC0WFP
厂家：	ROHM
描述：	BDJ0FC0WFP是可提供最大1A电流的低饱和型稳压器。输出电压固定型。封装是TO252-5。BDJ0FC0WFP内置防止因输出短路等发生IC破坏的过电流保护、以及防止因过负荷状态等使IC发生热破坏的过热保护电路。过电流保护稳压器
文件：	总12页 (文件大小：416K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Secondary LDO Regulators

Secondary

Variable Output LDO Regulator

No.10026EAT10

BD00IA5WEFJ

●Description

BD00IA5WEFJ is a LDO regulator with output current 0.5A. The output accuracy is ±1% of output voltage. With external

resistance, it is available to set the output voltage at random (from 0.8V to 5.5V) and also provides output voltage fixed type

without external resistance. It is used for the wide applications of digital appliances. It has package type: HTSOP-J8.

Over current protection (for protecting the IC destruction by output short circuit), circuit current ON/OFF switch (for setting

the circuit 0µA at shutdown mode), and thermal shutdown circuit (for protecting IC from heat destruction by over load

condition) are all built in. It is usable for ceramic capacitor and enables to improve smaller set and long-life.

●Features

1) Output current 0.5A

2) High accuracy reference voltage circuit

3) Built-in Over Current Protection circuit (OCP)

4) Built-in Thermal Shut Down circuit (TSD)

5) With shut down switch

6) Output voltage variable type (0.8V to 4.5V)

7) Package: HTSOP-J8

●Output voltage differential Line up

Product name

BD00IA5WEFJ

Variable

Package

○

HTSOP-J8

Product name : B D 0 0 I C 0 W E F J

Signal

Description

Output voltage (V)

Variable

Voltage resistance(V)

24V

10V

20V

15V

Output current (A)

0.1A

0.3A

0.5A

1.0A

1.5A

2.0A

Shutdown switch

“W”

Shutdown switch is built in

“

”

Shutdown switch is not built in

Package

EFJ

HTSOP-J8

www.rohm.com

2010.10 - Rev.A

1/11

Technical Note

BD00IA5WEFJ

●Absolute maximum ratings (Ta=25℃)

Parameter

Symbol

Ratings

Unit

Power supply voltage

EN voltage

Vcc

V_EN

7.0 ^*1

7.0

Output voltage

V_OUT

7.0

Feedback voltage

V_FB

7.0

Power dissipation

HTSOP-J8

Pd^*2

Topr

Tstg

Tjmax

2110 ^*2

-25～+85

-55～+150

+150

℃

Operating Temperature Range

Storage Temperature Range

Junction Temperature

Not to exceed Pd

Reduced by 16.9mW/℃ for each increase in Ta of 1℃ over 25℃. (when mounted on a board 70mm×70mm×1.6mm glass-epoxy board, two layer)

●Operating conditions (Ta=25℃)

Ratings

Parameter

Symbol

Unit

Min.

2.4

0.0

0.8

0.0

Max.

5.5

Input power supply voltage

EN voltage

Vcc

V_EN

5.5

Output voltage setting range

4.5

Output current

0.5

This product should not be used in a radioactive environment.

●Electrical characteristics (Unless otherwise noted, Ta=25℃, EN=3V, Vcc=3.3V, R₁=16kΩ, R₂=7.5kΩ)

Limits

Parameter

Symbol

Unit

Conditions

Min.

Typ.

Max.

Circuit current at shutdown mode

Bias current

Isd

Icc

µA

EN=0V, OFF mode

250

0.4

0.800

500

Line regulation

Reg.I

Reg Io

Vco

Vcc=( Vo+0.6V )→5.5V

Io=0→0.5A

Load regulation

Minimun dropout Voltage

Output reference voltage

EN Low voltage

0.792

0.6

0.808

0.8

5.5

Vcc=3.3V,Io=0.5A

Io=0mA

V_FB

V_EN(Low)

V_EN(High)

IEN

EN High voltage

2.4

EN Bias current

µA

●I/O Equivalent circuits

8pin(VCC) / 1pin(VO)

2pin(FB)

5pin(EN)

2pin(FB)

8pin(Vcc)

5pin(EN)

Vcc

1pin(Vo)

www.rohm.com

2010.10 - Rev.A

2/11

Technical Note

BD00IA5WEFJ

●Reference Data (Unless otherwise noted, Ta=25℃, EN=3V, Vcc=3.3V, R₁=16kΩ, R₂=7.5kΩ)

1V/div

0.1V/div

Vcc

2V/div

0.2A/div

2V/div

10µsec / div

10usec / div

1msec/div

Fig.2 Transient Response (1.0→0A)

Fig.1 Transient Response(0→1.0A)

Fig.3 Input sequence 1

Co=1µF

1V/div

Vcc

2V/div

40msec/div

500µsec / div

20msec / div

Fig.4 OFF sequence 1

Fig.5 Inpurt sequence 2

Co=1µF

Fig.6 OFF sequence 2

Co=1µF

450

350

250

150

5.0

4.0

3.0

2.0

1.0

0.0

2.7

2.6

2.5

2.4

2.3

-25

75 85

-25

75 85

-25

75 85

[℃]

Fig.7 Ta-Vo (Io=0mA)

Fig.8 Ta-Icc

Fig.9 Ta-Isd

(VEN=0V)

8.0

6.0

4.0

2.0

0.0

2.7

2.6

2.5

2.4

2.3

5.0

4.0

3.0

2.0

1.0

0.0

-25

75 85

0.2

0.4

0.6

Io [A]

0.8

5 5.5

[℃]

Vcc [V]

Fig.10 Ta-IEN

Fig.11 Io-Vo

Fig.12 Vcc-Isd

(VEN=0V)

www.rohm.com

2010.10 - Rev.A

3/11

Technical Note

BD00IA5WEFJ

●Reference Data

3.0

2.0

1.0

0.0

100

120

140

160

[℃]

180

200

0.2

0.4

0.6

Io [A]

0.8

5 5.5

Vcc [V]

Fig.13 Vcc-Vo (Io=0mA)

Fig.14 TSD (Io=0mA)

Fig.15 OCP

400

300

200

100

10.00

1.00

0.10

0.01

0.6

0.5

0.4

0.3

Safety area

0.2

0.4

Io [A]

0.6

0.8

0.1

0.2

0.3

Io [A]

0.4

0.5

-25

75 85

[℃]

Fig.18 Io-Icc

Fig.16 Minimum dropout Voltage 1

(Vcc=3.3V, Io=-0.5A)

Fig.17 ESR Condencer

100

0.6

0.5

0.4

0.3

0.2

0.1

0.0

0.6

0.5

0.4

0.3

0.2

0.1

0.0

0.1

100

0.1

0.2

0.3

Io [A]

0.4

0.5

0.1

0.2

0.3

Io [A]

0.4

0.5

Frequency [kHz]

Fig.19 PSRR(Io=0mA)

Fig.20 Minimum dropout Voltage 2

Fig.21 Minimum dropout Voltage 3

(Vcc=2.4V, Ta=25℃)

(Vcc=3.3V, Ta=25℃)

0.6

0.5

0.4

0.3

0.2

0.1

0.0

0.1

0.2

0.3

Io [A]

0.4

0.5

Fig.22 Minimum dropout Voltage 4

(Vcc=5.0V, Ta=25℃)

www.rohm.com

2010.10 - Rev.A

4/11

Technical Note

BD00IA5WEFJ

●Heat Dissipation Characteristics

◎HTSOP-J8

4.0

Measure condition: mounted on a ROHM board, and IC

Substrate size: 70mm × 70mm × 1.6mm

⑤3.76W

(Substrate with thermal via)

・Solder the substrate and package reverse exposure heat radiation part

3.0

① IC only

θj-a=249.5℃/W

② 1-layer(copper foil are :0mm×0mm)

θj-a=153.2℃/W

③ 2-layer(copper foil are :15mm×15mm)

θj-a=113.6℃/W

④2.11W

2.0

④ 2-layer(copper foil are :70mm×70mm)

θj-a=59.2℃/W

⑤ 4-layer(copper foil are :70mm×70mm)

θj-a=33.3℃/W

③1.10W

1.0

②0.82W

①0.50W

0.0

100

125

150

Ambient Temperature: Ta [℃]

●About Input-to-output capacitor

It is recommended that a capacitor is placed nearby pin between Input pin and GND, output pin and GND.

A capacitor, between input pin and GND, is valid when the power supply impedance is high or drawing is long. Also as for a

capacitor, between output pin and GND, the greater the capacity, more sustainable the line regulation and it makes

improvement of characteristics by load change. However, please check by mounted on a board for the actual application.

Ceramic capacitor usually has difference, thermal characteristics and series bias characteristics, and moreover capacity

decreases gradually by using conditions.

For more detail, please be sure to inquire the manufacturer, and select the best ceramic capacitor.

Ceramic capacitor capacity- DC bias characteristics

(Characteristics example)

10 Voltage resistance

B1 characteristics

GRM188B11A105KA61D

-10

10 Voltage resistance

-20

B characteristics

-30

B characteristics

-40

6.3 Voltage resistance

10 Voltage resistance

-50

F characteristics

-60

4 Voltage resistance

10 Voltage Resistance

X6S characteristics

F characteristics

-70

-80

-90

-100

DC Bias Voltage [V]

www.rohm.com

2010.10 - Rev.A

5/11

Technical Note

BD00IA5WEFJ

●Heat Loss

Thermal design should allow operation within the following conditions. Note that the temperatures listed are the allowed

temperature limits, and thermal design should allow sufficient margin from the limits.

1. Ambient temperature Ta can be no higher than 85℃.

2. Chip junction temperature (Tj) can be no higher than 150℃.

Chip junction temperature can be determined as follows:

① Calculation based on ambient temperature (Ta)

Tj=Ta+θj-a×W

＜Reference values＞

1-layer substrate (copper foil density 0mm×0mm)

2-layer substrate (copper foil density 15mm×15mm)

2-layer substrate (copper foil density 70mm×70mm)

4-layer substrate (copper foil density 70mm×70mm)

θj-a：HTSOP-J8 153.2℃/W

113.6℃/W

59.2℃/W

33.3℃/W

Substrate size: 70×70×1.6mm³(substrate with thermal via)

Most of the heat loss that occurs in the BD00IA5WEFJ is generated from the output Pch FET. Power loss is determined by

the total V_cc-Vo voltage and output current. Be sure to confirm the system input and output voltage and the output current

conditions in relation to the heat dissipation characteristics of the V_INand Vo in the design. Bearing in mind that heat

dissipation may vary substantially depending on the substrate employed (due to the power package incorporated in the

BD00IA5WEFJ make certain to factor conditions such as substrate size into the thermal design.

Power consumption (W) = Input voltage (VCC)- Output voltage (Vo) ×Io(Ave)

Example) Where VCC=3.3V, VO=2.5V, Io(Ave) = 0.1A,

Power consumption (W)

3.3(V)-2.5(V) ×0.1(A)

=0.08(W)

●About equivalent series resistance ESR (ceramic capacitor etc.)

Capacity-Bias characteristics

100

Capacitor usually has ESR(Equivalent Series Resistance), and

operates stable in ESR-OUT range, showed right. Generally, ESR of

ceramic, tantalum and electronic capacitor etc. is different for each,

so please be sure to check a capacitor which is going to use, and

use it inside the stable range, showed right. Then, please evaluate

for the actual application

0.1

0.01

100

150

200

IOUT [mA]

Stable area characteristics

(Characteristics example)

www.rohm.com

2010.10 - Rev.A

6/11

Technical Note

BD00IA5WEFJ

●Block Diagram

BD00IA5WEFJ

(VO+0.6)～5.5V

GND

VCC

Ceramic

Capacitor

≧ 1µF

OCP

SOFT

0.8V～4.5V

Ceramic

Capacitor

≧ 1µF

TSD

●Pin number, Pin name

Pin No.

Pin name

VOUT

Pin Function

Output voltage pin

Feedback pin

GND

N.C.

GND pin

Non Connection

Enable pin

N.C.

VCC

FIN

Non Connection

Input voltage pin

Substrate(GND pin)

Reverse

www.rohm.com

2010.10 - Rev.A

7/11

Technical Note

BD00IA5WEFJ

●Evaluation board circuit

VCC

N.C

VOUT

C10

N.C

GND

N.C.

GND

SW1

VOUT

Gate

●Evaluation board parts list

Designation Value

Part No.

Company Designation Value

Part No.

Company

16kΩ MCR01PZPZF1602

7.5kΩ MCR01PZPZF7501

ROHM

C10

‐

1uF

‐

ROHM

CM105B105K16A

KYOCERA

‐

1uF

‐

CM105B105K16A

KYOCERA

‐

BD00IA5WEFJ

‐

ROHM

‐

●About Board Layout

GND

Cin

VCC (Vi n)

・Input capacitor Cin of VCC (Vin) should be placed very close to VCC(Vin) pin as possible, and used broad wiring pattern.

Output capacitor Co also should be placed close to IC pin as possible. In case connected to inner layer GND plane, please

use several through hole.

・VFB pin has comparatively high impedance, and is apt to be effected by noise, so floating capacity should be minimum as

possible. Please be careful in wiring drawing

・Please take GND pattern space widely, and design layout to be able to increase radiation efficiency.

・For output voltage setting

Output voltage can be set by FB pin voltage(0.800V typ.)and external resistance R1, R2.

R1+R2

VO = VFB×

(The use of resistors with R1+R2=5k to 90k is recommended)

www.rohm.com

2010.10 - Rev.A

8/11

Technical Note

BD00IA5WEFJ

●Notes for use

(1) Absolute maximum ratings

An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can

break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any

over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as

fuses.

(2) Connecting the power supply connector backward

Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply

lines. An external direction diode can be added.

(3) Power supply lines

Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line,

separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals

to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the

circuit, not that capacitance characteristic values are reduced at low temperatures.

(4) GND voltage

The potential of GND pin must be minimum potential in all operating conditions.

(5) Thermal design

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.

(6) Off leak in high temperature.

Off-leak in high temperature may increase because of manufacturing of IC diviation.

Design in cousideration with graph of typ, worst is shown below.

BD00IA5WEFJ Ta-Ileak

0.5

0.4

0.3

0.2

worst

0.1

ttyp

100

125

150

Temperature (℃)

(7) Inter-pin shorts and mounting errors

Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any

connection error or if pins are shorted together.

(8) Actions in strong electromagnetic field

Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to

malfunction.

(9) ASO

When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.

(10) Thermal shutdown circuit

The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is

designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation.

Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit

is assumed.

TSD ON Temperature[℃] (typ.)

Hysteresis Temperature [℃] (typ.)

BD00IA5WEFJ

175

www.rohm.com

2010.10 - Rev.A

9/11

Technical Note

BD00IA5WEFJ

(11) Testing on application boards

When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.

A lways discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or

removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic

measure. Use similar precaution when transporting or storing the IC.

(12) Regarding input pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.

P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode

or transistor. For example, the relation between each potential is as follows:

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes

operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.

Resistor

Transistor (NPN)

Pin A

Pin B

Pin A

P⁺

Parasitic

element

P substrate

Parasitic

element

GND

Parasitic element

Other adjacent elements

(13) Ground Wiring Pattern.

When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,

placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage

variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the

GND wiring pattern of any external components, either.

www.rohm.com

2010.10 - Rev.A

10/11

Technical Note

BD00IA5WEFJ

●Ordering part number

B D

0 0

A 5

E F J

E 2

ROHM

Output voltage Voltage

Output cuurent Shutdown switch Package

Packaging specifications

E2: Emboss tape reel

Part Number 00 : Variable

resistance A1:0.1A

“W”：Built in

”：None

EFJ ：HTSOP-J8

E :24V

F :20V

G :15V

H :10V

A3:0.3A

A5:0.5A

C0:1.0A

C5:1.5A

D0:2.0A

“

:7V

HTSOP-J8

4.9 0.1

(MAX 5.25 include BURR)

Tape

Embossed carrier tape

2500pcs

(3.2)

Quantity

4°

−4

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1PIN MARK

+0.05

-0.03

0.545

0.17

1.27

+0.05

0.42

0.08

0.04

0.08

Direction of feed

1pin

Reel

(Unit : mm)

Order quantity needs to be multiple of the minimum quantity.

∗

www.rohm.com

2010.10 - Rev.A

11/11

Notice

N o t e s

No copying or reproduction of this document, in part or in whole, is permitted without the

consent of ROHM Co.,Ltd.

The content speciﬁed herein is subject to change for improvement without notice.

The content speciﬁed herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the speciﬁcations,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information speciﬁed in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information speciﬁed herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

use of such technical information.

The Products speciﬁed in this document are intended to be used with general-use electronic

equipment or devices (such as audio visual equipment, ofﬁce-automation equipment, commu-

nication devices, electronic appliances and amusement devices).

The Products speciﬁed in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

against the possibility of physical injury, ﬁre or any other damage caused in the event of the

failure of any Product, such as derating, redundancy, ﬁre control and fail-safe designs. ROHM

shall bear no responsibility whatsoever for your use of any Product outside of the prescribed

scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or

system which requires an extremely high level of reliability the failure or malfunction of which

may result in a direct threat to human life or create a risk of human injury (such as a medical

instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-

controller or other safety device). ROHM shall bear no responsibility in any way for use of any

of the Products for the above special purposes. If a Product is intended to be used for any

such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology speciﬁed herein that may

be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to

obtain a license or permit under the Law.

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

http://www.rohm.com/contact/

www.rohm.com

R1010

BDJ0FC0WFP [ROHM]

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