BH26M0AWHFV [ROHM]

BHxxM0A系列是输出为300mA的高性能CMOS LDO。电路电流65uA,消耗低且噪音特性优异,适用于逻辑IC电源、RF电源、相机模块电源等各种应用。;
BH26M0AWHFV
型号: BH26M0AWHFV
厂家: ROHM    ROHM
描述:

BHxxM0A系列是输出为300mA的高性能CMOS LDO。电路电流65uA,消耗低且噪音特性优异,适用于逻辑IC电源、RF电源、相机模块电源等各种应用。

文件: 总13页 (文件大小:620K)
中文:  中文翻译
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Datasheet  
CMOS LDO Regulators for Portable Equipments  
1ch 300mA  
CMOS LDO Regulators  
BHxxM0A series  
General Description  
Key Specifications  
„ Input Power Supply Voltage Range:  
2.5V to 5.5V  
0 to 300mA  
-40 to 85℃  
1.5V to 3.4V  
±1%  
BHxxM0A series are high-performance CMOS LDO  
regulators with output current ability of up to 300mA. These  
devices have excellent noise characteristics despite of  
their low circuit current consumption of 65µA. They are  
most appropriate for various applications such as power  
supplies for logic IC, RF, and camera modules.  
„ Output Current Range:  
„ Operating Temperature Range:  
„ Output Voltage Lineup:  
„ Output Voltage Accuracy:  
„ Circuit Current:  
65μA (Typ.)  
0μA (Typ.)  
„ Standby Current:  
Package  
W(Typ.) x D(Typ.) x H(Max.)  
1.60mm x 3.00mm x 0.75mm  
HVSOF6  
Features  
„ High Output Voltage Accuracy: ±1 %  
(±25mV on VOUT<2.5V products)  
„ Dropout voltage: 60mV (IOUT=100mA)  
„ Compatible with small ceramic capacitor  
„ Output Voltage ON/OFF Control  
„ Built-in Over Current Protection Circuit (OCP)  
„ Built-in Thermal Shutdown Circuit (TSD)  
„ Ultra-small power package:HVSOF6  
Applications  
„ Battery-driven portable devices  
„ Other electronic devices using microcontrollers or  
logic circuits  
Typical Application Circuit  
Vout  
Vin  
VIN  
VOUT  
VOUT  
Cout  
Cin  
On  
BHxxM0A  
GND  
NOISE  
STBY  
Off  
Cn  
Figure 1. Typical Application Circuit  
Product structureSilicon monolithic integrated circuit This product is not designed protection against radioactive rays  
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Pin Configuration  
STBY  
GND NOISE  
VIN  
Pin Description  
VOUT VOUT  
Pin No.  
Symbol  
Function  
1
VIN  
VOUT  
VOUT  
NOISE  
GND  
INPUT Pin  
2
OUTPUT Pin  
OUTPUT Pin  
3
4
NOISE reducing capacitor ground terminal  
GROUND Pin  
5
6
STBY  
FIN  
OUTPUT CONTROL Pin (High:ON,Low:OFF)  
OPEN  
reverse  
Block Diagram  
VIN  
1
VOLTAGE  
REFERENCE  
-
+
VOUT  
VOUT  
GND  
5
2
3
THERMAL  
PROTECTION  
OVER CURRENT  
PROTECTION  
STBY  
6
CONTROL  
BLOCK  
NOISE  
4
Figure 2. Block diagram  
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BHxxM0A series  
Absolute Maximum Ratings  
Parameter  
Symbol  
VMAX  
Pd  
Ratings  
-0.3 to +6.5  
680(*1)  
Unit  
V
Maximum Power Supply Voltage Range  
Power Dissipation  
mW  
Maximum Junction Temperature  
Operating Temperature Range  
Storage Temperature Range  
Tjmax  
Topr  
+125  
-40 to +85  
-55 to +125  
Tstg  
(*1) Derate by 6.8mW/when operating above Ta=25. (When mounted on a board 70mm×70mm×1.6mm glass-epoxy board, two layer.)  
Recommended Operating Ratings  
Parameter  
Symbol  
VIN  
Limit  
Unit  
V
Input Power Supply Voltage Range  
Maximum Output Current Range  
2.5 to 5.5  
0 to 300  
IMAX  
mA  
Recommended Operating Conditions  
Ratings  
Typ.  
Parameter  
Input Capacitor  
Symbol  
Unit  
Conditions  
Min.  
Max.  
Cin  
Cout  
Cn  
1.0(*2)  
µF  
µF  
µF  
A ceramic capacitor is recommended.  
A ceramic capacitor is recommended.  
A ceramic capacitor is recommended.  
Output Capacitor  
1.0(*2)  
Noise Decrease Capacitor  
0.01  
0.22  
(*2) Set the value of the capacitor so that it does not fall below the minimum value. Take into considerations the temperature characteristics,  
DC device characteristics, and degradation with time.  
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Electrical characteristics  
(Unless otherwise noted, Ta=25,VIN=VOUT+1.0V(*3),STBY=1.5V, Cin=1μF, Co=1μF, Cn=0.01μF.)  
Limit  
PARAMETER  
REG】  
Symbol  
UNIT  
Conditions  
MIN.  
TYP.  
MAX.  
VOUT  
×0.99  
VOUT  
×1.01  
VOUT  
+25mV  
95  
VOUT  
VOUT  
IOUT=1mA, VOUT2.5V  
IOUT=1mA, VOUT2.5V  
Output Voltage  
VOUT  
V
VOUT  
-25mV  
Circuit Current  
IGND  
ISTBY  
R.R.  
-
-
-
65  
-
μA  
μA  
dB  
IOUT=1mA  
Circuit Current (STBY)  
Ripple Rejection Ratio  
1.0  
STBY=0V  
60  
-
VRR=-20dBv,fRR=1kHz,IOUT=10mA  
VIN=0.98×VOUT,IOUT=100mA  
VOUT2.5V  
Dropout Voltage  
Line Regulation  
VSAT1  
VDL1  
-
-
60  
2
90  
20  
mV  
mV  
IOUT=1mA  
VIN=VOUT+0.5V to 5.5V(*4)  
IOUT=1mA to 100mA  
IOUT=1mA to 300mA  
Load Regulation 1  
Load Regulation 2  
Output Voltage  
Temperature  
VDLO1  
VDLO2  
-
-
6
30  
90  
mV  
mV  
18  
VOUT/Ta  
-
±100  
-
ppm/IOUT=1mA,Ta=-40 to +85℃  
OCP】  
Limit Current  
Short Current  
ILMAX  
-
-
600  
100  
-
-
mA  
mA  
Vo=VOUT×0.85  
Vo=0V  
ISHORT  
STBY】  
STBY Pull-down Resistor  
RSTB  
VSTBH  
VSTBL  
550  
1.5  
1100  
2200  
VCC  
0.3  
kΩ  
V
ON  
-
-
STBY Control  
Voltage  
OFF  
-0.3  
V
(*3) VIN=3.5V for VOUT2.5V.  
(*4) VIN=3.0V to 5.5V for VOUT2.5V.  
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Reference data BH30M0AWHFV (Unless otherwise specified, Ta=25.)  
Figure 3. Output Voltage vs. Input Voltage  
Figure 4. GND Current vs. Input Voltage  
Figure 5. Output Voltage vs. Output Current  
(OCP Threshold)  
Figure 6. Dropout Voltage vs. Output Current  
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Reference data BH30M0AWHFV (Ta=25, unless otherwise specified.)  
Figure 7. Output Voltage vs. Temperature  
Figure 8. Ripple Rejection vs. Frequency  
Figure 9. Load response  
Figure 10. Startup time  
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BHxxM0A series  
About input/output capacitor  
Capacity value of ceramic capacitor - DC bias characteristics  
(Example)  
It is recommended that an input capacitor is placed near pins  
between the VCC pin and GND as well as an output capacitor  
between the output pin and GND. The input is valid when the  
power supply impedance is high or when the PCB trace has  
significant length. For the output capacitor, the greater the  
capacitance, the more stable the output will be depending on  
the load and line voltage variations. However, please check the  
actual functionality of this capacitor by mounting it on a board  
for the actual application. Ceramic capacitors usually have  
different, thermal and equivalent series resistance  
characteristics, and may degrade gradually over continued  
use.  
10-V withstand voltage  
B1characteristics  
GRM188B11A105KA61D  
10  
0
10-V withstand voltage  
B characteristics  
-10  
-20  
-30  
-40  
-50  
-60  
-70  
-80  
-90  
-100  
6.3-V withstand voltage  
B characteristics  
10-V withstand voltage  
F characteristics  
4-V withstand voltage  
X6S characteristics  
10-V withstand voltage  
F characteristics  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
For additional details, please check with the manufacturer,  
and select the best ceramic capacitor for your application  
DC Bias Voltage [V]  
Figure 11. Capacity-bias characteristics  
Cout=1.0μF,Cin=1.0μF,Temp=+25  
Equivalent Series Resistance (ESR) of a Ceramic Capacitor  
100  
Capacitors generally have ESR (equivalent series resistance) and it  
operates stably in the ESR-IOUT area shown on the right. Since  
ceramic capacitors, tantalum capacitors, electrolytic capacitors, etc.  
generally have different ESR, please check the ESR of the capacitor to  
be used and use it within the stability area range shown in the right  
graph for evaluation of the actual application.  
10  
1
Stable region  
0.1  
0.01  
0
50  
100  
150  
200  
250  
300  
Output CurrentꢀIOUTꢀ[mA]  
Figure 12. Stable region (example)  
Power Dissipation (Pd)  
As for power dissipation, an estimate of heat reduction characteristics and internal power consumption of IC are shown, so  
please use these for reference. Since power dissipation changes substantially depending on the implementation conditions  
(board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is recommended to measure Pd  
on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original IC performance, such as  
causing the operation of the thermal shutdown circuit or reduction in current capability. Therefore, be sure to prepare  
sufficient margin within power dissipation for usage.  
Calculation of the maximum internal power consumption of IC (PMAX)  
PMAX=(VIN-VOUT)×IOMAX  
Where : VIN=Input voltage  
VOUT= Output voltage IOMAX: Maximum output current  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
0.68W  
Standard ROHM  
board  
* Please design the margin so that  
PMAX becomes is than Pd (PMAX<Pd)  
within the usage temperature range  
85  
0
25  
50  
75  
100  
125  
Ta ()  
Figure 13.HVSOF6 Power dissipation heat reduction characteristics (Reference)  
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BHxxM0A series  
Operational Notes  
1) Absolute maximum ratings  
This product is produced with strict quality control, however it may be destroyed if operated beyond its absolute  
maximum ratings. In addition, it is impossible to predict all destructive situations such as short-circuit modes, open  
circuit modes, etc. Therefore, it is important to consider circuit protection measures, like adding a  
fuse, in case the IC is operated in a special mode exceeding the absolute maximum ratings.  
2) GND Potential  
GND potential must be the lowest potential of all pins of the IC at all operating conditions. Ensure that no pins are at a  
voltage below the ground pin at any time, even during transient condition.  
3) Setting of Heat  
Carry out the heat design that have adequate margin considering Pd of actual working states.  
4) Pin Short and Mistake Fitting  
When mounting the IC on the PCB, pay attention to the orientation of the IC. If there is mistake in the placement, the IC  
may be burned up.  
5) Actions in Strong Magnetic Field  
Using the IC within a strong magnetic field may cause the IC to malfunction.  
6) Mutual impedance  
Use short and wide wiring tracks for the power supply and ground to keep the mutual impedance as small as  
possible. Use a capacitor to keep ripple to a minimum.  
7) STBY Pin Voltage  
For standby mode, set STBY voltage below 0.3V. For normal operation, set the pin voltage beyond 1.5V. It is not  
recommended to set STBY voltage between 0.3V and 1.5V, as it may cause malfunctions.  
8) Over Current Protection Circuit  
Over current and short circuit protection is built-in at the output, and IC destruction is prevented at the time of load  
short circuit. These protection circuits are effective in the destructive prevention by the sudden accident. Please  
avoid applications where the over current protection circuit operates continuously.  
9) Thermal shutdown  
This IC also features a thermal shutdown circuit that is designed to turn off the output when the junction temperature of  
the IC exceeds about 170. This feature is intended to protect the IC only in the event of thermal overload and is not  
designed to guarantee operation or act as an active security device for applications. Therefore, it is not recommended  
that you design application where TSD will work in normal condition.  
TSD ON TEMPURATURE() (typ.)  
HYSTERESIS TEMPURATURE() (typ.)  
170  
15  
BHxxM0A series  
10) Noise Pin  
NOISE pin can drive small current, since it is directly connected to reference voltage circuit. The output voltage may  
drop when the load of NOISE pin is more than 100nA. If the pin is connected to a capacitor, please use ceramic  
capacitor for small leak current. Please take note that the output noise is smaller as NOISE pin capacitor is larger,  
but startup time is longer.  
11)Output capacitor  
To prevent oscillation at output, it is recommended that the IC be operated at the stable region shown in Figure 12.  
It operates at the capacitance value of more than 1.0μF. As capacitance is larger, stability becomes more stable and  
characteristic of output load fluctuation is also improved.  
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Ordering Information  
B
H
x
x
M
0 A W  
H
F
V
-
T
R
ROHM  
Output voltage  
Series name  
M0A:300mA  
Shutdown  
switch  
W:With switch  
Package  
HFV:HVSOF6  
Packaging and forming specifications  
TR:Embossed tape and reel  
Part No. xx=15:1.5V  
xx=18:1.8V  
xx=20:2.0V  
xx=21:2.1V  
xx=25:2.5V  
xx=26:2.6V  
xx=27:2.7V  
xx=28:2.8V  
xx=29:2.9V  
xx=30:3.0V  
xx=31:3.1V  
xx=32:3.2V  
xx=33:3.3V  
xx=34:3.4V  
Physical Dimension Tape and Reel Information  
HVSOF6  
<Tape and Reel information>  
1.6 0.1  
(MAX 1.8 include BURR)  
Tape  
Embossed carrier tape  
Quantity  
3000pcs  
6
5 4  
TR  
Direction  
of feed  
The direction is the 1pin of product is at the upper right when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
(1.2)  
(1.4)  
1pin  
1
2 3  
0.145 0.05  
S
0.1  
S
0.22 0.05  
0.5  
Direction of feed  
Order quantity needs to be multiple of the minimum quantity.  
Reel  
(Unit : mm)  
Marking Diagram(s)  
xx  
15  
18  
20  
21  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
Output Voltage  
Marking  
EA  
EB  
EC  
ED  
EE  
EF  
EG  
EH  
EJ  
1.5V typ.  
1.8V typ.  
2.0V typ.  
2.1V typ.  
2.5V typ.  
2.6V typ.  
2.7V typ.  
2.8V typ.  
2.9V typ.  
3.0V typ.  
3.1V typ.  
3.2V typ.  
3.3V typ.  
3.4V typ.  
HVSOF6(TOP VIEW)  
Part Number Marking  
LOT Number  
EK  
EL  
1PIN MARK  
EM  
EN  
EP  
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Revision History  
Date  
Revision  
Changes  
04.Apr.2013  
001  
New Release  
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Notice  
Precaution on using ROHM Products  
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,  
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you  
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport  
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car  
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or  
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.  
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any  
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific  
Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
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USA  
EU  
CHINA  
CLASS  
CLASSⅣ  
CLASSb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are designed and manufactured for use under standard conditions and not under any special or  
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any  
special or extraordinary environments or conditions. If you intend to use our Products under any special or  
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of  
product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual  
ambient temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the  
ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice - GE  
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Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
QR code printed on ROHM Products label is for ROHM’s internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,  
please consult with ROHM representative in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable  
for infringement of any intellectual property rights or other damages arising from use of such information or data.:  
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the information contained in this document.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
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Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
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