BH31NB1WHFV-TR [ROHM]

Fixed Positive LDO Regulator, 3.1V, 0.45V Dropout, CMOS, PDSO5, ROHS COMPLIANT, HVSOF-5;
BH31NB1WHFV-TR
型号: BH31NB1WHFV-TR
厂家: ROHM    ROHM
描述:

Fixed Positive LDO Regulator, 3.1V, 0.45V Dropout, CMOS, PDSO5, ROHS COMPLIANT, HVSOF-5

光电二极管 输出元件 调节器
文件: 总11页 (文件大小:442K)
中文:  中文翻译
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CMOS LDO Regulators for Portable Equipments  
1ch 150mA  
CMOS LDO Regulators  
BH□□NB1WHFV series  
No.11020EBT04  
Description  
The BH□□NB1WHFV series is a line of 150 mA output, high-performance CMOS regulators that deliver a high ripple  
rejection ratio of 80 dB (Typ., 1 kHz). They are ideal for use in high-performance, analog applications and offer improved line  
regulation, load regulation, and noise characteristics. Using the ultra-small HVSOF5 package, which features a built-in heat  
sink, contributes to space-saving application designs.  
Features  
1) High accuracy output voltage: ± 1%  
2) High ripple rejection ratio: 80 dB (Typ., 1 kHz)  
3) Stable with ceramic capacitors  
4) Low bias current: 60 µA  
5) Output voltage on/off control  
6) Built-in overcurrent and thermal shutdown circuits  
7) Ultra-small HVSOF5 power package  
Applications  
Battery-driven portable devices, etc.  
Product line  
150 mA BH□□NB1WHFV Series  
Product name  
2.5  
2.8  
2.85  
2.9  
3.0  
3.1  
3.3  
Package  
HVSOF5  
BH□□NB1WHFV  
Model name: BH□□NB1W□  
a
b
Symbol  
Description  
Output voltage specification  
□□  
25  
Output voltage (V)  
2.5 V (Typ.)  
□□  
30  
Output voltage (V)  
3.0 V (Typ.)  
a
b
28  
2.8 V (Typ.)  
31  
3.1 V (Typ.)  
2J  
2.85 V (Typ.)  
2.9 V (Typ.)  
33  
3.3 V (Typ.)  
29  
Package HFV: HVSOF5  
www.rohm.com  
© 2011 ROHM Co., Ltd. All rights reserved.  
2011.01 - Rev.B  
1/8  
Technical Note  
BH□□NB1WHFV series  
Absolute maximum ratings  
Parameter  
Symbol  
Ratings  
Unit  
Applied power supply voltage  
Power dissipation  
VMAX  
Pd  
0.3 to +6.0  
410 *1  
V
mW  
°C  
Operating temperature range  
Topr  
40 to +85  
Storage temperature range  
Tstg  
55 to +125  
°C  
*1: Reduce by 4.1 mW/C over 25C, when mounted on a glass epoxy PCB (70 mm 70 mm 1.6 mm).  
Recommended operating ranges (not to exceed Pd)  
Parameter  
Symbol  
Ratings  
Unit  
Power supply voltage  
Output current  
VIN  
2.5 to 5.5  
0 to 150  
V
IOUT  
mA  
Recommended operating conditions  
Parameter Symbol  
Input capacitor  
Output capacitor  
Ratings  
Typ.  
Unit  
Conditions  
Min.  
Max.  
The use of ceramic  
capacitors is recommended.  
CIN  
CO  
0.1 *2  
µF  
µF  
The use of ceramic  
capacitors is recommended.  
2.2 *2  
*2 Make sure that the output capacitor value is not kept lower than this specified level across a variety of temperature, DC bias characteristic.  
And also make sure that the capacitor value cannot change as time progresses.  
Electrical characteristics  
(Unless otherwise specified, Ta = 25°C, VIN = VOUT + 1.0 V, STBY = 1.5 V, CIN = 0.1 µF, CO = 2.2 µF)  
Limits  
Parameter  
Output voltage  
Symbol  
Unit  
Conditions  
IOUT = 1 mA  
Min.  
Typ.  
Max.  
VOUT  
IGND  
ISTBY  
VOUT0.99  
VOUT  
VOUT1.01  
V
IOUT = 50 mA  
STBY = 0 V  
Circuit current  
60  
100  
1.0  
µA  
µA  
Circuit current (STBY)  
VRR = 20 dBv, fRR = 1 kz,  
IOUT = 10 mA  
Ripple rejection ratio  
RR  
80  
dB  
IOUT = 1 mA to 30 mA  
IOUT = 30 mA to 1 mA  
Load response 1  
Load response 2  
LTV1  
LTV2  
25  
25  
mV  
mV  
VIN = 0.98 VOUT,  
Dropout voltage 1  
Dropout voltage 2  
Line regulation  
VSAT1  
VSAT2  
VDL1  
80  
250  
1
150  
450  
20  
mV  
mV  
mV  
IOUT = 30 mA  
VIN = 0.98 VOUT,  
IOUT = 100 mA  
VIN = VOUT + 0.5 V to 5.5 V,  
IOUT = 50 mA  
IOUT = 1 mA to 100 mA  
IOUT = 1 mA to 150 mA  
VO = VOUT 0.98  
VO = 0 V  
Load regulation 1  
Load regulation 2  
VDLO1  
VDLO2  
ILMAX  
ISHORT  
RSTB  
6
30  
90  
mV  
mV  
mA  
mA  
kΩ  
9
Overcurrent protection  
limit current  
250  
50  
550  
Short current  
STBY pull-down resistance  
275  
1100  
ON  
OFF  
VSTBH  
VSTBL  
1.5  
VIN  
0.3  
V
V
STBY control voltage  
0.3  
* This IC is not designed to be radiation-resistant.  
www.rohm.com  
© 2011 ROHM Co., Ltd. All rights reserved.  
2011.01 - Rev.B  
2/8  
Technical Note  
BH□□NB1WHFV series  
Reference data  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
0
1
2
3
4
5
0
1
2
3
4
5
0
1
2
3
4
5
Input Voltage VIN[V]  
Input Voltage VIN[V]  
Input Voltage VIN[V]  
Fig.2 Output Voltage vs Input Voltage  
(BH30NB1WHFV)  
Fig.3 Output Voltage vs Input Voltage  
(BH33NB1WHFV)  
Fig.1 Output Voltage vs Input Voltage  
(BH25NB1WHFV)  
80  
70  
60  
50  
40  
30  
20  
10  
0
80  
70  
60  
50  
40  
30  
20  
10  
0
80  
70  
60  
50  
40  
30  
20  
10  
0
0
1
2
3
4
5
0
1
2
3
4
5
0
1
2
3
4
5
Input Voltage VIN[V]  
Input Voltage VIN[V]  
Input Voltage VIN[V]  
Fig.6 GND Current vs Input Voltage  
(BH33NB1WHFV)  
Fig.4 GND Current vs Input Voltage  
(BH25NB1WHFV)  
Fig.5 GND Current vs Input Voltage  
(BH30NB1WHFV)  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
0
50  
100 150 200 250 300  
0
50  
100 150 200 250 300  
0
50  
100 150 200 250  
300  
Output Current IOUT[mA]  
Output Current IOUT [mA]  
Output Current IOUT [mA]  
Fig.9 Output Voltage vs Output Current  
(BH33NB1WHFV)  
Fig.8 Output Voltage vs Output Current  
(BH30NB1WHFV)  
Fig.7 Output Voltage vs Output Current  
(BH25NB1WHFV)  
0. 5  
0. 4  
0. 3  
0. 2  
0. 1  
0. 0  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
0
50  
100  
150  
0
50  
100  
150  
0
50  
100  
150  
Output Current IOUT[mA]  
Output Current IOUT[mA]  
Output Current IOUT[mA]  
Fig.12 Dropout voltage vs Output Current  
(BH33NB1WHFV)  
Fig.10 Dropout voltage vs Output Current Fig.11 Dropout voltage vs Output Current  
(BH25NB1WHFV) (BH30NB1WHFV)  
www.rohm.com  
© 2011 ROHM Co., Ltd. All rights reserved.  
2011.01 - Rev.B  
3/8  
Technical Note  
BH□□NB1WHFV series  
2.60  
2.55  
2.50  
3.40  
3.35  
3.30  
3.25  
3.20  
3.10  
3.05  
3.00  
2.95  
2.90  
2.45  
IOUT=1mA  
IOUT=1mA  
IOUT=1mA  
2.40  
-50  
-25  
0
25  
Temp[  
50  
75  
100  
-50  
-25  
0
25  
Temp[ ]  
50  
75  
100  
-50  
-25  
0
25  
Temp[  
50  
75  
100  
]
]
Fig.14 Output Voltage vs Temperature  
(BH30NB1WHFV)  
Fig.15 Output Voltage vs Temperature  
(BH33NB1WHFV)  
Fig.13 Output Voltage vs Temperature  
(BH25NB1WHFV)  
90  
80  
70  
60  
50  
40  
90  
80  
70  
60  
50  
40  
90  
80  
70  
60  
50  
40  
30  
30  
30  
Co=2.2μF  
Io=10mA  
Co=2.2μF  
Io=10mA  
Co=2.2μF  
Io=10mA  
20  
20  
20  
10  
10  
10  
100  
1 k  
10 k  
100  
1 M  
100  
1 k  
10 k  
100  
1 M  
100  
1 k  
10 k  
100  
1 M  
Frequency f[Hz]  
Frequency f[Hz]  
Frequency f[Hz]  
Fig.17 Ripple Rejection  
Fig.18 Ripple Rejection  
Fig.16 Ripple Rejection  
(BH25NB1WHFV)  
(BH30NB1WHFV)  
(BH33NB1WHFV)  
IOUT = 1 mA 30 mA  
IOUT = 1 mA 30 mA  
IOUT = 1 mA 30 mA  
VOUT  
50 mV / div  
100 µs / div  
VOUT  
VOUT  
50 mV / div  
100 µs / div  
50 mV / div  
100 µs / div  
Fig.19 Load Response  
(Co = 2.2 µF)  
Fig.20 Load Response  
(Co = 2.2 µF)  
Fig.21 Load Response  
(Co = 2.2 µF)  
(BH25NB1WHFV)  
(BH30NB1WHFV)  
(BH33NB1WHFV)  
1 V / div  
1 V / div  
1 V / div  
STBY  
STBY  
STBY  
1 V / div  
1 V / div  
1 V / div  
Co = 1 µF  
VOUT  
Co = 1 µF  
Co = 1 µF  
Co = 10 µF  
Co = 10 µF  
Co = 10 µF  
VOUT  
VOUT  
Co = 2.2 µF  
Co = 2.2 µF  
100 µs / div  
Co = 2.2 µF  
100 µs / div  
100 µs / div  
Fig.23 Output Voltage Rise Time  
(BH30NB1WHFV)  
Fig.24 Output Voltage Rise Time  
(BH33NB1WHFV)  
Fig.22 Output Voltage Rise Time  
(BH25NB1WHFV)  
www.rohm.com  
2011.01 - Rev.B  
4/8  
© 2011 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BH□□NB1WHFV series  
Block diagram, recommended circuit diagram, and pin assignment diagram  
BH□□NB1WHFV  
Pin  
No.  
VIN  
VIN  
Symbol  
STBY  
Function  
3
VOLTAGE  
REFERENCE  
Output voltage on/off control  
(High: ON, Low: OFF)  
1
Cin  
VOUT  
Co  
VOUT  
N.C.  
4
5
THERMAL  
PROTECTION  
2
3
4
5
GND  
VIN  
VOUT  
N.C.  
Ground  
2
1
GND  
Power supply input  
Voltage output  
NO CONNECT  
OVER CURRENT  
PROTECTION  
VSTB  
CONTROL  
BLOCK  
STBY  
Cin    0.1µF  
Co    2.2µF  
Fig.25  
Power dissipation (Pd)  
1. Power dissipation (Pd)  
Power dissipation calculations include estimates of power dissipation characteristics and internal IC power consumption,  
and should be treated as guidelines. In the event that the IC is used in an environment where this power dissipation is  
exceeded, the attendant rise in the junction temperature will trigger the thermal shutdown circuit, reducing the current  
capacity and otherwise degrading the IC's design performance. Allow for sufficient margins so that this power dissipation is  
not exceeded during IC operation.  
Calculating the maximum internal IC power consumption (PMAX)  
PMAX = (VIN VOUT) IOUT (MAX.)  
VIN : Input voltage  
VOUT : Output voltage  
IOUT (MAX): Max. output current  
2. Power dissipation/power dissipation reduction (Pd)  
HVSOF5  
0.6  
Board: 70 mm 70 mm 1.6 mm  
Material: Glass epoxy PCB  
0.4  
0.2  
0
410 mW  
0
25  
50  
Ta[]  
75  
100  
125  
Fig. 26 HVSOF5 Power Dissipation/Power Dissipation Reduction (Example)  
*Circuit design should allow a sufficient margin for the temperature range so that PMAX < Pd.  
Input Output capacitors  
It is recommended to insert bypass capacitors between input and GND pins, positioning them as close to the pins as  
possible. These capacitors will be used when the power supply impedance increases or when long wiring paths are used, so  
they should be checked once the IC has been mounted.  
Ceramic capacitors generally have temperature and DC bias characteristics. When selecting ceramic capacitors, use X5R or  
X7R, or better models that offer good temperature and DC bias characteristics and high tolerant voltages.  
Typical ceramic capacitor characteristics  
120  
100  
80  
60  
40  
20  
0
100  
95  
120  
50 V tolerance  
50 V  
tolerance  
100  
80  
60  
40  
20  
0
X7R  
X5R  
90  
85  
80  
75  
70  
Y5V  
10 V  
tolerance  
10 V  
tolerance  
16 V tolerance  
16 V tolerance  
0
1
2
3
4
0
1
2
3
4
-25  
0
25  
Temp[  
50  
75  
DC bias Vdc[V]  
DC bias Vdc[V]  
]
Fig.29 Capacitance vs Temperature  
(X5R, X7R, Y5V)  
Fig.27 Capacitance vs Bias  
(Y5V)  
Fig.28 Capacitance vs Bias  
(X5R, X7R)  
www.rohm.com  
© 2011 ROHM Co., Ltd. All rights reserved.  
2011.01 - Rev.B  
5/8  
Technical Note  
BH□□NB1WHFV series  
Output capacitors  
Mounting input capacitor between input pin and GND(as close to pin as possible), and also output capacitor between output  
pin and GND(as close to pin as possible) is recommended. The input capacitor reduces the output impedance of the voltage  
supply source connected to the VCC. The higher value the output capacitor goes, the more stable the whole operation  
becomes. This leads to high load transient response. Please confirm the whole operation on actual application board.  
Generally, ceramic capacitor has wide range of tolerance, temperature coefficient, and DC bias characteristic. And also its  
value goes lower as time progresses. Please choose ceramic capacitors after obtaining more detailed data by asking  
capacitor makers.  
BH□□NB1WHFV  
100  
COUT = 2.2 µF  
Ta = +25°C  
10  
1
Stable region  
0.1  
0.01  
0
50  
100  
150  
Output Current IOUT [mA]  
Fig.30 Stable Operation Region (Example)  
Operation Notes  
1. Absolute maximum ratings  
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc.,  
can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit.  
If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,  
such as fuses.  
2. Thermal design  
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating  
conditions.  
3. Inter-pin shorts and mounting errors  
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any  
connection error or if pins are shorted together.  
4. Thermal shutdown circuit (TSD)  
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit is designed only to  
shut the IC off to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do  
not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is  
assumed.  
5. Overcurrent protection circuit  
The IC incorporates a built-in overcurrent protection circuit that operates according to the output current capacity. This  
circuit serves to protect the IC from damage when the load is shorted. The protection circuit is designed to limit current  
flow by not latching in the event of a large and instantaneous current flow originating from a large capacitor or other  
component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents.  
However, the IC should not be used in applications characterized by the continuous operation or transitioning of the  
protection circuits. At the time of thermal designing, keep in mind that the current capability has negative characteristics  
to temperatures.  
6. Action in strong electromagnetic field  
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to  
malfunction.  
7. Ground wiring pattern  
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,  
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage  
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change  
the GND wiring pattern of any external components, either.  
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© 2011 ROHM Co., Ltd. All rights reserved.  
2011.01 - Rev.B  
6/8  
Technical Note  
BH□□NB1WHFV series  
8. GND voltage  
The potential of GND pin must be minimum potential in all operating conditions.  
9. Back Current  
In applications where the IC may be exposed to back current flow, it is recommended to create a path to dissipate this  
current by inserting a bypass diode between the VIN and VOUT pins.  
Back current  
VIN  
OUT  
STBY  
GND  
Fig. 31 Example Bypass Diode Connection  
10. Testing on application boards  
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to  
stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting  
it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an  
antistatic measure. Use similar precaution when transporting or storing the IC.  
11. Regarding input pin of the IC  
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them  
isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a  
parasitic diode or transistor. For example, the relation between each potential is as follows:  
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.  
When GND > Pin B, the P-N junction operates as a parasitic transistor.  
Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual  
interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes  
operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.  
Resistor  
Transistor (NPN)  
B
Pin A  
Pin B  
Pin B  
C
E
Pin A  
B
C
E
N
N
N
P+  
P+  
P+  
P+  
N
P
P
Parasitic  
element  
N
N
Parasitic  
element  
P substrate  
P substrate  
GND  
GND  
GND  
GND  
Parasitic element  
Parasitic element  
Other adjacent elements  
Fig.32 Example of IC structure  
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© 2011 ROHM Co., Ltd. All rights reserved.  
2011.01 - Rev.B  
7/8  
Technical Note  
BH□□NB1WHFV series  
Ordering part number  
B H  
2 5  
N B 1  
W
H F V - T R  
Part No.  
Output voltage Series  
Shutdown  
switch  
W : Includes  
switch  
Package  
HFV : HVSOF5  
Packaging and forming specification  
TR: Embossed tape and reel  
25:2.5 V  
28:2.8 V  
2J:2.85 V  
29:2.9 V  
30:3.0 V  
31:3.1 V  
33:3.3 V  
NB1 : High ripple  
rejection  
HVSOF5  
<Tape and Reel information>  
1.6 0.05  
(0.8)  
(0.3)  
Tape  
Embossed carrier tape  
3000pcs  
Quantity  
1.0 0.05  
TR  
Direction  
of feed  
5
1
4
3
4
5
The direction is the 1pin of product is at the upper right when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
3
2 1  
2
1pin  
0.13 0.05  
S
0.1  
0.22 0.05  
S
0.5  
M
Direction of feed  
Order quantity needs to be multiple of the minimum quantity.  
0.08  
Reel  
(Unit : mm)  
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2011.01 - Rev.B  
8/8  
© 2011 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Notice  
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serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.  
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any  
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific  
Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
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CLASS  
CLASSⅣ  
CLASSb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
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a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
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H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual  
ambient temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the  
ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice - GE  
Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
QR code printed on ROHM Products label is for ROHM’s internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,  
please consult with ROHM representative in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable  
for infringement of any intellectual property rights or other damages arising from use of such information or data.:  
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the information contained in this document.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice - GE  
Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.  
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s  
representative.  
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
Notice – WE  
Rev.001  
© 2014 ROHM Co., Ltd. All rights reserved.  

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