BH33LB1WG [ROHM]

Standard CMOS LDO Regulators; 标准CMOS LDO稳压器


型号：	BH33LB1WG
厂家：	ROHM
描述：	Standard CMOS LDO Regulators 标准CMOS LDO稳压器稳压器
文件：	总9页 (文件大小：693K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

CMOS LDO Regulator Series for Portable Equipments

Standard CMOS LDO Regulators

BHŜŜFB1WG series, BHŜŜFB1WHFV series,

BHŜŜLB1WG series, BHŜŜLB1WHFV series

Large Current 300mA

CMOS LDO Regulators

BH ŜŜMA3WHFV Series

No.10020ECT02

Description

The BHŜŜFB1W, BHŜŜLB1W and BHŜŜMA3W series are low dropout CMOS regulators with 150 mA and 300 mA

output that have ±1% high accuracy output voltage.

The BHŜŜFB1W series combines 40µA low current consumption and a 70 dB high ripple rejection ratio by utilizing output

level CMOS technology. The components can be easily mounted into the small standard SSOP5 and the ultra-small

HVSOF5/HVSOF6 packages.

Features

1) High accuracy output voltage: ±1%

2) High ripple rejection ratio: 70 dB (BHŜŜFB1WHFV/WG, BHŜŜLB1WHFV/WG)

3) Low dropout voltage: 60 mV (when current is 100 mA) (BHŜŜMA3WHFV)

4) Stable with ceramic output capacitors

5) Low Bias current : 40µA (IO = 50 mA) (BHŜŜFB1WHFV/WG)

6) Output voltage ON/OFF control

7) Built-in over-current protection and thermal shutdown circuits

8) Ultra-small power package: HVSOF5 (BHŜŜFB1WHFV, BHŜŜLB1WHFV)

9) Ultra-small power package: HVSOF6 (BHŜŜMA3WHFV)

Applications

Battery-driven portable devices and etc.

Line up

150mA BHŜŜFB1W and BHŜŜLB1W Series

Part Number

1.5 1.8 1.85 2.5 2.8 2.9 3.0 3.1 3.3

Package

SSOP5

BHŜŜFB1WG

- - -

HVSOF5

SSOP5

BHŜŜFB1WHFV - - -

BHŜŜLB1WG

- - - - - - -

- - - - - -

HVSOF5

BHŜŜLB1WHFV

300mA BHŜŜMA3WHFV series

Part Number

1.5 1.8 2.5 2.8 2.9 3.0 3.1 3.3

Package

BHŜŜMA3WHFV

HVSOF6

Part Number: B H ŜŜ F B 1 W Ŝ , B H ŜŜ L B 1 W Ŝ

Part Number: B H ŜŜ M A 3 W Ŝ

Symbol

Details

Output Voltage Designation

Symbol

Details

Output Voltage Designation

ŜŜ

Output Voltage (V)

1.5V (Typ.)

1.8V (Typ.)

1.85V (Typ.)

2.5V (Typ.)

2.8V (Typ.)

Output Voltage (V)

2.9V (Typ.)

3.0V (Typ.)

3.1V (Typ.)

3.3V (Typ.)

ŜŜ

Output Voltage (V)

1.5V (Typ.)

1.8V (Typ.)

2.5V (Typ.)

2.8V (Typ.)

HFV : HVSOF6

Output Voltage (V)

2.9V (Typ.)

3.0V (Typ.)

3.1V (Typ.)

3.3V (Typ.)

ŜŜ

Package:

G : SSOP5 HFV : HVSOF5

www.rohm.com

2010.07 - Rev. C

1/8

BHĄĄFB1WG series, BHĄĄFB1WHFV series,

BHĄĄLB1WG series, BHĄĄLB1WHFV series, BHĄĄMA3WHFV series

Technical Note

Absolute maximum ratings (Ta = 25 C)

Parameter

Symbol

VMAX

Limits

Unit

0.3

6.5

Applied supply voltage

680 (HVSOF6)

410 (HVSOF5)

540 (SSOP5)

Power dissipation

Topr

Tstg

Operating temperature range

Storage temperature range

125

Recommended operating range

Parameter

Symbol

Min.

2.5

Typ.

Max.

5.5

Unit

Power supply voltage

VIN

MA3W

300

150

FB1W

LB1W

Output current

IOUT

Recommended operating conditions

Parameter

Input capacitor

Symbol

CIN

Min.

0.1

Typ.

Max.

Unit

μF

Conditions

Ceramic capacitor recommended

1.0

μF

Output capacitor

Noise decrease capacitor

0.01

0.22

μF

FB1WHFV/WG , BH

LB1WHFV/WG

Parameter

Symbol

VOUT

I GND

I STBY

Min.

Typ.

Max.

OUT 1.01

1.0

450

Unit

Conditions

IOUT=1mA

VOUT

Output voltage

OUT 0.99

IOUT=50mA

μA

Circuit current

STBY=0V

Circuit current(STBY)

Ripple rejection ratio

Load response 1

Load response 2

Dropout voltage

Line regulation

VRR=-20dBv, fRR=1kHz, IOUT=10mA

IOUT=1mA to 30mA

LTV1

IOUT=30mA to 1mA

LTV2

VIN=0.98 VOUT, IOUT=100mA

VSAT

VDL1

VDL01

VDL02

250

=V_OUT0.5V to 5.5V

IOUT=1mA to 100mA

IOUT=1mA to 150mA

Load regulation (1

Load regulation (2

)

150

250

300

420

450

Over current protection

limit current

ILMAX

Vo=VOUT 0.98

Vo=0V

Short current

I SHORT

kΩ

STBY pull-down resistor

1100

2200

Vcc

0.3

RSTB

VSTBH

VSTBL

550

1.5

OFF

STBY

control voltage

0.3

BH25,28,29,30,31,33WHFV/G

MA3WHFV

Parameter

Symbol

VOUT

Min.

Typ.

VOUT

Max.

Unit

Conditions

IOUT=1mA

STBY=0V

I GND

1.0

μA

I STBY

VRR=-20dBv, fRR=1kHz, IOUT=10mA

VIN=0.98 X VOUT, IOUT=100mA

VIN=VOUT+0.5V to 5.5V

IOUT=1mA to 100mA

VSAT1

VDL1

VDL01

VDL02

IOUT=1mA to 300mA

ppm/ C IOUT=1mA, Ta=-40 to 85 C

100

600

100

Vo=VOUT X 0.85

Vo=0V

ILMAX

I SHORT

www.rohm.com

2/8

2010.07 - Rev. C

BH□□FB1WG series, BH□□FB1WHFV series,

BH□□LB1WG series, BH□□LB1WHFV series, BH□□MA3WHFV series

Technical Note

Typ i cal ch aract eri st i cs

• Output voltage-input voltage

1.5

BH15LB1WHFV

~ Condition ~

BH28FB1WHFV

~ Condition ~

VIN=0 to 5.5V

Cin=0.1μF

BH30MA3WHFV

~ Condition ~

VIN=0 to 5.5V

Cin=1.0μF

VIN=0 to 5.5V

Cin=0.1μF

Co=1.0μF

Cn=none

ROUT= 1.5k Ω

Ta= 2 5 °C

ROUT= 2.8k Ω

Ta= 2 5 °C

ROUT= 3.0k Ω

Ta= 2 5 °C

0.5

1.5

2.5

3.5

4.5

5.5

0.5

1.5

2.5

3.5

4.5

5.5

0.5

1.5

2.5

3.5

4.5

5.5

Input Voltage V^IN[V]

Fig.3

Fig.1

Fig.2

•GNDcurrent

-input voltage

100

BH15LB1WHFV

~ Condition ~

VIN=0 to 5.5V

Cin=0.1μF

BH28FB1WHFV

~ Condition ~

VIN=0 to 5.5V

Cin=0.1μF

BH30MA3WHFV

~ Condition ~

VIN=0 to 5.5V

Cin=1.0μF

Co=1.0μF

Cn=none

ROUT= 2.8k

ROUT= 1.5k

ROUT= 3.0k

Ta= 2 5 °C

0ꢀ 0.5

1.5

2.5

3.5 ꢀ4ꢀ 4.5 5ꢀ5.5

0.5

1.5

2.5

3.5

4.5

5.5

0.5

1.5

2.5

3.5

4.5

5.5

Input Voltage VIN[V]

Input Voltage V^IN[V]

Fig.4

Fig.6

Fig.5

• Output voltage-output current

3.5

BH15LB1WHFV

~ Condition ~

BH28FB1WHFV

~ Condition ~

BH30MA3WHFV

~ Condition ~

VIN=3.5V

VIN=3.8V

VIN=4.0V

VOUT=1.53V to 0V

Cin=0.1μF

Co=1.0μF

VOUT=2.83V to 0V

Cin=0.1μF

VOUT=3.03V to 0V

Cin=1.0μF

Co=1.0μF

1.5

2.5

Co=1.0μF

Ta=25°C

Cn=none

Ta=25°C

0.5

1.5

0.5

100

150

200

250

300

100

200

300 400

500 600

700

100

200

300

400

Output Current I^OUT[mA]

Output Current IOUT[mA]

Fig.9

Fig.7

Fig.8

•Dropout voltage-output current

500

300

250

200

150

100

BH28FB1WHFV

~ Condition ~

BH30MA3WHFV

~ Condition ~

VIN=2.74V

IOUT=0 to 150mA

Cin=0.1μF

VIN=2.940V

IOUT=0 to 300mA

Cin=1.0μF

Co=1.0μF

400

300

200

100

Co=1.0μF

Ta= 2 5 °C

Cn=none

Ta= 2 5 °C

100

150

100

150

200

250

300

Output Current I^OUT[mA]

Fig.11

Fig.10

www.rohm.com

3/8

2010.07 - Rev. C

BH□□FB1WG series, BH□□FB1WHFV series,

BH□□LB1WG series, BH□□LB1WHFV series, BH□□MA3WHFV series

Technical Note

Typical Characteristics

• Output voltage-temperature

• Ripple reflection-frequency

• Load response characteristics (CO = 1.0 μF)

• Output voltage startup time

www.rohm.com

4/8

2010.07 - Rev. C

BH□□FB1WG series, BH□□FB1WHFV series,

BH□□LB1WG series, BH□□LB1WHFV series, BH□□MA3WHFV series

Technical Note

Block diagrams

Power supply input

Ground

Output voltage ON/OFF control

(High: ON, Low: OFF)

NO CONNECT

Voltage output

Output voltage ON/OFF control

(High: ON, Low: OFF)

Ground

Power supply input

Voltage output

NO CONNECT

Terminal No. Terminal Name Function

Power supply input

Voltage output

Noise reducing capacitor

ground terminal

Ground

Output voltage ON/OFF control

(High: ON, Low: OFF)

Power dissipation Pd

1. Power dissipation

Power dissipation calculation include estimates of power dissipation characteristics and internal IC power consumption

and should be treated as guidelines. In the event that the IC is used in an environment where this power dissipation is

exceeded, the attendant rise in the junction temperature will trigger the thermal shutdown circuit, reducing the current

capacity and otherwise degrading the IC's design performance. Allow for sufficient margins so that this power dissipation

is not exceeded during IC operation.

Calculating the maximum internal IC power consumption (PMAX)

Input voltage

Output voltage

Output current

2. Power dissipation characteristics (Pd)

Board: 70 mm X 70 mm X 1.6 mm

Material: Glass epoxy PCB

Board: 70 mm X 70 mm X 1.6 mm

Material: Glass epoxy PCB

Board: 70 mm X 70 mm X 1.6 mm

Material: Glass epoxy PCB

Fig. 27: HVSOF5

Fig. 28: SSOP5

Power Dissipation/

Power Dissipation Reduction (Example)

Fig. 26: HVSOF6

Power Dissipation/

Power Dissipation Reduction (Example)

Power Dissipation/

Power Dissipation Reduction (Example)

www.rohm.com

5/8

2010.07 - Rev. C

BH□□FB1WG series, BH□□FB1WHFV series,

BH□□LB1WG series, BH□□LB1WHFV series, BH□□MA3WHFV series

Technical Note

Input capacitor

It is recommended to insert bypass capacitors between input and GND pins, positioning them as close to the pins as

possible. These capacitors will be used when the power supply impedance increases or when long wiring routes are used, so

they should be checked once the IC has been mounted.

Ceramic capacitors generally have temperature and DC bias characteristics. When selecting ceramic capacitors, use X5R or

X7R or better models that offer good temperature and DC bias characteristics and high torelant voltages.

Examples of ceramic capacitor characteristics

100

120

100

120

100

50V torelance

16V torelance

X7R

X5R

16V torelance

Y5V

10V torelance

DC bias Vdc (V)

Temperature (°C)

DC bias Vdc (V)

Fig. 29: Capacitance

-bias characteristics (Y5V)

Fig. 30: Capacitance

bias characteristics (X5R, X7R)

Fig. 31: Capacitance–temperature characteristics

(X5R, X7R, Y5V)

Output capacitor

To prevent oscillation at the output, it is recommended that the IC be operated at the stable region show in below Fig. It

operates at the capacitance of more than 1.0μF. As capacitance is larger, stability becomes more stable and characteristic of

output load fluctuation is also improved.

BHŜŜLB1WHFV/WG

BHŜŜFB1WHFV/WG

BHŜŜMA3WHFV

Cout=1.0μF

Cout=2.2μF

Cout=1.0μF

Cin=1.0μF

Ta= 25°C

100

Stable region

0.1

0.01

0.1

0.01

100

150

Output current IOUT(mA)

Fig. 33 BHŜŜFB1WHFV/WG

Stable operating region characteristics (Example)

100

150

100

Output current IOUT(mA)

Fig. 34 BHŜŜMA3WHFV

Stable operating region characteristics (Example)

200

300

Output current IOUT(mA)

Fig. 32 BHŜŜLB1WHFV/WG

Stable operating region characteristics (Example)

Other precautions

• Over current protection circuit

The IC incorporates a built-in over current protection circuit that operates according to the output current capacity. This circuit

serves to protect the IC from damage when the load is shorted. The protection circuits use fold-back type current limiting and

are designed to limit current flow by not latching up in the event of a large and instantaneous current flow originating from a

large capacitor or other component. These protection circuits are effective in preventing damage due to sudden and

unexpected accidents. However, the IC should not be used in applications characterized by the continuous operation or

transitioning of the protection circuits.

• Thermal shutdown circuit

This system has a built-in thermal shutdown circuit for the purpose of protecting the IC from thermal damage. As shown

above, this must be used within the range of power dissipation, but if the power dissipation happens to be continuously

exceeded, the chip temperature increases, causing the thermal shutdown circuit to operate. When the thermal shutdown

circuit operates, the operation of the circuit is suspended. The circuit resumes operation immediately after the chip

temperature decreases, so the output repeats the ON and OFF states. There are cases in which the IC is destroyed due to

thermal runaway when it is left in the overloaded state. Be sure to avoid leaving the IC in the overloaded state.

• Actions in strong magnetic fields

Use caution when using the IC in the presence of a strong magnetic field as such environments may occasionally cause the chip

to malfunction.

• Back current

In applications where the IC may be exposed to back current flow, it is recommended to create a route t dissipate this current

by inserting a bypass diode between the VIN and VOUT pins.

• GND potential

Ensure a minimum GND pin potential in all operating conditions.

In addition, ensure that no pins other than the GND pin carry a voltage less than or equal to the GND pin, including during

actual transient phenomena.

www.rohm.com

6/8

2010.07 - Rev. C

BH□□FB1WG series, BH□□FB1WHFV series,

BH□□LB1WG series, BH□□LB1WHFV series, BH□□MA3WHFV series

Technical Note

Noise terminal (BHŜŜMA3WHFV)

The terminal is directly connected to inward normal voltage source. Because this has low current ability, load exceeding

100nA will cause some instability at the output. For such reasons, we urge you to use ceramic capacitors which have less

leak current. When choosing noise the current reduction capacitor, there is a trade-off between boot-up time and stability. A

bigger capacitor value will result in lesser oscillation but longer boot-up time for VOU T.

100

BH30MA3WHFV

~ Condition ~

VIN=4.0V

Cin=1.0μF

Co=1.0μF

ROUT=3.0kΩ

Ta=25°C

0.1

0.01

100P

1000P

0.01μ

0.1μ

noise-filtering capacitor capacitance Cn (F)

Fig. 35: VOUT startup time vs. noise-filtering capacitor capacitance characteristics (Example)

Regarding input pin of the IC

+ isolation and P substrate layers between adjacent

This monolithic IC contains P

elements in order to keep them isolated. P/N junctions are formed at the intersection of

these P layers with the N layers of other elements to create a variety of parasitic elements.

For example, when a resistor and transistor are connected to pins as shown in Fig.37

The P/N junction functions as a parasitic diode when GND > (Pin A) for the resistor or

GND > (Pin B) for the transistor (NPN).

back current

VCC

OUT

Similarly, when GND > (Pin B) for the transistor (NPN), the parasitic diode described

above combines with the N layer of other adjacent elements to operate as a parasitic

NPN transistor.

CTL

GND

The formation of parasitic elements as a result of the relationships of the potentials of

different pins is an inevitable result of the IC's architecture. The operation of parasitic

elements can cause interference with circuit operation as well as IC malfunction and

damage. For these reasons, it is necessary to use caution so that the IC is not used in a

way that will trigger the operation of parasitic elements, such as by the application of

voltage lower than the GND (P substrate) voltage to input pins.

Fig. 36: Example of bypass

diode connection

Transistor (NPN)

(Terminal B)

Resistor

(Terminal B)

(Terminal A)

GND

Other adjacent elements

(Terminal A)

GND

Parasitic elements

P-board

Parasitic element

GND

Parasitic element

GND

Parasitic elements

GND

Fig.37

Part number selection

B H

3 0

F B 1

H F V - T R

Package

HFV : HVSOF6

HVSOF5

ROHM

part number voltage

Output

Current capacity Shutdown

Package specification

TR : Embossed taping

MA3 : 300mA

FB1 : 150mA

LB1 : 150mA

switch

W : With switch

G : SSOP5

www.rohm.com

7/8

2010.07 - Rev. C

BH□□FB1WG series, BH□□FB1WHFV series,

BH□□LB1WG series, BH□□LB1WHFV series, BH□□MA3WHFV series

Technical Note

(Unit:mm)

(1.8MAX.)

+6°

^-4°

2.9±0.2

1.6±0.05

1.6±

0.1

4°

0.8

0.3

1.0±0.05

(1.2)

(1.4)

0.13±0.05

3 2 1

0.145±0.05

0.13 ⁺^-^0.0³⁵

0.42 ^+0.05

-0.04

0.95

0.1 S

0.22±0.05

0.1

0.22±0.05

0.5

SSOP5

HVSOF5

HVSOF6

(Package Specification) HVSOF6

(Package Specification) SSOP5, HVSOF5

Package Form

Embossed taping

3000pcs

Embossed taping

3000pcs

Package Form

Package Quantity

Package

Orientation

Package

Orientation

(When the reel is held with the left hand and the tape is drawn out with the right hand,

the No. 1 pin of the product faces the upper right direction.)

(When the reel is held with the left hand and the tape is drawn out with the right hand,

the No. 1 pin of the product faces the upper right direction.)

No. 1 pin

Pulling side

Reel

* Please make orders in multiples of the package quantity.

www.rohm.com

8/8

2010.07 - Rev. C

Notice

N o t e s

No copying or reproduction of this document, in part or in whole, is permitted without the

consent of ROHM Co.,Ltd.

The content speciﬁed herein is subject to change for improvement without notice.

The content speciﬁed herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the speciﬁcations,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information speciﬁed in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information speciﬁed herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

use of such technical information.

The Products speciﬁed in this document are intended to be used with general-use electronic

equipment or devices (such as audio visual equipment, ofﬁce-automation equipment, commu-

nication devices, electronic appliances and amusement devices).

The Products speciﬁed in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

against the possibility of physical injury, ﬁre or any other damage caused in the event of the

failure of any Product, such as derating, redundancy, ﬁre control and fail-safe designs. ROHM

shall bear no responsibility whatsoever for your use of any Product outside of the prescribed

scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or

system which requires an extremely high level of reliability the failure or malfunction of which

may result in a direct threat to human life or create a risk of human injury (such as a medical

instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-

controller or other safety device). ROHM shall bear no responsibility in any way for use of any

of the Products for the above special purposes. If a Product is intended to be used for any

such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology speciﬁed herein that may

be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to

obtain a license or permit under the Law.

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

http://www.rohm.com/contact/

www.rohm.com

R1010

BH33LB1WG [ROHM]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB

SI9137LG

SI9122E